Grinding and polishing processing assembly line for substrate slice

Abstract

The invention discloses a substrate slice grinding and polishing processing assembly line which comprises a ceramic disk cleaning machine, a slice shoveling machine, a roller conveying line, a wax pasting machine and a plurality of polishing machines. A first temporary storage machine is arranged on one side of the slice shoveling machine, first lifting machines are arranged at the two ends of the first temporary storage machine, and the roller conveying line is arranged on one side of one of the first lifting machines; a ceramic disc cleaning machine is arranged at one end of the roller conveying line, a wax pasting machine is arranged on one side of the ceramic disc cleaning machine, a second temporary storage machine is arranged on one side of the wax pasting machine, a plurality of polishing machines are arranged between the second temporary storage machine and the slice shoveling machine, and grabbing manipulator mechanisms are arranged between the adjacent polishing machines; the polishing operation parameters of the multiple polishing machines are different; a plurality of grinding and processing devices of the substrate slices are integrated on one processing assembly line through the roller conveying line, the processing efficiency of the substrate slices is improved, meanwhile, a plurality of polishing machines are arranged, the operation parameters and functions of the polishing machines are different, the substrate slices can be polished through various processes, and the processing precision is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of substrate sheet processing, and more specifically, to a substrate sheet grinding and polishing processing line. Background Art

[0002] The grinding process of the substrate sheet is complicated, and it needs to be cleaned by ceramic disc, scraped, waxed and polished. The existing processing line cannot meet all the processing technologies. After one process is completed, it needs to be manually transported to the next process, which is labor-intensive and results in low processing efficiency. It is also impossible to realize processing automation. In addition, the existing processing line does not have a polishing machine with different polishing parameters, and it is impossible to perform multiple process polishing on the substrate sheet, resulting in poor polishing effect. Summary of the invention

[0003] In order to solve at least one of the above technical problems, the present invention proposes a substrate sheet grinding and polishing processing line.

[0004] The first aspect of the present invention provides a substrate sheet grinding and polishing processing line, a ceramic disc cleaning machine, a ceramic disc lifting machine, a buffer machine, a manipulator, a ceramic disc washing machine, a scraper, a roller conveyor line, a waxing machine and a plurality of polishing machines; the characteristics are that the ceramic disc is recycled through cleaning in a circular line body, and the manual operation only needs to insert the wafer into the loading and waxing machine station, and after the wafer and the ceramic disc carrier are ground and polished for multiple times, the wafer and the ceramic disc are separated by the scraper and the wafer is output;

[0005] A first buffer is provided on one side of the blade shovel, first elevators are provided at both ends of the first buffer, and the roller conveyor line is provided on one side of one of the first elevators;

[0006] A ceramic disc cleaning machine is arranged at one end of the roller conveyor line, a waxing machine is arranged at one side of the ceramic disc cleaning machine, a second buffer machine is arranged at one side of the waxing machine, a plurality of polishing machines are arranged between the second buffer machine and the scraping machine, and a grabbing manipulator mechanism is arranged between adjacent polishing machines;

[0007] The polishing operating parameters of multiple polishing machines are different.

[0008] In a preferred embodiment of the present invention, a second elevator is provided between the wax applying machine and the second buffer machine.

[0009] In a preferred embodiment of the present invention, the polishing machine includes a first polishing machine, a second polishing machine, a third polishing machine, a fourth polishing machine and a fifth polishing machine, and the grasping robot mechanism includes a first robot arm and a second robot arm, the first robot arm is arranged between the first polishing machine and the second polishing machine, the third polishing machine and the fourth polishing machine, and the fourth polishing machine and the fifth polishing machine, and the second robot arm is arranged between the second polishing machine and the third polishing machine.

[0010] In a preferred embodiment of the present invention, a translation module is disposed at the bottom of the second robotic arm, and a first cleaning tank is disposed below the second robotic arm.

[0011] In a preferred embodiment of the present invention, a second cleaning tank is provided on one side of the fifth polishing machine, a first robotic arm is provided above the second cleaning tank, a rotating suction cup is provided at the end of the first robotic arm, and a plurality of cleaning nozzles are provided on the second cleaning tank.

[0012] In a preferred embodiment of the present invention, the roller conveyor line includes a conveying lifting assembly and a plurality of conveying rollers arranged on one side of the conveying assembly, the conveying rollers are used to convey substrate sheets, a conveying sensor is arranged on one side of the conveying lifting assembly, and conveying cylinder blocking wheel positioning ceramic discs are arranged on both sides of the conveying rollers.

[0013] In a preferred embodiment of the present invention, the first lifting machine includes a lifting cylinder, a lifting sensor and a lifting blocking wheel are arranged on one side of the lifting cylinder, and a lifting roller is arranged at one end of the lifting cylinder.

[0014] In a preferred embodiment of the present invention, the first cache machine includes a plurality of cache rollers, cache blocking wheels are symmetrically arranged on both sides of any cache roller, and a cache sensor and a fan filter outlet are arranged on one side of the cache roller.

[0015] In a preferred embodiment of the present invention, the scraper machine includes a roller conveying assembly, a plurality of rollers are arranged on the roller conveying assembly, a water spraying mechanism and a blocking wheel are arranged on one side of the roller, a scraper lifting assembly is arranged on the roller conveying assembly, a sensor is arranged on one side of the roller, and the roller is connected to a waterproof motor, which drives the roller to rotate.

[0016] In a preferred embodiment of the present invention, a barcode scanner is provided on one side of the roller conveying assembly, a blocking cylinder is provided on one side of the barcode scanner, a wind knife is provided on one side of the blocking cylinder, a water tank is provided on the other side of the blocking cylinder, an inclined elevator is provided at one end of the water tank, and an overflow port is provided on one side of the water tank, and the overflow port is used to remove dirt and keep it clean.

[0017] The above technical solution of the present invention has the following advantages compared with the prior art:

[0018] The present application integrates grinding processing equipment for multiple substrate sheets into one processing line through a roller conveyor line, thereby improving the processing efficiency of the substrate sheets. At the same time, multiple polishing machines are arranged, each of which has different operating parameters and functions, and the substrate sheets can be polished by a variety of processes to improve the processing accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, some of the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1 It is a schematic diagram of the three-dimensional structure of a substrate lapping and polishing processing line according to an embodiment of the present invention;

[0021] Figure 2 Schematic diagram of a roller conveyor line according to an embodiment of the present invention;

[0022] Figure 3 is a schematic structural diagram of a first hoist according to an embodiment of the present invention;

[0023] Figure 4 This is a schematic diagram of the structure of a shovel blade machine according to an embodiment of the present invention;

[0024] Figure 5 It is a schematic diagram of the structure of the first cache machine according to an embodiment of the present invention.

[0025] In the figure: 1. Scraper, 101. Wind knife, 102. Blocking cylinder, 103. Overflow, 104. Inclined elevator, 105. Water tank, 106. Barcode scanner, 107. Sensor, 108. Lifting assembly, 109. Waterproof motor, 110. Blocking wheel, 111. Roller; 2. First elevator, 201. Lifting cylinder, 202. Lifting sensor, 203. Lifting roller, 204. Lifting blocking wheel; 3. First cache machine, 301. Fan filter outlet, 302. Cache blocking wheel, 303. Cache roller, 304. Cache Sensor; 4, roller conveyor line, 401, conveying lifting assembly, 402, conveying cylinder blocking wheel, 403, conveying sensor, 404, conveying roller; 5, ceramic disc cleaning machine, 6, waxing machine, 7, second lifting machine, 8, second buffer machine, 9, first robotic arm, 10, first polishing machine, 11, second polishing machine, 12, translation module, 13, first cleaning tank, 14, second robotic arm, 15, third polishing machine, 16, fourth polishing machine, 17, fifth polishing machine, 18, rotating suction cup, 19, cleaning nozzle, 20, second cleaning tank. DETAILED DESCRIPTION

[0026] In order to more clearly understand the above-mentioned purpose, features and advantages of the present invention, the present invention is further described in detail below in conjunction with specific embodiments. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0027] In the following description, numerous specific details are set forth to provide a thorough understanding of the present invention.

[0028] However, the present invention may also be implemented in other ways than those described herein.

[0029] Therefore, the protection scope of the present invention is not limited by the specific embodiments disclosed below.

[0030] Embodiment 1

[0031] See also Figure 1-Figure 5 As shown, the present invention proposes a substrate sheet grinding and polishing processing line, including: a ceramic disc cleaning machine, a ceramic disc lifting machine, a buffer machine, a manipulator, a ceramic disc washing machine, a scraper machine, a roller conveyor line, a wax sticking machine and a plurality of polishing machines; the characteristic is that the ceramic disc is recycled through cleaning in the annular line body, and the manual operation only needs to insert the wafer into the feeding and wax sticking machine station, and the wafer and the ceramic disc carrier are separated from the ceramic disc by the scraper machine after multiple grinding and polishing, and the wafer is output;

[0032] A first buffer 3 is provided on one side of the blade shovel 1, first elevators 2 are provided at both ends of the first buffer 3, and a roller conveyor line 4 is provided on one side of one of the first elevators 2;

[0033] A ceramic disc cleaning machine 5 is provided at one end of the roller conveyor line 4, a waxing machine 6 is provided at one side of the ceramic disc cleaning machine 5, a second buffer machine 8 is provided at one side of the waxing machine 6, a plurality of polishing machines are provided between the second buffer machine 8 and the scraping machine 1, and a grabbing manipulator mechanism is provided between adjacent polishing machines;

[0034] The polishing operating parameters of multiple polishing machines are different.

[0035] According to the embodiment of the present invention, a second elevator 7 is provided between the wax applying machine 6 and the second buffer machine 8 .

[0036] According to an embodiment of the present invention, the polishing machine includes a first polishing machine 10, a second polishing machine 11, a third polishing machine 15, a fourth polishing machine 16 and a fifth polishing machine 17, and the grasping robot mechanism includes a first robot arm 9 and a second robot arm 14, the first robot arm 9 is arranged between the first polishing machine 10 and the second polishing machine 11, the third polishing machine 15 and the fourth polishing machine 16, and the fourth polishing machine 16 and the fifth polishing machine 17, and the second robot arm 14 is arranged between the second polishing machine 11 and the third polishing machine 15.

[0037] According to the embodiment of the present invention, a translation module 12 is disposed at the bottom of the second robotic arm 14 , and a first cleaning tank 13 is disposed below the second robotic arm 14 .

[0038] According to an embodiment of the present invention, a second cleaning tank 20 is provided on one side of the fifth polishing machine 17, a first robotic arm 9 is provided above the second cleaning tank 20, a rotating suction cup 18 is provided at the end of the first robotic arm 9, and a plurality of cleaning nozzles 19 are provided on the second cleaning tank 20.

[0039] According to an embodiment of the present invention, the roller conveyor line 4 includes a conveying lifting component 401 and a plurality of conveying rollers 404 arranged on one side of the conveying component, the conveying rollers 404 are used to convey substrate sheets, a conveying sensor 403 is arranged on one side of the conveying lifting component 401, and conveying cylinder blocking wheels 402 are arranged on both sides of the conveying rollers 404.

[0040] According to the embodiment of the present invention, the first lifting machine 2 includes a lifting cylinder 201 , a lifting sensor 202 and a lifting blocking wheel 204 are arranged on one side of the lifting cylinder 201 , and a lifting roller 203 is arranged at one end of the lifting cylinder 201 .

[0041] According to the embodiment of the present invention, the first cache machine 3 includes a plurality of cache rollers 303 , cache blocking wheels 302 are symmetrically arranged on both sides of any cache roller 303 , and a cache sensor 304 and a fan filter outlet 301 are arranged on one side of the cache roller 303 .

[0042] According to an embodiment of the present invention, the scraper 1 includes a roller conveying assembly, a plurality of rollers 111 are arranged on the roller conveying assembly, a water spraying mechanism and a blocking wheel 110 are arranged on one side of the roller 111, a lifting assembly 108 is arranged on the roller conveying assembly, a sensor 107 is arranged on one side of the roller 111, and the roller 111 is connected to a waterproof motor 109, which drives the roller 111 to rotate.

[0043] According to an embodiment of the present invention, a barcode scanner 106 is provided on one side of the roller conveying assembly, a blocking cylinder 102 is provided on one side of the barcode scanner 106, a wind knife 101 is provided on one side of the blocking cylinder 102, a water tank 105 is provided on the other side of the blocking cylinder 102, an inclined elevator 104 is provided at one end of the water tank 105, and an overflow port 103 is provided on one side of the water tank 105.

[0044] In summary, the present application integrates the grinding processing equipment of multiple substrate sheets into one processing line through the roller conveyor line 4, thereby improving the processing efficiency of the substrate sheets. At the same time, multiple polishing machines are set up, each polishing machine has different operating parameters and functions, and the substrate sheets can be polished by a variety of processes to improve the processing accuracy.

[0045] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0046] The above description of the disclosed embodiments enables one skilled in the art to implement or use the present invention. Various modifications to the above embodiments will be apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the above embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

[0047] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A substrate grinding and polishing processing line, comprising: Ceramic disc cleaning machine, ceramic disc lifting machine, buffer machine, manipulator, ceramic disc washing machine, scraper, roller conveyor line, waxing machine and multiple polishing machines; characterized in that the ceramic disc is recycled through cleaning in the annular line body, and the manual operation only needs to plug the wafer into the feeding and waxing machine station, and the wafer and the ceramic disc carrier are ground and polished for multiple times, and then the wafer is separated from the ceramic disc by the scraper and the wafer is output; A first buffer is provided on one side of the blade shovel, first elevators are provided at both ends of the first buffer, and the roller conveyor line is provided on one side of one of the first elevators; A ceramic disc cleaning machine is arranged at one end of the roller conveyor line, a waxing machine is arranged at one side of the ceramic disc cleaning machine, a second buffer machine is arranged at one side of the waxing machine, a plurality of polishing machines are arranged between the second buffer machine and the scraping machine, and a grabbing manipulator mechanism is arranged between adjacent polishing machines; The polishing operating parameters of multiple polishing machines are different.

2. A substrate sheet grinding and polishing processing line according to claim 1, characterized in that: A second elevator is arranged between the wax applying machine and the second buffer machine.

3. A substrate sheet grinding and polishing processing line according to claim 2, characterized in that: The polishing machine includes a first polishing machine, a second polishing machine, a third polishing machine, a fourth polishing machine and a fifth polishing machine, and the grasping robot mechanism includes a first robot arm and a second robot arm, the first robot arm is arranged between the first polishing machine and the second polishing machine, the third polishing machine and the fourth polishing machine, and the fourth polishing machine and the fifth polishing machine, and the second robot arm is arranged between the second polishing machine and the third polishing machine.

4. A substrate sheet grinding and polishing processing line according to claim 3, characterized in that: A translation module is arranged at the bottom of the second robotic arm, and a first cleaning tank is arranged below the second robotic arm.

5. A substrate lapping and polishing processing line according to claim 4, characterized in that: A second cleaning tank is arranged at one side of the fifth polishing machine, a first mechanical arm is arranged above the second cleaning tank, a rotating suction cup is arranged at the end of the first mechanical arm, and a plurality of cleaning nozzles are arranged on the second cleaning tank.

6. A substrate lapping and polishing processing line according to claim 1, characterized in that: The roller conveyor line includes a conveying lifting component and a plurality of conveying rollers arranged on one side of the conveying component. The conveying rollers are used to convey substrate sheets. A conveying sensor is arranged on one side of the conveying lifting component. Conveying cylinder blocking wheels are arranged on both sides of the conveying rollers.

7. A substrate lapping and polishing processing line according to claim 1, characterized in that: The first lifting machine comprises a lifting cylinder, a lifting sensor and a lifting blocking wheel are arranged on one side of the lifting cylinder to position the ceramic plate, and a lifting roller is arranged at one end of the lifting cylinder.

8. A substrate lapping and polishing processing line according to claim 1, characterized in that: The first cache machine includes a plurality of cache rollers, and cache blocking wheels are symmetrically arranged on both sides of any cache roller, and a cache sensor and a fan filter outlet are arranged on one side of the cache roller.

9. A substrate sheet grinding and polishing processing line according to claim 1, characterized in that: The scraper includes a roller conveying assembly, a plurality of rollers are arranged on the roller conveying assembly, a water spray mechanism and a blocking wheel are arranged on one side of the roller, a scraper lifting assembly is arranged on the roller conveying assembly, a sensor is arranged on one side of the roller, and the roller is connected to a waterproof motor. The waterproof motor drives the roller to rotate, so that the wafer can be separated from the ceramic disk and the wafer can be sent into the jam in sequence.

10. A substrate lapping and polishing processing line according to claim 9, characterized in that: A barcode scanner is provided on one side of the roller conveying assembly, a blocking cylinder is provided on one side of the barcode scanner, a wind knife is provided on one side of the blocking cylinder, a water tank is provided on the other side of the blocking cylinder, an inclined elevator is provided at one end of the water tank, an overflow port is provided on one side of the water tank, and the overflow port is used to remove dirt and keep it clean.

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