Display module, manufacturing method thereof and display device

Abstract

The embodiment of the invention discloses a display module, a manufacturing method thereof and a display device. In one specific implementation mode, the display module comprises a display substrate and a cover plate, the display substrate comprises a driving circuit layer and a light-emitting structure layer which are arranged in a stacked mode, the driving circuit layer comprises a plurality of thin film transistors, and the display module further comprises a first shielding layer arranged on the first side of the driving circuit layer; the second shielding layer is arranged on the second side of the driving circuit layer; the first shielding layer and the second shielding layer are electrically connected through the connecting part, and the orthographic projection of the thin film transistor on the cover plate is located in the orthographic projection edge of the first shielding layer on the cover plate and located in the orthographic projection edge of the second shielding layer on the cover plate. According to the embodiment, the first shielding layer and the second shielding layer which are electrically connected are arranged on the two sides of the driving circuit layer, a Faraday cage of the thin film transistor is formed, and electrostatic shielding protection is formed on the thin film transistor.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and more specifically, to a display module and a manufacturing method thereof, and a display device. Background Art

[0002] As the display technology of organic light emitting diode (OLED) becomes more and more mature, the market of OLED display screens becomes more and more extensive. For example, in the fields of wearable, folding, and automotive, the market share of OLED display products is also increasing. However, with the emergence of some new usage scenarios, some related and new defects have also begun to appear. For example, in some actual vehicle-mounted usage scenarios, because the customer's air-conditioning products have the "negative ion wind" function, the OLED display screen needs to be used in an electrostatic field environment for a long time. In a strong electric field environment, the characteristics of the thin film transistor (TFT) in the display product will shift accordingly, resulting in black light screen brightness, abnormal screen display, no display, split screen and other TFT characteristic shift-related defects.

[0003] Therefore, a new design is needed that can keep the TFT of display products stable in an electrostatic field environment. Summary of the invention

[0004] The purpose of the present disclosure is to provide a display module and a manufacturing method thereof, and a display device to solve at least one of the problems existing in the prior art.

[0005] In order to achieve the above objectives, the present invention adopts the following technical solutions:

[0006] The first aspect of the present disclosure provides a display module, including a display substrate and a cover plate, wherein the display substrate includes a driving circuit layer and a light-emitting structure layer stacked in layers, wherein the driving circuit layer includes a plurality of thin film transistors, and the display module further includes:

[0007] A first shielding layer disposed on a first side of the driving circuit layer, the first side being close to a screen side of the display module;

[0008] a second shielding layer disposed on a second side of the driving circuit layer, the second side being an opposite side to the first side; and

[0009] The connection part will

[0010] The first shielding layer and the second shielding layer are electrically connected,

[0011] The orthographic projection of the thin film transistor on the cover plate is located within the edge of the orthographic projection of the first shielding layer on the cover plate and is located within the edge of the orthographic projection of the second shielding layer on the cover plate.

[0012] In some optional embodiments,

[0013] The first shielding layer is arranged between the display substrate and the cover plate.

[0014] In some optional embodiments, the display module further includes: a polarizer disposed between the display substrate and the cover plate,

[0015] The first shielding layer is disposed between the polarizer and the display substrate, or

[0016] The first shielding layer is arranged between the polarizer and the cover plate.

[0017] In some optional embodiments, the display substrate further includes: a light shielding layer disposed on the second side of the driving circuit layer, and a touch control layer disposed between the light emitting structure layer and the cover plate.

[0018] The second shielding layer is disposed in the light shielding layer, and

[0019] The first shielding layer is arranged in the touch control layer.

[0020] In some optional embodiments,

[0021] The orthographic projection of the driving circuit layer on the cover plate falls within the edge of the orthographic projection of the first shielding layer on the cover plate.

[0022] The connecting portion is at least one silver glue dot, and the silver glue dot partially covers the first shielding layer and the second shielding layer.

[0023] In some optional embodiments, the driving circuit layer includes: a first gate layer and a first source-drain metal layer,

[0024] The connecting part includes: a first connecting part and a second connecting part,

[0025] The first connection portion is disposed in the first gate layer, and the second connection portion is disposed in the first source-drain metal layer.

[0026] In some optional embodiments, the driving circuit layer includes: a first gate layer, a second gate layer, a third gate layer, a first source-drain metal layer, a second source-drain metal layer, and a third source-drain metal layer.

[0027] The connecting portion includes at least two of a first connecting portion, a second connecting portion, a third connecting portion, a fourth connecting portion, a fifth connecting portion, and a sixth connecting portion,

[0028] The first connection part is arranged in the first gate layer, the second connection part is arranged in the second gate layer, the third connection part is arranged in the third gate layer, the fourth connection part is arranged in the first source-drain metal layer, the fifth connection part is arranged in the second source-drain metal layer, and the sixth connection part is arranged in the third source-drain metal layer.

[0029] In some optional embodiments, the first shielding layer is a whole layer structure or a grid structure covering the driving circuit layer.

[0030] The second shielding layer is a whole layer structure or a grid structure covering the driving circuit layer.

[0031] In some optional embodiments, the thickness of the first shielding layer is greater than or equal to 0.1 μm and less than or equal to 1.0 μm.

[0032] In some optional embodiments, the material of the first shielding layer is transparent metal oxide.

[0033] A second aspect of the present disclosure provides a display device, comprising the display module described above.

[0034] A third aspect of the present disclosure provides a method for manufacturing the display module described above, comprising:

[0035] forming a driving circuit layer;

[0036] forming a first shielding layer on a first side of the driving circuit layer;

[0037] forming a second shielding layer on a second side of the driving circuit layer; and

[0038] A connection portion is formed, the connection portion electrically connecting the first shielding layer and the second shielding layer.

[0039] In some optional embodiments, forming a first shielding layer on the first side of the driving circuit layer further comprises:

[0040] forming a first shielding layer on the cover plate to form a first substrate;

[0041] forming a polarizer on the driving circuit layer to form a second substrate;

[0042] Laminating the first shielding layer side of the first substrate to the polarizer side of the second substrate, or

[0043] forming a first shielding layer on the polarizer to form a first substrate;

[0044] Laminating the driving circuit layer to the first shielding layer side or the polarizer side of the first substrate to form a second substrate;

[0045] A cover plate is formed on the second substrate away from the driving circuit layer, or

[0046] forming a polarizer on the driving circuit layer;

[0047] forming a first shielding layer on the polarizer;

[0048] A cover plate is formed on the first shielding layer.

[0049] The beneficial effects of the present disclosure are as follows:

[0050] In response to the existing problems, the present disclosure develops a display module and a manufacturing method thereof, as well as a display device, and provides a first shielding layer and a second shielding layer electrically connected via a connecting portion on both sides of the driving circuit layer, thereby forming a "Faraday cage" structure surrounding the driving circuit layer in the display product, and utilizing the "Faraday cage" to form electrostatic shielding protection for the thin film transistors in the driving circuit layer, thereby preventing the thin film transistors from having characteristic deviations in an electrostatic environment, ensuring normal display of the display product in an electrostatic environment, improving display effects and product life, and having broad application prospects. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] The specific implementation methods of the present disclosure are further described in detail below with reference to the accompanying drawings.

[0052] Figure 1 A schematic cross-sectional view of a display module according to an embodiment of the present disclosure is shown;

[0053] Figure 2 A schematic top view of a display module according to an embodiment of the present disclosure is shown;

[0054] Figure 3 A schematic cross-sectional view showing a display module according to another embodiment of the present disclosure;

[0055] Figure 4 A schematic cross-sectional view showing a display module according to another embodiment of the present disclosure;

[0056] Figures 5 to 8 A process flow chart of a method for manufacturing a display module according to an embodiment of the present disclosure is shown. DETAILED DESCRIPTION

[0057] In order to more clearly illustrate the present disclosure, the present disclosure is further described below in conjunction with the embodiments and drawings. Similar components in the drawings are represented by the same or similar reference numerals. It should be understood by those skilled in the art that the content specifically described below is illustrative rather than restrictive, and should not be used to limit the scope of protection of the present disclosure.

[0058] It should be noted that the words “having”, “including”, “comprising”, etc. described in the present disclosure are all open-ended meanings, that is, when describing that a module “has”, “including”, or “comprising” a first element, a second element, and / or a third element, it means that the module includes other elements in addition to the first element, the second element, and / or the third element. In addition, ordinal numbers such as “first”, “second”, and “third” in the present disclosure are not intended to limit a specific order, but are only used to distinguish between various parts.

[0059] The terms “on”, “formed on” and “disposed on” in the present disclosure may mean that one layer is directly formed or disposed on another layer, or may mean that one layer is indirectly formed or disposed on another layer, i.e., there are other layers between the two layers.

[0060] In addition, in the present disclosure, the term "co-layer arrangement" used refers to two layers, parts, components, elements or parts that can be formed by the same preparation process (such as a patterning process, etc.), and the two layers, parts, components, elements or parts are generally formed of the same material. For example, two or more functional layers are co-layered, which means that these co-layered functional layers can be formed using the same material layer and the same preparation process, thereby simplifying the preparation process of the display substrate.

[0061] In order to solve the above technical problems, the embodiment of the present disclosure provides a display module, including a display substrate and a cover plate, the display substrate includes a driving circuit layer and a light-emitting structure layer stacked, the driving circuit layer includes a plurality of thin film transistors, and the display module also includes:

[0062] A first shielding layer disposed on a first side of the driving circuit layer, the first side being close to a screen side of the display module;

[0063] a second shielding layer disposed on a second side of the driving circuit layer, the second side being an opposite side to the first side; and

[0064] The connection part will

[0065] The first shielding layer and the second shielding layer are electrically connected,

[0066] The orthographic projection of the thin film transistor on the cover plate is located within the edge of the orthographic projection of the first shielding layer on the cover plate and is located within the edge of the orthographic projection of the second shielding layer on the cover plate.

[0067] In this embodiment, a first shielding layer and a second shielding layer electrically connected via a connecting portion are provided on both sides of the driving circuit layer, thereby forming a "Faraday cage" structure surrounding the driving circuit layer in the display product, and utilizing the "Faraday cage" to form electrostatic shielding protection for the thin film transistors in the driving circuit layer, thereby preventing the thin film transistors from having characteristic deviations in an electrostatic environment, ensuring normal display of the display product in an electrostatic environment, and improving display effects and product life.

[0068] In one embodiment, see Figure 1 As shown, the display module includes a display substrate 100-1 and a cover plate 106 covering the display substrate 100-1. The display substrate 100-1 includes a stacked driving circuit layer 101 and a light emitting structure layer 111. Those skilled in the art should understand that the cover plate 106 is arranged on the screen side of the display substrate 100-1, that is, the light emitting side of the light emitting structure layer 111.

[0069] The light-emitting unit is arranged in the light-emitting structure layer 111, and the driving circuit layer 101 includes a plurality of thin film transistors (TFT) T, which are used to form a pixel driving circuit for driving the light-emitting unit to emit light, and a peripheral circuit for providing a scanning signal or a light-emitting control signal to the thin film transistor T in the pixel driving circuit. Of course, if the display product has specific needs, the thin film transistor T will also be used to form various other circuits that provide voltage and current signals.

[0070] Of course, the present disclosure does not intend to specifically limit the type of light-emitting unit. In addition to OLED, the light-emitting unit may also be a quantum dot light-emitting diode (QLED) or a micro light-emitting diode (Micro LED). As long as the circuit structure composed of thin film transistors is required to assist the display panel in displaying the picture, it is within the protection scope of the embodiments of the present disclosure.

[0071] In particular, the display module further includes a driving circuit layer 101, a first shielding layer 102-1 disposed on a first side of the driving circuit layer 101, a second shielding layer 103-1 disposed on a second side of the driving circuit layer 101, and a connecting portion 104-1. The first side is close to the light-emitting side of the display module, and the second side is far away from the light-emitting side of the display module, or the second side is the opposite side of the first side, and the connecting portion 104-1 electrically connects the first shielding layer 102-1 and the second shielding layer 103-1. The orthographic projection of the thin film transistor T on the cover plate 106 is located within the orthographic projection edge of the first shielding layer 102-1 on the cover plate 106 and is located within the orthographic projection edge of the second shielding layer 103-1 on the cover plate 106.

[0072] The above arrangement provides a first shielding layer 102-1 and a second shielding layer 103-1 on both sides of the driving circuit layer 101, and uses the connecting portion 104-1 to electrically connect the two metal layers. At the same time, the orthographic projection of the thin film transistor T on the cover plate 106 is located within the orthographic projection edge of the first shielding layer 102-1 on the cover plate 106 and is located within the orthographic projection edge of the second shielding layer 103-1 on the cover plate 106, so that the first shielding layer 102-1 and the second shielding layer 103-1 are at the same potential, so that the first shielding layer 102-1, the second shielding layer 103-1 and the connecting portion 104-1 constitute an equipotential cavity that encloses all the thin film transistors T, that is, a "Faraday cage". The driving circuit layer 101 is placed within the "Faraday cage" and is not affected by the external electric field. Therefore, even if the display module works in an electrostatic environment for a long time, the characteristics of the thin film transistors in the driving circuit layer 101 are not affected, and are not offset due to the influence of the electrostatic environment, thereby avoiding a series of display defects caused by the offset of the thin film transistor, thereby improving the display effect and product life.

[0073] It should be noted that the embodiments of the present application are not intended to limit the specific positional relationship between the connecting portion 104-1 and the thin film transistor T. It is used to electrically connect the first shielding layer 102-1 and the second shielding layer 103-1 to the same electric potential. As long as the first shielding layer 102-1 and the second shielding layer 103-1 are in an orthographic projection relationship and their outer edges surround the thin film transistor T, electrostatic shielding protection for the thin film transistor T can be formed, and an equipotential cavity in a functional sense can be formed to form a "Faraday cage" with good protection effect, which will not be elaborated below.

[0074] Optionally, the first shielding layer 102 - 1 and the second shielding layer 103 - 1 are grounded, so that the “Faraday cage” structure is at the same ground potential and discharges static charge to the ground.

[0075] Optionally, the first shielding layer 105 is disposed between the display substrate 100 - 1 and the cover plate 106 .

[0076] Specific to Figure 1 In the embodiment shown, the display module further includes a polarizer 105. The first shielding layer 102-1 is disposed between the polarizer 105 and the cover plate 106.

[0077] The first shielding layer 102 - 1 may be directly formed on the substrate on which the display substrate 100 - 1 and the polarizer 105 are bonded together, and then the cover plate 106 is formed on the polarizer 105 .

[0078] The first shielding layer 102-1 can also be first formed on the cover plate 105 to form a first substrate, the display substrate 100-1 and the polarizer 105 are bonded together to form a second substrate, and then the first shielding layer side of the first substrate is bonded to the polarizer side of the second substrate.

[0079] In the above manner, the polarizer 105 or the cover plate 106 is equivalent to the substrate for forming the first shielding layer 102-1, so that the thickness of the first shielding layer 102 can be greatly reduced, for example, the thickness of the first shielding layer 102 can be controlled to be greater than or equal to 0.1 μm and less than or equal to 1.0 μm. Thus, the electrostatic protection of the thin film transistor T in the driving circuit layer 101 can be improved without affecting the overall thickness of the display module too much.

[0080] Optionally, the material of the first shielding layer 102-1 is a transparent metal oxide, such as indium tin oxide (ITO), indium gallium zinc oxide (IGZO), indium zinc oxide (IZO), etc., so that the first shielding layer 102-1 does not affect the light transmittance of the display module.

[0081] Further optionally, the first shielding layer 102-1 and the second shielding layer 103-1 are not necessarily limited to a whole layer structure. In other words, the first shielding layer 102-1 is a whole layer structure covering the driving circuit layer 101, or the first shielding layer is a grid structure, and the second shielding layer 103-1 is a whole layer structure or a grid structure covering the driving circuit layer 101.

[0082] Of course, refer to Figure 1 As shown, other organic layers may be provided between the polarizer 105 and the first shielding layer 102-1, for example, an optically transparent hot melt adhesive film (TOCA) 107 as a protective layer of the display substrate 100. It should be noted that when the optically transparent hot melt adhesive film (TOCA) 107 is provided between the first shielding layer 102-1 and the polarizer 105, the first shielding layer 102-1 should be formed on the cover plate 106 to form a substrate and then bonded to the polarizer 105, which will not be described in detail here.

[0083] In addition, the second shielding layer 103-1 can utilize the existing metal film structure attached to the back of the display substrate 100-1, so as not to increase the thickness of the additional film layer. For example, the second shielding layer 103-1 can be a heat dissipation layer (Super Clean Foam, SCF) attached to the back of the display substrate 100-1. A bottom film (Bottle Film) can also be included between the second shielding layer 103-1 and the display substrate 100-1, which will not be described in detail herein.

[0084] More specifically, combined Figure 1 and Figure 2As shown, the connection part 104-1 is at least one silver glue dot. Specifically, the orthographic projection of the driving circuit layer 101 on the cover plate 106 falls within the edge of the orthographic projection of the first shielding layer 102-1 on the cover plate 106, and the silver glue dot 104-1 partially covers the first shielding layer 102-1 and the second shielding layer 103-1. In order to reduce the influence of the connection part 104-1 on other parts of the display module, the silver glue dot can be located at the edge area of ​​the display module. Among them, Figure 1 Schematically shown Figure 2 along Figure 2 An enlarged cross-sectional view of the area corresponding to the AA' cutout portion.

[0085] In this embodiment, at least one silver glue dot can be formed in the reserved area on the back of the display module by the glue dispensing process. However, it should be pointed out that the present disclosure does not intend to limit the specific number, specific layout, and specific size of the silver glue dots, as long as an effective electrical connection relationship between the first shielding layer 102-1 and the second shielding layer 103-1 can be formed. In addition, the specific position of the silver glue dot may be limited by the structural layout of the back of the display substrate in the specific display product, and the specific size is limited by the size of the reserved space of the specific product, which will not be repeated here.

[0086] In another embodiment, referring to Figure 3 As shown, the display module includes a display substrate 100-1 and a cover plate 106 covering the display substrate 100-1. The display substrate 100-1 includes a stacked driving circuit layer 101 and a light emitting structure layer 111. Those skilled in the art should understand that the cover plate 106 is arranged on the screen side of the display substrate 100-1, that is, the light emitting side of the light emitting structure layer 111.

[0087] Similarly, the light-emitting unit is arranged in the light-emitting structure layer 111, and the driving circuit layer 101 includes a thin film transistor T, which is used to form a pixel driving circuit that drives the light-emitting unit to emit light, and a peripheral circuit that provides a scanning signal or a light-emitting control signal to the thin film transistor T in the pixel driving circuit. Of course, if the display product has specific needs, the thin film transistor T is also used to form various other circuits that provide voltage and current signals.

[0088] Of course, the present disclosure does not intend to specifically limit the type of light-emitting unit. In addition to OLED, the light-emitting unit may also be QLED or Micro LED, etc. As long as the circuit structure formed by the thin film transistor T is required to assist the display panel in displaying the picture, it is within the protection scope of the embodiments of the present disclosure.

[0089] The display module also includes a driving circuit layer 101, a first shielding layer 102-1 disposed on a first side of the driving circuit layer 101, a second shielding layer 103-1 disposed on a second side of the driving circuit layer 101, and a connecting portion 104-1. The first side is close to the light-emitting side of the display module, and the second side is far away from the light-emitting side of the display module, or the second side is the opposite side of the first side, and the connecting portion 104-1 electrically connects the first shielding layer 102-1 and the second shielding layer 103-1. The orthographic projection of the thin film transistor T on the cover plate 106 is located within the orthographic projection edge of the first shielding layer 102-1 on the cover plate 106 and is located within the orthographic projection edge of the second shielding layer 103-1 on the cover plate 106.

[0090] The above arrangement provides a first shielding layer 102-2 and a second shielding layer 103-2 on both sides of the driving circuit layer 101, and uses the connecting portion 104-1 to electrically connect the two layers of metal. At the same time, the orthographic projection of the thin film transistor T on the cover plate 106 is located within the orthographic projection edge of the first shielding layer 102-2 on the cover plate 106 and is located within the orthographic projection edge of the second shielding layer 103-2 on the cover plate 106, so that the first shielding layer 102-2 and the second shielding layer 103-2 are at the same potential, so that the first shielding layer 102-2, the second shielding layer 103-2 and the connecting portion 104-1 constitute an equipotential cavity that encloses all the thin film transistors T, that is, a "Faraday cage". The driving circuit layer 101 is placed within the "Faraday cage" and is not affected by the external electric field. Therefore, even if the display module works in an electrostatic environment for a long time, the characteristics of the thin film transistors in the driving circuit layer 101 are not affected, and are not offset due to the influence of the electrostatic environment, thereby avoiding a series of display defects caused by the offset of the thin film transistor, thereby improving the display effect and product life.

[0091] Optionally, the first shielding layer 102 - 2 and the second shielding layer 103 - 2 are grounded, so that the “Faraday cage” structure is at the same ground potential and discharges static charge to the ground.

[0092] In this embodiment, optionally, the first shielding layer 102 - 2 is disposed between the display substrate 100 - 1 and the polarizer 105 .

[0093] It should be noted that, in this embodiment, the first shielding layer 102-2 can be directly formed on the light-emitting side of the display substrate 100-1, that is, the first shielding layer 102-2 can be directly formed on the stack of the display substrate 100-1, and then the polarizer 205 and the cover plate 106 are formed in sequence. At this time, the thickness of the first shielding layer 202 is relatively thick, and the purpose of using its own thickness to form a film substrate is achieved. At this time, the thickness of the first shielding layer 102-2 can be, for example, greater than or equal to 75 μm and less than or equal to 100 μm.

[0094] Optionally, the first shielding layer 102-2 is first formed on the surface of the polarizer 105 to form a first substrate, and then the first shielding layer side of the first substrate is bonded to the light-emitting side of the display substrate 100-1 to form a second substrate, and a cover plate 106 is formed on the side of the second substrate away from the driving circuit layer 101. In this way, the thickness of the first shielding layer 102-2 can be greatly reduced. For example, the thickness of the first shielding layer 102-2 can be controlled to be greater than or equal to 0.1 μm and less than or equal to 1.0 μm. In this way, the electrostatic protection of the thin film transistors in the driving circuit layer can be improved without affecting the overall thickness of the display module too much.

[0095] and Figure 1 Similar to the embodiment shown, the preferred material of the first shielding layer 102-2 is transparent metal oxide, such that the first shielding layer 102-2 does not affect the light transmittance of the display module, for example, indium tin oxide (ITO), indium gallium zinc oxide (IGZO), indium zinc oxide (IZO), etc.

[0096] Further optionally, the first shielding layer 102-2 and the second shielding layer 103-2 are not necessarily limited to a whole layer structure. In other words, the first shielding layer 102-2 is a whole layer structure covering the driving circuit layer 101, or the first shielding layer 102-2 is a grid structure, and the second shielding layer 103-2 is a whole layer structure or a grid structure covering the driving circuit layer.

[0097] An optically transparent hot melt adhesive film (TOCA) 107 may also be provided between the polarizer 105 and the first shielding layer 102-2 as a protective layer for the display substrate 100-1. Of course, those skilled in the art should understand that when the film layer is included between the two, the first shielding layer 102-2 should be formed by first forming it on the display substrate 100-1 and then forming the polarizer 105 thereon, which will not be described in detail here.

[0098] Similarly, the second shielding layer 103-2 can utilize the existing metal film structure attached to the back of the display substrate 100-1, so as not to increase the thickness of the additional film layer. For example, the second shielding layer 103-2 can be a heat dissipation layer (Super Clean Foam, SCF) attached to the back of the display substrate 100-1. A bottom film (Bottle Film) can also be included between the second shielding layer 103-2 and the display substrate 100, which will not be described in detail herein.

[0099] Similarly, the connection part 104-1 is at least one silver glue dot, and the silver glue dot partially covers the first shielding layer 102-2 and the second shielding layer 103-2. Specifically, the orthographic projection of the driving circuit layer 101 on the cover plate 106 falls within the edge of the orthographic projection of the first shielding layer 102-2 on the cover plate 106, and the silver glue dot 104-1 partially covers the first shielding layer 102-2 and the second shielding layer 103-2. In order to reduce the influence of the connection part 104-1 on other parts of the display module, the silver glue dot can be located at the edge area of ​​the display module.

[0100] In this embodiment, at least one silver glue dot can be formed in the reserved area on the back of the display module by the glue dispensing process. However, it should be pointed out that the present disclosure does not intend to limit the specific number, specific layout, and specific size of the silver glue dots, as long as an effective electrical connection relationship between the first shielding layer 102-2 and the second shielding layer 103-2 can be formed. In addition, the specific position of the silver glue dot may be limited by the structural layout of the back of the display substrate in the specific display product, and the specific size is limited by the size of the reserved space of the specific product, which will not be repeated here.

[0101] It should be noted that although Figure 3 The embodiment shows the relative relationship between the first shielding layer and the polarizer, but the embodiments of the present disclosure are not limited to this. Display products that do not include polarizers are also within the protection scope of the embodiments of the present disclosure. That is, when the first shielding layer is arranged between the display substrate and the cover plate, it can also include a display product in which a color filter is arranged on the packaging cover plate (Color filter on Encapsulation, COE) technology, which will not be repeated in this article.

[0102] In another embodiment, referring to Figure 4 As shown, the display module includes a display substrate and a cover plate 106 covering the display substrate. The display substrate includes a stacked driving circuit layer 101 and a light emitting structure layer 111. Those skilled in the art should understand that the cover plate 106 is arranged on the screen side of the display substrate 100, that is, the light emitting side of the light emitting structure layer 111.

[0103] Similarly, the light-emitting unit is arranged in the light-emitting structure layer 111, and the driving circuit layer 101 includes a thin film transistor T, which is used to form a pixel driving circuit that drives the light-emitting unit to emit light, and a peripheral circuit that provides a scanning signal or a light-emitting control signal to the thin film transistor T in the pixel driving circuit. Of course, if the display product has specific needs, the thin film transistor T will also be used to form various other circuits that provide voltage and current signals.

[0104] Of course, the present disclosure does not intend to specifically limit the type of light-emitting unit. In addition to OLED, the light-emitting unit may also be QLED or Micro LED, etc. As long as the circuit structure formed by the thin film transistor T is required to assist the display panel in displaying the picture, it is within the protection scope of the embodiments of the present disclosure.

[0105] The display module also includes a driving circuit layer 101, a first shielding layer 102-3 arranged on a first side of the driving circuit layer 101, a second shielding layer 103-3 arranged on a second side of the driving circuit layer 101, and a connecting portion 104-2. The first side is close to the light-emitting side of the display module, and the second side is far away from the light-emitting side of the display module, or the second side is the opposite side of the first side, and the connecting portion 104-2 electrically connects the first shielding layer 102-3 and the second shielding layer 103-3. The orthographic projection of the thin film transistor on the cover plate 106 is located within the orthographic projection edge of the first shielding layer 102-3 on the cover plate 106 and is located within the orthographic projection edge of the second shielding layer 103-3 on the cover plate 106.

[0106] The above arrangement provides a first shielding layer 102-3 and a second shielding layer 103-3 on both sides of the driving circuit layer 101, and uses the connecting portion 104-2 to electrically connect the two layers of metal. At the same time, the orthographic projection of the thin film transistor T on the cover plate 106 is located within the orthographic projection edge of the first shielding layer 102-3 on the cover plate 106 and is located within the orthographic projection edge of the second shielding layer 103-2 on the cover plate 106, so that the first shielding layer 102-3 and the second shielding layer 103-3 are at the same potential, so that the first shielding layer 102-3, the second shielding layer 103-3 and the connecting portion 104-2 constitute an equipotential cavity that encloses all the thin film transistors T, that is, a "Faraday cage". The driving circuit layer 101 is placed within the "Faraday cage" and is not affected by the external electric field. Therefore, even if the display module works in an electrostatic environment for a long time, the characteristics of the thin film transistors in the driving circuit layer 101 are not affected, and are not offset due to the influence of the electrostatic environment, thereby avoiding a series of display defects caused by the offset of the thin film transistor, thereby improving the display effect and product life.

[0107] In this embodiment, the first shielding layer 302 and the second shielding layer 303 are disposed inside the display substrate to precisely define the scope of the “Faraday cage” structure.

[0108] Specifically, the orthographic projection edge of the first shielding layer 102-3 on the driving circuit layer 101 surrounds the orthographic projection of the thin film transistor T in the driving circuit layer 101 on the driving circuit layer 101, and the orthographic projection edge of the second shielding layer 103-3 on the driving circuit layer 101 surrounds the orthographic projection of the thin film transistor T in the driving circuit layer 101 on the driving circuit layer 101.

[0109] Reference Figure 4 As shown, the first shielding layer 102-3 can be arranged in the touch layer 108. The touch layer 108 is arranged between the light emitting structure layer 111 and the cover plate 106. The reason for this arrangement is that the touch layer 108 is arranged on the light emitting side of the light emitting structure layer 111, and has less wiring relationship with other layers, and the touch layer 108 includes a stacked sampling metal layer. It is more convenient to add a shielding layer in this structure and form an electrical connection with another shielding layer located below the driving circuit layer 101.

[0110] Of course, those skilled in the art should understand that, although not specifically limited, the touch layer 108 is a stacked layer composed of multiple film layers for touch signal sampling.

[0111] More specifically, refer to Figure 4 As shown, the second shielding layer 103 - 3 is disposed in the light shielding layer, and the light shielding layer is, for example, a metal layer disposed on the second side of the driving circuit 101 .

[0112] Optionally, if the second shielding layer 103-3 is a whole layer structure, a light-shielding layer corresponding to the active area of ​​the thin film transistor T in the driving circuit layer 101 is formed while forming the second shielding layer 103-3; if at least a portion of the second shielding layer 103-3 is a grid structure, the portion corresponding to the active area of ​​the thin film transistor T in the driving circuit layer 101 is a non-hollow pattern.

[0113] The preferred material of the first shielding layer 102-3 is a transparent metal oxide, such as indium tin oxide (ITO), indium gallium zinc oxide (IGZO), indium zinc oxide (IZO), etc., so that the first shielding layer 102-3 does not affect the light transmittance of the display module.

[0114] In this embodiment, the connection portion 104 - 2 forms an electrical connection between the first shielding layer 102 - 3 and the second shielding layer 103 - 3 by means of the film layer where the internal wiring layer of the driving circuit layer 101 is located, without requiring additional process steps and equipment.

[0115] Specific to Figure 4 , the driving circuit layer 101 includes an active layer 121, a gate insulating layer 131, a first gate layer 141, a dielectric layer 151, and a first source-drain metal layer 161 which are sequentially stacked.

[0116] The connection portion 104 - 2 includes a first connection portion 114 - 2 and a second connection portion 124 - 1 , wherein the first connection portion 104 - 2 is disposed in the first gate layer 141 , and the second connection portion 124 - 2 is disposed in the first source-drain metal layer 161 .

[0117] It should be noted that the embodiment of the present disclosure does not limit the connection portion 104-2 to only Figure 4In other words, in actual products, the driving circuit layer 101 may include more than one gate layer and more than one source-drain metal layer. For example, the driving circuit layer 101 of some display products includes a first gate layer Gate1, a second gate layer Gate2, a third gate layer Gate3, a first source-drain metal layer SD1, a second source-drain metal layer SD2, and a third source-drain metal layer SD3. The connecting portion may use at least two of the above layers to form an electrical connection from the first shielding layer to the second shielding layer.

[0118] The connecting part includes: at least two of a first connecting part, a second connecting part, a third connecting part, a fourth connecting part, a fifth connecting part, and a sixth connecting part, the first connecting part is arranged on the first gate layer, the second connecting part is arranged on the second gate layer, the third connecting part is arranged on the third gate layer, the fourth connecting part is arranged on the first source-drain metal layer, the fifth connecting part is arranged on the second source-drain metal layer, and the sixth connecting part is arranged on the third source-drain metal layer.

[0119] Of course, the present disclosure does not limit the driving circuit layer to include all the above layers or only include the first gate layer and the second gate layer. A structure including only some of the metal layers is also allowed. In this case, the connecting part is composed of at least two of these layers, which will not be repeated in this article.

[0120] Based on the same inventive concept, an embodiment of the present disclosure further provides a method for manufacturing the display module described above, comprising:

[0121] forming a driving circuit layer;

[0122] forming a first shielding layer on a first side of the driving circuit layer;

[0123] forming a second shielding layer on a second side of the driving circuit layer; and

[0124] A connection portion is formed, the connection portion electrically connecting the first shielding layer and the second shielding layer.

[0125] In this embodiment, a first shielding layer and a second shielding layer are formed on both sides of the driving circuit layer, and a connecting portion is formed, thereby forming a "Faraday cage" structure surrounding the driving circuit layer, and the "Faraday cage" is used to form electrostatic shielding protection for the thin film transistors in the driving circuit layer, thereby avoiding characteristic deviation of the thin film transistors in an electrostatic environment, ensuring normal display of the display product in an electrostatic environment, improving display effects and product life, and having broad application prospects.

[0126] Refer to the following Figures 5 to 8 , describe in detail the production Figure 1 An exemplary method of the display module of the illustrated embodiment.

[0127] In step S1, refer to Figure 5 As shown, a first shielding layer 102 - 1 is deposited on a cover plate 106 to form a first substrate.

[0128] In step S2, refer to Figure 6 As shown, a polarizer 105 is formed on the driving circuit layer 101 to form a second substrate. Specifically, the driving circuit layer 101 is disposed in the display substrate 100-1, and the polarizer 105 can be attached to the light-emitting side of the display substrate 100-1 by an adhesive. A light-emitting structure layer 111 covering the driving circuit layer 101 is also formed on the driving circuit layer 101.

[0129] In step S3, refer to Figure 7 As shown, the first shielding layer side of the first substrate is bonded to the polarizer side of the second substrate. For example, the first shielding layer side of the first substrate and the polarizer side of the second substrate can be bonded together by an adhesive.

[0130] Next, the second shielding layer 103 - 2 is formed on the second side of the driving circuit layer 101 , and then at least one silver glue dot is formed by a dispensing process to form a connecting portion 104 , which electrically connects the first shielding layer 102 and the second shielding layer 103 .

[0131] By the above method, the thickness of the first shielding layer 202 is greatly reduced, for example, the thickness of the first shielding layer 102-1 can be controlled to be greater than or equal to 0.1 μm and less than or equal to 1.0 μm, thereby improving the electrostatic protection of the thin film transistors in the driving circuit layer 101 without affecting the overall thickness of the display module too much.

[0132] In addition to the above steps, the following steps may be performed to reduce the thickness of the first shielding layer to be greater than or equal to 0.1 μm and less than or equal to 1.0 μm, using the polarizer or the cover plate as the substrate.

[0133] Optionally, forming a first shielding layer on the first side of the driving circuit layer further comprises:

[0134] A first shielding layer is formed on the polarizer to form a first substrate; a driving circuit layer is attached to the first shielding layer side or the polarizer side of the first substrate to form a second substrate; a cover plate is formed on the second substrate away from the driving circuit layer side, or

[0135] A polarizer is formed on the driving circuit layer; a first shielding layer is formed on the polarizer; and a cover plate is formed on the first shielding layer.

[0136] Based on the same inventive concept, an embodiment of the present disclosure further provides a display device, comprising the display module described in the above embodiment.

[0137] In this embodiment, the display device can be a mobile phone, tablet computer, television, monitor, laptop computer, car display, digital photo frame or navigation system, etc., which is a product or component that needs to be used in an electrostatic environment. By loading the above display module, the display device can be used in an electrostatic environment for a long time and stably without increasing the process cost, and the production cost is lower, it has higher competitiveness, and has broad application prospects.

[0138] In response to the existing problems, the present disclosure develops a display module and a manufacturing method thereof, as well as a display device, and provides a first shielding layer and a second shielding layer electrically connected via a connecting portion on both sides of the driving circuit layer, thereby forming a "Faraday cage" structure surrounding the driving circuit layer in the display product, and utilizing the "Faraday cage" to form electrostatic shielding protection for the thin film transistors in the driving circuit layer, thereby preventing the thin film transistors from having characteristic deviations in an electrostatic environment, ensuring normal display of the display product in an electrostatic environment, improving display effects and product life, and having broad application prospects.

[0139] Obviously, the above embodiments of the present disclosure are merely examples for clearly illustrating the present disclosure, and are not limitations on the implementation methods of the present disclosure. For ordinary technicians in this field, other different forms of changes or modifications can be made on the basis of the above description. It is impossible to list all the implementation methods here. All obvious changes or modifications derived from the technical solution of the present disclosure are still within the protection scope of the present disclosure.

Claims

1. A display module, characterized in that: The display module comprises a display substrate and a cover plate, wherein the display substrate comprises a driving circuit layer and a light emitting structure layer which are stacked, wherein the driving circuit layer comprises a plurality of thin film transistors, and the display module further comprises: A first shielding layer disposed on a first side of the driving circuit layer, the first side being close to a screen side of the display module; a second shielding layer disposed on a second side of the driving circuit layer, the second side being an opposite side to the first side; and a connecting portion, the connecting portion electrically connecting the first shielding layer and the second shielding layer, The orthographic projection of the thin film transistor on the cover plate is located within an orthographic projection edge of the first shielding layer on the cover plate and is located within an orthographic projection edge of the second shielding layer on the cover plate.

2. The display module according to claim 1, characterized in that: The first shielding layer is disposed between the display substrate and the cover plate.

3. The display module according to claim 2, characterized in that: Also includes: A polarizer disposed between the display substrate and the cover plate, The first shielding layer is disposed between the polarizer and the display substrate, or The first shielding layer is arranged between the polarizer and the cover plate.

4. The display module according to claim 1, characterized in that: The display substrate further includes: a light shielding layer disposed on the second side of the driving circuit layer, and a touch control layer disposed between the light emitting structure layer and the cover plate. The second shielding layer is disposed in the light shielding layer, and The first shielding layer is disposed in the touch control layer.

5. The display module according to claim 2 or 3, characterized in that: The orthographic projection of the driving circuit layer on the cover plate falls within the edge of the orthographic projection of the first shielding layer on the cover plate, The connecting portion is at least one silver glue dot, and the silver glue dot partially covers the first shielding layer and the second shielding layer.

6. The display module according to claim 4, characterized in that: The driving circuit layer includes: a first gate layer and a first source-drain metal layer, The connecting part comprises: a first connecting part and a second connecting part, The first connection portion is disposed in the first gate layer, and the second connection portion is disposed in the first source-drain metal layer.

7. The display module according to claim 4, characterized in that: The driving circuit layer includes: a first gate layer, a second gate layer, a third gate layer, a first source-drain metal layer, a second source-drain metal layer, and a third source-drain metal layer. The connecting portion includes at least two of a first connecting portion, a second connecting portion, a third connecting portion, a fourth connecting portion, a fifth connecting portion, and a sixth connecting portion, The first connection portion is arranged on the first gate layer, the second connection portion is arranged on the second gate layer, the third connection portion is arranged on the third gate layer, the fourth connection portion is arranged on the first source-drain metal layer, the fifth connection portion is arranged on the second source-drain metal layer, and the sixth connection portion is arranged on the third source-drain metal layer.

8. The display module according to claim 1, characterized in that: The first shielding layer is a whole layer structure or a grid structure covering the driving circuit layer. The second shielding layer is a whole layer structure or a grid structure covering the driving circuit layer.

9. The display module according to claim 2 or 3, characterized in that: The thickness of the first shielding layer is greater than or equal to 0.1 μm and less than or equal to 1.0 μm.

10. The display module according to claim 1, characterized in that: The material of the first shielding layer is transparent metal oxide.

11. A display device, characterized in that: A display module comprising any one of claims 1-10.

12. A method for manufacturing the display module according to any one of claims 1 to 10, characterized in that: include: forming the driving circuit layer; forming the first shielding layer on the first side of the driving circuit layer; forming the second shielding layer on the second side of the driving circuit layer; as well as The connection portion is formed to electrically connect the first shielding layer and the second shielding layer.

13. The manufacturing method according to claim 12, characterized in that: The forming of the first shielding layer on the first side of the driving circuit layer further comprises: forming the first shielding layer on the cover plate to form a first substrate; forming a polarizer on the driving circuit layer to form a second substrate; Laminating the first shielding layer side of the first substrate to the polarizer side of the second substrate, or Those forming the first shielding layer on the polarizer to form a first substrate; Laminating the driving circuit layer to the first shielding layer side or the polarizer side of the first substrate to form a second substrate; The cover plate is formed on the side of the second substrate away from the driving circuit layer, or forming the polarizer on the driving circuit layer; forming the first shielding layer on the polarizer; The cover plate is formed on the first shielding layer.

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