Temperature controlled showerhead for treatment tools

Abstract

In one embodiment, an apparatus includes a showerhead including a disk and a stem coupled to the disk; and an adjuster coupled with the backbone. The adjuster includes: an adapter including a heater insert; and a fluid line proximate the heater insert, where the heater insert extends from a top surface of the adapter through a first cavity in the adapter into a second cavity in the trunk. The adapter also includes a bellows including a flange, where the bellows is coupled with the adapter via the flange.

Description

Priority claim

[0001] This application claims priority to U.S. Provisional Patent Application No. 63 / 373,981, filed on August 30, 2022, entitled “TEMPERATURE CONTROLLED SHOWERHEAD FOR A PROCESSING TOOL,” the entire contents of which are incorporated herein by reference. Background Art

[0002] Substrate processing for etching and deposition forms the backbone of the semiconductor industry. Although a variety of processing techniques are available, almost all processes utilize a showerhead to transport a process gas to the substrate to be processed. Depending on the nature of the process (deposition or etching), the process gas may be heated to allow chemical deposition or to enhance etching. While heating is important for many processes, it is also important to maintain the temperature of the process gas for process uniformity and repeatability. Therefore, methods to achieve effective temperature control are being investigated. BRIEF DESCRIPTION OF THE DRAWINGS

[0003] The materials described herein are shown in the accompanying drawings by way of example and not limitation. For simplicity and clarity of description, the elements shown in the drawings are not necessarily drawn to scale. For example, for clarity, the size of some elements is more exaggerated than the size of other elements. In addition, for clarity of discussion, various physical features can be presented in their simplified "ideal" form and geometric features, but it should not be understood that the actual situation can only be close to the ideal type shown. For example, smooth surfaces and square intersections can be drawn without considering the limited roughness, rounded corners and non-ideal angle intersections of the structures formed by nanofabrication technology. In addition, where deemed appropriate, the figure marks are repeated in the drawings to indicate corresponding or similar elements.

[0004] Figure 1 is a cross-sectional view of a processing chamber including a showerhead and a substrate support assembly according to an implementation of the present disclosure.

[0005] Figure 2 is a cross-sectional view of a device including a spray head coupled to a regulator according to an implementation of the present disclosure.

[0006] Figure 3 According to an implementation scheme of the present disclosure Figure 2 A plan view of the device.

[0007] Figure 4A According to an implementation scheme of the present disclosure Figure 2 and Figure 3 An isometric view of the fluid pipeline depicted in FIG.

[0008] Figure 4BAccording to an implementation scheme of the present disclosure Figure 4A A cross-sectional view of the fluid pipeline passing through AA'.

[0009] Figure 5 is a cross-sectional view of a device including a spray head coupled to a regulator according to an implementation of the present disclosure.

[0010] Fig. 6A According to an implementation scheme of the present disclosure Figure 5 An isometric view of the fluid pipeline depicted in FIG.

[0011] Figure 6B According to an implementation scheme of the present disclosure Fig. 6A A cross-sectional view of the fluid pipeline passing through AA'.

[0012] Figure 7 is a cross-sectional view of a system according to an implementation of the present disclosure, the system including a showerhead and a substrate support assembly.

[0013] Figure 8 A flow chart of a method of controlling temperature in a showerhead during substrate processing according to an implementation of the present disclosure.

[0014] Fig. 9A According to an implementation scheme of the present disclosure Figure 7 A cross-sectional view of the system during an operating state in which the temperature in the showerhead increases during processing.

[0015] Fig. 9B According to an implementation scheme of the present disclosure Figure 7 A cross-sectional view of the system during an operating state in which the temperature in the showerhead is reduced during processing. DETAILED DESCRIPTION

[0016] An apparatus for diverting heat flow in a processing tool is described. In the following description, several specific details, such as block diagrams, are set forth to provide a more complete understanding of implementations of the disclosure. It will be apparent to those skilled in the art that implementations of the disclosure may be implemented without these specific details. In other cases, well-known functions (e.g., radio frequency sources) are briefly described to avoid unnecessarily obscuring implementations of the disclosure. In addition, it should be understood that the different implementations shown in the drawings are merely exemplary representations and are not necessarily drawn to scale.

[0017] In some cases, known methods and apparatus are shown in the following description in the form of block diagrams rather than in detail to avoid obscuring the present invention. Reference to "implementation" or "an implementation" or "some implementations" in various places in this specification refers to that the specific features, structures, functions, or characteristics described with reference to the implementation are included in at least one implementation of the present invention. Therefore, the words "in an implementation" or "in an implementation" or "some implementations" that appear in various places in this specification do not necessarily refer to the same implementation of the present invention. In addition, specific features, structures, functions, or characteristics can be combined in one or more implementations in any suitable manner. For example, in the case where the specific features, structures, functions, or characteristics of the first implementation and the second implementation are not mutually exclusive, the first implementation and the second implementation can be combined.

[0018] "Coupled" and "connected" and their derivatives may be used herein to describe functional or structural relationships between components. These words should not be synonymous with each other, but in a specific implementation, "connected" may be used to indicate that two or more elements are in direct physical, optical, or electrical contact with each other. "Coupled" may be used to indicate that two or more elements are in direct or indirect (with other intermediate elements) physical, electrical, or magnetic contact with each other, and / or that two or more elements operate or interact with each other (e.g., a cause-and-effect relationship).

[0019] As used herein, "above," "below," "between," and "over" may generally refer to the relative position of a component or material with respect to other components or materials where such physical relationship is noteworthy. Unless these terms are modified with "directly" or "directly," there may be one or more intervening components or materials. Similar distinctions exist in the context of assembly of components. When used throughout this specification and in the claims, a list of items connected by "at least one of" or "one or more of" may mean any combination of the listed items.

[0020] As used herein, "adjacent" may generally refer to one thing being located near (eg, next to or proximate to with one or more things in between) or adjacent to (eg, abutting) another thing.

[0021] Unless otherwise specified in explicit reference to their use, the terms "substantially equal", "approximately equal" and "approximately equal" represent that there is at most only an occasional deviation between the two objects described. In the art, such deviations are usually no greater than + / -10% of the stated value.

[0022] Processing tools are used to perform a variety of deposition and etching processes in semiconductor device manufacturing. The processing tool may include a processing chamber and one or more substrate support assemblies, which are used for single wafer processing or multi-wafer batch processing processing capabilities. The substrate support assembly may include different components, such as cooling gas pipelines, push pins, RF lines, heating electrodes, etc. The heating electrodes in the substrate support assembly can be implemented to accelerate or increase chemical reactivity to facilitate substrate processing. The processing chamber can also be heated to provide uniform processing conditions for multi-wafer processing.

[0023] The processing tool also includes a gas delivery system and a showerhead coupled to the gas delivery system. In at least one embodiment, the process gas can be transported to the substrate placed on the substrate support assembly via the showerhead at a desired process temperature. In at least one embodiment, the desired process temperature can be greater than room temperature. In some such embodiments, the showerhead can include a conductive material. In at least one embodiment, the conductive material can be heated to maintain the desired process temperature of the process gas. However, the substrate support assembly can also be heated. In at least one embodiment, the substrate support assembly can be heated to a temperature greater than the temperature of the process gas or the showerhead. Heat can be radiated from the substrate support assembly during processing. Heat radiated from the substrate support assembly and from the chamber can affect the temperature at the showerhead. For example, absorbing heat radiated from the substrate support assembly can increase the temperature of the showerhead. Changes in temperature at the showerhead (e.g., increases in temperature) can change the properties of the gas being transported. In addition, changes in the temperature of the showerhead over the surface area of ​​the showerhead can be non-uniform. Areas of non-uniform temperature near the outlet orifice in the showerhead can establish non-uniform processing conditions on the substrate. Additionally, changes in temperature at the showerhead may occur during processing or during the time between processing of two subsequent substrates.

[0024] In order to minimize the variation of the processing temperature, it is desirable to implement a temperature control system partially integrated in the showerhead. In at least one embodiment, the means for controlling the temperature comprises a regulator integrated with the showerhead. The regulator is a structure comprising a thermally conductive material. In at least one embodiment, the regulator also comprises one or more heater cartridges and one or more fluid lines. In at least one embodiment, the heater cartridge can be inserted into a corresponding cavity in the regulator and the showerhead and is thermally connected to the regulator and the showerhead. In at least one embodiment, one or more fluid lines can at least partially surround the one or more heater cartridges and can flow water or other chemicals to reduce the ambient temperature of the regulator and the showerhead. In at least one embodiment, the fluid lines can be formed by grooves in the regulator body. In at least one embodiment, for functionality, the showerhead and the regulator can be thermally balanced with each other. In at least one embodiment, the regulator can also be mechanically coupled to a stabilizer system so that the showerhead is substantially parallel to the wafer surface.

[0025] At the beginning of the processing operation, the temperature can be monitored by temperature sensors at one or more locations of the nozzle and the regulator. In at least one implementation, the temperature of the substrate support assembly and the temperature of the chamber can be set to a desired set value. In at least one implementation, the temperature of the nozzle and the regulator can be adjusted by a combination of heating and cooling. In at least one implementation, the heater plug-in can include a resistive heating element activated by, for example, the passage of an electric current. In at least one implementation, the heater plug-in can locally heat the material of the regulator and the nozzle via, for example, thermal conduction. Heat can be quickly transported throughout the conductive material. Fine tuning of the temperature can be achieved by simultaneously passing a cooling fluid through one or more fluid pipelines. In at least one implementation, one or more fluid pipelines can perform local cooling and the effect of cooling can be quickly transferred throughout these conductive materials. For example: heat from the nozzle can be transported to the cooled regulator, resulting in a reduction in the temperature of the nozzle. In at least one implementation, the temperature of the nozzle can be monitored in real time by one or more sensors. In at least one implementation, an active feedback mechanism can be implemented to control the desired temperature setting during or after the process. In at least one implementation, an additional feedback mechanism can be implemented to actively account for desired temperature changes during the process, such as at the beginning of the process or at the end of the process.

[0026] Figure 11 is a cross-sectional view of a system 100 including a showerhead 102 and a substrate support assembly 104 according to at least one implementation. In at least one implementation, the showerhead 102 includes a trunk 106 and a disk 108 coupled to the trunk 106. In at least one implementation, the showerhead 102 includes a cavity 110. The cavity 110 is coupled to a gas delivery tube 112. In at least one implementation, the gas delivery tube 112 is coupled to a gas source 114.

[0027] A "disc" herein may generally refer to a circular object having a cavity therein. A "showerhead" herein may generally refer to a device that distributes a process gas in a process chamber. In at least one implementation, the showerhead 102 may generally include a non-conductive material (e.g., quartz) or a conductive material. In at least one implementation, the showerhead 102 includes a conductive material, such as aluminum. A "trunk" herein may generally refer to a columnar structure. In at least one implementation, the columnar structure may be a hollow cylinder or a solid cylinder with a cavity. The columnar structure may be a pipe. A "cavity" herein may generally refer to a hollow structure in a solid object. The cavity may have different shapes and sizes, both regular and irregular. A "gas transport tube" herein may generally refer to a tube containing a thermally conductive material with a hollow interior. In at least one implementation, the tube may be double-walled with an insulating barrier in between to provide thermal insulation from the surrounding environment. The gas transport tube 112 may be heated. A "gas source" herein may generally refer to a container or storage device for one or more process gases. Although the gas source 114 is shown adjacent to the showerhead 102, the gas delivery tube 112 is not drawn to scale in the figure. As used herein, a "substrate support assembly" may generally refer to a planar electrode coupled to a backbone. In at least one implementation, the substrate support assembly may include an electrostatic chuck, which may include heating and / or cooling elements to aid in processing of the substrate. In at least one implementation, the substrate support assembly may be coupled to an RF power supply.

[0028] In at least one implementation, the temperatures T1, T2, T3 of the showerhead 102, the substrate support assembly 104, and the gas source 114, respectively, can be monitored when the system 100 is idle or not processing a substrate. In at least one implementation, the temperatures T1, T2, T3 can be monitored by temperature sensors coupled to the showerhead 102, the substrate support assembly 104, and the gas source 114. In at least one implementation, during operation, the gas 116 flows from the gas source 114 through the gas transport tube 112 and the cavity 110 and strikes the distribution plate 118. The "distribution plate" herein may generally refer to an opaque structure that provides a barrier to the striking gas molecules. In at least one implementation, during operation, the gas 116 striking the distribution plate 118 may diffuse in the cavity 119 of the disk 108 and enter the hole 120 of the disk 108. The gas 116 flows to the substrate 122 placed on the substrate support assembly 104. In at least one implementation, the gas can be used to perform etching or deposition. In at least one implementation, the substrate support assembly 104 is heated, and the temperature T3 may be significantly greater than the temperature T2. In at least one implementation, the gas 116 may be heated to a temperature T1 at the gas source 114. In at least one implementation, the temperature T1 is significantly less than the temperature T3. In at least one implementation, the temperature T1 is significantly less than the temperature T3, and the temperature T2 may be substantially equal to room temperature. In at least one implementation, during processing, heat 124 may radiate from the substrate 122 and the substrate support assembly 104 causing fluctuations in the temperature T2. In at least one implementation, fluctuations in the temperature T2 may affect the properties of the gas 116 transmitted through the cavity 110. Without active control of the temperature T2 during processing and between subsequent processing of the substrate 122, any changes in the properties of the gas may adversely affect the etching or deposition rate. Therefore, temperature control of the showerhead 102 is highly desirable.

[0029] Figure 22 is a cross-sectional view of an apparatus 200 according to at least one implementation, the apparatus 200 comprising a showerhead 202 comprising a disk 204 and a backbone 206 coupled to the disk 204. In at least one implementation, the disk 204 may comprise a hollow cavity 208 and holes 210 for distribution of process gases. In at least one implementation, the showerhead 202 comprises a high thermal conductivity material, such as aluminum. In one example, a thermal conductivity greater than 80 watts per square meter per Kelvin (W / mK) may be considered high. In at least one implementation, the apparatus 200 further comprises an adjuster 212 coupled to the backbone 206. As used herein, the term "adjuster" may generally refer to a structure that provides structural adjustment of a connection, such as temperature control, or mechanical control (such as tilting capability). In at least one implementation, the adjuster 212 comprises a high thermal conductivity material. In at least one implementation, the adjuster 212 comprises aluminum. In at least one implementation, the regulator 212 includes an adapter 214 and a bellows 216 coupled to the adapter 214. In at least one implementation, the adapter 214 also includes a heater insert 218 and a fluid line 220 adjacent to the heater insert 218.

[0030] In at least one embodiment, to facilitate the routing of the heater plug-in 218, the fluid line 220 and the adapter 214 may include a cylindrical structure. In this article, a "connector" may generally refer to a structure that allows two or more objects to be coupled together. In at least one embodiment, the adapter may have specific features and structures therein. In at least one embodiment, the adapter 214 includes a cylindrical portion 219 and a cylindrical portion 221. The cylindrical portion 219 and the cylindrical portion 221 are connected. In at least one embodiment, the cylindrical portion 219 and the cylindrical portion 221 have diameters D1 and D2, respectively. In at least one embodiment, the diameters D1 and D2 are different. The different diameters D1 and D2 of the cylindrical portion 219 and the cylindrical portion 221 respectively promote the coupling of the bellows 216 between the cylindrical portion 221 and the support structure 222. In at least one embodiment, the support structure 222 is a component of the processing chamber that contains the device 200. In at least one implementation, the adapter 214 also includes holes or cavities to control the passage of, for example, bolts, or components used to achieve temperature control in the showerhead 202 .

[0031] In at least one implementation, the device 200 includes three heater plug-ins. In this article, "heater plug-in" can generally refer to a heating element that releases heat to the surrounding area conductively or radiatively. In at least one implementation, heater plug-ins 218A and 218B are visible in the cross-sectional view. In at least one implementation, heater plug-in 218A extends from the adapter surface 214A through the cavity 226 in the adapter 214 to the cavity 224 in the trunk 206. In at least one implementation, surface 214A can be the top surface of the adapter 214. Heater plug-ins 218A and 218B can resistively heat by passing current through the filaments in the body of these heater plug-ins. In at least one implementation, the width of heater plug-ins 218A and 218B can be at least 5mm. In at least one implementation, the width of heater plug-ins 218A and 218B can be between 5mm-15mm. In at least one implementation, heater inserts 218A and 218B extend at least 50% of the length of trunk 206 as measured from interface 227 between trunk 206 and adapter 214. In an illustrative implementation, heater inserts 218A and 218B extend at least 75% of the length of trunk 206.

[0032] In at least one implementation, the fluid line 220 is advantageously located near the interface 227 to provide thermal conductivity of the spray head 202 by flowing a temperature-controlled fluid or coolant. In this document, the terms fluid and coolant are used interchangeably. In at least one implementation, the flow of coolant through the fluid line 220 can reduce the temperature of the adapter 214 and the spray head 202 thermally connected to the adapter 214. In at least one implementation, the coolant can be maintained within a certain temperature range, and the flow rate of the coolant in the fluid line 220 can be controlled to adjust the heat exchange with the adapter 214.

[0033] In at least one implementation, the fluid line 220 can be a channel in the sidewall 214B of the cylindrical portion 219 of the adapter 214. In at least one implementation, the fluid line 220 can extend a portion of the length of the cylindrical portion 219 as shown. In at least one implementation, the channel in the sidewall 214B provides at least three surfaces for the coolant flowing in the fluid line 220 to contact the adapter 214. In at least one implementation, the fluid line 220 is covered by a cap 228 extending along the sidewall 214B. In this document, a "cap" can generally refer to an object used to cover an open structure (such as a channel). In at least one implementation, the cap 228 includes a material that is the same or substantially the same as the material of the adapter 214. In at least one implementation, the cap 228 can be in thermal equilibrium with the adapter 214. In this document, a "fluid line" can generally refer to a structure (such as a channel or body) that can support fluid flow. In at least one implementation, the fluid line 220 can be a pipe that is separate from but thermally connected to the adapter 214. In some such implementations, the fluid line 220 in the form of a pipe can also wrap around the trunk 206. Further details and implementations of the fluid line 220 will be discussed later.

[0034] In at least one implementation, the showerhead 202 further includes a cavity 230 extending from the disk 204 to the top of the trunk 206. In at least one implementation, the trunk 206 can be further connected to a hollow cylinder 232 directly above the cavity 230. In at least one implementation, the hollow cylinder 232 includes a cavity 234 having a width substantially equal to the width of the cavity 230. The cavities 230 and 234 together form a conduit for conveying or facilitating the flow of gas from the gas source 114 to the holes 210 in the disk 204.

[0035] In at least one embodiment, the bellows 216 further includes a convolution 216A between flanges 216B and 216C. In this document, a "bellows" may generally refer to a device used to connect two objects that require structural adjustment (such as tilting). In this document, the term "convolution" may generally refer to a flexible accordion-like structure that can extend and contract and tilt within 5 degrees. In this document, a "flange" may generally refer to a metal structure that allows coupling with an external structure. In at least one embodiment, the convolution 216A may include a stainless steel material and may be welded to flanges 216B and 216C. Flanges 216B and 216C may also include a stainless steel material. The number of convolutions 216A may vary depending on the height H of the bellows 216. B And changes.

[0036] In at least one implementation, the adapter 214 is connected to the flange 216C. As shown, the cylindrical portion 221 of the adapter 214 is located on the flange 216C. In at least one implementation, the flange 216B is supported by the support structure 222. The adjuster 212 and the showerhead 202 can be tilted (relative to the z-axis) by adjusting the tilt adjustment screws 236A and 236B relative to the flange 216B. In at least one implementation, adjusting the tilt adjustment screws 236A and 236B can cause the showerhead surface 204A to be parallel to the surface of the substrate placed on the substrate support assembly (not shown) below. In at least one implementation, the showerhead surface 204A parallel to the substrate is highly desirable because the gas exiting through the holes 210 distributed throughout the showerhead 202 can span the same distance to the substrate 122 below. In at least one implementation, the non-parallel showerhead surface 204A introduces changes to the gas trajectory. In at least one implementation, variations in gas trajectories may introduce differences in etch rates or deposition rates across the substrate causing process non-uniformity.

[0037] Figure 3 300 is a plan view of an adapter 214 according to at least one implementation of the present invention. In at least one implementation, the adapter 214 includes three tilt adjustment screws 236A, 236B, and 236C. In at least one implementation, the tilt adjustment screws 236A, 236B, and 236C are substantially equidistant from each other and from the axial center 301 of the adjuster 212. In at least one implementation, as arranged, the tilt adjustment screws 236A, 236B, and 236C can be provided on the spray head surface 204A ( Figure 2 ) and the surface of the substrate support assembly, as described below.

[0038] In at least one implementation, three heater inserts 218A, 218B, and 218C are shown. In at least one implementation, the heater inserts 218A, 218B, and 218C can be evenly distributed from the axial center 301. In at least one implementation, the heater inserts 218A, 218B, and 218C are distributed at the same radial distance from the axial center 301. In at least one implementation, as arranged, the heater inserts 218A, 218B, and 218C can provide substantial uniformity of heat transport throughout the volume of the regulator 212.

[0039] In at least one implementation, fluid line 220 follows a substantially circular path. Line segments 302 and 304 are coupled to fluid line 220 to provide an inlet and an outlet for coolant to flow in fluid line 220. Line segments 302 and 304 may be further coupled to fittings 306 and 308, respectively, to provide coupling to source and exhaust lines (not shown). Fittings 306 and 308 may include joints.

[0040] In at least one implementation, the heater inserts 218A, 218B, and 218C are distributed radially between the cavity 230 and the fluid line 220. The heater inserts 218A, 218B, and 218C may be radially offset from the fluid line 220 by at least 5 cm.

[0041] In at least one implementation, during operation, the adapter 214 undergoes heat exchange with the coolant flowing in the fluid line 220. In at least one implementation, heat can be transferred from the adapter 214, which may be at a higher temperature, to the coolant maintained at a lower temperature. In at least one implementation, the coolant circulating in the fluid line 220 can thus transfer heat away from the adapter 214 as it flows toward the outlet (e.g., via the fitting 308). The line segments 302 and 304 may be in a different plane than the fluid line 220. For example, the line segments 302 and 304 may extend out of the plane shown.

[0042] Figure 4A 4 is an isometric view of a fluid line 220 in at least one embodiment, including line segments 302 and 304. In at least one embodiment, the connector 214 is not shown in the diagram for clarity. In at least one embodiment, a portion of the cap 228 covering the fluid line 220 is shown to provide background information about the volume and shape of the fluid line 220. In at least one embodiment, the fluid line 220 is a partial cylinder with a disconnect 402. In at least one embodiment, the fluid line 220 is coupled to the line segments 302 and 304. In at least one embodiment, the line segments 302 and 304 extend from the fluid line 220 in vertical and horizontal directions. In at least one embodiment, the line segments 302 and 304 provide a continuous path for fluid to flow in and out of the fluid line 220.

[0043] In at least one implementation, pipeline segment 302 includes a vertical segment 302A and a transverse segment 302B connected to vertical segment 302A. In at least one implementation, segment 304 includes a vertical segment 304A and a transverse segment 304B connected to vertical segment 304A. In at least one implementation, vertical segments 302A and 304A and transverse segments 302B and 304B may be grooves or channels in cylindrical portion 221 (not shown).

[0044] Figure 4B To pass through Figure 4A 4. A cross-sectional view 410 of the structure along line AA' in FIG. Portions of the adapter 214 and cap 228 are also depicted to provide background information. In at least one embodiment, the fluid line 220 has a Figure 2In at least one implementation, fluid line 220 allows heat exchange between the fluid flowing in fluid line 220 and surfaces 214C, 214D, and 214E. In at least one implementation, the fluid volume is partially defined by cross-sectional area A. F To decide, A F is the height H of the fluid pipeline 220 F and width W F In at least one embodiment, where the fluid line 220 is a channel in the cylindrical portion 219 of the connector 214, the maximum height of the fluid line 220 is given by the height of the cylindrical portion 219. In at least one embodiment, the cross-sectional shape of the fluid line 220 can be determined by the total heat content to be adjusted in the connector 214. In at least one embodiment, the total heat content to be adjusted can depend on the total contact surface area between the fluid and the connector 214. In at least one embodiment, the total contact surface area can be increased by the presence of grooves or protrusions on the surface 214D (as discussed below). In at least one embodiment, for a fixed W F , any protrusion in surface 214D reduces the total volume of fluid that can flow in fluid line 220.

[0045] Figure 5 2 is a cross-sectional view of a device 500 according to an implementation of the present disclosure. In at least one implementation, the device 500 includes all features of the device 200 except the fluid line 220. In at least one implementation, the device 500 includes a fluid line 502 that includes one or more properties of the fluid line 220. The fluid line 502 includes a groove or channel. In at least one implementation, the fluid line 502 includes three channels 502A, 502B, and 502C. The channels 502A, 502B, and 502C are covered by the cap 228 as shown.

[0046] Fig. 6A 600 is an isometric view of a fluid line 502 including line segments 504 and 506 according to at least one implementation. In at least one implementation, the adapter 214 is not shown in the figure for clarity. In at least one implementation, the portion of the cap 228 covering the fluid line 502 is shown to provide background information of the volume of the fluid line 502. As shown, the channels 502A, 502B, and 502C are shaped as cylindrical rings with a disconnect 602. In at least one implementation, although the cylindrical rings do not contact each other, each channel 502A, 502B, and 502C is coupled to the line segment 504 at a first end and coupled to the line segment 506 at a second end. In at least one implementation, the line segments 504 and 506 provide fluid paths to flow into and out of each channel 502A, 502B, and 502C.

[0047] In at least one implementation, pipeline segment 504 includes a vertical segment 504A and a transverse segment 504B connected to vertical segment 504A. In at least one implementation, pipeline segment 506 includes a vertical segment 506A and a transverse segment 506B connected to vertical segment 506A. In at least one implementation, transverse segment 504B can be coupled to a fluid source and transverse segment 506B can be coupled to a fluid drain.

[0048] Figure 6B To pass through Fig. 6A 610 is a cross-sectional view of the structure along line AA' in FIG. Portions of the adapter 214 and the cap 228 are also depicted to provide background information. In at least one implementation, the fluid line 502 may have a Figure 5 During processing, the fluid line 502 allows heat exchange between the fluid flowing in the fluid line 502 and the different surfaces in the adapter 214.

[0049] In at least one implementation, the volume of the fluid in the fluid pipeline 502 is proportional to the cross-sectional area A of each channel 502A, 502B, 502C. N Proportional. Cross-sectional area A N is the height H of each channel 502A, 502B, 502C F and width W F In at least one implementation, when the fluid line 502 is confined to the cylindrical portion 219 of the adapter 214, the maximum height of each channel 502A, 502B, 502C is limited by the height of the cylindrical portion 219. The cross-sectional shape of each channel 502A, 502B, 502C can be determined by the total heat content to be regulated in the adapter 214. The total heat content to be regulated can depend on the total contact surface area between the fluid and the adapter 214. In at least one implementation, the total contact surface area can be increased by the presence of a protrusion in the adapter 214.

[0050] In at least one implementation, the total contact surface area in the fluid line 502 is less than that in the fluid line 220 ( Figure 4A and 4B ) is increased. In at least one implementation, the fluid that can be transported in channel 502A contacts surfaces 214E, 214F, and 214G. In at least one implementation, the fluid that can be transported in channel 502B contacts surfaces 214H, 214I, and 214J. In at least one implementation, the fluid that can be transported in channel 502C contacts surfaces 214C, 214K, and 214L. In at least one implementation, surfaces 214X and 214Y do not contribute to surface conduction because there is no contact between the fluid and these surfaces.

[0051] In at least one implementation, compared to fluid line 220 ( Figure 4B ), there will be a net decrease in the volume of fluid in the fluid line 502. In at least one implementation, the increase in the total contact surface area in the fluid line 502 can increase the amount of heat exchange between the fluid transported in the fluid line 502 and the adapter 214. It should be understood that relative to the height H of the channel 502A, 502B, or 502C, C , the spacing S between consecutive channels (e.g., 502A and 502B, or 502B and 502C) C In at least one embodiment, each channel 502A, 502B, 502C has the same or substantially the same height H. C In addition, the spacing S between channels (e.g., 502A and 502B, or 502B and 502C) is C However, in other implementations, the height H of each channel 502A, 502B, 502C may be the same or substantially the same. C In at least one implementation, the spacing S between channels 502A and 502B is C The spacing S between channels 502B and 502C may be C different.

[0052] Although three channels 502A, 502B, 502C are depicted Figure 5 , 6A and 6B, but the number of channels may be greater than three and depends on the vertical thickness of the cylindrical portion 219.

[0053] In at least one implementation, fluid line 502 may include a spiral structure. The spiral structure may be coupled between a first end connector and a second end connector. In at least one implementation, the first end connector and the second end connector may not be on the same plane. In at least one implementation, the end connector may be a coupler for connecting the spiral structure to a coolant source or a coolant discharge port. Such a spiral structure may not include a vertical pipeline section. In at least one implementation, a spiral structure including pipes may be implemented. These pipes may be placed in channels 502A, 502B, 502C.

[0054] Figure 7is a cross-sectional view of a system 700 including the apparatus 500 and the substrate support assembly 104 according to an implementation of the present disclosure. In at least one implementation, the system 700 includes temperature sensors 702, 704, 706. In at least one implementation, the temperature sensors 702, 704, 706 are coupled to the showerhead 202, the gas source 114, and the substrate support assembly 104, respectively. In at least one implementation, the temperature sensors 702, 704, 706 may be coupled to a separate component designed to set the temperature of the showerhead 202, the gas source 114, and the substrate support assembly 104, respectively. In at least one implementation, such a separate component may include a temperature controller. In at least one implementation, the temperature sensors 702, 704, 706 measure the temperatures T1, T2, and T3 of the gas source 114, the showerhead 202, and the substrate support assembly 104, respectively. In at least one implementation, the measurements may be performed in real time while the system 700 is processing the substrate 122. In at least one implementation, active feedback from the temperature sensors 702 , 704 , 706 may be utilized to change the temperature at the showerhead 202 .

[0055] Figure 8 An operating device (eg, system 700 ( Figure 7 ) in the apparatus 500) of the method 800. In at least one implementation, the method 800 begins with operation 810, providing the system 700 ( Figure 7 ). In at least one implementation, method 800 continues at operation 820, which sets a first set point temperature on the substrate support assembly and a second set point temperature on the showerhead. In at least one implementation, method 800 continues at operation 830, which places a substrate on the substrate support assembly and flows a process gas through the showerhead to the substrate to process the substrate. In at least one implementation, method 800 continues at operation 840, which monitors the temperature on the showerhead and compares the monitored temperature to the second set point temperature. In at least one implementation, method 800 ends at operation 850, and if the monitored temperature is different from the second set point temperature, the temperature on the showerhead is controlled by controlling power supplied to the heater plug and / or controlling fluid flowing in a fluid line.

[0056] Fig. 9A FIG. 7 is a cross-sectional view of a system 700 including an apparatus 500 and a substrate support assembly 104 during processing of a substrate 122 according to an implementation of the present disclosure. Figure 7As discussed, measurements can be made in real time while the system 700 is processing the substrate 122. In at least one implementation, active feedback from the temperature sensors 702, 704, and 706 can be used to change the temperature at the showerhead 202. In at least one implementation, the temperature T2 at the showerhead 202 can be changed by applying power to the heater inserts 218A and 218B and / or by flowing fluid in the fluid line 502. In at least one implementation, the setpoint temperature on the showerhead 202 can be lower than the setpoint temperature on the substrate support assembly 104. In at least one implementation, the initial temperature T2 is less than the initial temperature T1.

[0057] In at least one implementation, the temperature T2 can be increased at the beginning of processing. In at least one implementation, the temperature T2 can be increased because heat (indicated by arrow 900) from the substrate support assembly 104 can radiate toward the showerhead 202 and increase the temperature T2. Because the showerhead 202 is in thermal contact with the regulator 212, temperature changes in the showerhead 202 can be compensated by cooling in the regulator 212. Heat can be transported (indicated by arrow 902) from the showerhead 202 to the regulator 212. In at least one implementation, in order to absorb heat from the showerhead 202, fluid flow can be increased in the fluid line 502 to quickly exchange heat away from the body of the regulator 212. In at least one implementation, if power is initially applied to the heater inserts 218A and 218B, the power applied can then be reduced to reduce the temperature in the regulator 212 and the showerhead 202. In at least one implementation, the system 700 includes two paths for controlling the temperature increase in the showerhead 202 when processing the substrate 122.

[0058] Fig. 9B is a cross-sectional view of a system 700 during processing of a substrate 122 according to one implementation of the present disclosure. In at least one implementation, the setpoint temperature on the substrate support assembly 104 can be lower than the setpoint temperature on the showerhead 202. For example, the initial temperature T2 is greater than the initial temperature T1. In at least one implementation, a cool (e.g., a temperature below 70 degrees Celsius) substrate support assembly 104 may be desirable for certain processing conditions. In at least one implementation, the showerhead 202 may be heated to a temperature T2 that is substantially the same as the temperature T1, where the temperature T1 is the temperature of the gas at the gas source 114. In at least one implementation, the temperature T1 of the process gas may be heated to a processing temperature prior to flowing (indicated by arrow 910) through the cavities 234, 230 and out of the orifice 210.

[0059] In at least one implementation, the temperature T2 can be reduced at the beginning of the process. In at least one implementation, the temperature T2 can be reduced because heat (indicated by arrow 904) can be radiated from the showerhead 202 to the substrate support assembly 104 to reduce the temperature T2. In at least one implementation, the power applied to the heater plugs 218A and 218B can be increased to increase the temperature in the showerhead 202. Because the heater plugs 218A and 218B extend in both the adjuster 212 and the showerhead 202, there can be two paths for heating the showerhead 202. A portion of the heat can be generated in the showerhead 202 and another portion of the heat can be generated in the adjuster 212. The heat generated by the adjuster 212 can be transported to the showerhead 202 (indicated by arrow 906). In at least one implementation, if a fluid flows in the fluid line 502, the flow rate of the fluid can be reduced to maintain the temperature T2. In at least one implementation, the reduction in the fluid flow rate can reduce the amount of heat that leaves the adapter 214. In at least one implementation, the heater inserts 218A and 218B and the fluid line 502 can be used during processing to actively control the temperature at the showerhead 202 .

[0060] Example 1: A device comprising: a spray head comprising a disk and a trunk coupled to the disk; and a regulator coupled to the trunk, the regulator comprising: a connector comprising: a heater plug; and a fluid line adjacent to the heater plug, wherein the heater plug extends from a top surface of the connector through a first cavity in the connector to a second cavity in the trunk; and a bellows comprising a flange, wherein the bellows is coupled to the connector via the flange.

[0061] Example 2: The device of Example 1, wherein the nozzle includes a cavity extending from the disk to the top of the trunk.

[0062] Example 3 is the device described in any one of the preceding examples (especially Example 2), wherein the spray head further comprises a hollow cylinder connected to the trunk above the cavity.

[0063] Example 4 is the device described in any of the preceding examples (particularly Example 2), wherein the cavity is cylindrical.

[0064] Example 5 is the device of any of the preceding examples, particularly Example 1, wherein the heater insert extends at least 50% of the length of the trunk.

[0065] Example 6 is a device described in any one of the preceding examples (particularly Example 1), wherein the adjuster further comprises a first cylindrical portion and a second cylindrical portion, the second cylindrical portion being located above the first cylindrical portion, wherein the first cylindrical portion is located on the trunk and the second cylindrical portion is coupled to the flange.

[0066] Example 7 is the device of any of the preceding examples, particularly Example 6, wherein the fluid line comprises a channel located at a side wall of the first cylindrical portion in the adapter.

[0067] Example 8 is the device of any of the preceding examples, particularly Example 7, wherein the fluid line comprises a spiral structure.

[0068] Example 9 is a device described in any one of the preceding examples (particularly Example 7), wherein the fluid line includes a first channel located above a second channel, wherein the first channel and the second channel are connected at first corresponding ends via a first connector and wherein the first channel and the second channel are connected at second corresponding ends via a second connector.

[0069] Example 10 is the device of any of the preceding examples, particularly Example 2, wherein the cavity extends along the axial center of the trunk and the disk.

[0070] Example 11 is the apparatus of any of the preceding examples, particularly Example 10, wherein the heater insert is radially between the cavity and the fluid line.

[0071] Example 12 is the device of any of the preceding examples, particularly Example 11, wherein the heater insert is radially offset from the fluid line by at least 5 mm.

[0072] Example 13 is the device of any of the preceding examples, particularly Example 1, wherein the regulator comprises three heater inserts.

[0073] Example 14 is the device of any of the preceding examples, particularly Example 1, wherein the adjuster further comprises a tilt adjustment screw coupled to the flange.

[0074] Example 15: A method of controlling temperature at a showerhead in a processing tool, the method comprising: providing an apparatus comprising: a substrate support assembly; the showerhead comprising a disk and a trunk coupled to the disk; and an adjuster coupled to the trunk, the adjuster comprising: an adapter comprising: a heater plug; and a fluid line adjacent to the heater plug, wherein the heater plug extends from a top surface of the adapter through a first cavity in the adapter to a second cavity in the trunk; and a bellows comprising a flange, wherein the bellows is coupled to the adapter via the flange; setting a first set point temperature on the substrate support assembly; setting a second set point temperature on the showerhead by controlling power supplied to the heater plug and / or flowing a fluid through the fluid line; placing a substrate on the substrate support assembly; performing processing by flowing a process gas through the first cavity and the second cavity and the showerhead to the substrate; monitoring the temperature on the showerhead; and controlling the temperature on the showerhead by controlling power supplied to the heater plug and / or controlling the fluid flowing in the fluid line.

[0075] Example 16 is the method of any of the preceding examples, particularly Example 15, wherein the process gas is heated to a process temperature prior to flowing through the first cavity and through the second cavity.

[0076] Example 17 is the method of any of the preceding examples, particularly Example 16, wherein the first set point temperature is greater than the second set point temperature.

[0077] Example 18 is the method of any of the preceding examples, particularly Example 16, wherein the first set point temperature is less than the second set point temperature.

[0078] Example 19 is a method as described in any of the preceding examples, particularly Example 17, wherein the processing increases the second set point temperature, and wherein controlling the temperature on the spray head includes reducing power supplied to the heater insert and increasing flow through the fluid line.

[0079] Example 20 is a method as described in any of the preceding examples, particularly Example 18, wherein the processing reduces the second set point temperature, and wherein controlling the temperature on the spray head includes increasing the power supplied to the heater insert and reducing the flow through the fluid line.

[0080] In addition to what is described herein, various modifications may be made to the disclosed implementations and implementations thereof without departing from the scope thereof. Therefore, the descriptions of the implementations herein should be interpreted as merely illustrative, and not as limitations on the scope of the present disclosure. The scope of the present invention should be measured solely with reference to the following claims.

Claims

1. A device comprising: a spray head comprising a disk and a stem coupled to the disk; and A regulator coupled to the backbone, the regulator comprising: The connector contains: a heater insert; and a fluid line adjacent to the heater insert, wherein the heater insert extends from a top surface of the adapter, through a first cavity in the adapter, and into a second cavity in the stem; and A bellows comprises a flange, wherein the bellows is coupled to the adapter via the flange.

2. The device of claim 1, wherein the showerhead comprises a cavity extending from the disk to the top of the stem.

3. The device according to claim 2, wherein the spray head further comprises a hollow cylinder connected to the trunk above the cavity.

4. The device of claim 2, wherein the cavity is cylindrical.

5. The device of claim 1, wherein the heater insert extends at least 50% of the length of the trunk.

6. The device of claim 1, wherein the adjuster further comprises a first cylindrical portion and a second cylindrical portion, the second cylindrical portion being located above the first cylindrical portion, wherein the first cylindrical portion is located on the trunk and the second cylindrical portion is coupled to the flange.

7. The device of claim 6, wherein the fluid line comprises a channel located at a side wall of the first cylindrical portion in the adapter.

8. The device of claim 7, wherein the fluid line comprises a helical structure.

9. The device of claim 7, wherein the fluid line comprises a first channel located above a second channel, wherein the first channel and the second channel are connected at first respective ends by a first connector and wherein the first channel and the second channel are connected at second respective ends by a second connector.

10. The device of claim 2, wherein the cavity extends along the axial center of the trunk and the disk.

11. The device of claim 10, wherein the heater insert is radially interposed between the cavity and the fluid line.

12. The apparatus of claim 11, wherein the heater insert is radially offset from the fluid line by at least 5 mm.

13. The device of claim 1, wherein the regulator comprises three heater inserts.

14. The apparatus of claim 1, wherein the adjuster further comprises a tilt adjustment screw coupled to the flange.

15. A method of controlling temperature at a showerhead in a processing tool, the method comprising: A device is provided, the device comprising: a substrate support assembly; The nozzle comprises a disk and a trunk coupled to the disk; and A regulator coupled to the backbone, the regulator comprising: The connector contains: a heater insert; and a fluid line adjacent to the heater insert, wherein the heater insert extends from a top surface of the adapter, through a first cavity in the adapter, and into a second cavity in the trunk; as well as a bellows comprising a flange, wherein the bellows is coupled to the adapter via the flange; setting a first set point temperature on the substrate support assembly; setting a second set point temperature on the showerhead by controlling power supplied to the heater insert and / or flowing fluid through a fluid line; placing a substrate on the substrate support assembly; performing processing by flowing a process gas through the first cavity and the second cavity and the showerhead toward the substrate; monitoring the temperature on the showerhead; and The temperature on the showerhead is controlled by controlling the power supplied to the heater insert and / or controlling the fluid flowing in the fluid line.

16. The method of claim 15, wherein the process gas is heated to a process temperature prior to flowing through the first cavity and through the second cavity.

17. The method of claim 16, wherein the first set point temperature is greater than the second set point temperature.

18. The method of claim 16, wherein the first set point temperature is less than the second set point temperature.

19. The method of claim 17, wherein the processing causes the second set point temperature to increase, and wherein controlling the temperature on the showerhead comprises reducing power supplied to the heater insert and increasing flow through the fluid line.

20. The method of claim 18, wherein the processing causes the second set point temperature to decrease, and wherein controlling the temperature on the showerhead comprises increasing power supplied to the heater insert and decreasing flow through the fluid line.

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