Long hole drilling method for machining ceramic material

Abstract

The invention relates to the technical field of ceramic material processing, and particularly discloses a long hole drilling method for processing a ceramic material, which comprises the following steps: (1) selecting proper ceramic powder; (2) adding a bonding auxiliary agent; (3) uniformly mixing the ceramic powder and the adhesive aid by using mixing equipment to form a ceramic mixture; (4) preparing an inorganic non-metal ceramic green body by adopting a powder forming method, and biscuiting to obtain a ceramic green body; (5) the green body is fixed to a machining center, a laser module emits laser to form a first drilling point at the pre-drilling position of the green body, and then drilling is conducted on one side of the first drilling point; (6) after punching on one side is completed, the blank is turned over and fixed to the machining center, then the laser module emits the laser again, another second drilling point is formed at the position on the other side of the punching position, and the two holes are parallel to each other or correspondingly penetrate through each other; and (7) drying and sintering the punched green body to finish the processing of the deep and long through hole of the green body.

Description

Technical Field

[0001] The invention relates to the technical field of processing ceramic materials, in particular to a method for drilling long holes in processing ceramic materials. Background Art

[0002] Ceramic materials have excellent properties such as high strength, high hardness, low density, low expansion coefficient, as well as wear resistance, corrosion resistance, heat insulation, and good chemical stability. They have become a new type of engineering material widely used in aerospace, petrochemical, instrumentation, machinery manufacturing, and nuclear industry.

[0003] However, ceramic materials are very difficult to process due to their high brittleness, low fracture toughness, and the elastic limit and strength of the material being very close. Any improper processing method will cause damage to the surface layer of the workpiece, making it difficult to achieve high-precision, high-efficiency, and high-reliability processing, thus limiting the further expansion of the application scope of ceramic materials.

[0004] Due to their high brittleness, high hardness and difficulty in processing, ceramic materials are prone to brittle fracture during the processing process, resulting in high manufacturing costs and reduced safety performance. In particular, it is difficult to ensure quality during the drilling process. Common problems include surface cracks and irregular hole shapes.

[0005] In terms of drilling, in addition to laser drilling, CNC machine tools with cutting tools are also a common method. However, this processing method is difficult to achieve elongated through-hole processing on ceramic materials, and it is easy to cause ceramic collapse during the processing, which is less safe. Therefore, although ceramic materials have many excellent properties, the challenges in their processing still limit their application in certain fields. Summary of the invention

[0006] The purpose of the present invention is to provide a method for drilling long holes in ceramic materials, which adopts drilling and milling to process holes in ceramic materials such as alumina and zirconia, can solve the drawbacks of the prior art, and has the characteristics of fast drilling speed, low processing difficulty, low processing cost and good processing effect.

[0007] To achieve the above object, the present invention adopts the following technical solutions:

[0008] The invention discloses a method for drilling long holes in ceramic materials, comprising: (1) selecting suitable ceramic powder; (2) adding a bonding agent; (3) using a mixing device to uniformly mix the ceramic powder and the bonding agent to form a ceramic mixture; (4) using a powder molding method to prepare an inorganic non-metallic ceramic green body, and obtaining a ceramic green body after bisque firing, wherein the green body is dried at a temperature of 60-100°C, the drying time is 12-24h, and the sintering temperature is 1300-1700°C; (5) fixing the green body on a machining center, emitting a laser through a laser module to form a first drilling point at a pre-drilling position of the green body, and then drilling a hole on one side of the first drilling point, first using a hole with a length of 160-200mm Use a hard drill tool with a length of 160-200 mm to drill the second drill point, and then switch to a hard drill tool with a tool holder of 350-400 mm in length and a cooling module to drill holes; (6) After completing the drilling on one side, flip the blank 180 degrees and fix it on the machining center, and then use the laser module to emit a laser again to form another second drill point at the drilling position on the other side. Similarly, use a hard drill tool with a length of 160-200 mm to drill the second drill point, and then switch to a hard drill tool with a tool holder of 350-400 mm in length and a cooling module to drill until the holes on both sides interpenetrate each other, so that the two holes are parallel or corresponding to each other; (7) Dry and sinter the punched blank to complete the processing of the deep and long through hole of the blank.

[0009] In some embodiments, the long and deep through hole has a length of 500-600 mm and a hole diameter of 5-10 mm.

[0010] In some embodiments, in step (4), the powder molding method is selected from isostatic pressing, slip casting and gel casting.

[0011] In some embodiments, in step (4), the prepared inorganic non-metallic ceramic green body includes inorganic non-metallic materials such as aluminum oxide, silicon dioxide, silicon nitride, zirconium oxide, and silicon carbide.

[0012] In some embodiments, in step (4), the biscuit calcining temperature is 800-1500°C.

[0013] In some embodiments, in step (5) and step (6), the machining center parameters are set as: cutting depth 20-100 mm / min, feed rate 50-200 mm / min, and drill speed 1500-8000 rpm.

[0014] In some embodiments, in step (5) and step (6) of the present invention, the hard drill tool with a shank having a cooling module includes a shank, a drill bit, an infusion tube, a cooling channel, and a channel opening, the infusion tube is arranged on one side of the shank, the cooling channel is arranged inside the drill bit, the channel opening is arranged on the top of the drill bit, and the infusion tube is connected to the cooling channel.

[0015] In some embodiments, the cooling module uses water with a cooling liquid of 2-4°C or 10-25°C.

[0016] In some embodiments, the hard drill tool includes a rod body, and the end of one end of the rod body is provided with a chip groove extending inward from the end, and the chip groove is composed of a groove bottom wall and a groove side wall, wherein the groove bottom wall is set to a plane and passes through the center line of the rod body, the groove bottom wall and the groove side wall are perpendicular to each other, and a blade groove is also provided downward at the groove bottom wall, and the blade groove is composed of a groove bottom wall and a groove side wall that are perpendicular to each other and integrally connected, the groove bottom wall of the blade groove is parallel to the groove bottom wall of the chip groove, and a composite blade is fixed in the blade groove.

[0017] In some embodiments, in step (5) and step (6), the blank is drilled, and at the same time, multiple vibration generators in an ultrasonic vibration platform generate ultrasonic waves that propagate along the drilling direction, causing the blank to vibrate ultrasonically at multiple frequencies along the drilling direction. The ultrasonic vibration frequency of the vibration generator is 40 kHz to 60 kHz, the power is 10% to 100%, and the amplitude is 10 μm.

[0018] The beneficial effects of the present invention are:

[0019] The present invention provides a method for drilling long holes in ceramic materials. Through the above method, holes are drilled in the bisque-fired green body stage, and the low hardness of the green body is utilized. Compared with directly drilling holes in finished ceramics, the safety and efficiency of the drilling process are significantly improved. This method not only optimizes the hole processing efficiency, but also successfully realizes the deep and long through-hole processing of inorganic non-metallic ceramic materials such as alumina, zirconium oxide, and silicon carbide, breaking through the limitations of traditional ceramic processing. In addition, the direct drilling and the drilling method of the present invention with small feed, small cutting depth and high speed can avoid the collapse of the outlet edge caused by uneven force, improve the hole morphology quality of the workpiece, and improve the workpiece yield rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a structural schematic diagram of Example 1;

[0021] Figure 2 It is a partial enlarged schematic diagram of the hard drill tool of Example 1;

[0022] Figure 3 This is a schematic diagram of the use status of Example 1;

[0023] Figure 4 It is a partial enlarged schematic diagram of the hard drill tool of Example 2;

[0024] Figure 5 It is a schematic diagram of the use status of Embodiment 1-3;

[0025] In the figure:

[0026] 100. Drill length device for processing ceramic materials; 10. Driving device; 1. Infusion tube; 2. Tool handle; 30. Hard drill tool; 3. Drill bit; 31. Groove bottom wall; 32. Blade groove; 33. Composite blade; 34. Chip groove; 35. Rod body; 40. Cooling module; 4. Cooling flow channel; 5. Flow channel outlet; 6. Ultrasonic vibration platform; 61. Vibration generator; 7. Laser module; A. Coolant; B. Blank. DETAILED DESCRIPTION

[0027] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0028] In the description of the present invention, it should be noted that the orientations or positional relationships indicated by the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. Among them, the terms "first position" and "second position" are two different positions, and the first feature "above", "above" and "above" the second feature include the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. The first feature "below", "below" and "below" the second feature include the first feature being directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0029] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0030] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0031] like Figures 1 to 3 As shown, this embodiment provides a method for drilling long holes in ceramic materials. The processing method of the present invention is used to process long and deep through holes on ceramic materials. The length of the long and deep through holes is 500-600 mm and the hole diameter is 5-10 mm. The steps are as follows:

[0032] (1) Selecting suitable ceramic powders; In this embodiment, the prepared inorganic non-metallic ceramic greenware includes inorganic non-metallic materials such as alumina, silicon dioxide, silicon nitride, zirconium oxide, and silicon carbide. This involves comprehensive consideration of factors such as the chemical composition, particle size distribution, purity, crystal structure, and thermal stability of the powder. For high-strength structural ceramics, it may be necessary to select high-purity, fine-grained alumina (Al2O3) or silicon carbide (SiC) powders.

[0033] (2) Adding a bonding aid: In step (2) of this embodiment, a bonding aid is added to improve the molding performance and sintering activity of the ceramic powder. It is necessary to add an appropriate amount of a bonding aid. These aids can be organic or inorganic. Their function is to form a thin film on the surface of the powder, reduce friction between the powders, increase fluidity, and thus improve molding efficiency.

[0034] (3) Using a mixing device to uniformly mix the ceramic powder and the bonding agent to form a ceramic mixture; in this embodiment, the relative viscosity of the ceramic slurry in which the ceramic powder and the bonding agent are uniformly mixed in step (3) is defined as the relative viscosity of the ceramic slurry after being stirred and then resting for 30-60 seconds, the number of stirring intervals can be 5-20 times, and the total time can be at least 10 minutes.

[0035] (4) The inorganic non-metal ceramic green body is prepared by a powder molding method, and the ceramic green body B is obtained after bisque firing. The drying temperature of green body B is 60-100°C, the drying time is 12-24h, and the sintering temperature is 1300-1700°C; in this embodiment, the powder molding method is selected from one of isostatic pressing, slip casting and gel casting, and the prepared inorganic non-metal ceramic green body includes inorganic non-metallic materials such as alumina, silicon dioxide, silicon nitride, zirconium oxide and silicon carbide; it should be further explained that the bisque firing temperature is 800-1500°C. Preferably, the alumina powder is loaded into a rubber mold and put into an isostatic press, the molding pressure is 100-120MPa, the pressure is maintained for 5-10min, and the ceramic green body is obtained, which is bisque fired at 1350°C for 2h-2.5h to obtain green body B.

[0036] (5) Fix the blank B on the machining center, and use a laser module 7 to emit a laser to form a first drilling point at the pre-drilling position of the blank B, and then drill a hole on one side of the first drilling point. First, use a hard drill tool 30 with a length of 160-200 mm to drill a hole, and then switch to a hard drill tool 30 with a tool handle 2 with a length of 350-400 mm and a cooling module 40 to drill a hole. In this embodiment, step (5) mainly uses a hard drill tool 30 with a length of 160-200 mm to drill a hole. This cemented carbide tool is suitable for the initial drilling stage due to its high hardness and strong wear resistance. It can effectively penetrate the blank B material and form a preliminary hole structure. Then switch to a hard drill tool 30 with a tool handle 2 with a length of 350-400 mm and a cooling module 40 to drill a hole. The design of this tool takes into account the heat generated during the machining process. The cooling module 40 can effectively reduce the temperature of the cutting area, reduce the heat-affected area, improve the machining quality, and extend the service life of the tool. Through this staged drilling process, the stability of the drilling process and the processing quality of the final hole can be ensured, meeting the needs of high-precision processing.

[0037] (6) After completing the drilling on one side, the blank B is turned 180 degrees and fixed on the machining center, and then a laser is emitted again through the laser module 7 to form another second drilling point at the drilling position on the other side. Similarly, a hard drill tool 30 with a length of 160-200mm is used to drill the second drilling point, and then the tool handle 2 with a length of 350-400mm and a hard drill tool 30 with a cooling module 40 are switched to drill until the holes on both sides penetrate each other, so that the two holes are parallel or corresponding to each other. In this embodiment, in steps (5) and (6), the machining center parameters are set as: cutting depth 20-100mm / min, feed rate 50-200mm / min, drill bit 3 speed 1500-8000rpm.

[0038] It is worth mentioning that the hard drill tool 30 with a tool handle 2 and a cooling module 40 includes a tool handle 2, a drill bit 3, an infusion tube 1, a cooling channel 4, and a channel opening 5. The infusion tube 1 is arranged on one side of the tool handle 2, the cooling channel 4 is arranged inside the drill bit 3, the channel opening 5 is arranged on the top of the drill bit 3, and the infusion tube 1 is connected to the cooling channel 4; the cooling module 40 uses coolant A which is water at 2-4°C or 10-25°C.

[0039] (7) Drying and sintering the punched green body B to complete the processing of the deep and long through hole of the green body B. In this embodiment, the punched green body B is dried at 65°C-70°C for 24 hours, and then sintered at 17000°C for 2 hours to complete the processing of the deep and long through hole of the ceramic material.

[0040] It should be further explained that in step (7), the punched blank B is dried and sintered to complete the processing of the deep and long through holes of the blank B. In this embodiment, the punched blank B is first placed in a temperature-controlled drying oven and dried at a temperature of 65°C to 70°C for 24 hours to ensure that the moisture in the blank B is completely evaporated to avoid cracking of the blank B due to moisture evaporation during the subsequent sintering process. After drying, the blank B is placed in a sintering furnace and sintered at a temperature of up to 1700°C for 2 hours to promote the densification of ceramic particles and grain boundary bonding, and complete the processing of the deep and long through holes of the ceramic material. This sintering process can not only improve the density and strength of the blank B, but also optimize its microstructure, ensure the dimensional accuracy and surface finish of the deep and long through holes, and meet the requirements of ceramic materials for reliability and durability in high-performance applications.

[0041] By using the above method, holes are drilled in the B stage of the bisque fired body, and the low hardness of the body is utilized. Compared with drilling directly on the finished ceramic, the safety and efficiency of the drilling process are significantly improved. This method not only optimizes the hole processing efficiency, but also successfully realizes the deep and long through-hole processing of inorganic non-metallic ceramic materials such as alumina, zirconia, and silicon carbide, breaking through the limitations of traditional ceramic processing. In addition, the direct drilling and drilling methods of the present invention with small feed, small cutting depth and high speed can avoid the collapse of the outlet caused by uneven force, improve the hole morphology quality of the workpiece, and improve the workpiece yield rate.

[0042] like Figure 2-Figure 5 As shown, in the method for drilling a long hole in a ceramic material provided in this embodiment, a long drilling device 100 for processing a ceramic material is used, comprising: a driving device 10; a hard drill tool 30, the hard drill tool 30 is connected to the driving device 10, and the hard drill tool 30 comprises a rod body 35, and an end of one end of the rod body 35 is provided with a chip removal groove 34 extending inward from the end, and the chip removal groove 34 is composed of a groove bottom wall 31 and a groove side wall, wherein the groove bottom wall 31 is set as a plane and passes through the center line of the rod body 35, the groove bottom wall 31 and the groove side wall are perpendicular to each other, and a cutter is further provided downward at the groove bottom wall 31. A blade slot 32, the blade slot 32 is composed of a blade slot bottom wall 31 and a blade slot side wall which are perpendicular to each other and connected integrally, the blade slot bottom wall 31 of the blade slot 32 is parallel to the groove bottom wall 31 of the chip groove 34, the angle between the blade slot side wall of the blade slot 32 and the axis of the round rod is 16° to 20°, a composite blade 33 is fixedly connected in the blade slot 32; a laser module 7, which is located on one side of the driving device 10 and is electrically connected to the driving device 10; an ultrasonic vibration platform 6, a blank B is provided on the ultrasonic vibration platform 6, and a plurality of vibration generators 61 in the ultrasonic vibration platform 6.

[0043] In this embodiment, the laser module 7 is configured to emit at least one laser to form a first drilling point and a second drilling point at the pre-drilling position of the blank B, and the driving device 10 is used to drive the hard drill tool 30 to drill a hole at the first drilling point or one side of the second drilling point, and the ultrasonic vibration platform 6 propagates ultrasonic waves along the drilling direction, causing the blank B to vibrate with multi-frequency ultrasonic vibrations along the drilling direction; and the first drilling point and the second drilling point can correspond to each other or be offset from each other.

[0044] In this embodiment, the ultrasonic vibration frequency of the vibration generator 61 is 40kHz to 60kHz, the power is 10% to 100%, and the amplitude is 10μm. Specifically, the ultrasonic vibration frequency of the vibration generator 61 is set between 40kHz and 60kHz. This frequency range is carefully selected based on the physical properties and processing requirements of the ceramic material to achieve the best drilling effect. Within this frequency range, the energy transmission efficiency and material removal rate of the ultrasonic wave can be optimized; wherein, the power output range of the vibration generator 61 is set at 10% to 100%. Such a design allows the operator to flexibly adjust the power output according to specific processing conditions and progress requirements to adapt to different drilling depths and difficulties. The adjustment of power not only affects the drilling speed, but also affects the wear degree of the tool and the energy consumption efficiency. As for the amplitude, the vibration generator 61 is set to have an amplitude of 10 microns (μm). This amplitude value is determined based on a deep understanding of the processing characteristics of ceramic materials, which can ensure that sufficient energy is generated during the drilling process to break and remove materials while avoiding excessive thermal damage or mechanical stress to the workpiece.

[0045] Specifically, the laser module 7 is configured to emit at least one laser to form a first drilling point and a second drilling point at the pre-drilling position of the blank B. This technology utilizes the high energy density characteristics of the laser to achieve precise drilling on the ceramic material by precisely controlling the focal position of the laser beam. The drive device 10 is used to drive the hard drill tool 30 to drill a hole on one side of the first drilling point. The device can provide a stable feed rate and precise positioning to ensure that the drill bit 3 accurately penetrates the material along a predetermined trajectory. At the same time, the ultrasonic vibration platform 6 propagates ultrasonic waves in the drilling direction, causing the blank B to vibrate ultrasonically at multiple frequencies in the drilling direction. This ultrasonic vibration-assisted technology can significantly improve the material removal rate, improve the surface quality of the hole wall, and reduce the internal stress during the processing. Through this composite processing method, the drilling efficiency can be effectively improved, tool wear can be reduced, and better processing accuracy and surface integrity can be obtained, which is crucial for the manufacture of precision ceramic components.

[0046] It should be further explained that the drilling device 100 for processing ceramic materials includes a cooling module 40, the hard drill tool 30 has a cooling module 40, the hard drill tool 30 includes a shank 2, a drill bit 3, a cooling channel 4, and a channel opening 5. The infusion tube 1 of the cooling module 40 is arranged on one side of the shank 2, the cooling channel 4 is arranged inside the drill bit 3, the channel opening 5 is arranged on the top of the drill bit 3, and the infusion tube 1 is connected to the cooling channel 4.

[0047] Figure 4 The chip groove 34 in the hard drill tool 30 is a spiral chip groove, and the design of the spiral chip groove helps to effectively discharge the chips from the cutting area during the drilling process. Due to the continuity and guidance of the spiral groove, the chips can be discharged smoothly along the spiral path of the groove, thereby reducing the accumulation of chips in the hole and avoiding friction and blockage between the chips and the tool or the hole wall.

[0048] Embodiment 2 of the present invention uses the processing method of the present invention to process a deep and long through hole on a ceramic material (silicon nitride), with a hole length of 500 mm and a hole diameter of 10 mm, and the steps are as follows:

[0049] (1) Putting silicon nitride powder into a rubber mold and putting it into an isostatic press, with a molding pressure of 110 MPa and holding the pressure for 10 min to obtain a zirconia ceramic green body, and sintering it at a temperature of 1200° C. for 2 h to 2.5 h to obtain a body B;

[0050] (2) Fix the blank B on the machining center, and drill a hole on one side of the punching position of the blank B, setting the cutting depth to 0.25mm-0.5mm, the feed rate to 50mm / min, and the rotation speed of the drill bit 3 to 3500rpm; first use a hard drill tool 30 with a length of 150mm to drill a hole, and then switch to a hard drill tool 30 with a shank 2 with a length of 300mm and a cooling device to drill a hole on one side of the first drilling point, wherein the hard drill tool 30 with a shank 2 and a cooling module 40 includes a shank 2, a drill bit 3, an infusion tube 1, a cooling channel 4, and a channel opening 5, the infusion tube 1 is arranged on one side of the shank 2, the cooling channel 4 is arranged inside the drill bit 3, the channel opening 5 is arranged on the top of the drill bit 3, and the infusion tube 1 is connected to the cooling channel 4; the cooling module 40 uses coolant A of 2-4℃ or 10-25℃ water, and the flow rate is 2m3 / h.

[0051] In this embodiment, the cooling liquid A of the cooling module 40 mentioned in step (2) is water at 2-4°C or 10-25°C, with a flow rate of 2m 3 / h, the selection of this temperature range and flow rate is designed to ensure the cooling effect while avoiding the degradation of tool material performance due to too low temperature. Through this precise temperature control and flow rate control, we can effectively control the heat generated during the processing, ensure the stability of the processing process and the processing quality of the final product. This not only improves the processing efficiency, but also ensures the processing accuracy and surface finish of the deep and long through holes of ceramic materials, meeting the manufacturing requirements of high-performance ceramic materials.

[0052] (3) After completing the drilling on one side, turn the blank B over and fix it on the machining center, and drill the other side at the drilling position, setting the cutting depth to 0.3mm, the feed rate to 50mm / min, and the drill bit 3 speed to 3000rpm; similarly, first use a hard drill tool 30 with a length of 150mm to drill a hole, then switch to a hard drill tool 30 with a shank 2 with a cooling device with a length of 300mm to drill a hole on one side of the second drilling point, and then switch to a hard drill tool 30 with a shank 2 with a cooling module 40 with a length of 350-400mm to drill until the holes on both sides interpenetrate each other, so that the two holes are parallel or corresponding to each other.

[0053] It should be further explained that the blank B is turned over and fixed on the machining center to ensure that the contact surface between the blank B and the machining table is flat and stable, so as to facilitate the accuracy of the subsequent machining process. When drilling holes on the other side of the drilling position, the operation must be strictly carried out in accordance with the machining parameters, and the cutting depth is set to 0.3mm to ensure that the depth of each cutting is moderate to avoid tool damage or cracking of the blank B due to excessive cutting. The feed rate is set to 50mm / min. This speed can not only ensure the machining efficiency, but also reduce the cutting heat generated by too fast feeding, thereby reducing the risk of cracks in the blank B due to thermal stress. The speed of the drill bit 3 is set to 3000rpm. This speed is conducive to improving the cutting efficiency while maintaining the stability of the tool. In the drilling process, a carbide drill tool with a length of 150mm is first used for preliminary drilling. This tool is suitable for the processing of hard materials due to its high hardness and good wear resistance. After completing the initial drilling, it is necessary to switch to the tool handle 2 with a length of 300 mm. The tool handle 2 is specially designed with a cooling device, which can effectively reduce the temperature of the cutting area, reduce the heat-affected area, and improve the processing quality. Using this hard drill tool 30 with a cooling device to drill one side of the second drilling point can ensure the accuracy and surface finish of the hole, while extending the service life of the tool. During the entire processing process, the wear of the tool and the temperature change of the blank B should be continuously monitored to ensure the stability of the processing process and the processing quality of the product.

[0054] (4) The punched body B is dried at 100° C.-120° C. for 10 h-12 h, and then sintered at 1500° C. for 2 h, thereby completing the processing of the deep and long through holes in the silicon nitride ceramic material.

[0055] The elongated through hole processed by the above method has high roundness and good smoothness. The average processing time of a single through hole is about 5 hours, and the through hole processing qualification rate reaches 100%.

[0056] It is worth mentioning that the sintering temperature range in the above-mentioned method of drilling long holes in ceramic materials is generally in the range of 800°C to 1400°C. The specific temperature depends on the type and composition of the ceramic material. For alumina ceramic materials, the sintering temperature is about 1300°C to 1600°C; for silicate ceramic materials, the sintering temperature is about 1300°C to 1600°C.

[0057] Sintering temperature: about 900℃ to 1300℃; silicon nitride ceramics: sintering temperature: about 1600℃ to 1800℃; zirconium ceramics: sintering temperature: about 1200℃ to 1600℃.

[0058] In the above-mentioned embodiment, if an alumina ceramic material is used: Alumina (Al2O3) is a ceramic material with high hardness and wear resistance, so the sintering temperature is relatively high. The present invention can set the temperature between 1300°C and 1600°C. This is because the lattice energy of alumina is relatively high, and higher energy is required to promote the bonding between particles. If silicon nitride ceramics are used: Silicon nitride (Si3N4) is a high-temperature structural ceramic material, which is well-known for its excellent high-temperature strength and thermal shock resistance. Its sintering temperature is relatively high. The present invention can set the temperature between 1600°C and 1800°C. This is because the lattice energy of silicon nitride is high and effective grain growth and sintering can only be achieved at high temperatures. Therefore, the sintering temperature set in step (4) of the present invention can cover the ceramic materials listed above.

[0059] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the embodiments here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A method for drilling long holes in ceramic materials, characterized in that: The following steps are involved: (1) Select appropriate ceramic powder; (2) Adding bonding aids; (3) using a mixing device to uniformly mix the ceramic powder and the bonding aid to form a ceramic mixture; (4) preparing an inorganic non-metallic ceramic green body by a powder molding method, and obtaining a ceramic green body after biscuit firing, wherein the green body is dried at a temperature of 60-100° C., the drying time is 12-24 h, and the sintering temperature is 1300-1700° C.; (5) Fixing the blank on a machining center, emitting a laser through a laser module to form a first drilling point at a pre-drilling position of the blank, and then drilling a hole on one side of the first drilling point, first using a hard drill tool with a length of 160-200 mm to drill the hole, and then switching to a hard drill tool with a handle of 350-400 mm and a cooling module to drill the hole; (6) After completing the drilling on one side, the blank is turned 180 degrees and fixed on the machining center, and then a laser is emitted by the laser module again to form another second drilling point at the drilling position on the other side. Similarly, a hard drill tool with a length of 160-200 mm is used to drill the second drilling point, and then a hard drill tool with a tool handle of 350-400 mm and a cooling module is switched to drill until the holes on both sides interpenetrate each other, so that the two holes are parallel or corresponding to each other; (7) Drying and sintering the punched green body to complete the processing of the deep and long through holes in the green body.

2. The method for drilling long holes in ceramic materials according to claim 1, characterized in that: The length of the deep through hole is 500-600 mm and the hole diameter is 5-10 mm.

3. The method for drilling long holes in ceramic materials according to claim 1, characterized in that: In step (4), the powder molding method is selected from one of isostatic pressing, slip casting and gel casting.

4. The method for drilling a long hole in a ceramic material according to claim 1, characterized in that: In step (4), the prepared inorganic non-metallic ceramic green body includes inorganic non-metallic materials such as alumina, silicon dioxide, silicon nitride, zirconium oxide and silicon carbide.

5. The method for drilling long holes in ceramic materials according to claim 1, characterized in that: In step (4), the biscuit firing temperature is 800-1500°C.

6. The method for drilling a long hole in a ceramic material according to claim 1, characterized in that: In step (5) and step (6), the machining center parameters are set as: cutting depth 20-100 mm / min, feed rate 50-200 mm / min, and drill speed 1500-8000 rpm.

7. The method for drilling a long hole in a ceramic material according to claim 1, characterized in that: In step (5) and step (6) of the present invention, the hard drill tool with a tool handle having the cooling module includes a tool handle, a drill bit, an infusion tube, a cooling channel, and a channel opening, wherein the infusion tube is arranged on one side of the tool handle, the cooling channel is arranged inside the drill bit, the channel opening is arranged on the top of the drill bit, and the infusion tube is connected to the cooling channel.

8. The method for drilling long holes in ceramic materials according to claim 7, characterized in that: The cooling module uses water with a temperature of 2-4°C or 10-25°C as the cooling liquid.

9. The method for drilling a long hole in a ceramic material according to any one of claims 1 to 7, characterized in that: The hard drill tool includes a rod body, and the end of one end of the rod body is provided with a chip groove extending inward from the end head, and the chip groove is composed of a groove bottom wall and a groove side wall, wherein the groove bottom wall is set as a plane and passes through the center line of the rod body, the groove bottom wall and the groove side wall are perpendicular to each other, and a blade groove is also provided downward at the groove bottom wall, and the blade groove is composed of a groove bottom wall and a groove side wall that are perpendicular to each other and connected as a whole, the groove bottom wall of the blade groove is parallel to the groove bottom wall of the chip groove, and a composite blade is fixed in the blade groove.

10. The method for drilling a long hole in a ceramic material according to claim 1, characterized in that: In step (5) and step (6), the blank is drilled, and at the same time, multiple vibration generators in an ultrasonic vibration platform generate ultrasonic waves that propagate along the drilling direction, so that the blank vibrates at multiple frequencies ultrasonically along the drilling direction. The ultrasonic vibration frequency of the vibration generator is 40kHz to 60kHz, the power is 10% to 100%, and the amplitude is 10μm.

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