Software and hardware co-processing-based chip mounter production process optimization method and system

Abstract

The invention relates to the technical field of chip mounter control, and provides a chip mounter production process optimization method and system based on software and hardware co-processing, and the method comprises the steps that an upper computer issues a loading disc replacement instruction to a chip mounter sub-module through an immediate execution channel of a main control board so as to immediately execute loading disc replacement, a suction instruction and a monitoring instruction are issued to the chip mounter sub-module through the main process channel to execute a suction action; wherein the sucking instructions and the monitoring instructions are executed in sequence in a queue form, the sucking instructions comprise a feeder element sucking instruction and a loading disc element sucking instruction, and the monitoring instruction is arranged in front of each loading disc element sucking instruction so as to ensure that the loading disc element sucking instruction is executed after the corresponding loading disc replacement instruction is completed. According to the scheme, the automatic tray and the suction mounting control logic in the production process are divided into two independent modules, the sequence of instructions issued by the two modules during actual execution is guaranteed through the instruction monitoring function, and the response speed of equipment is increased.

Description

Technical Field

[0001] The present invention relates to the field of chip placement machine control technology, and in particular to a chip placement machine production process optimization method and system based on software and hardware collaborative processing. Background Art

[0002] A placement machine is a chip placement device. In an SMT production line, it is placed after a dispensing machine or screen printer. Its main function is to pick up components from the feeder by moving the placement head, and to place the components on the PCB pads at high speed and high precision.

[0003] The placement machine equipment realizes the placement of PCB boards through the coordinated control of the software and hardware systems. A placement action can be divided into the following steps: (1) The feeder delivers the components to the suction position; (2) The placement head moves to the suction position and performs the suction action; (3) The component is identified by the camera and the correction value is obtained; (4) The placement head moves to the placement position and performs the placement action.

[0004] There are many types of feeders used to store components, mainly including belt feeders and tray feeders. Among them, belt feeders mainly refer to feeder feeders, which are the most commonly used in production. For example, invention patent CN116113229A discloses a method and device and storage medium to ensure the consistency of multiple feeder feeding points. The feeder is installed on the base of the placement machine. The position of each feeding is fixed. When in use, the material belt is installed on the feeder. During production, each time the feeder performs feeding, a component will be sent to the suction position for the placement head to absorb. The feeder has high feeding efficiency, but it may not be suitable for some large components and some components that need to be recycled (cannot be put back into the material belt). For some components that cannot use the feeder feeder, a tray feeder is required.

[0005] Tray feeders are generally suitable for large components, and their control logic is more complex than that of belt feeders. For example, invention patent CN117082847A discloses an automatic control device and method for a placement machine tray. The device includes a fixed tray and an automatic tray. The fixed tray is installed on the base of the equipment and has only one layer of available trays. The automatic tray feeder can accommodate multiple layers of trays. Common automatic trays generally include components such as a carrier box, a conveyor track, and a gripper. Multiple layers of trays can be placed in the carrier box, and each layer of trays can be used to place components. The working principle of the automatic tray is: The carrier box can move in the vertical direction to make any carrier layer reach the grabbing position; The gripper can move in the horizontal direction. When the gripper is in the closed state, it can "grasp" the carrier and move the carrier in the horizontal direction to extract the carrier to the working position or return it to the carrier box.

[0006] In actual use, components are placed on the carrier. One type of component can be placed in multiple layers of carriers, and multiple types of components can be placed in one layer of carrier. The actual workflow of the automatic tray feeder is: for the component to be picked up, first pull out its corresponding carrier, and return the carrier to the carrier box after the pickup is completed. For example, for a set of pick-and-place cycles, placement heads 1-10 need to pick up components 1-10, and components 1-10 are placed on layers 1-10 of the carriers, respectively. The actual execution process is as follows: (1) The carrier box moves to the first layer of the carrier, the gripper pulls the carrier to the working position, and placement head 1 picks up a component; (2) The gripper drives the carrier to move and returns the carrier to the first layer of the carrier box; then the carrier box moves to the second layer of the carrier, the gripper pulls the carrier to the working position, and placement head 2 picks up a component; and so on.

[0007] In actual use, you may face complex usage scenarios. For example, for a set of pick-and-place cycles, placement head 1 needs to pick up flyer component 1, placement head 2 needs to pick up automatic tray component 2 (located on the first layer of the tray), placement head 3 picks up flyer component 3, and placement head 4 needs to pick up automatic tray component 4 (located on the second layer of the tray). The conventional approach is generally to execute sequentially, such as Figure 1 As shown, that is: 1. Feeder 1 feeds, and placement head 1 picks up feeder component 1; 2. The first layer of the tray is extracted, and placement head 2 picks up tray component 2; 3. Feeder 3 feeds, and placement head 3 picks up feeder component 3; 4. The first layer of the tray is returned, the second layer of the tray is extracted, and placement head 4 needs to pick up automatic tray component 4. The disadvantage of this approach is that steps 1 to 4 are executed sequentially, which is not optimal in terms of efficiency. In fact, considering the independence of tray operations, the feeding and picking actions in step 1 and the tray extraction action in step 2, as well as the feeding and picking actions in step 3 and the tray replacement operation in step 4 can be executed in parallel, such as Figure 2 As shown, the purpose of saving time and improving production efficiency is achieved. In the entire production process of the placement machine, the tray replacement action is a relatively time-consuming part. If the execution process is not optimized, it will affect the actual production efficiency of the placement machine. In addition, the tray action can also be executed in parallel during the process of substrate transmission and substrate reference point recognition. It can be seen that the automatic tray control logic in the production process of the placement machine has a certain complexity. How to ensure the accurate and efficient execution of the process is a problem that needs to be solved. Summary of the invention

[0008] In order to solve the problems in the prior art, the purpose of the present invention is to provide a method and system for optimizing the production process of a placement machine based on software and hardware collaborative processing.

[0009] In order to achieve the above-mentioned objectives, the first aspect of the present invention provides a method for optimizing the production process of a placement machine based on software and hardware collaborative processing, wherein the upper computer sends a carrier plate replacement instruction to the placement machine sub-module through the immediate execution channel of the main control board to immediately execute the carrier plate replacement, and sends a suction instruction and a monitoring instruction to the placement machine sub-module through the main process channel to execute the suction action; wherein the suction instruction and the monitoring instruction are executed in sequence in the form of a queue, and the suction instruction includes a feeder component suction instruction and a carrier component suction instruction, and each carrier component suction instruction is provided with a monitoring instruction to ensure that the carrier component suction instruction is executed after the corresponding carrier plate replacement instruction is completed.

[0010] Preferably, the method further comprises that after the upper computer monitors the completion of the absorption of a carrier component through a completion code event returned by the main control board, a carrier replacement instruction is issued through the immediate execution channel of the main control board to extract the designated carrier.

[0011] Preferably, the method also includes that when a group of components are all successfully identified, the upper computer sends a carrier replacement instruction through the immediate execution channel of the main control board to extract the specified carrier; or, when there are components in a group of components that fail to be identified, after waiting for the component to be discarded or specially returned, the upper computer sends a carrier replacement instruction through the immediate execution channel of the main control board to extract the specified carrier.

[0012] Preferably, the method further comprises that, when all the carrier components required for the production of a substrate are sucked out, the host computer sends a carrier replacement instruction through the immediate execution channel of the main control board to extract the carrier required for the production of the next substrate in advance.

[0013] Preferably, the process of extracting the carrier is based on the automatic tray module of the placement machine to execute the carrier replacement instruction, and the upper computer controls the carrier replacement timing through event-driven, and the execution logic is: after the production starts, the instruction event monitoring is turned on, and when the completion code event returned by the main control board monitors the specified signal event, the carrier replacement detection is automatically triggered to determine whether the carrier needs to be replaced. If the carrier needs to be replaced, the carrier replacement instruction is issued through the immediate execution channel, and the replacement operation is performed by the automatic tray module of the placement machine; when the production is exited, the instruction event monitoring is terminated.

[0014] Preferably, the host computer records and saves the actual number of used components on the carrier plate by monitoring the completion code event of the suction instruction, and calculates the suction position of the current component or warns that the components on the carrier plate have been used up according to the counting information.

[0015] The second aspect of the present invention provides a chip placement machine production process optimization system based on software and hardware collaborative processing, including a carrier control module and a suction process module. The carrier control module is used to create a carrier replacement instruction, and send it to the placement machine submodule through the main control board immediate execution channel to immediately execute the carrier replacement; The suction process module is used to create suction instructions and monitoring instructions, which are sent to the placement machine sub-module through the main process channel of the main control board to execute the suction action; wherein the suction instructions and monitoring instructions are executed in sequence in the form of a queue, and the suction instructions include feeder component suction instructions and carrier component suction instructions. A monitoring instruction is provided before each carrier component suction instruction to ensure that the carrier component suction instruction is executed after the corresponding carrier replacement instruction is completed.

[0016] Preferably, the system starts command event monitoring after starting production. When the specified signal event is monitored through the completion code event returned by the main control board, the carrier replacement detection is automatically triggered to determine whether the carrier needs to be replaced. If the carrier needs to be replaced, the carrier replacement command is issued through the immediate execution channel, and the replacement operation is performed by the automatic tray module; when exiting production, the command event monitoring is terminated.

[0017] Preferably, the system further comprises a tray counting module for recording and saving the actual number of tray components used according to the completion code event of the monitoring suction instruction, and calculating the suction position of the current component according to the counting information or warning that the tray components have been used up.

[0018] A third aspect of the present invention provides a machine-readable storage medium having instructions stored thereon, the instructions being used to enable a machine to execute the above-mentioned method for optimizing the production process of a placement machine based on software-hardware collaborative processing.

[0019] Through the above technical scheme, the tray replacement instruction is sent to the automatic tray module of the placement machine for execution using the immediate execution channel, and the suction and placement instruction uses the main process channel. By adding a monitoring instruction for the tray replacement instruction before each suction instruction, the correctness of the instruction execution order is guaranteed, and the suction instruction is executed only after the tray replacement instruction is executed. In this way, the automatic tray and suction and placement control logic in the production process are divided into two independent modules. The monitoring instruction function is used to ensure the order of actual execution between the instructions issued by the two modules, so that the modules are decoupled, the maintainability of the code is improved, and the response speed of the equipment is improved.

[0020] Other features and advantages of the embodiments of the present invention will be described in detail in the subsequent detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The accompanying drawings are used to provide a further understanding of the embodiments of the present invention and constitute a part of the specification. Together with the following specific implementations, they are used to explain the embodiments of the present invention, but do not constitute a limitation on the embodiments of the present invention. In the accompanying drawings: Figure 1 This is a schematic diagram of the normal sequence of component absorption by the placement machine; Figure 21. It is a schematic diagram of the component picking sequence of the chip mounter according to an embodiment of the present invention; Figure 3 1. It is a schematic diagram of the production process of a chip mounter according to an embodiment of the present invention; Figure 4 It is a schematic diagram of the main process and immediate execution process of an embodiment of the present invention; Figure 5 This is a schematic diagram of the timing of replacing the carrier plate according to an embodiment of the present invention; Figure 6 It is a schematic diagram of the component pickup position and component counting of the carrier according to an embodiment of the present invention. DETAILED DESCRIPTION

[0022] The specific implementation of the embodiment of the present invention is described in detail below in conjunction with the accompanying drawings. It should be understood that the specific implementation described here is only used to illustrate and explain the embodiment of the present invention, and is not used to limit the embodiment of the present invention.

[0023] A first aspect of an embodiment of the present invention provides a method for optimizing a production process of a chip mounter based on software and hardware collaborative processing, comprising the following steps: Figure 3 As shown, the host computer sends a tray replacement instruction to the placement machine submodule (automatic tray module) through the immediate execution channel of the main control board to immediately execute the tray replacement, and sends a suction instruction and a monitoring instruction to the placement machine submodule (placement head module, XY module, etc.) through the main process channel to execute the suction action; wherein, the suction instruction and the monitoring instruction are executed in sequence in the form of a queue, and the suction instruction includes a feeder component suction instruction and a tray component suction instruction. A monitoring instruction is provided before each tray component suction instruction to ensure that the tray component suction instruction is executed after the corresponding tray replacement instruction is completed.

[0024] The hardware main control board uses two command channels: Figure 4 As shown, the main process channel and the immediate execution channel, the main process channel maintains a queue of instructions to be executed, and sends the received instructions to the device for execution in sequence according to the first-in-first-out principle; the instructions in the immediate execution channel are directly sent to the device for execution without waiting. The present invention uses the monitoring instruction function to ensure the execution order between instructions.

[0025] The concept of monitoring instructions in this application is as follows: any instruction has a unique monitoring ID as an identifier. The main process channel of this application includes but is not limited to suction instructions and monitoring instructions, and may also include conventional instructions, such as axis movement instructions, component suction instructions, camera shooting instructions, etc., which are used to control the device to perform actions. The monitoring instruction is a special instruction used in the main process. It supports the monitoring ID of other instructions as parameters to realize the monitoring function. The specific working principle is: in the process of executing instructions in sequence in the main process, if a monitoring instruction is executed, it is necessary to wait for the instruction corresponding to its monitoring ID to be executed before executing the subsequent instruction sequence, otherwise it will be blocked and waiting.

[0026] <Command 1> Absorb command 1, ID=1 <Command 2> Monitoring command, ID=2, monitoring ID=1 <Command 3> Placement command, monitoring ID = 3 For example, in the above instruction sequence, during the actual execution process, instruction 1 is executed first (instruction 1 is sent to the device for execution), and then instruction 2 is executed. At this time, it blocks and waits until a signal that instruction 1 has been executed is monitored, and then instruction 3 is executed (instruction 3 is sent to the device for execution).

[0027] The main control board feeds back the execution status of all instructions to the host computer in real time. Therefore, through the monitoring ID of the instruction, the host computer can obtain the start and completion status of all instructions from the main control board. After the execution status of any instruction on the hardware changes (start execution or execution completion), this status will be fed back to the host computer software through a completion code event. The completion code event includes parameters: monitoring ID, execution status (started, completed). After the host computer receives the completion code event, it can correspond to the specific instruction through the monitoring ID, which can be used to monitor the execution status of various instructions. On this basis, various complex logics can be improved according to actual needs.

[0028] The technical solution of the present invention divides the automatic tray and suction placement control logic in the production process into two independent modules, and ensures the order of actual execution between the instructions issued by the two modules through the monitoring instruction function, thereby decoupling the modules, improving the maintainability of the code, and improving the response speed of the equipment.

[0029] Specifically, the tray replacement instruction is sent to the automatic tray module of the placement machine using the immediate execution channel, while the suction placement instruction uses the main process channel. By adding a monitoring ID for the tray replacement instruction before each suction instruction, the correctness of the instruction execution order is guaranteed, ensuring that the suction instruction is executed only after the tray replacement instruction is executed.

[0030] After each carrier component is absorbed, it is immediately replaced with another carrier layer of another carrier component needed next time. During the replacement, some other operations such as feeder absorption or placement can be performed. Before each absorption instruction, the corresponding carrier replacement instruction is monitored, so that the carrier replacement instruction can be executed in parallel with other action processes as much as possible, so as to shorten the time and improve production efficiency.

[0031] By splitting the process into two independent modules, we can improve production efficiency while decoupling the code and making it easier to maintain. At the same time, the software can realize parallel computing of data, which can also improve efficiency to a certain extent.

[0032] like Figure 1 The conventional sequential execution scheme shown is equivalent to sending all instructions to the main process for sequential execution. Figure 2 As shown, the disk replacement instruction is sent to the immediate execution channel and is sent in advance as early as possible to achieve the purpose of improving concurrency and saving time.

[0033] In the case where the tray operation is time-consuming, the present invention proposes a tray replacement timing optimization scheme to further improve the parallelism of the entire production process, such as Figure 5 As shown in the figure, the early replacement of the carrier is triggered by command status monitoring. The main strategies include: 1. Immediately after starting production, the first layer of carrier required for this time is pulled out (executed in parallel with substrate transfer and mark point recognition); 2. In a set of pick-and-place cycles, after a carrier component is sucked (monitoring that the sucking instruction is executed), the next carrier required is immediately pulled out; 3. When all components in a group are successfully identified, immediately remove a group of carriers; 4. When there are components that fail to be identified, wait for the component to be thrown away / specially returned (monitor the completion of throwing away / specially returned) and then immediately draw the next set of carriers; 5. When all the carrier components required for a substrate are sucked, the first layer of carrier required for the next substrate is extracted in advance.

[0034] The specified carrier is extracted based on the automatic tray module of the placement machine to execute the carrier replacement instruction. The upper computer controls the carrier replacement timing through event drive. The specific execution logic is to start the instruction event monitoring after the production starts, monitor the completion code event returned by the hardware module, that is, the main control board. When monitoring the completion of the absorption instruction execution, the start of production signal, the recognition completion signal and other events, the carrier replacement detection is automatically triggered. According to the actual situation, if the carrier needs to be replaced, the main control board execution channel will immediately issue an instruction to replace it with the next carrier required. When exiting production, the instruction event monitoring is terminated.

[0035] By optimizing the timing of tray replacement, the concurrency of the process is improved, which can greatly improve production efficiency and reduce the time consumption of the tray process.

[0036] In another embodiment of the present invention, considering that the components are arranged in a grid shape in the carrier and are picked up one by one, the system should support determining the coordinates of the component to be picked up currently to ensure the correctness of the picking position, while ensuring flexibility and supporting interruption and continuation of production at any time.

[0037] In addition, considering that the number of components that can be placed on a tray is fixed, the components are picked up one by one during the production process. Under normal circumstances, the operator will prepare enough components to ensure that the production can be completed normally. However, in the actual production process, some components may be damaged, resulting in abnormal identification and cannot be mounted. At this time, the next component will be used, which may cause the components to run out during production.

[0038] In view of the above situation, the present invention records the number of components that have been used and the total number of components, determines the next suction position according to the counting information, and promptly prompts the operator to replenish the components when the components are about to be / have been used up.

[0039] In addition, if the production is quit midway, the software needs to record the position of the tray component that should be sucked next time to ensure smooth continuation of production. If the data recording function is not supported, then before each production, it is necessary to rearrange the components, fill the tray with materials, and start sucking from the first position to ensure smooth production. The operation process is cumbersome and affects the actual production efficiency.

[0040] And considering the actual use scenario, when the operator starts production midway, there may be a need to start picking from any position on the tray. All of these require the software to provide a reasonable tray component counting and picking position management solution.

[0041] The method for optimizing the production process of a placement machine based on software and hardware collaborative processing of the present invention also includes a carrier component counting logic based on monitoring instructions: the upper computer records and saves the actual number of carrier components used according to the completion code event of the monitoring suction instruction, calculates the suction position of the current component according to the counting information, or warns that the carrier components have been used up.

[0042] By monitoring the completion code event of the suction command, the actual number of tray components used is recorded, and this information can be written to a file to ensure that it can be used next time. Each time the suction command is monitored to be completed, the tray count of the corresponding component is increased by one. Each time a component is sucked, the suction position (the number of tray layers and the position of the component in the tray) is calculated based on the current component count information, so that the components can be sucked one by one in order. The tray component suction position and component count are as follows Figure 6shown.

[0043] At the same time, an early warning function is also implemented when the carrier components are used up. Before each carrier component absorption, it is judged whether the current number of remaining components is sufficient. If the components are used up, a prompt is given and the process is paused. Before each production starts, it can also judge whether the number of remaining components is sufficient to meet production needs based on the current counting information. If there is a shortage, a prompt message is also given.

[0044] Based on this logic, it also supports providing a UI interface so that the operator can see the usage of components in real time. It also supports manual modification of the current component count information to achieve the function of customizing the start suction position according to actual needs.

[0045] In summary, the present invention realizes a complete automatic pallet control function in the production process by processing the above three embodiments, significantly reducing the production downtime. Compared with the conventional solution, the present invention has a higher degree of automation, reduces operating errors and improves equipment utilization.

[0046] Based on the same inventive concept, the second aspect of the embodiment of the present invention provides a chip placement machine production process optimization system based on software and hardware collaborative processing, such as Figure 3 As shown, it includes a tray control module and an absorption process module. The carrier control module is used to create a carrier replacement instruction, which is sent to the placement machine submodule through an immediate execution channel to immediately execute the carrier replacement; The suction process module is used to create suction instructions and monitoring instructions, which are sent to the placement machine sub-module through the main process channel to perform the suction action; wherein the suction instructions and monitoring instructions are executed in sequence in a queue form, and the suction instructions include feeder component suction instructions and carrier component suction instructions. A monitoring instruction is provided before each carrier component suction instruction to ensure that the carrier component suction instruction is executed after the corresponding carrier replacement instruction is completed.

[0047] Furthermore, the system starts command event monitoring after starting production. When the specified signal event is monitored by monitoring the completion code event returned by the monitoring command (including the completion of the absorption command execution, the start of production signal or the identification completion signal event), the carrier replacement detection is automatically triggered to determine whether the carrier needs to be replaced. If the carrier needs to be replaced, the carrier replacement command is issued through the immediate execution channel, and the replacement operation is performed by the automatic tray module; when exiting production, the command event monitoring is terminated.

[0048] Furthermore, the system also includes a tray counting module for recording and saving the actual number of tray components used according to the completion code event of the monitoring suction instruction, and calculating the suction position of the current component according to the counting information or warning that the tray components have been used up.

[0049] Based on the same inventive concept, the third aspect of an embodiment of the present invention provides a machine-readable storage medium, on which instructions are stored, and the instructions are used to enable the machine to execute the above-mentioned method for optimizing the production process of a placement machine based on software and hardware collaborative processing of the present application.

[0050] It should also be noted that the terms "comprises," "includes," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, commodity, or apparatus that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, commodity, or apparatus.

[0051] The above are only embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included within the scope of the claims of the present application.

Claims

1. A method for optimizing the production process of a chip placement machine based on software and hardware collaborative processing, characterized in that: The host computer sends a tray replacement instruction to the placement machine submodule through the immediate execution channel of the main control board to immediately execute the tray replacement, and sends a suction instruction and a monitoring instruction to the placement machine submodule through the main process channel to execute the suction action; wherein, the suction instruction and the monitoring instruction are executed in sequence in the form of a queue, and the suction instruction includes a feeder component suction instruction and a tray component suction instruction. A monitoring instruction is provided before each tray component suction instruction to ensure that the tray component suction instruction is executed after the corresponding tray replacement instruction is completed.

2. The method according to claim 1, characterized in that The method further includes that after the upper computer monitors the completion of a carrier component absorption through a completion code event returned by the main control board, a carrier replacement instruction is issued through an immediate execution channel of the main control board to extract the designated carrier.

3. The method according to claim 1, characterized in that The method also includes that when all components in a group are successfully identified, the upper computer sends a carrier replacement instruction through the immediate execution channel of the main control board to extract the specified carrier; or, when there are components in a group of components that fail to be identified, after waiting for the component to be discarded or specially returned, the upper computer sends a carrier replacement instruction through the immediate execution channel of the main control board to extract the specified carrier.

4. The method according to claim 1, characterized in that: The method also includes that, when all the carrier components required for the production of a substrate are sucked, the host computer sends a carrier replacement instruction through the immediate execution channel of the main control board to extract the carrier required for the production of the next substrate in advance.

5. The method according to any one of claims 2 to 4, characterized in that: The process of extracting the carrier is based on the automatic tray module of the placement machine to execute the carrier replacement instruction, and the upper computer controls the carrier replacement timing through event drive. The execution logic is: after the production starts, the instruction event monitoring is turned on. When the completion code event returned by the main control board monitors the specified signal event, the carrier replacement detection is automatically triggered to determine whether the carrier needs to be replaced. If the carrier needs to be replaced, the carrier replacement instruction is issued through the immediate execution channel, and the replacement operation is performed by the automatic tray module of the placement machine; when the production is exited, the instruction event monitoring is terminated.

6. The method according to claim 5, characterized in that The host computer records and saves the actual number of components on the carrier plate by monitoring the completion code event of the suction command, and calculates the suction position of the current component based on the counting information or warns that the components on the carrier plate have been used up.

7. A chip placement machine production process optimization system based on software and hardware collaborative processing, characterized in that: Including tray control module and suction process module, The carrier control module is used to create a carrier replacement instruction, and send it to the placement machine submodule through the main control board immediate execution channel to immediately execute the carrier replacement; The suction process module is used to create suction instructions and monitoring instructions, which are sent to the placement machine sub-module through the main process channel of the main control board to execute the suction action; wherein the suction instructions and monitoring instructions are executed in sequence in the form of a queue, and the suction instructions include feeder component suction instructions and carrier component suction instructions. A monitoring instruction is provided before each carrier component suction instruction to ensure that the carrier component suction instruction is executed after the corresponding carrier replacement instruction is completed.

8. The system according to claim 7, characterized in that The system starts command event monitoring after starting production. When the specified signal event is monitored through the completion code event returned by the main control board, the carrier replacement detection is automatically triggered to determine whether the carrier needs to be replaced. If the carrier needs to be replaced, the carrier replacement command is issued through the immediate execution channel, and the automatic tray module performs the replacement operation; when exiting production, the command event monitoring is terminated.

9. The system according to claim 7 or 8, characterized in that: The system also includes a tray counting module for recording and saving the actual number of tray components used according to the completion code event of the monitoring suction instruction, and calculating the suction position of the current component according to the counting information or warning that the tray components have been used up.

10. A machine-readable storage medium having instructions stored thereon, the instructions being used to cause a machine to execute the method according to any one of claims 1 to 6.

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