Testing equipment

Abstract

The present application relates to a detection device, which includes a mounting platform, a carrying module, a detection module, a screening module and a suction module. The placement platform is connected to the mounting platform, and the placement platform is used to carry chips; the detection module is connected to the mounting platform, and the detection module is located above the carrying module and is used to determine whether the chip is qualified; the screening module is connected to the mounting platform, and the screening module is located below the carrying module and is used to push the unqualified semiconductor chip to move upward; the suction module is installed on the mounting platform, and the suction module is used to absorb the chip pushed by the screening module. In this way, the detection device of the present application, through the collaborative work of multiple modules, does not need to manually mark the unqualified chips with ink, avoids the secondary contamination that may be caused during the marking and transportation process, and ensures the cleanliness of the chip.

Description

Technical Field

[0001] The present application relates to the field of semiconductor testing, and in particular to a testing device. Background Art

[0002] In the field of semiconductor manufacturing, back-end quality inspection is an important part of ensuring chip performance and reliability. With the continuous advancement of semiconductor technology, the market has put forward higher requirements for chip quality and stability.

[0003] In related technologies, inspectors use professional lighting and magnification tools to carefully inspect the appearance of the chip. If defective products are found, they are usually marked (e.g., with ink) for subsequent processing.

[0004] However, since the ink can only be printed manually, the efficiency is extremely low and the chip turnover process is prone to secondary pollution. Summary of the invention

[0005] The present application provides a detection device to solve at least one of the above problems.

[0006] The present application provides a detection device, which includes an installation platform, a carrying module, a detection module, a screening module and a suction module, wherein the placement platform is connected to the installation platform, and the placement platform is used to carry chips; the detection module is connected to the installation platform, and the detection module is located above the carrying module and is used to determine whether the chip is qualified; the screening module is connected to the installation platform, and the screening module is located below the carrying module and is used to push the unqualified semiconductor chip to move upward; the suction module is installed on the installation platform, and the suction module is used to absorb the chip pushed by the screening module.

[0007] In some embodiments, the carrier module has a hollow space, the hollow space is used to accommodate the chip, and the detection module and the screening module are respectively located on opposite sides of the hollow space.

[0008] In some embodiments, the supporting module includes a loading platform and a tray, the tray is connected to the mounting platform, the loading platform is movably connected to the tray, the loading platform is located above the tray, the loading platform is provided with a first hollow hole, the tray is provided with a second hollow hole, the second hollow hole is connected to the first hollow hole, and the second hollow hole and the first hollow hole together form the hollow space.

[0009] In some embodiments, a mounting groove is provided on a side of the loading platform facing away from the tray, and the mounting groove is arranged around the first hollow hole and connected to the first hollow hole.

[0010] In some embodiments, the supporting module includes a first slide rail structure and a second slide rail structure, the first slide rail structure is movably connected between the loading platform and the second slide rail structure, the second slide rail structure is movably connected between the first slide rail structure and the tray, the first slide rail structure extends along the first direction, the second slide rail structure extends along the second direction, and the first direction is perpendicular to the second direction.

[0011] In some embodiments, the suction module includes a moving part and a suction needle part, the suction needle part is connected to the moving part, and the moving part is movably connected to the mounting platform along a first direction, a second direction or a third direction, and the first direction, the second direction and the third direction are perpendicular to each other.

[0012] In some embodiments, the needle suction component is rotatably connected to the moving component.

[0013] In some embodiments, the suction module also includes a locking piece, and the suction module can be selectively in a rotating state and a locking state. When the suction module is in the rotating state, the suction needle component can rotate relative to the movable component through the locking piece. When the suction module is in the locking state, the suction needle component is relatively fixed to the movable component.

[0014] In some embodiments, the suction needle component includes a suction needle, an electromagnetic motor and a bracket, the suction needle and the electromagnetic motor are installed on the bracket, and the battery motor can drive the suction needle to move relative to the bracket; the bracket is connected to the moving module through the locking member.

[0015] In some embodiments, the screening module can be movably connected to the mounting platform along a first direction, a second direction or a third direction, and the first direction, the second direction and the third direction are perpendicular to each other; when the screening module moves along the third direction, the screening module can push the unqualified semiconductor chips to move upward.

[0016] The above technical solution provided by the embodiment of the present application has the following advantages compared with the prior art: the detection equipment of the present application, through the collaborative work of multiple modules, does not need to manually mark unqualified chips with ink, avoids secondary contamination that may be caused during marking and transportation, and ensures the cleanliness of the chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0019] One or more embodiments are exemplarily described by pictures in the corresponding drawings, and these exemplified descriptions do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

[0020] Figure 1 A schematic diagram of the structure of a detection device provided in an embodiment of the present application is shown.

[0021] Figure 2 Shows Figure 1 Schematic diagram of the structure of the load-bearing module.

[0022] Figure 3 Shows Figure 1 Schematic diagram of the structure of the absorption module.

[0023] Figure 4 Shows Figure 1 Schematic diagram of the structure of the screening module.

[0024] Description of reference numerals:

[0025] Detection equipment 10, installation platform 100, carrying module 200, hollow space 210, stage 220, first hollow hole 221, installation slot 222, tray 230, second hollow hole 231, first slide rail structure 240, second slide rail structure 250, detection module 300, screening module 400, suction module 500, moving part 510, suction needle part 520, suction needle 521, electromagnetic motor 522, bracket 523, locking member 530, first direction X, second direction Y, third direction Z. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0027] The disclosure below provides many different embodiments or examples to implement different structures of the present invention. In order to simplify the disclosure of the present invention, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present invention. In addition, the present invention can repeat reference numbers and / or letters in different examples. This repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed.

[0028] For ease of description, spatial relative terms may be used herein to describe the relative positional relationship or movement of one element or feature relative to another element or feature as shown in the figure, such as "inside", "outside", "inner side", "outer side", "below", "below", "above", "above", "front", "back", etc. Such spatial relative terms are intended to include different orientations of the device in use or operation in addition to the orientation depicted in the figure. For example, if the device in the figure undergoes a position flip or a posture change or a motion state change, then these directional indications also change accordingly, for example: an element described as "below other elements or features" or "below other elements or features" will subsequently be oriented as "above other elements or features" or "above other elements or features". Therefore, the example term "below..." may include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions) and the spatial relative descriptors used herein are interpreted accordingly.

[0029] See also Figures 1 to 4 The embodiment of the present application provides a detection device 10, which includes an installation platform 100, a carrier module 200, a detection module 300, a screening module 400 and a suction module 500. The placement platform is connected to the installation platform 100, and the placement platform is used to carry chips; the detection module 300 is connected to the installation platform 100, and the detection module 300 is located above the carrier module 200 and is used to determine whether the chip is qualified; the screening module 400 is connected to the installation platform 100, and the screening module 400 is located below the carrier module 200 and is used to push the unqualified semiconductor chip to move upward; the suction module 500 is installed on the installation platform 100, and the suction module 500 is used to absorb the chip pushed by the screening module 400.

[0030] Thus, compared with the detection device 10 in the related art, the detection device 10 of the present application does not need to manually mark unqualified chips with ink through the collaborative work of multiple modules, thus avoiding secondary contamination that may be caused during marking and transportation, and ensuring the cleanliness of the chips.

[0031] In some embodiments, the detection device 10 may further include a control module, which is electrically connected to the supporting module 200, the detection module 300, the screening module 400 and the suction module 500, so that the supporting module 200, the detection module 300, the screening module 400 and the suction module 500 can work in an orderly and automatic manner, thereby helping to improve the degree of automated detection of the detection device 10.

[0032] In some embodiments, the detection module 300 may include a CCD camera, which may be used to detect unqualified chips.

[0033] In some embodiments, the mounting platform 100 serves as the basis of the entire detection device 10 . The mounting platform 100 is used to fix and support all other modules to ensure the stability and reliability of the detection device 10 .

[0034] The chip is mounted on the mother-child ring through a blue film. The mother-child ring is covered with a blue film, and multiple chips can be arranged on the blue film.

[0035] In some embodiments, the carrier module 200 has a hollow space 210 , and the hollow space 210 is used to accommodate the chip. The detection module 300 and the screening module 400 are respectively located on opposite sides of the hollow space 210 .

[0036] The mother-child ring can be stuck in the hollow space 210. The carrier module 200 is installed on the mounting platform 100, and has a hollow space 210 inside for placing the semiconductor chip to be tested. The design of the hollow space 210 ensures that the chip will not be disturbed by the external environment during the detection process, and facilitates the operation of the detection module 300 and the screening module 400.

[0037] Thus, the hollow space 210 design of the carrier module 200 ensures that the chip is in a fixed position during the detection process, avoiding detection errors caused by chip movement. In addition, the detection module 300 and the screening module 400 are respectively located on opposite sides of the hollow space 210, so that the detection and screening processes do not interfere with each other, ensuring the accuracy and consistency of the detection results.

[0038] In some embodiments, the carrier module 200 includes a stage 220 and a tray 230, the tray 230 is connected to the mounting platform 100, the stage 220 is movably connected to the tray 230, the stage 220 is located above the tray 230, the stage 220 is provided with a first hollow hole 221, the tray 230 is provided with a second hollow hole 231, the second hollow hole 231 is connected to the first hollow hole 221, and the second hollow hole 231 and the first hollow hole 221 together form the hollow space 210. Among them, the first hollow hole 221 can be used to accommodate a chip.

[0039] Thus, the movable design of the stage 220 allows the position of the chip to be flexibly adjusted, ensuring that each chip can be tested at the best position.

[0040] In some embodiments, a mounting groove 222 is provided on one side of the stage 220 away from the tray 230, and the mounting groove 222 is arranged around the first hollow hole 221 and connected to the first hollow hole 221. The mounting groove 222 can be used to accommodate the mother-and-child ring, thereby fixing the mother-and-child ring.

[0041] This ensures that the mother-and-child ring will not move or tilt during the detection process, improves the stability of the chip during the detection process, and avoids detection errors. In addition, it makes the placement and removal of the mother-and-child ring more convenient and quick, reduces the difficulty of operation, and avoids chip damage caused by improper operation.

[0042] In some embodiments, the carrying module 200 includes a first slide rail structure 240 and a second slide rail structure 250, wherein the first slide rail structure 240 is movably connected between the loading platform 220 and the second slide rail structure 250, and the second slide rail structure 250 is movably connected between the first slide rail structure 240 and the tray 230, wherein the first slide rail structure 240 extends along the first direction X, and the second slide rail structure 250 extends along the second direction Y, and the first direction X is perpendicular to the second direction Y. The first slide rail structure 240 and the second slide rail structure 250 can both be slide rails.

[0043] Thus, the first slide rail structure 240 and the second slide rail structure 250 extend respectively in the first direction X and the second direction Y, so that the stage 220 can be accurately moved in two perpendicular directions. This allows the chip to be accurately positioned at the optimal position during the detection process, thereby improving the accuracy and consistency of the detection.

[0044] In addition, through the rapid movement of the first slide rail structure 240 and the second slide rail structure 250 , the chip can be quickly adjusted to the optimal position of the detection module 300 , which reduces the adjustment time and improves the detection speed.

[0045] In some embodiments, the lens of the CCD camera of the detection module, the position of the unqualified chip and the screening module 400 are in the same straight line (three-point alignment), so that the control module can determine the position of the unqualified chip, and then control the suction module 500 to accurately suck the unqualified chip.

[0046] In some embodiments, the suction module 500 includes a moving part 510 and a needle suction part 520, the needle suction part 520 is connected to the moving part 510, and the moving part 510 is movably connected to the mounting platform 100 along a first direction X, a second direction Y, or a third direction Z, wherein the first direction X, the second direction Y, and the third direction Z are mutually perpendicular. In this way, the moving part 510 of the suction module 500 can move along the first direction X, the second direction Y, and the third direction Z, which are mutually perpendicular, so that the needle suction part 520 can accurately locate the position of the lifted chip. This improves the accuracy of suction and ensures that unqualified chips can be accurately sucked and transferred.

[0047] In addition, through rapid movement with multiple degrees of freedom, the suction needle component 520 can quickly reach the lifted chip position, reducing the suction time and improving production efficiency.

[0048] In some embodiments, the movable component 510 may also include a plurality of screw slides, which move along the first direction X, the second direction Y, and the third direction Z respectively, so that the movable component 510 is movably connected to the mounting platform 100 along the first direction X, the second direction Y, or the third direction Z, thereby driving the needle suction component 520 to move along the first direction X, the second direction Y, or the third direction Z.

[0049] In some embodiments, after the movable component 510 drives the needle suction component 520 to move to a specified position, the movable component 510 may not move any more, and the needle suction component 520 may suck the chip by its own displacement.

[0050] In some embodiments, the needle suction component 520 is rotatably connected to the moving component 510 .

[0051] By rotating the suction needle component 520, the angle of the suction needle 521 can be adjusted so that it can more easily contact unqualified chips located at different positions, especially in a narrow or complex space.

[0052] In addition, the rotatable design of the suction needle component 520 allows the device to adapt to chips of different shapes and sizes, thereby improving the versatility and flexibility of the device. Whether it is a flat chip or a chip with protrusions or depressions, it can be sucked by adjusting the angle of the suction needle 521.

[0053] In some embodiments, the suction module 500 also includes a locking member 530, and the suction module 500 can be selectively in a rotating state and a locking state. When the suction module 500 is in the rotating state, the suction needle component 520 can rotate relative to the movable component 510 through the locking member 530. When the suction module 500 is in the locking state, the suction needle component 520 is relatively fixed to the movable component 510.

[0054] Thus, when the suction module 500 is in a rotating state, the suction needle component 520 can rotate freely and be adjusted to an optimal angle. This is particularly suitable for chips that need to be sucked from a specific angle, which improves the flexibility of suction. By adjusting the angle of the suction needle 521, it can be ensured that the suction needle 521 can be more accurately aligned with the lifted chip, avoiding suction failure caused by angle deviation.

[0055] When the suction module 500 is in a locked state, the suction needle component 520 is relatively fixed to the moving component 510, ensuring that the angle of the suction needle 521 remains unchanged during the suction process. This improves the accuracy and stability of suction and avoids suction failure or chip damage caused by changes in the angle of the suction needle 521.

[0056] In addition, when the suction module 500 is in a locked state, the suction needle component 520 is relatively fixed to the moving component 510, ensuring that the angle of the suction needle 521 remains unchanged during the suction process. This improves the accuracy and stability of suction and avoids suction failure or chip damage caused by changes in the angle of the suction needle 521.

[0057] The locking member 530 may be a screw, and the locking member 530 may be disposed through the needle suction component 520 and the moving component 510 and threadedly engaged with the needle suction component 520 and the moving component 510. When the suction module 500 is in a rotating state, the locking member 530 is in a loosened state; when the suction module 500 is in a locked state, the locking member 530 is in a tightened state.

[0058] In some embodiments, the suction needle component 520 includes a suction needle 521, an electromagnetic motor 522 and a bracket 523, the suction needle 521 and the electromagnetic motor 522 are installed on the bracket 523, and the battery motor can drive the suction needle 521 to move relative to the bracket 523; the bracket 523 is connected to the moving module through the locking member 530.

[0059] In this way, the electromagnetic motor 522 drives the suction needle 521 to move relative to the bracket 523, ensuring that the suction needle 521 can accurately align with the lifted chip, thereby improving the accuracy and flexibility of suction.

[0060] In some embodiments, after the movable component 510 drives the needle suction component to move to a specified position, the movable component 510 may no longer move, and the needle suction component 520 may drive the suction needle 521 to move via the electromagnetic motor 522 .

[0061] In some embodiments, the suction needle 521 may be a hollow pipe structure, one end of the suction needle 521 may be provided with a vacuum device, and the other end of the suction needle 521 may suck unqualified chips. The electromagnetic motor 522 may apply a force to the suction needle 521, thereby driving the suction needle 521 to move. Of course, a limit structure may also be provided on the bracket 523 to limit the movement of the suction needle 521 within the range of movement, and the bracket 523 may also be provided with a spring, so that the suction needle 521 can be reset.

[0062] In some embodiments, the suction module 500 may further include a vacuum tube and a storage bottle, one end of the vacuum tube is connected to the suction needle 521, the other end of the vacuum tube is connected to the storage bottle, and a vacuum device is disposed on the vacuum tube. Unqualified chips can be transferred to the storage bottle along the vacuum tube, thereby recycling the discarded chips, and also helping to reduce the risk of chips falling during transportation and causing pollution to the environment.

[0063] In some embodiments, the screening module 400 can be movably connected to the mounting platform 100 along a first direction X, a second direction Y or a third direction Z, and the first direction X, the second direction Y and the third direction Z are perpendicular to each other; when the screening module 400 moves along the third direction Z, the screening module 400 can push the unqualified semiconductor chips to move upward.

[0064] In this way, the screening module 400 can move along the first direction X, the second direction Y and the third direction Z, which are perpendicular to each other, so that the screening module 400 can accurately locate the position of the unqualified chip. This improves the accuracy and flexibility of the screening and ensures that the unqualified chips can be accurately lifted up.

[0065] In addition, when the screening module 400 moves along the third direction Z, the ejector pins can lift unqualified chips from the second hollow holes 231 of the tray 230. The lifting height and strength of the ejector pins can be controlled by a motor to ensure that the lifting process is smooth and does not damage the chips.

[0066] In some embodiments, the screening module 400 may include a pin, which may be disposed on the top of the screening module 400 and may be used to pierce the blue film and push unqualified chips upward.

[0067] The screening module 400 includes a plurality of lead screw guide rails that can control the movement of the ejector in the first direction X or the second direction Y, and a stepper motor that controls the movement of the ejector along the third direction Z (the main function of which is to accurately control the movement distance of the ejector along the third direction Z), so that the ejector is consistent with the CCD lens center of the detection module 300.

[0068] Based on the above implementation, the chip detection process is as follows:

[0069] First, the operator mounts multiple semiconductor chips on the mother-child ring through the blue film, and places the mother-child ring in the hollow space 210 of the carrier module 200. The mother-child ring is clamped in the first hollow hole 221 of the stage 220 to ensure that the chip position is fixed.

[0070] Second, the stage 220 of the carrying module 200 is adjusted along two vertical directions through the first slide rail structure 240 and the second slide rail structure 250 to ensure that the chip is located at the optimal detection position directly below the CCD camera of the detection module 300 .

[0071] Third, the detection module 300 is started, and the CCD camera is used to perform optical detection on the chip to determine whether the chip meets the quality standard. The detection data is transmitted to the control module for analysis and processing. The lens of the CCD camera of the detection module 300, the position of the unqualified chip, and the suction needle 521 of the screening module 400 are in the same straight line (three-point alignment).

[0072] Fourth, for the unqualified chips detected, the control module instructs the screening module 400 to operate. The screening module 400 moves precisely to the bottom of the unqualified chip along the third direction Z (usually the vertical direction) through the ejector pin on its top. The ejector pin passes through the second hollow hole 231 of the tray 230, punctures the blue film, and gently lifts the unqualified chip to separate it from the surface of the blue film.

[0073] Fifth, the suction module 500 is started, and the moving part 510 moves precisely to the top of the raised unqualified chip along three mutually perpendicular directions (first direction X, second direction Y, and third direction Z). Driven by the electromagnetic motor 522, the suction needle 521 of the suction needle part 520 moves downward to the contact surface of the unqualified chip, and negative pressure is generated by the vacuum device, so that the unqualified chip is transferred to the storage bottle through the vacuum tube.

[0074] Sixth, after completing a single test, each module is reset and waits for the next test cycle to start. The operator replaces a new mother-child ring or chip as needed and repeats the above process. In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, please refer to the relevant description of other embodiments.

[0075] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0076] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0077] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be connected, detachably connected, or integrated; it can be mechanically connected or electrically connected; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0078] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0079] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms should not be understood as necessarily referring to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification.

[0080] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

[0081] The above is a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed by the present invention, and these modifications or replacements should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be based on the protection scope of the claims.

Claims

1. A detection device for detecting a chip, characterized in that: include: Installation platform; A carrying module, wherein the placing platform is connected to the mounting platform, and the placing platform is used to carry the chip; A detection module, the detection module is connected to the mounting platform, the detection module is located above the carrier module and is used to determine whether the chip is qualified; A screening module, the screening module is connected to the mounting platform, the screening module is located below the carrying module and is used to push the unqualified semiconductor chips to move upwards; as well as A suction module is installed on the installation platform, and is used to suck the chip pushed by the screening module.

2. The detection device according to claim 1, characterized in that: The carrying module has a hollow space, and the hollow space is used to accommodate the chip. The detection module and the screening module are respectively located on two opposite sides of the hollow space.

3. The detection device according to claim 2, characterized in that: The carrying module includes a loading platform and a tray, the tray is connected to the mounting platform, the loading platform is movably connected to the tray, the loading platform is located above the tray, the loading platform is provided with a first hollow hole, the tray is provided with a second hollow hole, the second hollow hole is connected to the first hollow hole, and the second hollow hole and the first hollow hole together form the hollow space.

4. The detection device according to claim 3, characterized in that: A mounting groove is provided on a side of the loading platform away from the tray, and the mounting groove is arranged around the first hollow hole and is connected to the first hollow hole.

5. The detection device according to claim 3, characterized in that: The supporting module includes a first slide rail structure and a second slide rail structure, the first slide rail structure is movably connected between the loading platform and the second slide rail structure, the second slide rail structure is movably connected between the first slide rail structure and the tray, the first slide rail structure extends along the first direction, the second slide rail structure extends along the second direction, and the first direction is perpendicular to the second direction.

6. The detection device according to claim 1, characterized in that: The suction module includes a moving part and a needle suction part, the needle suction part is connected to the moving part, and the moving part is movably connected to the mounting platform along a first direction, a second direction or a third direction, and the first direction, the second direction and the third direction are perpendicular to each other.

7. The detection device according to claim 6, characterized in that: The needle suction component is rotatably connected to the moving component.

8. The detection device according to claim 7, characterized in that: The suction module also includes a locking piece, and the suction module can be selectively in a rotating state and a locking state. When the suction module is in the rotating state, the suction needle component can rotate relative to the movable component by the locking piece. When the suction module is in the locking state, the suction needle component is relatively fixed to the movable component.

9. The detection device according to claim 8, characterized in that: The suction needle component includes a suction needle, an electromagnetic motor and a bracket. The suction needle and the electromagnetic motor are installed on the bracket. The battery motor can drive the suction needle to move relative to the bracket. The bracket is connected to the moving module through the locking piece.

10. The detection device according to claim 1, characterized in that: The screening module can be movably connected to the mounting platform along a first direction, a second direction or a third direction, and the first direction, the second direction and the third direction are perpendicular to each other; when the screening module moves along the third direction, the screening module can push the unqualified semiconductor chips to move upward.

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