Wafer carrier device for manufacturing semiconductor device

Abstract

The invention relates to the technical field of semiconductor device manufacturing, and provides a wafer carrier device for semiconductor device manufacturing, which comprises a carrier frame, a carrier cover and a wafer, and is characterized in that the carrier frame is provided with an accommodating groove; the carrying cover is detachably fixed on the carrying frame; the combined cover is arranged on the carrying cover, an adjusting cavity is defined by the combined cover and the carrying cover, and the volume of the adjusting cavity is adjustable; a vent hole is formed in the carrying frame, and the vent hole penetrates through the carrying frame; the elastic sealing ring is sealed and fixed in the vent hole; the wafer is arranged on one side, close to the carrying cover, of the elastic sealing ring in an abutting mode, and the wafer and the carrying frame are arranged in a spaced mode. According to the invention, the adjusting cavity and the vent hole which are communicated with the accommodating groove are arranged, and the volume of the adjusting cavity is adjustable, so that when the carrying cover is connected with the carrying frame, the wafer can stably and uniformly abut against the elastic sealing ring, and the processing safety of the wafer is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor device manufacturing, and in particular to a wafer carrier device for semiconductor device manufacturing. Background Art

[0002] Wafers are the raw materials for making products related to the semiconductor field. During the manufacturing process of semiconductor devices, it is necessary to design a special wafer carrier device to carry the wafers to ensure the smooth progress of wafer processing operations.

[0003] The utility model with announcement number CN212967633U discloses a wafer box, which includes: the top cover is detachably connected to the bottom cover; the clamping mechanism includes: a connecting plate and more than three pressing claws; the connecting plate can be arranged between the bottom cover and the top cover; the first ends of more than three pressing claws are fixedly connected to the connecting plate; more than three supporting blocks are fixedly arranged on the bottom cover, and more than three supporting blocks correspond to more than three pressing claws one by one; the supporting blocks are provided with placement grooves, and the second ends of the pressing claws can be pressed into the corresponding placement grooves. The wafer box is easy to operate and can lock the wafers, so that the wafers will not slide when the cover is opened and transferred.

[0004] In the above technical solution, in order to improve the locking degree of the wafer, multiple pressure claws and multiple support blocks are set to press and fix the wafer. However, this pressing method is not only easy to cause damage to the surface of the wafer, but also easy to cause uneven pressure problems, which is not conducive to ensuring the processing safety of the wafer. Summary of the invention

[0005] In view of this, the present invention proposes a wafer carrier device for semiconductor device manufacturing, which can lock the wafer steadily and evenly, thereby improving the processing safety of the wafer.

[0006] The technical solution of the present invention is implemented as follows: The present invention provides a wafer carrier device for semiconductor device manufacturing, comprising a carrier, a carrier cover and a wafer, wherein:

[0007] The carrier is provided with a receiving groove;

[0008] The carrier cover is detachably fixed on the carrier and blocks the receiving groove;

[0009] It also includes a composite cover and an elastic sealing ring, wherein:

[0010] The composite cover is arranged on the carrier cover and encloses the carrier cover to form an adjustment cavity, the adjustment cavity is communicated with the receiving groove, and the volume of the adjustment cavity is adjustable;

[0011] A vent hole is provided in the carrier, the vent hole penetrates the carrier and is connected to the receiving groove; the elastic sealing ring is sealed and fixed in the vent hole, and a part of the elastic sealing ring extends out of the vent hole;

[0012] The wafer is disposed against the side of the elastic sealing ring close to the carrier cover and is spaced apart from the carrier.

[0013] On the basis of the above technical solution, preferably, the composite cover comprises a cover body and a convex ring, wherein:

[0014] The cover body is sleeved on the outer side of the carrier cover and is slidably connected thereto;

[0015] A clamping groove is provided on the peripheral side of the carrier cover, and the convex ring is fixedly arranged in the cover body and can be clamped with the clamping groove. When the convex ring is clamped with the clamping groove, the cover body and the carrier are in contact with each other.

[0016] More preferably, the carrier cover is connected to the carrier by threaded engagement, an annular groove is provided on one end of the peripheral side of the carrier cover close to the carrier, and a limiting groove is provided in the annular groove on one side away from the carrier;

[0017] The composite cover also includes a limiting block, which is fixedly disposed in the cover body and is engaged with the limiting groove and is rotatably connected with the annular groove.

[0018] More preferably, the composite cover further comprises a spring, and two ends of the spring respectively abut against a side of the cover body close to the carrier and a side of the carrier cover away from the carrier;

[0019] A communication hole is provided in the middle of the carrier cover, and the communication hole is communicated with the adjustment cavity and the containing groove.

[0020] On the basis of the above technical solution, preferably, it further comprises a negative pressure mechanism, wherein the negative pressure mechanism comprises a piston plate, a connecting frame and a sliding rod, wherein:

[0021] The piston plate seals and slides in the vent hole;

[0022] The connecting frame is fixedly arranged on a side of the piston plate away from the elastic sealing ring;

[0023] The sliding rod penetrates and is slidably arranged on the carrier, and one end of the sliding rod is fixedly connected to the connecting frame.

[0024] More preferably, one end of the sliding rod away from the connecting frame abuts against a side of the composite cover close to the carrier;

[0025] The negative pressure mechanism further comprises an elastic block, which is fixedly arranged on the carrier and abuts against a side of the connecting frame away from the piston plate.

[0026] More preferably, the vent hole comprises a mounting portion and a pressure regulating portion, wherein:

[0027] The mounting portion is provided on a side of the carrier close to the carrier cover and is located in the receiving groove, and the elastic sealing ring is sealed and fixed in the mounting portion;

[0028] The pressure regulating part is arranged on a side of the carrier away from the carrier cover and is communicated with the mounting part. The piston plate seals and slides in the pressure regulating part, and the inner diameter of the pressure regulating part is greater than the inner diameter of the mounting part.

[0029] More preferably, the vent holes and the elastic sealing rings are provided in plurality and correspond one to one;

[0030] One of the vent holes is coaxially arranged with the receiving groove, and the other vent holes are arranged in a circular array around the axis of the receiving groove.

[0031] More preferably, the piston plate includes a first movable plate, a sealing box and a second movable plate, wherein:

[0032] The first movable plate is sealingly slid in the vent hole located in the middle position;

[0033] The sealing box is sealingly slidable in the vent holes located at the outer edge and corresponds to the vent holes one by one. A T-shaped groove is provided on a side of the sealing box away from the carrier cover.

[0034] The second movable plate is slidably disposed in the T-shaped groove, and the second movable plate and the first movable plate are both fixedly connected to the connecting frame.

[0035] More preferably, the cross section of the carrier is a rounded diamond shape, and the cross sections of the carrier cover and the composite cover are both circular.

[0036] Compared with the prior art, the wafer carrier device for semiconductor device manufacturing of the present invention has the following advantages:

[0037] Beneficial effects:

[0038] (1) By providing an adjustment cavity and a vent hole connected to the receiving groove, and making the volume of the adjustment cavity adjustable, when the carrier cover is connected to the carrier, the wafer can be pressed against the elastic sealing ring stably and evenly, thereby improving the processing safety of the wafer;

[0039] (2) By providing the card slot and the convex ring, the relative position of the composite cover and the carrier cover can be fixed, and by providing the ring groove and the spring, the composite cover and the carrier cover can be easily restored to their original positions, thereby improving the operational convenience of the carrier device;

[0040] (3) By providing a negative pressure mechanism, the fixing firmness of the wafer can be improved, the wafer can be prevented from shifting during the locking process, and the carrier device can be designed to be lightweight and thin. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0042] Figure 1 A cross-sectional view of a wafer carrier device for semiconductor device manufacturing according to the present invention along its width direction;

[0043] Figure 2 A three-dimensional diagram of a carrier in a wafer carrier device for semiconductor device manufacturing of the present invention;

[0044] Figure 3 A partial cross-sectional view of a wafer carrier device for semiconductor device manufacturing according to the present invention;

[0045] Figure 4 A cross-sectional view of a carrier cover and a composite cover in a wafer carrier device for manufacturing a semiconductor device according to the present invention;

[0046] Figure 5 for Figure 1 A in the middle is an enlarged view of the adjustment cavity in a state where no adjustment is performed;

[0047] Figure 6 for Figure 1 A in the middle is an enlarged view of the reduced state of the regulating cavity;

[0048] Figure 7 A three-dimensional diagram of a carrier cover in a wafer carrier device for manufacturing semiconductor devices according to the present invention;

[0049] Figure 8 for Figure 7 The enlarged view of point B in the middle;

[0050] Fig. 9 A three-dimensional diagram of a composite cover in a wafer carrier device for semiconductor device manufacturing of the present invention;

[0051] Fig.10 for Fig. 9 Enlarged view of point C in the middle;

[0052] Fig.11 A cross-sectional view of a wafer carrier device for semiconductor device manufacturing according to the present invention along its length direction;

[0053] Fig.12 A three-dimensional view of a connection frame in a wafer carrier device for semiconductor device manufacturing of the present invention;

[0054] Fig.13 A three-dimensional diagram of a negative pressure mechanism in a wafer carrier device for semiconductor device manufacturing according to the present invention;

[0055] Fig.14 for Fig.11 The enlarged view of point D in the middle;

[0056] Fig.15 A cross-sectional view of a first movable plate in a wafer carrier device for manufacturing semiconductor devices of the present invention;

[0057] Fig.16 A cross-sectional view of a second movable plate in a wafer carrier device for manufacturing semiconductor devices according to the present invention;

[0058] Fig.17 The present invention is a three-dimensional diagram of a wafer carrier device for semiconductor device manufacturing.

[0059] Wherein: 1. carrier; 101. receiving groove; 102. vent hole; 1021. mounting part; 1022. pressure regulating part; 2. carrier cover; 201. card slot; 202. ring groove; 203. limit groove; 204. connecting hole; 3. composite cover; 31. cover body; 32. convex ring; 33. limit block; 34. spring; 301. regulating chamber; 4. elastic sealing ring; 5. negative pressure mechanism; 51. piston plate; 511. first movable plate; 512. sealing box; 513. second movable plate; 52. connecting frame; 53. sliding rod; 54. elastic block; 501. T-slot; 6. wafer. DETAILED DESCRIPTION

[0060] The following will be combined with the specific implementation of the present invention to clearly and completely describe the technical solution in the present invention. Obviously, the described implementation is only a part of the implementation of the present invention, not all of the implementation. Based on the implementation of the present invention, all other implementations obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0061] like Figure 1As shown, a wafer carrier device for semiconductor device manufacturing of the present invention includes a carrier 1, a carrier cover 2, a composite cover 3, an elastic sealing ring 4, a negative pressure mechanism 5 and a wafer 6, which is used in the manufacturing process of semiconductor devices.

[0062] Among them, the carrier 1 is the main component of the carrier device, and a receiving groove 101 is provided on the carrier 1, and the receiving groove 101 is used to place the wafer 6. After the wafer 6 is placed in the receiving groove 101, the carrier cover 2 is fixed on the carrier 1 and blocks the receiving groove 101 to package the wafer 6. The carrier cover 2 is detachably fixedly connected to the carrier 1, so as to facilitate the removal of the wafer 6 from the carrier 1.

[0063] When the wafer 6 is packaged in the carrier 1 and the carrier cover 2 , it needs to be limited and fixed, otherwise the wafer 6 is prone to be damaged due to sliding.

[0064] To solve this problem, a vent hole 102 is provided in the carrier 1, the vent hole 102 penetrates the carrier 1 and communicates with the receiving groove 101, the elastic sealing ring 4 is sealed and fixed in the vent hole 102, and a part of the elastic sealing ring 4 extends out of the vent hole 102; the composite cover 3 is arranged on the carrier cover 2, the composite cover 3 and the carrier cover 2 are enclosed to form a relatively closed adjustment cavity 301, the adjustment cavity 301 is communicated with the receiving groove 101, and the volume of the adjustment cavity 301 is adjustable; Figure 3 As shown, when the wafer 6 is placed in the receiving groove 101 and the carrier cover 2 is connected to the carrier 1, the volume of the adjusting chamber 301 is reduced, thereby compressing the air in the adjusting chamber 301 and the receiving groove 101 to form high-pressure air. The high-pressure air will press the wafer 6 against and press the side of the elastic sealing ring 4 close to the carrier cover 2, thereby locking the wafer 6 to prevent the wafer 6 from sliding; at the same time, in order to avoid extrusion damage between the wafer 6 and the carrier 1, the reduction amount of the adjusting chamber 301 and the elastic contraction amount of the elastic sealing ring 4 are limited, so that when the wafer 6 is against the elastic sealing ring 4, it can be spaced apart from the carrier 1.

[0065] Compared with the method of using related components to compress the wafer 6 in the prior art, the carrier device uses air pressure to press the wafer 6. This method is more stable and uniform, and reduces the contact between the wafer 6 and excessive components, thereby achieving a good protective effect and ensuring the processing safety of the wafer 6.

[0066] In order to achieve the communication between the adjusting chamber 301 and the containing groove 101 , a communication hole 204 is preferably opened in the middle of the carrier cover 2 , so that the communication hole 204 is connected with the adjusting chamber 301 and the containing groove 101 .

[0067] In order to adjust the volume of the adjustment chamber 301, Figure 4-Figure 10As shown, the composite cover 3 includes a cover body 31 and a convex ring 32. The cover body 31 is sleeved on the outer side of the carrier cover 2 and is slidably connected thereto. A card slot 201 is provided on the peripheral side of the carrier cover 2. The convex ring 32 is fixedly arranged in the cover body 31 and can be carded with the card slot 201. Figure 5 As shown, at this time, the cover body 31 and the carrier cover 2 are in a state where the adjustment chamber 301 is not adjusted, and the volume of the adjustment chamber 301 is relatively large. When the carrier cover 2 is connected to the carrier 1, the cover body 31 is slid downward to reduce the volume of the adjustment chamber 301, thereby increasing the air pressure inside the receiving groove 101 to fix the wafer 6. Figure 6 As shown, until the protruding ring 32 is engaged with the engaging groove 201 , the force applied to the cover body 31 can be released, so that the relative position of the cover body 31 and the carrier cover 2 remains unchanged.

[0068] like Figure 6 As shown, when the protruding ring 32 is engaged with the slot 201 , the cover 31 abuts against the carrier 1 , thereby improving the sealing performance of the receiving slot 101 and preventing the locking degree of the wafer 6 and the cleanliness of the surface of the wafer 6 from being affected by air leakage.

[0069] In order to facilitate the assembly of the carrier cover 2 and the carrier 1, it is preferred that the carrier cover 2 is connected to the carrier 1 by threaded fitting, which is more convenient to operate, and this connection method makes the relative position of the carrier cover 2 and the carrier 1 more stable. However, the carrier cover 2 is located in the composite cover 3. When the carrier cover 2 and the carrier 1 are assembled, it is necessary to rotate the composite cover 3 to allow the carrier cover 2 to rotate. For this purpose, an annular groove 202 is provided on one end of the peripheral side of the carrier cover 2 close to the carrier 1, and a limiting groove 203 is provided on the side of the annular groove 202 away from the carrier 1; a limiting block 33 is provided in the composite cover 3, and the limiting block 33 is fixedly arranged in the cover body 31, so that the limiting block 33 is engaged with the limiting groove 203 and is rotatably connected with the annular groove 202; Figure 5 As shown, at this time, the limit block 33 is engaged with the limit groove 203, and the cover 2 can be driven to rotate by rotating the cover body 31, so that the cover 2 is screwed onto the carrier 1, and when the cover body 31 is pressed downward, the limit block 33 is separated from the limit groove 203, so that the limit block 33 enters the annular groove 202, and at this time, the cover body 31 is rotated, and the cover 2 is not driven to rotate, thereby improving the independence of the composite cover 3 and the cover 2; for example, in Figure 6 In the state shown, if you want to separate the convex ring 32 from the slot 201, you need to apply an upward force to the cover body 31. The direction of the force applied manually is not easy to control, and it is easy for the cover body 31 to rotate during the movement. However, the design structure ensures that the rotation of the cover body 31 will not drive the carrier cover 2 to rotate, so that the carrier device is suitable for more usage conditions.

[0070] Before the carrier device is used, it is preferred that the adjustment chamber 301 is in a state of maximum volume. To this end, a spring 34 is provided in the composite cover 3, and the two ends of the spring 34 are respectively abutted against a side of the cover body 31 close to the carrier 1 and a side of the carrier cover 2 away from the carrier 1, so that the side of the cover body 31 close to the carrier 1 and the side of the carrier cover 2 away from the carrier 1 maintain a maximum distance in the initial state.

[0071] The negative pressure mechanism 5 is used to form negative pressure in the vent hole 102 to cooperate with the adjustment of the volume of the adjustment chamber 301 to lock the wafer 6. The setting of the negative pressure mechanism 5 helps to reduce the adjustment range of the adjustment chamber 301, which is beneficial to the lightweight design of the carrier cover 2 and the composite cover 3.

[0072] As a preferred embodiment, the negative pressure mechanism 5 includes a piston plate 51, a connecting frame 52 and a sliding rod 53. The piston plate 51 slides sealingly in the vent 102; the connecting frame 52 is fixedly arranged on the side of the piston plate 51 away from the elastic sealing ring 4; the sliding rod 53 penetrates and is slidably arranged on the carrier 1, and one end of the sliding rod 53 is fixedly connected to the connecting frame 52. By sliding the sliding rod 53 at one end outside the carrier 1, the piston plate 51 can be driven to slide in the vent 102, thereby forming a negative pressure in the vent 102, so as to increase the resistance between the wafer 6 and the elastic sealing ring 4, and strengthen the fixing firmness of the wafer 6.

[0073] When the wafer 6 is fixed, it is necessary not only to operate the composite cover 3 but also to operate the sliding rod 53. The operation method is relatively complicated. In order to improve the operation efficiency of the carrier device, the composite cover 3 and the negative pressure mechanism 5 are linked, such as Fig.11 and Fig.14 As shown, the end of the sliding rod 53 away from the connecting frame 52 is abutted against the side of the composite cover 3 close to the carrier 1, and an elastic block 54 is arranged in the negative pressure mechanism 5. The elastic block 54 is made of elastic material, such as flexible silicone, etc. The elastic block 54 is fixedly arranged on the carrier 1 and abutted against the side of the connecting frame 52 away from the piston plate 51. When the composite cover 3 is pressed downward, the sliding rod 53, the connecting frame 52 and the piston plate 51 can be driven to move downward, not only forming high pressure on the top side of the wafer 6, but also forming negative pressure on the bottom side of the wafer 6, thereby firmly fixing the wafer 6 on the elastic sealing ring 4; and when the wafer 6 needs to be taken out, the composite cover 3 is moved upward, and the piston plate 51 can be moved back to its original position by using the elastic block 54 to abut against the connecting frame 52, so that no negative pressure is formed in the vent 102.

[0074] When the negative pressure demand in the vent hole 102 is relatively large, in order to ensure the lightweight design of the carrier 1 and the negative pressure mechanism 5, it is preferred that the vent hole 102 includes a mounting portion 1021 and a pressure regulating portion 1022. The mounting portion 1021 is provided on a side of the carrier 1 close to the carrier cover 2 and is located in the receiving groove 101. The elastic sealing ring 4 is sealed and fixed in the mounting portion 1021. The pressure regulating portion 1022 is provided on a side of the carrier 1 away from the carrier cover 2 and is connected to the mounting portion 1021. The piston plate 51 is sealed and slidable in the pressure regulating portion 1022, and the inner diameter of the pressure regulating portion 1022 is larger than the inner diameter of the mounting portion 1021. Fig.15 As shown, the cross section of the vent hole 102 is T-shaped, and when the piston plate 51 moves downward a short distance, a large negative pressure can be formed in the mounting portion 1021.

[0075] The wafer 6 has a large size. In order to improve the locking stability of the wafer 6, Figure 2 As shown, multiple vent holes 102 and elastic sealing rings 4 are provided, and they correspond one to one; the center of gravity of the wafer 6 is in its middle position, so one of the vent holes 102 is coaxially arranged with the receiving groove 101, that is, this vent hole 102 is arranged in the middle position of the receiving groove 101, and the remaining multiple vent holes 102 are arranged in a circular array around the axis of the receiving groove 101.

[0076] The present invention provides different structural designs for the piston plate 51 at different positions. Specifically, the piston plate 51 includes a first movable plate 511, a sealing box 512, and a second movable plate 513. Fig.15 As shown, the first movable plate 511 is sealed and slides in the vent hole 102 located in the middle position and is fixedly connected to the connecting frame 52. When the composite cover 3 drives the sliding rod 53 to slide downward, the first movable plate 511 can be driven to move downward synchronously; Fig.16 As shown, the sealing box 512 is sealed and slides in the vent hole 102 located at the outer edge position, and corresponds to it one by one. A T-slot 501 is opened on the side of the sealing box 512 away from the carrier cover 2; the second movable plate 513 is slidably set in the T-slot 501, specifically, it is slidably set in the large hole in the T-slot 501, and the second movable plate 513 is fixedly connected to the connecting frame 52. When the composite cover 3 drives the sliding rod 53 to slide downward, it will first drive the second movable plate 513 to slide downward in the T-slot 501 until the second movable plate 513 abuts against the sealing When the sealing box 512 is sealed, the sealing box 512 will be driven to move downward; that is, when the composite cover 3 drives the sliding rod 53 to slide downward, the piston plate 51 in the vent 102 located in the middle position moves downward synchronously with the composite cover 3, and the multiple piston plates 51 in the vent 102 located at the outer edge position first remain stationary, and then move downward synchronously with the composite cover 3. Utilizing this structure, the fixing firmness of the middle position of the wafer 6 can be strengthened first, and then the fixing firmness of the edge position of the wafer 6 can be strengthened, which is beneficial to improving the fixing stability of the wafer 6.

[0077] In order to prevent the carrier 1 from slipping relative to the carrier cover 2 and the composite cover 3 when they are rotated, it is preferred that the cross-section of the carrier 1 is a rounded diamond shape, and the cross-sections of the carrier cover 2 and the composite cover 3 are both circular; at the same time, the upper and lower outer diameters of the carrier device are not uniform, which is also conducive to the stacking and splitting of multiple carrier devices, thereby improving the processing efficiency of the wafer 6.

[0078] Specifically, Figure 2 and Fig.17 As shown, it is preferred that the angle between two adjacent side surfaces of the carrier 1 is 90 degrees, the fillet radius of two relative top angles of the carrier 1 is equal to the radius of the composite cover 3, and the fillet radius of the other two relative top angles of the carrier 1 is smaller. At this time, the carrier device can be placed not only in a circular space, but also in a rectangular space, and the side walls of the carrier device can be abutted against the side walls of the placement space to achieve the stacking stability of the carrier device.

[0079] A method for using a wafer carrier device for semiconductor device manufacturing of the present invention is as follows:

[0080] S1, placing the wafer 6 in the receiving groove 101, and making the wafer 6 abut against the plurality of elastic sealing rings 4;

[0081] S2, installing the carrier cover 2 on the carrier frame 1;

[0082] S3, pressing the composite cover 3, so that the convex ring 32 is engaged with the slot 201, thereby forming high pressure and negative pressure on both sides of the wafer 6, so that the wafer 6 is firmly held against the elastic sealing ring 4;

[0083] S4, when it is necessary to take out the wafer 6, force is applied to the composite cover 3 to separate the convex ring 32 from the slot 201, and the composite cover 3 and the negative pressure mechanism 5 are restored to their original positions by using the spring 34 to support the cover body 31 and the elastic block 54 to support the connecting frame 52, so that the air pressure on both sides of the wafer 6 is restored to the initial equilibrium state;

[0084] S5 , removing the carrier cover 2 from the carrier 1 , and taking the wafer 6 out of the receiving slot 101 , so as to process the wafer 6 .

[0085] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A wafer carrier device for semiconductor device manufacturing, comprising a carrier (1), a carrier cover (2) and a wafer (6), wherein: The carrier (1) is provided with a receiving groove (101); The carrier cover (2) is detachably fixed on the carrier (1) and blocks the containing groove (101); It is characterized in that it also includes a composite cover (3) and an elastic sealing ring (4), wherein: The composite cover (3) is arranged on the carrier cover (2) and encloses the carrier cover to form an adjustment cavity (301); the adjustment cavity (301) is in communication with the receiving groove (101), and the volume of the adjustment cavity (301) is adjustable; The carrier (1) is provided with a vent hole (102), the vent hole (102) passes through the carrier (1) and is in communication with the receiving groove (101); the elastic sealing ring (4) is sealed and fixed in the vent hole (102), and a part of the elastic sealing ring (4) extends out of the vent hole (102); The wafer (6) is arranged in contact with a side of the elastic sealing ring (4) close to the carrier cover (2), and is spaced apart from the carrier (1).

2. A wafer carrier device for semiconductor device manufacturing as claimed in claim 1, characterized in that: The composite cover (3) comprises a cover body (31) and a convex ring (32), wherein: The cover body (31) is sleeved on the outer side of the carrier cover (2) and is slidably connected thereto; A clamping groove (201) is provided on the peripheral side of the carrier cover (2); the convex ring (32) is fixedly arranged in the cover body (31) and can be clamped with the clamping groove (201); and when the convex ring (32) is clamped with the clamping groove (201), the cover body (31) and the carrier (1) are in contact with each other.

3. A wafer carrier device for semiconductor device manufacturing as claimed in claim 2, characterized in that: The carrier cover (2) is connected to the carrier (1) by threaded engagement, and an annular groove (202) is provided on one end of the peripheral side of the carrier (2) close to the carrier (1), and a limiting groove (203) is provided in the annular groove (202) on the side away from the carrier (1); The composite cover (3) further comprises a limit block (33), wherein the limit block (33) is fixedly arranged in the cover body (31), is engaged with the limit groove (203), and is rotatably connected with the annular groove (202).

4. A wafer carrier device for semiconductor device manufacturing as claimed in claim 3, characterized in that: The composite cover (3) further comprises a spring (34), the two ends of which are respectively in contact with a side of the cover body (31) close to the carrier (1) and a side of the carrier cover (2) away from the carrier (1); A communication hole (204) is provided in the middle of the carrier cover (2), and the communication hole (204) is connected to the adjustment cavity (301) and the containing groove (101).

5. A wafer carrier device for semiconductor device manufacturing as claimed in claim 1, characterized in that: It also includes a negative pressure mechanism (5), the negative pressure mechanism (5) includes a piston plate (51), a connecting frame (52) and a sliding rod (53), wherein: The piston plate (51) slides sealingly in the vent hole (102); The connecting frame (52) is fixedly arranged on a side of the piston plate (51) away from the elastic sealing ring (4); The sliding rod (53) penetrates through and is slidably arranged on the carrier (1), and one end of the sliding rod (53) is fixedly connected to the connecting frame (52).

6. A wafer carrier device for semiconductor device manufacturing as claimed in claim 5, characterized in that: One end of the sliding rod (53) away from the connecting frame (52) abuts against a side of the composite cover (3) close to the carrier (1); The negative pressure mechanism (5) further comprises an elastic block (54), wherein the elastic block (54) is fixedly arranged on the carrier (1) and abuts against a side of the connecting frame (52) away from the piston plate (51).

7. A wafer carrier device for semiconductor device manufacturing as claimed in claim 5, characterized in that: The vent hole (102) comprises a mounting portion (1021) and a pressure regulating portion (1022), wherein: The mounting portion (1021) is provided on a side of the carrier (1) close to the carrier cover (2) and is located in the receiving groove (101), and the elastic sealing ring (4) is sealed and fixed in the mounting portion (1021); The pressure regulating portion (1022) is opened on a side of the carrier (1) away from the carrier cover (2) and is connected to the mounting portion (1021); the piston plate (51) seals and slides in the pressure regulating portion (1022), and the inner diameter of the pressure regulating portion (1022) is greater than the inner diameter of the mounting portion (1021).

8. A wafer carrier device for semiconductor device manufacturing as claimed in claim 5, characterized in that: The vent holes (102) and the elastic sealing ring (4) are both provided in plurality and correspond one to one; One of the vent holes (102) is coaxially arranged with the containing groove (101), and the remaining plurality of vent holes (102) are arranged in a circular array around the axis of the containing groove (101).

9. A wafer carrier device for semiconductor device manufacturing as claimed in claim 8, characterized in that: The piston plate (51) comprises a first movable plate (511), a sealing box (512) and a second movable plate (513), wherein: The first movable plate (511) is sealingly slidable in the vent hole (102) located in the middle position; The sealing box (512) is sealingly slidable in the vent holes (102) located at the outer edge and corresponds one to one with the vent holes. A T-shaped groove (501) is provided on a side of the sealing box (512) away from the carrier cover (2); The second movable plate (513) is slidably disposed in the T-shaped slot (501), and the second movable plate (513) and the first movable plate (511) are both fixedly connected to the connecting frame (52).

10. A wafer carrier device for semiconductor device manufacturing as claimed in claim 5, characterized in that: The cross section of the carrier (1) is in the shape of a rounded diamond, and the cross sections of the carrier cover (2) and the composite cover (3) are both in the shape of a circle.

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