Integrated DSC chip conveying fixture and working method thereof

Abstract

The present invention belongs to the field of conveying technology, specifically relates to material handling, and more particularly to an integrated DSC chip conveying fixture and a working method thereof, comprising: a carrier, which is used to carry a DSC chip; a conveying device, which is controlled by a control module, and the control module is configured to control the conveying device to convey the DSC chip to the carrier; wherein the conveying device comprises: a clamping cylinder and at least one pair of clamping mechanisms; the clamping cylinder is electrically connected to the control module; the clamping mechanisms are relatively arranged on the clamping cylinders, and clamping stations are formed between the clamping mechanisms, and the control module controls the clamping cylinders to drive the relative clamping mechanisms to approach to clamp the DSC chip; the clamping mechanisms are configured to adapt to DSC chips of different thicknesses, thereby realizing clamping and conveying of DSC chips of different thicknesses, and meeting the clamping and conveying requirements of DSC chips of different thicknesses.

Description

Technical Field

[0001] The present invention belongs to the field of conveying technology, specifically relates to material handling, and in particular to an integrated DSC chip conveying fixture and a working method thereof. Background Art

[0002] DSC chips have various thicknesses. DSC chips are chips that use a double-sided cooling process. However, the equipment for clamping and transporting DSC chips can only accommodate DSC chips of one thickness. When using this equipment to clamp and transport thinner DSC chips, the DSC chip cannot be clamped, which can easily cause the DSC chip to fall off and be damaged. When using this equipment to clamp and transport thicker DSC chips, the DSC chip cannot be clamped or may be damaged. When multiple DSC chips of different thicknesses need to be transported, the equipment cannot be adapted, which affects the transport efficiency of the DSC chips and cannot meet the needs of production transport.

[0003] Therefore, due to the technical problem that the clamping equipment cannot meet the clamping and handling requirements of DSC chips of various thicknesses, it is necessary to design an integrated DSC chip conveying fixture and its working method.

[0004] It should be noted that the above information disclosed in this background technology section is only used to understand the background technology of the present application concept, and therefore, the above description is not considered to constitute information of the prior art. Summary of the invention

[0005] The embodiments of the present disclosure at least provide an integrated DSC chip conveying fixture and a working method thereof.

[0006] In a first aspect, an embodiment of the present disclosure provides an integrated DSC chip conveying fixture, comprising:

[0007] A carrier, which is used to carry the DSC chip;

[0008] The transport device is controlled by a control module, and the control module is configured to control the transport device to transport the DSC chip to the carrier; wherein

[0009] The handling device comprises: a clamping cylinder and at least one pair of clamping mechanisms;

[0010] The clamping cylinder is electrically connected to the control module;

[0011] The clamping mechanisms are relatively arranged on the clamping cylinders, and a clamping station is formed between the clamping mechanisms. The control module controls the clamping cylinders to drive the relative clamping mechanisms to approach to clamp the DSC chip.

[0012] The clamping mechanism is configured to accommodate DSC chips of different thicknesses.

[0013] In an optional embodiment, the clamping mechanism includes: a connecting member;

[0014] The connecting member is arranged on the clamping cylinder, and at least one supporting block is arranged on the connecting member, and the supporting block is arranged close to the bottom surface of the connecting member;

[0015] A notch corresponding to the support block is provided on the bottom surface of the DSC chip, and one side wall of the notch is open, and the opening is located on the side wall of the DSC chip;

[0016] The support block protrudes from one side of the connector close to the DSC chip, the top surface of the support block protruding from the connector is a first inclined surface, and the support block protruding from the connector is inserted into the corresponding notch to support the DSC chip;

[0017] The connecting member is vertically provided with a strip hole, the strip hole corresponds to the support block, and the strip hole is located above the corresponding support block;

[0018] The strip-shaped hole has a clamping assembly, which is suitable for sliding up and down in the strip-shaped hole so that the distance between the clamping assembly and the supporting block is adapted to the thickness of the DSC chip.

[0019] In an optional embodiment, the clamping assembly includes: a sliding block and a clamping member;

[0020] The sliding block is arranged in the strip-shaped hole, and the sliding block is slidably connected to the inner wall of the strip-shaped hole so that the sliding block slides up and down along the strip-shaped hole;

[0021] A spring is connected between the bottom surface of the sliding block and the top surface of the supporting block;

[0022] A notch is arranged on the top surface of the sliding block, and the notch penetrates a side of the sliding block close to the DSC chip and a side away from the DSC chip;

[0023] The clamping piece is rotatably connected to the inner wall of the notch, and part of the clamping piece protrudes from a side of the connector close to the DSC chip after passing through the notch. The bottom surface of the protruding connector part of the clamping piece is a second inclined surface, which contacts the top surface of the DSC chip when clamping the DSC chip.

[0024] In an optional embodiment, the clamping member is hollow inside;

[0025] A plurality of through holes are formed on the second inclined surface, and the through holes are connected to the interior of the clamping member;

[0026] The top surface of the clamping piece is connected with a hose, and the hose is communicated with the inside of the clamping piece;

[0027] The gas inside the clamp is extracted through the hose, and the through hole then extracts gas into the inside of the clamp.

[0028] In an optional embodiment, a surrounding plate corresponding to the through hole is arranged inside the clamping member, and the surrounding plate is arranged around the corresponding through hole;

[0029] The axis of the enclosure is parallel to the axis of the through hole;

[0030] When the second inclined surface is in contact with the top surface of the DSC chip, the axis of the enclosure plate is in a vertical state.

[0031] In an optional embodiment, in the initial state, the bottom surface of the support block is parallel to the top surface of the DSC chip. At this time, the top surface of the clamping piece is parallel to the bottom surface of the support block. After the second inclined surface moves above the top surface of the DSC chip, as the through hole draws air into the inside of the clamping piece, the air pressure between the second inclined surface and the top surface of the DSC chip decreases, and the clamping piece gradually rotates until the second inclined surface is in contact with the top surface of the DSC chip. At this time, the part of the clamping piece away from the DSC chip rotates upward, and this part protrudes from the side of the connecting piece away from the DSC chip.

[0032] In an optional embodiment, the clamping cylinder is arranged on a manipulator;

[0033] The manipulator is electrically connected to the control module;

[0034] The control module controls the manipulator to drive the clamping cylinder to move so that the clamping cylinder moves above the carrier.

[0035] In an optional embodiment, the carrier is provided with a plurality of placement positions for carrying the DSC chip;

[0036] Sensor modules corresponding to the clamping members are arranged on both sides of the placement position, and the sensor modules are electrically connected to the control module;

[0037] The sensor module is suitable for detecting whether the corresponding clamping part partially protrudes from the side of the connecting part away from the DSC chip. If all sensor modules corresponding to a placement position detect that the corresponding clamping part partially protrudes from the side of the connecting part away from the DSC chip, the control module determines that the clamping mechanism clamps the DSC chip.

[0038] In an optional embodiment, the carrier is mounted on a conveyor belt mechanism, the conveyor belt mechanism is electrically connected to a control module, and the control module is further configured to control the conveyor belt mechanism to drive the carrier to move;

[0039] A baffle is provided on one side of the conveyor belt mechanism in the width direction, and a cylinder is provided on the other side;

[0040] The cylinder is provided with a push block;

[0041] The cylinder is electrically connected to the control module, and the control module controls the cylinder to drive the pushing block to contact the outer wall of the carrier, so as to push the carrier to contact the baffle.

[0042] In a second aspect, the present disclosure also provides a working method using the above-mentioned integrated DSC chip delivery fixture, including:

[0043] Controlling the transport device by the control module to transport the DSC chip to the carrier; and

[0044] The control module controls the clamping cylinder to drive the relative clamping mechanism to approach the DSC chip for clamping.

[0045] The beneficial effect of the present invention is that the integrated DSC chip conveying fixture comprises: a carrier, which is used to carry the DSC chip; a transport device, which is controlled by a control module, and the control module is configured to control the transport device to transport the DSC chip to the carrier; wherein the transport device comprises: a clamping cylinder and at least one pair of clamping mechanisms; the clamping cylinder is electrically connected to the control module; the clamping mechanisms are relatively arranged on the clamping cylinders, and clamping stations are formed between the clamping mechanisms, and the control module controls the clamping cylinders to drive the relative clamping mechanisms to approach to clamp the DSC chip; the clamping mechanisms are configured to adapt to DSC chips of different thicknesses, thereby realizing the clamping and transport of DSC chips of different thicknesses, and meeting the clamping and transport requirements of DSC chips of different thicknesses.

[0046] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention are realized and obtained by the structures particularly pointed out in the description, claims and drawings.

[0047] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, this article specifically cites preferred embodiments and provides detailed descriptions as follows in conjunction with the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0049] Figure 1 A schematic diagram of the structure of an integrated DSC chip delivery fixture provided in an embodiment of the present disclosure;

[0050] Figure 2 A schematic diagram of the structure of a clamping mechanism provided in an embodiment of the present disclosure;

[0051] Figure 3 A schematic diagram of the position of a hose provided in an embodiment of the present disclosure;

[0052] Figure 4 A partial cross-sectional view of a clamping mechanism provided in an embodiment of the present disclosure;

[0053] Figure 5 A schematic diagram of a clamping state of a clamping mechanism provided in an embodiment of the present disclosure;

[0054] Figure 6 A structural schematic diagram of a conveyor belt mechanism provided in an embodiment of the present disclosure;

[0055] Figure 7 A principle block diagram of an integrated DSC chip delivery fixture provided in an embodiment of the present disclosure;

[0056] In the figure:

[0057] 1 carrier, 11 placement positions, 12 sensor modules;

[0058] 2 handling device, 21 clamping cylinder, 22 clamping mechanism, 221 connecting piece, 222 strip hole, 223 supporting block, 224 first inclined surface, 225 sliding block, 226 notch, 227 clamping piece, 228 spring, 229 second inclined surface, 230 through hole, 231 enclosure, 232 hose, 24 manipulator;

[0059] 3 conveyor belt mechanism, 31 baffle, 32 cylinder, 33 push block;

[0060] 4DSC chip, 41 missing slots. DETAILED DESCRIPTION

[0061] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0062] As used herein, the phrases "in one embodiment," "according to one embodiment," "in some embodiments," and the like generally refer to the fact that the particular feature, structure, or characteristic following the phrase may be included in at least one embodiment of the present disclosure. Therefore, a particular feature, structure, or characteristic may be included in more than one embodiment of the present disclosure, so that these phrases do not necessarily refer to the same embodiment. As used herein, the terms "example," "exemplary," and the like are used to "serve as an example, instance, or illustration." Any implementation, aspect, or design described herein as "example" or "exemplary" is not necessarily to be construed as preferred or superior to other implementations, aspects, or designs. On the contrary, the use of the terms "example," "exemplary," and the like is intended to present concepts in a concrete manner.

[0063] Some embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0064] like Figure 1 and Figure 7 As shown, at least one disclosed embodiment provides an integrated DSC chip conveying fixture, including: a carrier 1, which is used to carry the DSC chip 4; a transport device 2, which is controlled by a control module, and the control module is configured to control the transport device 2 to transport the DSC chip 4 to the carrier 1; wherein the transport device 2 includes: a clamping cylinder 21 and at least one pair of clamping mechanisms 22; the clamping cylinder 21 is electrically connected to the control module; the clamping mechanisms 22 are relatively arranged on the clamping cylinder 21, and a clamping station is formed between the clamping mechanisms 22, and the control module controls the clamping cylinder 21 to drive the relative clamping mechanisms 22 to approach to clamp the DSC chip 4; the clamping mechanism 22 is configured to adapt to DSC chips 4 of different thicknesses, thereby realizing the clamping and transport of DSC chips 4 of different thicknesses, and meeting the clamping and transport requirements of DSC chips 4 of different thicknesses.

[0065] like Figure 2As shown, in an optional embodiment, the clamping mechanism 22 includes: the clamping mechanism 22 includes: a connecting member 221; the connecting member 221 is arranged on the clamping cylinder 21, and at least one supporting block 223 is arranged on the connecting member 221, and the supporting block 223 is arranged close to the bottom surface of the connecting member 221; a notch 41 corresponding to the supporting block 223 is opened on the bottom surface of the DSC chip 4, and one side wall of the notch 41 is opened, and the opening is located on the side wall of the DSC chip 4; a portion of the supporting block 223 is close to the DSC chip 4 from the connecting member 221 One side of the connector 221 protrudes, and the top surface of the protruding connecting member 221 of the support block 223 is a first inclined surface 224. The protruding connecting member 221 of the support block 223 is inserted into the corresponding groove 41 to support the DSC chip 4; a strip hole 222 is vertically opened on the connecting member 221, and the strip hole 222 corresponds to the support block 223, and the strip hole 222 is located above the corresponding support block 223; there is a clamping assembly in the strip hole 222, and the clamping assembly is suitable for sliding up and down in the strip hole 222, so that the distance between the clamping assembly and the support block 223 is adapted to the thickness of the DSC chip 4.

[0066] Two support blocks 223 and corresponding clamping components can be arranged on one connecting member 221, that is, one side of the DSC chip 4 is clamped by the cooperation of the two support blocks 223 and the clamping components, so that the DSC chip 4 can be better clamped; the support block 223 and the clamping member 227 are partially extended out of the connecting member 221, so that the extended part can clamp the DSC chip 4; the support block 223 also has a part that does not have a first inclined surface 224 extending out of the connecting member 221, so that the first inclined surface 224 is fully extended into the notch 41. The portion of the support block 223 extending out of the connecting member 221 without the first inclined surface 224 can contact the top surface of the notch 41 to support the DSC chip 4; the thickness of the support block 223 is less than the height of the notch 41, so that when the support block 223 supports the DSC chip 4, the bottom surface of the support block 223 is higher than the bottom surface of the DSC chip 4, which is convenient for subsequent release of the DSC chip 4. When the bottom surface of the DSC chip 4 contacts the placement position 11, the bottom surface of the support block 223 will not contact the placement position 11, avoiding the presence of a gap between the support block 223 and the placement position 11. The friction is convenient for the support block 223 not to drive the DSC chip 4 to move when the DSC chip 4 is released, and for the bottom surface of the support block 223 to avoid contact with the top surface of the lower DSC chip 4 when the DSC chip 4 is stacked on another DSC chip 4, so as to avoid the movement of the DSC chip 4 and the lower DSC chip 4 when the DSC chip 4 is released; in the initial state, the distance between the two relatively arranged support blocks 223 is greater than the width of the DSC chip 4, so that the manipulator 24 drives the clamping cylinder 21 to move so that the DSC chip 4 is completely located between the two The distance between the clamping mechanism 22, the support block 223 and the clamping piece is the smallest, and the distance can be slightly smaller than the thickness of the thinnest DSC chip 4, so that the support block 223 and the clamping piece can clamp DSC chips 4 of greater thickness. At this time, the first bevel 224 and the second bevel 229 completely extend out of the connecting piece 221. For the first bevel 224, the closer to the DSC chip 4, the lower the position, and for the second bevel 229, the closer to the DSC chip 4, the higher the position. At this time, the clamping cylinder 21 drives the clamping mechanism 22 to approach and clamp the DSC chip 4.

[0067] like Figure 5As shown, in an optional embodiment, the clamping assembly includes: a sliding block 225 and a clamping member 227; the sliding block 225 is arranged in the strip hole 222, and the sliding block 225 is slidably connected to the inner wall of the strip hole 222, so that the sliding block 225 slides up and down along the strip hole 222; a spring 228 is connected between the bottom surface of the sliding block 225 and the top surface of the support block 223; a notch 226 is arranged on the top surface of the sliding block 225, and the notch 226 passes through the side of the sliding block 225 close to the DSC chip 4 and the side away from the DSC chip 4; the clamping member 227 and the notch 226 are connected. The inner wall is rotatably connected, and a torsion spring can be set at the position of the rotatable connection to facilitate the resetting of the clamping member 227. The part of the clamping member 227 passes through the notch 226 and protrudes from the side of the connecting member 221 close to the DSC chip 4. The bottom surface of the part of the clamping member 227 protruding from the connecting member 221 is a second inclined surface 229. The second inclined surface 229 contacts the top surface of the DSC chip 4 when clamping the DSC chip 4. The part of the clamping member 227 away from the DSC chip 4 can only rotate upward counterclockwise, and the rotation direction is shown as F in the figure, so as to prevent the second inclined surface 229 from being lifted up by the DSC chip 4 and rotating clockwise after contacting the DSC chip 4.

[0068] The spring 228 can reset the sliding block 225; when the connecting member 221 approaches the DSC chip 4, the first inclined surface 224 on the supporting block 223 is inserted into the corresponding notch 41, and the second inclined surface 229 of the clamping member 227 contacts the edge of the top surface of the DSC chip 4, and as the connecting member 221 continues to approach the DSC chip 4, the edge of the top surface of the DSC chip 4 pushes the clamping member 227 upward to make the sliding block 225 slide upward, so that the spring 228 is gradually in a stretched state, and the distance between the clamping member 227 and the supporting block 223 gradually increases to adapt to the thickness of the DSC chip 4, so as to meet the clamping of DSC chips 4 of different thicknesses. The spring 228 in the stretched state can make the clamping member 227 press the DSC chip 4 downward to ensure the clamping of the DSC chip 4.

[0069] like Figure 3 and Figure 4As shown, in an optional embodiment, the clamping member 227 is hollow inside; a plurality of through holes 230 are formed on the second inclined surface 229, and the through holes 230 are communicated with the inside of the clamping member 227; a hose 232 is connected to the top surface of the clamping member 227, and the hose 232 is communicated with the inside of the clamping member 227; the gas inside the clamping member 227 is extracted through the hose 232, and at this time, the through holes 230 exhaust gas into the inside of the clamping member 227; the hose 232 is connected to an exhaust device, and through the exhaust device The air inside the clamping piece 227 is continuously extracted. When the second inclined surface 229 moves toward the top surface of the DSC chip 4, air is extracted into the clamping piece 227 through the through hole 230 to remove impurities on the top surface of the DSC chip 4. The second inclined surface 229 contacts the edge of the DSC chip 4 and can scrape off impurities at the through hole 230 through the edge to prevent the through hole 230 from being blocked. The scraped impurities can be extracted into the clamping piece 227 through the through hole 230 to prevent impurities from remaining on the DSC chip 4.

[0070] In an optional embodiment, a panel 231 corresponding to the through hole 230 is provided inside the clamping member 227, and the panel 231 is provided around the corresponding through hole 230; the axis of the panel 231 is parallel to the axis of the through hole 230; when the second inclined surface 229 is in contact with the top surface of the DSC chip 4, the clamping member 227 and the support block 223 cooperate to clamp the DSC chip 4, and the axis of the panel 231 is in a vertical state; the area enclosed by the panel 231 can be used as an extension of the through hole 230, and the hose 232 is connected to the inside of the clamping member 227 The direction of the gas in the position can be parallel to the direction of the gas in the through hole 230. When the impurities on the top surface of the DSC chip 4 are sucked into the clamping piece 227 through the through hole 230, the enclosure 231 will not hinder the entry of impurities. When the second inclined surface 229 is in contact with the top surface of the DSC chip 4, the enclosure 231 is in a vertical state, surrounding the through hole 230 to prevent impurities inside the clamping piece 227 from rolling into the through hole 230, and then when the vacuum is closed during the process of loosening the DSC chip 4, impurities in the through hole 230 will not fall onto the DSC chip 4.

[0071] In an optional embodiment, in the initial state, the bottom surface of the support block 223 is parallel to the top surface of the DSC chip 4. At this time, the top surface of the clamping piece 227 is parallel to the bottom surface of the support block 223. After the second inclined surface 229 moves to above the top surface of the DSC chip 4, as the through hole 230 draws air into the clamping piece 227, the air pressure between the second inclined surface 229 and the top surface of the DSC chip 4 is reduced, and the clamping piece 227 gradually rotates until the second inclined surface 229 is in contact with the top surface of the DSC chip 4. At this time, the part of the clamping piece 227 away from the DSC chip 4 rotates upward, and this part protrudes from the side of the connecting piece 221 away from the DSC chip 4.

[0072] In an optional embodiment, the clamping cylinder 21 is set on the manipulator 24; the manipulator 24 is electrically connected to the control module; the control module controls the manipulator 24 to drive the clamping cylinder 21 to move, so that the clamping cylinder 21 moves to above the carrier 1; the manipulator 24 can drive the clamping cylinder 21 to move to meet the clamping and transportation requirements of the DSC chip 4.

[0073] In an optional embodiment, the carrier 1 is provided with a plurality of placement positions 11 to carry the DSC chip 4; sensor modules 12 corresponding to the clamping member 227 are provided on both sides of the placement position 11, and the sensor modules 12 are electrically connected to the control module; the sensor modules 12 are suitable for detecting whether the corresponding clamping member 227 partially protrudes from the side of the connecting member 221 away from the DSC chip 4, and if all the sensor modules 12 corresponding to a placement position 11 detect that the corresponding clamping member 227 partially protrudes from the side of the connecting member 221 away from the DSC chip 4, the control module determines that the clamping mechanism 22 clamps the DSC chip 4; the sensor module 1 2 can be an infrared sensor, a photoelectric sensor, etc.; three DSC chips 4 can be clamped, transported and stacked on the placement position 11, and the required chip devices are formed after subsequent sintering; after the manipulator 24 drives the clamping cylinder 21 to move the DSC chip 4 to above the placement position 11, when all the sensor modules 12 detect that the part corresponding to the clamping member 227 is in a protruding state from the side of the connecting member 221 away from the DSC chip 4, it is judged that the clamping mechanism 22 stably clamps the DSC chip 4, then the manipulator 24 drives the clamping cylinder 21 to descend, and releases the clamping of the DSC chip 4 after the DSC chip 4 is lowered into place, so that the DSC chip 4 is placed in the corresponding position.

[0074] like Figure 6 As shown, in an optional embodiment, the carrier 1 is mounted on a conveyor belt mechanism 3, and the conveyor belt mechanism 3 is electrically connected to a control module, and the control module is also configured to control the conveyor belt mechanism 3 to drive the carrier 1 to move; a baffle 31 is provided on one side of the conveyor belt mechanism 3 in the width direction, and a cylinder 32 is provided on the other side; a push block 33 is provided on the cylinder 32; the cylinder 32 is electrically connected to the control module, and the control module controls the cylinder 32 to drive the push block 33 to contact the outer wall of the carrier 1, so as to push the carrier 1 to contact with the baffle 31, so that the carrier 1 is clamped to avoid the movement of the carrier 1 when the DSC chip 4 is placed, and to avoid the displacement of the DSC chip 4.

[0075] In the initial state, the distance between the two relatively arranged support blocks 223 is greater than the width of the DSC chip 4, so that the DSC chip 4 is completely located between the two clamping mechanisms 22 after the manipulator 24 drives the clamping cylinder 21 to move. The distance between the support block 223 and the clamping member is the smallest, and the distance can be slightly smaller than the thickness of the thinnest DSC chip 4, so that the support block 223 and the clamping member can clamp DSC chips 4 of greater thickness. At this time, the first inclined surface 224 and the second inclined surface 229 completely extend out of the connecting member 221. For the first inclined surface 224, the closer to the DSC chip 4, the lower the position, and for the second inclined surface 229, the closer to the DSC chip 4, the higher the position. At this time, the clamping cylinder 21 drives the clamping mechanism 2 2 approaches to clamp the DSC chip 4, the first inclined surface 224 extends into the corresponding notch 41, after the first inclined surface 224 completely extends into the notch 41, the portion of the support block 223 extending out of the connecting member 221 without the first inclined surface 224 can contact the inner top surface of the notch 41 to support the DSC chip 4, the second inclined surface 229 of the clamping member 227 contacts the edge of the top surface of the DSC chip 4, and as the connecting member 221 continues to approach the DSC chip 4, the edge of the top surface of the DSC chip 4 pushes the clamping member 227 upward to make the sliding block 225 slide upward, so that the spring 228 is gradually in a stretched state, and the distance between the clamping member 227 and the support block 223 gradually increases to adapt to the thickness of the DSC chip 4 , to meet the clamping needs of DSC chips 4 of different thicknesses, the spring 228 in the stretched state can make the clamping piece 227 press the DSC chip 4 downward to ensure the clamping of the DSC chip 4, the hose 232 is connected to the exhaust device, and the air inside the clamping piece 227 is continuously extracted through the exhaust device. When the second inclined surface 229 moves toward the top surface of the DSC chip 4, the impurities on the top surface of the DSC chip 4 can be removed by exhausting air into the clamping piece 227 through the through hole 230, so as to avoid interference from impurities when the second inclined surface 229 is fitted with the top surface of the clamping piece 227, and ensure that the clamping piece 227 can firmly clamp the DSC chip 4. After the DSC chip 4 no longer lifts up the clamping piece 227, as the exhaust continues, the second inclined surface 229 is The air pressure between the surface 229 and the top surface of the DSC chip 4 decreases, and the clamping piece 227 gradually rotates until the second inclined surface 229 is in contact with the top surface of the DSC chip 4, completing the clamping and clamping of the DSC chip 4. The manipulator 24 drives the clamped DSC chip 4 to move above the placement position 11. When all sensor modules 12 detect that the part corresponding to the clamping piece 227 is in a protruding state from the side of the connecting piece 221 away from the DSC chip 4, it is judged that the clamping mechanism 22 stably clamps the DSC chip 4. At this time, the manipulator 24 drives the clamping cylinder 21 to descend, and the bottom surface of the DSC chip 4 contacts the placement position 11. Then, after the vacuum is closed, the control module controls the clamping cylinder 21 to drive the connecting piece 221 away, thereby releasing the DSC chip 4.

[0076] At least one other disclosed embodiment also provides a working method using the above-mentioned integrated DSC chip conveying jig, including: controlling the transport device 2 through the control module to transport the DSC chip 4 to the carrier 1; and controlling the clamping cylinder 21 through the control module to drive the relative clamping mechanism 22 to approach and clamp the DSC chip 4.

[0077] In summary, the integrated DSC chip conveying fixture includes: a carrier 1, which is used to carry the DSC chip 4; a transport device 2, which is controlled by a control module, and the control module is configured to control the transport device 2 to transport the DSC chip 4 to the carrier 1; wherein the transport device 2 includes: a clamping cylinder 21 and at least one pair of clamping mechanisms 22; the clamping cylinder 21 is electrically connected to the control module; the clamping mechanisms 22 are relatively arranged on the clamping cylinder 21, and a clamping station is formed between the clamping mechanisms 22, and the control module controls the clamping cylinder 21 to drive the relative clamping mechanisms 22 to approach to clamp the DSC chip 4; the clamping mechanism 22 is configured to adapt to DSC chips 4 of different thicknesses, thereby realizing the clamping and transportation of DSC chips 4 of different thicknesses, and meeting the clamping and transportation requirements of DSC chips 4 of different thicknesses.

[0078] In the description of the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0079] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. In addition, terms such as "first", "second" and other numerical terms do not imply an order or sequence when used in this document unless explicitly indicated above. Therefore, without departing from the teachings of the example embodiments, the first element, component, region, layer or section discussed above may be referred to as a second element, component, region, layer or section.

[0080] Spatially relative terms, such as "inside", "outside", "below", "below", "down", "above", "on", etc., may be used herein to facilitate description of the relationship of one element or feature to another element or feature as illustrated in the figure. In addition to the orientation depicted in the figure, spatially relative terms may be intended to cover different orientations of the device in use or operation. For example, if the device in the figure is turned over, the elements described as "below" or "below" other elements or features will be oriented to be "above" other elements or features. Therefore, the example term "below" can cover the orientation above and below. The device can be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein are interpreted accordingly.

[0081] Based on the above ideal embodiments of the present invention, the relevant staff can make various changes and modifications without departing from the technical concept of the present invention through the above description. The technical scope of the present invention is not limited to the contents of the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. An integrated DSC chip conveying fixture, characterized in that: include: A carrier (1) for carrying a DSC chip (4); The transport device (2) is controlled by a control module, and the control module is configured to control the transport device (2) to transport the DSC chip (4) to the carrier (1); in The handling device (2) comprises: a clamping cylinder (21) and at least one pair of clamping mechanisms (22); The clamping cylinder (21) is electrically connected to the control module; The clamping mechanisms (22) are arranged relatively on the clamping cylinders (21), a clamping station is formed between the clamping mechanisms (22), and the control module controls the clamping cylinders (21) to drive the relative clamping mechanisms (22) to approach to clamp the DSC chip (4); The clamping mechanism (22) comprises: a connecting piece (221) on which a strip-shaped hole (222) is vertically opened, the strip-shaped hole (222) corresponds to a supporting block (223), and the strip-shaped hole (222) is located above the corresponding supporting block (223); A clamping assembly is provided in the strip-shaped hole (222), which is suitable for sliding up and down in the strip-shaped hole (222) so that the distance between the clamping assembly and the support block (223) is adapted to the thickness of the DSC chip (4); The clamping assembly comprises: a clamping member (227); a notch (226) is arranged on the top surface of the sliding block (225); a spring (228) is connected between the bottom surface of the sliding block (225) and the top surface of the supporting block (223); The clamping member (227) is rotatably connected to the inner wall of the notch (226); a portion of the clamping member (227) passes through the notch (226) and protrudes from a side of the connecting member (221) close to the DSC chip (4); the bottom surface of the portion of the clamping member (227) protruding from the connecting member (221) is a second inclined surface (229); and the second inclined surface (229) contacts the top surface of the DSC chip (4) when clamping the DSC chip (4); A plurality of through holes (230) are formed on the second inclined surface (229) and are communicated with the interior of the clamping member (227); The top surface of the clamping piece (227) is connected to a hose (232), and the gas inside the clamping piece (227) is extracted through the hose (232). At this time, the through hole (230) extracts gas into the inside of the clamping piece (227).

2. The integrated DSC chip conveying fixture according to claim 1, characterized in that: A notch (41) corresponding to the support block (223) is provided on the bottom surface of the DSC chip (4), and a side wall of the notch (41) is open, and the opening is located on the side wall of the DSC chip (4); A portion of the support block (223) protrudes from a side of the connecting member (221) close to the DSC chip (4); a top surface of the portion of the support block (223) protruding from the connecting member (221) is a first inclined surface (224); and the portion of the support block (223) protruding from the connecting member (221) is inserted into the corresponding notch (41) to support the DSC chip (4).

3. The integrated DSC chip conveying fixture as claimed in claim 2, characterized in that: The clamping assembly comprises: a sliding block (225); The sliding block (225) is arranged in the strip-shaped hole (222), and the sliding block (225) is slidably connected to the inner wall of the strip-shaped hole (222), so that the sliding block (225) slides up and down along the strip-shaped hole (222); The notch (226) passes through a side of the sliding block (225) close to the DSC chip (4) and a side away from the DSC chip (4).

4. The integrated DSC chip conveying fixture as claimed in claim 3, characterized in that: The clamping member (227) is hollow inside; The hose (232) is in communication with the interior of the clamping member (227).

5. The integrated DSC chip conveying fixture as claimed in claim 4, characterized in that: A surrounding plate (231) corresponding to the through hole (230) is arranged inside the clamping member (227), and the surrounding plate (231) is arranged around the corresponding through hole (230); The axis of the enclosure plate (231) is parallel to the axis of the through hole (230); When the second inclined surface (229) is in contact with the top surface of the DSC chip (4), the axis of the enclosure plate (231) is in a vertical state.

6. The integrated DSC chip conveying fixture as claimed in claim 5, characterized in that: In the initial state, the bottom surface of the support block (223) is parallel to the top surface of the DSC chip (4). At this time, the top surface of the clamping member (227) is parallel to the bottom surface of the support block (223). After the second inclined surface (229) moves to above the top surface of the DSC chip (4), as the through hole (230) draws air into the inside of the clamping member (227), the air pressure between the second inclined surface (229) and the top surface of the DSC chip (4) decreases, and the clamping member (227) gradually rotates until the second inclined surface (229) is in contact with the top surface of the DSC chip (4). At this time, the portion of the clamping member (227) away from the DSC chip (4) rotates upward, and the portion protrudes from the side of the connecting member (221) away from the DSC chip (4).

7. The integrated DSC chip conveying fixture according to claim 1, characterized in that: The clamping cylinder (21) is arranged on a manipulator (24); The manipulator (24) is electrically connected to the control module; The control module controls the manipulator (24) to drive the clamping cylinder (21) to move, so that the clamping cylinder (21) moves to above the carrier (1).

8. The integrated DSC chip conveying fixture as claimed in claim 6, characterized in that: The carrier (1) is provided with a plurality of placement positions (11) for carrying the DSC chip (4); Sensor modules (12) corresponding to the clamping member (227) are arranged on both sides of the placement position (11), and the sensor modules (12) are electrically connected to the control module; The sensor module (12) is suitable for detecting whether a portion of the corresponding clamping member (227) protrudes from a side of the connecting member (221) away from the DSC chip (4); if all sensor modules (12) corresponding to a placement position (11) detect that a portion of the corresponding clamping member (227) protrudes from a side of the connecting member (221) away from the DSC chip (4), the control module determines that the clamping mechanism (22) clamps the DSC chip (4).

9. The integrated DSC chip conveying fixture as claimed in claim 8, characterized in that: The carrier (1) is mounted on a conveyor belt mechanism (3), the conveyor belt mechanism (3) is electrically connected to a control module, and the control module is further configured to control the conveyor belt mechanism (3) to drive the carrier (1) to move; A baffle (31) is provided on one side of the conveyor belt mechanism in the width direction, and a cylinder (32) is provided on the other side; The cylinder (32) is provided with a push block (33); The cylinder (32) is electrically connected to the control module, and the control module controls the cylinder (32) to drive the pushing block (33) to contact the outer wall of the carrier (1), so as to push the carrier (1) until it contacts the baffle (31).

10. A working method using the integrated DSC chip conveying fixture as claimed in claim 1, characterized in that: include: Controlling the transport device (2) through a control module to transport the DSC chip (4) onto the carrier (1); as well as The control module controls the clamping cylinder (21) to drive the relative clamping mechanism (22) to approach the DSC chip (4) for clamping.

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