Cleaning method for liquid supply pipeline system of double-sided polishing machine
Through a cleaning method of a double-sided polishing machine liquid supply pipeline system, the polishing liquid crystals are removed by using the flaring, circulation cleaning system and specific cleaning solution, which solves the abnormal liquid supply pressure problem caused by the accumulation of polishing liquid crystals, and achieves the effect of efficient removal rate and cost reduction.
Patent Information
- Application Number
- CN202411860179.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-17
- Publication Date
- 2025-04-04
AI Technical Summary
During the double-sided polishing machine processing, the accumulation of crystals of the polishing liquid leads to abnormal liquid supply pressure and cannot be effectively removed, resulting in the rework or scrapping of silicon polishing sheet products, increasing costs.
It provides a cleaning method for liquid supply pipeline system of a double-sided polisher, including removing the pipeline, flaring, connecting it to the component cleaning machine circulation system, using a cleaning solution of hydrofluoric acid, nitric acid and water to remove crystallization, and confirm the pH by rinsing through pure water circulation and then reinstalling it back to the machine.
After cleaning, the crystal removal rate of the components surface reaches more than 95%, reducing the risk of product scratches, improving the pressure of the liquid supply system, reducing rework and scrapping, and reducing manufacturing costs.
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of silicon wafer processing, and in particular to a method for cleaning a liquid supply pipeline system of a double-sided polishing machine. Background Art
[0002] In the manufacture of silicon polishing wafers, double-sided polishing is mainly used to remove the damaged layer of silicon wafers through mechanical grinding. Through the mechanical grinding action of ultra-fine abrasive particles in the polishing liquid and the chemical corrosion action of the slurry, polished wafers with high flatness and low damage layer are obtained.
[0003] As a key material of double-sided polishing machine, polishing liquid contains various mechanical abrasives and chemical slurries. During long-term operation, polishing liquid will form a thick crystal layer in pipes, filter elements and other components. This crystal layer is easy to cause additional scratches in the polishing process, which cannot be repaired by subsequent processing, and will produce polishing sheets with poor particles. At the same time, this crystallization will cause the polishing liquid in the liquid supply system to be transported poorly, and the pressure of the liquid supply system will be reduced. If the pressure exceeds the warning line, the polishing machine processing will be interrupted, resulting in rework or scrapping of silicon polishing sheet products, resulting in unnecessary cost losses.
[0004] Since polishing liquid crystals mainly grow on the inner surfaces of hollow components such as pipes or filter element housings, ordinary mechanical knocking measures cannot effectively remove them. An effective and proven method for removing polishing liquid crystals is needed. Summary of the invention
[0005] The present invention mainly solves the abnormal liquid supply pressure caused by the accumulation of polishing liquid crystals in the current double-sided polishing machine processing. A double-sided polishing machine liquid supply pipeline system cleaning method is provided, which has the advantages of convenient operation, good crystal removal stability and good improvement effect. After cleaning, the polishing liquid crystals on the surface of the pipeline and filter element housing and other components are basically removed, which provides an effective measure for the reuse of liquid supply system components and is conducive to reducing manufacturing costs.
[0006] The above technical problems of the present invention are mainly solved by the following technical solutions: A method for cleaning a liquid supply pipeline system of a double-sided polishing machine comprises the following steps: Step 1: After the double-sided polishing machine liquid supply pipeline is removed from the machine, it is inserted into the fixed interface and the two ends of the pipeline are expanded using expansion pliers.
[0007] Step 2: Connect both ends of the expanded pipe to the circulation system of the parts cleaning machine, fix it with a fixed interface, and start the cleaning program. The cleaning solution directly contacts the crystal surface of the component, and the crystals are quickly removed under the action of the circulation pump.
[0008] Step 3: After rinsing, use pure water to circulate and rinse several times. After confirming the PH value, remove and reinstall the machine for use.
[0009] Preferably, the liquid supply pipeline system includes a double-sided polishing machine 1 / 2 pipeline, a double-sided polishing machine 3 / 4 pipeline and Teflon pipeline materials.
[0010] Preferably, the pipeline needs to be expanded using a expander and then fixed using a fixed interface.
[0011] Preferably, the cleaning solution involved in the cleaning procedure includes hydrofluoric acid, nitric acid and water.
[0012] Preferably, the volume ratio of the cleaning solution is hydrofluoric acid: nitric acid: water = 3:1:9.
[0013] Preferably, the pure water flushing includes external spraying and internal circulation flushing of the pipeline.
[0014] The present invention can achieve the following effects: The present invention provides a method for cleaning a liquid supply pipeline system of a double-sided polishing machine. Compared with the prior art, the method has the advantages of convenient operation, good crystal removal stability and good improvement effect. After cleaning, the crystal removal rate of the component surface reaches more than 95%. The risk of product scratches is reduced, poor processing caused by reduced polishing liquid supply pressure is improved, and manufacturing costs are reduced. DETAILED DESCRIPTION
[0015] The technical solution of the invention is further specifically described below through embodiments.
[0016] Embodiment: A method for cleaning a liquid supply pipeline system of a double-sided polishing machine comprises the following steps: Step 1: After the double-sided polisher liquid supply pipeline is removed from the machine, it is inserted into the fixed interface and the two ends of the pipeline are expanded with a flaring pliers. The liquid supply pipeline system includes the double-sided polisher 1 / 2 pipeline, the double-sided polisher 3 / 4 pipeline and Teflon pipeline materials. The pipeline needs to be expanded with a flare and fixed with a fixed interface after expansion.
[0017] Step 2: Connect both ends of the expanded pipe to the circulation system of the parts cleaning machine, fix it with a fixed interface, and start the cleaning program. The cleaning solutions involved in the cleaning program include hydrofluoric acid, nitric acid and water. The volume ratio of the cleaning solution is hydrofluoric acid: nitric acid: water = 3:1:9. The cleaning solution directly contacts the crystal surface of the component, and the crystals are quickly removed under the action of the circulation pump.
[0018] Step 3: After flushing, use pure water to circulate and flush multiple times. Pure water flushing includes external spraying and internal circulation flushing of the pipe. After confirming the PH, remove and reinstall it on the machine for use.
[0019] In summary, the cleaning method of the liquid supply pipeline system of the double-sided polishing machine has the advantages of convenient operation, good crystal removal stability and good improvement effect. The crystal removal rate of the component surface after cleaning reaches more than 95%. The risk of product scratches is reduced, the processing defects caused by the reduction of polishing liquid supply pressure are improved, and the manufacturing cost is reduced.
[0020] The above description is only a specific embodiment of the present invention, but the structural features of the present invention are not limited thereto. Any changes or modifications made by any technician in the field of the present invention are included in the patent scope of the present invention.
Claims
1. A method for cleaning a liquid supply pipeline system of a double-sided polishing machine, characterized in that The steps are as follows: Step 1: After the double-sided polishing machine liquid supply pipeline is removed from the machine, it is inserted into the fixed interface and the two ends of the pipeline are expanded with expansion pliers; Step 2: Connect both ends of the expanded pipe to the circulation system of the parts cleaning machine, fix them with fixed interfaces, and start the cleaning program; Step 3: After rinsing, use pure water to circulate and rinse several times. After confirming the PH value, remove and reinstall the machine for use.
2. The method for cleaning the liquid supply pipeline system of a double-sided polishing machine according to claim 1, characterized in that: The liquid supply pipeline system includes a double-sided polishing machine 1 / 2 pipeline, a double-sided polishing machine 3 / 4 pipeline and Teflon pipeline materials.
3. The method for cleaning the liquid supply pipeline system of a double-sided polishing machine according to claim 1, characterized in that: The pipeline needs to be expanded using an expander and then fixed using a fixed interface.
4. The method for cleaning the liquid supply pipeline system of a double-sided polishing machine according to claim 1, characterized in that: The cleaning solutions involved in the cleaning procedure include hydrofluoric acid, nitric acid and water.
5. The method for cleaning the liquid supply pipeline system of a double-sided polishing machine according to claim 4, characterized in that: The volume ratio of the cleaning solution is hydrofluoric acid: nitric acid: water = 3:1:
9.
6. The method for cleaning the liquid supply pipeline system of a double-sided polishing machine according to claim 1, characterized in that: Pure water flushing includes external spraying and internal circulation flushing of the pipeline.
Citation Information
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