Dual channel monolithic gas manifold

Abstract

The present disclosure relates to a compact monolithic manifold for providing dual channel gas delivery for semiconductor processing tools. Some such manifolds may be designed with surface mounted flow component interfaces on opposite sides of the manifolds to reduce the overall footprint of the manifold block.

Description

Related Applications

[0001] The PCT application form is filed concurrently with this specification as a part of this application. Each application identified in the concurrently filed PCT application form to which this application claims the benefit or priority is incorporated herein by reference in its entirety and for all purposes. Background Art

[0002] Semiconductor processing tools often require the supply of various reactive gases to a wafer processing volume located within one or more semiconductor processing chambers. Surface mount valves and other surface mount flow components are often used to control the flow of various gases used during semiconductor processing operations in such tools.

[0003] This article discusses various improvements in manifolds that may be used with surface mount flow control components. Summary of the invention

[0004] The details of one or more implementations of the subject matter described in this specification are set forth in the accompanying drawings and the description that follows. Other features, aspects, and advantages will become apparent from the description, drawings, and claims.

[0005] In some implementations, a device may be provided, comprising: a manifold block having a group of at least five surface mount flow component interfaces. The group of at least five surface mount flow component interfaces (SMFCIs) may include a first SMFCI having a first central axis, a second SMFCI having a second central axis, a third SMFCI having a third central axis, a fourth SMFCI having a fourth central axis, and a fifth SMFCI having a fifth central axis. The first central axis may be parallel to and coincide with a first reference plane, and the fourth central axis may be parallel to and coincide with a second reference plane. The first SMFCI may be configured to cooperate with a first surface mount flow component, the second SMFCI may be configured to cooperate with a second surface mount flow component, the third SMFCI may be configured to cooperate with a third surface mount flow component, the fourth SMFCI may be configured to cooperate with a fourth surface mount flow component, and the fifth SMFCI may be configured to cooperate with a fifth surface mount flow component. The manifold block may include a first channel extending between the first SMFCI and the second SMFCI, a second channel extending between the second SMFCI and the third SMFCI, and a third channel extending between the fourth SMFCI and the fifth SMFCI. The first to third channels may be fluidly isolated from each other within the manifold block.

[0006] In some implementations, the first to fifth SMFCIs may be located on the same side of the manifold block.

[0007] In some implementations, the first SMFCI can be located on a side of the manifold block opposite the second SMFCI.

[0008] In some implementations, the second SMFCI and the third SMFCI can be located on the same side of the manifold block.

[0009] In some implementations, the first channel can extend along a first channel axis, the first channel axis is perpendicular to a second channel axis, the second channel extends along the second channel axis, and the first channel axis can be perpendicular to the first SMFCI.

[0010] In some implementations, the first channel can be a straight channel.

[0011] In some implementations, the second central axis and the third central axis can be parallel to the first reference plane and coincide with the first reference plane.

[0012] In some implementations, the fifth central axis can be parallel to the second reference plane and coincide with the second reference plane.

[0013] In some implementations, the first reference plane can be parallel to the second reference plane.

[0014] In some implementations, the manifold block may further include a transverse channel located inside the manifold block and fluidly connecting the third SMFCI and the fifth SMFCI.

[0015] In some implementations, the manifold block can be connected to a transverse channel outside the manifold block, and the transverse channel fluidly connects the third SMFCI with the fifth SMFCI.

[0016] In some implementations, the apparatus can further include an outlet flow path segment having a first end connected to the transverse channel fluid and a second end configured to connect to one or more components of a gas distribution system of a semiconductor processing tool.

[0017] In some implementations, the device may further include a first inlet flow path segment and a second inlet flow path segment. The first inlet flow path segment may be fluidically connected to the first SMFCI, the second inlet flow path segment may be fluidically connected to the fourth SMFCI, and the first inlet flow path segment and the second inlet flow path segment may be fluidically isolated from each other.

[0018] In some implementations, the first inlet flow path segment may extend through a first side of the manifold block, spanning between a side of the manifold block having the first SMFCI and a side of the manifold block opposite the side of the manifold block having the first SMFCI, and the second inlet flow path segment may extend through a second side of the manifold block, spanning between the side of the manifold block having the first SMFCI and the side of the manifold block opposite the side of the manifold block having the first SMFCI.

[0019] In some implementations, the first inlet flow path segment and the second inlet flow path segment can both extend through a first side of the manifold block, spanning between a side of the manifold block having the first SMFCI and a second side of the manifold block opposite the side of the manifold block having the first SMFCI.

[0020] In some implementations, the manifold block may have a width in a first direction perpendicular to the first reference plane, which is 225% or less of the width of the SMFCI in the first direction, and the manifold block may have a length in a second direction parallel to the first reference plane, which is 300% or less of the length of the SMFCI in the second direction.

[0021] In some implementations, the set of at least five SMFCIs may include a sixth SMFCI, the manifold block may further include a fourth channel extending between the fifth SMFCI and the sixth SMFCI, and the sixth SMFCI may be fluidly isolated from the first to fifth SMFCIs within the manifold block.

[0022] In some implementations, the device may further include: the first surface-mounted flow component; the second surface-mounted flow component; the third surface-mounted flow component; the fourth surface-mounted flow component; the fifth surface-mounted flow component; and the sixth surface-mounted flow component. The first surface-mounted flow component may be connected to the first SMFCI; the second surface-mounted flow component may be connected to the second SMFCI; the third surface-mounted flow component may be connected to the third SMFCI; the fourth surface-mounted flow component may be connected to the fourth SMFCI; the fifth surface-mounted flow component may be connected to the fifth SMFCI; and the sixth surface-mounted flow component may be connected to the sixth SMFCI.

[0023] In some implementations, the first surface mounted flow component and the fourth surface mounted flow component may be filters, and the second surface mounted flow component, the third surface mounted flow component, the fifth surface mounted flow component, and the sixth surface mounted flow component may be valves.

[0024] In some implementations, the first SMFCI includes four first holes arranged in an annular pattern around the first central axis, a first central port positioned along the first central axis, and at least a first centrifugal port located radially outward of the first central port relative to the first central axis, the second SMFCI includes four second holes arranged in an annular pattern around the second central axis, a second central port positioned along the second central axis, and at least a second centrifugal port located radially outward of the second central port relative to the second central axis, and the third SMFCI includes four third holes arranged in an annular pattern around the third central axis, a second central port positioned along the third central axis, and at least a second centrifugal port located radially outward of the second central port relative to the second central axis. The invention relates to a first SMFCI comprising a third center port positioned along the fourth center axis, and at least a third centrifugal port located radially outside the third center port relative to the third center axis, the fourth SMFCI comprises four fourth holes arranged in an annular pattern around the fourth center axis, a fourth center port positioned along the fourth center axis, and at least a fourth centrifugal port located radially outside the fourth center port relative to the fourth center axis, and the fifth SMFCI comprises four fifth holes arranged in an annular pattern around the fifth center axis, a fifth center port positioned along the fifth center axis, and at least a fifth centrifugal port located radially outside the fifth center port relative to the fifth center axis. The first central port and the first centrifugal port may each include a corresponding first hole and a corresponding first counterbore, wherein the corresponding first counterbore has a larger diameter than the corresponding first hole and is centered at the corresponding first hole, the second central port and the second centrifugal port may each include a corresponding second hole and a corresponding second counterbore, wherein the corresponding second counterbore has a larger diameter than the corresponding second hole and is centered at the corresponding second hole, the third central port and the third centrifugal port may each include a corresponding third hole and a corresponding third counterbore, wherein the corresponding third counterbore has a larger diameter than the corresponding third hole and is centered at the corresponding third hole, the fourth central port and the fourth centrifugal port may each include a corresponding fourth hole and a corresponding fourth counterbore, wherein the corresponding fourth counterbore has a larger diameter than the corresponding fourth hole and is centered at the corresponding fourth hole, and the fifth central port and the fifth centrifugal port may each include a corresponding fifth hole and a corresponding fifth counterbore, wherein the corresponding fifth counterbore has a larger diameter than the corresponding fifth hole and is centered at the corresponding fifth hole. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In the following discussion, reference is made to the following drawings; the drawings are not intended to be limiting in scope but are provided merely to facilitate the following discussion.

[0026] Figure 1 An exemplary flow component assembly is depicted.

[0027] Figure 2 Depicted in partially exploded view Figure 1 An exemplary flow component assembly of.

[0028] Figure 3 Depicts a perspective view of a surface mounted flow component interface.

[0029] Figure 4 and Figure 5 Depicted are top and bottom perspective views of an exemplary manifold block and some connecting components.

[0030] Figure 6 and Figure 7 Depicted Figure 4 and Figure 5 Top and side views of an exemplary manifold block with added crosshatching to indicate Figures 8 to 10 cross section.

[0031] Figure 8 is along Figure 7 A cross-sectional view along section line 8 in FIG.

[0032] Fig. 9 is along Figure 6 A cross-sectional view along section line 9 in FIG.

[0033] Fig.10 is along Figure 6 A cross-sectional view along section line 10 in FIG.

[0034] Fig.11 and Fig.12 Depicted are top and bottom perspective views of another exemplary manifold block and some connecting components.

[0035] Fig.13 Depicted Fig.11 and Fig.12 A side view of an exemplary manifold block, with hatching indicating cross-section Figures 14 to 16 cross section.

[0036] Fig.14 Depicted along Fig.13 A cross-sectional view along line 14 in FIG.

[0037] Fig.15 Depicted along Fig.13 A cross-sectional view along line 15 in FIG.

[0038] Fig.16 Depicted along Fig.13 A cross-sectional view along line 16 in FIG.

[0039] Fig.17 Describes the use Figures 11 to 16 A perspective view of a flow component assembly of an exemplary manifold block.

[0040] Fig.18 Depicted Figures 1 to 10 A cross-sectional view of a variant of a manifold block.

[0041] Fig.19 An example of a prior art flow component assembly is depicted.

[0042] Figures 20 to 24 Diagram depicting various manifold block designs. Fig.25 An exemplary semiconductor processing system having a flow component assembly as discussed herein is depicted.

[0043] The above-mentioned drawings are provided to facilitate understanding of the concepts discussed in the present disclosure and are used to depict some implementation schemes that fall within the scope of the present disclosure, but are not intended to be limiting - implementation schemes that conform to the present disclosure and are not depicted in the drawings are still considered to fall within the scope of the present disclosure. DETAILED DESCRIPTION

[0044] As discussed above, providing reactants and other gases to a semiconductor processing chamber typically involves the use of multiple, often dozens, of valves between such gas sources and the processing chamber(s) to which such gases are delivered. In most semiconductor processing chambers, such gases are delivered from a showerhead or gas distributor located above a susceptor within the chamber such that the gases flowing from the showerhead or gas distributor flow through the susceptor and the wafers supported thereby. In most cases, the many valves and other flow control components used may be mounted in what is known in the industry as a "gas box," which is a large housing that may house multiple sets of flow control components, one set for each of a variety of different gases, which may be controlled to produce a desired gas flow that is then delivered to the semiconductor processing chamber.

[0045] However, there may also be some valves or other flow control components located outside of the semiconductor processing chamber directly adjacent to the location to which the gas will be delivered, thereby reducing or minimizing the distance that the gas must travel and flow through before reaching the wafer. Such valves or other flow control components may be referred to as "point of use" valves or flow control components in this article. Point of use valves and flow control components provide enhanced control of the time when such gas streams reach the wafer, and it is possible to reduce the amount of gas that may be wasted in such gas streams (by reducing the lag time, which exists between the time point when the specific gas stream leading to the chamber is closed or adjusted and the time point when the effect of the adjustment becomes apparent in the gas stream reaching the wafer). In some semiconductor processing tools, it may also be desirable to mix two or more reactants together to form a more reactive compound, for example, two reactants do not form a deposition layer by themselves, but when combined into a specific compound, a deposition layer is indeed formed. In such a tool, it may be desirable to mix two or more reactants together at a location close to the delivery point, thereby reducing or minimizing the exposure of gas delivery lines and components to the compounds formed thereby (thereby reducing possible deposition in the gas supply line / components, or other undesirable interactions of the compound with the gas supply line / components).

[0046] In common semiconductor processing tools in which a showerhead or gas distribution system is positioned above a susceptor, point-of-use valves and flow control component assemblies for controlling gas flow may be mounted at a location proximate to the showerhead or gas distributor, in some cases directly on the ceiling or lid of the chamber to which the gas is delivered, and in many cases such a location may typically be free of large, bulky equipment and may generally be relatively easily accessible for maintenance purposes.

[0047] However, in some semiconductor processing tools, reactants can be delivered to the lower side of the wafer. In such tools, the base can actually be an inverted nozzle or gas distributor, and the wafer can actually be supported by a ring or support column located above the base, thereby forming a gap between the wafer and the base. In such tools, point-of-use valves and flow control components may need to be installed below the (multiple) chambers to which the process gases will be delivered. However, with respect to the installation location of such equipment on the lower side of the processing chamber, flexibility is usually much lower. For example, in many semiconductor processing tools, there will be a large diameter exhaust line, a vertical drive system for moving the base up and down, a high-voltage feed device for providing radio frequency power to the electrodes in the chamber, and a support structure located below the chamber for supporting the chamber. In addition, there may be a need for clearance requirements to provide sufficient access to the various systems located below the chamber for maintenance. These issues make it challenging to find space for point-of-use valves and flow control components below the processing chamber.

[0048] The inventors have contemplated a compact, dual-channel, monolithic manifold for surface mounted valves and flow control components that allows two separate input streams to be filtered and controlled with valves before being combined into a common outlet flow path. Such manifolds have a compact packaging footprint, which makes them more suitable for installation in space-constrained locations, such as below a semiconductor processing chamber. At the same time, through its "monolithic" design, such manifolds also have a reduced number of potential leak points, thereby reducing the likelihood of leaks and potential maintenance / refit requirements.

[0049] Figure 1 An exemplary point-of-use flow component assembly utilizing such a dual-channel monolithic manifold is depicted. Figure 2 An exemplary point-of-use flow component assembly is depicted in a partially disassembled state. Figure 1 and Figure 2 As shown, a flow component assembly 100 is provided by mounting surface-mounted flow components 126 (e.g., filters 128, valves 130, etc.) to a manifold block 104 using fasteners 134. Each surface-mounted flow component can be mated with a corresponding surface-mounted flow component interface (SMFCI) 106 on the manifold block 104. The surface-mounted flow components can include, for example, valves, filters, pressure regulators, through-caps (through-caps can be used when the number of SMFCIs provided for a particular channel in the manifold block 104 is greater than the number of flow components required for the channel), etc.

[0050] SMFCI is an industry standard fluidic interface that allows a modular approach to assembling fluid control systems. It is commonly used in the semiconductor processing field, and different manufacturers offer a variety of different types of flow components that all use SMFCI. Figure 3(which is a drawing drawn to scale) depicts a stereogram of a common SMFCI 306. As can be seen, the SMFCI 306 is a square area, for example, about 1.125 inches on a side, with a circular or square pattern of holes 310, the holes 310 being centered on the central axis 320 of the SMFCI 306. The holes 310 can be through holes to allow threaded fasteners to be inserted therein to secure the surface mount flow component thereto, for example, using a nut screwed into the threaded end of the fastener. Alternatively, the holes 310 can be threaded so that the fastener can be screwed directly into the threaded holes 310. Obviously, due to the radially symmetrical configuration of the square area and the holes 310 about the central axis 320, the surface mount flow component can generally be mated with the SMFCI 306 in any of four possible directions, each direction being 90° from the adjacent direction. The SMFCI 306 may also include holes 316, each of which can lead to a separate flow path inside the component having the SMFCI 306. One of the holes 316 is typically centered about the central axis 320 so that it is aligned with a corresponding opening on a surface mounted flow component regardless of the orientation of the surface mounted flow component. One or more additional holes 316 may be provided at locations radially offset from the centrally located hole 316 relative to the central axis 320. Each hole 316 may be provided with a counterbore 318 that may be sized to accommodate an annular seal, such as an O-ring or C-seal. Figure 3 , only two holes 316 are shown for the depicted SMFCI 306, but other SMFCIs 306 may have three, four, or five holes 316 (some examples later in this document show SMFCIs with three holes 316).

[0051] Fluid flowing through SMFCI 306 typically flows into the flow component mating with SMFCI 306 through one of the holes 316 and then exits the flow component via the other hole or holes 316. SMFCIs 306 are typically planar in nature as they are designed to mate with planar flanges on flow components.

[0052] return Figure 1 and Figure 2 , the manifold block 104 shown has a total of six SMFCIs 106, two on the top side ( Figure 2 ), and four on the bottom side ( Figure 2 Attached to the manifold block 104 is also a pair of inlet fittings 136 and outlet fittings 138. Each inlet fitting 136 is fluidly connected to a corresponding inlet flow path segment leading to one of the SMFCIs 106. Similarly, the outlet fitting 138 is fluidly connected to outlet flow path segments leading to both of the SMFCIs 106, such as via transverse passages 156.

[0053] As can be seen, an optional sealing plate 108 can be sandwiched between each flow component 126 and the SMFCI 106 to which it is mounted. For example, each sealing plate 108 can take the form of a thin metal square, for example, of the same size and shape as the SMFCI, and having through holes that correspond in position to the various holes and apertures of the SMFCI 106. The apertures that correspond in position to the apertures of the SMFCI can be equipped with a C-seal, for example, a metal tubular annular body having a peripheral slit along its outermost periphery, the aperture for each such aperture being sized to be slightly smaller than the C-seal, so that the C-seal captures the metal square within the peripheral slit, thereby retaining the C-seal in the sealing plate 108. The sealing plates 108 can allow the seals retained therein to be easily and simultaneously positioned within the SMFCI 106 used with them, and can reduce the chance of losing the seal during installation.

[0054] Figure 4 and Figure 5 A perspective view of the manifold block 104 is depicted without the flow components 126 attached. All six SMFCIs 106 are Figure 4 and Figure 5 (The central axis of the SMFCI 106 is indicated in the figure by an arrow perpendicular to each SMFCI 106). The first inlet flow path segment 160 and the second inlet flow path segment 162 can also be seen in Figure 4 and Figure 5 , each of which fluidically connects one of the inlet fittings 136 (omitted in these views) to a corresponding one of the SMFCI 106. For example, Figure 4 and Figure 5 The SMFCIs 106 in the embodiment have been designated as SMFCIs 106a / b / c / d / e / f and may be referred to herein as first / second / third / fourth / fifth / sixth SMFCIs, respectively. Thus, for example, the first inlet flow path segment 160 may be fluidly connected to one of the ports of the first SMFCI 106a, and the second inlet flow path segment 162 may be fluidly connected to one of the ports of the fourth SMFCI 106d. An outlet flow path segment 158 ​​may also be provided to fluidly connect the outlet fitting 138 to two of the SMFCIs 106, for example, via the transverse passage 156.

[0055] The first reference plane 122 and the second reference plane 124 are also shown Figure 4 and Figure 5In this example, the first reference plane 122 and the second reference plane 124 are parallel to each other, but in other implementations, the first reference plane 122 and the second reference plane 124 may not be arranged in parallel. Further description of these reference planes will be discussed below.

[0056] Figure 6 and Figure 7 Depicted are top and side views of the manifold block 104 (and some connected hardware), with cross-hatching indicating Figures 8 to 10 Therefore, Figure 8 is along Figure 7 A cross-sectional view of the manifold block 104 (and some attached hardware) with cross-hatching, Fig. 9 is along Figure 6 A cross-sectional view of the manifold block 104 and the transverse passage 156 along a vertical section line of Fig.10 is along Figure 6 1 and 2 ( FIG. 1 ). A cross-sectional view of the manifold block 104 taken along any horizontal section line of FIG. 1 (in this example, both sections are the same).

[0057] like Figure 8 As shown, the manifold block 104 may have two flow paths starting from a first inlet flow path segment 160 and a second inlet flow path segment 162, the two flow paths being fluidly isolated from each other within the manifold block 104, at least until the point at which the fluid leaves the last SMFCI 106. The first flow path may, for example, start from the first inlet flow path segment 160 and flow through the first SMFCI 106a. The first flow path may also include a first channel 144 (in this case, a straight channel extending through the manifold block 104 in a direction perpendicular to the first SMFCI 106a (e.g., along the central axis of the first SMFCI 106a), see Fig.10 ), the first passage 144 fluidly connects the first SMFCI 106a with the second SMFCI 106b. The second passage 146 as part of the first flow path can similarly connect the second SMFCI 106b with the third SMFCI 106c. The second passage 146 can be provided, for example, by a hole drilled into one end of the manifold block 104, passing through the third SMFCI 106c, and reaching the second SMFCI 106b. The plug 152 can then be inserted into the drilled hole and welded or brazed in place to seal the drilled hole. The plug 152 can, for example, extend to a depth in the drilled hole that is less than the depth at which the drilled hole can be fluidly connected to the third SMFCI 106c.

[0058] In a similar manner, the second flow path may begin at the second inlet flow path segment 162 and flow through the fourth SMFCI 106d. The second flow path may also include a third channel 148 fluidly connecting the fourth SMFCI 106d and the fifth SMFCI 106e within the manifold block 104, and a fourth channel 150 fluidly connecting the fifth SMFCI 106e and the sixth SMFCI 106f within the manifold block. In this example, the first channel 144 and the second channel 146 are both straight channels, whose central axes are located on the first reference plane 122, such as coincident with and parallel to the first reference plane 122, and the third channel 148 and the fourth channel 150 are both straight channels, and their central axes are located on the second reference plane 124. In the depicted configuration, the portion of the first flow path including the first channel 144 to the fourth channel 150 and the portion of the second flow path generally repeat each other (including the plug 152), and therefore should have similar or identical gas flow characteristics.

[0059] In the example of the manifold block 104, the two flow paths remain fluidly isolated from each other throughout the manifold block 104, but are then fluidly connected to each other via the transverse passage 156 (see Fig. 9 ), the transverse passage 156 is provided by a welded tube structure welded or brazed to the manifold block 104. The transverse passage 156 is fluidly connected to the outlet flow path segment 158, thereby allowing the gases delivered by the two flow paths to be delivered from the outlet flow path segment 158 ​​in a combined manner.

[0060] An alternative implementation of the manifold block 104 is Fig.11 and 12 , which are top and bottom perspective views of manifold block 1104. Similar to manifold block 104, manifold block 1104 is connected to inlet fitting 1136 via first inlet flow path segment 1160 and second inlet flow path segment 1162, and to outlet fitting 1138 via outlet flow path segment 1158. Manifold block 1104 may also have first reference plane 1122 and second reference plane 1124 associated therewith. SMFCI 1106a-f are also depicted. Transverse channels are also present in this design, but are incorporated into manifold block 1104, for example, in a raised portion thereof, with plug 1152 in the Fig.12 Visible in.

[0061] Fig.13 A side view of the manifold block 1104 (and some additional components) is depicted, with the cross-hatching indicating Figures 14 to 16 The cross section of Fig.14 It will be apparent that the first through fourth channels 1144 through 1150 between the SMFCIs 1106a-f are generally configured in the same manner as the first through fourth channels 144 through 150 of the manifold block 104, respectively. Fig.15 and Fig.16 As can be seen, manifold block 1104 differs from manifold block 104 in that manifold block 1104 includes an internal transverse channel 1156. Transverse channel 1156 in this example may be wound several times, first extending along a short channel that leads from the ports of the third SMFCI 1106c and the sixth SMFCI 1106f to a short riser channel (extending in a direction perpendicular to SMFCI 1106), which extends from these short channels to a cross section linking the two riser channels. An outlet flow path segment 1158 may be fluidly connected to transverse channel 1156, for example, via a connection to a hole in one side of manifold block 1104 leading to transverse channel 1156. This design eliminates some external flow components (e.g., elbows and pipe segments) with which manifold block 104 connects to provide transverse channel 156, and therefore may be less susceptible to damage (although manifold block 1104 may require more mechanical processing / material).

[0062] Fig.17 A manifold block 1104 is shown with various flow components attached to form a flow component assembly 1102, similar to Figure 1 As shown, the two manifold blocks 104 and 1104 generally occupy the same packaging volume.

[0063] It should be understood that in the examples discussed above, each of the two flow paths entering the manifold blocks 104 and 1104 can pass through three different SFMCIs in series. This allows surface-mounted flow components of various configurations to be installed on the manifold block to provide different functions. For example, in some implementations, a surface-mounted filter can be installed in the SMFCI closest to the first inlet flow path segment and the second inlet flow path segment, thereby allowing the process gas supplied therethrough to be filtered before reaching the semiconductor processing chamber. In such an implementation, one or two surface-mounted valves can be installed immediately downstream thereof. For example, a shutoff valve (e.g., a shutoff valve that can be quickly switched between fully open and fully closed, but which may not be able to perform more sophisticated flow control) can be installed at one or both of the second and fifth SMFCIs, while a flow control valve (e.g., a valve that can be switched between at least two different non-zero flow rates) can be installed at one or both of the third and sixth SMFCIs. Such a configuration can allow variable or single-speed flow control of the gas flowing along each flow path.

[0064] It should also be understood that if flow control components are omitted from the SMFCI, for example, as is the case in the above example of the fourth SMFCI, a through-cap, such as through-cap 132, may be used to direct gas through the SMFCI with low or minimal increase in flow resistance. Alternatively, the manifold block may be designed such that one of the SMFCIs on either or both flow paths is omitted entirely, in which case there may be a smaller number of passages between the SMFCIs. For example, Fig.18 As shown, a manifold block 1804 is shown which is identical to manifold block 104 except that first SMFCI 106a is omitted. First inlet flow path segment 1860 has been extended to reach the aperture of second SMFCI 1806b, thereby providing an effect equivalent to using a through cover (albeit a more streamlined equivalent).

[0065] Additionally, while the SMFCIs shown in the figures are all of the same size, it should be understood that SMFCIs of different sizes may be used in different environments and that a mix of SMFCIs of different sizes may be used with the manifold blocks discussed herein.

[0066] It will be apparent from the above discussion and the accompanying drawings discussed therein that the manifold block exemplified above provides a very compact valve system. Fig.19 As shown, the examples provided above were found to provide a packaging package size reduction of approximately 72%, thereby allowing two such manifold block assemblies to be installed within the same volume occupied by an equivalent valve system, such as Fig.19 To give an idea of ​​scale, some manifold blocks as discussed above may have a width in a first direction perpendicular to a first reference plane that is less than 225% of the width of one of the SMFCIs along the first direction (e.g., between 200% and 225%), and may have a length in a second direction parallel to the first reference plane and perpendicular to the first direction that is less than 300% of the width of one of the SMFCIs along the first direction (e.g., between 230% and 300%). For example, Figures 1 to 10 The illustrated implementation (excluding inlet and outlet flow path hardware extending from the manifold block 104) may have a height of approximately less than 8 inches in a direction parallel to the central axis of the SMFCI, a width of approximately 2.5 inches in a direction perpendicular to the first reference plane, and a length of approximately 3.375 inches in a direction parallel to the SMFCI and perpendicular to the width direction.

[0067] Such a compact footprint is achieved in part by positioning some of the SMFCIs on opposite sides of the manifold block. This allows the footprints of the SMFCIs to overlap when viewed along the SMFCI center axis, thereby allowing an increased number of SMFCIs to be installed in a given area (compared to an SMFCI configuration where all SMFCIs are configured in a non-overlapping manner). It should be understood that such overlap is not strictly necessary, although a manifold block in which all SMFCIs are on the same side and without overlap may not be used to provide such a compact assembly as the valve assembly described.

[0068] Figure 20 to Figure 24 An alternative configuration of a manifold block is shown in which may provide a similar, though perhaps less space efficient, reduced packaging volume (with non-overlapping SMFCI footprints). Figure 20 to Figure 24 In the figure, the SMFCI is shown with dotted lines, while the channels inside the manifold block (e.g., between the ports of the SMFCI, or between the SMFCI ports and external tubular channels), the bend fittings, or the T-shaped fittings are shown with dot-dash lines.

[0069] exist Fig. 20, a manifold block 2004 is shown with a configuration of five SMFCIs thereon, SMFCIs 2006a and 2006b may be fluidly connected in series with a first inlet flow path 2060, thereby allowing a first surface mounted flow component (e.g., a filter) to be mounted to the first SMFCI 2006a, and a second surface mounted flow component (e.g., a valve) to be mounted to the second SMFCI 2006b, thereby allowing controlled flow of filtered gas to a transverse channel 2056 leading to an outlet flow path segment 2058. A second inlet flow path 2062 may be fluidly connected in series with a third SMFCI 2006c, a fourth SMFCI 2006d, and a fifth SMFCI 2006e. The fourth SMFCI 2006d and the fifth SMFCI 2006e may also be fluidly connected to the transverse channel 2056 so that the gas flowing through either or both of the fourth SMFCI 2006d and the fifth SMFCI 2006e will mix with the gas flowing from the second SMFCI 2006b into the transverse channel 2056. As shown, the first SMFCI 2006a is fluidly connected to the second SMFCI 2006b through the first channel 2044, and the third SMFCI 2006c is fluidly connected to the fourth SMFCI 2006d through the second channel 2046. The first channel 2044 and the second channel 2046 may extend in parallel directions and have approximately the same length. The third channel 2048 may fluidly connect the fourth SMFCI 2006d to the fifth SMFCI 2006e, and the third channel 2048 may extend in a direction perpendicular to the first channel 2044 and the second channel 2046 and parallel to the SMFCI 2006.

[0070] Manifold block 2004 provides a compact assembly that is nearly as compact in the plane of the SMFCI as described above with respect to manifold blocks 104 and 1104, but is also compact in a direction perpendicular to the SMFCI. It can also be observed that the second flow path in manifold block 2004 has two fluid connection points with transverse channel 2056, as opposed to the single fluid connection point of the second flow path of manifold blocks 104 or 1104 with transverse channel 156 or 1156, respectively. In this example, SMFCI 2006d is a 3-port SMFCI that, for example, when connected to a surface mount diaphragm valve, can be operated to close the center port from two side ports (which can remain fluidly connected due to the annular plenum surrounding the sealed center port). In such a case, one of the side ports in SMFCI 2006d can be connected to second channel 2046, thereby supplying gas to the second side port in SMFCI 2006d, and therefore to SMFCI 2006e, regardless of the valve state of the valve connected to SMFCI 2006d. When the valve at SMFCI 2006d is actuated to an open state, gas can be directed to transverse channel 2056 via the central port of SMFCI 2006d. Similarly, when the valve at SMFCI 2006e is actuated to an open state, gas can be directed to transverse channel 2056 via one of the ports of SMFCI 2006e. For example, if the two flow paths leading from SMFCIs 2006d and 2006e to transverse channel 2056 are provided with different flow resistances (e.g., by using one or more restrictors or flow restrictors that can be fluidly inserted between transverse channel 2056 and one or both of SMFCIs 2006d and 2006e), this can actually allow the flow through SMFCIs 2006d and 2006e to switch between two or three different flow rates (e.g., through a lower flow rate flow path from one of SMFCIs 2006d and 2006e, through a higher flow rate flow path from the other of SMFCIs 2006d and 2006e, or through both flow paths from SMFCIs 2006d and 2006e).

[0071] Fig.21Manifold block 2104 is shown with a configuration of six SMFCIs thereon, SMFCIs 2106a, 2106b, and 2106c may be fluidly connected in series with a first inlet flow path 2160, allowing a first surface mount flow component (e.g., a filter) to be mounted to the first SMFCI 2106a, and second and third surface mount flow components (e.g., valves) to be mounted to the second and third SMFCIs 2106b, 2106c, allowing controlled flow of filtered gas to a transverse channel 2156 leading to an outlet flow path segment 2158. A second inlet flow path 2162 may be fluidly connected in series with a fourth SMFCI 2106d, a fifth SMFCI 2106e, and a sixth SMFCI 2106f. The sixth SMFCI 2106f may also be fluidly connected to the transverse channel 2156 so that the gas flowing through the sixth SMFCI 2106f will mix with the gas flowing into the transverse channel 2156 from the third SMFCI 2106c. As shown, the second SMFCI 2106b is fluidly connected to the third SMFCI 2106c through the first channel 2144, and the first SMFCI 2106a is fluidly connected to the second SMFCI 2106b through an external fluid channel, such as provided by a pipe and an elbow fitting. For example, a filter can be connected to the fourth SMFCI 2106d, and a valve can be connected to the fifth SMFCI 2106e and the sixth SMFCI 2106f. The two valves in series may, for example, include an upstream shutoff valve and a downstream variable flow rate valve.

[0072] In this example, the fourth SMFCI 2106d and the fifth SMFCI 2106e, as well as the fifth SMFCI 2106e and the sixth SMFCI 2106f are also fluidically connected via an external fluid channel. Also in this example, the five SMFCIs are configured along a common axis, for example, in a linear array, but the direction of the fluid flowing through each of these SMFCIs (or at least a portion of these SMFCIs) is configured in a direction perpendicular to the array axis.

[0073] Fig. 22 A manifold block 2204 is shown that is similar to manifold block 2104, except that first SMFCI 2106a is omitted and the first flow path flows directly into what would be the second SMFCI 2106b of the manifold block 2104. Features of manifold block 2204 that are labeled with the same two digits as similar features in manifold block 2104 can be assumed to be the same, and the description of those similar features in the above discussion of manifold block 2104 also applies. Fig. 22 The corresponding features among those features in .

[0074] Fig.23 A manifold block 2304 is depicted that is similar to the manifold block 2104, except that all six SMFCIs 2306a-f are configured in a linear array. There is also no channel connecting two SMFCIs inside the manifold block 2304. Instead, the first SMFCI 2306a is fluidly connected to the second SMFCI 2306b through an external flow path, and the second SMFCI 2306b is fluidly connected to the third SMFCI 2306c through another external flow path. Similarly, the fourth SMFCI 2306d is fluidly connected to the fifth SMFCI 2306e through an external flow path, and the fifth SMFCI 2306e is fluidly connected to the sixth SMFCI 2306f through another external flow path. The third SMFCI 2306c and the sixth SMFCI 2306f are both fluidly connected to the transverse channel 2356 leading to the outlet flow path segment 2358. Flow control components may be connected to SMFCIs 2306a-f in a manner similar to how flow control components may be connected to SMFCIs 2106a-f. Features of manifold block 2304 that have a reference numeral (with the following two digits being the same as similar features in manifold block 2104) may be assumed to be the same, and the description of those similar features in the above discussion of manifold block 2104 applies equally to the same. Fig.23 The corresponding features among those in .

[0075] Fig.24 A manifold block 2404 is depicted that includes five SMFCIs 2406a-e, which can provide Fig. 20 2406a-e are similar in function and operation to the fluid circuit of the manifold block, except that the SMFCIs 2406a-e are arranged in a linear array. In this example, only one channel 2444 is provided inside the manifold block to fluidically connect the fourth SMFCI 2406d and the fifth SMFCI 2406e, and other fluid connections between the SMFCIs are achieved via external piping connections. Features of the manifold block 2404 with a reference (the last two digits are the same as similar features in the manifold block 2104) can be assumed to be the same, and the description of those similar features in the above discussion of the manifold block 2104 also applies to Fig.24 The corresponding features among those in .

[0076] As described above, the manifold blocks and valve assemblies used therewith discussed herein may be installed beneath a semiconductor processing chamber. Fig.25 An example of such an installation is depicted in Fig.25, a semiconductor processing chamber 2564 is shown that includes a showerhead 2570 that can be used to provide process gases to a wafer 2572, which can be supported within the chamber 2564 by a wafer support 2574 connected to a showerhead base 2568. The showerhead base 2568 can have a plurality of orifices in a top surface that can be used to supply process gases to the underside of the wafer 2572. Gases can be provided to these orifices via an internal plenum (not shown) of the showerhead base 2568, for example, from a flow component assembly 2502 (e.g., an assembly similar to the flow component assembly 102) via a stem 2566. A lifting mechanism 2576 can be provided to allow the stem 2566 (and the showerhead base 2568) to move vertically up and down within the chamber 2564 as desired. The flow component assembly 2502 can be connected to the stem 2566 so that they move in tandem with the stem 2566.

[0077] For example, control of the flow component assemblies described herein can be assisted by the use of a controller that can be included as part of a semiconductor processing tool having a flow component assembly. The above-described systems can be integrated with electronic devices to control the operation of these systems before and after processing of semiconductor wafers or substrates. The electronic device can be referred to as a "controller" and can control various components or subcomponents of a system or systems. Depending on the processing requirements and / or system type, the controller can be programmed to control any of the systems disclosed herein, including the operation of a number of valves or other components included in the flow control assembly.

[0078] Broadly speaking, a controller can be defined as an electronic device having various integrated circuits, logic, memory, and / or software that receive instructions, issue instructions, control operations, enable cleaning operations, enable endpoint measurements, etc. The integrated circuits can include chips in the form of firmware that store program instructions, digital signal processors (DSPs), chips defined as application specific integrated circuits (ASICs), and / or one or more microprocessors or microcontrollers that execute program instructions (e.g., software). The program instructions can be instructions sent to the controller in the form of various individual settings (or program files) that define operating parameters for performing specific gas flow operations using the flow component assemblies described herein.

[0079] In some implementations, the controller may be part of or coupled to a computer that is integrated with the system, coupled to the system, otherwise networked to the system, or a combination thereof. For example, the controller may be in the "cloud" or all or part of a wafer fab host system that may allow remote access to wafer processing. The computer may enable remote access to the system to monitor the current progress of a manufacturing operation, check the history of past manufacturing operations, check trends or performance criteria for multiple manufacturing operations, change parameters of a current process, set processing steps to follow the current process, or start a new process. In some examples, a remote computer (e.g., a server) may provide a process recipe to the system via a network (which may include a local network or the Internet). The remote computer may include a user interface that enables input or programming of parameters and / or settings, which are then sent from the remote computer to the system. In some examples, the controller receives instructions in the form of data that specify parameters for each processing step to be performed during one or more operations. It should be understood that the parameters may be specific to the type of process to be performed and the type of tool that the controller is configured to interface with or control. Thus, as described above, the controller can be distributed, for example, by including one or more discrete controllers networked together and working toward a common purpose (e.g., the processes and controls described herein). An example of a distributed controller for such a purpose is one or more integrated circuits on a chamber (e.g., a VTM) that communicate with one or more integrated circuits remotely (e.g., at a platform level or as part of a remote computer), which combine to control gas flow operations using the flow component assemblies discussed herein.

[0080] The flow component assemblies described herein may be connected to one or more other devices, including but not limited to plasma etching chambers or modules, deposition chambers or modules, spin rinse chambers or modules, metal plating chambers or modules, cleaning chambers or modules, chamfer edge etching chambers or modules, physical vapor deposition (PVD) chambers or modules, chemical vapor deposition (CVD) chambers or modules, atomic layer deposition (ALD) chambers or modules, atomic layer etching (ALE) chambers or modules, ion implantation chambers or modules, track chambers or modules, or any other semiconductor processing system that may be associated with or used for the manufacture and / or preparation of semiconductor wafers.

[0081] As described above, depending on one or more processing steps to be performed by the tool, the controller can communicate with one or more other tool circuits or modules, other tool components, cluster tools, other tool interfaces, adjacent tools, neighboring tools, tools located throughout the factory, a host computer, another controller, or tools used in material transport of wafer containers (e.g., FOUPs) to and from tool locations and / or load ports in a semiconductor manufacturing facility.

[0082] For purposes of this disclosure, the term "fluidically connected" is used to refer to volumes, plenums, holes, etc., which can be connected to each other directly or through one or more intermediate components or volumes to form a fluid connection, similar to the term "electrically connected" used to refer to components that are connected together to form an electrical connection. The term "fluid interposition" (if used) can be used to refer to a component, volume, plenum, or hole that is fluidly connected to at least two other components, volumes, plenums, or holes, so that fluid flowing from one of those other components, volumes, plenums, or holes to the other or another of those components, volumes, plenums, or holes will first flow through the "fluid interposition" component and then reach the other or another of those components, volumes, plenums, or holes. For example, if a pump is fluidly interposed between a reservoir and an outlet, fluid flowing from the reservoir to the outlet will first flow through the pump and then reach the outlet. The term "fluidically adjacent", if used, refers to the placement of one fluid element relative to another fluid element such that no possible structure is fluidly interposed between the two elements that could interrupt fluid flow between the two fluid elements. For example, in a flow path having a first valve, a second valve, and a third valve sequentially positioned there along, the first valve is fluidly adjacent to the second valve, the second valve is fluidly adjacent to both the first and third valves, and the third valve is fluidly adjacent to the second valve.

[0083] Any ordinal labels (if any) used in the present disclosure and claims, such as (a), (b), (c) ... or (1), (2), (3) ... or the like, should be understood as not conveying any particular order or sequence unless such order or sequence is explicitly indicated. For example, if there are three steps labeled (i), (ii), and (iii), it should be understood that the steps can be performed in any order (or even simultaneously, if there are no other limitations) unless otherwise indicated. For example, if step (ii) involves the operation of an element produced in step (i), then step (ii) can be considered to occur at a point after step (i). Similarly, if step (i) involves the operation of an element produced in step (ii), it should be understood to be the opposite. It should also be understood that the use of the ordinal label "first" (e.g., "first item") in this document should not be interpreted as implicitly or inherently suggesting that there must be a "second" instance (e.g., "second item").

[0084] It should be understood that the phrases "for each <item> in one or more <items>," "each <item> in one or more <items>," and the like, if used herein, include both single-item groups and multi-item groups, i.e., the phrase "for...each" is used in the sense that it is used in a programming language to refer to each item in any group of items referenced. For example, if the group of items referenced is a single item, then "each" will refer only to that single item (although dictionary definitions of "each" often define the term to mean "each of two or more things"), and does not mean that there must be at least two of those items. Similarly, the terms "set" or "subset" by themselves should not be taken to necessarily cover multiple items - it should be understood that a set or subset may cover only one member or multiple members (unless the context dictates otherwise).

[0085] Unless otherwise indicated, when the term "between" used in this article is used with a numerical range, it should be understood to include the starting and ending values ​​of the range. For example, between 1 and 5 should be understood to include numbers 1, 2, 3, 4 and 5, not just numbers 2, 3 and 4.

[0086] The term "operably connected" should be understood to refer to a state in which two components and / or systems are directly or indirectly connected so that, for example, at least one component or system can control the other. For example, a controller may be described as being operably connected to a resistive heating unit, including a controller connected to a sub-controller of the resistive heating unit, the sub-controller being electrically connected to a relay, the relay being configured to controllably connect or disconnect the resistive heating unit from a power source capable of providing an amount of electricity that can be supplied to the resistive heating unit to produce a desired degree of heating. Because of the electrical current involved, the controller itself may not be able to directly provide such power to the resistive heating unit, but it should be understood that the controller is still operably connected to the resistive heating unit.

[0087] It should be understood that the examples and implementations described herein are for illustrative purposes only, and that those skilled in the art will associate various modifications or variations therewith. Although various details have been omitted for clarity, various design alternatives may be implemented. Therefore, the present examples are considered to be illustrative rather than restrictive, and the present disclosure is not limited to the details set forth herein, but may be modified within the scope of the present disclosure.

[0088] It should be understood that although the above disclosure focuses on one or more specific exemplary implementations, it is not limited to the examples discussed, but is also applicable to similar variations and mechanisms, and such similar variations and mechanisms are also considered to fall within the scope of the present disclosure.

Claims

1. A device comprising: A manifold block having a set of at least five surface mount flow component interfaces, wherein: The set of at least five surface mount flow component interfaces (SMFCIs) includes a first SMFCI having a first central axis, a second SMFCI having a second central axis, a third SMFCI having a third central axis, a fourth SMFCI having a fourth central axis, and a fifth SMFCI having a fifth central axis, The first central axis is parallel to the first reference plane and coincides with the first reference plane, The fourth central axis is parallel to the second reference plane and coincides with the second reference plane, The first SMFCI is configured to cooperate with a first surface mounted flow component, the second SMFCI is configured to cooperate with a second surface mounted flow component, the third SMFCI is configured to cooperate with a third surface mounted flow component, the fourth SMFCI is configured to cooperate with a fourth surface mounted flow component, and the fifth SMFCI is configured to cooperate with a fifth surface mounted flow component, The manifold block includes a first channel extending between the first SMFCI and the second SMFCI, a second channel extending between the second SMFCI and the third SMFCI, a third channel extending between the fourth SMFCI and the fifth SMFCI, and The first through third passages are fluidly isolated from one another within the manifold block. 2 . The apparatus of claim 1 , wherein the first to fifth SMFCIs are located on the same side of the manifold block.

3. The apparatus of claim 1, wherein the first SMFCI is located on a side of the manifold block opposite to the second SMFCI.

4. The apparatus of claim 3, wherein the second SMFCI and the third SMFCI are located on the same side of the manifold block.

5. The device according to claim 3, wherein: The first channel extends along a first channel axis, the first channel axis is perpendicular to a second channel axis, the second channel extends along the second channel axis, and The first channel axis is perpendicular to the first SMFCI. The device according to claim 5 , wherein the first channel is a straight channel.

7. The device according to any one of claims 1 to 6, wherein the corresponding second center axis and the third center axis are parallel to the first reference plane and coincide with the first reference plane.

8. The device of claim 7, wherein the fifth central axis is parallel to and coincident with the second reference plane.

9. The apparatus of claim 8, wherein the first reference plane is parallel to the second reference plane.

10. The apparatus of claim 9, wherein the manifold block further comprises a transverse channel located inside the manifold block and fluidly connecting the third SMFCI and the fifth SMFCI.

11. The apparatus of claim 10, wherein the manifold block is connected to a transverse channel outside the manifold block, and the transverse channel fluidly connects the third SMFCI with the fifth SMFCI.

12. The apparatus of claim 10, further comprising an outlet flow path segment having a first end connected to the transverse channel fluid and a second end configured to be connected to one or more components of a gas distribution system of a semiconductor processing tool.

13. The apparatus of claim 1 further comprising a first inlet flow path segment and a second inlet flow path segment, wherein: The first inlet flow path segment is fluidly connected to the first SMFCI, The second inlet flow path segment is fluidly connected to the fourth SMFCI, and The first inlet flow path segment and the second inlet flow path segment are fluidly isolated from each other.

14. The device according to claim 13, wherein: The first inlet flow path segment extends through a first side of the manifold block, spanning between a side of the manifold block having the first SMFCI and a side of the manifold block opposite the side of the manifold block having the first SMFCI, and The second inlet flow path segment extends through a second side of the manifold block, spanning between the side of the manifold block having the first SMFCI and the side of the manifold block opposite the side of the manifold block having the first SMFCI.

15. The device according to claim 13, wherein: The first inlet flow path segment and the second inlet flow path segment both extend through a first side of the manifold block, spanning between a side of the manifold block having the first SMFCI and a second side of the manifold block opposite the side of the manifold block having the first SMFCI.

16. The device according to claim 15, wherein: The manifold block has a width in a first direction perpendicular to the first reference plane, the width being 225% or less of a width of the SMFCI in the first direction, and The manifold block has a length in a second direction parallel to the first reference plane, the length being 300% or less of a length of the SMFCI in the second direction.

17. The device according to claim 16, wherein: The group of at least five SMFCIs includes a sixth SMFCI, The manifold block further includes a fourth passage extending between the fifth SMFCI and the sixth SMFCI, and The sixth SMFCI is fluidly isolated from the first through fifth SMFCIs within the manifold block.

18. The apparatus according to claim 17, further comprising: The first surface mounts a flow component; said second surface mounted flow component; said third surface mounted flow component; said fourth surface mounted flow component; said fifth surface mounted flow component; as well as A sixth surface mount flow component, wherein: The first surface mounted flow component is connected to the first SMFCI; The second surface mounted flow component is connected to the second SMFCI; The third surface mounted flow component is connected to the third SMFCI; The fourth surface mounted flow component is connected to the fourth SMFCI; The fifth surface mount flow component is connected to the fifth SMFCI; and The sixth surface mounted flow component is connected to the sixth SMFCI.

19. The device of claim 18, wherein the first surface mounted flow component and the fourth surface mounted flow component are filters, and the second surface mounted flow component, the third surface mounted flow component, the fifth surface mounted flow component, and the sixth surface mounted flow component are valves.

20. The device according to claim 1, wherein: The first SMFCI includes four first holes arranged in an annular pattern around the first central axis, a first central port located along the first central axis, and at least a first centrifugal port located radially outward of the first central port relative to the first central axis, wherein the first central port and the first centrifugal port each include a corresponding first hole and a corresponding first counterbore, the corresponding first counterbore having a larger diameter than the corresponding first hole and centered at the corresponding first hole, The second SMFCI includes four second holes arranged in an annular pattern around the second central axis, a second central port located along the second central axis, and at least a second centrifugal port located radially outward of the second central port relative to the second central axis, wherein the second central port and the second centrifugal port each include a corresponding second hole and a corresponding second counterbore, the corresponding second counterbore having a larger diameter than the corresponding second hole and centered at the corresponding second hole, The third SMFCI includes four third holes arranged in an annular pattern around the third central axis, a third central port located along the third central axis, and at least a third centrifugal port located radially outward of the third central port relative to the third central axis, wherein the third central port and the third centrifugal port each include a corresponding third hole and a corresponding third counterbore, the corresponding third counterbore having a larger diameter than the corresponding third hole and centered at the corresponding third hole, The fourth SMFCI includes four fourth holes arranged in an annular pattern around the fourth central axis, a fourth central port located along the fourth central axis, and at least a fourth centrifugal port located radially outward of the fourth central port relative to the fourth central axis, wherein the fourth central port and the fourth centrifugal port each include a corresponding fourth hole and a corresponding fourth counterbore, the corresponding fourth counterbore having a larger diameter than the corresponding fourth hole and centered at the corresponding fourth hole, and The fifth SMFCI includes four fifth holes arranged in an annular pattern around the fifth central axis, a fifth central port positioned along the fifth central axis, and at least a fifth centrifugal port located radially outside the fifth central port relative to the fifth central axis, wherein the fifth central port and the fifth centrifugal port each include a corresponding fifth hole and a corresponding fifth counterbore, the corresponding fifth counterbore having a larger diameter than the corresponding fifth hole and centered at the corresponding fifth hole.

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