A wafer surface polishing apparatus

By designing a crystal tray surface polishing device and adopting a multi-angle polishing and adhesive collection mechanism, the problem of existing equipment being unable to perform all-round polishing and adhesive collection has been solved, thereby improving polishing efficiency and environmental cleanliness.

CN119748229BActive Publication Date: 2026-04-17DINGLI AUTOMATIC TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
DINGLI AUTOMATIC TECH CO LTD
Filing Date
2024-12-31
Publication Date
2026-04-17

AI Technical Summary

Technical Problem

Existing polishing equipment cannot achieve fine polishing from all angles and angles when polishing crystal trays, and the colloids removed during polishing are difficult to collect effectively, polluting the environment.

Method used

A crystal tray surface polishing device was designed, which adopts a roller conveying component, a pressing mechanism, a positioning mechanism, a linear drive module, a coarse polishing mechanism and a fine polishing mechanism, combined with a rotating shaft and a limiting component, to realize multi-angle polishing of the crystal tray and automatic collection of adhesive.

Benefits of technology

It achieves all-round fine polishing of the crystal tray surface, improves the efficiency of adhesive removal, effectively collects the adhesive removed during polishing, and improves the working environment.

✦ Generated by Eureka AI based on patent content.

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Abstract

This invention relates to the field of polishing equipment technology, and more particularly to a crystal tray surface polishing device. The device comprises a support frame with axially transversely arranged rotating shafts on both sides, the shafts being perpendicular to the conveying direction of the crystal tray. These rotating shafts are rotatably mounted on a support frame. A third servo motor is mounted on the support frame, and the output shaft of the third servo motor is connected to the rotating shafts via a transmission component. The support frame also includes a limiting component for limiting the rotation of the rotating shafts to a specified angle. By operating the third servo motor, the rotating shafts are controlled to rotate, causing the support frame and roller conveying component to rotate on the support frame. This also drives the pressed crystal tray to rotate to a vertical position. A linear drive module is then activated, driving the coarse and fine polishing mechanisms to move up and down via a movable bracket and support plate. During the polishing process of the crystal tray, the polished adhesive impurities fall downwards and are collected and processed from below the crystal tray.
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Description

Technical Field

[0001] This invention relates to the field of polishing equipment technology, and in particular to a crystal tray surface polishing device. Background Technology

[0002] The main production process in the photovoltaic wafer slicing industry includes six steps: ingot inspection, gluing, slicing, degumming, cleaning, and sorting. As a key component that supports silicon wafers, the surface of the crystal tray will have residual glue and other impurities after gluing and slicing. This not only affects the performance and lifespan of the crystal tray itself, but may also have adverse effects on subsequent production processes. For example, if the surface of the crystal tray is uneven or contains impurities in the slicing process, it may lead to a decrease in the cutting quality of the silicon wafer, resulting in problems such as edge chipping and uneven thickness, thereby reducing the product qualification rate.

[0003] Existing polishing equipment presents numerous problems when polishing crystal trays. During the polishing process, most existing equipment can only grind the crystal tray surface in a single direction or at a limited angle, making it difficult to achieve comprehensive, multi-angle, and fine polishing. For example, some equipment can only grind the top surface of the crystal tray, while the sides are poorly treated, resulting in incomplete removal of adhesive from the crystal tray surface and affecting its surface quality. Furthermore, during the polishing process, the adhesive residue easily splatters, polluting the working environment and being difficult to collect and dispose of. Therefore, this paper proposes a crystal tray surface polishing device to solve the above-mentioned technical problems. Summary of the Invention

[0004] The purpose of this invention is to provide a crystal tray surface polishing device to address the shortcomings of existing technologies, thereby solving the technical problem that existing polishing devices are not convenient for collecting and processing the polished adhesive during the crystal tray transportation and polishing process.

[0005] To achieve the above objectives, the technical solution of the present invention is as follows:

[0006] A crystal tray surface polishing device includes a base and a support frame mounted on the base. The support frame is equipped with a support frame and a roller conveying component for conveying the crystal tray to the polishing station. The crystal tray has handles on both sides of its width. The support frame is also equipped with a pressing mechanism for pressing the handles of the crystal tray and a positioning mechanism for positioning the crystal tray placed at the polishing station and specifying the pressing position.

[0007] It also includes a linear drive module mounted on the support frame and whose length direction is consistent with the conveying direction of the crystal tray. The movable end of the linear drive module is equipped with a movable bracket. The movable bracket is equipped with a support plate placed above the roller conveying component. A coarse grinding mechanism for coarse grinding of the top surface and left and right sides of the crystal tray is mounted on the support plate. A fine grinding mechanism for fine grinding of the top surface and left and right sides of the crystal tray is also mounted.

[0008] The left and right sides of the support frame are provided with axially transversely arranged rotating shafts that are perpendicular to the conveying direction of the crystal tray. The rotating shafts are rotatably mounted on the support frame. A third servo motor is mounted on the support frame, and the output shaft of the third servo motor is connected to the rotating shaft through a transmission component. The support frame is also equipped with a limiting component for limiting the rotating shaft to rotate it by a specified angle.

[0009] The limiting component includes a ring-shaped limiting member that is coaxial with the rotating shaft. The limiting member is fixedly mounted on the support frame. Part of the limiting member is formed with an arc-shaped guide rod. It also includes a swing arm with one end fixed to the rotating shaft and the other end of the swing arm slidably mounted on the arc-shaped guide rod to be limited by the limiting member.

[0010] The pressing mechanism includes a guide rail that is vertically arranged on the support frame, and a lifting frame that can move up and down is provided on the guide rail. Both ends of the lifting frame are equipped with pressing parts that can pass through the roller conveying component from bottom to top and are used to press the handles on both sides of the crystal tray respectively.

[0011] Each guide rail is rotatably provided with a vertically arranged threaded rod, which is threadedly connected to the lifting frame. The top of each threaded rod extends upward through the guide rail. A driven wheel is provided at the top of the threaded rod extending outside the guide rail. A transmission belt is wound around the driven wheel. The support frame is equipped with a first servo motor, and a drive wheel is provided on the output shaft of the first servo motor. The transmission belt is also wound around the drive wheel.

[0012] The beneficial effects of this invention are as follows: During polishing, after the crystal tray is horizontally transported to the designated polishing station by the running roller conveying component, the left and right sides of the crystal tray are first positioned by the positioning mechanism, and the crystal tray placed at the polishing station is positioned at the designated pressing position. Then, the pressing mechanism is run to press the handle of the crystal tray, thereby pressing the crystal tray tightly. After pressing, it is convenient to perform adhesive removal and polishing on the crystal tray. By pressing the crystal tray tightly, it is prevented from moving around during the adhesive removal and polishing process.

[0013] Once the crystal tray at the polishing station is pressed by the pressing mechanism, the linear drive module is activated to control the movable bracket and support plate to move along the conveying direction of the crystal tray. Simultaneously, the coarse grinding mechanism is activated, allowing it to contact the top surface and left and right sides of the crystal tray at the same time. Then, the movable bracket and support plate drive the coarse grinding mechanism to move along the conveying direction of the crystal tray, thus simultaneously performing coarse grinding and polishing on the top surface and left and right sides of the crystal tray. During the coarse grinding process, the fine grinding mechanism is activated, achieving coarse grinding on the top surface and left and right sides of the crystal tray first, followed by fine grinding, thus performing grinding and polishing on both sides in one go, improving the efficiency of removing adhesive from the surface of the crystal tray.

[0014] In addition, by operating the third servo motor, the rotating shaft is controlled to rotate under the transmission action of the transmission components, causing the support frame and roller conveying components to rotate on the support frame. This also drives the pressed crystal tray to rotate to a vertical position. Furthermore, the linear drive module is operated, which drives the coarse grinding mechanism and the fine grinding mechanism to move up and down through the movable bracket and support plate. During the grinding and polishing process of the crystal tray, the glue impurities that are ground off will fall downwards and be collected and processed from below the crystal tray, thus improving the collection efficiency.

[0015] After the crystal tray is polished, the control shaft rotates in the opposite direction to reset, returning the crystal tray to a horizontal arrangement. Once the pressing mechanism resets, the roller conveyor transports the polished crystal tray away, facilitating the transport of the next crystal tray to the polishing station. By setting a limiting component, the shaft rotates only 90°, thus controlling whether the pressed crystal tray is arranged horizontally or vertically. When conveying and pressing the crystal tray, the roller conveyor is arranged horizontally; when polishing the crystal tray, it is arranged vertically. This ability to freely switch states according to different situations allows the polishing mechanism to automatically convey the crystal tray horizontally and perform vertical polishing, facilitating the collection of the polished residue and improving the practicality of the polishing equipment. Attached Figure Description

[0016] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0017] Figure 2 This is a partial structural schematic diagram of the present invention.

[0018] Figure 3 This is a schematic diagram of the polished state of the support frame after rotation according to the present invention.

[0019] Figure 4 This is a schematic diagram of the internal structure of the support frame of the present invention.

[0020] Figure 5 This is a schematic diagram of the pressing mechanism of the present invention.

[0021] Figure 6 This is a partial structural diagram of the pressing mechanism of the present invention.

[0022] Figure 7 This is a schematic diagram of the pressing part of the present invention.

[0023] Figure 8 This is a schematic diagram of the positioning mechanism of the present invention.

[0024] Figure 9 This is a schematic diagram showing the state in which the crystal holder is pressed tightly and the positioning mechanism is driven downward to disengage from the polishing station according to the present invention.

[0025] Figure 10 This is a schematic diagram of the coarse grinding mechanism and the fine grinding mechanism of the present invention.

[0026] The reference numerals in the figures include:

[0027] 1. Base; 2. Support frame; 3. Support frame body; 4. Roller conveyor component; 5. Pressing mechanism; 51. Guide rail; 52. Lifting frame; 53. Pressing part; 531. Mounting plate; 532. First rotating shaft; 533. Pressing plate; 534. Receiving groove; 535. First gear; 536. Electric push rod; 537. Rack; 538. Second rotating shaft; 539. Bevel gear; 5310. Push block; 54. Threaded rod; 55. Driven wheel; 56. First servo motor; 57. Drive wheel; 58. Transmission belt; 6. Positioning mechanism; 61. Left support rod; 62. Right support rod; 63. Positioning roller; 64. Support component; 65. Positive and negative threaded rod; 66. Second servo motor; 67. Second gear; 68. Third gear; 69. Guide rod; 610. Spring; 611. Mating component 612. Clearance slot; 7. Linear drive module; 8. Movable bracket; 9. Support plate; 10. Rough grinding mechanism; 101. Movable seat; 102. Cylinder; 103. Left movable frame; 104. Right movable frame; 105. Dual-axis motor; 106. Lead screw; 107. First drive motor; 108. Left rough grinding wheel; 109. Right rough grinding wheel; 1010. Second drive motor; 1011. Top surface rough grinding wheel; 11. Fine grinding mechanism; 111. Top surface fine grinding wheel; 112. Left fine grinding wheel; 113. Right fine grinding wheel; 12. Rotating shaft; 13. Third servo motor; 14. Transmission component; 15. Limiting component; 151. Swing arm; 152. Limiting component; 153. Arc-shaped guide rod; 16. Transport mechanism; 17. Crystal holder; 18. Handle; 19. Polishing station. Detailed Implementation

[0028] The following is a detailed description of a crystal tray surface polishing device according to the present invention, with reference to the accompanying drawings.

[0029] like Figure 1-3As shown, an embodiment of the crystal tray surface polishing equipment of the present invention includes a base 1 for supporting the entire equipment and a support frame 2 disposed on the base 1. A support frame 3 is mounted on the support frame 2, and a roller conveying component 4 is provided on the support frame 3 for horizontally conveying the crystal tray 17 to the polishing station 19. After the crystal tray 17 is horizontally conveyed to the designated polishing station 19, it can be subjected to adhesive removal and polishing treatment. Handles 18 are provided on both sides of the width of the crystal tray 17. The support frame 3 is also equipped with a pressing mechanism 5 for pressing the handles 18 of the crystal tray 17, and a positioning mechanism 6 for positioning the crystal tray 17 placed in the polishing station 19 to a designated pressing position. After the crystal tray 17 is horizontally transported to the designated polishing station 19 by the roller conveyor component 4, the left and right sides of the crystal tray 17 are first positioned by the positioning mechanism 6, and the crystal tray 17 placed in the polishing station 19 is positioned at the designated pressing position. Then the pressing mechanism 5 is run to press the handle 18 of the crystal tray 17, thereby pressing the crystal tray 17. After pressing, it is convenient to perform adhesive removal and polishing on the crystal tray 17. By pressing the crystal tray 17, it is prevented from moving around during the adhesive removal and polishing process. In addition, when the pressing mechanism 5 presses the handle 18 of the crystal tray 17, it will drive the positioning mechanism 6 to move together, so that the positioning mechanism 6 is disengaged from the polishing station 19. During the adhesive removal and polishing process, the top surface and the left and right sides of the crystal tray 17 can be removed and polished at the same time.

[0030] In order to remove adhesive and polish the top surface and left and right sides of the crystal tray 17, a linear drive module 7 with the same length direction as the conveying direction of the crystal tray 17 is installed on the support frame 3. A movable bracket 8 is installed on the movable end of the linear drive module 7. The movable bracket 8 is provided with a support plate 9 placed above the roller conveying component 4. A coarse polishing mechanism 10 for coarse polishing of the top surface and left and right sides of the crystal tray 17 is installed on the support plate 9. A fine polishing mechanism 11 for fine polishing of the top surface and left and right sides of the crystal tray 17 is also installed. After the crystal tray 17 at the polishing station 19 is pressed by the pressing mechanism 5, the linear drive module 7 is activated to control the movable bracket 8 and the support plate 9 to move along the conveying direction of the crystal tray 17. At the same time, the coarse grinding mechanism 10 is activated first, so that it can contact the top surface and left and right sides of the crystal tray 17 simultaneously. Then, the movable bracket 8 and the support plate 9 drive the coarse grinding mechanism 10 to move along the conveying direction of the crystal tray 17, so that the top surface and left and right sides of the crystal tray 17 can be coarsely ground and polished at the same time. During the coarse grinding of the crystal tray 17, the fine grinding mechanism 11 is activated to achieve coarse grinding of the top surface and left and right sides of the crystal tray 17 first, and then fine grinding, so that both sides are ground and polished at one time, which improves the efficiency of removing adhesive from the surface of the crystal tray 17.

[0031] To facilitate the collection and processing of glue impurities from grinding, rotating shafts 12 are provided on both the left and right sides of the support frame 3, arranged laterally and perpendicular to the conveying direction of the crystal tray 17. The rotating shafts 12 are rotatably mounted on the support frame 2. By setting the rotating shafts 12, the support frame 3 and the roller conveying component 4 can rotate on the support frame 2, which in turn drives the pressed crystal tray 17 to rotate to a vertical position (e.g., ...). Figure 3 As shown in the figure, the linear drive module 7 drives the coarse grinding mechanism 10 and the fine grinding mechanism 11 to move up and down through the movable bracket 8 and the support plate 9. During the grinding and polishing of the crystal tray 17, the glue impurities that are ground off will fall downwards. After placing a collection frame (not shown in the figure) below the crystal tray 17, the glue impurities can be collected and processed. After the crystal tray 17 is ground and polished, the control shaft 12 is rotated in the opposite direction to reset, so that the crystal tray 17 is rearranged horizontally again. After the pressing mechanism 5 is reset, the roller conveyor component 4 transports the polished crystal tray 17 away, so that the next crystal tray 17 to be polished can be transported to the polishing station 19.

[0032] To control the rotation of the rotating shaft 12, a third servo motor 13 is installed on the support frame 2. The output shaft of the third servo motor 13 is connected to the rotating shaft 12 via a transmission component 14. The transmission component 14 can be a transmission structure consisting of a pulley and a belt. By running the third servo motor 13, the rotating shaft 12 is controlled to rotate in both directions under the transmission action of the transmission component 14. In addition, a limiting component 15 is also installed on the support frame 2 to limit the rotation of the rotating shaft 12 to a specified angle. By setting the limiting component 15, the rotating shaft 12 rotates only 90°, which means that the pressed crystal tray 17 can be arranged horizontally or vertically. When the crystal tray 17 needs to be conveyed and pressed, the roller conveying component 4 is arranged horizontally; when the crystal tray 17 needs to be polished, the roller conveying component 4 is arranged vertically. The base 1 is provided with a pair of transport mechanisms 16 that are respectively connected to the beginning and end of the roller conveying component 4. When the crystal tray 17 is polished, the roller conveying component 4 and the transport mechanisms 16 connected to its two ends are operated simultaneously to transport the crystal tray 17 away. After it is transported away, the next crystal tray 17 to be polished is transported to the polishing station 19 to realize the automatic transport processing of the crystal tray 17.

[0033] Furthermore, the limiting component 15 includes a ring-shaped limiting member 152 coaxially arranged with the rotating shaft 12. The limiting member 152 is fixedly mounted on the support frame 2. Part of the limiting member 152 is formed with an arc-shaped guide rod 153. It also includes a swing arm 151 with one end fixed to the rotating shaft 12. The other end of the swing arm 151 is slidably mounted on the arc-shaped guide rod 153 to limit the sliding range by the limiting member 152. When the rotating shaft 12 is controlled to rotate, the swing arm 151 can be driven to rotate around its axis. The swing arm 151 slides on the arc-shaped guide rod 153, and the sliding range is limited by the limiting member 152, so that the rotating shaft 12 only rotates 90°.

[0034] like Figure 4-6 As shown, the pressing mechanism 5 includes a vertically arranged guide rail 51 mounted on the support frame 3. A lifting frame 52 that can move up and down is mounted on the guide rail 51. Both ends of the lifting frame 52 are equipped with pressing parts 53 that can pass through the roller conveying component 4 from bottom to top and are used to press the handles 18 on both sides of the crystal tray 17 respectively. The initial position of the pressing parts 53 is below the roller conveying component 4. After the crystal tray 17 is conveyed to the polishing station 19 by the roller conveying component 4, the lifting frame 52 is controlled to move upward on the guide rail 51, so that the pressing parts 53 at both ends pass through the gap between the rollers on the roller conveying component 4 from bottom to top. After passing through, the pressing parts 53 at both ends approach different handles 18 respectively. At this time, the pressing parts 53 are operated to change their state, and then the lifting frame 52 is controlled to move downward, so that the pressed parts 53 in the changed state simultaneously press the handles 18 on both sides of the crystal tray 17. How the state of the pressing parts 53 changes specifically will be described below.

[0035] To control the lifting frame 52 to slide up and down on the guide rails 51, vertically arranged threaded rods 54 are rotatably provided on each guide rail 51. The threaded rods 54 are threadedly connected to the lifting frame 52, and the top of each threaded rod 54 extends upward through the guide rail 51. A driven wheel 55 is provided on the top of the threaded rod 54 extending outside the guide rail 51. A transmission belt 58 is wound around the driven wheel 55. The support frame 3 is equipped with a first servo motor 56, and a drive wheel 57 is provided on the output shaft of the first servo motor 56. The transmission belt 58 is also wound around the drive wheel 57. When the first servo motor 56 is operated, the drive wheel 57 is rotated. Under the transmission action of the transmission belt 58, each driven wheel 55 is driven to rotate synchronously, thereby driving the threaded rods 54 in each guide rail 51 to rotate synchronously, thus controlling the lifting frame 52 to slide up and down on the guide rail 51.

[0036] like Figure 7As shown, the pressing part 53 includes a mounting plate 531 disposed on the end of the lifting frame 52. A first rotating shaft 532, axially arranged laterally and parallel to the width direction of the crystal holder 17, is rotatably mounted on the mounting plate 531. A pressing plate 533 for pressing the handle 18 is disposed on the first rotating shaft 532. Initially, the pressing plate 533 is vertically arranged and rotatably mounted on the mounting plate 531 via the first rotating shaft 532. When the first rotating shaft 532 is controlled to rotate, causing the pressing plate 533 to rotate together, the pressing plate 533 is positioned directly above the handle 18 and is arranged laterally. When the pressing plate 533 rotates in the opposite direction to reset, it will deviate from the position directly above the handle 18. When the pressing plate 533 rotates to the position directly above the handle 18, the lifting frame 52 is controlled to move downwards on the guide rail 51, and the mounting plate 531 moves downwards with the pressing plate 533 to press the handle 18. In addition, a receiving groove 534 is formed on the pressing plate 533 to press the handle 18 and limit its position. When the mounting plate 531 moves the pressing plate 533 downward to press the handle 18, the handle 18 is placed in the receiving groove 534 to limit its position, preventing the position of the crystal holder 17 from shifting during the grinding and polishing process, thus improving the pressing effect.

[0037] To control the rotation of the first rotating shaft 532, a mounting cavity is formed within the mounting plate 531. The end of the first rotating shaft 532 extends into the mounting cavity, and a first gear 535 is mounted on this end. An electric push rod 536 is also mounted within the mounting cavity. The telescopic rod end of the electric push rod 536 is provided with a rack 537 that meshes with the first gear 535. The initial state of the telescopic rod of the electric push rod 536 is the extended state. By operating the electric push rod 536, the telescopic rod retracts, causing the rack 537 to move and rotate 90°. The first rotating shaft 532 rotates, causing the pressing plate 533 to rotate 90° on the mounting plate 531, so that the pressing plate 533 is positioned directly above the handle 18. After controlling the lifting frame 52 to move downward on the guide rail 51, the mounting plate 531 moves downward with the pressing plate 533 to press the handle 18 firmly. Additionally, when it is not necessary to press the handle 18, the electric push rod 536 operates to control the telescopic rod to extend again, the rack 537 is driven to rotate 90° in the opposite direction, and the first rotating shaft 532 rotates in the opposite direction to drive the pressing plate 533 away from directly above the handle 18. At this time, after the control lifting frame 52 moves downward on the guide rail 51, it drives the mounting plate 531 to pass through the gap between the rollers on the roller conveying component 4 from top to bottom, so as to prevent it from being blocked when conveying the polished crystal tray 17.

[0038] like Figure 8-9As shown, the positioning mechanism 6 includes a left support rod 61 and a right support rod 62 arranged on the left and right sides below the roller conveying component 4. Both the left support rod 61 and the right support rod 62 are provided with positioning rollers 63 for positioning the left and right sides of the crystal tray 17 placed in the polishing station 19. The positioning rollers 63 pass through the gap between the rollers on the roller conveying component 4 from bottom to top, thereby positioning the left and right sides of the crystal tray 17 placed in the polishing station 19. After positioning, the crystal tray 17 is placed in the designated pressing position, which is convenient for being pressed by the pressing plate 533.

[0039] Additionally, a T-shaped support member 64 that can slide up and down is provided on the support frame 3. The left support rod 61 and the right support rod 62 are slidably disposed at the left and right ends of the support member 64, respectively, and can slide towards or away from each other. By controlling the left support rod 61 and the right support rod 62 to move closer or further away from each other, the distance between the left and right positioning rollers 63 can be controlled to position crystal trays 17 of different sizes. In addition, the support member 64 is slidably mounted on the support frame 3, so that the left support rod 61 and the right support rod 62 can also be slidably mounted on the support frame 3. When the mounting plate 531 moves downward to drive the pressing plate 533 to press the handle 18, the mounting plate 531 will drive the left support rod 61 and the right support rod 62 to move downward together, so that the positioning roller 63 moves downward away from the polishing station 19, which is convenient for grinding and polishing the left and right sides of the crystal holder 17. When the pressing plate 533 is vertically arranged and deviated from the top of the handle 18, when the mounting plate 531 drives the pressing plate 533 to move downward, it will not drive the left support rod 61 and the right support rod 62 to move downward, thus achieving the effect of linkage. The linkage is described below.

[0040] A forward and reverse threaded rod 65 is rotatably mounted within the support member 64, arranged laterally in the axial direction and parallel to the width direction of the crystal holder 17. Different threaded portions on the forward and reverse threaded rods 65 are threadedly connected to the left support rod 61 and the right support rod 62, respectively. A second servo motor 66 is mounted on the outside of the support member 64. A second gear 67 is mounted on the output shaft of the second servo motor 66, and a third gear 68 that meshes with the second gear 67 is mounted in the middle of the forward and reverse threaded rods 65. By operating the second servo motor 66, the forward and reverse threaded rods 65 can be driven to rotate within the support member 64 under the transmission action of the second gear 67 and the third gear 68, thereby controlling the movement of the left support rod 61 and the right support rod 62 in directions that bring them closer to or further away from each other.

[0041] A vertically arranged guide rod 69 is also installed on the support member 64 and slidably disposed with the support frame 3. A spring 610 is provided on the guide rod 69 and placed between the support member 64 and the support frame 3 to apply an upward pushing force to the support member 64. When the mounting plate 531 moves the left support rod 61 and the right support rod 62 downward together, the support member 64 will also move downward on the support frame 3, and the spring 610 will be compressed. When the downward pressure on the left support rod 61 and the right support rod 62 is stopped, the left support rod 61 and the right support rod 62 will automatically return to their original position under the action of the compressed spring 610, so that the positioning roller 63 is repositioned in the polishing station 19.

[0042] Furthermore, the mounting plate 531 is also provided with a linkage part for simultaneously moving the left support rod 61 and the right support rod 62 downwards while driving the pressing plate 533 to move downwards to press the handle 18. The linkage part includes a second rotating shaft 538 rotatably mounted on the mounting plate 531 and arranged vertically (e.g., ...). Figure 7 As shown, the top end of the second rotating shaft 538 extends into the mounting cavity, and the bottom end extends to the outer side of the bottom of the mounting plate 531. Both the top end of the second rotating shaft 538 and the end of the first rotating shaft 532 are provided with bevel gears 539, and the bevel gears 539 mesh with each other. The bottom end of the second rotating shaft 538 is provided with a push block 5310. The middle position of the push block 5310 is offset from the axis of the second rotating shaft 538. The second rotating shaft 538 rotates to drive the push block 5310 to swing around its axis. The push block 5310 is initially positioned directly below the mounting plate 531, and its swinging end is also positioned directly below the mounting plate 531. When the electric push rod 536 is activated, the telescopic rod retracts, causing the rack 537 to move and rotate 90°. The first rotating shaft 532 rotates, causing the pressing plate 533 to rotate 90° on the mounting plate 531, placing the pressing plate 533 directly above the handle 18. While the first rotating shaft 532 rotates, the second rotating shaft 538 is driven to rotate under the transmission action of the bevel gear 539, thereby causing the push block 5310 to swing around the axis of the second rotating shaft 538, causing the swinging end of the push block 5310 to deviate from directly below the mounting plate 531.

[0043] In addition, both the left support rod 61 and the right support rod 62 are provided with mating parts 611 for pushing the push block 5310 after it is swung (e.g., Figure 8(As shown), and a clearance groove 612 is formed on the mating part 611 for the side of the mounting plate 531 to pass through. When the pressing plate 533 is vertically arranged, the swinging end of the push block 5310 is positioned directly below the mounting plate 531. At this time, when the lifting frame 52 moves the mounting plate 531 up and down, it can easily pass through the clearance groove 612 on the mating part 611, thus preventing the left support rod 61 and the right support rod 62 from moving downwards. When the pressing plate 533 is rotated to be positioned horizontally directly above the handle 18, the push block 5310 is driven to swing around the axis of the second rotation axis 538, causing the swinging end of the push block 5310 to deviate from directly below the mounting plate 531. During the process of the lifting frame 52 moving the mounting plate 531 downwards to press the handle 18 through the pressing plate 533, the swinging push block 5310 cannot pass through the clearance groove 612, thus pushing the mating part 611 downwards through the swinging push block 5310 (as shown). Figure 9 As shown, the left support rod 61 and the right support rod 62 are pushed downward together to achieve a linkage effect, which improves the automation settings of this polishing equipment.

[0044] like Figure 10As shown, the rough grinding mechanism 10 includes a movable seat 101 mounted on the support plate 9 and movable towards or away from the polishing station 19, and a cylinder 102 for controlling the movement of the movable seat 101. The end of the telescopic rod of the cylinder 102 is fixedly mounted to the movable seat 101. By operating the cylinder 102, the movable seat 101 is controlled to move towards or away from the polishing station 19 on the support plate 9. The movable seat 101 is equipped with a second drive motor 1010, and a top surface for rough grinding the top surface of the crystal holder 17 is mounted on the output shaft of the second drive motor 1010. The surface rough grinding wheel 1011 is provided. In addition, the movable base 101 is also equipped with a left movable frame 103 and a right movable frame 104 arranged to the left and right and movable in a direction that can move closer to or further away from each other. Both the left movable frame 103 and the right movable frame 104 are equipped with a first drive motor 107. The output shaft end of the first drive motor 107 on the left is provided with a left rough grinding wheel 108 for rough grinding the left side of the crystal holder 17, and the output shaft end of the first drive motor 107 on the right is provided with a right rough grinding wheel 109 for rough grinding the right side of the crystal holder 17. After the crystal holder 17 placed in the polishing station 19 is pressed, the cylinder 102 is activated to control the movable seat 101 to move on the support plate 9 towards the polishing station 19, so that the top surface rough grinding wheel 1011 contacts the top surface of the crystal holder 17. Simultaneously, the left movable frame 103 and the right movable frame 104 are controlled to move towards each other, causing the left rough grinding wheel 108 and the right rough grinding wheel 109 to move closer together, so that they contact the left and right sides of the crystal holder 17 respectively. At the same time, the second drive motor 1010, the first drive motor 107, and the linear drive module 7 are running simultaneously. While driving the top surface coarse grinding wheel 1011, the left side coarse grinding wheel 108, and the right side coarse grinding wheel 109 to rotate, the support plate 9 will carry the top surface coarse grinding wheel 1011, the left side coarse grinding wheel 108, and the right side coarse grinding wheel 109 to move at a uniform speed along the length direction of the crystal holder 17, thereby realizing automatic grinding and polishing of the top surface and left and right sides of the crystal holder 17.

[0045] To control the movement of the left movable frame 103 and the right movable frame 104 towards or away from each other, the movable base 101 is equipped with a dual-axis motor 105, and each of the two output shafts of the dual-axis motor 105 is equipped with a lead screw 106. The lead screws 106 on both sides are threadedly connected to the left movable frame 103 and the right movable frame 104, respectively. The threads of the lead screws 106 on both sides are arranged in opposite directions. Running the dual-axis motor 105 drives the lead screws 106 on both sides to rotate simultaneously, thereby controlling the movement of the left movable frame 103 and the right movable frame 104 towards or away from each other.

[0046] Furthermore, the coarse grinding mechanism 10 and the fine grinding mechanism 11 share some structural similarities, differing only in the grinding wheels. They can operate simultaneously or separately. The coarse grinding mechanism 10 is equipped with a top coarse grinding wheel 1011, a left coarse grinding wheel 108, and a right coarse grinding wheel 109, while the fine grinding mechanism 11 is equipped with a top fine grinding wheel 111, a left fine grinding wheel 112, and a right fine grinding wheel 113. When the top surface of the crystal holder 17 passes through the top coarse grinding wheel... After rough grinding by 1011, the top surface of the crystal holder 17 is finely ground by the top fine grinding wheel 111. Similarly, after the left and right sides of the crystal holder 17 are rough ground by the left coarse grinding wheel 108 and the right coarse grinding wheel 109, the left and right sides of the crystal holder 17 are finely ground by the left fine grinding wheel 112 and the right fine grinding wheel 113. After the crystal holder 17 undergoes two grinding processes, the surface of the crystal holder 17 is fully de-adhesive polished to improve the efficiency of de-adhesive polishing.

[0047] In summary, the present invention possesses the excellent characteristics described above, which enhances its effectiveness in use compared to previous technologies, making it a highly practical product.

[0048] The above description is only a preferred embodiment of the present invention. For those skilled in the art, there will be changes in the specific implementation and application scope based on the ideas of the present invention. The content of this specification should not be construed as a limitation of the present invention.

Claims

1. A crystal tray surface polishing device, characterized in that: It includes a base (1) and a support frame (2) set on the base (1). The support frame (2) is equipped with a support frame (3), and the support frame (3) is equipped with a roller conveying component (4) for conveying the crystal tray (17) to the polishing station (19). The crystal tray (17) is provided with handles (18) on both sides of its width. The support frame (3) is also equipped with a pressing mechanism (5) for pressing the handles (18) of the crystal tray (17) and a positioning mechanism (6) for positioning the crystal tray (17) placed in the polishing station (19) to a designated pressing position. It also includes a linear drive module (7) mounted on the support frame (3) and whose length direction is consistent with the conveying direction of the crystal tray (17). The movable end of the linear drive module (7) is equipped with a movable bracket (8). The movable bracket (8) is equipped with a support plate (9) placed above the roller conveying component (4). A coarse grinding mechanism (10) for coarse grinding of the top surface and left and right sides of the crystal tray (17) is mounted on the support plate (9). A fine grinding mechanism (11) for fine grinding of the top surface and left and right sides of the crystal tray (17) is also mounted on the support plate (9). The left and right sides of the support frame (3) are provided with a rotating shaft (12) arranged axially and perpendicular to the conveying direction of the crystal tray (17). The rotating shaft (12) is rotatably mounted on the support frame (2). The support frame (2) is equipped with a third servo motor (13), and the output shaft of the third servo motor (13) is connected to the rotating shaft (12) through a transmission component (14). The support frame (2) is also equipped with a limiting component (15) for limiting the rotating shaft (12) to rotate it by a specified angle. The limiting component (15) includes a ring-shaped limiting member (152) coaxially arranged with the rotating shaft (12). The limiting member (152) is fixedly arranged on the support frame (2). Part of the limiting member (152) is formed with an arc-shaped guide rod (153). It also includes a swing arm (151) with one end fixedly arranged with the rotating shaft (12). The other end of the swing arm (151) is slidably arranged on the arc-shaped guide rod (153) to be limited by the limiting member (152). The pressing mechanism (5) includes a guide rail (51) arranged vertically on the support frame (3), and a lifting frame (52) that can move up and down is provided on the guide rail (51). Both ends of the lifting frame (52) are equipped with pressing parts (53) that can pass through the roller conveying component (4) from bottom to top and are used to press the handles (18) on both sides of the crystal tray (17) respectively. Each guide rail (51) is rotatably provided with a vertically arranged threaded rod (54). The threaded rod (54) is threadedly connected to the lifting frame (52). The top of each threaded rod (54) extends upward through the guide rail (51). A driven wheel (55) is provided on the top of the threaded rod (54) extending outside the guide rail (51). A transmission belt (58) is wound around the driven wheel (55). The support frame (3) is equipped with a first servo motor (56), and a drive wheel (57) is provided on the output shaft of the first servo motor (56). The transmission belt (58) is also wound around the drive wheel (57).

2. The crystal tray surface polishing equipment according to claim 1, characterized in that: The pressing part (53) includes a mounting plate (531) disposed on the end of the lifting frame (52). The mounting plate (531) is rotatably provided with a first rotating shaft (532) arranged laterally in the axial direction and parallel to the width direction of the crystal holder (17). The first rotating shaft (532) is provided with a pressing plate (533) for pressing the handle (18). The pressing plate (533) is rotatably disposed on the mounting plate (531) via the first rotating shaft (532) so that it is positioned directly above or away from the handle (18). The pressing plate (533) is formed with a receiving groove (534) for pressing the handle (18) and limiting its position.

3. The crystal tray surface polishing equipment according to claim 2, characterized in that: The mounting plate (531) has a mounting cavity formed inside. The end of the first rotating shaft (532) extends into the mounting cavity, and a first gear (535) is mounted on the end. An electric push rod (536) is also mounted in the mounting cavity. The telescopic rod end of the electric push rod (536) is provided with a rack (537) that meshes with the first gear (535).

4. The crystal tray surface polishing equipment according to claim 3, characterized in that: The positioning mechanism (6) includes a left support rod (61) and a right support rod (62) arranged on the left and right sides below the roller conveying component (4). The left support rod (61) and the right support rod (62) are each provided with positioning rollers (63) for positioning the crystal holder (17) placed on the left and right sides of the polishing station (19). The support frame (3) is provided with a T-shaped support member (64) that can slide up and down. The left support rod (61) and the right support rod (62) are respectively slidably arranged at the left and right ends of the support member (64), and the two can slide towards each other or away from each other. The support member (64) is also provided with a guide rod (69) arranged vertically and slidably arranged with the support frame (3). The guide rod (69) is provided with a spring (610) placed between the support member (64) and the support frame (3) to apply an upward pushing force to the support member (64).

5. The crystal tray surface polishing equipment according to claim 4, characterized in that: The support member (64) is rotatably provided with a forward and reverse threaded rod (65) arranged laterally in the axial direction and parallel to the width direction of the crystal holder (17), and different threaded portions on the forward and reverse threaded rod (65) are threadedly connected to the left support rod (61) and the right support rod (62) respectively; a second servo motor (66) is installed on the outside of the support member (64), a second gear (67) is provided on the output shaft of the second servo motor (66), and a third gear (68) that meshes with the second gear (67) is installed in the middle of the forward and reverse threaded rod (65).

6. The crystal tray surface polishing equipment according to claim 4, characterized in that: The mounting plate (531) is provided with a linkage part for simultaneously moving the left support rod (61) and the right support rod (62) downwards while driving the pressing plate (533) to move downwards to press the handle (18); the linkage part includes a second rotating shaft (538) rotatably mounted on the mounting plate (531) and arranged vertically, the top end of the second rotating shaft (538) extending into the mounting cavity, and the bottom end extending to the outer side of the bottom of the mounting plate (531), and both the top end of the second rotating shaft (538) and the end end of the first rotating shaft (532) are provided with bevel gears (539), and The bevel gears (539) mesh with each other, and the bottom end of the second rotating shaft (538) is equipped with a push block (5310). The middle position of the push block (5310) is offset from the axis of the second rotating shaft (538). The second rotating shaft (538) rotates to drive the push block (5310) to swing around its axis. The left support rod (61) and the right support rod (62) are both provided with a mating part (611) for being pushed by the swinging push block (5310), and a clearance groove (612) is formed on the mating part (611) for the side of the mounting plate (531) to pass through.

7. The crystal tray surface polishing equipment according to claim 1, characterized in that: The rough grinding mechanism (10) includes a movable seat (101) mounted on a support plate (9) and movable toward or away from the polishing station (19), and a cylinder (102) for controlling the movement of the movable seat (101). The movable seat (101) is equipped with a second drive motor (1010), and a top surface rough grinding wheel (1011) for rough grinding the top surface of the crystal holder (17) is mounted on the output shaft of the second drive motor (1010). It also includes left-right arranged components that can move toward or away from each other. The left movable frame (103) and the right movable frame (104) are movable in the direction of movement. The left movable frame (103) and the right movable frame (104) are each equipped with a first drive motor (107). The output shaft end of the first drive motor (107) on the left is provided with a left coarse grinding wheel (108) for coarse grinding the left side of the crystal holder (17). The output shaft end of the first drive motor (107) on the right is provided with a right coarse grinding wheel (109) for coarse grinding the right side of the crystal holder (17).

Citation Information

Patent Citations

  • Crystal support surface polishing equipment

    CN117001507A

  • Solder thickness control structure and application

    CN118875411A