Glue injection method and glue injection mold

Abstract

The invention discloses a glue injection method and a glue injection mold, comprising: obtaining a start signal and preset glue injection parameters, establishing a heating model of the glue injection mold; starting a heating device to heat the glue injection mold, and starting the glue injection device to inject potting resin into a cavity of the glue injection mold; obtaining the temperature in the glue injection mold in real time; in a first heating stage, the heating device continuously heats the glue injection mold; in a second heating stage, the heating device intermittently heats the glue injection mold; when a control module detects that a glue injection end condition is met, the heating device and the glue injection device stop working; through the first heating stage, the temperature of the glue injection mold is quickly increased to the working temperature, thereby improving the working efficiency of the glue injection mold; through the second heating stage, the glue injection mold is intermittently maintained at the working temperature, and the potting resin in the glue injection mold will be cured according to a preset sequence, thereby ensuring that the phenomenon of product failure caused by lack of material, flow marks, etc. is avoided, and a better glue injection packaging effect is ensured.

Description

Technical Field

[0001] The invention relates to the technical field of glue injection, and in particular to a glue injection method and a glue injection mold. Background Art

[0002] As a new type of ground transportation in the 21st century, medium and low-speed maglev trains have the advantages of high speed, flexible route selection, strong climbing ability, safe and comfortable riding, etc. However, there are still some challenges and defects in the development of packaging technology for suspension electromagnets. During the packaging process of suspension electromagnets, the performance of the electromagnets may be unstable or fail due to fluctuations in packaging materials, process parameters and other factors. Therefore, optimizing packaging materials and process parameters and improving packaging quality and stability have become effective methods to improve the reliability of electromagnets.

[0003] Based on the above situation, the present invention proposes a glue injection method and a glue injection mold, which can effectively solve one or more of the above problems. Summary of the invention

[0004] The purpose of the present invention is to provide a glue injection method and a glue injection mold.

[0005] The present invention is achieved through the following technical solution: a glue injection method, comprising:

[0006] Obtain the start signal and preset injection parameters, and establish a heating model for the injection mold;

[0007] Starting the heating device to heat the mold body according to the heating model of the mold body, and starting the glue injection device to inject the potting resin into the cavity of the mold body;

[0008] Obtain the temperature inside the mold body in real time, recorded as T;

[0009] In the first heating stage, the heating device continuously heats the mold body. When it is detected that the temperature T inside the mold body is equal to the first temperature threshold T1, the heating device stops working;

[0010] In the second heating stage, the heating device intermittently heats the mold body;

[0011] When the control module detects that the glue injection end conditions are met, the heating device and the glue injection device stop working.

[0012] Preferably, in the second heating stage, the heating device is started at intervals of t1 to heat the mold body, and the heating device stops working after working for t2 time; t1 and t2 constitute a first heating cycle, and several first heating cycles are continuously cycled until the total cycle time meets the second heating time.

[0013] Preferably, in the second heating stage, the process includes:

[0014] Record the initial temperature when entering the second heating stage as Ta;

[0015] When it is detected that the temperature T in the mold body is less than the second temperature threshold T2, the heating device is started, and the current temperature in the mold body is recorded as Tb and the duration after entering the second heating stage is recorded as a;

[0016] When it is detected that the temperature T inside the mold body is greater than or equal to the second temperature threshold value T2, the heating device stops working, and records the current temperature inside the mold body as Tc and the duration of the heating device working as b;

[0017] When it is detected that the temperature inside the mold body is again lower than the second temperature threshold value T2, the heating device starts to work, and records the current temperature inside the mold body as Td and the time c when the heating device stops working;

[0018] b and c constitute a second heating cycle, and several second heating cycles are continuously cycled until the running time of the second heating stage meets the second heating time.

[0019] Preferably, when the control module detects that the glue injection end condition is met, it includes:

[0020] When the infrared sensor installed at the air outlet of the mold body detects that the potting resin fills the cavity to the air outlet, the control module controls the glue injection device to stop working.

[0021] Preferably, when the control module detects that the glue injection end condition is met, it includes:

[0022] When the pressure detection device connected to the liquid outlet of the glue injection device detects that the liquid pressure increases to n times, the control module controls the glue injection device to stop working.

[0023] Preferably, after the glue injection device stops working, the heating device continues to heat the mold body and maintains the temperature of the mold body at the third temperature threshold T3.

[0024] Preferably, in establishing the heating model of the mold body, it includes:

[0025] The mold body is divided into x zones along the length direction, and each zone includes a temperature sensor and a heating device;

[0026] Along the direction from the liquid inlet to the gas outlet on the mold body, x zones are defined as Q1~Qx respectively;

[0027] A first temperature threshold T1 and a second temperature threshold T2 of the Q1 to Qx region are defined, and the first temperature threshold T1 and the second temperature threshold T2 are increasing or decreasing in the sequence from the Q1 to the Qx region.

[0028] A glue injection mold is also provided, comprising:

[0029] A control module is used to obtain a start signal and preset injection parameters and establish a heating model for the injection mold;

[0030] A heating device, used to start the heating device to heat the injection mold according to the heating model of the injection mold; the heating device includes a heating structure;

[0031] A glue injection device, used for injecting potting resin into the cavity of the glue injection mold;

[0032] Monitoring module, used to obtain the temperature inside the injection mold;

[0033] The heating device, the glue injection device and the monitoring module are all connected to the control module via electrical signals, and the control module can control the operation of the heating device, the glue injection device and the monitoring module.

[0034] Preferably, it further comprises a mold body, wherein the mold body comprises a box body and a cover plate, and the cover plate is arranged above the box body;

[0035] A cavity for accommodating the inner core is opened downward on the top surface of the box body; an injection connector and an exhaust connector are connected to the side of the box body, and one end of each of the injection connector and the exhaust connector can be connected to the cavity, the other end of the injection connector is connected to the glue injection device, and the other end of the exhaust connector is connected to the vacuum generating device;

[0036] A plurality of connecting plates are arranged on the outer side of the box body, and the connecting plates are respectively attached to one side of the box body. At least some of the connecting plates are provided with a plurality of installation cavities, and the installation cavities can be used to install the heating structure.

[0037] Compared with the prior art, the present invention has the following advantages and beneficial effects:

[0038] The glue injection method and the glue injection mold of the present invention quickly increase the temperature of the glue injection mold to the working temperature through the first heating stage, thereby improving the working efficiency of the glue injection mold; and intermittently maintain the glue injection mold at the working temperature through the second heating stage, thereby ensuring that the glue injection liquid in the glue injection mold will be cured according to a preset sequence, thereby ensuring that the occurrence of product failures caused by material shortages, flow marks, etc., is avoided, and ensuring a better glue injection packaging effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 The figure is a schematic flow chart of the glue injection method of the present invention.

[0040] Figure 2 It is a structural schematic diagram of the glue injection mold of the present invention;

[0041] Figure 3 It is a schematic diagram of the cross-sectional structure of the glue injection mold of the present invention;

[0042] Figure 4 It is a schematic diagram of the cross-sectional structure of the glue injection mold with an inner core according to the present invention;

[0043] Figure 5 This is a schematic diagram of the exploded structure of the glue injection mold of the present invention;

[0044] Figure 6 This is a schematic structural diagram of one embodiment of the glue injection mold described in the present invention. DETAILED DESCRIPTION

[0045] In order to enable those skilled in the art to better understand the technical solution of the present invention, the preferred implementation scheme of the present invention is described below in conjunction with specific embodiments. However, it should be understood that the drawings are only used for exemplary description and cannot be understood as a limitation on this patent. In order to better illustrate this embodiment, some parts of the drawings may be omitted, enlarged or reduced, and do not represent the size of the actual product. For those skilled in the art, it is understandable that some well-known structures and their descriptions in the drawings may be omitted. The positional relationship described in the drawings is only for exemplary description and cannot be understood as a limitation on this patent.

[0046] Embodiment 1:

[0047] like Figure 1 As shown, the present invention provides a glue injection method, comprising:

[0048] Obtain the start signal and preset injection parameters, and establish a heating model for the mold body;

[0049] Starting the heating device to heat the mold body according to the heating model of the mold body, and starting the glue injection device to inject the potting resin into the cavity of the mold body;

[0050] Obtain the temperature inside the mold body in real time, recorded as T;

[0051] In the first heating stage, the heating device continuously heats the mold body. When it is detected that the temperature T inside the mold body is equal to the first temperature threshold T1, the heating device stops working. The first temperature threshold T1 is a point value in this embodiment. In other embodiments, the first temperature threshold T1 can be a range value. At this time, the heating device stops working only when it is detected that the temperature T inside the mold body is less than the minimum value of the first temperature threshold T1.

[0052] In the second heating stage, the heating device intermittently heats the mold body;

[0053] When the control module detects that the glue injection end conditions are met, the heating device and the glue injection device stop working.

[0054] The present application uses the first heating stage to quickly increase the temperature of the mold body to the working temperature, thereby improving the working efficiency of the mold body; and uses the second heating stage to intermittently maintain the mold body at the working temperature to ensure that the potting resin in the mold body is cured in a preset order, thereby avoiding the occurrence of product failures caused by material shortages, flow marks, etc., and ensuring a better injection packaging effect.

[0055] Embodiment 2:

[0056] The present invention provides a glue injection method, comprising:

[0057] Obtain the start signal and preset injection parameters, and establish a heating model for the mold body;

[0058] Starting the heating device to heat the mold body according to the heating model of the mold body, and starting the glue injection device to inject the potting resin into the cavity of the mold body;

[0059] Obtain the temperature inside the mold body in real time, recorded as T;

[0060] In the first heating stage, the heating device continuously heats the mold body. When it is detected that the temperature T inside the mold body is equal to the first temperature threshold T1, the heating device stops working. The first temperature threshold T1 is a point value in this embodiment. In other embodiments, the first temperature threshold T1 can be a range value. At this time, the heating device stops working only when it is detected that the temperature T inside the mold body is less than the minimum value of the first temperature threshold T1.

[0061] In the second heating stage, the heating device intermittently heats the mold body;

[0062] When the control module detects that the glue injection end conditions are met, the heating device and the glue injection device stop working.

[0063] The present application uses the first heating stage to quickly increase the temperature of the mold body to the working temperature, thereby improving the working efficiency of the mold body; and uses the second heating stage to intermittently maintain the mold body at the working temperature to ensure that the potting resin in the mold body is cured in a preset order, thereby avoiding the occurrence of product failures caused by material shortages, flow marks, etc., and ensuring a better packaging effect.

[0064] Furthermore, in establishing the heating model of the mold body, it includes:

[0065] The mold body is divided into x zones along the length direction, and each zone includes a temperature sensor and a heating device;

[0066] Along the direction from the liquid inlet to the gas outlet on the mold body, x zones are defined as Q1~Qx respectively;

[0067] A first temperature threshold T1 and a second temperature threshold T2 of the Q1-Qx region are defined, and the first temperature threshold T1 and the second temperature threshold T2 are increasing or decreasing in the order from the Q1 to the Qx region. While maintaining the increasing or decreasing trend in the order from the Q1 to the Qx region, the temperature in the Q1 to the Qx region also needs to be maintained between the first temperature threshold T1 and the second temperature threshold T2.

[0068] The mold body is divided into zones, and different working temperatures are set for different zones. A temperature gradient is established on the mold body. The curing sequence of the potting resin in the cavity is guided by the temperature gradient to ensure a better packaging effect.

[0069] A temperature sensor and a heating device are provided in each area, and each area implements independent temperature control, which can better clarify the temperature gradient on the mold body. For example, if the temperature sensor on the Q1 area detects that the temperature of the Q1 area is lower than the second temperature threshold T2, the heating device responsible for the Q1 area is started to heat the Q1 area; at this time, if the temperature sensor on the Q2 area detects that the temperature of the Q2 area is at the second temperature threshold T2, the heating device responsible for the Q2 area maintains its original working state.

[0070] Furthermore, in the second heating stage, the heating device is started at intervals of t1 to heat the mold body, and the heating device stops working after working for t2 time; t1 and t2 constitute a first heating cycle, and several first heating cycles are continuously cycled until the total cycle time meets the second heating time.

[0071] The heating device is controlled in the second heating stage according to the set time t1 and t2, so as to better maintain the temperature of the mold body within the working temperature range; however, when the above method is used, the temperature change of the mold body is easily affected by the environment. When the external ambient temperature is high, the temperature of the mold body will be high, and the packaging surface will be prone to material shortage or flow marks; when the external ambient temperature is low, the temperature of the mold body will be low, and the packaging surface will be prone to flow marks or material shortage.

[0072] In another embodiment, in the second heating stage, comprising:

[0073] Record the initial temperature when entering the second heating stage as Ta;

[0074] When it is detected that the temperature T in the mold body is less than the second temperature threshold T2, the heating device is started, and the current temperature in the mold body is recorded as Tb and the duration after entering the second heating stage is recorded as a;

[0075] When it is detected that the temperature T inside the mold body is greater than or equal to the second temperature threshold value T2, the heating device stops working, and records the current temperature inside the mold body as Tc and the duration of the heating device working as b;

[0076] When it is detected that the temperature inside the mold body is again lower than the second temperature threshold value T2, the heating device starts to work, and records the current temperature inside the mold body as Td and the time c when the heating device stops working;

[0077] b and c constitute a second heating cycle, and several second heating cycles are continuously cycled until the running time of the second heating stage meets the second heating time.

[0078] Among them, the second temperature threshold T2 is a point value in this embodiment, and in other embodiments, the second temperature threshold T2 can be a range value. In this case, the heating device starts working only when it is detected that the temperature T inside the mold body is less than the minimum value of the second temperature threshold T2; or the heating device stops working only when it is detected that the temperature T inside the mold body is greater than the maximum value of the second temperature threshold T2.

[0079] By detecting the temperature change of the mold body, the heating device is controlled in the second heating stage to better maintain the temperature of the mold body within the working range, ensuring that the potting resin in the mold body will be cured according to the preset order; and the temperature of the mold body is maintained by the above method without being affected by external environmental factors, and the temperature control has higher accuracy, and the packaging surface will not have flow marks, material shortages and other phenomena.

[0080] In other embodiments, starting from the second heating cycle, the heating device can be directly controlled according to the times b and c, without constantly comparing the temperature T of the mold body with the second temperature threshold T2, thereby optimizing the control program and reducing the burden on the control module.

[0081] In this embodiment, the glue injection end condition is satisfied when at least one of the following points is met:

[0082] First point: When the infrared sensor installed at the air outlet of the mold body detects that the potting resin fills the cavity to the air outlet, the control module controls the glue injection device to stop working.

[0083] When the first point is met, it can be directly concluded that the cavity has been filled with the potting resin, and the injection device can be stopped to continue injecting the resin into the cavity.

[0084] Second point: when the pressure detection device connected to the liquid outlet of the glue injection device detects that the liquid pressure increases to n times, the control module controls the glue injection device to stop working.

[0085] When the second point is met, it is indirectly concluded through the increase in liquid pressure that the potting resin has filled the cavity, and the injection device can be stopped to continue injecting glue into the cavity.

[0086] The third point: the flow meter connected to the liquid outlet of the injection device detects that the potting resin input into the cavity has met the preset value in the preset injection parameter, and the control module controls the injection device to stop working.

[0087] When the first point is met, it can be directly concluded from the injection flow rate that the potting resin has filled the cavity, and the injection device can be stopped to continue injecting glue into the cavity.

[0088] If only the first point is used as the condition to satisfy the end of injection, there may be bubbles in the potting resin in the cavity that is not completely filled, and then there will be material shortages on the packaging surface, resulting in poor packaging effect.

[0089] If only the second point is used as the condition to meet the end of injection, it can be guaranteed that the places where the potting resin can flow must be filled with potting resin, and there is no possibility of blockage during the resin packaging process. This will cause the cavity to not be filled with potting resin, and then there will be material shortages on the packaging surface, resulting in poor packaging effect.

[0090] If only the third point is used as the condition for ending injection, then if the sealing of the mold body is not good, the potting resin will flow out of the cavity of the mold body, and a certain amount of potting resin will not be able to fill the cavity, resulting in material shortage on the packaging surface, resulting in poor packaging effect.

[0091] If the first point, the second point and the third point are simultaneously used as conditions for satisfying the end of glue injection, the progress of glue injection can be more perfectly controlled to ensure a better packaging effect.

[0092] Furthermore, after the glue injection device stops working, the heating device continues to heat the mold body and maintains the temperature of the mold body at the third temperature threshold T3.

[0093] The mold body is continuously heated to maintain the mold body at the working temperature to ensure that the potting resin in the cavity can be completely cured to ensure a better packaging effect.

[0094] Embodiment 3:

[0095] like Figures 2 to 5 As shown, the present invention also provides a glue injection mold, including: a control module, a heating device, a glue injection device, a monitoring module and a mold body.

[0096] A control module is used to obtain a start signal and preset injection parameters and establish a heating model for the injection mold;

[0097] The heating device is used to start the heating device to heat the injection mold according to the heating model of the injection mold; the heating device includes a heating structure 6; the heating device may also include a temperature control module for controlling the heating temperature of the heating structure 6 and a heat dissipation structure for accelerating heat conduction, etc.

[0098] A glue injection device, used for injecting potting resin into the cavity of the glue injection mold;

[0099] Monitoring module, used to obtain the temperature inside the injection mold;

[0100] The heating device, the glue injection device and the monitoring module are all connected to the control module via electrical signals, and the control module can control the operation of the heating device, the glue injection device and the monitoring module.

[0101] The mold body comprises a box body 1 and a cover plate 2, wherein the cover plate 2 is arranged on top of the box body 1;

[0102] A cavity 11 for accommodating the inner core is provided downwardly on the top surface of the box body 1; an injection connector 3 and an exhaust connector 4 are connected to the side surface of the box body 1, and one end of the injection connector 3 and the exhaust connector 4 can be connected to the cavity 11, the other end of the injection connector 3 is connected to the glue injection device, and the other end of the exhaust connector 4 is connected to the vacuum generating device;

[0103] The injection connector 3 is connected to the liquid inlet of the mold body, and the exhaust connector 4 is connected to the air outlet of the mold body.

[0104] The glue injection device is used to inject glue injection packaging material into the cavity 11. In this embodiment, the glue injection packaging material is epoxy resin. In other embodiments, the glue injection packaging material can also be other resin materials or modified resin materials.

[0105] The vacuum generating device is used to extract the air in the cavity 11, making the cavity 11 in a near-vacuum state, so that the glue injection packaging material can fill the gap between the cavity 11 and the inner core, ensuring a better glue injection packaging effect; in this embodiment, the vacuum generating device can be a vacuum pump, and in other embodiments, the vacuum generating device can also be a vacuum pump, etc.

[0106] Among them, the injection connection piece 3 needs to be set on the side of the box body 1 near the bottom, and the exhaust connection piece 4 needs to be set on the side of the box body 1 near the top; the injection connection piece 3 and the exhaust connection piece 4 can be set on the same side or on different sides; in this embodiment, the injection connection piece 3 is set on the left side of the box body 1 near the bottom, and the exhaust connection piece 4 is set on the right side of the box body 1 near the top.

[0107] A plurality of connecting plates are disposed on the outer side of the box body 1 , and the connecting plates are respectively attached to one side of the box body 1 . At least some of the connecting plates are provided with a plurality of mounting cavities 5 , and the mounting cavities 5 can be used to mount the heating structure 6 .

[0108] By installing the heating structure on the connecting plate attached to the box body 1, it is ensured that heat can be transferred to the cavity 11 in time, the curing effect of the injection packaging material in the cavity 11 is optimized, the curing speed of the injection packaging material is increased, the product is efficiently injection packaged, and a good yield rate is guaranteed.

[0109] And through a plurality of installation cavities 5, a certain distance is maintained between any two adjacent heating structures 6, so as to reduce the mutual influence and better ensure that the first temperature threshold T1 and the second temperature threshold T2 are increasing or decreasing in the order from Q1 to Qx area; in this embodiment, each area includes at least one heating structure 6, and each heating structure is only used to control the temperature change of the area where it is located.

[0110] When it is detected that the temperature T in the Q1 region is less than the second temperature threshold T2, all heating structures 6 in the Q1 region are started to heat the Q1 region so that the temperature in the Q1 region meets the working requirements.

[0111] When it is detected that the temperature T in the Q1 region is greater than or equal to the second temperature threshold T2, all heating structures 6 in the Q1 region stop working to prevent the temperature in the Q1 region from being too high and affecting the normal progress of the injection packaging process.

[0112] Furthermore, the monitoring module includes a plurality of temperature sensors, which are distributed at different positions on the box body 1 and are used to monitor the temperatures at different positions on the box body 1 , so as to facilitate the control module to control the heating structure 6 .

[0113] At least one temperature sensor is provided in any area of ​​the Q1 to Qx areas, and each temperature sensor is used to monitor the temperature change of the area where it is located.

[0114] When the temperature sensor in the Q1 region detects that the temperature T in the Q1 region is less than the second temperature threshold T2, the heating device is started.

[0115] When the temperature sensor in the Q1 region detects that the temperature T in the Q1 region is greater than or equal to the second temperature threshold T2, the heating device stops working.

[0116] Furthermore, at least part of the installation cavity 5 is used to install the heating structure 6; in the present embodiment, a heating structure 6 is provided in each installation cavity 5. In the present embodiment, the installation cavity 5 located at the junction of two adjacent areas is not installed with the heating structure 6, which can enhance the temperature difference between the two adjacent areas, avoid the linear distribution of temperature on the mold body, better realize the temperature gradient, ensure better control of the curing sequence, and achieve a better injection packaging effect. In order to enhance the temperature difference between the two adjacent areas, a temperature control structure can also be installed in the installation cavity 5 at the junction of the two adjacent areas. The temperature control structure can control the temperature to maintain within the gradient temperature by heat dissipation, better realize the temperature gradient, and ensure a better injection packaging effect.

[0117] In this embodiment, the heating structure is a PTC heating element. In other embodiments, the heating structure may also be other structures that can generate heat.

[0118] All heating structures 6 are connected to the control module, and the temperature of the heating structure 6 is set by the heating model generated by the control module, so that an increasing or decreasing temperature gradient is formed on the box body 1 along the sequence of areas Q1 to Qx, which is convenient for controlling the curing sequence of the injection packaging material in the cavity 11, avoiding the occurrence of unqualified products due to material shortages, flow marks, etc., and ensuring a better injection packaging effect.

[0119] Furthermore, it also includes a lifting mechanism 9, which is arranged below the box body 1; the lifting mechanism 9 includes a lifting rod 91, and a section of the lifting rod 91 extends into the mold cavity 11.

[0120] The lifting mechanism 9 is used to lift the product after the injection and packaging is completed, so as to facilitate demoulding of the product.

[0121] Furthermore, the cover plate 2 includes a main body 21 , a first positioning plate 22 and a second positioning plate 23 , and the first positioning plate 22 and the second positioning plate 23 constitute a positioning hole 24 for positioning the inner core.

[0122] The positioning hole 24 formed by the cooperation of the first positioning plate 22 and the second positioning plate 23 limits the position of the inner core in the cavity 11, and does not require manual adjustment, thereby ensuring a better glue injection packaging effect and improving the efficiency of the glue injection packaging.

[0123] In another embodiment, at least five connecting plates are provided on the outer side of the box body 1, which are respectively a first mounting plate 71 arranged above the box body 1, a second mounting plate 72 arranged in front of the box body 1, a third mounting plate 73 arranged behind the box body 1, a fourth mounting plate 74 arranged on the left side of the box body 1 and a fifth mounting plate 75 arranged on the right side of the box body 1; a plurality of mounting cavities 5 are opened on the first mounting plate 71, the second mounting plate 72, the third mounting plate 73, the fourth mounting plate 74 and the fifth mounting plate 75.

[0124] The top, front, back, left and right sides of the box body 1 are heated by the first mounting plate 71, the second mounting plate 72, the third mounting plate 73, the fourth mounting plate 74 and the fifth mounting plate 75 to ensure that heat can be transferred to the cavity 11 from five directions in time, optimize the curing effect of the injection packaging material in the cavity 11, increase the curing speed of the injection packaging material, efficiently inject and package the product, and ensure a good yield rate.

[0125] like Figure 6 As shown, in yet another embodiment, a sixth mounting plate 76 is provided below the box body 1 .

[0126] Furthermore, a plurality of installation cavities 5 are provided on the sixth installation plate 76. One of two adjacent installation cavities 5 is used to install the heating structure 6, and the other is used to install the first heat insulation structure 8.

[0127] The bottom and left and right sides of the box body 1 can also be heated to ensure that the glue injection packaging material at the bottom of the cavity 11 is solidified first, ensuring that the bottom of the product has a better glue injection packaging effect.

[0128] A lifting structure 9 needs to be installed at the bottom of the box 1, so a heating structure is generally not set at the bottom of the box 1, but during the glue injection and packaging process, material shortage at the bottom is prone to occur; after adding a sixth mounting plate 76 with a heating structure 6 at the bottom of the box 1, the material shortage at the bottom of the product after glue injection and packaging is greatly reduced, and a higher yield rate is achieved.

[0129] According to the description and drawings of the present invention, those skilled in the art can easily manufacture or use the glue injection method and the glue injection mold of the present invention, and can produce the positive effects recorded in the present invention.

[0130] Unless otherwise specified, in the present invention, the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicating orientation or positional relationships are based on the orientation or positional relationships shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, the terms describing the orientation or positional relationship in the present invention are only used for illustrative purposes and cannot be understood as limitations on this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood in conjunction with the drawings and according to specific circumstances.

[0131] Unless otherwise clearly specified and limited, in the present invention, the terms "disposed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected, or indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0132] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Any simple modification or equivalent change made to the above embodiment based on the technical essence of the present invention shall fall within the protection scope of the present invention.

Claims

1. A glue injection method, characterized in that: include: Obtain the start signal and preset injection parameters, and establish a heating model for the mold body; Starting the heating device to heat the mold body according to the heating model of the mold body, and starting the glue injection device to inject the potting resin into the cavity of the mold body; Obtain the temperature inside the mold body in real time, recorded as T; In the first heating stage, the heating device continuously heats the mold body. When it is detected that the temperature T inside the mold body is equal to the first temperature threshold T1, the heating device stops working; In the second heating stage, the heating device intermittently heats the mold body; When the control module detects that the glue injection end conditions are met, the heating device and the glue injection device stop working.

2. The glue injection method according to claim 1, characterized in that: In the second heating stage, the heating device is started at intervals of t1 to heat the mold body, and stops working after working for t2 time; t1 and t2 constitute a first heating cycle, and several first heating cycles are continuously cycled until the total cycle time meets the second heating time.

3. The glue injection method according to claim 1, characterized in that: In the second heating stage, it includes: Record the initial temperature when entering the second heating stage as Ta; When it is detected that the temperature T in the mold body is less than the second temperature threshold value T2, the heating device is started, and the current temperature in the mold body is recorded as Tb and the duration after entering the second heating stage is recorded as a; When it is detected that the temperature T inside the mold body is greater than or equal to the second temperature threshold value T2, the heating device stops working, and records the current temperature inside the mold body as Tc and the duration of the heating device working as b; When it is detected that the temperature inside the mold body is again lower than the second temperature threshold value T2, the heating device starts to work, and records the current temperature inside the mold body as Td and the time c when the heating device stops working; b and c constitute a second heating cycle, and several second heating cycles are continuously cycled until the running time of the second heating stage meets the second heating time.

4. The glue injection method according to claim 1, characterized in that: When the control module detects that the injection end conditions are met, it includes: When the infrared sensor installed at the air outlet of the mold body detects that the potting resin fills the cavity to the air outlet, the control module controls the glue injection device to stop working.

5. The glue injection method according to claim 1, characterized in that: When the control module detects that the injection end conditions are met, it includes: When the pressure detection device connected to the liquid outlet of the glue injection device detects that the liquid pressure increases to n times, the control module controls the glue injection device to stop working.

6. The glue injection method according to claim 1, characterized in that: After the glue injection device stops working, the heating device continues to heat the mold body and maintains the temperature of the mold body at the third temperature threshold T3.

7. The glue injection method according to claim 1, characterized in that: In establishing the heating model of the mold body, it includes: The mold body is divided into x zones along the length direction, each zone includes a temperature sensor and a heating device; Along the direction from the liquid inlet to the gas outlet on the mold body, x zones are defined as Q1~Qx respectively; A first temperature threshold T1 and a second temperature threshold T2 of the Q1 to Qx region are defined, and the first temperature threshold T1 and the second temperature threshold T2 are increasing or decreasing in the sequence from the Q1 to the Qx region.

8. A glue injection mold, characterized in that: include: A control module is used to obtain a start signal and preset injection parameters and establish a heating model for the injection mold; A heating device, used to start the heating device according to the heating model of the injection mold to heat the injection mold; the heating device comprises a heating structure (6); A glue injection device, used for injecting potting resin into the cavity of the glue injection mold; Monitoring module, used to obtain the temperature inside the injection mold; The heating device, the glue injection device and the monitoring module are all connected to the control module via electrical signals, and the control module can control the operation of the heating device, the glue injection device and the monitoring module.

9. The glue injection mold according to claim 8, characterized in that: It also comprises a mould body, the mould body comprising a box body (1) and a cover plate (2), the cover plate (2) being arranged on top of the box body (1); A cavity (11) for accommodating an inner core is provided downwardly on the top surface of the box body (1); an injection connector (3) and an exhaust connector (4) are connected to the side surface of the box body (1); and one end of each of the injection connector (3) and the exhaust connector (4) can be connected to the cavity (11), the other end of the injection connector (3) is connected to a glue injection device, and the other end of the exhaust connector (4) is connected to a vacuum generating device; A plurality of connecting plates are provided on the outer side of the box body (1), and the plurality of connecting plates are respectively attached to one side of the box body (1). At least some of the connecting plates are provided with a plurality of mounting cavities (5), and the mounting cavities (5) can be used to mount the heating structure (6).

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