Grinding and polishing tool for welding seam on inner wall of cavity and grinding and polishing method of grinding and polishing tool

Abstract

The invention discloses a cavity inner wall welding seam grinding and polishing tool and a grinding and polishing method thereof. The cavity inner wall welding seam grinding and polishing tool and the grinding and polishing method thereof can effectively solve the problem that a welding seam on the inner wall of a cavity of a hollow semiconductor product with a small opening is difficult to grind and polish. A grinding and polishing tool for welding seams on the inner wall of a cavity comprises a first mounting arm, a second mounting arm and a third mounting arm, an extension arm perpendicular to the second mounting arm is arranged at one end of the second mounting arm, a second mounting structure is arranged at the other end of the second mounting arm, and the end of the extension arm is rotationally connected to the other end of the first mounting arm through a shaft rod; the limiting and locking structure comprises an arc-shaped groove formed in the extension arm, a screw rod arranged on the first mounting arm and parallel to the shaft rod and a locking nut arranged on the screw rod, the arc-shaped groove is coaxial with the shaft rod, the screw rod penetrates through the arc-shaped groove, and the extension arm is located between the first mounting arm and the locking nut.

Description

Technical Field

[0001] The invention relates to the technical field of weld grinding and polishing, and in particular to a cavity inner wall weld grinding and polishing tool and a grinding and polishing method thereof. Background Art

[0002] Polishing refers to a processing method that uses mechanical, chemical or electrochemical effects to reduce the surface roughness of a workpiece to obtain a bright and smooth surface. Mechanical polishing is a modification process of the workpiece surface using polishing tools and abrasive particles or other polishing media.

[0003] With the rapid development of the semiconductor industry, the requirements for semiconductor surface treatment are also increasing. Due to the diversification of semiconductor product structures, it is necessary to meet the connection of equipment of different sizes. At present, there are some hollow semiconductor products whose outer surface has only one or more small openings connected to the inner cavity of the product (it is difficult for a person to reach into the inner cavity of the product through the opening). Since it is difficult for mechanical grinding and polishing tools to directly mechanically grind and polish the welds on the inner wall of the cavity of such hollow semiconductor products with small openings, the mechanical grinding and polishing of the welds on the inner wall of the cavity of these semiconductor products is greatly limited; while chemical polishing is effective for the outer surface, the welds on the inner wall of the cavity cannot be touched, and the time-consuming cost is too high; similarly, electrolytic polishing is effective for the outer surface, but the welds on the inner wall of the cavity cannot be touched, and a specific tooling head is required, which consumes a lot of energy and is difficult to polish. Summary of the invention

[0004] The purpose of the present invention is to provide a cavity inner wall weld grinding and polishing tool and a grinding and polishing method thereof, which can effectively solve the problem that the weld on the inner wall of the cavity of such hollow semiconductor products with small openings is difficult to grind and polish.

[0005] The technical solution of the present invention is: A cavity inner wall weld grinding and polishing tool, comprising: A first mounting arm, one end of which is provided with a first mounting structure; A second mounting arm, one end of which is provided with an extension arm perpendicular to the second mounting arm, the other end of the second mounting arm is provided with a second mounting structure, and the end of the extension arm is rotatably connected to the other end of the first mounting arm through a shaft; The limit locking structure includes an arc groove arranged on the extension arm, a screw rod arranged on the first installation arm and parallel to the shaft rod, and a locking nut arranged on the screw rod, the arc groove is coaxial with the shaft rod, the screw rod passes through the arc groove, and the extension arm is located between the first installation arm and the locking nut; When the screw rod abuts against one end of the arc-shaped groove, the second mounting arm is perpendicular to the first mounting arm; When the screw rod is against the other end of the arc groove, the second mounting arm and the first mounting arm are in an extended state, and the angle between the second mounting arm and the first mounting arm is 160-180 degrees. When a cavity inner wall weld grinding and polishing tool of the present scheme is used, the automatic grinder is fixedly mounted on the other end of the second mounting arm through the second mounting structure; by rotating the second mounting arm, when the screw rod is against the other end of the arc groove, the second mounting arm and the first mounting arm are in an extended state, and the second mounting arm is roughly parallel to the first mounting arm; so that the automatic grinder and the second mounting arm can extend into the inner cavity of the product through the smaller opening on the product; then, the second mounting arm is rotated to a set angle, so that the automatic grinder can grind and polish the weld on the inner cavity surface of the product; then tighten the locking nut; then, the automatic grinder is moved and / or rotated by the first mounting arm to grind and polish the weld on the inner cavity surface of the product. Therefore, the cavity inner wall weld grinding and polishing tool of the present invention can grind and polish the weld on the cavity inner wall of such hollow semiconductor products with small openings, thereby effectively solving the problem that the weld on the cavity inner wall of such hollow semiconductor products with small openings is difficult to grind and polish.

[0006] Preferably, it also includes an elastic member, and the second mounting arm rotates around the shaft under the action of the elastic member until the screw rod abuts against one end of the arc groove. At this time, the second mounting arm is perpendicular to the first mounting arm. When grinding the inner wall weld of the cylindrical cavity, the second mounting arm and the first mounting arm need to be adjusted to a vertical state to facilitate grinding and polishing the inner wall weld of the cylindrical cavity. This solution is particularly suitable for grinding and polishing the inner wall weld of the cylindrical cavity. Specifically, when the automatic grinder and the second mounting arm can extend into the inner cavity of the product through a smaller opening on the product; then, loosen the locking nut. At this time, the second mounting arm rotates around the shaft under the action of the elastic member until the screw rod abuts against one end of the arc groove; then tighten the locking nut to complete the adjustment of the second mounting arm.

[0007] Preferably, a fan-shaped plate is provided on the extension arm, and the arc-shaped groove is arranged on the fan-shaped plate.

[0008] Preferably, the first mounting structure includes two parallel first waist-shaped holes, and the length direction of the first waist-shaped holes is parallel to the length direction of the first mounting arm. In this way, the cavity inner wall weld grinding and polishing tool can be installed on the manipulator through the first mounting structure, and the manipulator can be used to grind and polish the weld of the cavity inner wall of the hollow semiconductor product; in addition, the installation position of the first mounting arm can be adjusted through the first waist-shaped holes.

[0009] Preferably, the second mounting structure includes one or more mounting holes. The automatic grinder and polisher is fixed to the mounting holes by bolts, so that the automatic grinder and polisher is fixedly mounted on the other end of the second mounting arm.

[0010] Preferably, the second mounting arm is a telescopic arm. In this way, the length of the second mounting arm can be adjusted to grind the inner wall welds of different cavity sizes.

[0011] Preferably, the second mounting arm includes two left and right mounting arm plates and connecting bolts connecting the two mounting arm plates. Both mounting arm plates are provided with second waist-shaped holes. The length direction of the second waist-shaped holes is parallel to the length direction of the second mounting arm. The connecting bolts pass through the second waist-shaped holes of the two mounting arm plates.

[0012] A method for grinding and polishing a cavity inner wall weld seam using a grinding and polishing tool comprises the following steps: First, rotate the second mounting arm until the screw rod contacts the other end of the arc groove; then tighten the locking nut; The automatic grinder and polisher is fixedly mounted on the other end of the second mounting arm through the second mounting structure; Second, extend the automatic grinder and the second mounting arm into the inner cavity of the product through the opening of the product, and place the extension arm outside the product; then, loosen the locking nut and rotate the second mounting arm to the set angle so that the automatic grinder can grind and polish the weld on the inner cavity surface of the product; then, tighten the locking nut; Third, the automatic grinder and polisher is moved and / or rotated by the first mounting arm to grind and polish the weld on the inner cavity surface of the product. Therefore, the cavity inner wall weld grinding and polishing tooling of this solution can grind and polish the weld on the inner wall of the cavity of such hollow semiconductor products with small openings, thereby effectively solving the problem that the weld on the inner wall of the cavity of such hollow semiconductor products with small openings is difficult to grind and polish.

[0013] A method for grinding and polishing a cavity inner wall weld seam using a grinding and polishing tool comprises the following steps: First, rotate the second mounting arm until the screw rod contacts the other end of the arc groove; then tighten the locking nut; The automatic grinder and polisher is fixedly mounted on the other end of the second mounting arm through the second mounting structure; Second, extend the automatic polisher and the second mounting arm into the inner cavity of the product through the opening of the product, and place the extension arm outside the product; then, loosen the locking nut. At this time, the second mounting arm rotates around the shaft under the action of the elastic member until the screw rod abuts against one end of the arc groove; then, tighten the locking nut; Third, the automatic grinder and polisher is moved and / or rotated by the first mounting arm to grind and polish the weld on the inner cavity surface of the product. Therefore, the cavity inner wall weld grinding and polishing tooling of this solution can grind and polish the weld on the inner wall of the cavity of such hollow semiconductor products with small openings, thereby effectively solving the problem that the weld on the inner wall of the cavity of such hollow semiconductor products with small openings is difficult to grind and polish.

[0014] The beneficial effect of the present invention is that the welding seam grinding and polishing tool for the inner wall of the cavity of such hollow semiconductor products with small openings can be grinded and polished, thereby effectively solving the problem that the welding seam on the inner wall of the cavity of such hollow semiconductor products with small openings is difficult to grind and polish. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a structural schematic diagram of a cavity inner wall weld grinding and polishing tooling of the present invention.

[0016] Figure 2 It is a structural schematic diagram of a cavity inner wall weld grinding and polishing tool of the present invention when the second mounting arm and the first mounting arm are in an unfolded state during use.

[0017] Figure 3 The present invention is a schematic structural diagram of a cavity inner wall weld grinding and polishing tooling when the second mounting arm is in a perpendicular state to the first mounting arm during use.

[0018] Figure 4 The present invention is a schematic structural diagram of a cavity inner wall weld grinding and polishing tool during the process of grinding and polishing the weld on the cavity inner wall.

[0019] In the figure: First mounting arm 1, first waist-shaped hole 1.1; Second mounting arm 2, extension arm 2.1, left mounting arm plate 2.2, right mounting arm plate 2.3, sector plate 2.4, second waist-shaped hole 2.5, mounting hole 2.6; Axle 3; Limit locking structure 4, arc groove 4.0, screw rod 4.1, locking nut 4.2; Automatic grinding and polishing machine 5; Opening 6. DETAILED DESCRIPTION

[0020] The present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments: Specific embodiment 1, as Figure 1 As shown, a cavity inner wall weld grinding and polishing tool comprises a first mounting arm 1, a second mounting arm 2 and a limit locking structure 4.

[0021] A first mounting structure is disposed at one end of the first mounting arm 1 .

[0022] An extension arm 2.1 perpendicular to the second mounting arm 2 is disposed at one end of the second mounting arm 2. A second mounting structure is disposed at the other end of the second mounting arm 2. The end of the extension arm 2.1 is rotatably connected to the other end of the first mounting arm 1 through a shaft 3.

[0023] The position limiting locking structure 4 includes an arc groove 4.0 provided on the extension arm 2.1, a screw rod 4.1 provided on the first mounting arm 1 and parallel to the shaft rod 3, and a locking nut 4.2 provided on the screw rod 4.1. The arc groove 4.0 is coaxial with the shaft rod 3. The screw rod 4.1 passes through the arc groove 4.0. The extension arm 2.1 is located between the first mounting arm 1 and the locking nut 4.2.

[0024] like Figure 1 As shown, when the screw rod 4.1 abuts against one end of the arc groove 4.0, the second mounting arm 2 is perpendicular to the first mounting arm 1.

[0025] like Figure 2 As shown, when the screw rod 4.1 abuts against the other end of the arc groove 4.0, the angle between the second mounting arm 2 and the first mounting arm 1 is 160-180 degrees, and the second mounting arm 2 and the first mounting arm 1 are in an extended state.

[0026] When a cavity inner wall weld grinding and polishing tool of the present embodiment is in use, the automatic grinder 5 is fixedly mounted on the other end of the second mounting arm 2 through the second mounting structure; by rotating the second mounting arm 2, when the screw 4.1 is against the other end of the arc groove 4.0, the second mounting arm 2 and the first mounting arm 1 are in an unfolded state, and the second mounting arm 2 is roughly parallel to the first mounting arm 1; so that the automatic grinder 5 and the second mounting arm 2 can extend into the product inner cavity through the smaller opening on the product; then, the second mounting arm 2 is rotated to a set angle, so that the automatic grinder 5 can grind and polish the weld on the surface of the product inner cavity; then, the locking nut 4.2 is tightened; then, the automatic grinder 5 is moved and / or rotated by the first mounting arm 1, so as to grind and polish the weld on the surface of the product inner cavity by the automatic grinder 5. Therefore, a cavity inner wall weld grinding and polishing tool adopted in the present scheme can grind and polish the weld on the inner wall of the cavity of such hollow semiconductor products with small openings, thereby effectively solving the problem that the weld on the inner wall of the cavity of such hollow semiconductor products with small openings is difficult to grind and polish (the hollow semiconductor product with small opening in this article refers to a hollow semiconductor product through which an adult's hand cannot or is difficult to reach into the inner cavity of the product).

[0027] In this embodiment, the first mounting arm 1 and the second mounting arm 2 are both strip-shaped plate structures. A fan-shaped plate 2.4 is provided on the extension arm 2.1, and an arc groove 4.0 is provided on the fan-shaped plate.

[0028] like Figure 1As shown, the first mounting structure includes two parallel first waist-shaped holes 1.1, and the length direction of the first waist-shaped holes 1.1 is parallel to the length direction of the first mounting arm 1. In this way, the cavity inner wall weld grinding and polishing tool can be installed on the manipulator through the first mounting structure, and the manipulator can be used to grind and polish the weld of the cavity inner wall of the hollow semiconductor product; in addition, the installation position of the first mounting arm 1 can also be adjusted through the first waist-shaped holes 1.1.

[0029] The second mounting structure includes one or more mounting holes 2.6. In this embodiment, the second mounting structure includes two mounting holes 2.6. The automatic polisher 5 is fixed to the mounting holes 2.6 by bolts, so that the automatic polisher 5 is fixedly mounted on the other end of the second mounting arm 2.

[0030] In one implementation of this embodiment, the second mounting arm 2 is a telescopic arm. In this way, the length of the second mounting arm 2 can be adjusted to grind the inner wall welds of different cavity sizes.

[0031] In one example, if Figure 1 As shown, the second mounting arm 2 includes two left and right mounting arm plates and a connecting bolt connecting the two mounting arm plates. Two second waist-shaped holes 2.5 parallel to each other are provided on the two mounting arm plates. Specifically, the two second waist-shaped holes 2.5 on the left mounting arm plate 2.2 are arranged at the right end of the left mounting arm plate, and the two second waist-shaped holes 2.5 on the right mounting arm plate 2.3 are arranged at the left end of the right mounting arm plate. The length direction of the second waist-shaped holes 2.5 is parallel to the length direction of the second mounting arm 2. The two second waist-shaped holes 2.5 on the left mounting arm plate are provided with a connecting bolt, and the connecting bolt passes through the second waist-shaped holes 2.5 of the two mounting arm plates. The connecting bolt connects the left and right mounting arm plates into one.

[0032] Of course, the second mounting arm 2 may also be other telescopic arm structures in the prior art.

[0033] In another implementation of this embodiment, the second mounting arm 2 is an integral mounting arm and is not retractable, so as to facilitate the actual manufacturing of the second mounting arm 2.

[0034] Specific embodiment 2, as Figure 1 As shown, a cavity inner wall weld grinding and polishing tool includes a first mounting arm 1, a second mounting arm 2, an elastic member and a limit locking structure 4.

[0035] A first mounting structure is disposed at one end of the first mounting arm 1 .

[0036] An extension arm 2.1 perpendicular to the second mounting arm 2 is disposed at one end of the second mounting arm 2. A second mounting structure is disposed at the other end of the second mounting arm 2. The end of the extension arm 2.1 is rotatably connected to the other end of the first mounting arm 1 through a shaft 3.

[0037] The position limiting locking structure 4 includes an arc groove 4.0 provided on the extension arm 2.1, a screw rod 4.1 provided on the first mounting arm 1 and parallel to the shaft rod 3, and a locking nut 4.2 provided on the screw rod 4.1. The arc groove 4.0 is coaxial with the shaft rod 3. The screw rod 4.1 passes through the arc groove 4.0. The extension arm 2.1 is located between the first mounting arm 1 and the locking nut 4.2.

[0038] The second mounting arm 2 rotates around the shaft 3 under the action of the elastic member until the screw 4.1 abuts against one end of the arc groove 4.0. Figure 1 As shown, when the screw rod 4.1 abuts against one end of the arc groove 4.0, the second mounting arm 2 is perpendicular to the first mounting arm 1.

[0039] like Figure 2 As shown, when the screw rod 4.1 abuts against the other end of the arc groove 4.0, the angle between the second mounting arm 2 and the first mounting arm 1 is 160-180 degrees, and the second mounting arm 2 and the first mounting arm 1 are in an extended state.

[0040] The elastic member is a spring or a torsion spring.

[0041] In one example, the elastic member is a torsion spring. The torsion spring is sleeved on the shaft 3, one end of the torsion spring abuts against the stopper of the first mounting arm 1, and the other end of the torsion spring abuts against the stopper of the second mounting arm 2; thereby, the second mounting arm 2 rotates around the shaft 3 under the action of the elastic member until the screw 4.1 abuts against one end of the arc groove 4.0.

[0042] In another example, the elastic member is a tension spring. One end of the tension spring is connected to the first mounting arm 1, and the other end of the tension spring is connected to the second mounting arm 2; so that the second mounting arm 2 rotates around the shaft 3 under the action of the elastic member until the screw 4.1 abuts against one end of the arc groove 4.0.

[0043] When grinding the inner wall weld of the cylindrical cavity, the second mounting arm 2 and the first mounting arm 1 need to be adjusted to a vertical state to facilitate grinding and polishing the inner wall weld of the cylindrical cavity; this embodiment is particularly suitable for grinding and polishing the inner wall weld of the cylindrical cavity. Specifically, The automatic grinder and polisher 5 is fixedly mounted on the other end of the second mounting arm 2 through the second mounting structure; when the second mounting arm 2 is rotated so that the screw rod 4.1 abuts against the other end of the arc groove 4.0, the second mounting arm 2 and the first mounting arm 1 are in an unfolded state, and the second mounting arm 2 is roughly parallel to the first mounting arm 1; thereby, the automatic grinder and polisher 5 and the second mounting arm 2 can extend into the inner cavity of the product through the smaller opening on the product; Next, loosen the locking nut 4.2. At this time, the second mounting arm 2 rotates around the shaft 3 under the action of the elastic member until the screw 4.1 abuts against one end of the arc groove 4.0. Then tighten the locking nut 4.2 to complete the adjustment of the second mounting arm 2 without manual adjustment. Then, the automatic grinder 5 is moved and / or rotated by the first mounting arm 1 to grind and polish the weld on the inner cavity surface of the product. Therefore, the cavity inner wall weld grinding and polishing tooling of the present solution can grind and polish the weld on the inner wall of the cavity of such hollow semiconductor products with small openings, effectively solving the problem that the weld on the inner wall of the cavity of such hollow semiconductor products with small openings is difficult to grind and polish; it is particularly suitable for grinding and polishing the inner wall weld of a cylindrical cavity.

[0044] In this embodiment, Figure 1 As shown, both the first mounting arm 1 and the second mounting arm 2 are strip-shaped plate structures. A sector plate 2.4 is provided on the extension arm 2.1, and an arc groove 4.0 is provided on the sector plate.

[0045] The first mounting structure includes two parallel first waist-shaped holes 1.1, and the length direction of the first waist-shaped holes 1.1 is parallel to the length direction of the first mounting arm 1. In this way, the cavity inner wall weld grinding and polishing tool can be installed on the manipulator through the first mounting structure, and the manipulator can be used to grind and polish the weld of the cavity inner wall of the hollow semiconductor product; in addition, the installation position of the first mounting arm 1 can also be adjusted through the first waist-shaped holes 1.1.

[0046] The second mounting structure includes one or more mounting holes 2.6. In this embodiment, the second mounting structure includes two mounting holes 2.6. The automatic polisher 5 is fixed to the mounting holes 2.6 by bolts, so that the automatic polisher 5 is fixedly mounted on the other end of the second mounting arm 2.

[0047] In one implementation of this embodiment, the second mounting arm 2 is a telescopic arm. In this way, the length of the second mounting arm 2 can be adjusted to grind the inner wall welds of different cavity sizes.

[0048] In one example, if Figure 1As shown, the second mounting arm 2 includes two left and right mounting arm plates and a connecting bolt connecting the two mounting arm plates. Two second waist-shaped holes 2.5 parallel to each other are provided on the two mounting arm plates. Specifically, the two second waist-shaped holes 2.5 on the left mounting arm plate 2.2 are arranged at the right end of the left mounting arm plate, and the two second waist-shaped holes 2.5 on the right mounting arm plate 2.3 are arranged at the left end of the right mounting arm plate. The length direction of the second waist-shaped holes 2.5 is parallel to the length direction of the second mounting arm 2. The two second waist-shaped holes 2.5 on the left mounting arm plate are provided with a connecting bolt, and the connecting bolt passes through the second waist-shaped holes 2.5 of the two mounting arm plates. The connecting bolt connects the left and right mounting arm plates into one.

[0049] Of course, the second mounting arm 2 may also be other telescopic arm structures in the prior art.

[0050] In another implementation of this embodiment, the second mounting arm 2 is an integral mounting arm and is not retractable, so as to facilitate the actual manufacturing of the second mounting arm 2.

[0051] Specific embodiment three, a grinding and polishing method using a cavity inner wall weld grinding and polishing tool, the specific structure of the cavity inner wall weld grinding and polishing tool used in the grinding and polishing method refers to specific embodiment one.

[0052] A method for grinding and polishing a cavity inner wall weld seam using a grinding and polishing tool comprises the following steps: First, as Figure 2 As shown, the second mounting arm 2 is rotated until the screw rod 4.1 abuts against the other end of the arc groove 4.0; at this time, the angle between the second mounting arm 2 and the first mounting arm 1 is 160-180 degrees, and the second mounting arm 2 and the first mounting arm 1 are in an extended state; then the locking nut 4.2 is tightened. When the second mounting arm 2 and the first mounting arm 1 are in an extended state, the second mounting arm 2 is roughly parallel to the first mounting arm 1; so that the automatic polisher 5 and the second mounting arm 2 can extend into the inner cavity of the product through the smaller opening on the product.

[0053] The automatic grinder 5 is fixedly mounted on the other end of the second mounting arm 2 through the second mounting structure; specifically, the automatic grinder 5 is fixed to the mounting hole 2.6 through bolts, so that the automatic grinder 5 is fixedly mounted on the other end of the second mounting arm 2. The automatic grinder 5 is an electric grinder or a pneumatic grinder. The specific grinding and polishing method and structure of the automatic grinder 5 are prior arts, and the specific structure is not the invention of the present application. Therefore, the present application does not elaborate on the conventional technical means such as the specific grinding and polishing method and structure of the automatic grinder 5.

[0054] Second, manually extend the automatic grinder 5 and the second mounting arm 2 into the inner cavity of the product through the opening 6 of the product, and place the extension arm 2.1 outside the product or close to the outside of the product.

[0055] Then, if Figure 3 As shown, loosen the locking nut 4.2, rotate the second mounting arm 2 to a set angle, and enable the automatic grinder 5 to grind and polish the weld on the inner surface of the product.

[0056] Next, tighten the lock nut 4.2; Third, if Figure 4 As shown, the operator manually moves and / or rotates the automatic grinder 5 through the first mounting arm 1 to grind and polish the weld on the inner cavity surface of the product through the automatic grinder 5. Therefore, the use of a cavity inner wall weld grinding and polishing tool of this embodiment can grind and polish the weld on the inner wall of the cavity of such hollow semiconductor products with small openings, thereby effectively solving the problem that the weld on the inner wall of the cavity of such hollow semiconductor products with small openings is difficult to grind and polish.

[0057] Specific embodiment 4 is a grinding and polishing method using a cavity inner wall weld grinding and polishing tool. The specific structure of the cavity inner wall weld grinding and polishing tool used in the grinding and polishing method refers to specific embodiment 1.

[0058] A method for grinding and polishing a cavity inner wall weld seam using a grinding and polishing tool comprises the following steps: First, as Figure 2 As shown, the second mounting arm 2 is rotated until the screw rod 4.1 abuts against the other end of the arc groove 4.0; at this time, the angle between the second mounting arm 2 and the first mounting arm 1 is 160-180 degrees, and the second mounting arm 2 and the first mounting arm 1 are in an extended state; then the locking nut 4.2 is tightened. When the second mounting arm 2 and the first mounting arm 1 are in an extended state, the second mounting arm 2 is roughly parallel to the first mounting arm 1; so that the automatic polisher 5 and the second mounting arm 2 can extend into the inner cavity of the product through the smaller opening on the product.

[0059] The automatic grinder 5 is fixedly mounted on the other end of the second mounting arm 2 through the second mounting structure; specifically, the automatic grinder 5 is fixed to the mounting hole 2.6 through bolts, so that the automatic grinder 5 is fixedly mounted on the other end of the second mounting arm 2. The automatic grinder 5 is an electric grinder or a pneumatic grinder. The specific grinding and polishing method and structure of the automatic grinder 5 are prior arts, and the specific structure is not the invention of the present application. Therefore, the present application does not elaborate on the conventional technical means such as the specific grinding and polishing method and structure of the automatic grinder 5.

[0060] The cavity inner wall weld grinding and polishing tool is installed on the robot arm through the first installation structure.

[0061] Second, if Figure 3 As shown, the automatic polisher 5 and the second mounting arm 2 are extended into the inner cavity of the product through the opening 6 of the product by a robot, and the extension arm 2.1 is placed outside the product or close to the outside of the product (the robot is not shown in the figure).

[0062] Next, loosen the locking nut 4.2 and rotate the second mounting arm 2 to a set angle so that the automatic grinder 5 can grind and polish the weld on the inner surface of the product.

[0063] Next, tighten the lock nut 4.2; Third, if Figure 4 As shown, the manipulator moves and / or rotates the automatic grinder 5 through the first mounting arm 1, so as to grind and polish the weld on the inner cavity surface of the product through the automatic grinder 5. Therefore, the use of a cavity inner wall weld grinding and polishing tool of this embodiment can grind and polish the weld on the inner wall of the cavity of such hollow semiconductor products with small openings, thereby effectively solving the problem that the weld on the inner wall of the cavity of such hollow semiconductor products with small openings is difficult to grind and polish.

[0064] Specific embodiment 5 is a grinding and polishing method using a cavity inner wall weld grinding and polishing tool. The specific structure of the cavity inner wall weld grinding and polishing tool used in the grinding and polishing method refers to specific embodiment 2.

[0065] A method for grinding and polishing a cavity inner wall weld seam using a grinding and polishing tool comprises the following steps: First, as Figure 2 As shown, the second mounting arm 2 is rotated until the screw rod 4.1 abuts against the other end of the arc groove 4.0; at this time, the angle between the second mounting arm 2 and the first mounting arm 1 is 160-180 degrees, and the second mounting arm 2 and the first mounting arm 1 are in an extended state; then the locking nut 4.2 is tightened. When the second mounting arm 2 and the first mounting arm 1 are in an extended state, the second mounting arm 2 is roughly parallel to the first mounting arm 1; so that the automatic polisher 5 and the second mounting arm 2 can extend into the inner cavity of the product through the smaller opening on the product.

[0066] The automatic grinder 5 is fixedly mounted on the other end of the second mounting arm 2 through the second mounting structure; specifically, the automatic grinder 5 is fixed to the mounting hole 2.6 through bolts, so that the automatic grinder 5 is fixedly mounted on the other end of the second mounting arm 2. The automatic grinder 5 is an electric grinder or a pneumatic grinder. The specific grinding and polishing method and structure of the automatic grinder 5 are prior arts, and the specific structure is not the invention of the present application. Therefore, the present application does not elaborate on the conventional technical means such as the specific grinding and polishing method and structure of the automatic grinder 5.

[0067] Second, if Figure 3 As shown, the automatic grinder 5 and the second mounting arm 2 are manually extended into the inner cavity of the product through the opening 6 of the product, and the extension arm 2.1 is placed outside the product or close to the outside of the product.

[0068] Next, the locking nut 4.2 is loosened, and the second mounting arm 2 rotates around the shaft 3 under the action of the elastic member until the screw rod 4.1 abuts against one end of the arc groove 4.0. At this time, the second mounting arm 2 is perpendicular to the first mounting arm 1.

[0069] Next, tighten the lock nut 4.2.

[0070] Third, if Figure 4 As shown, the operator manually moves and / or rotates the automatic grinder 5 through the first mounting arm 1 to grind and polish the weld on the inner cavity surface of the product through the automatic grinder 5. Therefore, the cavity inner wall weld grinding and polishing tooling of the present solution can grind and polish the weld on the inner wall of the cavity of such hollow semiconductor products with small openings, thereby effectively solving the problem that the weld on the inner wall of the cavity of such hollow semiconductor products with small openings is difficult to grind and polish.

[0071] The grinding and polishing method using the cavity inner wall weld grinding and polishing tool in this embodiment is particularly suitable for grinding and polishing the inner wall weld of a cylindrical cavity. In this embodiment, the grinding and polishing method is described by taking the grinding and polishing of the inner wall weld of a cylindrical cavity as an example. Specifically, A method for grinding and polishing the inner wall weld of a cylindrical cavity using a cavity inner wall weld grinding and polishing tool comprises the following steps: First, as Figure 2 As shown, the second mounting arm 2 is rotated until the screw rod 4.1 abuts against the other end of the arc groove 4.0; at this time, the angle between the second mounting arm 2 and the first mounting arm 1 is 160-180 degrees, and the second mounting arm 2 and the first mounting arm 1 are in an extended state; then the locking nut 4.2 is tightened. When the second mounting arm 2 and the first mounting arm 1 are in an extended state, the second mounting arm 2 is roughly parallel to the first mounting arm 1; so that the automatic polisher 5 and the second mounting arm 2 can extend into the inner cavity of the product through the smaller opening on the product.

[0072] The automatic grinder 5 is fixedly mounted on the other end of the second mounting arm 2 through the second mounting structure; specifically, the automatic grinder 5 is fixed to the mounting hole 2.6 through bolts, so that the automatic grinder 5 is fixedly mounted on the other end of the second mounting arm 2. The automatic grinder 5 is an electric grinder or a pneumatic grinder. The specific grinding and polishing method and structure of the automatic grinder 5 are prior arts, and the specific structure is not the invention of the present application. Therefore, the present application does not elaborate on the conventional technical means such as the specific grinding and polishing method and structure of the automatic grinder 5.

[0073] Second, if Figure 3 As shown, the automatic grinder 5 and the second mounting arm 2 are manually extended into the inner cavity of the product through the opening 6 of the product, and the extension arm 2.1 is placed outside the product or close to the outside of the product.

[0074] Next, the locking nut 4.2 is loosened, and the second mounting arm 2 rotates around the shaft 3 under the action of the elastic member until the screw rod 4.1 abuts against one end of the arc groove 4.0. At this time, the second mounting arm 2 is perpendicular to the first mounting arm 1.

[0075] Next, tighten the lock nut 4.2.

[0076] Third, if Figure 4 As shown, the operator manually moves the automatic grinder 5 through the first mounting arm 1, so that the grinding and polishing head of the automatic grinder 5 is closely attached to the inner wall weld surface of the cylindrical cavity; The operator manually drives the automatic grinder and polisher 5 to rotate along the inner wall of the cylindrical cavity through the first mounting arm 1 , so as to grind and polish the weld on the inner cavity surface of the product through the automatic grinder and polisher 5 .

[0077] Specific embodiment six, a grinding and polishing method using a cavity inner wall weld grinding and polishing tool, the specific structure of the cavity inner wall weld grinding and polishing tool used in the grinding and polishing method refers to specific embodiment two.

[0078] A method for grinding and polishing a cavity inner wall weld seam using a grinding and polishing tool comprises the following steps: First, as Figure 2 As shown, the second mounting arm 2 is rotated until the screw rod 4.1 abuts against the other end of the arc groove 4.0; at this time, the angle between the second mounting arm 2 and the first mounting arm 1 is 160-180 degrees, and the second mounting arm 2 and the first mounting arm 1 are in an extended state; then the locking nut 4.2 is tightened. When the second mounting arm 2 and the first mounting arm 1 are in an extended state, the second mounting arm 2 is roughly parallel to the first mounting arm 1; so that the automatic polisher 5 and the second mounting arm 2 can extend into the inner cavity of the product through the smaller opening on the product.

[0079] The automatic grinder 5 is fixedly mounted on the other end of the second mounting arm 2 through the second mounting structure; specifically, the automatic grinder 5 is fixed to the mounting hole 2.6 through bolts, so that the automatic grinder 5 is fixedly mounted on the other end of the second mounting arm 2. The automatic grinder 5 is an electric grinder or a pneumatic grinder. The specific grinding and polishing method and structure of the automatic grinder 5 are prior arts, and the specific structure is not the invention of the present application. Therefore, the present application does not elaborate on the conventional technical means such as the specific grinding and polishing method and structure of the automatic grinder 5.

[0080] The cavity inner wall weld grinding and polishing tool is installed on the robot arm through the first installation structure.

[0081] Second, if Figure 3 As shown, the automatic grinder 5 and the second mounting arm 2 are manually extended into the inner cavity of the product through the opening of the product by a robot, and the extension arm 2.1 is placed outside the product or close to the outside of the product (the robot is not shown in the figure).

[0082] Next, the locking nut 4.2 is loosened, and the second mounting arm 2 rotates around the shaft 3 under the action of the elastic member until the screw rod 4.1 abuts against one end of the arc groove 4.0. At this time, the second mounting arm 2 is perpendicular to the first mounting arm 1.

[0083] Next, tighten the lock nut 4.2.

[0084] Third, if Figure 4 As shown, the manipulator moves and / or rotates the automatic grinder 5 through the first mounting arm 1, so as to grind and polish the weld on the inner cavity surface of the product through the automatic grinder 5. Therefore, the cavity inner wall weld grinding and polishing tooling of the present solution can grind and polish the weld on the inner wall of the cavity of such hollow semiconductor products with small openings, thereby effectively solving the problem that the weld on the inner wall of the cavity of such hollow semiconductor products with small openings is difficult to grind and polish.

[0085] The grinding and polishing method using the cavity inner wall weld grinding and polishing tool in this embodiment is particularly suitable for grinding and polishing the inner wall weld of a cylindrical cavity. In this embodiment, the grinding and polishing method is described by taking the grinding and polishing of the inner wall weld of a cylindrical cavity as an example. Specifically, A method for grinding and polishing the inner wall weld of a cylindrical cavity using a cavity inner wall weld grinding and polishing tool comprises the following steps: First, rotate the second mounting arm 2 until the screw rod 4.1 contacts the other end of the arc groove 4.0; at this time, the angle between the second mounting arm 2 and the first mounting arm 1 is 160-180 degrees, and the second mounting arm 2 and the first mounting arm 1 are in an extended state; then tighten the locking nut 4.2. When the second mounting arm 2 and the first mounting arm 1 are in an extended state, the second mounting arm 2 is roughly parallel to the first mounting arm 1; so that the automatic polisher 5 and the second mounting arm 2 can extend into the inner cavity of the product through the smaller opening on the product.

[0086] The automatic grinder 5 is fixedly mounted on the other end of the second mounting arm 2 through the second mounting structure; specifically, the automatic grinder 5 is fixed to the mounting hole 2.6 through bolts, so that the automatic grinder 5 is fixedly mounted on the other end of the second mounting arm 2. The automatic grinder 5 is an electric grinder or a pneumatic grinder. The specific grinding and polishing method and structure of the automatic grinder 5 are prior arts, and the specific structure is not the invention of the present application. Therefore, the present application does not elaborate on the conventional technical means such as the specific grinding and polishing method and structure of the automatic grinder 5.

[0087] The cavity inner wall weld grinding and polishing tool is installed on the robot arm through the first installation structure.

[0088] Second, the automatic grinder 5 and the second mounting arm 2 are manually extended into the inner cavity of the product through the opening of the product by a robot, and the extension arm 2.1 is placed outside the product or close to the outside of the product.

[0089] Next, the locking nut 4.2 is loosened, and the second mounting arm 2 rotates around the shaft 3 under the action of the elastic member until the screw rod 4.1 abuts against one end of the arc groove 4.0. At this time, the second mounting arm 2 is perpendicular to the first mounting arm 1.

[0090] Next, tighten the lock nut 4.2.

[0091] Third, the manipulator manually moves the automatic grinder and polisher 5 through the first mounting arm 1, so that the grinding and polishing head of the automatic grinder and polisher 5 is closely attached to the inner wall weld surface of the cylindrical cavity; The manipulator manually drives the automatic grinder and polisher 5 to rotate along the inner wall of the cylindrical cavity through the first mounting arm 1 , so as to grind and polish the weld on the inner cavity surface of the product through the automatic grinder and polisher 5 .

[0092] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any way. Any simple modification, change and equivalent transformation made to the above embodiment based on the technical essence of the present invention still falls within the protection scope of the technical solution of the present invention.

Claims

1. A cavity inner wall weld grinding and polishing tool, characterized in that: include: A first mounting arm, one end of which is provided with a first mounting structure; A second mounting arm, one end of which is provided with an extension arm perpendicular to the second mounting arm, the other end of the second mounting arm is provided with a second mounting structure, and the end of the extension arm is rotatably connected to the other end of the first mounting arm through a shaft; The limit locking structure includes an arc groove arranged on the extension arm, a screw rod arranged on the first installation arm and parallel to the shaft rod, and a locking nut arranged on the screw rod, the arc groove is coaxial with the shaft rod, the screw rod passes through the arc groove, and the extension arm is located between the first installation arm and the locking nut; When the screw rod abuts against the other end of the arc-shaped groove, the second mounting arm and the first mounting arm are in an extended state.

2. The cavity inner wall weld grinding and polishing tool according to claim 1 is characterized in that: When the screw rod abuts against one end of the arc groove, the second mounting arm is perpendicular to the first mounting arm; when the screw rod abuts against the other end of the arc groove, the angle between the second mounting arm and the first mounting arm is 160-180 degrees.

3. The cavity inner wall weld grinding and polishing tool according to claim 1 is characterized in that: It also includes an elastic member. Under the action of the elastic member, the second mounting arm rotates around the shaft until the screw rod abuts against one end of the arc groove. At this time, the second mounting arm is perpendicular to the first mounting arm.

4. A cavity inner wall weld grinding and polishing tool according to claim 1, 2 or 3, characterized in that: The extension arm is provided with a sector plate, and the arc-shaped groove is arranged on the sector plate.

5. A cavity inner wall weld grinding and polishing tool according to claim 1, 2 or 3, characterized in that: The first mounting structure includes two parallel first waist-shaped holes, and the length direction of the first waist-shaped holes is parallel to the length direction of the first mounting arm.

6. A cavity inner wall weld grinding and polishing tool according to claim 1, 2 or 3, characterized in that: The second mounting structure includes one or more mounting holes.

7. A cavity inner wall weld grinding and polishing tool according to claim 1, 2 or 3, characterized in that: The second mounting arm is a telescopic arm.

8. The cavity inner wall weld grinding and polishing tool according to claim 7, characterized in that: The second mounting arm includes two left and right mounting arm plates and connecting bolts connecting the two mounting arm plates. Both mounting arm plates are provided with second waist-shaped holes. The length direction of the second waist-shaped holes is parallel to the length direction of the second mounting arm. The connecting bolts pass through the second waist-shaped holes of the two mounting arm plates.

9. A method for grinding and polishing a cavity inner wall weld using a cavity inner wall weld polishing tool as claimed in any one of claims 1 to 8, characterized in that: The following steps are included: First, rotate the second mounting arm until the screw rod contacts the other end of the arc groove; then tighten the locking nut; The automatic grinder and polisher is fixedly mounted on the other end of the second mounting arm through the second mounting structure; Second, extend the automatic grinder and the second mounting arm into the inner cavity of the product through the opening of the product, and place the extension arm outside the product; then, loosen the locking nut and rotate the second mounting arm to the set angle so that the automatic grinder can grind and polish the weld on the inner cavity surface of the product; then, tighten the locking nut; Third, the automatic grinder and polisher is moved and / or rotated by the first mounting arm to grind and polish the weld on the inner cavity surface of the product.

10. A method for grinding and polishing a cavity inner wall weld using the grinding and polishing tool of claim 3, characterized in that: The following steps are included: First, rotate the second mounting arm until the screw rod contacts the other end of the arc groove; then tighten the locking nut; The automatic grinder and polisher is fixedly mounted on the other end of the second mounting arm through the second mounting structure; Second, extend the automatic polisher and the second mounting arm into the inner cavity of the product through the opening of the product, and place the extension arm outside the product; then, loosen the locking nut. At this time, the second mounting arm rotates around the shaft under the action of the elastic member until the screw rod abuts against one end of the arc groove; then, tighten the locking nut; Third, the automatic grinder and polisher is moved and / or rotated by the first mounting arm to grind and polish the weld on the inner cavity surface of the product by the automatic grinder and polisher.

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