Wafer bonding equipment

Abstract

The present application provides a wafer bonding device. The wafer bonding device includes a bonding chamber and a first carrier, a second carrier and a driving assembly located in the bonding chamber. The first carrier and the second carrier are arranged opposite to each other. The first carrier includes a bearing portion, a limiting portion arranged on the bearing portion and an alignment portion located on the side of the bearing portion. The bearing portion is used to carry a wafer. The limiting portion is used to enter the alignment opening of the two wafers carried by the bearing portion to limit the two wafers. The driving assembly includes a first driving portion, which is used to drive the alignment portion to move in the horizontal direction so that the alignment portion drives the two wafers carried by the bearing portion to move and align. The driving assembly also includes a second driving portion, which is used to drive the first carrier and / or the second carrier to move so that the two wafers located between the bearing portion and the second carrier are bonded.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing technology, and in particular to a wafer bonding device. Background Art

[0002] Wafer bonding device is a special equipment used to tightly bond wafers and is widely used in semiconductor manufacturing, microelectronics, micro-electromechanical systems and other fields.

[0003] In the existing wafer bonding process, two wafers are usually aligned outside the bonding chamber and then transferred into the bonding chamber for bonding. During the transfer process, the relative positions of the wafers may shift, resulting in reduced bonding accuracy. Summary of the invention

[0004] The present application provides a wafer bonding device, which includes a bonding chamber and a first carrier, a second carrier and a driving assembly located in the bonding chamber;

[0005] The first carrier and the second carrier are arranged opposite to each other; the first carrier comprises a carrying portion, a limiting portion arranged on the carrying portion, and an alignment portion located on a side of the carrying portion; the carrying portion is used to carry wafers; the limiting portion is used to enter an alignment opening of two wafers carried by the carrying portion to limit the two wafers;

[0006] The driving assembly includes a first driving part, and the first driving part is used to drive the alignment part to move in a horizontal direction, so that the alignment part drives the two wafers carried by the carrying part to move and align;

[0007] The driving assembly further includes a second driving unit, and the second driving unit is used to drive the first carrier and / or the second carrier to move so as to bond two wafers between the carrier and the second carrier.

[0008] In some embodiments, the bearing portion is provided with a receiving groove; the driving assembly also includes a third driving portion, and the third driving portion is used to drive the limiting portion to move in the vertical direction so that the limiting portion switches between the first state and the second state; when the limiting portion is in the first state, the limiting portion enters the receiving groove; when the limiting portion is in the second state, the limiting portion exposes the receiving groove.

[0009] In some embodiments, the alignment portion includes at least two sub-alignment portions arranged at intervals; the alignment portion has a first state and a second state; when the alignment portion is in the first state, the distance between each of the sub-alignment portions and the bearing portion is smaller than the distance between each of the sub-alignment portions and the bearing portion when the alignment portion is in the second state;

[0010] The first driving part is used to drive each of the sub-aligning parts to move, so that the aligning part switches between the first state and the second state.

[0011] In some embodiments, a line connecting the orthographic projection of the center of the limiting portion on the top surface of the bearing portion and the center of the top surface of the bearing portion is a first straight line, and a straight line passing through the center of the top surface of the bearing portion and perpendicular to the first straight line is a second straight line; at least one of the sub-alignment portions is located on a side of the second straight line away from the limiting portion.

[0012] In some embodiments, the alignment portion includes two sub-alignment portions, the two sub-alignment portions are both located on a side of the second straight line away from the limiting portion, and the two sub-alignment portions are symmetrical about the first straight line.

[0013] In some embodiments, the first driving part includes a sub-driving part corresponding to each of the sub-alignment parts, the sub-driving part includes a motor and a guide rail, the guide rail is arranged on the outside of the bearing part, and each of the motors is used to drive the corresponding sub-alignment part to move along the guide rail.

[0014] In some embodiments, the first driving unit also includes a controller, which is used to obtain the working current of the motor. When the working current is less than or equal to a preset current, the controller controls the first driving unit to drive the sub-alignment unit to move; when the working current is greater than the preset current, the controller controls the first driving unit to stop working.

[0015] In some embodiments, the wafer separation device also includes a wafer separation component, and the driving assembly also includes a fourth driving unit; the fourth driving unit is configured to: after the first wafer is placed on the supporting unit, drive the wafer separation component to extend to the side of the first wafer away from the first carrier; after the second wafer is placed on the side of the wafer separation component away from the supporting unit, drive the wafer separation component to move to the side of the wafer so that the two wafers are in contact.

[0016] In some embodiments, the wafer bonding device further includes an air pump; the supporting portion is provided with an adsorption hole; an exhaust channel is provided inside the first carrier, and the exhaust channel is respectively connected to the adsorption hole and the air pump.

[0017] In some embodiments, the second carrier includes a bonding portion, and an orthographic projection of the bonding portion on a plane where the top surface of the carrying portion is located falls on the top surface of the carrying portion.

[0018] The wafer alignment and bonding of the wafer bonding device of the present application are completed in the bonding chamber. There is no need to transfer the wafer after alignment, which can avoid the reduction of bonding accuracy caused by the relative position deviation of the wafer during the transfer process, which is beneficial to improving the bonding quality, simplifying the process flow and improving production efficiency.

[0019] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0021] Figure 1 A schematic structural diagram of a wafer bonding device provided in one embodiment of the present application;

[0022] Figure 2 for Figure 1 A top view of a first stage of a wafer bonding apparatus provided in the illustrated embodiment;

[0023] Figure 3 for Figure 2 A partial enlarged view of region A in the embodiment shown;

[0024] Figure 4 for Figure 2 A partial enlarged view of area B in the embodiment shown. DETAILED DESCRIPTION

[0025] Here, the technical solutions in the embodiments (or "implementations") of the present application will be described clearly and completely in conjunction with the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements.

[0026] If there are terms involving directional indications or positional relationships in the embodiments of the present application (such as up, down, left, right, front, back, inside, outside, top, bottom, center, vertical, horizontal, longitudinal, transverse, length, width, counterclockwise, clockwise, axial, radial, circumferential, etc.), such terms are only used to explain the relative positional relationship, movement, etc. between the components under a certain specific posture (as shown in the accompanying drawings); if the specific posture changes, the directional indication or positional relationship will also change accordingly. In addition, the terms "first", "second", etc. involved in the embodiments of the present application are only used for the purpose of convenience of description and cannot be understood as indicating or implying relative importance.

[0027] The wafer bonding device of the embodiment of the present application is described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the features of the following embodiments and implementations can complement or combine with each other.

[0028] like Figure 1 and Figure 2 As shown, the wafer bonding device 100 of the present application includes a bonding chamber 40 and a first stage 10 , a second stage 20 and a driving assembly 30 located in the bonding chamber 40 .

[0029] The first stage 10 and the second stage 20 are arranged opposite to each other. The first stage 10 includes a carrying portion 11, a limiting portion 12 arranged on the carrying portion 11, and an alignment portion 13 located at the side of the carrying portion 11. The carrying portion 11 is used to carry the wafer 200. The limiting portion 12 is used to enter the alignment opening 203 of the two wafers 200 carried by the carrying portion 11 to limit the two wafers 200.

[0030] The driving assembly 30 includes a first driving part 31 , and the first driving part 31 is used to drive the aligning part 13 to move in a horizontal direction, so that the aligning part 13 drives the two wafers 200 carried by the carrying part 11 to move and align.

[0031] The driving assembly 30 further includes a second driving unit 32, which is used to drive the first stage 10 or the second stage 20 to move, or to drive the first stage 10 and the second stage 20 to move simultaneously, so that two wafers 200 located between the supporting unit 11 and the second stage 20 are bonded.

[0032] The wafer bonding device 100 provided in the embodiment of the present application sets the wafer 200 on the bearing portion 11 of the first carrier 10, and the limiting portion 12 is located in the alignment opening 203 of the two wafers 200. At this time, the alignment openings 203 of the two wafers are basically aligned, and the limiting portion 12 can limit the translation of the wafer 200 to avoid the misalignment of the alignment openings 203 of the two wafers 200, thereby achieving the angular alignment of the two wafers. When the alignment portion 13 is driven to move by the first driving portion 31, the alignment portion 13 can contact the edge of the wafer 200 and drive the wafer 200 to rotate around the limiting portion 12, so that the edges of the two wafers 200 are aligned, and finally the alignment of the two wafers 200 is achieved. Compared with the method in the related art of completing wafer alignment outside the bonding chamber and then transferring the wafer into the bonding chamber for bonding, the wafer bonding device of the present application completes the alignment and bonding of the wafer in the bonding chamber. There is no need to transfer the wafer after alignment, which can avoid the reduction in bonding accuracy caused by the relative position of the wafer shifting during the transfer process, which is beneficial to improving the bonding quality, simplifying the process flow, and improving production efficiency.

[0033] In one embodiment, Figure 1 As shown, the wafer bonding device 100 further includes an air pump 51, which is connected to the bonding chamber 40. Before wafer alignment and bonding, the air pump 51 can be used to extract the air in the bonding chamber 40 and fill the bonding chamber 40 with an inert gas, so that a clean and stable bonding environment is formed in the bonding chamber 40, thereby preventing the wafer surface from being contaminated, which is beneficial to improving the purity of the bonding interface. In some embodiments, the air pump 51 can be a molecular pump or a dry pump.

[0034] In one embodiment, Figure 1 As shown, the wafer bonding device further includes an air pump 52, the bearing part 11 is provided with an adsorption hole 111, the first carrier 10 is provided with an exhaust channel 101 inside, and the exhaust channel 101 is connected to the adsorption hole 111 and the air pump 52 respectively. The first wafer 201 is moved into the bonding chamber 40 by the clamping device outside the wafer bonding device, and after pre-alignment, the first wafer 201 is placed on the bearing part 11, and then the air pump 52 works to extract the air in the exhaust channel 101, so that the adsorption hole 111 generates an adsorption force on the first wafer 201, thereby fixing the first wafer 201 on the bearing part 11, avoiding the position of the first wafer 201 from being offset by the clamping device in the process of releasing the wafer or moving out of the bonding chamber, which is conducive to making the limiting part 12 fall accurately into the alignment opening 203 of the first wafer 201. During the alignment of the two wafers 200, the air pump 52 releases the first wafer 201, so that the first wafer 201 can rotate under the drive of the alignment portion 13. The purpose of pre-aligning the first wafer 201 is to align the stopper 12 with the alignment opening 203 of the first wafer 201, so that the stopper 12 can enter the alignment opening 203 of the first wafer 201.

[0035] In one embodiment, Figure 1 and Figure 2 As shown, the wafer separation device 100 further includes a wafer separation member 60, and the driving assembly 30 further includes a fourth driving unit. The fourth driving unit is configured to: after the first wafer 201 is placed on the carrying portion 11, drive the wafer separation member 60 to extend to the side of the first wafer 201 away from the first stage 10, and after the second wafer 202 is placed on the side of the wafer separation member 60 away from the carrying portion 11, drive the wafer separation member 60 to move to the side of the wafer 200 to make the two wafers contact.

[0036] Before wafer bonding, the wafer separator 60 extends between the first wafer 201 and the second wafer 202 to prevent the surfaces of the two wafers from sticking together. When the bonding chamber 40 is evacuated, the wafer separator 60 can separate the first wafer 201 and the second wafer 202 by a certain distance, so that the air pump 51 can completely extract the air between the two wafers, thereby preventing bubbles from existing between the first wafer 201 and the second wafer 202 and affecting the bonding quality of the wafers.

[0037] In one embodiment, Figure 1 As shown, after the first wafer 201 is placed on the carrying portion 11, or the wafer separator 60 is extended to the side of the first wafer 201 away from the first stage 10, the clamping device moves the second wafer 202 into the bonding chamber 40, and after pre-alignment, the second wafer 202 is placed above the first wafer 201 or the wafer separator 60. The purpose of pre-aligning the second wafer 202 is to align the stopper 12 with the alignment opening 203 of the second wafer 202 and enter the alignment opening 203 of the second wafer 202.

[0038] In one embodiment, Figure 1 and Figure 2 As shown, the bearing portion 11 is provided with a receiving groove, and the driving assembly 30 further includes a third driving portion, and the third driving portion is used to drive the limiting portion 12 to move in the vertical direction so that the limiting portion 12 switches between the first state and the second state. When the limiting portion 12 is in the first state, the limiting portion 12 enters the receiving groove, and when the limiting portion 12 is in the second state, the limiting portion 12 is exposed from the receiving groove. When the wafer 200 needs to be placed on the bearing portion 11, the limiting portion 12 is controlled to switch to the second state; Figure 2 and Figure 3 As shown, after the wafer 200 is placed on the carrier 11, the limiting portion 12 is located in the alignment opening 203 of the wafer to limit the wafer 200. During the wafer bonding process, the limiting portion 12 is switched back to the first state to avoid collision with the bonding portion 21 and affect the bonding quality.

[0039] In other embodiments, during the wafer bonding process, the limiting portion 12 may not be fully retracted into the accommodating groove, but the extending height of the limiting portion 12 cannot exceed the top surface of the second wafer 202 located above to avoid interference between the limiting portion 12 and the bonding portion 21.

[0040] In one embodiment, the accommodating groove is a groove formed by the side of the bearing portion 11 being recessed toward the keying portion 21 , or the accommodating groove is a through groove penetrating the bearing portion.

[0041] In one embodiment, Figure 3As shown, the limiting portion 12 is a cylindrical structure. During the wafer alignment process, the alignment portion 13 drives the wafer to rotate and align. The cylindrical limiting portion 12 is conducive to the wafer 200 rotating around the limiting portion 12 during the alignment process, thereby reducing the friction between the limiting portion 12 and the wafer.

[0042] In one embodiment, Figure 2 As shown, the alignment portion 13 includes at least two sub-alignment portions 131 arranged at intervals. The alignment portion 13 has a first state and a second state: when the alignment portion 13 is in the first state, the distance between each of the sub-alignment portions 131 and the carrying portion 11 is smaller than the distance between each of the sub-alignment portions 131 and the carrying portion 11 when the alignment portion 13 is in the second state. The first driving portion 31 is used to drive each of the sub-alignment portions 131 to move so that the alignment portion 131 switches between the first state and the second state. When the alignment portion 13 is in the first state, each of the sub-alignment portions 131 abuts against the edge of the wafer 200.

[0043] Before the wafer 200 is placed on the carrying part 11, the first driving part 31 drives each sub-alignment part 131 away from the carrying part 11, so that the alignment part 13 switches to the second state. At this time, there is a large space between each sub-alignment part 131 and the carrying part 11, which is convenient for moving the wafer 200 above the carrying part 11 to avoid the wafer 200 colliding with the alignment part 13 during the placement process. After the wafer 200 is placed on the carrying part 11, the first driving part 31 drives each sub-alignment part 131 to move in the direction close to the carrying part 11 until the alignment part 13 is in the first state. At this time, each sub-alignment part 131 abuts against the edge of the wafer 200, thereby driving the wafer 200 to rotate around the limiting part 12 to achieve alignment of the edges of the two wafers 200.

[0044] In one embodiment, Figure 1 As shown, the second carrier 20 includes a bonding portion 21, and the orthographic projection of the bonding portion 21 on the plane where the top surface of the bearing portion 11 is located falls on the top surface of the bearing portion 11. That is, when the alignment portion 13 is in the first state and the second state, the orthographic projection of the bonding portion 21 on the plane where the top surface of the bearing portion 11 is located does not overlap with the alignment portion 13. During the wafer bonding process, the second driving portion 32 drives the first carrier 10 or the second carrier 20 to move toward the other carrier, so that the bonding portion 21 moves toward the bearing portion 11 until it contacts the wafer 200 and then applies pressure to the wafer, thereby completing the wafer bonding. Through the above arrangement, it is possible to prevent the bonding portion 21 from contacting the alignment portion 13 located on the side of the bearing portion 11 during the movement, thereby avoiding damage to the equipment.

[0045] In one embodiment, Figure 2As shown, the line connecting the orthographic projection of the center of the limiting portion 12 on the top surface of the bearing portion 11 and the center of the top surface of the bearing portion 11 is a first straight line L1, and the straight line passing through the center of the top surface of the bearing portion 11 and perpendicular to the first straight line L1 is a second straight line L2, and at least one of the sub-alignment portions 131 is located on the side of the second straight line L2 away from the limiting portion 12.

[0046] By arranging at least one sub-alignment portion 131 on the side of the second straight line away from the limiting portion 12, the force exerted by the sub-alignment portion 131 on the side of the second straight line away from the limiting portion 12 on the wafer 200 can make the alignment opening 203 of the wafer 200 close to the second straight line abut against the limiting portion 12, so that the overlapping area of ​​the positive projection of the alignment openings 203 of the two wafers on the top surface of the supporting portion 11 can be larger, which helps to improve the alignment accuracy of the wafer.

[0047] In one embodiment, the width of the end of the alignment opening 203 of the wafer 200 close to the second straight line L2 is smaller than the width of the end away from the second straight line L2, and the width of the end close to the second straight line L2 is smaller than or equal to the width of the limiting portion 12. In this way, during the wafer alignment process, the force applied to the wafer by the sub-alignment portion 131 located on the side of the second straight line L2 away from the limiting portion 12 can make both sides of the width of the ends of the two wafers close to the second straight line L2 contact the limiting portion 12, and then the orthographic projections of the alignment openings of the two wafers 200 on the top surface of the carrying portion 11 are substantially completely overlapped, effectively ensuring the alignment accuracy of the wafers.

[0048] In one embodiment, Figure 2 As shown, the alignment portion 13 includes two sub-alignment portions 131, and the two sub-alignment portions 131 are both located on the side of the second straight line L2 away from the limiting portion 12, and the two sub-alignment portions 131 are symmetrical about the first straight line L1. In this way, the arrangement of the sub-alignment portions 131 is simple, which facilitates the contact between the limiting portion 12 and the end of the alignment opening 203 of the wafer close to the second straight line L2.

[0049] Specifically, during the wafer alignment process, the limiting portion 12 is simultaneously located at the alignment openings 203 of the two wafers 200 to prevent the positions of the alignment openings 203 of the two wafers from being offset, and the limiting portion 12 can abut against the side walls of the alignment openings 203 to limit the translation of the two wafers 200 on the supporting portion 11. The two sub-alignment portions 131 act on the wafers on both sides of the wafers respectively to drive the wafers 200 to rotate around the limiting portion 12 to align the edges of the two wafers 200. After the wafers are aligned, the combined force applied by the two sub-alignment portions 131 to the wafers is along the first straight line L1, and the forces on the opposite sides of the limiting portion 12 are always substantially the same, which helps to prevent the limiting portion 12 from being deformed.

[0050] In one embodiment, Figure 2 and Figure 4 As shown, the first driving part 31 includes a sub-driving part 311 corresponding to each of the sub-aligning parts 131, and the sub-driving part 311 includes a motor and a guide rail, and the guide rail is arranged outside the carrying part 11, and each of the motors is used to drive the corresponding sub-aligning part 131 to move along the guide rail. The sub-aligning part 131 moves toward or away from the carrying part 11 along the guide rail to realize the switching of the aligning part 131 between the first state and the second state. The sub-aligning part 131 can be precisely controlled by the cooperation of the guide rail and the motor, and the control process is simple and the implementation difficulty is low.

[0051] In one embodiment, the first driving unit 31 further includes a controller, and the controller is used to detect the working current of the motor. When the working current is less than or equal to a preset current, the controller controls the first driving unit to drive the sub-alignment unit to move; when the working current is greater than the preset current, the controller controls the first driving unit to stop working. By comparing the working current with the preset current, it is determined whether the first driving unit 31 needs to continue to drive the sub-alignment unit 131, so as to avoid the sub-alignment unit 131 continuously applying a large force to the wafer 200, thereby damaging the wafer.

[0052] Specifically, when the sub-alignment portion 131 is not in contact with the edge of the wafer 200, the working current of the motor is relatively small. When the sub-alignment portion 131 is in the first state, the sub-alignment portion 131 is in contact with the edge of the wafer 200, and the working current of the motor gradually increases to drive the wafer 200 to rotate. After the edges of the two wafers 200 are aligned, the sub-alignment portion 131 can no longer drive the wafers to move, and the working current of the motor suddenly increases to be greater than the preset current. At this time, the controller controls the motor to stop working.

[0053] In one embodiment, Figure 1 As shown, during the wafer bonding process, the alignment portion 13 is kept against the edge of the wafer 200 to limit the wafer 200 and prevent the wafer 200 from being displaced due to the movement of the carrier or the wafer 200 from being offset when the bonding portion 21 applies pressure to the wafer 200 .

[0054] In one embodiment, Figure 1 As shown, the first stage includes a carrier plate 102, the carrying portion 11 is a portion of the carrier plate 102, and the alignment portion 13 and the wafer separation element 60 are disposed on the carrier plate 102. In other embodiments, the carrying portion 11 can be used as a carrier plate.

[0055] refer to Figure 1 and Figure 2When the second driving unit 32 is only drivingly connected to the second stage 20, the process of implementing wafer alignment and bonding using the wafer bonding apparatus provided in the embodiment of the present application is as follows:

[0056] First, the third driving unit drives the limiting portion 12 to extend out of the receiving groove, and after the clamping device clamps the first wafer 201 for pre-alignment, the first wafer 201 is placed on the carrying portion 11, so that the limiting portion 12 is located in the alignment opening 203 of the first wafer 201;

[0057] Afterwards, the air pump 52 evacuates the exhaust channel 101 , and the suction holes 111 generate suction force on the first wafer 201 , thereby fixing the first wafer 201 on the carrier 11 ;

[0058] Afterwards, the fourth driving unit drives the wafer separation member 60 to extend above the first wafer 201, and after the clamping device pre-aligns the second wafer 202, the second wafer 202 is placed on the wafer separation member 60, so that the limiting portion 12 is simultaneously located at the alignment opening 203 of the second wafer 202;

[0059] Afterwards, the air pump 52 releases the vacuum, and the first driving part 31 drives the alignment part 13 to move from the second state to the first state, and the alignment part 13 abuts against the edge of the wafer 200 to push the wafer 200 for alignment. When the controller detects that the motor working current is greater than the preset current, the controller controls the motor to stop driving the alignment part 13.

[0060] Afterwards, the fourth driving unit drives the wafer separator 60 to withdraw from between the two wafers, the second driving unit 32 drives the second stage 20 to move toward the first stage 10, and the bonding unit 21 applies pressure to the wafer on the supporting unit 11 to bond the two wafers.

[0061] It should be noted that the technical solutions or technical features described in the above embodiments can be combined or supplemented with each other without causing conflicts. The scope of protection of this application is not limited to the precise structures described in the above embodiments and shown in the drawings; all modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of this application should be included in the scope of protection of this application.

Claims

1. A wafer bonding device, characterized in that: The wafer bonding device comprises a bonding chamber and a first carrier, a second carrier and a driving assembly located in the bonding chamber; The first carrier and the second carrier are arranged opposite to each other; the first carrier comprises a carrying portion, a limiting portion arranged on the carrying portion, and an alignment portion located on a side of the carrying portion; the carrying portion is used to carry wafers; the limiting portion is used to enter an alignment opening of two wafers carried by the carrying portion to limit the two wafers; The driving assembly includes a first driving part, and the first driving part is used to drive the alignment part to move in a horizontal direction, so that the alignment part drives the two wafers carried by the carrying part to move and align; The driving assembly further includes a second driving unit, and the second driving unit is used to drive the first carrier and / or the second carrier to move so as to bond two wafers between the carrier and the second carrier.

2. The wafer bonding device according to claim 1, characterized in that: The bearing part is provided with a receiving groove; the driving assembly also includes a third driving part, and the third driving part is used to drive the limiting part to move in the vertical direction so that the limiting part switches between the first state and the second state; when the limiting part is in the first state, the limiting part enters the receiving groove; when the limiting part is in the second state, the limiting part exposes the receiving groove.

3. The wafer bonding device according to claim 1, characterized in that: The alignment portion comprises at least two sub-alignment portions arranged at intervals; the alignment portion has a first state and a second state; when the alignment portion is in the first state, the distance between each of the sub-alignment portions and the bearing portion is smaller than the distance between each of the sub-alignment portions and the bearing portion when the alignment portion is in the second state; The first driving part is used to drive each of the sub-aligning parts to move, so that the aligning part switches between the first state and the second state.

4. The wafer bonding device according to claim 3, characterized in that: The line connecting the orthographic projection of the center of the limiting portion on the top surface of the bearing portion and the center of the top surface of the bearing portion is a first straight line, and the straight line passing through the center of the top surface of the bearing portion and perpendicular to the first straight line is a second straight line; at least one of the sub-alignment portions is located on the side of the second straight line away from the limiting portion.

5. The wafer bonding device according to claim 4, characterized in that: The alignment portion includes two sub-alignment portions, the two sub-alignment portions are both located on a side of the second straight line away from the limiting portion, and the two sub-alignment portions are symmetrical with respect to the first straight line.

6. The wafer bonding device according to claim 3, characterized in that: The first driving part includes a sub-driving part corresponding to each of the sub-aligning parts, and the sub-driving part includes a motor and a guide rail. The guide rail is arranged outside the bearing part, and each of the motors is used to drive the corresponding sub-aligning part to move along the guide rail.

7. The wafer bonding device according to claim 6, characterized in that: The first driving unit also includes a controller, which is used to obtain the working current of the motor. When the working current is less than or equal to a preset current, the controller controls the first driving unit to drive the sub-alignment unit to move; when the working current is greater than the preset current, the controller controls the first driving unit to stop working.

8. The wafer bonding device according to claim 1, characterized in that: The wafer separation device also includes a wafer separation component, and the driving assembly also includes a fourth driving unit; the fourth driving unit is configured to: after the first wafer is placed on the supporting unit, drive the wafer separation component to extend to the side of the first wafer away from the first carrier; after the second wafer is placed on the side of the wafer separation component away from the supporting unit, drive the wafer separation component to move to the side of the wafer to make the two wafers contact.

9. The wafer bonding device according to claim 1, characterized in that: The wafer bonding device also includes an air pump; the carrying part is provided with an adsorption hole; an exhaust channel is provided inside the first carrier, and the exhaust channel is respectively connected to the adsorption hole and the air pump.

10. The wafer bonding device according to claim 1, characterized in that: The second carrier includes a bonding portion, and an orthographic projection of the bonding portion on a plane where the top surface of the bearing portion is located falls on the top surface of the bearing portion.

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