Flexible heat dissipation device and method with gradient inverse opal nanostructure

Abstract

The invention provides a flexible heat dissipation device and method with a gradient inverse opal nanostructure, relates to the field of heat dissipation of flexible electronic devices, and aims to solve the problem that a heat dissipation cooling structure in a current flexible electronic device is difficult to fit with a device distribution form. The flexible heat dissipation system has the advantage of flow uniformity, modular connection combination can be achieved according to the specific array form and arrangement space of the flexible electronic device effect elements, the integrated flexible heat dissipation system is formed, the nanometer circulation driving force of the gradient inverse opal nanometer structure and the efficient heat dissipation capacity of the flexible manifold microchannel are organically utilized, and the heat dissipation efficiency is improved. Therefore, a universal thermal management technical scheme is provided for efficient heat dissipation of flexible electronic devices of different types and forms.

Description

Technical Field

[0001] The present invention relates to the field of heat dissipation of flexible electronic devices, and in particular to a flexible heat dissipation device and method having a gradient inverse opal nanostructure. Background Art

[0002] With the innovative development of microelectronics technology, flexible electronic devices such as wearable devices, smart medical treatment, and electronic skin have shown broad application prospects. With their unique flexibility, deformability, and ability to fit various complex shapes, they have attracted much attention in many high-tech fields such as consumer electronics, medical health, and smart sensing. However, flexible electronic devices usually need to integrate many functional components in a compact space. The heat generated by their integrated circuits and functional components during high-power operation is difficult to dissipate effectively. In addition, the special flexible structure of flexible electronic devices imposes strict restrictions on the heat dissipation space and heat dissipation methods, making the thermal management problem of flexible electronic devices a key bottleneck restricting device performance and operational reliability.

[0003] Heat dissipation of traditional electronic devices is usually achieved through rigid heat dissipation devices such as heat pipes and temperature equalizers. However, for flexible electronic devices, these rigid heat dissipation devices made of metal and other materials have the intrinsic defect of being unable to bend or stretch, which greatly limits their flexible application on the variable curvature surfaces where flexible electronic devices work. In addition, the functional elements in flexible electronic devices usually have a variety of array forms, and the currently commonly used heat dissipation structure cannot flexibly form an overall heat dissipation circulation system according to the device array form, resulting in difficulty in achieving a good fit between the heat dissipation structure and the various array forms of the functional elements, a relatively complex heat dissipation system, and a relatively inefficient cooling effect. Summary of the invention

[0004] The purpose of the present invention is to address the defects of the prior art and provide a flexible heat dissipation device and method with a gradient inverse opal nanostructure, which can realize modular connection and combination according to the specific array form and layout space of the functional elements of the flexible electronic device to form an integrated flexible heat dissipation system, and organically utilize the nano-circulation driving force of the gradient inverse opal nanostructure and the efficient heat dissipation capability of the flexible manifold microchannel, thereby providing a universal thermal management technology solution for efficient heat dissipation of flexible electronic devices of different types and forms.

[0005] The first object of the present invention is to provide a flexible heat dissipation device having a gradient inverse opal nanostructure, using the following scheme:

[0006] The flexible unit comprises at least one honeycomb-shaped flexible unit, wherein the flexible unit comprises a microchannel portion, a manifold layer portion and a packaging cover plate portion which are sequentially stacked in an axial direction;

[0007] A flow dividing loop, an inlet manifold and an outlet manifold are arranged inside the manifold layer part. The flow dividing loop is distributed circumferentially along the edge of the manifold layer part. The inlet manifold is connected to the flow dividing loop, and the outlet manifold is connected to the collecting cavity in the center of the manifold layer part. Multiple inlet manifolds and multiple outlet manifolds are alternately arranged in sequence around the circumference of the manifold layer part.

[0008] The microchannel part is provided with a plurality of annular microchannels spaced apart along the radial direction thereof; the inlet manifold is connected to the outlet manifold through the annular microchannel, and the annular microchannel is provided with a gradient inverse opal nanostructure at the connecting position;

[0009] The packaging cover plate part is provided with a working medium outflow outlet connected to the collecting cavity, and the circumferential side wall of the manifold layer part is provided with a cooling working medium inlet connected to the diversion loop.

[0010] Furthermore, the flow distribution loop is hexagonal for the flow of cooling medium, the inlet manifold and the outlet manifold extend radially of the manifold layer respectively, one radial end of the inlet manifold is connected to the flow distribution loop, and one radial end of the outlet manifold is connected to the collecting chamber.

[0011] Furthermore, the inlet manifold forms a tapered flow channel structure along the radial direction of the manifold layer portion, and the width of the inlet manifold gradually decreases in the radial direction close to the axis of the manifold layer portion.

[0012] Further, along the axial direction of the manifold layer portion, one end of the inlet manifold and the outlet manifold abuts against the microchannel portion and communicates with the annular microchannel, and the other end is blocked by the packaging cover plate portion.

[0013] Furthermore, the annular microchannels on the microchannel portion are concentrically distributed, and the annular microchannels are hexagonal.

[0014] Furthermore, a chamber is provided at the center of the microchannel portion, and the chamber is connected to the collecting chamber.

[0015] Furthermore, in the annular microchannel, a first porous inverse opal nanostructure and a second porous inverse opal nanostructure are sequentially arranged in a direction from the inlet manifold to the outlet manifold, and the pore size of the first porous inverse opal nanostructure is smaller than the pore size of the second porous inverse opal nanostructure.

[0016] Furthermore, when there are multiple flexible units, the sides of adjacent flexible units are abutted, and the cooling medium inlets distributed on the abutting sides are connected, and the multiple flexible units are assembled to form a flexible module for heat dissipation.

[0017] The second object of the present invention is to provide a working method of the flexible heat dissipation device having a gradient inverse opal nanostructure as described in the first object, comprising:

[0018] The microchannel part of the flexible unit is arranged on the heat-generating surface, and the cooling medium flows in from the cooling medium inlet of the manifold layer;

[0019] After being split by the split flow loop, the cooling medium enters multiple inlet manifolds, flows downward and impacts the microchannel layer, cooling the heat-generating surface;

[0020] The gradient inverse opal nanostructure at the microchannel layer can provide capillary force and nanoporous channels to form a rehydration nanocirculation. Under the action of pressure difference, the cooling medium after heat exchange flows out of the microchannel layer, flows to the outlet manifold and collects in the collection chamber.

[0021] The working fluid flows out through the outlet and then completes the heat exchange cycle.

[0022] Furthermore, when multiple flexible units are spliced ​​for use, the side surfaces of adjacent flexible units are abutted, and the cooling medium inlets distributed on the abutting side surfaces are connected, so that the cooling medium enters the multiple flexible units.

[0023] Compared with the prior art, the present invention has the following advantages and positive effects:

[0024] (1) In view of the problem that the heat dissipation and cooling structure in the current flexible electronic devices is difficult to fit the device distribution form, the microchannel part, the manifold layer part and the packaging cover part are all hexagonal, which has the advantage of flow uniformity. Compared with the rectangular loop, the hexagonal loop can reduce the flow dead zone and the generation of eddy currents, making the distribution of the fluid in the channel more uniform, thereby improving the heat transfer efficiency and reducing the pressure drop; it has the advantage of heat dissipation unit integration. Compared with the circular loop, the hexagonal loop can realize the seamless and tight arrangement of the heat dissipation unit, providing a higher channel density to increase the heat transfer and mass transfer capacity of the system; the honeycomb design of the hexagonal structure has good mechanical stability, can withstand high internal and external pressures and has the advantage of flexibility; it can realize modular connection and combination according to the specific array form and layout space of the functional elements of the flexible electronic device to form an integrated flexible heat dissipation system, and organically utilize the gradient inverse opal nanostructure nanocirculation driving force and the flexible manifold microchannel efficient heat dissipation capacity, thereby providing a universal thermal management technology solution for efficient heat dissipation of flexible electronic devices of different types and forms.

[0025] (2) It has a multi-level gradient three-dimensional interconnected porous inverse opal nanostructure. On the one hand, it takes advantage of the small pore structure with strong capillary driving characteristics to effectively promote the rapid transport and transfer of fluids in a small space; on the other hand, it takes advantage of the large pore area to give full play to the seepage characteristics of the gas-liquid two-phase working fluid, so that the gas-liquid two-phase can efficiently penetrate and diffuse in it, thereby realizing the high circulation power of the nanoscale three-dimensional heat dissipation structure fluid, promoting the circulation and fluid replenishment of the working fluid, and enhancing the heat and mass circulation characteristics.

[0026] (3) It has an annular flexible manifold microchannel structure, which optimizes the working fluid flow distribution path at the macro scale to achieve uniform distribution and efficient transmission of the fluid; in addition, the manifold microchannel structure layout has the ability of jet impingement cooling, which can provide stronger heat exchange capacity in high heat flux areas; in addition, the flexible design enables it to adapt to application scenarios with complex three-dimensional surfaces, and realize effective thermal management of flexible electronic devices and wearable devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The accompanying drawings in the specification, which constitute a part of the present invention, are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute improper limitations on the present invention.

[0028] Figure 1 Schematic diagram of the overall structure of the flexible heat dissipation device with gradient inverse opal nanostructure in Examples 1 and 2 of the present invention.

[0029] Figure 2 Schematic diagram of the overall structural decomposition of the flexible heat dissipation device with gradient inverse opal nanostructure in Examples 1 and 2 of the present invention.

[0030] Figure 3 Schematic diagram of the cooling medium flow in the manifold layer of the flexible heat dissipation device with gradient inverse opal nanostructure in Examples 1 and 2 of the present invention.

[0031] Figure 4 Schematic diagram of the flow direction of the cooling medium in the microchannel part in Examples 1 and 2 of the present invention.

[0032] Figure 5 Schematic diagram of the flow of cooling medium in the annular microchannel under the action of the gradient inverse opal nanostructure in Examples 1 and 2 of the present invention.

[0033] Figure 6 Schematic diagram of the flow of cooling medium in the plane direction of the flexible heat dissipation device with gradient inverse opal nanostructure in Examples 1 and 2 of the present invention.

[0034] Figure 7 for Figure 6 Schematic diagram of the cross section at AA in the middle.

[0035] Figure 8 It is a schematic diagram of a heat dissipation system formed by splicing multiple flexible units in embodiments 1 and 2 of the present invention.

[0036] Fig. 9 This is a schematic diagram of effectively dissipating heat after a plurality of flexible units in embodiments 1 and 2 of the present invention are spliced ​​and attached to the heating surface of a flexible electronic device.

[0037] Fig.10It is a schematic diagram of the flexibility of a heat dissipation system formed by splicing multiple flexible units in Examples 1 and 2 of the present invention.

[0038] In the figure: 1. packaging cover part, 2. manifold layer part, 3. microchannel part, 11. working fluid outflow outlet, 21. cooling working fluid inlet, 22. hexagonal cooling working fluid diversion loop, 23. inlet manifold, 24. outlet manifold, 25. collecting cavity, 251. through hole, 31. annular microchannel, 32. hexagonal chamber, 33. gradient inverse opal nanostructure.

[0039] 实 The center arrow represents the flow path of the cooling medium, the dashed arrow represents the flow path of the cooling medium after the heat exchange is completed, and ● indicates that the cooling medium flows outward perpendicular to the plane. It means that the cooling medium flows inward perpendicular to the plane. DETAILED DESCRIPTION

[0040] Example 1

[0041] In a typical embodiment of the present invention, Figure 1-Figure 10 As shown, a flexible heat dissipation device with a gradient inverse opal nanostructure is provided.

[0042] The currently commonly used heat dissipation structure cannot flexibly form an overall heat dissipation circulation system according to the device array form, which makes it difficult to fit the heat dissipation structure well with the various array forms of functional elements, the heat dissipation system is relatively complex, and the cooling effect is relatively inefficient. Based on this, the present embodiment provides a flexible heat dissipation device with a gradient inverse opal nanostructure, which can realize modular connection and combination according to the specific array form and layout space of the functional elements of the flexible electronic device to form an integrated flexible heat dissipation system, and organically utilize the nano-circulation driving force of the gradient inverse opal nanostructure and the efficient heat dissipation capability of the flexible manifold microchannel, thereby providing a universal thermal management technology solution for efficient heat dissipation of flexible electronic devices of different types and forms.

[0043] like Figure 1 As shown, the basic unit of the flexible heat dissipation device with gradient inverse opal nanostructure is a flexible unit. A single flexible unit is the smallest unit for heat dissipation and cooling. Multiple flexible units can also be spliced ​​to form a honeycomb heat dissipation system. Each flexible unit mainly includes three parts, namely, a packaging cover plate part 1, a manifold layer part 2, and a microchannel part 3.

[0044] The flexible unit is in the shape of a hexagonal prism. The microchannel portion 3, the manifold layer portion 2 and the packaging cover plate portion 1 are stacked in sequence along the axial direction of the honeycomb structure to form the flexible unit. Therefore, the microchannel portion 3, the manifold layer portion 2 and the packaging cover plate portion 1 are also hexagonal prism structures.

[0045] like Figure 2 As shown, the outlines of the packaging cover plate part 1, the manifold layer part 2 and the microchannel part 3 are all hexagonal. One of its advantages is that it has the advantage of flow uniformity. Compared with the rectangular loop, the hexagonal loop can reduce the generation of flow dead zones and eddies, making the fluid more evenly distributed in the channel, thereby improving the heat transfer efficiency and reducing the pressure drop. The second advantage is that it has the advantage of heat dissipation unit integration. Compared with the circular loop, the hexagonal loop can achieve seamless and close arrangement of the heat dissipation unit, providing a higher channel density to increase the heat transfer and mass transfer capacity of the system. The third advantage is that the hexagonal structure can form a honeycomb shape after splicing. The honeycomb distribution design has good mechanical stability, can withstand higher internal and external pressures and has flexibility advantages.

[0046] See also Figure 2 and Figure 3 A flow dividing loop 22, an inlet manifold 23 and an outlet manifold 24 are provided inside the manifold layer part 2. The inlet manifold 23 is connected to the flow dividing loop 22, and the outlet manifold 24 is connected to the collecting chamber 25 in the center of the manifold layer part 2. Multiple inlet manifolds 23 and multiple outlet manifolds 24 are alternately distributed in sequence around the circumference of the manifold layer part 2.

[0047] For the manifold layer part 2, as Figure 3 As shown, a hexagonal cooling medium flow distribution loop 22 is arranged along the circumferential direction, and one or more cooling medium inlets 21 are provided for the cooling medium to enter; the inlet manifold 23 and the outlet manifold 24 extend radially along the manifold layer part 2, and the radial end of the inlet manifold 23 is connected to the flow distribution loop, and the radial end of the outlet manifold 24 is connected to the collection chamber 25. The collection chamber 25 has a through hole 251 in the center for collecting and discharging the cooling medium after the heat exchange is completed.

[0048] In this embodiment, Figure 3 As shown, a plurality of cooling medium inlet manifolds 23 are used to distribute the cooling medium and impact the microchannel layer downward; in addition, cooling medium outlet manifolds 24 are arranged at intervals between the cooling medium inlet manifolds 23 to allow the cooling medium to flow out of the microchannel layer after heat exchange.

[0049] Specifically, the cooling medium inlet manifold 23 extending in the radial direction presents a conical flow channel structure. In the radial direction close to the axis of the manifold layer part 2, the width of the inlet manifold 23 gradually decreases, which can effectively regulate the flow velocity distribution, reduce the flow resistance, and evenly distribute the cooling medium to the microchannel branch to avoid local hot spots.

[0050] See also Figure 2 and Figure 4The microchannel portion 3 is provided with a plurality of annular microchannels 31 spaced apart along its radial direction, the annular microchannels 31 are concentrically distributed, and a hexagonal chamber 32 is arranged in the center; the inlet manifold 23 is connected to the outlet manifold 24 through the annular microchannel 31 or the hexagonal chamber 32, and the annular microchannel 31 and the hexagonal chamber 32 are both provided with a gradient inverse opal nanostructure 33 at the connecting position.

[0051] As innovative improvements, such as Figure 5 As shown, the microchannel part 3 is arranged with a gradient inverse opal nanostructure 33 in the annular microchannel 31 and the hexagonal chamber 32 to solve the technical problem that in the conventional microchannel, in the high heat flux density heat dissipation scenario, the cooling medium generates a large number of bubbles due to evaporation / boiling during the heat exchange process, forming an embolic flow to block the cooling medium replenishment path, thereby inducing the microchannel to produce unstable flow boiling, local cooling liquid shortage, and heat exchange capacity degradation. The gradient inverse opal nanostructure 33 is arranged in the microchannel part 3 based on the inflow and outflow position of the cooling medium to provide a fluid circulation driving force, promote the circulation replenishment of the working medium, and enhance the heat and mass circulation characteristics.

[0052] In the annular microchannel 31 , a first porous inverse opal nanostructure and a second porous inverse opal nanostructure are sequentially arranged in a direction from the inlet manifold 23 to the outlet manifold 24 , and the pore size of the first porous inverse opal nanostructure is smaller than that of the second porous inverse opal nanostructure.

[0053] Specifically, a small-aperture porous inverse opal nanostructure is arranged at the annular microchannel 31 corresponding to the manifold of the cooling medium inlet 21, and a large-aperture porous inverse opal nanostructure is arranged at the annular microchannel 31 corresponding to the cooling medium outlet manifold 24. The small-aperture structure has the advantage of strong capillary drive characteristics, which effectively promotes the rapid transportation and transfer of the cooling medium in a small space for fluid replenishment; in addition, the large-aperture area is used to give full play to the seepage characteristics of the gas-liquid two-phase working medium, so that the gas-liquid two-phase flow can efficiently penetrate and diffuse therein, thereby strengthening the heat and mass circulation transportation.

[0054] like Figure 6 and Figure 7 As shown, the final microchannel part 3, the manifold layer part 2 and the packaging cover plate part 1 are axially stacked to form a flexible unit. Specifically, one end of the inlet manifold 23 and the outlet manifold 24 of the manifold layer part 2 abuts the microchannel part 3 and connects the annular microchannel 31 and the hexagonal chamber 32, and the other end is blocked by the packaging cover plate part 1.

[0055] The packaging cover plate portion 1 is provided with a working medium outflow outlet 11 connected to the collecting chamber 25, for the cooling working medium to flow out of the heat dissipation device after heat exchange; the manifold layer portion 2 is provided with a cooling working medium inlet 21 connected to the diversion loop on the circumferential side wall, for inputting the cooling working medium into the heat dissipation device.

[0056] The circulation heat exchange path of the cooling medium in the flexible unit is: the cooling medium flows in from the cooling medium inlet 21 of the manifold layer part 2, is diverted through the hexagonal cooling medium diversion loop 22, and enters a plurality of cooling medium inlet manifolds 23; since the inlet manifold 23 is connected with the annular microchannel 31 and the hexagonal chamber 32 of the microchannel part 3, the cooling medium enters the annular microchannel 31 through multiple segmented fluid inlets at the same time, and after completing the heat exchange with the heating surface, it flows out through multiple segmented fluid outlets at the same time into the cooling medium outlet manifold 24, which effectively shortens the fluid flow length in the microchannel, reduces the flow resistance and pressure drop, and has excellent flow heat exchange characteristics.

[0057] As an innovative improvement, due to the optimized structural design of the annular diversion, the annular microchannel 31 and the conical cooling medium inlet manifold 23, compared with the traditional microchannel, the flexible heat dissipation device with a gradient inverse opal nanostructure provided in this embodiment has more uniform flow distribution characteristics, excellent flow characteristics and temperature uniformity characteristics, and has the jet impact efficient cooling capability, thereby realizing effective thermal management of flexible electronic devices and wearable devices.

[0058] In this embodiment, a flexible heat dissipation device with a gradient inverse opal nanostructure is specifically implemented as follows: In this embodiment, a sacrificial template method is combined with a photolithography process to realize the construction of the gradient inverse opal nanostructure 33 .

[0059] First, 5nm-20nm Ti is evaporated on the surface of the substrate using thermal evaporation technology or electron beam evaporation technology to increase adhesion, and then 50nm-200nm of gold or platinum and other metals are evaporated as an electroplating seed layer.

[0060] Secondly, the photoresist AZ4620 is spin-coated on the surface of the substrate to form a layer of photosensitive material. The electroplating pattern is designed and processed on the mask template where the cooling medium flows in (a small-aperture inverse opal nanostructure is arranged). The photoresist layer is solidified by ultraviolet light, and the photoresist in the unexposed area is removed with a developer to obtain the electroplating area.

[0061] The immersion area is modified using a solution such as sodium 3-mercapto-1-propanesulfonate, so that a hydrophilic self-assembled monolayer is attached to the gold surface to form a hydrophilic surface.

[0062] A 4% polystyrene sphere solution with a diameter of 20 nm was dispersed on the substrate surface by drop casting. Driven by the sedimentation of the dispersed polystyrene sphere particles and the convection self-assembly mechanism, the dispersed polystyrene spheres were automatically assembled into a porous filler template, which was then transferred to a 95°C oven and sintered for 0.5 hours to become an electroplating sacrificial layer.

[0063] Finally, an electrochemical workstation was used at 2.5 mA cm -2 Electrodeposition was performed at a constant current density for 90 minutes, and then the electroplating sacrificial layer was removed using a solution such as tetrahydrofuran, and the photoresist was removed using a stripping solution. After cleaning with acetone, isopropanol and deionized water, a small-pore inverse opal nanostructure was obtained.

[0064] The above operation is repeated, and the diameter of the polystyrene ball solution is changed to 200 nm, thereby obtaining a large-pore inverse opal nanostructure, thereby achieving effective establishment of a gradient inverse opal nanostructure 33 in the microchannel portion 3.

[0065] Specifically, the diameter of the polystyrene ball solution can be selected according to actual conditions.

[0066] In this embodiment, a mold method is used to construct a flexible manifold microchannel.

[0067] The package cover plate part 1, the manifold layer part 2 and the microchannel part 3 are made of the same flexible material. First, a manifold microchannel mold is obtained. Silicon can be used as a mold substrate, and the size and shape of the package cover plate part 1, the manifold layer part 2 and the microchannel part 3 can be designed on the substrate using photolithography technology to obtain a silicon-based mold. Alternatively, 3D printing technology can be used to directly design and print resin-based package cover plate part 1, manifold layer part 2 and microchannel part 3 molds.

[0068] After the obtained manifold microchannel mold is cleaned, a photoresist is spin-coated on its surface and then cured to facilitate the subsequent demoulding of the flexible manifold microchannel component.

[0069] Liquid polydimethylsiloxane (PDMS) or polymethyl methacrylate (PMMA) is mixed with a curing agent and boron nitride powder. The high thermal conductivity of boron nitride powder can significantly enhance the thermal conductivity of the flexible microchannel, which helps to efficiently transfer heat between the heat dissipation device and the heating surface. The mixed solution is then poured into the treated manifold microchannel mold, cured in an oven, and then demolded to obtain the various parts of the flexible manifold microchannel, and then the through holes 251 are processed for the working fluid inlet and working fluid outlet.

[0070] Finally, the various parts of the flexible manifold microchannel are connected and sealed by direct bonding, hot pressing curing, plasma bonding, etc. to obtain a flexible manifold microchannel heat dissipation device.

[0071] When there are multiple flexible units, the sides of adjacent flexible units are attached to each other, and the cooling medium inlets 21 distributed on the attached sides are connected. Based on the flexible device functional component array form, multiple flexible units are freely spliced ​​and combined to form a flexible module. The flexible module can be used as follows Fig. 9 and Fig.10The honeycomb structure shown in the figure realizes effective circulation of cooling medium between devices by setting a plurality of through holes 251 at the hexagonal cooling medium diversion loop 22 of the spliced ​​heat sink manifold layer part 2, and can also be connected through the cooling medium inlet 21 to form a flexible manifold microchannel heat dissipation system, thereby enabling targeted cooling of flexible heating surfaces of specific shapes.

[0072] Based on the array arrangement of different flexible functional components, multiple flexible units are spliced ​​and combined to form a suitable flexible heat dissipation system, thereby providing a universal thermal management solution for flexible electronic devices of different forms or functions.

[0073] like Figure 8 As shown, the flexible units of the flexible heat dissipation devices with different gradient inverse opal nanostructures are connected and assembled by gluing, and the multiple flexible units are connected through the cooling medium inlet 21 to realize the cooling medium circulation process at the heat dissipation system level.

[0074] like Fig. 9 As shown, a flexible manifold microchannel heat dissipation system composed of multiple flexible units is attached to the surface of the heating element by bonding to effectively dissipate heat from the flexible electronic device.

[0075] As innovative improvements, such as Fig.10 As shown, since the flexible manifold microchannel cooling system is made of flexible materials and has a hexagonal structure with excellent flexibility, it can effectively break through the technical bottleneck that the traditional rigid cooling system is difficult to bend or the bending causes a significant decrease in the system's cooling efficiency, and achieve efficient heat dissipation in application scenarios on the surface of variable curvature flexible devices.

[0076] Example 2

[0077] In another typical embodiment of the present invention, Figure 1-Figure 10 As shown, a working method of a flexible heat dissipation device with a gradient inverse opal nanostructure is provided, using the flexible heat dissipation device with a gradient inverse opal nanostructure as in Example 1.

[0078] like Figure 1 As shown, a working method of a flexible heat dissipation device having a gradient inverse opal nanostructure comprises:

[0079] The microchannel part 3 of the flexible unit is arranged on the heat-generating surface, and the cooling medium flows in from the cooling medium inlet 21 of the manifold layer;

[0080] After being split by the split flow loop, the cooling medium enters the multiple inlet manifolds 23, and flows downward and impacts the microchannel layer to cool the heat-generating surface;

[0081] The gradient inverse opal nanostructure 33 at the microchannel layer can provide capillary force and nanoporous channels to form a rehydration nanocirculation. Under the action of pressure difference, the cooling medium after heat exchange flows out of the microchannel layer, flows to the outlet manifold 24 and collects in the collection chamber 25;

[0082] The working medium flows out through the outlet 11 and then flows out to complete the heat exchange cycle.

[0083] When multiple flexible units are spliced ​​for use, the sides of adjacent flexible units are abutted, and the cooling medium inlets 21 distributed on the abutting sides are connected, so that the cooling medium enters the multiple flexible units.

[0084] Specifically, in combination with Example 1 and Figure 1-Figure 10 , the working method of the flexible heat dissipation device having the gradient inverse opal nanostructure includes:

[0085] The cooling medium flows in from the cooling medium inlet 21 of the manifold layer, and the cooling medium can be shared between multiple flexible manifold microchannel heat dissipation devices through the through hole 251. After being diverted by the hexagonal cooling medium diversion loop 22, it enters the cooling medium inlet 21 manifold. The cooling medium simultaneously impacts downward on the microchannel layer to cool the heating surface. Under the action of the pressure difference, the cooling medium after heat exchange flows out of the microchannel layer, flows to the cooling medium outlet manifold 24, and flows out through the manifold collection cavity 25 to complete the heat exchange cycle. In particular, during the heat exchange process of the microchannel layer, evaporation / boiling will generate a large number of bubbles, forming an embolic flow that makes it difficult to replenish the cooling medium, while the gradient inverse opal nanostructure 33 at the microchannel layer can provide capillary force and nanoporous channels to form a replenishment nanocycle, thereby enhancing the heat and mass circulation characteristics of the heat dissipation system.

[0086] Due to the working method of the flexible heat dissipation device with gradient inverse opal nanostructure, both its material and structure have excellent flexibility advantages, which can effectively achieve efficient heat dissipation of flexible electronic devices on variable curvature surfaces.

[0087] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A flexible heat dissipation device having a gradient inverse opal nanostructure, characterized in that: The flexible unit comprises at least one hexagonal column-shaped flexible unit, wherein the flexible unit comprises a microchannel portion, a manifold layer portion and a packaging cover plate portion which are sequentially stacked in an axial direction; A flow dividing loop, an inlet manifold and an outlet manifold are arranged inside the manifold layer part. The flow dividing loop is distributed circumferentially along the edge of the manifold layer part. The inlet manifold is connected to the flow dividing loop, and the outlet manifold is connected to the collecting cavity in the center of the manifold layer part. Multiple inlet manifolds and multiple outlet manifolds are alternately arranged in sequence around the circumference of the manifold layer part. The microchannel part is provided with a plurality of annular microchannels spaced apart along the radial direction thereof; the inlet manifold is connected to the outlet manifold through the annular microchannel, and the annular microchannel is provided with a gradient inverse opal nanostructure at the connecting position; The packaging cover plate part is provided with a working medium outflow outlet connected to the collecting cavity, and the circumferential side wall of the manifold layer part is provided with a cooling working medium inlet connected to the diversion loop.

2. The flexible heat dissipation device with gradient inverse opal nanostructure according to claim 1, characterized in that: The flow distribution loop is hexagonal for cooling medium to flow. The inlet manifold and the outlet manifold extend radially along the manifold layer portion respectively. One radial end of the inlet manifold is connected to the flow distribution loop, and one radial end of the outlet manifold is connected to the collecting chamber.

3. The flexible heat dissipation device with gradient inverse opal nanostructure according to claim 2, characterized in that: The inlet manifold forms a tapered flow channel structure along the radial direction of the manifold layer portion, and the width of the inlet manifold gradually decreases in the radial direction close to the axis of the manifold layer portion.

4. The flexible heat dissipation device with gradient inverse opal nanostructure according to claim 1, characterized in that: Along the axial direction of the manifold layer portion, one end of the inlet manifold and the outlet manifold abuts against the microchannel portion and communicates with the annular microchannel, and the other end is blocked by the packaging cover plate portion.

5. The flexible heat dissipation device with gradient inverse opal nanostructure according to claim 4, characterized in that: The annular microchannels on the microchannel part are concentrically distributed and are hexagonal.

6. The flexible heat dissipation device with gradient inverse opal nanostructure as claimed in claim 1, 4 or 5, characterized in that: A chamber is arranged at the center of the microchannel part, and the chamber is connected to the collecting chamber.

7. The flexible heat dissipation device with gradient inverse opal nanostructure according to claim 1, characterized in that: In the annular microchannel, a first porous inverse opal nanostructure and a second porous inverse opal nanostructure are sequentially arranged in a direction from the inlet manifold to the outlet manifold, and the pore size of the first porous inverse opal nanostructure is smaller than the pore size of the second porous inverse opal nanostructure.

8. The flexible heat dissipation device with gradient inverse opal nanostructure according to claim 1, characterized in that: When there are multiple flexible units, the sides of adjacent flexible units are abutted, and the cooling medium inlets distributed on the abutting sides are connected, and the multiple flexible units are assembled to form a flexible module for heat dissipation.

9. A method for operating a flexible heat dissipation device having a gradient inverse opal nanostructure, comprising: manufacturing the flexible heat dissipation device having a gradient inverse opal nanostructure as claimed in any one of claims 1 to 8, characterized in that: include: The microchannel part of the flexible unit is arranged on the heat-generating surface, and the cooling medium flows in from the cooling medium inlet of the manifold layer; After being diverted by the diversion loop, the cooling medium enters multiple inlet manifolds, and flows downward and impacts the microchannel layer to cool the heating surface; the gradient inverse opal nanostructure at the microchannel layer can provide capillary force and nanoporous channels to form a rehydration nanocirculation. Under the action of pressure difference, the cooling medium after heat exchange flows out of the microchannel layer, flows to the outlet manifold and gathers in the collection chamber; The working fluid flows out through the outlet and then completes the heat exchange cycle.

10. The working method of the flexible heat dissipation device with gradient inverse opal nanostructure according to claim 9, characterized in that: When multiple flexible units are spliced ​​for use, the sides of adjacent flexible units are abutted, and the cooling medium inlets distributed on the abutting sides are connected, so that the cooling medium enters the multiple flexible units.

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