Display panel, preparation method thereof and display device

Abstract

The application provides a display panel and a preparation method thereof and a display device. The display panel comprises a substrate, a driving substrate, a pixel definition layer, a sub-pixel and an overhanging structure. The driving substrate is arranged on the substrate. The pixel definition layer is arranged on the driving substrate. The pixel definition layer protrudes from the driving substrate and surrounds a pixel containing area. The sub-pixel is arranged in the pixel containing area. The sub-pixel comprises an anode, an organic light-emitting layer and a cathode which are arranged in the direction from the driving substrate to the direction away from the driving substrate. The overhanging structure is arranged on the pixel definition layer and protrudes from the pixel containing area. The overhanging structure comprises a light-transmitting conductive layer and a light-transmitting insulating layer which shields the light-transmitting conductive layer. The light-transmitting conductive layer is electrically connected with the driving substrate. The light-transmitting conductive layer is in contact with the cathode. The display panel can effectively reduce the loss of outgoing light, improve the light extraction efficiency of the display panel, reduce the energy consumption of the display panel and effectively prolong the service life.

Description

Technical Field

[0001] This invention relates to the field of display technology, and in particular to a display panel, its manufacturing method, and a display device. Background Technology

[0002] Active-matrix organic light-emitting diode (AMOLED) displays have become the mainstream display technology. To improve resolution and reduce cost, the maskless deposition and photolithography techniques used in AMOLED fabrication significantly increase the effective light-emitting area (aperture ratio), thus facilitating a substantial increase in pixel density. To achieve high resolution and color accuracy in AMOLEDs, a cathode isolation pillar structure has been introduced. This involves creating insulating partitions on the substrate before depositing the organic thin film and metal cathode, instead of using a metal template, to separate the different pixels and achieve pixel array arrangement. This cathode isolation pillar structure is also known as a suspended structure.

[0003] In existing technologies, because the height of the suspending structure is greater than the height of the organic light-emitting layer of the pixel, some of the light emitted by the organic light-emitting layer will be blocked or absorbed by the suspending structure surrounding the pixel, resulting in some loss of emitted light. This leads to a reduction in the light extraction efficiency of the display panel and affects the display brightness of the display panel. Summary of the Invention

[0004] The display panel, its manufacturing method, and display device provided in this application aim to solve the problem that the hanging structure in existing display panels leads to a decrease in the light extraction efficiency of the display panel, which affects the display brightness of the display panel.

[0005] To solve the above-mentioned technical problems, one technical solution adopted in this application is: to provide a display panel, comprising:

[0006] Substrate;

[0007] A driving substrate is disposed on the substrate;

[0008] A pixel definition layer is disposed on the driving substrate; the pixel definition layer protrudes from the driving substrate and surrounds a pixel receiving area.

[0009] A sub-pixel is disposed within the pixel accommodating area; the sub-pixel includes an anode, an organic light-emitting layer, and a cathode sequentially stacked from near the driving substrate toward away from the driving substrate;

[0010] A pendant structure is disposed on the pixel definition layer and protrudes from the pixel accommodating area; the pendant structure includes a light-transmitting conductive layer and a light-transmitting insulating layer that blocks the light-transmitting conductive layer; the light-transmitting conductive layer is electrically connected to the driving substrate; the light-transmitting conductive layer is disposed in contact with the cathode.

[0011] In one specific embodiment, the light-transmitting insulating layer includes photoresist, which includes one or more of photoolefin monomer photoresist, azidoquinone photoresist, or polyvinyl alcohol lauryl ester photoresist;

[0012] The light-transparent conductive layer includes a light-transparent conductive oxide, and the light-transparent conductive oxide includes indium tin oxide.

[0013] In one specific embodiment, the light transmittance of the light-transmitting conductive layer is greater than or equal to 90%; the light transmittance of the light-transmitting insulating layer is greater than or equal to 80%.

[0014] In one specific embodiment, the pixel definition layer has a protrusion on the side facing the hanging structure for supporting the hanging structure; and the projection of the protrusion on the substrate along the stacking direction of the display panel is located within the projection of the light-transmitting insulating layer on the substrate along the stacking direction.

[0015] The light-transmitting conductive layer is disposed between the light-transmitting insulating layer and the protrusion; and the light-transmitting conductive layer at least covers a portion of the surface of the sidewalls of the protrusion along both sides of the first direction; wherein, the first direction is perpendicular to the stacking direction.

[0016] In one specific embodiment, the thickness of the light-transmitting conductive layer is greater than or equal to 20 nm and less than or equal to 100 nm.

[0017] In one specific embodiment, the transmittance of the pixel definition layer is greater than or equal to 85%; and the refractive index of the pixel definition layer is greater than or equal to 1.4 and less than or equal to 1.7.

[0018] In one specific embodiment, the pixel definition layer comprises polyimide and / or polycarbonate.

[0019] To solve the above-mentioned technical problems, another technical solution adopted in this application is to provide a display device, including a display panel as described in any of the above claims.

[0020] To solve the above-mentioned technical problems, another technical solution adopted in this application is: providing a method for manufacturing a display panel, comprising:

[0021] A preform is provided; the preform includes a substrate, a driving substrate, a pixel definition layer, and an anode; wherein the pixel definition layer protrudes from the driving substrate to form a pixel receiving region; the anode is disposed within the pixel receiving region;

[0022] A light-transparent conductive material is deposited and patterned on the pixel definition layer to form a light-transparent conductive layer;

[0023] A light-transmitting insulating material is deposited and patterned on the light-transmitting conductive layer to form a light-transmitting insulating layer, and the light-transmitting insulating layer is used to block the light-transmitting conductive layer to form a hanging structure.

[0024] On the side of the anode away from the driving substrate, organic light-emitting material and cathode conductive material are sequentially vapor-deposited to form an organic light-emitting layer and a cathode, and the cathode is arranged in contact with the light-transmitting conductive layer.

[0025] In one specific embodiment, the pixel definition layer has a protrusion on the side away from the driving substrate; the step of depositing a light-transmitting conductive material on the pixel definition layer and patterning it to form the light-transmitting conductive layer specifically includes:

[0026] A conductive oxide layer is formed by depositing a light-transmitting conductive oxide material on the surface of the pixel definition layer and the anode surface;

[0027] The conductive oxide layer is patterned by exposure etching to form the light-transmitting conductive layer, and the light-transmitting conductive layer covers at least a portion of the surface of the sidewalls on both sides of the protrusion along a first direction; wherein, the first direction is perpendicular to the stacking direction.

[0028] The beneficial effects of this application's embodiments are as follows: Unlike existing technologies, this application provides a display panel comprising a substrate, a driving substrate, a pixel definition layer, sub-pixels, and a dangling structure. The driving substrate is disposed on the substrate; the pixel definition layer is disposed on the driving substrate and protrudes from the driving substrate, forming a pixel receiving area; the sub-pixels are disposed within the pixel receiving area; each sub-pixel includes an anode, an organic light-emitting layer, and a cathode, sequentially stacked from near the driving substrate towards the direction away from the driving substrate; the dangling structure is disposed on the pixel definition layer and protrudes from the pixel receiving area; the dangling structure includes a light-transmitting conductive layer and a light-transmitting insulating layer that blocks the light-transmitting conductive layer; the light-transmitting conductive layer is electrically connected to the driving substrate; and the light-transmitting conductive layer is in contact with the cathode. By using a light-transmitting conductive layer and a light-transmitting insulating layer to form the dangling structure, emitted light that would otherwise be blocked or absorbed by the dangling structure can pass through it, effectively reducing emitted light loss, improving the light extraction efficiency of the display panel, and reducing the driving current required for the display panel to emit light of the same brightness, thereby reducing the energy consumption of the display panel and effectively extending its service life. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the structure of a display panel provided in one embodiment of this application;

[0030] Figure 2 This is a schematic diagram of the structure of a display device provided in an embodiment of this application;

[0031] Figure 3 A schematic flowchart illustrating a method for fabricating a display panel according to an embodiment of this application;

[0032] Figure 4 This is a schematic diagram of the structure corresponding to step S1;

[0033] Figure 5a This is a schematic diagram of the structure corresponding to step S21;

[0034] Figure 5b This is a schematic diagram of the structure corresponding to step S22;

[0035] Figure 6a This is a schematic diagram of the structure corresponding to step S31;

[0036] Figure 6b This is a schematic diagram of the structure corresponding to step S32;

[0037] Figure 7 This is a schematic diagram of the structure corresponding to step S4.

[0038] Explanation of icon numbers:

[0039] 100-Display panel; 1-Substrate; 2-Driving substrate; 3-Pixel definition layer; 4-Sub-pixel; 5-Dangling structure; 6-Etching protection layer; 7-First encapsulation layer; 8-Second encapsulation layer; 10-Preform; 31-Protrusion; 41-Anode; 42-Organic light-emitting layer; 43-Cathode; 51-Transparent conductive layer; 52-Transparent insulating layer; 510-Conductive oxide layer; 520-Transparent insulating material layer. Detailed Implementation

[0040] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0041] The terms "first," "second," and "third" in this application are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified. All directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationships and movements between components in a specific orientation (as shown in the figures). If the specific orientation changes, the directional indications also change accordingly. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or devices.

[0042] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0043] The present application will now be described in detail with reference to the accompanying drawings and embodiments.

[0044] See Figure 1 , Figure 1 This is a schematic diagram of the structure of a display panel provided in an embodiment of this application; this application provides a display panel, which can be an organic light-emitting diode (OLED) display panel; the display panel can include a substrate 1, a driving substrate 2, a pixel definition layer 3, sub-pixels 4, and a hanging structure 5.

[0045] The substrate 1 supports and protects the various film layers of the display panel; in a specific embodiment, the substrate 1 can be a glass substrate. The driving substrate 2 may include a driving circuit layer (not shown) for driving the sub-pixels 4 to emit light; the pixel definition layer 3 is disposed on the surface of the driving substrate 2 away from the substrate 1. The pixel definition layer 3 protrudes from the driving substrate 2 and defines a plurality of pixel accommodating areas for accommodating the sub-pixels 4.

[0046] Sub-pixel 4 is disposed within the pixel accommodating area, and sub-pixel 4 includes an anode 41, an organic light-emitting layer 42, and a cathode 43 sequentially stacked from the direction close to the driving substrate 2 to the direction away from the driving substrate 2; wherein, the anode 41 is connected to the anode power line, and the cathode 43 is connected to the cathode power line, so that the organic light-emitting layer 42 emits light after conducting electricity.

[0047] A dangling structure 5 is disposed on the side surface of the pixel definition layer 3 facing away from the driving substrate 2, and the dangling structure 5 protrudes and surrounds the pixel receiving area to separate sub-pixels 4 of different colors and avoid pixel crosstalk. Specifically, the dangling structure 5 includes a light-transmitting conductive layer 51 and a light-transmitting insulating layer 52 sequentially stacked from the pixel definition layer 3 toward the pixel definition layer 3.

[0048] The light-transmitting conductive layer 51 is disposed on the side of the suspended structure 5 near the pixel definition layer 3, and is located on the surface of the pixel definition layer 3 facing the suspended structure 5. The light-transmitting conductive layer 51 is in contact with the cathode 43 of the sub-pixel 4, so as to conduct electricity between the common cathode 43 and the cathode 43 of different sub-pixels 4. The light-transmitting insulating layer 52 is disposed on the surface of the light-transmitting conductive layer 51 away from the pixel definition layer 3, and is used to separate sub-pixels 4 of different colors. Furthermore, the two side edges of the light-transmitting insulating layer 52 protrude from the light-transmitting conductive layer 51 to form an eaves structure, so that when the organic light-emitting layer 42 and the cathode 43 are deposited by vapor deposition, the evaporation angle can be changed through the eaves structure so that the cathode 43 covers the organic light-emitting layer 42.

[0049] Specifically, at least a portion of the light emitted by the organic light-emitting layer 42 can pass through the light-transmitting conductive layer 51 and the light-transmitting insulating layer 52. Thus, by using the light-transmitting conductive layer 51 and the light-transmitting insulating layer 52 to form the suspension structure 5, the emitted light that would otherwise be blocked or absorbed by the suspension structure 5 can pass through the suspension structure 5, effectively reducing the emitted light loss, improving the light extraction efficiency of the display panel, reducing the driving current required for the display panel to emit light of the same brightness, thereby reducing the energy consumption of the display panel and effectively extending its service life.

[0050] In a specific embodiment, the light-transmitting conductive layer 51 may include a light-transmitting conductive oxide to achieve conductivity while allowing emitted light to pass through. Specifically, the light-transmitting conductive oxide may include indium-tin oxide (ITO), aluminum-zinc oxide (AZO), gallium-zinc oxide (GZO), or fluorine-doped tin oxide (FTO), etc. Preferably, the light-transmitting conductive oxide may be indium-tin oxide, and the light-transmitting conductive layer 51 may be an ITO metal layer. The light transmittance of the light-transmitting conductive layer 51 is greater than or equal to 90% to reduce the blocking or absorption of emitted light by the light-transmitting conductive layer 51 and reduce emitted light loss. Specifically, the light transmittance of the light-transmitting conductive layer 51 may be any value selected from 90%, 92%, 94%, 95%, or 96%. Preferably, the light transmittance of the light-transmitting conductive layer 51 is greater than or equal to 95%.

[0051] In a specific embodiment, the light-transmitting insulating layer 52 may include photoresist, facilitating exposure and etching after photoresist material deposition to form the light-transmitting insulating layer 52. Specifically, the photoresist may include one or more of photoolefin monomer photoresist, azidoquinone photoresist, or polyvinyl alcohol laurate photoresist, to give the formed light-transmitting insulating layer 52 good light transmittance. Specifically, the light transmittance of the light-transmitting insulating layer 52 is greater than or equal to 80%, to reduce the obstruction of emitted light by the light-transmitting insulating layer 52, further reducing emitted light loss. Specifically, the light transmittance of the light-transmitting insulating layer 52 can be any value among 80%, 83%, 85%, 90%, or 95%.

[0052] See Figure 1 In a specific embodiment, the pixel definition layer 3 also has a protrusion 31 on the side facing the hanging structure 5, which is used to support the hanging structure 5 so that the hanging structure 5 has sufficient height to facilitate the evaporation of the organic light-emitting layer 42 and the cathode 43. The evaporation angle can be changed by the eaves structure so that the cathode 43 covers the organic light-emitting layer 42. Specifically, the projection of the protrusion 31 on the substrate 1 along the stacking direction Z of the display panel is located within the projection of the light-transmitting insulating layer 52 on the substrate 1 along the stacking direction Z, so that the light-transmitting insulating layer 52 can block the light-transmitting conductive layer 51 disposed on the protrusion 31 to form an eaves structure.

[0053] A light-transmitting conductive layer 51 is disposed between the light-transmitting insulating layer 52 and the protrusion 31, and the projection of the light-transmitting conductive layer 51 on the substrate 1 along the stacking direction Z is located within the projection of the light-transmitting insulating layer 52 on the substrate 1 along the stacking direction Z, so that the light-transmitting insulating layer 52 can block the light-transmitting conductive layer 51, forming an eaves structure. Specifically, the light-transmitting conductive layer 51 at least covers a portion of the surface of the sidewalls on both sides of the protrusion 31 along the first direction X, so that the cathode 43 of the sub-pixel 4 can overlap with the light-transmitting conductive layer 51, thereby realizing the electrical connection between the cathode 43 and the light-transmitting conductive layer 51; wherein, the first direction X is perpendicular to the stacking direction Z.

[0054] It is understandable that although the light-transmitting conductive layer 51 has high light transmittance, it will still inevitably absorb and reflect a small amount of emitted light. In this embodiment, by providing the protrusion 31 to support the height of the suspension structure 5, the thickness d of the light-transmitting conductive layer 51 can be made smaller, thereby reducing the absorption and reflection of emitted light by the light-transmitting conductive layer 51 and further reducing emitted light loss. In addition, reducing the thickness of the light-transmitting conductive layer 51 can also reduce the difficulty of the manufacturing process. Specifically, the thickness d of the light-transmitting conductive layer 51 is greater than or equal to 20 nm and less than or equal to 100 nm, so as to reduce the absorption and reflection of emitted light by the light-transmitting conductive layer 51 while ensuring the conductivity of the light-transmitting conductive layer 51. Specifically, the thickness d of the light-transmitting conductive layer 51 can be any value among 20 nm, 40 nm, 60 nm, 80 nm or 100 nm.

[0055] Furthermore, the transmittance of the pixel definition layer 3 is greater than or equal to 85% to reduce the obstruction of the emitted light by the protrusion 31, allowing the emitted light to pass through the protrusion 31 and further reducing emitted light loss. Specifically, the transmittance of the pixel definition layer 3 can be any value among 85%, 87%, 90%, 95%, or 98%.

[0056] Furthermore, the refractive index of the pixel definition layer 3 is greater than or equal to 1.4 and less than or equal to 1.7, so that the emitted light is refracted by the protrusions 31 of the pixel definition layer 3 before being emitted, thereby increasing the viewing angle range of the display panel. Specifically, the refractive index of the pixel definition layer 3 can be any value of 1.4, 1.5, 1.6, or 1.7. Specifically, the pixel definition layer 3 may include polyimide and / or polycarbonate.

[0057] like Figure 1As shown, in a specific embodiment, the anode 41 is disposed on the side surface of the driving substrate 2 facing the pixel definition layer 3 and located within the pixel accommodating area, and is etched into a preset pattern. The pixel definition layer 3 is disposed between the anodes 41 of adjacent sub-pixels 4 to space the anodes 41 between the sub-pixels 4, preventing the anodes 41 of adjacent sub-pixels 4 from conducting to each other and affecting the display effect of the display panel. Specifically, the height of the pixel definition layer 3 along the stacking direction Z can also be greater than the height of the anodes 41 along the stacking direction Z, to further ensure that the anodes 41 of the sub-pixels 4 cannot conduct to each other; preferably, the two sides of the pixel definition layer 3 can also cover part of the anodes 41.

[0058] An organic light-emitting layer 42 is disposed on the surface of the anode 41 facing away from the driving substrate 2. In a specific embodiment, the organic light-emitting layer 42 can be deposited on the display panel by vapor deposition; the organic light-emitting layer 42 covers the anode 41 and partially covers the first pixel definition layer 3 to completely cover the anode 41, preventing the subsequently vapor-deposited cathode 43 from contacting and conducting with the anode 41, thus avoiding any impact on the display effect. Of course, the organic light-emitting layer 42 can also partially cover the pixel definition layer 3 to completely cover the anode 41.

[0059] The cathode 43 is disposed on the surface of the organic light-emitting layer 42 facing away from the anode 41. The cathode 43 can also be deposited on the surface of the organic light-emitting layer 42 by evaporation source. During the evaporation process, the evaporation angle can be changed so that the cathode 43 overlaps the second metal layer, so that the cathode 43 is in contact with the light-transmitting conductive layer 51, and the cathode 43 of the sub-pixel 4 is connected to the common cathode 43.

[0060] In a specific embodiment, the display panel may further include an etch protection layer 6, a first encapsulation layer 7, and a second encapsulation layer 8. The etch protection layer 6 is used to protect the sub-pixels 4 of other colors during the fabrication of the display panel from etching, preventing damage to the fabricated sub-pixels 4 in subsequent fabrication processes. Specifically, the etch protection layer 6 is disposed on the side of the cathode 43 facing away from the organic light-emitting layer 42 and covers the surface of the cathode 43, with one end of the etch protection layer 6 overlapping the second insulating layer to provide etch protection for each film layer of the sub-pixel 4. The etch protection layer 6 may include a non-conductive inorganic material; specifically, the etch protection layer 6 may include a silicon-containing inorganic material, such as a SiNx-based inorganic material.

[0061] After all sub-pixels 4 are fabricated, a first encapsulation layer 7 and a second encapsulation layer 8 can be deposited on the display panel to encapsulate the entire display panel. Specifically, the first encapsulation layer 7 covers the side of the etched protective layer 6 facing away from the driving substrate 2; the second encapsulation layer 8 covers the side of the first encapsulation layer 7 facing away from the driving substrate 2. The first encapsulation layer 7 can be an organic encapsulation layer, and the second encapsulation layer 8 can be an inorganic encapsulation layer.

[0062] This application provides a display panel, which includes a substrate 1, a driving substrate 2, a pixel definition layer 3, sub-pixels 4, and a hanging structure 5. The driving substrate 2 is disposed on the substrate 1. The pixel definition layer 3 is disposed on the driving substrate 2 and protrudes from the driving substrate 2, forming a pixel receiving area. The sub-pixels 4 are disposed within the pixel receiving area. The sub-pixels 4 include an anode 41, an organic light-emitting layer 42, and a cathode 43, sequentially stacked from near the driving substrate 2 towards away from the driving substrate 2. The hanging structure 5 is disposed on the pixel definition layer 3 and protrudes from the pixel receiving area. The hanging structure 5 includes a light-transmitting conductive layer 51 and a light-transmitting insulating layer 52 that blocks the light-transmitting conductive layer 51. The light-transmitting conductive layer 51 is electrically connected to the driving substrate 2 and is in contact with the cathode 43. By using a light-transmitting conductive layer 51 and a light-transmitting insulating layer 52 to form a suspension structure 5, the emitted light that would otherwise be blocked or absorbed by the suspension structure 5 can pass through the suspension structure 5, effectively reducing the emitted light loss, improving the light extraction efficiency of the display panel, reducing the driving current required for the display panel to emit light of the same brightness, thereby reducing the energy consumption of the display panel and effectively extending its service life.

[0063] See Figure 2 , Figure 2 This is a schematic diagram of the structure of a display device provided in one embodiment of this application; this application also provides a display device for displaying images. The display device includes the display panel 100 involved in any of the above embodiments. This display device can effectively reduce emitted light loss, improve the light extraction efficiency of the display panel, reduce the driving current required for the display panel to emit light of the same brightness, thereby reducing the energy consumption of the display panel and effectively extending its service life.

[0064] See Figures 3-7 , Figure 3 A schematic flowchart illustrating a method for fabricating a display panel according to an embodiment of this application; Figure 4 for Figure 3 A schematic diagram of the structure corresponding to step S1 in the middle section; Figure 5a for Figure 3 A schematic diagram of the structure corresponding to step S21; Figure 5b This is a schematic diagram of the structure corresponding to step S22;

[0065] Figure 6a for Figure 3 A schematic diagram of the structure corresponding to step S31 in the middle section; Figure 6b for Figure 3 A schematic diagram of the structure corresponding to step S32 in the middle section; Figure 7 for Figure 3 A schematic diagram of the structure corresponding to step S4. This application also provides a method for manufacturing a display panel, used to manufacture the display panel involved in any of the above embodiments. The specific steps of this method include:

[0066] Step S1: Provide a preform; the preform includes a substrate, a driving substrate, a pixel definition layer and an anode; wherein, the pixel definition layer protrudes from the driving substrate to form a pixel receiving area; the anode is disposed in the pixel receiving area.

[0067] Specifically, such as Figure 4 As shown, a driving circuit layer and other structures are fabricated on one side of the substrate 1 to form a driving substrate 2. Then, an anode conductive material is deposited on the side of the driving substrate 2 away from the substrate 1 and etched into a preset pattern to form an anode 41. Next, a light-transmitting insulating material is deposited on the surface of the driving substrate 2 not covered by the anode 41 to form a pixel definition layer 3, and the edge of the pixel definition layer 3 covers the edge of the anode 41. The height of the pixel definition layer 3 along the stacking direction Z is greater than the thickness of the anode 41 along the stacking direction Z, and several openings are formed around it, i.e., pixel accommodating areas.

[0068] Specifically, the steps for forming pixel definition layer 3 include:

[0069] Step S11: Deposit a light-transmitting insulating material on the side of the driving substrate away from the substrate.

[0070] Specifically, the light-transmitting insulating material can be polyimide and / or polycarbonate, and the light transmittance of the pixel definition layer 3 is greater than or equal to 85% to reduce the obstruction of the emitted light by the protrusion 31, allowing the emitted light to pass through the protrusion 31 and further reducing emitted light loss. Specifically, the light transmittance of the pixel definition layer 3 can be any value among 85%, 87%, 90%, 95%, or 98%. The refractive index of the pixel definition layer 3 is greater than or equal to 1.4 and less than or equal to 1.7, so that the emitted light is refracted by the protrusion 31 of the pixel definition layer 3 and emitted, thereby increasing the viewing angle range of the display panel; specifically, the refractive index of the pixel definition layer 3 can be any value among 1.4, 1.5, 1.6, or 1.7. The light-transmitting insulating material covers the surface of the anode 41 and the surface of the driving substrate 2 not covered by the anode 41.

[0071] Step S12: The light-transmitting insulating material is etched using a half-exposure process to form a pixel definition layer; wherein, the side of the pixel definition layer away from the driving substrate has a protrusion.

[0072] In the specific implementation process, a halftone mask with light-transmitting and semi-light-transmitting areas is used to expose and etch the light-transmitting insulating material to form a pixel definition layer 3 with protrusions 31. Specifically, the light-transmitting area of ​​the halftone mask is aligned with the anode 41 to etch the portion of the light-transmitting insulating material covering the anode 41, exposing the anode 41. The opaque and semi-light-transmitting areas of the halftone mask, corresponding to the portions of the light-transmitting insulating material, form a stepped pixel definition layer 3; the portion of the light-transmitting insulating material corresponding to the opaque area of ​​the halftone mask forms the protrusions 31, which support the suspended structure 5 to ensure the suspended structure 5 has sufficient height.

[0073] Step S2: Deposit and pattern a transparent conductive material on the pixel definition layer to form a transparent conductive layer.

[0074] In the specific implementation process, step S2 specifically includes:

[0075] Step S21: Deposit a transparent conductive oxide material on the pixel definition layer surface and the anode surface to form a conductive oxide layer.

[0076] Specifically, such as Figure 5a As shown, at least one of conductive oxides such as indium tin oxide, zinc aluminum oxide, zinc gallium oxide, and tin fluoride oxide is deposited on the surface of the pixel definition layer 3 away from the driving substrate 2 and on the surface of the anode 41 away from the driving substrate 2 to form a conductive oxide layer 510. The thickness d of the conductive oxide layer 510 is greater than or equal to 20 nm and less than or equal to 100 nm. Specifically, the thickness d of the conductive oxide layer 510 can be any value among 20 nm, 40 nm, 60 nm, 80 nm, or 100 nm.

[0077] Step S22: Pattern the conductive oxide layer using an exposure etching method to form a light-transmitting conductive layer, and make the light-transmitting conductive layer at least cover a portion of the surface of the sidewalls on both sides of the protrusion along the first direction; wherein, the first direction is perpendicular to the stacking direction.

[0078] Specifically, such as Figure 5bAs shown, the conductive oxide layer 510 is exposed and etched using a mask to remove the conductive oxide layer 510 on the surface of the anode 41 and a portion of the conductive oxide layer 510 on the surface of the pixel definition layer 3, while retaining a portion of the conductive oxide layer 510 on the surface of the protrusion 31 to form a light-transmitting conductive layer 51. Specifically, the light-transmitting conductive layer 51 at least covers a portion of the sidewalls of the protrusion 31 along both sides of the first direction X, and the surface of the protrusion 31 away from the driving substrate 2. Specifically, the thickness d of the light-transmitting conductive layer 51 is greater than or equal to 20 nm and less than or equal to 100 nm to reduce the absorption and reflection of emitted light by the light-transmitting conductive layer 51 while ensuring the conductivity of the light-transmitting conductive layer 51; specifically, the thickness d of the light-transmitting conductive layer 51 can be any value among 20 nm, 40 nm, 60 nm, 80 nm, or 100 nm.

[0079] Step S3: Deposit a light-transmitting insulating material on the light-transmitting conductive layer and pattern it to form a light-transmitting insulating layer, and make the light-transmitting insulating layer block the light-transmitting conductive layer to form a hanging structure.

[0080] In the specific implementation process, step S3 specifically includes:

[0081] Step S31: Deposit a light-transmitting insulating material on the surface of the light-transmitting conductive layer, the surface of the pixel definition layer, and the anode surface to form a light-transmitting insulating material layer.

[0082] Specifically, such as Figure 6a As shown, at least one of the following photoresists, such as photoresist, azidoquinone photoresist, or polyvinyl alcohol laurate photoresist, is deposited on the surface of the transparent conductive layer 51 away from the pixel definition layer 3, the surface of the pixel definition layer 3 not covered by the transparent conductive layer 51, and the surface of the anode 41 away from the driving substrate 2, to form a transparent insulating material layer 520.

[0083] Step S32: Pattern the light-transmitting insulating material using an exposure etching method to form a light-transmitting insulating layer.

[0084] Specifically, such as Figure 6b As shown, the light-transmitting insulating material layer 520 is exposed and etched using a mask to remove the light-transmitting insulating material layer 520 on the surface of the anode 41 and the pixel definition layer 3, as well as the light-transmitting insulating material layer 520 on the surface of the light-transmitting conductive layer 51 located on the sidewall of the protrusion 31; and retains a portion of the light-transmitting insulating material layer 520 corresponding to the end of the protrusion 31 away from the driving substrate 2 to form a light-transmitting insulating layer 52. At the same time, by controlling the exposure and stripping conditions, the light-transmitting insulating layer 52 can block the light-transmitting conductive layer 51 to form an eaves structure; so that when the organic light-emitting layer 42 and the cathode 43 are deposited by vapor deposition, the evaporation angle can be changed by the eaves structure so that the cathode 43 covers the organic light-emitting layer 42.

[0085] Specifically, the light-transmitting insulating layer 52 and the light-transmitting conductive layer 51 form a pendant structure 5; the two ends of the light-transmitting insulating layer 52 protrude from the light-transmitting conductive layer 51 along the first direction X, and the projection of the light-transmitting conductive layer 51 on the substrate 1 along the stacking direction Z is located within the projection of the light-transmitting insulating layer 52 on the substrate 1 along the stacking direction Z.

[0086] Step S4: On the side of the anode away from the driving substrate, organic light-emitting material and cathode conductive material are sequentially vapor-deposited to form an organic light-emitting layer and a cathode, and the cathode is made to be in contact with the light-transmitting conductive layer.

[0087] In the specific implementation process, the organic light-emitting layer 42 can be deposited on the display panel by vapor deposition and completely cover the anode 41; the cathode 43 can also be deposited on the surface of the organic light-emitting layer 42 by vapor deposition; the anode 41, the organic light-emitting layer 42 and the cathode 43 together form the sub-pixel 4.

[0088] Specifically, during the vapor deposition process, the evaporation angle can be changed by the roof structure formed by the light-transmitting conductive layer 51 and the light-transmitting insulating layer 52, so that the cathode 43 completely covers the organic light-emitting layer 42 and at least partially covers the pixel definition layer 3, while the cathode 43 covers part of the surface of the light-transmitting conductive layer 51 to separate the organic light-emitting layer 42 from the light-transmitting conductive layer 51.

[0089] like Figure 1 As shown, in the specific implementation process, after step S4, it may also include: depositing inorganic material on the side of the cathode away from the organic light-emitting layer and on the surface of the overhanging structure to form an etching protective layer; and making the etching protective layer overlap with the overhanging structure.

[0090] Specifically, the etched protective layer 6 covers part of the surface of the light-transmitting insulating layer 52 and overlaps the surface of the light-transmitting insulating layer 52 to protect the internal film structure.

[0091] In the specific implementation process, after the step of forming the etching protective layer 6, it may also include: depositing organic materials and inorganic materials sequentially on the side of the etching protective layer away from the cathode to form a first encapsulation layer and a second encapsulation layer.

[0092] Specifically, an organic material is deposited on the surface of the etched protective layer 6 facing away from the driving substrate 2 and on the surface of the light-transmitting insulating layer 52 that is not covered to form a first encapsulation layer 7, and the surface of the first encapsulation layer 7 facing away from the driving substrate 2 is planarized; then an inorganic material is deposited on the surface of the first encapsulation layer 7 facing away from the driving substrate 2 to form a second encapsulation layer 8, so as to form a... Figure 1 The display panel shown.

[0093] This application provides a method for fabricating a display panel by providing a preform 10. The preform 10 includes a substrate 1, a driving substrate 2, a pixel definition layer 3, and an anode 41. The pixel definition layer 3 protrudes from the driving substrate 2 to form a pixel receiving area. The anode 41 is disposed within the pixel receiving area. Then, a light-transmitting conductive material is deposited on the pixel definition layer 3 and patterned to form a light-transmitting conductive layer 51. Next, a light-transmitting insulating material is deposited on the light-transmitting conductive layer 51 and patterned to form a light-transmitting insulating layer 52, and the light-transmitting insulating layer 52 blocks the light-transmitting conductive layer 51 to form a hanging structure 5. Finally, an organic light-emitting material and a cathode 43 conductive material are sequentially vapor-deposited on the side of the anode 41 away from the driving substrate 2 to form an organic light-emitting layer 42 and a cathode 43, and the cathode 43 is disposed in contact with the light-transmitting conductive layer 51. Thus, by using a light-transmitting conductive layer 51 and a light-transmitting insulating layer 52 to form a suspension structure 5, the emitted light that would otherwise be blocked or absorbed by the suspension structure 5 can pass through the suspension structure 5, effectively reducing the loss of emitted light, improving the light extraction efficiency of the display panel, reducing the driving current required for the display panel to emit light of the same brightness, thereby reducing the energy consumption of the display panel and effectively extending its service life.

[0094] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A display panel, characterized by, The display panel comprises: a substrate; a driving substrate disposed on the substrate; a pixel definition layer disposed on the driving substrate; the pixel definition layer protrudes from the driving substrate and forms a pixel containing area; a sub-pixel disposed in the pixel containing area; the sub-pixel comprises an anode, an organic light-emitting layer and a cathode which are sequentially stacked from the side close to the driving substrate to the side away from the driving substrate; an overhanging structure disposed on the pixel definition layer and protruding from the pixel containing area; the overhanging structure comprises a light-transmitting conductive layer and a light-transmitting insulating layer shielding the light-transmitting conductive layer; the light-transmitting conductive layer is in contact with the cathode; wherein the side of the pixel definition layer facing the overhanging structure has a protruding portion for supporting the overhanging structure; and the projection of the protruding portion on the substrate along the stacking direction of the display panel is located within the projection of the light-transmitting insulating layer on the substrate along the stacking direction; the light-transmitting conductive layer is disposed between the light-transmitting insulating layer and the protruding portion; and the light-transmitting conductive layer covers at least part of the surface of the sidewall on both sides of the protruding portion along a first direction; wherein the first direction is perpendicular to the stacking direction.

2. The display panel of claim 1, wherein: the light-transmitting insulating layer comprises a photoresist, and the photoresist comprises one or more of a photoolefin monomer photoresist, an azidoquinone photoresist or a polyvinyl laurate photoresist; the light-transmitting conductive layer comprises a light-transmitting conductive oxide, and the light-transmitting conductive oxide comprises indium tin oxide.

3. The display panel of claim 2, wherein: the light-transmitting rate of the light-transmitting conductive layer is greater than or equal to 90%; and the light-transmitting rate of the light-transmitting insulating layer is greater than or equal to 80%.

4. The display panel of claim 1, wherein: the thickness of the light-transmitting conductive layer is greater than or equal to 20 nm and less than or equal to 100 nm.

5. The display panel of claim 1, wherein: the light-transmitting rate of the pixel definition layer is greater than or equal to 85%; and the refractive index of the pixel definition layer is greater than or equal to 1.4 and less than or equal to 1.

7.

6. The display panel of claim 5, wherein: the pixel definition layer comprises polyimide and / or polycarbonate.

7. A display device, characterized by comprising: The display panel comprises any one of claims 1-6.

8. A method for manufacturing a display panel, characterized by, The display panel comprises: providing a preform; the preform comprises a substrate, a driving substrate, a pixel definition layer and an anode; wherein the pixel definition layer protrudes from the driving substrate to form a pixel containing area; and the anode is disposed in the pixel containing area; depositing a light-transmitting conductive material on the pixel definition layer and patterning to form a light-transmitting conductive layer; depositing a light-transmitting insulating material on the light-transmitting conductive layer and patterning to form a light-transmitting insulating layer, and making the light-transmitting insulating layer shield the light-transmitting conductive layer to form an overhanging structure; evaporating and depositing an organic light-emitting material and a cathode conductive material on the side of the anode away from the driving substrate to form an organic light-emitting layer and a cathode, and making the cathode in contact with the light-transmitting conductive layer; The pixel definition layer has a protruding portion on the side away from the driving substrate; and a projection of the protruding portion on the substrate along the stacking direction of the display panel is located within a projection of the light-transmitting insulating layer on the substrate along the stacking direction; and the step of depositing a light-transmitting conductive material on the pixel definition layer and patterning to form a light-transmitting conductive layer specifically comprises: depositing a light-transmitting conductive oxide material on the surface of the pixel definition layer and the surface of the anode to form a conductive oxide layer; patterning the conductive oxide layer by exposure etching to form the light-transmitting conductive layer, and making the light-transmitting conductive layer cover at least part of the surface of the sidewall of the protruding portion on both sides along a first direction; wherein the first direction is perpendicular to the stacking direction.

Images