Low temperature rise relay

Abstract

The invention discloses a low-temperature-rise relay, which relates to the field of relays and comprises a base, a magnetic circuit assembly and a moving armature assembly are arranged in the base, the moving armature assembly is connected with the magnetic circuit assembly through a pressure spring, an upper cover covers the base, a leading-out sheet is arranged in the base, and a plurality of glue grooves are formed in one side, deviating from the upper cover, of the base. The upper cover is provided with a glue groove, the glue groove is arranged on the upper cover, so that a leading-out pin of the leading-out piece extends out of the base along the glue groove, one side, deviating from the leading-out pin, of the leading-out piece is connected with a heat dissipation piece, and the upper cover is provided with a sealing groove, so that one end, deviating from the leading-out piece, of the heat dissipation piece penetrates through and is located outside the upper cover. The problem that the temperature of a traditional relay is too high under the conditions of high-density packaging and long-time working is effectively solved.

Description

Technical Field

[0001] The present invention relates to the technical field of relays, and more particularly to a low temperature rise relay. Background Art

[0002] With the rapid development of solar photovoltaic industry, higher requirements are put forward for relays used in solar photovoltaic inverters, especially for relay loads. According to market needs, the load voltage reaches 1000Va.c., the switching current needs to reach at least 100A, and the conduction current exceeds 320A.

[0003] Since photovoltaic installation locations vary from deserts to oceans, from high latitudes to low latitudes, relays need to be able to withstand large currents and be sealed, which requires the relay temperature rise to be low enough.

[0004] In summary, how to reduce the temperature rise of the relay is a problem that needs to be solved urgently by those skilled in the art. Summary of the invention

[0005] In view of this, an object of the present invention is to provide a low temperature rise relay, which effectively reduces the temperature rise of the relay.

[0006] In order to achieve the above object, the present invention provides the following technical solutions:

[0007] A low temperature rise relay comprises a base, a magnetic circuit assembly and a movable armature assembly are arranged in the base, the movable armature assembly is connected to the magnetic circuit assembly through a compression spring, the base cover is provided with an upper cover, a lead sheet is arranged in the base, and a plurality of glue grooves are provided on a side of the base away from the upper cover so that the lead pins of the lead sheet extend out of the base along the glue grooves;

[0008] A heat sink is connected to the side of the lead-out piece away from the lead-out pin, and a sealing groove is provided on the upper cover so that an end of the heat sink away from the lead-out piece passes through and is located outside the upper cover.

[0009] Preferably, the lead-out plate is a U-shaped copper busbar, and the lead-out plate includes an inner side and an outer side of the lead-out plate that are parallel to each other. The side of the inner side of the lead-out plate facing away from the lead-out pin and the side of the outer side of the lead-out plate facing away from the lead-out pin are connected by a cross-piece connector, and the heat sink is arranged at the cross-piece connector.

[0010] Preferably, the heat sink comprises:

[0011] A connecting piece connected to the crossbar connecting piece;

[0012] A plurality of heat sinks are arranged parallel to each other and are arranged on the crossbar connector along the reverse extension direction of the lead pins.

[0013] Preferably, the connecting piece and the crossbar connecting member are matched in shape so as to increase the contact area between the connecting piece and the crossbar connecting member.

[0014] Preferably, a plurality of heat dissipation teeth are provided on a side of each heat dissipation fin facing away from the cross-piece connecting member, and a plurality of adjacent heat dissipation teeth on each heat dissipation fin are interconnected via a series connection member.

[0015] Preferably, the distance from the heat sink to the static contact on the lead-out sheet is smaller than the distance from the lead-out pin to the static contact on the lead-out sheet, and the ratio between the two distances is not less than 3.

[0016] Preferably, a first slot hole is formed through the inner side of the lead-out piece, and the first slot hole is in the shape of a circular hole.

[0017] Preferably, a second slot hole is formed through the inner side of the lead-out piece, and the second slot hole is a waist-shaped hole.

[0018] Preferably, a plurality of through holes are provided on the upper cover, each of the through holes is provided with an explosion-proof window, and a circle of notches is provided on the inner side of the through holes located at the explosion-proof window.

[0019] Preferably, a circle of notches is provided on the upper cover in the circumferential direction of the heat sink to form an air duct.

[0020] The low-temperature-rise relay provided by the present invention can effectively reduce the temperature rise of the relay. First, the lead-out plate is effectively connected to the heat sink, and the lead-out pin of the lead-out plate extends out of the base, and the heat sink extends out of the upper cover, ensuring that heat can be quickly transferred from the lead-out plate and the heat sink to the external environment, improving the overall heat dissipation efficiency, and the lead-out plate and the heat sink are respectively located at opposite ends, further improving the heat dissipation effect. Secondly, the rubber groove design in the base ensures good sealing between the lead-out pin and the base, avoiding performance degradation due to air leakage. In addition, the sealing groove design on the upper cover further enhances the overall sealing and reliability of the relay, preventing external dust and moisture from entering the interior, thereby extending the service life of the relay. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0022] Figure 1 This is a schematic diagram of the overall structure of the low temperature rise relay in this embodiment;

[0023] Figure 2 Schematic diagram of explosion of the low temperature rise relay in this embodiment;

[0024] Figure 3 is a top view of the base in this embodiment;

[0025] Figure 4 This is a schematic diagram of the structure of the lead-out plate and the heat sink in this embodiment;

[0026] Figure 5 Schematic diagram of the distances between the static contact and the crossbar and the lead-out pin 103 in this embodiment;

[0027] Figure 6 2 is a cross-sectional view of the upper cover in this embodiment.

[0028] Figure 1-Figure 6 , the reference numerals include:

[0029] 1. Lead-out plate; 11. Inner side of lead-out plate; 12. Outer side of lead-out plate; 101. First slot; 102. Second slot; 103. Lead-out pin; 104. Crossbar connector; 3. Heat sink; 31. Connecting plate; 32. Heat sink; 33. Heat sink tooth; 4. Base; 41. Glue groove; 5. Magnetic circuit assembly; 6. Moving armature assembly; 7. Upper cover; 71. Sealing groove; 72. Explosion-proof window; 721. Through hole; 8. Compression spring; 9. Static contact. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] Unless otherwise defined, the technical terms or scientific terms used in the disclosure of this application shall have the usual meanings understood by persons with ordinary skills in the field to which the invention belongs. The words "first", "second" and similar words used in the present invention do not indicate any order, quantity or importance. Words such as "connected" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative position relationships. When the absolute position of the object being described changes, the relative position relationship may also change accordingly. An embodiment of the present application discloses a low temperature rise relay.

[0032] The core of the present invention is to provide a low temperature rise relay.

[0033] Please refer to Figures 1 to 6 .

[0034] The low temperature rise relay provided by the present invention comprises a base 4, a magnetic circuit assembly 5 and a movable armature assembly 6 are arranged in the base 4, the movable armature assembly 6 is connected to the magnetic circuit assembly through a compression spring 8, the base 4 is covered with an upper cover 7, a lead-out piece 1 is arranged in the base 4, a plurality of glue grooves 41 are provided on the side of the base 4 away from the upper cover 7, so that the lead-out pins 103 of the lead-out piece 1 extend out of the base 4 along the glue grooves 41. A heat sink 3 is connected to the side of the lead-out piece 1 away from the lead-out pin 103, and a sealing groove 71 is provided on the upper cover 7, so that the end of the heat sink 3 away from the lead-out piece 1 passes through and is located outside the upper cover 7.

[0035] Specifically, two lead-out sheets 1 are arranged in the base 4, and the two lead-out sheets 1 are arranged side by side on both sides of the base 4. A plurality of glue grooves 41 for installing the lead-out sheets 1 are provided on the base 4, and the lead pins 103 of the lead-out sheets 1 are inserted in the glue grooves 41 and extend out of the base 4, so as to facilitate heat dissipation and heat conduction to the external space. The lead-out sheets 1 and the glue grooves 41 can be sealed and fixed by glue, so as to further improve the stability between the lead-out sheets 1 and the base 4. A heat sink 3 is provided on the side of the lead-out sheet 1 away from the lead pins 103, and the heat sink 3 can effectively conduct the heat in the heat transfer path of the lead-out sheet 1. A sealing groove 71 is provided at the installation position of the heat sink 3 on the upper cover 7, and the side of the heat sink 3 away from the lead-out sheet 1 is provided through the sealing groove 71, so that the heat sink 3 is located outside the upper cover 7, so as to facilitate heat dissipation and heat conduction to the external space. The heat sink 3 and the sealing groove 71 can be sealed and fixed by glue. In this embodiment, by adding a heat sink 3 to the lead-out plate 1, the heat transfer path of the lead-out plate 1 is made more reasonable, and the lead-out plate 1 and the heat sink 3 are located at opposite ends, thereby forming an effective heat convection channel, which accelerates the transfer and dissipation of heat.

[0036] The low temperature rise relay mentioned above effectively improves the heat dissipation effect of the relay, thereby effectively reducing the temperature rise of the relay, and effectively solves the problem of excessive temperature of traditional relays under high-density packaging and long-term working conditions.

[0037] The low temperature rise relay provided by the present invention is described in more detail below with reference to the accompanying drawings and specific embodiments.

[0038] In a specific embodiment, reference Figure 4The lead-out plate 1 is a U-shaped copper bar, and the lead-out plate 1 includes an inner side 11 and an outer side 12 of the lead-out plate which are parallel to each other. The side of the inner side 11 of the lead-out plate away from the lead-out pin 103 and the side of the outer side 12 of the lead-out plate away from the lead-out pin 103 are connected by a cross-piece connector 104, and the heat sink 3 is arranged at the cross-piece connector 104.

[0039] Specifically, the lead-out piece 1 is a U-shaped structure, which is divided into the outer side 12 of the lead-out piece and the inner side 11 of the lead-out piece according to the position of the lead-out piece 1 in the base 4. The outer side 12 of the lead-out piece and the inner side 11 of the lead-out piece are connected by a crossbar connector 104, and the connection is bent. According to the resistance value of the U-shaped copper bar, the temperature rise at the inner side 11 of the lead-out piece is much higher than the temperature rise at the outer side 12 of the lead-out piece. The heat sink 3 is arranged at the crossbar connector 104, and the heat in the heat transfer path from the inner side 11 of the lead-out piece to the outer side 12 of the lead-out piece can be extracted from the heat sink 3, making the heat transfer route more reasonable and further improving the heat dissipation efficiency. Due to the special structure of the U-shaped copper bar, a large amount of heat accumulation will be generated on the inner side 11 of the lead-out piece when the current passes through. This is because when the current flows inside the conductor, heat will be generated due to the existence of resistance, and the area close to the center of the conductor (i.e., the inner side 11 of the lead-out piece) will have a relatively high temperature due to relatively poor heat dissipation conditions. The heat sink 3 is arranged at the crossbar connector 104 , and the heat sink 3 can directly contact the inner side 11 of the lead-out plate, and quickly take away the heat by heat conduction.

[0040] Based on any of the above embodiments, Figure 4 The heat sink 3 includes a connecting piece 31 and a plurality of heat sinks 32 . The connecting piece 31 is connected to the crossbar connector 104 . The plurality of heat sinks 32 are arranged parallel to each other and are arranged on the crossbar connector 104 along the reverse extension direction of the lead pin 103 .

[0041] Specifically, the heat sink 3 includes a horizontally arranged connecting piece 31 and two heat sinks 32 vertically arranged at both ends of the connecting piece 31. The connecting piece 31 is installed on the crossbar connector 104 so that the extension direction of the heat sink 32 is opposite to the extension direction of the lead pin 103, so that the heat dissipation position of the heat sink 3 and the heat dissipation position of the lead pin 1 are located at opposite ends, further improving the heat dissipation effect. The connecting piece 31 is arranged horizontally and fits tightly on the crossbar connector 104, ensuring efficient conduction of heat from the crossbar connector 104 to the heat sink 3. The two heat sinks 32 are vertically installed at both ends of the connecting piece 31, and their extension direction is completely opposite to the extension direction of the lead pin 103. Not only does it maximize the use of space, but it also effectively separates the heat dissipation area from the high temperature area of ​​the lead pin 1, avoiding direct heat reflux and improving the heat dissipation efficiency. The close fit between the connecting piece 31 and the crossbar connector 104 not only helps heat conduction, but also enhances the structural stability of the entire heat dissipation assembly. The risk of loosening and damage due to vibration or shock is reduced, improving the reliability and durability of the relay.

[0042] Based on any of the above embodiments, Figure 4 The shapes of the connecting piece 31 and the crossbar connecting piece 104 match each other so that the contact area between the connecting piece 31 and the crossbar connecting piece 104 is increased.

[0043] Specifically, in order to maximize the heat transfer efficiency, the shape of the connecting piece 31 matches the shape of the crossbar connector 104. This match not only ensures close contact between the two, but also significantly increases their contact area. By increasing the contact area, the connecting piece 31 can more effectively absorb heat from the crossbar connector 104 and quickly transfer it to the heat sink 32. This design significantly reduces thermal resistance and improves heat transfer efficiency, thereby ensuring stable operation of the relay in a high temperature environment.

[0044] Optionally, the connecting piece 31 may adopt a profile similar to that of the crossbar connecting member 104, or may be provided with additional protrusions, grooves or wavy structures on the contact surface to increase the number and density of contact points.

[0045] Based on any of the above embodiments, Figure 3 A plurality of heat dissipation teeth 33 are provided on a side of each heat dissipation fin 32 away from the crossbar connector 104 , and a plurality of adjacent heat dissipation teeth 33 on each heat dissipation fin 32 are connected to each other through a series connection.

[0046] Specifically, a plurality of heat dissipation teeth 33 are provided on the side of each heat sink 32 away from the crossbar connector 104. These heat dissipation teeth 33 not only increase the heat dissipation area, but also effectively guide the air flow and enhance the heat dissipation effect through their unique shape and structure. The heat dissipation teeth 33 may adopt different shapes, such as wave shape, sawtooth shape or fin shape, to adapt to different heat dissipation requirements and air flow conditions. Multiple adjacent heat dissipation teeth 33 on each heat sink 32 are interconnected by series members. These series members not only ensure the structural stability between the heat dissipation teeth 33, but also form a continuous heat dissipation channel, so that heat can be transferred and dissipated more smoothly inside the heat sink 32. The series members may be made of metal wire, thin metal sheet or other high thermal conductivity materials to ensure efficient heat transfer. The design of the heat dissipation teeth 33 and the series members greatly increases the heat dissipation area, while optimizing the air flow path, so that heat can be dissipated to the surrounding environment more quickly and effectively. This design significantly reduces the temperature of the relay and improves its operating stability and service life. At the same time, the series connection between the heat dissipation teeth 33 not only facilitates the transfer of heat, but also enhances the overall structural stability of the heat sink 32. This design reduces the risk of heat sink deformation or damage caused by vibration or impact, and improves the reliability and durability of the relay. In addition, the heat dissipation teeth 33 can be selected with special shapes and structures, which can guide the air flow and form an effective convection heat dissipation effect. The heat dissipation efficiency is further improved, especially under high power density and long-term working conditions, providing a more reliable heat dissipation guarantee for the relay.

[0047] Based on any of the above embodiments, Figure 5 , the distance from the heat sink 3 to the static contact 9 on the lead-out plate 1 is smaller than the distance from the lead-out pin 103 to the static contact 9 on the lead-out plate 1, and the ratio between the two distances is not less than 3.

[0048] Specifically, the distance from the heat sink 3 to the static contact 9 on the lead-out sheet 1, that is, the distance from the horizontal connector 104 to the static contact 9, is set to X1, and the distance from the lead pin 103 to the static contact 9 on the lead-out sheet 1 is set to X2, wherein X1 is much smaller than X2, and the ratio of X2 to X1 is not less than 3, so that a large amount of heat generated by the contact can be conducted to the heat sink 3 located at the horizontal connector 104 for heat dissipation, thereby effectively reducing the heat at the lead pin 103, and the heat generated by the contact can be more quickly conducted out of the relay body through the heat sink, thereby reducing the temperature rise of the relay. Since the heat sink 32 of the heat sink 3 is located outside the relay body, its heat dissipation effect is more significant, and the heat generated by the contact can be more quickly conducted out of the relay body, thereby significantly reducing the overall temperature rise of the relay.

[0049] Based on any of the above embodiments, the inner side 11 of the lead-out plate is provided with a first slot 101 which is a round hole, and the inner side 11 of the lead-out plate is provided with a second slot 102 which is a waist-shaped hole.

[0050] Specifically, by providing a first slot 101 and a second slot 102 on the inner side 11 of the lead sheet, and the first slot 101 and the second slot 102 are located on the outer side of the base 4, the resistance difference between the inner side 11 of the lead sheet and the outer side 12 of the lead sheet can be effectively balanced, so that more current can be transmitted through the outer side 12 of the lead sheet, thereby reducing the heat generated at the inner side 11 of the lead sheet, and further effectively reducing the temperature rise inside the relay. Through experimental calculation, the calculation results are shown in the following table. Q is the heat generated in 1s, r1 is the resistance of the outer side of the lead sheet, r2 is the resistance of the inner side of the lead sheet, I1 is the current passing through the outer side of the lead sheet, I2 is the current passing through the inner side of the lead sheet, Q1 is the heat generated in 1s on the outer side of the lead sheet, Q2 is the heat generated in 1s on the inner side of the lead sheet, and S is the surface area. According to the experimental data in the table, it can be seen intuitively that by balancing the resistance difference between the inner side 11 of the lead-out plate and the outer side 12 of the lead-out plate, more heat can be dissipated through the outer side 12 of the lead-out plate, while the heat generated by the inner side 11 of the lead-out plate remains unchanged, thereby effectively reducing the temperature rise inside the relay.

[0051] r1 r2 I1 I2 Q1 Q2 Q1 change Q2 Transformation A product on the market 0.02 0.0073 85.6 234 146.5 399.7 0 0 Lateral shortening X1 Inner S=72 0.0147 0.0073 103.2 216.8 156.6 343.1 6.8% -14.2% Outer shortening X2 Inner S=66 0.0147 0.0078 111 209 181.1 340.7 23.6% -14.8% Shorten the outside X3 inside S=60 0.0147 0.0087 121 199 215.2 344.5 46.9% -13.8%

[0052] Based on any of the above embodiments, Figure 5 The upper cover 7 is provided with a plurality of through holes 721 , each of which is provided with an explosion-proof window 72 , and the through holes 721 are located on the inner side of the explosion-proof window 72 and have a circle of gaps.

[0053] Specifically, there are two through holes 721 on the upper cover 7, and each through hole 721 is provided with an explosion-proof window 72. The explosion-proof window 72 plays a role in keeping the upper cover 7 sealed during normal use. However, when the components in the shell are damaged and high-temperature gas is generated, the explosion-proof window 72 is damaged in time, which can avoid the explosion of the relay and improve the explosion-proof performance of the relay.

[0054] In order to further ensure that the explosion-proof window 72 can be broken in time when the components in the shell are damaged and high-temperature gas is generated, a circle of notches is opened around the through hole 721 in the circumferential direction of the explosion-proof window 72, so that the connection between the explosion-proof window 72 and the through hole 721 becomes thinner, thereby making it easier for the explosion-proof window 72 to fall off and be damaged from the through hole 721, further improving the explosion-proof performance of the relay.

[0055] Based on any of the above embodiments, Figure 5 A circle of notches is provided on the upper cover 7 in the circumferential direction of the heat sink 3 to form an air duct.

[0056] Specifically, in order to enhance the heat dissipation effect and improve the thermal management performance of the device, a circle of notches is opened on the upper cover 7 in the circumferential direction of the heat sink 3. These notches are connected to each other to form a continuous air duct, which provides a channel for air flow, thereby facilitating convection with the outside air and further improving the heat dissipation efficiency.

[0057] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0058] The above is a detailed introduction to a low temperature rise relay provided by the present invention. This article uses specific examples to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method and core ideas of the present invention. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present invention, the present invention can also be improved and modified in a number of ways, and these improvements and modifications also fall within the scope of protection of the present invention.

Claims

1. A low temperature rise relay, comprising a base (4), wherein a magnetic circuit assembly (5) and a movable armature assembly (6) are arranged in the base (4), wherein the movable armature assembly (6) is connected to the magnetic circuit assembly via a compression spring (8), and the base (4) is covered with an upper cover (7), characterized in that: A lead-out plate (1) is arranged in the base (4), and a plurality of glue grooves (41) are provided on a side of the base (4) facing away from the upper cover (7), so that the lead-out pins (103) of the lead-out plate (1) extend out of the base (4) along the glue grooves (41); A heat sink (3) is connected to the side of the lead-out piece (1) facing away from the lead-out pin (103), and a sealing groove (71) is provided on the upper cover (7) so that an end of the heat sink (3) facing away from the lead-out piece (1) passes through and is located outside the upper cover (7).

2. A low temperature rise relay according to claim 1, characterized in that: The lead-out plate (1) is a U-shaped copper bar, and the lead-out plate (1) comprises a lead-out plate inner side (11) and a lead-out plate outer side (12) which are parallel to each other, and a side of the lead-out plate inner side (11) facing away from the lead-out pin (103) and a side of the lead-out plate outer side (12) facing away from the lead-out pin (103) are connected via a crossbar connector (104), and the heat sink (3) is arranged at the crossbar connector (104).

3. A low temperature rise relay according to claim 2, characterized in that: The heat sink (3) comprises: A connecting piece (31) connected to the crossbar connecting piece (104); A plurality of heat sinks (32) are arranged in parallel with each other and are arranged on the crossbar connecting member (104) along the reverse extension direction of the lead-out pin (103).

4. A low temperature rise relay according to claim 3, characterized in that: The shapes of the connecting piece (31) and the crossbar connecting piece (104) are matched to increase the contact area between the connecting piece (31) and the crossbar connecting piece (104).

5. A low temperature rise relay according to claim 3, characterized in that: A plurality of heat dissipation teeth (33) are provided on a side of each heat dissipation fin (32) facing away from the crossbar connecting member (104), and a plurality of adjacent heat dissipation teeth (33) on each heat dissipation fin (32) are interconnected via a series connection member.

6. A low temperature rise relay according to claim 3, characterized in that: The distance from the heat sink (3) to the static contact (9) on the lead-out plate (1) is smaller than the distance from the lead-out pin (103) to the static contact (9) on the lead-out plate (1), and the ratio between the two distances is not less than 3.

7. A low temperature rise relay according to any one of claims 2 to 6, characterized in that: A first slot (101) is formed through the inner side (11) of the lead-out piece, and the first slot (101) is in the shape of a circular hole.

8. A low temperature rise relay according to any one of claims 2 to 6, characterized in that: A second slot hole (102) is formed through the inner side (11) of the lead-out plate, and the second slot hole (102) is a waist-shaped hole.

9. A low temperature rise relay according to any one of claims 2 to 6, characterized in that: The upper cover (7) is provided with a plurality of through holes (721), each of the through holes being provided with an explosion-proof window (72), and the through holes (721) are located on the inner side of the explosion-proof window (72) and have a circle of notches.

10. A low temperature rise relay according to any one of claims 2 to 6, characterized in that: The upper cover (7) is provided with a circle of notches in the circumferential direction of the heat sink (3) to form an air duct.

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