A polishing tool and polishing method for through hole sealing surface

Abstract

The present invention relates to a polishing tool and a polishing method for a through-hole sealing surface, wherein the polishing tool comprises a cylindrical rod body, a polishing piece is sleeved on one side of the polishing end close to the cylindrical rod body, the polishing surface of the polishing piece is covered with sandpaper, and the sandpaper contacts the through-hole sealing surface during polishing; the clamping end of the cylindrical rod body is clamped and driven to rotate by a driving device. The polishing tool provided by the present invention can greatly improve the polishing efficiency and ensure the roughness of the polishing lines, has a high polishing quality, and thus ensures the sealing of the contact surface, and is suitable for polishing the sealing requirement surface that is not the center of the product.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor processing equipment, and in particular to a polishing tool and a polishing method for a through hole sealing surface. Background Art

[0002] In the manufacture of semiconductor equipment, gas distribution plates are often used to accurately distribute gases to different reaction chambers. In situations where high gas flow accuracy and equipment stability are required, the sealing surface of the non-product area of ​​the gas distribution plate usually needs to be finely polished to improve sealing and reduce gas leakage, thereby ensuring efficient and safe operation of the system.

[0003] At present, three-jaw fixture polishing equipment is mainly used to polish the sealing surface, but the use of three-jaw fixture polishing equipment is limited to the same area where the longitudinal surface and the center point of the product are located. It is impossible to polish the sealing surface that is not on the center circle of the product and has longitudinal grain. Polishing operations can only be performed using tooling and handheld gun drills.

[0004] CN205904849U discloses a valve seat sealing surface polishing tool, including a motor, a clamping tool, a core shaft, a flap wheel and a housing, the motor is installed in the housing, the housing is installed on the clamping tool, one end of the core shaft is fixedly connected to the main shaft of the motor, and the other end of the core shaft extends out of the housing, the flap wheel is coaxially installed on the core shaft, the flap wheel is located at the end of the core shaft extending out of the housing, and a bearing is installed between the core shaft and the housing.

[0005] CN220740659U discloses a polishing device for the inclined sealing surface of a small-caliber top-mounted ball valve body, which includes a valve body fixing mechanism, a polishing mechanism, and a polishing machine fixing mechanism. The above three mechanisms are all arranged on a general vehicle, wherein the polishing mechanism is fixed on the polishing machine fixing mechanism, and the valve body fixing mechanism is opposite to the polishing mechanism.

[0006] The above polishing tools can accurately perform high-speed polishing on the sealing surface of the workpiece, but the application scenarios are limited. They are not suitable for polishing the sealing surfaces that are not on the center circle of the product, and the preparation cost of the polishing tools is relatively high. Summary of the invention

[0007] In view of the deficiencies in the prior art, the purpose of the present invention is to provide a polishing tool and a polishing method for a through-hole sealing surface, which is suitable for polishing sealing surfaces that are not in the center of the product, effectively improving the polishing efficiency and ensuring the roughness of the polishing lines.

[0008] In order to achieve the purpose of the invention, the present invention adopts the following technical solutions:

[0009] In the first aspect, the present invention provides a polishing tool for a through-hole sealing surface, the polishing tool comprising a cylindrical rod body, a polishing piece being sleeved on one side of the polishing end close to the cylindrical rod body, the polishing surface of the polishing piece being covered with sandpaper, and the sandpaper being in contact with the through-hole sealing surface during polishing; the clamping end of the cylindrical rod body is clamped and driven to rotate by a driving device.

[0010] The polishing tool for the through-hole sealing surface provided by the present invention can greatly improve the polishing efficiency and ensure the roughness of the polishing lines, thereby ensuring the sealing of the contact surface. Compared with the embryo drawing machine, it can meet the requirements of the along-the-grain processing of various types of positions. In addition, under the action of the driving device, it avoids the problems of unevenness of pure hand grinding and unclear along-the-grain lines. It has high polishing quality and is suitable for polishing the sealing surface that is not the center of the product.

[0011] Preferably, the cylindrical rod body and the polishing piece are made of polypropylene respectively and independently.

[0012] The present invention adopts a polishing tool made of polypropylene, which has a low hardness and can avoid bumps and scratches on the product during the polishing process.

[0013] Preferably, the cylindrical rod body and the polishing piece are processed by computer numerical control.

[0014] Preferably, the diameter of the polished end surface of the cylindrical rod is smaller than the diameter of the through hole.

[0015] Preferably, the polishing member is annular, and the outer diameter of the polishing surface of the polishing member is smaller than the diameter of the through hole sealing surface.

[0016] It should be noted that the present invention does not specifically limit the specific size of the polishing part. The function of the polishing part in the present invention is to make the sandpaper contact with the through-hole sealing surface and perform polishing. Therefore, it can be understood that other specific sizes of polishing parts that can achieve such functions can be used in the present invention, and technical personnel in this field can adaptively adjust the specific size of the polishing part according to the usage scenario and application conditions.

[0017] Preferably, the outer diameter of the sandpaper is smaller than the outer diameter of the polishing surface of the polishing element.

[0018] The outer diameter of the sandpaper is set to be smaller than the outer diameter of the polishing surface of the polishing piece, so that during the polishing operation, the polishing piece can press the sandpaper to make it completely fit the sealing surface of the through hole.

[0019] Preferably, the outer diameter of the sandpaper is larger than the outer diameter of the annular polishing area of ​​the through hole sealing surface.

[0020] It should be noted that the present invention does not specifically limit the outer diameter of sandpaper. The role of sandpaper in the present invention is a medium for polishing along the grain. Therefore, it can be understood that other outer diameters of sandpaper that can achieve such functions can be used in the present invention, and those skilled in the art can adaptively adjust the outer diameter of sandpaper according to usage scenarios and application conditions.

[0021] Preferably, the mesh number of the sandpaper is 400-800 meshes, for example, 400 meshes, 600 meshes or 800 meshes, but is not limited to the listed values, and other unlisted values ​​within the numerical range are also applicable.

[0022] In a second aspect, the present invention provides a method for polishing a through hole sealing surface, the polishing method is performed using the polishing tool for the through hole sealing surface described in the first aspect, and the polishing method comprises the following steps:

[0023] Sandpaper is inserted into the polishing end of the cylindrical rod body so that the sandpaper covers the polishing surface of the polished part; then the clamping end of the cylindrical rod body is clamped by a driving device, and the polishing end of the cylindrical rod body is inserted into the through hole so that the sandpaper contacts the sealing surface of the through hole; the driving device drives the polishing end of the cylindrical rod body to rotate to achieve the parallel-grain polishing of the sealing surface of the through hole.

[0024] The polishing method of the through hole sealing surface provided by the present invention can realize the parallel-grain polishing of the through hole sealing surface with the assistance of a driving device by adopting a specially designed polishing tool. The parallel-grain surface roughness can meet the requirements, thereby ensuring the sealing performance of the through hole sealing surface.

[0025] Preferably, the edge of the polishing end is chamfered before the polishing end is inserted into the sandpaper.

[0026] In the present invention, the edge of the polishing end is chamfered to prevent burrs from falling off during the polishing process and thus contaminating the product.

[0027] Preferably, the through hole is located at a location other than the center of the product, and the through hole includes a water channel and / or a vent.

[0028] The polishing tool provided by the present invention can polish the sealing surface where the through hole is located at a location other than the center of the product, thereby meeting the requirements for along-grain polishing roughness.

[0029] Preferably, the polishing end of the driving cylindrical rod rotates at a speed of 3000-3500 r / min, for example, 3000 r / min, 3100 r / min, 3200 r / min, 3300 r / min or 3500 r / min, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0030] The time for driving the polishing end of the cylindrical rod to rotate is 5-10 minutes, for example, 5 minutes, 6 minutes, 8 minutes, 9 minutes or 10 minutes, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0031] Preferably, the drive means comprises a handheld drill.

[0032] Preferably, after the polishing along the grain, the surface along the grain is masked with an adhesive tape, and the random grains on the edges are polished and trimmed.

[0033] The numerical range described in the present invention not only includes the point values ​​listed above, but also includes any point values ​​between the above numerical ranges that are not listed. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range.

[0034] Compared with the prior art, the present invention has the following beneficial effects:

[0035] The polishing tool for the through-hole sealing surface provided by the present invention can greatly improve the polishing efficiency and ensure the roughness of the polishing lines, thereby ensuring the sealing of the contact surface. Compared with the embryo drawing machine, it can meet the requirements of the along-the-grain processing of various types of positions. In addition, under the action of the driving device, it avoids the problems of unevenness of pure hand grinding and unclear along-the-grain lines. It has high polishing quality and is suitable for polishing the sealing surface that is not the center of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 is a schematic structural diagram of a polishing tool provided in Example 1 of the present invention;

[0037] Figure 2 is a schematic diagram of the connection between the sandpaper and the polishing tool provided in Example 1 of the present invention;

[0038] Figure 3 It is a schematic diagram of the polished end of the cylindrical rod body provided in Example 1 of the present invention being inserted into the interior of a through hole.

[0039] Wherein: 1, cylindrical rod body; 2, polishing end; 3, polishing piece; 4, sandpaper; 5, through hole sealing surface; 6, clamping end. DETAILED DESCRIPTION

[0040] The technical solution of the present invention is further described below by specific implementation methods. It should be understood by those skilled in the art that the embodiments are only to help understand the present invention and should not be regarded as specific limitations of the present invention.

[0041] Example 1

[0042] This embodiment provides a polishing tool for the through hole sealing surface, the structural schematic diagram of which is shown in FIG. Figure 1As shown, the polishing tool comprises a cylindrical rod body 1, a polishing piece 3 is sleeved on one side of the polishing end 2 close to the cylindrical rod body 1, and the polishing surface of the polishing piece 3 is covered with 600-mesh sandpaper 4. The connection diagram of the sandpaper 4 and the polishing tool is shown in Figure 2 As shown, during polishing, the sandpaper 4 contacts the through-hole sealing surface 5; the clamping end 6 of the cylindrical rod body 1 is clamped and driven to rotate by a handheld drill; the cylindrical rod body 1 and the polishing piece 3 are both made of polypropylene, and the cylindrical rod body 1 and the polishing piece 3 are processed by computer numerical control.

[0043] The end face diameter of the polished end 2 of the cylindrical rod body 1 is smaller than the diameter of the through hole; the polishing member 3 is annular, and the outer diameter of the polishing surface of the polishing member 3 is smaller than the diameter of the through hole sealing surface 5; the outer diameter of the sandpaper 4 is smaller than the outer diameter of the polishing surface of the polishing member 3, and the outer diameter of the sandpaper 4 is larger than the outer diameter of the annular polishing area of ​​the through hole sealing surface 5.

[0044] The method for polishing the through hole sealing surface 5 using a polishing tool comprises the following steps:

[0045] The edge of the polished end 2 of the cylindrical rod body 1 is chamfered, and then the sandpaper 4 is inserted into the polished end 2 so that the sandpaper 4 covers the polished surface of the polishing piece 3; then the clamping end 6 of the cylindrical rod body 1 is clamped by a handheld drill, and the polished end 2 of the cylindrical rod body 1 is inserted into the through hole, as shown in the schematic diagram. Figure 3 As shown, the sandpaper 4 is brought into contact with the through-hole sealing surface 5; the polishing end 2 of the cylindrical rod body 1 is driven by a handheld drill to rotate at a speed of 3200 r / min for 8 minutes to achieve the parallel-grain polishing of the through-hole sealing surface 5, and then the parallel-grain surface is masked with tape, and the random grains on the edge are polished and trimmed.

[0046] In this embodiment, the parallel-grain polishing of the through-hole sealing surface can meet the requirements, and the parallel-grain pattern ensures the sealing of the contact surface and improves the polishing efficiency.

[0047] Example 2

[0048] The present embodiment provides a polishing tool for a through-hole sealing surface, the polishing tool comprising a cylindrical rod body 1, a polishing piece 3 is sleeved on one side of a polishing end 2 close to the cylindrical rod body 1, the polishing surface of the polishing piece 3 is covered with 400-mesh sandpaper 4, and the sandpaper 4 is in contact with the through-hole sealing surface 5 during polishing; the clamping end 6 of the cylindrical rod body 1 is clamped and driven to rotate by a hand-held drill; the cylindrical rod body 1 and the polishing piece 3 are both made of polypropylene, and the cylindrical rod body 1 and the polishing piece 3 are processed by computer numerical control.

[0049] The end face diameter of the polished end 2 of the cylindrical rod body 1 is smaller than the diameter of the through hole; the polishing member 3 is annular, and the outer diameter of the polishing surface of the polishing member 3 is smaller than the diameter of the through hole sealing surface 5; the outer diameter of the sandpaper 4 is smaller than the outer diameter of the polishing surface of the polishing member 3, and the outer diameter of the sandpaper 4 is larger than the outer diameter of the annular polishing area of ​​the through hole sealing surface 5.

[0050] The method for polishing the through hole sealing surface 5 using a polishing tool comprises the following steps:

[0051] The edge of the polished end 2 of the cylindrical rod body 1 is chamfered, and then sandpaper 4 is inserted into the polished end 2 so that the sandpaper 4 covers the polished surface of the polishing piece 3; then a handheld drill is used to clamp the clamping end 6 of the cylindrical rod body 1, and the polished end 2 of the cylindrical rod body 1 is inserted into the through hole so that the sandpaper 4 contacts the through hole sealing surface 5; the handheld drill drives the polished end 2 of the cylindrical rod body 1 to rotate at a speed of 3000r / min for 10min to achieve the parallel-grain polishing of the through hole sealing surface 5, and then the parallel-grain surface is masked with tape, and the random grains on the edge are polished and trimmed.

[0052] In this embodiment, the parallel-grain polishing of the through-hole sealing surface can meet the requirements, and the parallel-grain pattern ensures the sealing of the contact surface and improves the polishing efficiency.

[0053] Example 3

[0054] The present embodiment provides a polishing tool for a through-hole sealing surface, the polishing tool comprising a cylindrical rod body 1, a polishing piece 3 is sleeved on one side of a polishing end 2 close to the cylindrical rod body 1, the polishing surface of the polishing piece 3 is covered with 800-mesh sandpaper 4, and the sandpaper 4 is in contact with the through-hole sealing surface 5 during polishing; the clamping end 6 of the cylindrical rod body 1 is clamped and driven to rotate by a hand-held drill; the cylindrical rod body 1 and the polishing piece 3 are both made of polypropylene, and the cylindrical rod body 1 and the polishing piece 3 are processed by computer numerical control.

[0055] The end face diameter of the polished end 2 of the cylindrical rod body 1 is smaller than the diameter of the through hole; the polishing member 3 is annular, and the outer diameter of the polishing surface of the polishing member 3 is smaller than the diameter of the through hole sealing surface 5; the outer diameter of the sandpaper 4 is smaller than the outer diameter of the polishing surface of the polishing member 3, and the outer diameter of the sandpaper 4 is larger than the outer diameter of the annular polishing area of ​​the through hole sealing surface 5.

[0056] The method for polishing the through hole sealing surface 5 using a polishing tool comprises the following steps:

[0057] The edge of the polished end 2 of the cylindrical rod body 1 is chamfered, and then sandpaper 4 is inserted into the polished end 2 so that the sandpaper 4 covers the polished surface of the polishing piece 3; then a handheld drill is used to clamp the clamping end 6 of the cylindrical rod body 1, and the polished end 2 of the cylindrical rod body 1 is inserted into the through hole so that the sandpaper 4 contacts the through hole sealing surface 5; the handheld drill drives the polished end 2 of the cylindrical rod body 1 to rotate at a speed of 3500r / min for 5min to achieve the parallel-grain polishing of the through hole sealing surface 5, and then the parallel-grain surface is masked with tape, and the random grains on the edge are polished and trimmed.

[0058] In this embodiment, the parallel-grain polishing of the through-hole sealing surface can meet the requirements, and the parallel-grain pattern ensures the sealing of the contact surface and improves the polishing efficiency.

[0059] Example 4

[0060] This embodiment provides a polishing tool for a through hole sealing surface, which is different from Embodiment 1 in that, except that the outer diameter of the sandpaper 4 is adjusted to be equal to the outer diameter of the polishing surface of the polishing member 3 , the rest is the same as Embodiment 1.

[0061] In this embodiment, since the outer diameter of the sandpaper is the same as the outer diameter of the polishing surface, the polishing piece cannot ensure that the sandpaper is pressed down to completely fit the through-hole sealing surface during the polishing process, thereby reducing the polishing quality.

[0062] Example 5

[0063] This embodiment provides a polishing tool for a through hole sealing surface. The method of polishing the through hole sealing surface 5 using the polishing tool is different from that in Embodiment 1 in that the edge of the polishing end 2 of the cylindrical rod body 1 is not chamfered, and the rest is the same as in Embodiment 1.

[0064] In this embodiment, since the polished end edge of the cylindrical rod body is not chamfered, burrs may fall off during the operation and contaminate the product, thereby reducing the product quality.

[0065] Example 6

[0066] This embodiment provides a polishing tool for a through hole sealing surface. The method of polishing the through hole sealing surface 5 using the polishing tool is different from that in Embodiment 1 in that, except for adjusting the rotation speed to 2500 r / min, the rest is the same as that in Embodiment 1.

[0067] In this embodiment, since the rotation speed is too low, the polishing quality will be reduced.

[0068] Example 7

[0069] This embodiment provides a polishing tool for a through hole sealing surface. The method of polishing the through hole sealing surface 5 using the polishing tool is different from that in Embodiment 1 in that, except for adjusting the rotation speed to 3800 r / min, the rest is the same as that in Embodiment 1.

[0070] In this embodiment, since the rotation speed is too high, the polishing quality will also be reduced, affecting the sealing effect of the sealing surface.

[0071] Comparative Example 1

[0072] This comparative example provides a polishing tool for a through-hole sealing surface, and the polishing tool is a three-jaw fixture polishing device.

[0073] The three-jaw fixture polishing device cannot polish the through-hole sealing surface at a position other than the product center circle, and has limitations in application.

[0074] In summary, the polishing tool for the through-hole sealing surface provided by the present invention can greatly improve the polishing efficiency and ensure the roughness of the polishing lines, thereby ensuring the sealing of the contact surface. Compared with the embryo drawing machine, it can meet the requirements of the along-the-grain processing of various types of positions. In addition, under the action of the driving device, it avoids the unevenness of pure hand grinding and the unclear along-the-grain lines. It has high polishing quality and is suitable for polishing the sealing surface that is not the center of the product.

[0075] The applicant declares that the above is only a specific implementation mode of the present invention, but the protection scope of the present invention is not limited thereto. Those skilled in the art should understand that any changes or substitutions that can be easily thought of by those skilled in the art within the technical scope disclosed by the present invention shall fall within the protection scope and disclosure scope of the present invention.

Claims

1. A polishing tool for a through hole sealing surface, characterized in that: The polishing tool comprises a cylindrical rod body, a polishing piece is sleeved on one side of the polishing end close to the cylindrical rod body, the polishing surface of the polishing piece is covered with sandpaper, and the sandpaper contacts the sealing surface of the through hole during polishing; the clamping end of the cylindrical rod body is clamped and driven to rotate by a driving device.

2. The polishing tool according to claim 1, characterized in that: The cylindrical rod body and the polishing piece are made of polypropylene respectively and independently.

3. The polishing tool according to claim 1 or 2, characterized in that: The cylindrical rod and polished parts are processed by computer numerical control.

4. The polishing tool according to any one of claims 1 to 3, characterized in that: The diameter of the polished end surface of the cylindrical rod body is smaller than the diameter of the through hole.

5. The polishing tool according to any one of claims 1 to 4, characterized in that: The polishing piece is annular, and the outer diameter of the polishing surface of the polishing piece is smaller than the diameter of the through hole sealing surface.

6. The polishing tool according to any one of claims 1 to 5, characterized in that: The outer diameter of the sandpaper is smaller than the outer diameter of the polishing surface of the polishing piece; Preferably, the outer diameter of the sandpaper is larger than the outer diameter of the annular polishing area of ​​the through hole sealing surface.

7. The polishing tool according to any one of claims 1 to 6, characterized in that: The mesh number of the sandpaper is 400-800 meshes.

8. A method for polishing a through hole sealing surface, characterized in that: The polishing method is performed using the polishing tool for the through hole sealing surface according to any one of claims 1 to 7, and the polishing method comprises the following steps: Sandpaper is inserted into the polishing end of the cylindrical rod body so that the sandpaper covers the polishing surface of the polished part; then the clamping end of the cylindrical rod body is clamped by a driving device, and the polishing end of the cylindrical rod body is inserted into the through hole so that the sandpaper contacts the sealing surface of the through hole; the driving device drives the polishing end of the cylindrical rod body to rotate to achieve the parallel-grain polishing of the sealing surface of the through hole.

9. The polishing method according to claim 8, characterized in that: Before the polishing end is inserted into the sandpaper, the edge of the polishing end is chamfered; Preferably, the through hole is located at a location other than the center of the product, and the through hole includes a water channel and / or a vent.

10. The polishing method according to claim 8 or 9, characterized in that: The polishing end of the driving cylindrical rod body rotates at a speed of 3000-3500 r / min; The polishing end of the driving cylindrical rod body rotates for 5-10 minutes.

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