Edge processing method for transparent brittle material

Abstract

The present invention provides an edge processing method for transparent brittle materials, comprising: controlling a laser processing device to cut the transparent brittle material to be processed according to preset processing parameters, processing paths and chamfer lines, generating a corresponding plurality of chamfer laser cutting lines on the transparent brittle material; performing quality inspection on the transparent brittle material after cutting; performing liquid polishing on the transparent brittle material that passes the quality inspection by means of a polishing liquid, so that the transparent brittle material is split into a plurality of required sub-areas according to the plurality of chamfer laser cutting lines. The present invention can provide high-precision edge processing through laser processing, while chemical etching ensures uniformity of thinning. The combination of the two not only ensures quality, but also provides a more refined processing effect, overcoming the limitations of traditional methods.

Description

Technical Field

[0001] The invention relates to the technical field of laser cutting, and in particular to an edge processing method for transparent brittle materials. Background Art

[0002] At present, many cover materials choose transparent brittle materials as the main materials. Because of their scratch resistance, excellent light transmittance, outstanding aesthetics, chemical stability and easy cleaning, they are widely used in smartphones, wearable devices and other electronic products. In order to enhance the edge strength of transparent brittle materials and prevent breakage during transportation or use, chamfering and its treatment have become an effective solution.

[0003] In the prior art, the processing of transparent brittle materials usually involves edge processing using CNC (computer numerical control) machine tools and sidewall polishing machines. These devices combine advanced technologies and processes to ensure accurate processing and excellent surface quality of the edges of transparent brittle materials. CNC machine tools control the processing process through computer programs, which can achieve high-precision and complex edge shape processing. The operator inputs the design parameters, and the machine tool automatically cuts, carves or drills according to these parameters; however, CNC machine tools have the disadvantages of high equipment cost, slow processing speed, complex operation and easy wear of tools. Sidewall polishing machines are specially used to process the edges and sides of transparent brittle materials. The surface of transparent brittle materials is polished by abrasives and mechanical force. The polishing machine is usually equipped with a rotating grinding head, which can apply pressure evenly to ensure the consistency of the processing effect; however, it has limitations on surface quality and processing depth, and has the disadvantages of generating more heat and consuming more abrasives during use.

[0004] Based on this, a new solution is needed. Summary of the invention

[0005] The purpose of the present invention is to provide an edge processing method for transparent brittle materials, which processes the edges of transparent brittle materials through laser chamfering process and chemical etching, combines the advantages of laser and chemical etching, ensures the smoothness of the edges and surfaces, and not only improves the strength of the material and the production quality control problems of traditional CNC and SPM processes, but also can effectively prevent accidental damage caused by the brittleness of the material, thereby ensuring reliability in practical applications.

[0006] An embodiment of the present invention provides an edge processing method for a transparent brittle material, comprising the following steps:

[0007] Step S1, controlling the laser processing equipment to cut the transparent brittle material to be processed according to preset processing parameters, processing paths and chamfering lines, and generating a corresponding plurality of chamfering laser cutting lines on the transparent brittle material;

[0008] Step S2, performing quality inspection on the cut transparent brittle material;

[0009] Step S3, performing liquid polishing on the transparent brittle material that has passed the quality inspection using a polishing liquid, so that the transparent brittle material is split into a plurality of required sub-areas according to the plurality of chamfer laser cutting lines.

[0010] In the edge processing method for transparent brittle materials provided by the present invention, step S11, according to the requirements of the finished product drawing, the design drawing is produced by CAD / CAM;

[0011] Step S12, generating the corresponding chamfer lines and the spectrum drawing including the processing path according to the design drawing through the control system of the laser processing equipment;

[0012] Step S13, setting the operating parameters of the laser processing equipment according to the type and thickness of the transparent brittle material to be processed;

[0013] Step S14, performing a trial cutting using the operating parameters to determine the preset processing parameters, wherein under the preset processing parameters, the processing position of the chamfer is located within the center line of the transparent brittle material;

[0014] Step S15, starting the laser processing equipment to perform cutting.

[0015] In the edge processing method for transparent brittle materials provided by the present invention, in step S15, it also includes real-time monitoring of the cutting process, and pausing the cutting to make adjustments when deviations occur in the cutting process.

[0016] In the edge processing method for transparent brittle materials provided by the present invention, the laser cutting equipment includes one of a diffractive optical element or a spatial light modulator optical device.

[0017] In the edge processing method for transparent brittle materials provided by the present invention, in the step S2, the quality inspection includes edge quality inspection, size inspection and strength test.

[0018] In the edge processing method for transparent brittle materials provided by the present invention, in the step S3, the polishing liquid includes 3%-5% hydrofluoric acid, 1%-2% sulfuric acid, 1%-3% ammonium fluoride, and 0.1%-0.3% surfactant by volume percentage.

[0019] In the edge processing method for transparent brittle materials provided by the present invention, in the step S3, the polishing liquid includes 30%-70% of sodium hydroxide by volume.

[0020] The implementation of the embodiment of the present invention has the following beneficial effects: in the edge processing method for transparent brittle materials provided by the present invention, laser processing can provide very high precision, ensuring the fineness of chamfers and cutting lines, while chemical liquid polishing ensures the uniformity and smoothness of surface treatment; by combining laser cutting and chemical etching, it is possible to achieve a fine processing effect that is difficult to achieve with traditional methods, especially when processing transparent brittle materials, it is possible to avoid cracks or rough edge problems that may be caused by traditional mechanical cutting; this process is not only suitable for the precision processing of a single material, but also can efficiently process large quantities of materials to achieve consistency and high quality during mass production; through this process combining laser cutting and chemical liquid polishing, the resulting transparent brittle material pieces can meet precise requirements in terms of size, shape, surface quality, etc.; especially in terms of cutting lines and chamfering, the precision is significantly improved, while also avoiding the defects that may exist in traditional cutting methods. This process ensures that the material not only meets the design requirements, but also has excellent appearance and functionality. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 Shown is a flow chart of the edge processing method for transparent brittle materials provided by the present invention. DETAILED DESCRIPTION

[0023] In order to facilitate understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. Typical embodiments of the present application are provided in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0025] In order to better understand the above-mentioned technical scheme, the above-mentioned technical scheme will be described in detail below in conjunction with the accompanying drawings and specific implementation methods. It should be understood that the embodiments of the present invention and the specific features in the embodiments are detailed descriptions of the technical scheme of the present application, rather than limitations on the technical scheme of the present application. In the absence of conflict, the embodiments of the present invention and the technical features in the embodiments can be combined with each other.

[0026] Figure 1 FIG. 2 is a flow chart of the edge processing method for transparent brittle materials provided by the present invention. Figure 1 As shown, the edge processing method for transparent brittle materials provided by the embodiment of the present invention comprises the following steps:

[0027] Step S1, controlling the laser processing equipment to cut the transparent brittle material to be processed according to preset processing parameters, processing paths and chamfering lines, and generating a corresponding plurality of chamfering laser cutting lines on the transparent brittle material;

[0028] Step S2, performing quality inspection on the cut transparent brittle material;

[0029] Step S3, performing liquid polishing on the transparent brittle material that has passed the quality inspection using a polishing liquid, so that the transparent brittle material is split into a plurality of required sub-areas according to the plurality of chamfer laser cutting lines.

[0030] Specifically, in the present invention, a laser processing device is first used to cut the transparent brittle material to be processed to generate a corresponding plurality of chamfered laser cutting lines on the transparent brittle material. Due to the non-contact characteristics of the laser processing process, the processing errors introduced by multiple handling and repositioning are reduced, thereby improving the consistency and reliability of the product. Traditional CNC processing is prone to scratches and burrs due to multiple operations on the workpiece, while laser chamfering can achieve high-quality chamfering effects in a single processing. At the same time, laser processing provides high-precision edge processing, which can achieve chamfering at the micron level to ensure the edge finish and dimensional consistency of each product. However, traditional CNC cutting and SPM polishing are often affected by the wear of processing tools and manual operation in precision control, resulting in unstable final product quality. At the same time, laser processing can improve the edge strength of the material by optimizing the cutting method, avoiding the potential weaknesses caused by cutting and polishing in traditional methods. The heat-affected zone of the laser is small, which can maintain the overall strength and toughness of the material.

[0031] Further, in one embodiment of the present invention, the laser cutting device includes a diffractive optical element or a spatial light modulator optical device. Among them, the diffractive optical element is an optical element composed of a grating or an optical lens, and its working principle is to decompose the incident light into different diffraction levels by adjusting the microstructure on its surface. The spatial light modulator optical device is a controllable technology for adjusting the beam profile. Its working principle is to modulate the light by changing the phase, amplitude or polarization state of each pill or unit in the internal beam, achieving a highly flexible and real-time dynamic change of the hologram or optical pattern.

[0032] Furthermore, in one embodiment of the present invention, during the laser processing, the design file produced by CAD / CAM is first uploaded to the control system of the laser cutting equipment to ensure that the chamfer lines and processing paths in the drawing are set correctly. Among them, the design file first uses CAD / CAM to produce a design drawing in accordance with the requirements of the finished product drawing, and then uploads the file to the control system of the laser equipment to derive the appropriate chamfer shape and spectrum drawing to ensure that the chamfer lines and processing paths in the drawing are set correctly. Then, according to the material type and thickness, set the laser power, speed, frequency, and focusing depth and other parameters. Usually several trial cuts are required to finally determine the best parameter combination, so that the chamfer processing position can be within the center line of the material. After confirming that all settings are correct, start the laser cutting equipment for processing. Monitor the processing process to ensure that the laser head moves along the predetermined trajectory on the processing path. Therefore, step S1 includes:

[0033] Step S11, according to the requirements of the finished product drawing, the design drawing is made through CAD / CAM;

[0034] Specifically, in this embodiment, according to the requirements of the customer or product design, the design drawings are drawn by CAD (computer-aided design) software. The design drawings shall include all cutting paths, chamfer angles, positions, and other possible processing requirements, such as cutting shapes, sizes, etc. Then, CAM (computer-aided manufacturing) software is used to generate G-code or other control files in other formats that can be read by the laser cutting equipment. These files define the operations that the laser cutting machine needs to perform, including laser path, power adjustment, speed control, etc. By closely integrating the laser processing system with CAD / CAM software, production drawings can be quickly generated and adjusted to meet the needs of different product designs.

[0035] Step S12, generating the corresponding chamfer lines and the spectrum drawing including the processing path according to the design drawing through the control system of the laser processing equipment;

[0036] Specifically, in this embodiment, once the CAD / CAM design drawings are completed, the drawings need to be input into the control system of the laser processing equipment. The control system will automatically generate the corresponding chamfer lines and cutting paths according to the chamfer requirements in the design drawings. Based on the content of the design drawings, the system will further convert them into spectral drawings that can be read by the laser equipment, that is, files containing detailed processing paths, laser energy adjustments, and cutting sequences. These files will guide the laser cutting equipment to accurately perform chamfer cutting and conventional cutting tasks.

[0037] Step S13, setting the operating parameters of the laser processing equipment according to the type and thickness of the transparent brittle material to be processed;

[0038] Specifically, in this embodiment, transparent brittle materials of different types and thicknesses require different laser cutting parameters to ensure good cutting effects without damaging the materials. These operating parameters include laser power, cutting speed, focal length adjustment, gas pressure, etc.

[0039] Step S14, performing a trial cutting using the operating parameters to determine the preset processing parameters, wherein under the preset processing parameters, the processing position of the chamfer is located within the center line of the transparent brittle material;

[0040] Specifically, in this embodiment, before the formal start of large-scale production, a trial cutting step is usually carried out to verify whether the set laser cutting parameters are reasonable and to confirm the accuracy of the chamfering processing position. The sample material is cut using the set operating parameters, and the cutting effect is observed to ensure that the cutting edge is smooth and the chamfering position is accurate. Special attention is paid to whether the chamfering position is within the center line of the transparent brittle material to avoid cutting errors or material damage due to chamfering position offset; if problems are found during the trial cutting process (such as uneven cutting, material cracks, chamfering angle deviation, etc.), the laser power, cutting speed and other parameters can be adjusted according to the actual situation until the best effect is achieved.

[0041] Step S15, starting the laser processing equipment to perform cutting.

[0042] Specifically, in this embodiment, after the trial cutting is successful, the laser cutting equipment can be officially started for mass production. At this time, the laser equipment will accurately perform the cutting task according to the design drawings and operating parameters. Through this series of steps, the laser cutting of transparent brittle materials can be completed accurately and efficiently, which not only ensures the cutting accuracy, but also effectively avoids the breakage and damage of the material.

[0043] Furthermore, in one embodiment of the present invention, in step S15, the cutting process is also monitored in real time, and when deviation occurs in the cutting process, the cutting is suspended for adjustment. In the edge processing method for transparent brittle materials provided by the present invention, the accuracy of the processing process can be ensured by introducing a real-time monitoring system, and timely adjustments can be made when deviation occurs. Specifically: the real-time monitoring system can track the laser focus position in real time. Once the focus is offset, the system will automatically pause cutting and make adjustments, which can effectively prevent uneven cutting quality caused by focus deviation and avoid material damage; through real-time temperature monitoring, the surface temperature of the material can be detected in real time during the cutting process to ensure that the temperature is within the ideal range. If the temperature is too high, the system can take timely measures, such as reducing the laser power or suspending cutting; the real-time monitoring system can also detect other deviations in the laser cutting process, such as changes in cutting speed and laser power. If these parameters are found to deviate from the set values, the system can automatically adjust the corresponding cutting parameters to ensure the stability and efficiency of the cutting process; during the cutting process, once deviations or abnormalities are detected (such as incorrect cutting trajectory, inconsistent cutting depth, etc.), the system will issue an alarm signal and suspend the cutting operation. This mechanism ensures that the cutting process will not continue until the problem is resolved, avoiding further processing defects or material waste.

[0044] In the edge processing of transparent brittle materials, by introducing a real-time monitoring system, key parameters in the laser cutting process can be monitored, and processing defects can be discovered and corrected in a timely manner. The introduction of this system not only improves the stability and accuracy of the production process, but also allows for rapid adjustments when deviations occur, avoiding product quality issues and significantly improving processing efficiency and product consistency.

[0045] Specifically, in one embodiment of the present invention, in the step S2, the quality inspection includes edge quality inspection, size inspection and strength test. Through quality inspection, it can be ensured that the transparent brittle material after processing meets the design requirements and the reliability of actual use in various performances. Due to its special physical properties, transparent brittle materials are prone to produce tiny defects during the cutting process. These defects may affect the appearance and function of the material. Therefore, after the laser cutting is completed, the edge quality inspection is first performed to ensure that there are no burrs, scratches or unevenness during the cutting process. Then, the chamfer size is measured using a precision measuring tool (such as a vernier caliper or a three-coordinate measuring machine) to ensure that it meets the design requirements. Finally, a strength test is performed on key components to ensure that the transparent brittle material will not be damaged or deformed due to excessive stress or external impact in actual use, thereby ensuring the reliability of the laser-processed material in actual use.

[0046] By performing edge quality inspection, size inspection and strength test in step S2, the quality and performance of the processed transparent brittle material can be effectively guaranteed to ensure that it meets the design specifications and actual use requirements. This series of quality inspection measures helps to discover potential defects in a timely manner and optimize product quality by adjusting the processing technology or material selection, thereby improving production efficiency, reducing scrap rate, and ensuring product consistency and reliability.

[0047] Specifically, in one embodiment of the present invention, after completing the quality inspection, the transparent brittle material that has passed the quality inspection is subjected to liquid polishing by means of a polishing liquid, so that the transparent brittle material is split into a plurality of required sub-areas according to the plurality of chamfered laser cutting lines. In the present invention, liquid polishing is performed using chemical liquids such as HF or NaOH, and the main process of the process is as follows: first, a chemical liquid suitable for the material to be processed is selected according to the type of glass and the required polishing effect; then, the thin glass that has been laser chamfered is immersed in the selected chemical liquid. According to the polishing requirements, the immersion time and liquid concentration are controlled to achieve the best polishing effect. During the immersion process, the chemical liquid reacts with the glass surface to remove tiny scratches, burrs and surface dirt, thereby improving the surface finish. In this embodiment, after the chemical liquid reacts with the glass surface, a small piece of material glass is separated from the chamfered laser cutting line, and the waste material is separated from the waste area. The number of small pieces split depends on the cutting drawing. The cutting drawing has defined how many final small pieces can be cut from the large / medium piece in one processing, and then the required small pieces can be split in one process.

[0048] Further, in one embodiment of the present invention, in the step S3, the polishing liquid includes 3%-5% hydrofluoric acid, 1%-2% sulfuric acid, 1%-3% ammonium fluoride, and 0.1%-0.3% surfactant by volume percentage. Specifically, hydrofluoric acid is the main component in the polishing liquid and has a strong etching effect. HF can react with silicates in the glass to produce soluble fluorinated silicates (SiF4), thereby effectively removing tiny scratches, flaws and surface layers on the glass surface, improving smoothness and transparency; the role of sulfuric acid is to enhance the etching effect of hydrofluoric acid, by providing an acidic environment, promoting the dissolution and reaction of HF, and enhancing the etching rate and uniformity of the glass surface. At the same time, sulfuric acid helps to remove certain pollutants and further clean the glass surface; ammonium fluoride, as a buffer, can control the etching rate of hydrofluoric acid and avoid excessive corrosion, which helps to ensure that the glass surface can be finely and evenly treated during the chemical polishing process to avoid irregular etching. Ammonium fluoride can also adjust the pH of the solution, thereby maintaining stable chemical reaction conditions; the role of the surfactant is to improve the wettability of the polishing liquid so that it can be evenly distributed on the glass surface to avoid local excessive corrosion. It can also help reduce the generation of bubbles, enhance the contact between the liquid and the glass surface, and ensure a more uniform etching process, thereby controlling the pore structure and fineness of the glass surface.

[0049] In this embodiment, the synergistic effect of hydrofluoric acid and sulfuric acid helps to significantly improve the finish of the glass surface, making it more transparent and smooth, and is particularly suitable for applications with strict requirements for high-precision surface quality. The addition of surfactants can effectively reduce the uneven etching caused by uneven liquid flow, ensuring that the surface treatment effect of each piece of glass is consistent. By adjusting the concentration of each component in the polishing liquid, the etching rate can be finely controlled to ensure a uniform and stable polishing effect.

[0050] Further, in another embodiment of the present invention, in the step S3, the polishing liquid includes 30%-70% sodium hydroxide by volume percentage to achieve glass etching, and the temperature is maintained at 120-150°C. In this embodiment, sodium hydroxide (NaOH) is used to achieve glass etching, and the treatment is carried out under high temperature conditions. As a strong alkaline substance, sodium hydroxide can react with silicon dioxide (SiO2) in the glass to form water-soluble sodium silicate, thereby achieving the purpose of etching the glass surface. A higher concentration of sodium hydroxide can effectively remove small defects and impurities on the glass surface in a shorter time, and at high temperatures, the dissolution and reaction rate of sodium hydroxide will increase, accelerate the removal of silicon dioxide on the glass surface, and effectively remove defects, bubbles and microcracks on the glass surface, while improving the surface smoothness of the glass. In this embodiment, the use of high-concentration sodium hydroxide can quickly and efficiently remove irregular defects on the glass surface at an appropriate temperature, significantly improving the surface smoothness and finish.

[0051] The present invention firstly uses laser cutting to make the glass surface be chamfered accurately, generates a predetermined chamfered laser cutting line, ensures that the edge of the glass has the required shape and size, and ensures the high precision of the cutting edge. Then, the thin glass treated with laser chamfering is immersed in a selected chemical liquid. During the immersion process, the chemical liquid reacts with the glass surface to remove tiny scratches, burrs and surface dirt, thereby improving the finish of the glass surface and reducing surface defects. This liquid polishing process can effectively remove tiny surface defects formed during the laser cutting process. Through the reaction with the chemical liquid, the surface of the glass is further polished, reducing the tiny defects caused by laser cutting, and also increasing the surface transparency of the glass. During the liquid polishing process, the chemical liquid not only polishes the surface, but also causes the glass to split according to the cutting pattern of the laser chamfering line. Specifically, the glass material will split from a larger glass sheet into multiple small pieces along the chamfering line cut by the laser. The number and size of each small piece depends on the processing plan pre-defined on the cutting drawing. During the splitting process, waste materials that fail to meet the requirements of the final use will be effectively separated into a designated waste area. This process not only improves material utilization, but also ensures the quality of each final piece.

[0052] The edge processing method for transparent brittle materials provided by the present invention has the following advantages:

[0053] 1. The combination of laser chamfering and chemical etching forms a continuous process flow, significantly reducing the multiple steps required in traditional CNC machining and SPM polishing. This integrated process can effectively shorten the production cycle, thereby improving overall production efficiency; traditional CNC+SPM machining often requires multiple stages of material handling and repositioning, which not only increases production time but may also cause material loss; the combination of laser and chemical etching reduces these intermediate steps, thereby speeding up production and reducing the risk of loss;

[0054] 2. Reduced equipment and maintenance costs: The combination of laser and chemical etching uses less equipment, which can reduce equipment investment and maintenance costs; compared with traditional CNC and SPM processing, this integrated approach is more economical; by reducing processing steps and equipment operating time, overall energy consumption is effectively controlled, further reducing production costs;

[0055] 3. Improve product quality: Reduce processing defects: The integrated processing process reduces the errors introduced by multiple handling and repositioning, significantly improving the consistency and reliability of the product; this advantage is often difficult to achieve in traditional CNC processing and polishing; laser processing can provide high-precision edge processing, while chemical etching ensures uniform thinning; the combination of the two not only guarantees quality, but also provides a more refined processing effect, overcoming the limitations of traditional methods;

[0056] 4. Improved energy efficiency: Integrated processing significantly reduces energy waste, helps achieve a more environmentally friendly production process, and meets the requirements of modern sustainable development;

[0057] 5. Adapt to different design requirements: The flexibility of laser processing enables it to easily adjust the shape and size of the chamfer according to the specific product design to meet different customer needs; at the same time, chemical etching can accurately control the degree of thinning to adapt to design requirements of different thicknesses and sizes.

[0058] The present invention not only solves the defects in traditional CNC processing and sidewall polishing machine processing by combining laser chamfering with chemical etching technology, but also brings significant advantages in production efficiency, cost control, product quality, environmental protection, etc. This integrated technical solution provides enterprises with greater market competitiveness and customer satisfaction in high-end application fields (such as smartphone screens, wearable devices, and automotive displays), and promotes the widespread use of UTG in various applications.

[0059] In the description provided herein, a large number of specific details are described. However, it is understood that embodiments of the present invention can be practiced without these specific details. In some instances, well-known methods, structures and techniques are not shown in detail so as not to obscure the understanding of this description.

[0060] Similarly, it should be understood that in order to streamline the present disclosure and aid in understanding one or more of the various inventive aspects, in the above description of exemplary embodiments of the present invention, various features of the present invention are sometimes grouped together into a single embodiment, figure, or description thereof. However, this disclosed method should not be interpreted as reflecting the intention that the claimed invention requires more features than those explicitly recited in each claim. More specifically, as reflected in the claims below, inventive aspects lie in less than all the features of the individual embodiments disclosed above. Therefore, the claims that follow the specific embodiment are hereby expressly incorporated into the specific embodiment, with each claim itself serving as a separate embodiment of the present invention.

[0061] In addition, those skilled in the art will appreciate that, although some embodiments herein include certain features included in other embodiments but not other features, the combination of features of different embodiments is meant to be within the scope of the present invention and form different embodiments. For example, in the claims below, any one of the claimed embodiments may be used in any combination.

[0062] It should be noted that the above embodiments illustrate the present invention rather than limit it, and that those skilled in the art may devise alternative embodiments without departing from the scope of the appended claims. In the claims, any reference symbol between brackets shall not be construed as a limitation on the claims. The word "comprising" does not exclude the presence of elements or steps not listed in the claims. The word "one" or "an" preceding an element does not exclude the presence of a plurality of such elements. The present invention may be implemented by means of hardware comprising a number of different elements and by means of a suitably programmed computer. In a unit claim enumerating a number of devices, several of these devices may be embodied by the same hardware item. The use of the words first, second, and third, etc., does not indicate any order. These words may be interpreted as names.

Claims

1. A method for edge processing of transparent brittle materials, characterized in that: The following steps are involved: Step S1, controlling the laser processing equipment to cut the transparent brittle material to be processed according to preset processing parameters, processing paths and chamfering lines, and generating a corresponding plurality of chamfering laser cutting lines on the transparent brittle material; Step S2, performing quality inspection on the cut transparent brittle material; Step S3, performing liquid polishing on the transparent brittle material that has passed the quality inspection using a polishing liquid, so that the transparent brittle material is split into a plurality of required sub-areas according to the plurality of chamfer laser cutting lines.

2. The edge processing method for transparent brittle materials according to claim 1, characterized in that: The step S1 comprises: Step S11, according to the requirements of the finished product drawing, the design drawing is made through CAD / CAM; Step S12, generating the corresponding chamfer lines and the spectrum drawing including the processing path according to the design drawing through the control system of the laser processing equipment; Step S13, setting the operating parameters of the laser processing equipment according to the type and thickness of the transparent brittle material to be processed; Step S14, performing a trial cutting using the operating parameters to determine the preset processing parameters, wherein under the preset processing parameters, the processing position of the chamfer is located within the center line of the transparent brittle material; Step S15, starting the laser processing equipment to perform cutting.

3. The edge processing method for transparent brittle materials according to claim 2, characterized in that: In step S15, the cutting process is also monitored in real time, and when deviation occurs in the cutting process, the cutting is suspended for adjustment.

4. The edge processing method for transparent brittle materials according to any one of claims 1 to 3, characterized in that: The laser cutting apparatus includes one of a diffractive optical element or a spatial light modulator optical device.

5. The edge processing method for transparent brittle materials according to claim 1, characterized in that: In the step S2, the quality inspection includes edge quality inspection, size inspection and strength test.

6. The edge processing method for transparent brittle materials according to claim 1, characterized in that: In the step S3, the polishing liquid includes, by volume percentage, 3%-5% hydrofluoric acid, 1%-2% sulfuric acid, 1%-3% ammonium fluoride, and 0.1%-0.3% surfactant.

7. The edge processing method for transparent brittle materials according to claim 1, characterized in that: In the step S3, the polishing liquid includes 30%-70% of sodium hydroxide by volume.

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