Demolding and blanking method for chip packaging

Abstract

The invention provides a demolding and blanking method for chip packaging, the back of a chip is pasted on a carrier material, and the method comprises the following steps: S1, clamps at two sides respectively clamp two ends of a non-lead side of the chip; s2, the clamp is lifted upwards, and meanwhile the chip is driven to be lifted upwards, so that the edges of the back faces of the two clamped ends of the chip are separated from the loaded material; s3, laterally moving the clamp along the horizontal direction parallel to the lead side, and driving the chip to laterally move at the same time, so as to reduce the pasting area of the back surface of the chip and the loading material; and S4, the clamp is lifted upwards again, meanwhile, the chip is driven to be lifted upwards, the chip is completely separated from the carrying material, and demolding and discharging are completed. According to the method, damage to the chip can be effectively avoided by accurately controlling the movement and acting force of the clamp, the integrity of the chip and the reliability of subsequent processing are guaranteed, standardization and automation of the chip demolding and discharging process can be achieved by setting the specific movement distance and height range, and the production efficiency is improved. And the efficiency and the stability of chip packaging, demolding and blanking are improved.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor manufacturing process, and in particular relates to a chip packaging demolding and blanking method. Background Art

[0002] In the current global chip packaging field, the demolding and unloading process generally relies on traditional nozzle adsorption technology. This technology mainly uses the nozzle to adsorb the front or back of the chip to perform unloading. However, when the nozzle is adsorbed on the front of the chip, the avoidance problem between the nozzle and the optical glass on the front of the chip must be considered to prevent damage to the optical glass. In addition, the method of using cylinder suction for adsorption is not effective in dealing with the high viscosity of the tape layer, which will make the chip unloading process complicated and inefficient.

[0003] On the other hand, if you choose to unload the chip from the back side, although you can avoid the problem of avoiding the optical glass, this method will expose the back side of the chip and the leads, which are easily damaged during the unloading process, increasing the risk of wire bending and chip damage. This situation not only affects the chip quality, but may also cause the packaging process to fail, resulting in economic losses.

[0004] In view of the above problems, it is an urgent problem to develop an efficient and reliable demolding and unloading method to optimize the demolding and unloading process of chip packaging.

[0005] It should be understood that the above statements merely provide background technology related to the present invention and do not necessarily constitute prior art. Summary of the invention

[0006] The purpose of the present invention is to provide a chip packaging demolding and unloading method to improve the efficiency and stability of chip packaging demolding and unloading.

[0007] To achieve the above-mentioned purpose, the present invention provides a method for demolding and unloading chip packaging, comprising the following steps: S1, clamps on both sides respectively clamp the two ends of the non-lead side of the chip; S2, lift the clamp upward, and at the same time drive the chip upward, so that the back edges of the clamped ends of the chip are separated from the carrier; S3, the clamp moves laterally along the horizontal direction parallel to the lead side, and at the same time drives the chip to move laterally, so as to reduce the adhesion area between the back of the chip and the carrier; S4, lift the clamp upward again, and at the same time drive the chip upward, so that the chip is completely separated from the carrier, and the demolding and unloading is completed.

[0008] Preferably, a clamping portion and a clamping portion located below the clamping portion are provided on each side of the clamp.

[0009] Preferably, the clamping portion is provided with a clamping wall, which is in contact with the non-lead side end of the chip, and the surface of which is roughened to be a non-smooth structure without burrs.

[0010] Preferably, the clamping portion is provided with a clamping groove of an inverted T-shaped structure, and a fixing hole is provided in a vertical portion of the clamping groove.

[0011] Preferably, the clamp on each side further includes an external clamping portion, and the external clamping portion is clamped and fixed to the clamping groove to achieve movement control of the clamp.

[0012] Preferably, a fixing piece is provided on the external clamping portion, and the fixing piece is matched with a fixing hole in the clamping slot to fix the external clamping portion and the clamping slot.

[0013] Preferably, the external clamping portion is connected to a cylinder, and the force applied by the clamp to clamp the two ends of the non-lead side of the chip is controlled by controlling the pressure of the cylinder.

[0014] Preferably, in S2, the height range of lifting the clamp upward is 0.55 mm to 0.65 mm.

[0015] Preferably, in S3, when the clamp clamps the chip, it performs a unidirectional single horizontal movement.

[0016] Preferably, the moving distance ranges from 0.55 mm to 0.65 mm.

[0017] In summary, compared with the prior art, the chip packaging demolding method provided by the present invention has at least the following beneficial effects:

[0018] (1) The method of the present invention can reduce the bonding area between the wafer back and the tape, reduce the viscosity of the adhesive layer, and thus facilitate chip demolding;

[0019] (2) The method of the present invention can reasonably avoid the optical glass area and protect the chip leads from being deformed by external interference;

[0020] (3) The method of the present invention can effectively avoid damage to the chip by accurately controlling the movement and force of the fixture, thereby ensuring the integrity of the chip and the reliability of subsequent processing, and improving the efficiency of chip packaging demolding and unloading;

[0021] (4) The method of the present invention can achieve standardization and automation of the chip demolding and unloading process by setting a specific moving distance and height range, thereby improving the stability of chip packaging demolding and unloading. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a front structural diagram of the chip package in the present invention;

[0023] Figure 2 This is a back structure diagram of the chip package in the present invention;

[0024] Figure 3 A schematic diagram of the positional relationship between the material loading and the chip in the present invention;

[0025] Figure 4 It is a flow chart of the film stripping and material discharging method of the present invention;

[0026] Figure 5 A three-dimensional diagram of a clamp on one side of the present invention;

[0027] Figure 6 It is a partial enlarged view of the clamping portion in the present invention;

[0028] FIG. 7( a ) is a top view of the clamp of the present invention; FIG. 7( b ) is a front view of the clamp of the present invention; and FIG. 7( c ) is a side view of the clamp of the present invention.

[0029] Description of reference numerals:

[0030] Package substrate 1

[0031] Optical glass 2

[0032] Chip body 3

[0033] Lead 4

[0034] Adhesive material 5

[0035] Loading 6

[0036] Fixture 9

[0037] Clamping portion 91

[0038] Clamping portion 92

[0039] Card slot 911

[0040] Fixing hole 912

[0041] Wall 921 DETAILED DESCRIPTION

[0042] The following will be combined with the attached embodiment of the present invention Figure 1 7, the technical scheme, structural features, objectives and effects achieved in the embodiments of the present invention are described in detail.

[0043] It should be noted that the drawings are in a very simplified form and use non-precise proportions. They are only used to conveniently and clearly assist in explaining the embodiments of the present invention, and are not used to limit the conditions for the implementation of the present invention. Therefore, they have no substantive technical significance. Any structural modification, change in proportional relationship or adjustment of size, without affecting the effects and purposes that can be achieved by the present invention, should still fall within the scope of the technical content disclosed by the present invention.

[0044] It should be noted that, in the present invention, the terms "comprises", "includes" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or equipment including a series of elements includes not only the elements explicitly listed, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or equipment.

[0045] like Figure 1 and Figure 2 As shown, the chip after packaging (hereinafter referred to as chip) includes: a chip body 3, embedded and fixed in the middle part of the packaging substrate 1; an optical glass 2, arranged in a specific area on the front side of the chip body 3, and connected to the front side of the chip body 3; leads 4, arranged on two opposite sides of the back side of the chip body 3, connecting the chip body 3 with the external circuit.

[0046] like Figure 3 As shown, it should be noted that the chips are arranged in an array on the carrier 6, and an adhesive material 5 is provided on the carrier 6. The back side of each chip is adhered to the carrier 6. The present invention provides a method for demolding and blanking of chip packaging, which can quickly and efficiently demold and blank the chips adhered to the carrier 6 without affecting any performance of the chip.

[0047] In a preferred embodiment of the present invention, the adhesive material 5 is an adhesive tape.

[0048] like Figure 4 As shown, the present invention provides a chip packaging stripping method, which specifically comprises the following steps:

[0049] S1, clamps 9 on both sides clamp the two ends of the non-lead side of the chip respectively;

[0050] S2, lift the clamp 9 upward, and at the same time drive the chip upward, so that the back edges of the two ends of the chip are separated from the carrier 6;

[0051] S3, the clamp 9 moves laterally along a horizontal direction parallel to the lead side, and at the same time drives the chip to move laterally, so as to reduce the bonding area between the back of the chip and the carrier 6;

[0052] S4, lift the clamp 9 upward again, and at the same time drive the chip upward, so that the chip is completely separated from the carrier 6, and the demolding and unloading are completed.

[0053] like Figure 5 As shown, in S1, a clamping portion 91 and a clamping portion 92 located below the clamping portion 91 are provided on each side of the clamp 9; wherein the clamping portion 91 clamps an external control device to achieve movement control of the clamp 9, and the clamping portion 92 clamps the non-lead side of the chip to achieve movement control of the chip.

[0054] Specifically, in a preferred embodiment of the present invention, the clamping portion 91 is mechanically connected to the external control device, so that the external control device can accurately control the position and movement trajectory of the clamp 9; the clamping portion 92 firmly clamps the ends of the non-lead side of the chip by mechanical clamping, ensuring that the chip remains stable during movement and avoids damage caused by vibration or impact. Therefore, through this structural design, precise operation and control of the chip is achieved, the efficiency of demolding and unloading is improved, and the quality of the chip after demolding and unloading is finally obtained.

[0055] Among them, Figure 6 As shown, the clamping portion 92 is provided with a clamping wall 921, and the surface of the clamping wall 921 is finely roughened to ensure that it is a non-smooth structure without burrs; it can be understood that in the process of clamping the chip, the clamping wall 921 contacts the end portions of the non-lead side of the chip. Through this design, not only the clamping reliability is improved, ensuring the smoothness and safety of the entire clamping process, but also the stability and accuracy of the chip during the clamping process are effectively guaranteed to avoid any potential damage to the chip.

[0056] Among them, Figure 5 , Figure 7(a) to Figure 7(c) As shown, the clamping portion 91 is provided with a clamping groove 911 of an inverted T-shaped structure, and the vertical portion of the clamping groove 911 is provided with a fixing hole 912; wherein, through the fixing hole 912, the clamping portion 91 can be accurately docked with the corresponding component of the external control device, thereby realizing accurate positioning and control of the clamp 9.

[0057] Furthermore, in the present invention, the external control device includes an external clamping portion (not shown in the figure), the shape of which matches the clamping slot 911 and is also an inverted T-shape, thereby enabling the external clamping portion to be clamped and fixed to the clamping slot 911 to achieve movement control of the clamp 9.

[0058] Furthermore, a fixing piece is provided on the external clamping part, and the fixing piece is arranged corresponding to the fixing hole 912 in the clamping groove 911, and can fix the external clamping part and the clamping groove 911, thereby effectively fixing the external clamping part and the clamping groove 911 tightly together, ensuring the stability and reliability of the entire structure.

[0059] Among them, considering the characteristics such as the size and weight of the external clamping part and the clamping slot 911, in a preferred embodiment of the present invention, two fixing members are provided on the external clamping part, and two fixing holes 912 are correspondingly provided in the clamping slot 911. By firmly connecting the two fixing members with the corresponding fixing holes 912, the tight combination of the external clamping part and the clamping slot 911 is ensured.

[0060] Furthermore, in this embodiment, the external control device also includes a cylinder connected to the external clamping portion, and can control the force of the clamp 9 clamping the two ends of the non-lead side of the chip by controlling the pressure of the cylinder.

[0061] Furthermore, in the above S2, the height range of lifting the clamp 9 upward is 0.55 mm to 0.65 mm. In a preferred embodiment of the present invention, the height of lifting the clamp 9 upward is set to 0.6 mm.

[0062] Furthermore, in the above S3, when the clamp 9 clamps the chip, it performs a unidirectional single horizontal movement, and the moving distance ranges from 0.55 mm to 0.65 mm. In a preferred embodiment of the present invention, the moving distance is set to 0.6 mm.

[0063] Furthermore, after completing the S4 step, the chip is completely separated from the carrier 6, at which time the clamp 9 will slowly descend and steadily place the chip in a designated position for subsequent processing or inspection; repeating the above steps, using the clamp 9, all the chips on the carrier 6 can be demolded and unloaded one by one.

[0064] In summary, the chip packaging demolding and unloading method provided by the present invention can effectively avoid damage to the chip by precisely controlling the movement and force of the clamp, thereby ensuring the integrity of the chip and the reliability of subsequent processing, and can achieve standardization and automation of the chip packaging demolding and unloading process by setting a specific moving distance and height range, thereby improving the efficiency and stability of chip packaging demolding and unloading, and has significant advantages.

[0065] Although the content of the present invention has been described in detail through the above preferred embodiments, it should be appreciated that the above description should not be considered as a limitation of the present invention. After reading the above content, it will be apparent to those skilled in the art that various modifications and substitutions of the present invention will occur. Therefore, the protection scope of the present invention should be limited by the appended claims.

Claims

1. A chip packaging stripping method, wherein the back of the chip is pasted on a carrier, characterized in that: The following steps are involved: S1, clamps on both sides respectively clamp the two ends of the non-lead side of the chip; S2, lifting the clamp upward, and at the same time driving the chip upward, so that the back edges of the two ends of the chip being clamped are separated from the carrier; S3, the fixture moves laterally along a horizontal direction parallel to the lead side, and at the same time drives the chip to move laterally, so as to reduce the adhesion area between the back side of the chip and the carrier; S4, lift the clamp upward again, and at the same time drive the chip upward, so that the chip is completely separated from the carrier, and the film stripping and unloading are completed.

2. The chip packaging stripping method according to claim 1, characterized in that: The clamp on each side is provided with a clamping portion and a clamping portion located below the clamping portion.

3. The chip packaging stripping method according to claim 2, characterized in that: The clamping portion is provided with a clamping wall, which is in contact with the non-lead side end of the chip, and the surface of the clamping wall is roughened to be a non-smooth structure without burrs.

4. The chip packaging stripping method according to claim 2, characterized in that: The clamping portion is provided with a clamping groove of an inverted T-shaped structure, and a fixing hole is provided in a vertical portion of the clamping groove.

5. The chip packaging stripping method according to claim 4, characterized in that: The clamp on each side also includes an external clamping portion, which is clamped and fixed in the clamping slot to achieve movement control of the clamp.

6. The chip packaging stripping method according to claim 5, characterized in that: The external clamping part is provided with a fixing piece, and the fixing piece is matched with the fixing hole in the clamping slot to fix the external clamping part and the clamping slot.

7. The chip packaging stripping method according to claim 5, characterized in that: The external clamping part is connected to a cylinder, and the force applied by the clamp to clamp the two ends of the non-lead side of the chip is controlled by controlling the pressure of the cylinder.

8. The chip packaging stripping method according to claim 1, characterized in that: In the above-mentioned S2, the height range of lifting the clamp upward is 0.55 mm to 0.65 mm.

9. The chip packaging stripping method according to claim 1, characterized in that: In the above S3, when the clamp holds the chip, it performs a unidirectional single horizontal movement.

10. The chip packaging stripping method according to claim 9, characterized in that: The moving distance range is 0.55mm~0.65mm.

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