Electronic device, heat spreader and preparation method thereof

Abstract

The present application provides an electronic device, a heat spreader and a method for making the same; the method for making the heat spreader includes: providing a first cover plate and a second cover plate; forming an array of recessed pit structures on one side surface of the first cover plate; placing a metal wire mesh with a woven structure between the surface of the first cover plate forming the recessed pit structure and the second cover plate; sealing the edges of the first cover plate and the second cover plate to form a storage cavity for a heat-conducting medium; filling the storage cavity with a heat-conducting medium and sealing it. The method for making the heat spreader provided in the embodiment of the present application, by providing a recessed pit structure on the surface of the cover plate bonded to the metal wire mesh, microscopically compensates for the deterioration of capillary performance caused by the reduction of the meniscus structure between the plate meshes. In this way, more steam circulation space can be obtained in the structural stacking without deteriorating the capillary performance, thereby reducing the resistance to vapor-liquid circulation and improving the monomer performance of VC.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation structures of electronic equipment, and in particular to an electronic equipment, a heat spreader and a preparation method thereof. Background Art

[0002] As electronic products have more and more functions and higher power, the heat generation of products is becoming more and more serious. VC (vapor chamber) temperature equalization board has capillary structure and cooling medium inside. When the coolant changes phase, it will absorb or release the latent heat of phase change, so the heat from the heat source can be moved to a relatively low temperature position. It is currently an ideal solution to solve the heat dissipation problem of various electronic products.

[0003] The heat spreader in the prior art generally has a structure in which a liquid containing cavity is formed between two metal plates. The heat spreader has limited heat dissipation performance and can no longer meet the heat dissipation requirements of electronic equipment. Summary of the invention

[0004] A first aspect of an embodiment of the present application provides a method for preparing a vapor chamber, the method comprising:

[0005] Providing a first cover plate and a second cover plate;

[0006] An array of distributed pit structures is formed on a side surface of the first cover plate;

[0007] Placing a metal wire mesh of a woven structure between the surface of the first cover plate forming the pit structure and the second cover plate;

[0008] Sealing the edges of the first cover plate and the second cover plate to form a storage cavity for the heat-conducting medium;

[0009] The storage cavity is filled with a heat-conducting medium and sealed.

[0010] In a second aspect, an embodiment of the present application provides a heat spreader, which includes a first cover plate, a second cover plate, and a metal mesh sealed between the first cover plate and the second cover plate; wherein the inner surface of the first cover plate that is attached to the metal mesh is provided with a pit structure.

[0011] In a third aspect, an embodiment of the present application provides an electronic device, which includes a heating device and the heat sink described in the above embodiment, wherein the heating device is in contact with an outer surface of the heat sink.

[0012] The preparation method of the heat spreader provided in the embodiment of the present application, by setting a pit structure on the surface of the cover plate bonded to the metal wire mesh, microscopically compensates for the deterioration of capillary performance caused by the reduction of the meniscus structure between the plate meshes. In this way, more steam circulation space can be obtained in the structural stacking without deteriorating the capillary performance, thereby reducing the vapor-liquid circulation resistance and improving the monomer performance of VC. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0014] Figure 1 It is a schematic diagram of the structure of the metal wire mesh and the cover plate on one side;

[0015] Figure 2 It is a schematic diagram of the structure of the metal wire and the cover plate;

[0016] Figure 3 It is a schematic diagram of the structure in which the flattened metal wire cooperates with the cover plate;

[0017] Figure 4 It is a schematic flow chart of an embodiment of a method for preparing a vapor chamber of the present application;

[0018] Figure 5 It is a schematic diagram of the structure of the first cover plate and the second cover plate in the embodiment of the present invention;

[0019] Figure 6 is a schematic diagram of a structure in which a metal wire mesh of a woven structure is placed between a first cover plate and a second cover plate;

[0020] Figure 7 This is a schematic structural diagram of an embodiment of a vapor chamber of the present application;

[0021] Figure 8 yes Figure 7 A schematic cross-sectional view of the structure of the vapor chamber along AA in the embodiment;

[0022] Fig. 9 is an enlarged schematic diagram of the microscopic cooperation between the metal wires in the metal wire mesh and the first cover plate in the embodiment of the present application;

[0023] Fig.10 It is a schematic flow chart of another embodiment of the method for preparing a vapor chamber of the present application;

[0024] Fig.11 is an enlarged schematic diagram of the microscopic cooperation between the metal wires in the flattened metal wire mesh and the first cover plate in the embodiment of the present application;

[0025] Fig.12 It is a structural schematic diagram of an embodiment of the electronic device of the present application;

[0026] Fig.13 yes Fig.12 A schematic cross-sectional view of the structure of the electronic device at position BB in the embodiment;

[0027] Fig.14 It is a schematic diagram of the structural composition block diagram of an embodiment of the electronic device of the present application. DETAILED DESCRIPTION

[0028] The present application is further described in detail below in conjunction with the accompanying drawings and examples. It is particularly noted that the following examples are only used to illustrate the present application, but are not intended to limit the scope of the present application. Similarly, the following examples are only some embodiments of the present application rather than all embodiments, and all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0029] The terms "first", "second", and "third" in the embodiments of the present application are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first", "second", and "third" can expressly or implicitly include at least one of the features. In the description of the present application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In the embodiments of the present application, all directional indications (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication also changes accordingly. The terms "including" and "having" in the embodiments of the present application and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but optionally also includes steps or units that are not listed, or optionally also includes other steps or components inherent to these processes, methods, products, or devices.

[0030] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0031] As used herein, "electronic devices" (or simply "terminals") include, but are not limited to, devices configured to receive / send communication signals via a wireline connection (e.g., via a public switched telephone network (PSTN), a digital subscriber line (DSL), a digital cable, a direct cable connection, and / or another data connection / network) and / or via a wireless interface (e.g., for a cellular network, a wireless local area network (WLAN), a digital television network such as a DVB-H network, a satellite network, an AM-FM broadcast transmitter, and / or another communication terminal). Communication terminals configured to communicate via a wireless interface may be referred to as "wireless communication terminals", "wireless terminals" or "mobile terminals". Examples of mobile terminals include, but are not limited to, satellite or cellular phones; personal communication system (PCS) terminals that may combine cellular radiotelephones with data processing, fax, and data communication capabilities; PDAs that may include radiotelephones, pagers, Internet / intranet access, web browsers, organizers, calendars, and / or global positioning system (GPS) receivers; and conventional laptop and / or palmtop receivers or other electronic devices that include radiotelephone transceivers. A mobile phone is an electronic device equipped with a cellular communication module.

[0032] With the continuous improvement of the performance of key components of smart terminals, the power consumption of smart terminals in 5G scenarios continues to grow. Ultra-thin VC has become a must-have heat dissipation device for the thermal management of mid-to-high-end 5G smart terminal equipment with its ultra-high thermal conductivity (equivalent thermal conductivity>3000W / mK). The inner wall of the VC is provided with a capillary structure, which stores liquid working fluid inside. When heat is transferred from the heat source to the VC, the liquid working fluid stored in the capillary structure absorbs heat and vaporizes and flows to the cold end. The hot steam condenses at the cold end to release heat, and then returns from the cold end to the hot end through the capillary structure, and so on, to achieve a uniform temperature effect. For the design of conventional ultra-thin VC, metal (such as copper, stainless steel, etc.) woven wire mesh has become the designer's preferred capillary structure due to its low cost and excellent capillary performance. The metal wire mesh is generally woven from stretched metal wire with a circular cross-section.

[0033] See also Figure 1 , Figure 1 It is a structural schematic diagram of the cooperation between the metal wire mesh and one side cover plate. From the microstructural point of view, the capillary driving force for the liquid working fluid transport during the VC operation is generated from the meniscus structure (the area marked with arrow 101a in the figure) formed inside the circular metal wire mesh and between it and the fitted cover plate 101b. The area marked with arrow 101c in the figure represents the metal wire.

[0034] In order to meet the requirements of thin design of electronic equipment, the heat spreader needs to be made thinner. Generally, the metal mesh is thinned (because the thickness of the cover plate is close to the limit of the material, and the thickness that can be thinned is limited), such as using thinner metal wire to weave the metal mesh or flattening the metal (wire) mesh. Please refer to Figure 2 and Figure 3 , Figure 2 This is a schematic diagram of the structure of the metal wire and the cover plate. Figure 3 Whether using finer wires to weave the metal mesh or flattening the metal (wire) mesh, the meniscus structure (the area marked with arrows 101a in the figure) formed between the wire 101c and the fitted cover plate 101b will become smaller, thereby affecting the capillary driving force for the transport of the liquid working fluid and reducing the heat conduction efficiency.

[0035] In view of this, the present application provides a method for preparing a vapor chamber, please refer to Figure 4 , Figure 4 It is a flow chart of an embodiment of a method for preparing a vapor chamber of the present application. It should be noted that the vapor chamber of the present application can be used for heat dissipation of electronic devices, and the electronic devices may include mobile phones, tablet computers, laptop computers, wearable devices, etc. The preparation method includes but is not limited to the following steps.

[0036] Step S100: providing a first cover plate and a second cover plate.

[0037] The first cover plate and the second cover plate in this embodiment may be made of stainless steel, aluminum alloy, copper alloy or the like, and the thickness of the first cover plate and the second cover plate may be 0.02-0.1 mm.

[0038] Step S200: forming an array of recessed pit structures on a surface of one side of a first cover plate.

[0039] See also Figure 5 , Figure 5 1 is a schematic diagram of the structure of the first cover plate and the second cover plate in the embodiment, wherein a side surface (inner surface, i.e., the surface attached to the metal mesh) of the first cover plate 110 forms an array of distributed pit structures 1100, and the pit structure 1100 can be formed by stamping. The depth of the pits in the pit structure 1100 can be 0.005-0.02 mm, and the spacing between adjacent pits is 0.01-0.1 mm.

[0040] In addition, a plurality of support columns 121 are formed on one side surface (inner surface, i.e., the surface in contact with the metal mesh) of the second cover plate 120 in the present embodiment. The plurality of support columns 121 may be formed by integral stamping, integral etching, or integral injection molding with the second cover plate 120. No specific limitation is made here. The plurality of support columns 121 are used to support and fix the metal mesh.

[0041] Please continue reading Figure 4 The preparation method in this embodiment further includes step S300, placing a metal wire mesh with a woven structure between the surface of the first cover plate forming the pit structure and the second cover plate.

[0042] See also Figure 6 , Figure 6 The schematic diagram is a structure diagram of a metal wire mesh of a woven structure placed between a first cover plate and a second cover plate, and the metal wire mesh of the woven structure is indicated by 130. The mesh number of the metal wire mesh 130 of the woven structure is 100-500, and the mesh number can be 100, 200, 250, 400, 500, etc.

[0043] Please continue reading Figure 4 The preparation method in this embodiment further includes step S400, sealing the edges of the first cover plate and the second cover plate to form a storage cavity for the heat-conducting medium.

[0044] The edge sealing method of the first cover plate and the second cover plate may be welding or hot pressing, etc., which is not specifically limited here.

[0045] Step S500: filling the storage cavity with a heat-conducting medium and sealing it.

[0046] Please also read Figure 7 and Figure 8 , Figure 7 is a schematic structural diagram of an embodiment of a heat spreader of the present application, Figure 8 yes Figure 7 The schematic cross-sectional view of the structure of the vapor chamber along AA in the embodiment, wherein the heat conducting medium may be filled into the storage cavity 1001 through the reserved opening 102 at the side of the vapor chamber 100, and then the reserved opening 102 is sealed. The heat conducting medium is a liquid heat dissipation medium, such as water or oil, etc., which is not specifically limited here.

[0047] See also Fig. 9 , Fig. 9It is an enlarged schematic diagram of the microscopic coordination between the metal wire in the metal wire mesh and the first cover plate in the embodiment of the present application. The metal wire is indicated by 131 in the figure. In order to avoid the deterioration of the capillary performance of the wire mesh caused by the reduction of the meniscus structure 101 of the heat-conducting medium formed between the metal wire 131 and the surface of the first cover plate 110, the technical solution in the embodiment of the present application forms a "pockmark" structure (pit structure 1100) on the surface of the first cover plate 110, thereby increasing the volume of the heat-conducting medium that can be accommodated by the meniscus structure 101 of the metal wire 131 and the first cover plate 110, ensuring that the use of thinner metal wire will not reduce its capillary transport performance, thereby ensuring the heat conduction efficiency.

[0048] The preparation method of the heat spreader provided in the embodiment of the present application, by setting a pit structure on the surface of the cover plate bonded to the metal wire mesh, microscopically compensates for the deterioration of capillary performance caused by the reduction of the meniscus structure between the plate meshes. In this way, more steam circulation space can be obtained in the structural stacking without deteriorating the capillary performance, thereby reducing the vapor-liquid circulation resistance and improving the monomer performance of VC.

[0049] See also Fig.10 , Fig.10 1 is a flow chart of another embodiment of the method for preparing a vapor chamber of the present application. The preparation method in this embodiment includes but is not limited to the following steps.

[0050] Step S100: providing a first cover plate and a second cover plate.

[0051] The first cover plate and the second cover plate in this embodiment may be made of stainless steel, aluminum alloy, copper alloy or the like, and the thickness of the first cover plate and the second cover plate may be 0.02-0.1 mm.

[0052] Step S200: forming an array of recessed pit structures on a surface of one side of a first cover plate.

[0053] Please continue reading Figure 5 , wherein a side surface (inner surface, i.e., the surface attached to the metal mesh) of the first cover plate 110 forms an array of distributed pit structures 1100, and the pit structure 1100 can be formed by stamping. The depth of the pits in the pit structure 1100 can be 0.005-0.02 mm, and the spacing between adjacent pits is 0.01-0.1 mm.

[0054] Different from the above-mentioned embodiment, the preparation method in this embodiment further includes step S600 of flattening the circular cross-section of the metal wire mesh.

[0055] Specifically, the circular cross-section of the metal wire mesh can be pressed into a runway-shaped cross-section, and the thickness of the flattened metal wire mesh is 0.03 to 0.08 mm.

[0056] The preparation method in this embodiment provides an ultra-thin VC design solution based on the composite capillary structure of "punched pits (pit structure) + compressed woven mesh". In the implementation method, the conventional metal woven wire mesh is first reduced in thickness by mechanical compression. Since the metal wire mesh is generally woven from circular cross-section metal wires, its circular cross-section will inevitably be destroyed after the wire mesh is mechanically compressed. Please refer to Fig.11 , Fig.11 1 is an enlarged schematic diagram of the microscopic cooperation between the metal wires in the flattened metal wire mesh and the first cover plate in the embodiment of the present application. Since the metal wires are flattened into a runway-shaped structure, the contact between the metal wires 131 and the first cover plate 110 changes from "line contact" to "surface contact", and the meniscus structure 101 between the metal wires 131 and the first cover plate 110 will be reduced. Fig.11 In order to avoid the deterioration of the capillary performance of the wire mesh caused by the reduction of the meniscus structure 101, the technical solution in the embodiment of the present application creatively forms a "pitted" structure on the first cover plate on which the wire mesh is laid through a stamping process, so that the volume of the heat-conducting medium that can be accommodated by the meniscus structure 101 between the flat wire mesh and the first cover plate can be increased, ensuring that the capillary transport performance will not be reduced after the wire mesh is compressed, thereby ensuring the heat conduction efficiency.

[0057] Please continue reading Fig.10 The preparation method in this embodiment further includes step S300, placing a metal wire mesh with a woven structure between the surface of the first cover plate forming the pit structure and the second cover plate.

[0058] Please continue Figure 6 , wherein the mesh number of the metal wire mesh 130 of the woven structure in this embodiment is 100-500, and the mesh number can specifically be 100, 200, 250, 400, 500 and the like.

[0059] Please continue reading Fig.10 The preparation method in this embodiment further includes step S400, sealing the edges of the first cover plate and the second cover plate to form a storage cavity for the heat-conducting medium.

[0060] The edge sealing method of the first cover plate and the second cover plate may be welding or hot pressing, etc., which is not specifically limited here.

[0061] Step S500: filling the storage cavity with a heat-conducting medium and sealing it.

[0062] You can continue to read Figure 7 and Figure 8 , wherein the heat conducting medium may be filled into the storage cavity 1001 through the reserved opening 102, and then the reserved opening 102 is sealed. The heat conducting medium is a liquid heat dissipation medium, such as water or oil, etc., which is not specifically limited here.

[0063] In a specific embodiment, the overall thickness of the heat spreader is 0.30mm, and the cover plate is made of stainless steel. The first cover plate and the second cover plate are stamped and formed using a 0.05mm thick stainless steel strip, and a 250-mesh woven stainless steel wire mesh is used as a capillary metal mesh with a thickness of 0.06mm. In terms of design, the steam chamber height of this heat spreader h = 0.3 (overall) - 0.05 (first cover plate) - 0.06mm (middle capillary metal mesh) - 0.05 (second cover plate) = 0.17mm. Using the design concept of this scheme, the 250-mesh stainless steel woven mesh can be compressed from 0.06mm to 0.04mm. Then, through the stamping process, pits with a depth of 0.005 to 0.02mm are formed on the first cover plate where the capillary metal mesh is laid to form a "pockmark" structure. In this embodiment, the steam chamber height of the heat spreader h'=0.3 (whole)-0.05 (first cover)-0.04 (middle capillary wire mesh)-0.05 (second cover)=0.19mm, and the steam chamber height is increased by 0.02mm. Studies have shown that the heat spread performance of ultra-thin VC is proportional to the size of its steam chamber, that is, the larger the size of the steam chamber structure, the smaller the vapor-liquid circulation resistance when the VC is working, and the better the temperature spread performance. Therefore, the technical solution in the embodiment of the present application can effectively improve the steam circulation resistance during the working process of VC and optimize the performance of VC monomers without complex molding processes.

[0064] The heat spreader preparation method in the embodiment of the present application reduces the Z-direction thickness space of the conventional woven capillary metal wire by mechanical compression, thereby making more steam circulation space for the ultra-thin VC ferry in the VC stacking design, and improving the performance of the VC monomer; the cover plate on which the woven mesh is laid realizes a "pockmarked" structure through a stamping process, thereby compensating for the loss of capillary performance caused by the reduction of the meniscus structure between the mesh plates after the woven mesh is flattened, and the conventional woven liquid-absorbing core is reduced in thickness without reducing performance through the composite structure of "pockmarked + flat mesh".

[0065] Furthermore, the present application also provides an electronic device, please refer to Fig.12 and Fig.13 , Fig.12 is a structural diagram of an embodiment of the electronic device of the present application, Fig.13 yes Fig.12 The schematic cross-sectional view of the structure of the electronic device at position BB in the embodiment, the electronic device in this embodiment may include a display screen 30, a housing 10, a control circuit board 20, a middle frame 40 and a heat spreader 100.

[0066] Optionally, the display screen 30 in this embodiment cooperates with the housing 10 (which can be a back cover) and the middle frame 40 to form a receiving cavity 1000, and the control circuit board 20 is arranged in the receiving cavity 1000, and the control circuit board 200 is electrically connected to the display screen 30, and is used to control the display surface (working state) of the display screen 30. Among them, a chip 21 can be provided on the control circuit board 20, and the chip 21 and the display screen 30 can both be heating devices of electronic devices. The heat spreader 100 is bonded to the heating device, and one end of the heat spreader 100 is in contact with the heating device (in this embodiment, the chip 21 is used as an example of a heat source). In order to achieve better results, TIMs material (Thermal Interface Material, a general term for materials used to coat between heat dissipation devices and heating devices to reduce the contact thermal resistance between them) can also be used between the heat source and the heat spreader to enhance the heat transfer to the heat spreader, and the other end of the heat spreader extends to the cold area of ​​the electronic device, such as an area away from the heat source, or is bonded to structural parts such as the middle frame to achieve the purpose of heat dissipation.

[0067] See also Fig.14 , Fig.14 It is a schematic diagram of the structural composition block diagram of an embodiment of an electronic device of the present application. The electronic device can be a mobile phone, a tablet computer, a laptop computer, a wearable device, etc. The mobile phone is used as an example in the diagram of this embodiment. The structure of the electronic device may include an RF circuit 910, a memory 920, an input unit 930, a display unit 940 (which may be the display screen 30 in the above embodiment), a sensor 950, an audio circuit 960, a wifi module 970, a processor 980 (which may be the chip 21 in the above embodiment) and a power supply 990, etc. Among them, the RF circuit 910, the memory 920, the input unit 930, the display unit 940, the sensor 950, the audio circuit 960 and the wifi module 970 are respectively connected to the processor 980; the power supply 990 is used to provide power to the entire electronic device 10.

[0068] Specifically, the RF circuit 910 is used to receive and send signals; the memory 920 is used to store data instruction information; the input unit 930 is used to input information, which may specifically include a touch panel 931 and other input devices 932 such as operation buttons; the display unit 940 may include a display panel 941, etc.; the sensor 950 includes an infrared sensor, a laser sensor, etc., for detecting user approach signals, distance signals, etc.; the speaker 961 and the microphone (or microphone) 962 are connected to the processor 980 through the audio circuit 960 for receiving and sending sound signals; the wifi module 970 is used to receive and transmit wifi signals, and the processor 980 is used to process data information of the electronic device. For the specific structural features of the electronic device, please refer to the relevant description of the above embodiment, which will not be described in detail here.

[0069] The heat spreader structure of the electronic device in this embodiment compensates for the deterioration of capillary performance caused by the reduction of the meniscus structure between the plates and meshes at the microscopic level by setting a pit structure on the surface of the cover plate bonded to the metal wire mesh. In this way, more steam circulation space can be obtained in the structural stacking without deteriorating the capillary performance, thereby reducing the vapor-liquid circulation resistance and improving the single-cell performance of VC.

[0070] The above descriptions are only some embodiments of the present application, and do not limit the protection scope of the present application. Any equivalent device or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A method for preparing a vapor chamber, characterized in that: The preparation method comprises: Providing a first cover plate and a second cover plate; An array of distributed pit structures is formed on a side surface of the first cover plate; Placing a metal wire mesh of a woven structure between the surface of the first cover plate forming the pit structure and the second cover plate; Sealing the edges of the first cover plate and the second cover plate to form a storage cavity for the heat-conducting medium; The storage cavity is filled with a heat-conducting medium and sealed.

2. The preparation method according to claim 1, characterized in that: Before the step of placing the metal wire mesh with a woven structure between the surface of the first cover plate forming the pit structure and the second cover plate, the step also includes: flattening the circular cross-section of the metal wires of the metal wire mesh.

3. The preparation method according to claim 1, characterized in that: In the step of forming the array-distributed pit structures on one side surface of the first cover plate, the pit structures are formed on one side surface of the first cover plate by stamping.

4. The preparation method according to claim 2, characterized in that: The thickness of the flattened wire mesh is 0.03 to 0.08 mm.

5. A heat spreader, characterized in that: The heat spreader includes a first cover plate, a second cover plate, and a metal wire mesh sealed between the first cover plate and the second cover plate; wherein the inner surface of the first cover plate that is attached to the metal wire mesh is provided with a pit structure.

6. The vapor chamber according to claim 5, characterized in that: The depth of the pits in the pit structure is 0.005-0.02 mm.

7. The vapor chamber according to claim 6, characterized in that: The spacing between adjacent pits in the pit structure is 0.01-0.1 mm.

8. The vapor chamber according to claim 5, characterized in that: The mesh number of the metal wire mesh is 100-500.

9. The vapor chamber according to claim 5, characterized in that: The thickness of the metal mesh is 0.03 to 0.08 mm.

10. The vapor chamber according to claim 5, characterized in that: The first cover plate and the second cover plate are both made of stainless steel.

11. The vapor chamber according to claim 10, characterized in that: The thickness of the first cover plate is 0.02-0.1 mm; the thickness of the second cover plate is 0.02-0.1 mm.

12. An electronic device, characterized in that: The electronic device comprises a heating device and the vapor chamber according to any one of claims 5 to 11, wherein the heating device is in contact with an outer surface of the vapor chamber.

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