Composite board and preparation method thereof, heat dissipation device and vehicle

Abstract

The invention discloses a composite board and a preparation method thereof, a heat dissipation device and a vehicle, the composite board is suitable for heat dissipation of a part to be subjected to heat dissipation, the composite board comprises a main body part, the main body part comprises a first alloy part and a second alloy part which are connected, the density of the first alloy part is rho1, the density of the second alloy part is rho2, and rho1 is larger than rho2; the maximum temperature variation obtained by testing the to-be-cooled part is T, and T is more than 0 and less than or equal to 20K; in a cross section which simultaneously passes through the first alloy part and the second alloy part in the thickness direction of the composite plate, the thicknesses of the first alloy part and the second alloy part are delta0, the thickness of the first alloy part is delta1, delta1 = delta0, and delta0 is more than 0 and less than 50mm; the heat resistance value of the main body part is lambda, lambda = T / 2 delta, and 1.07 K / mm < = lambda < = 1.77 K / mm. The composite board disclosed by the invention can meet the requirements of light weight and heat dissipation efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of composite materials, and in particular to a composite plate and a preparation method thereof, a heat dissipation device and a vehicle. Background Art

[0002] Existing composite panels as heat sinks cannot take into account both lightweight design and thermal conductivity. Summary of the invention

[0003] The object of the present invention is to provide a composite plate and a preparation method thereof, a heat dissipation device and a vehicle, so as to solve the problem of the difficulty in balancing the lightweight design and thermal conductivity efficiency of the composite plate.

[0004] To achieve the purpose of the present invention, the present invention provides the following technical solutions:

[0005] In a first aspect, the present invention provides a composite plate, which is suitable for dissipating heat from a heat dissipation component, the composite plate comprising a main body, the main body comprising a first alloy component and a second alloy component, the density of the first alloy component is ρ1, the density of the second alloy component is ρ2, satisfying: ρ1>ρ2; the maximum temperature change obtained by testing the heat dissipation component is △T, satisfying: 0<△T≤20K; in a cross-section passing through the first alloy component and the second alloy component at the same time in the thickness direction of the composite plate, the thickness of the first alloy component and the second alloy component is δ0, the thickness of the first alloy component is δ1, △δ=|δ1-δ0|, satisfying: 0mm<△δ<50mm; the thermal resistance value of the main body is λ, λ=△T / 2△δ, satisfying: 1.07K / mm≤λ≤1.77K / mm.

[0006] In one embodiment, the first alloy part is a copper alloy part, and the second alloy part is an aluminum alloy part. Preferably, the copper alloy part includes Cu and Ag, and preferably, also includes at least one of Bi, Sb, As, Fe, Pb and S; and / or, the aluminum alloy part includes Al, and preferably, also includes at least one of Si, Fe, Mg, Cu, Mn, B, Zn and Ti.

[0007] In one embodiment, the copper alloy part satisfies: the mass fraction of Cu+Ag is a1, wherein 99.7%≤a1<100%; preferably, the mass fraction of Bi is a2, wherein 0<a2≤0.001%; ​​and / or the mass fraction of Sb is a3, wherein 0<a3≤0.002%; and / or the mass fraction of As is a4, wherein 0<a4≤0.002%; and / or the mass fraction of Fe is a5, wherein 0<a5≤0.005%; and / or the mass fraction of Pb is a6, wherein 0<a6≤0.005%; and / or the mass fraction of S is a7, wherein 0<a7≤0.005%; and / or; the aluminum alloy part satisfies: the mass fraction of Al The mass fraction of Si is b1, wherein 97.30%≤b1<100%; preferably, it also satisfies: the mass fraction of Si is b2, wherein 0<b2≤0.75%; and / or the mass fraction of Fe is b3, wherein 0<b3≤0.35%; and / or the mass fraction of Mg is b4, wherein 0<b4≤1%; and / or the mass fraction of Cu is b5, wherein 0<b5≤0.1%; and / or the mass fraction of Mn is b6, wherein 0<b6≤0.1%; and / or the mass fraction of B is b7, wherein 0<b7≤0.1%; and / or the mass fraction of Zn is b8, wherein 0<b8≤0.25%; and / or the mass fraction of Ti is b9, wherein 0<b9≤0.05%.

[0008] In one embodiment, the first alloy part includes an embedded part, and the embedded part of the first alloy part is embedded in the second alloy part; or the second alloy part includes an embedded part, and the embedded part of the second alloy part is embedded in the first alloy part.

[0009] In one embodiment, the dimension of the embedding part in the thickness direction of the composite plate is h1, which satisfies: h1<δ0, and 0

[0010] In one embodiment, the number of the embedded parts of the first alloy member is multiple, and the embedded parts of the first alloy member are arranged at intervals in the length direction of the composite plate and / or the width direction of the composite plate;

[0011] Alternatively, there are multiple embedded parts of the second alloy member, and the multiple embedded parts of the second alloy member are arranged at intervals in the length direction of the composite plate and / or the width direction of the composite plate.

[0012] In one embodiment, the composite plate further includes a primer layer and a corrosion-resistant layer, wherein the primer layer wraps the main body, and the corrosion-resistant layer wraps the primer layer.

[0013] In a second aspect, the present invention provides a method for preparing a composite plate, comprising the following steps:​

[0014] providing a first alloy and a semi-molten second alloy;

[0015] The semi-molten second alloy is arranged on the first alloy and continuously cast and rolled to obtain a main body, which is the main body of the composite plate described in any one of the embodiments of the first aspect.

[0016] In one embodiment, a semi-molten second alloy is provided, comprising:

[0017] providing an initial second alloy;

[0018] Melting the initial second alloy to obtain a primary second alloy liquid;

[0019] adding chemical elements to the primary second alloy liquid to obtain a secondary second alloy liquid;

[0020] Refining and degassing the secondary second alloy liquid to obtain a tertiary second alloy liquid;

[0021] The second alloy liquid is allowed to stand for three times to obtain the semi-molten second alloy.

[0022] In one embodiment, a first alloy is provided, comprising:

[0023] providing an initial first alloy;

[0024] Degreasing the initial first alloy to obtain a first-processed first alloy;

[0025] deoxidizing the primary-treated first alloy to obtain a secondary-treated first alloy;

[0026] The secondary treated first alloy is preheated to obtain the first alloy.

[0027] In a third aspect, the present invention provides a heat dissipation device, comprising a heat dissipation component to be dissipated and a composite plate as described in any one of the embodiments of the first aspect, wherein the composite plate dissipates heat from the heat dissipation component to be dissipated.

[0028] In a fourth aspect, the present invention provides a vehicle, comprising a heat dissipation device as described in any one of the embodiments of the third aspect.

[0029] The present invention reduces the weight and cost of the composite plate by changing the thickness ratio of the first alloy member in the main body of the composite plate and using the second alloy member with a density less than that of the first alloy member. Due to the adjustment of the composition of the main body, the heat dissipation effect of the corresponding composite plate on the heat dissipation element, that is, the maximum temperature change △T of the heat dissipation element will also change, and the range of △T is 0<△T≤20k. The heat resistance value of the composite plate of the present invention is λ, wherein λ=△T / 2△δ, and 1.07K / mm≤λ≤1.77K / mm, when λ>1.77k / mm, the heat resistance value of the composite plate is too large and cannot meet The composite plate has a demand for heat dissipation; when λ<1.07k / mm, the corresponding △δ change value of the first alloy part is small, so the change value of the weight of the composite plate is small, and it is impossible to achieve a balance between heat dissipation performance and weight reduction performance; when 1.07K / mm≤λ≤1.77K / mm, the thermal resistance value λ of the main body of the composite plate with different thickness ratios is always within this range, so that the composite plate can obtain a better heat dissipation effect, and a second alloy part with a low density is used to achieve a lightweight design, which increases the power density per unit mass and matches the actual loading requirements. That is, the composite plate of the present invention can take into account the requirements of lightweight and heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0031] Figure 1 is a schematic diagram of the main body of the first embodiment;

[0032] Figure 2 is a schematic diagram of the main body of the second embodiment;

[0033] Figure 3 is a schematic diagram of the main body of the third embodiment;

[0034] Figure 4 is a schematic diagram of the main body of a fourth embodiment;

[0035] Figure 5 is a flow chart of a method for preparing a composite plate according to an embodiment;

[0036] Figure 6 is a flow chart of one step in a method for preparing a composite plate of an embodiment;

[0037] Figure 7 The present invention is a flow chart of another step in the method for preparing a composite board according to an embodiment.

[0038] Description of reference numerals:

[0039] 10 - main body, 11 - first alloy part, 111 - embedded part, 12 - second alloy part, 13 - transition layer. DETAILED DESCRIPTION

[0040] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0041] It should be noted that when a component is said to be "fixed to" another component, it can be directly on the other component or there can be a central component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there can be a central component at the same time.

[0042] Unless otherwise defined, all technical and scientific terms used in the present invention have the same meaning as those commonly understood by those skilled in the art to which the present invention belongs. The terms used in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used in the present invention includes any and all combinations of one or more of the related listed items.

[0043] Some embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0044] For reference Figure 1 and Figure 2 The present invention provides a composite plate, which is suitable for dissipating heat from a heat dissipation component. The composite plate includes a main body 10, and the main body 10 includes a first alloy component 11 and a second alloy component 12 connected to each other. The density of the first alloy component 11 is ρ1, and the density of the second alloy component 12 is ρ2, satisfying: ρ1>ρ2; the maximum temperature change obtained by testing the heat dissipation component is △T, satisfying: 0<△T≤20K.

[0045] In the cross section passing through the first alloy part 11 and the second alloy part 12 simultaneously in the thickness direction of the composite plate, the thickness of the first alloy part 11 and the second alloy part 12 is δ0, the thickness of the first alloy part 11 is δ1, △δ=|δ1-δ0|, satisfying: 0<△δ<50mm; the thermal resistance value of the main body 10 is λ, λ=△T / 2△δ, satisfying: 1.07K / mm≤λ≤1.77K / mm.

[0046] For reference Figure 1 and Figure 2 Optionally, when the main body 10 includes at least three alloy parts, only the adjacent and connected first alloy part 11 and second alloy part 12 are analyzed. When a transition layer 13 is provided between the first alloy part 11 and the second alloy part 12, Δδ corresponds to the total thickness of the second alloy part 12 and the transition layer 13.

[0047] For reference Figure 1 and Figure 2 Optionally, when the first alloy part 11 is a copper alloy part and the second alloy part 12 is an aluminum alloy part, a transition layer 13 is further provided between the first alloy part 11 and the second alloy part 12. The material of the transition layer 13 may be an intermetallic compound formed by Al and Cu, may be formed by Cu atoms filling in an Al lattice, or may be formed by Al atoms filling in a Cu lattice. Specifically, the material of the transition layer 13 may be Cu3Al2, Cu9Al4, CuAl, etc., without limitation.

[0048] Optionally, the first alloy part 11 is a copper alloy part, and the second alloy part 12 is an aluminum alloy part; or, the first alloy part 11 is a copper alloy part, and the second alloy part 12 is a nickel alloy part; or, the first alloy part 11 is a silver alloy part, and the second alloy part 12 is a copper alloy part, etc., without limitation.

[0049] Optionally, △δ is 1 mm, 10 mm, 20 mm, 30 mm, 40 mm, etc., without limitation. λ is 1.07 K / mm, 1.27 K / mm, 1.47 K / mm, 1.67 K / mm, 1.77 K / mm, etc., without limitation.

[0050] Optionally, △T can be 1K, 5K, 10K, 15K, 20K, etc., without limitation. The highest temperature of the heat sink after the heat sink is cooled by the composite plate is T1, and the highest temperature of the heat sink after the heat sink is cooled by the reference example is T2. The reference example is a plate made of a pure first alloy. Optionally, the reference example is a pure copper alloy, satisfying: △T = T1-T2.

[0051] Optionally, the following condition is satisfied: 2mm≤δ0≤25mm, and δ0 can be 2mm, 5mm, 10mm, 15mm, 20mm, 25mm, etc.

[0052] Optionally, the following condition is also satisfied: 1%≤δ1 / δ0≤20%, and δ1 / δ0 can be 1%, 5%, 10%, 15%, 20%, etc.

[0053] Optionally, the first alloy member 11 may be disposed on at least one end of the second alloy member 12 in the width direction of the composite plate. For details, please refer to Figure 1The second alloy member 12 is provided with the first alloy member 11 at one end in the width direction of the composite plate, or, Figure 2 The first alloy member 11 is disposed at both ends of the second alloy member 12 in the width direction of the composite plate.

[0054] Optionally, the conductivity of the composite plate is m, which satisfies: m ≥ 65% IACS. In the description of the present invention, the conductivity of the composite plate is the ratio of the conductivity of the composite plate to the standard conductivity of the pure copper material, expressed as % IACS. The standard conductivity of the present invention is 100% IACS. The standard conductivity is an annealed copper wire with a density of 8.89g / cm3, a length of 1m, a mass of 1g, and a resistance of 0.15328 ohms as a measurement standard. At 20 degrees Celsius, the resistivity of the above-mentioned annealed copper wire is 1.7241μΩ·cm, (or a conductivity of 58.0MS / m) and is determined to be 100% IACS (International Annealed Copper Standard). Specifically, through a DC resistance tester, the terminal of the instrument is connected to the composite plate to be tested, the length and cross-sectional area of ​​the composite plate to be tested are input, and the instrument measurement value is read to obtain the conductivity of the composite plate.

[0055] Optionally, the tensile strength of the composite plate is б, which satisfies: б ≥ 110 MPa. According to the requirements of GBT228.1-2010 Metallic Material Tensile Test Part 1: Room Temperature Tensile Test, the material is subjected to a tensile load on a universal tensile testing machine. When the load continues to increase, the maximum stress value reached by the material before fracture is the tensile strength of the measurement.

[0056] Optionally, the composite plate also meets the requirement of no cracks after 90° bending (1t). According to the YB / T5349-2014 metal material bending mechanical properties test method, a microcomputer-controlled electronic universal tensile testing machine is used to bend the material 90° under pressure load, and the morphology of the bending part is observed under a metallographic microscope.

[0057] Optionally, the connection method between the first alloy part 11 and the second alloy part 12 can be any one of stacking, coating, and embedding. Specifically, the first alloy part 11 can be embedded in the second alloy part 12, or the second alloy part 12 can be embedded in the first alloy part 11; the first alloy part 11 can coat the second alloy part 12, or the second alloy part 12 can coat the first alloy part 11, without limitation.

[0058] Optionally, after the composite board has been cut, shaped, or the like, the shape of the composite board may be rectangular, cylindrical, elliptical, square, diamond, or the like, without limitation.

[0059] Optionally, when the first alloy member 11 is a copper alloy member and the second alloy member 12 is an aluminum alloy member, the density of the main body 10 in one embodiment of the present invention is 3.94 g / cm 3Compared with pure copper alloy parts, the density of the main body 10 of an embodiment of the present invention is 44% of pure copper materials. Therefore, the main body 10 of the present invention can reduce the weight by about 40% compared with pure copper materials. In addition, the addition of aluminum alloy parts can reduce the cost of the main body 10. Specifically, the comprehensive cost of the main body 10 with aluminum alloy parts added in an embodiment is about 15% of the comprehensive cost of the main body 10 made of pure copper materials.

[0060] The present invention reduces the weight and cost of the composite plate by changing the thickness ratio of the first alloy member 11 in the main body 10 of the composite plate and using the second alloy member 12 with a density less than that of the first alloy. Due to the adjustment of the composition of the main body 10, the heat dissipation effect of the corresponding composite plate on the heat dissipation element, that is, the maximum temperature change ΔT of the heat dissipation element will also change, and the range of ΔT is 0<ΔT≤20k. The heat resistance value satisfied by the heat dissipation effect of the composite plate as a heat dissipation element is λ, correspondingly, λ=△T / 2△δ, and 1.07K / mm≤λ≤1.77K / mm, λ>1.77k / mm When λ is less than 1.07 k / mm, the change value of △δ of the corresponding first alloy part is small, so the change value of the weight of the composite plate is small, and it is impossible to achieve a balance between heat dissipation performance and weight reduction performance; when 1.07 K / mm≤λ≤1.77 K / mm, the heat resistance value λ of the main body 10 of the composite plate with different thickness ratios is always within this range, so that the composite plate can obtain a better heat dissipation effect, realize lightweight design, increase the power density per unit mass, and match the actual loading requirements, that is, the composite plate of the present invention can take into account the requirements of lightweight and heat dissipation efficiency.

[0061] In one embodiment, the first alloy part 11 is a copper alloy part, and the second alloy part 12 is an aluminum alloy part. Preferably, the copper alloy part includes Cu and Ag, and preferably also includes at least one of Bi, Sb, As, Fe, Pb and S; and / or, the aluminum alloy part includes Al, and preferably also includes at least one of Si, Fe, Mg, Cu, Mn, B, Zn and Ti.

[0062] Optionally, the aluminum alloy part may be made of a deformed aluminum alloy of series 1, 3, 4 or 8, depending on the chemical elements added. Further, the aluminum alloy part is made of a deformed aluminum alloy of grades 1060, 1050, 1100, 3003, 8011 or 8030. Specifically, the 1060 aluminum alloy is an alloy formed by adding a small amount of magnesium and zinc to pure aluminum, with a mass fraction of Mg of 0.4%-1% and a mass fraction of Zn of 0.25%.

[0063] Optionally, depending on the added chemical elements, the copper alloy parts with Zn added are brass, the copper alloy parts with Ni, Zn and other elements are nickel silver, and the copper alloy parts with Sn, Al, Zn and other elements are bronze.

[0064] Chemical elements are added to copper or aluminum to form an alloy. Compared with pure aluminum or pure copper, the alloy has the advantages of high hardness, good heat resistance and corrosion resistance.

[0065] In one embodiment, in a copper alloy part, the following is satisfied: the mass fraction of Cu+Ag is a1, wherein 99.7%≤a1<100%; preferably, the following is also satisfied: the mass fraction of Bi is a2, wherein 0<a2≤0.001%; ​​and / or, the mass fraction of Sb is a3, wherein 0<a3≤0.002%; and / or, the mass fraction of As is a4, wherein 0<a4≤0.002%; and / or, the mass fraction of Fe is a5, wherein 0<a5≤0.005%; and / or, the mass fraction of Pb is a6, wherein 0<a6≤0.005%; and / or, the mass fraction of S is a7, wherein 0<a7≤0.005%; and / or; in an aluminum alloy part, the following is satisfied: the mass fraction of Al is b1, wherein 97.30%≤b1<100%; preferably, it also satisfies: the mass fraction of Si is b2, wherein 0<b2≤0.75%; and / or the mass fraction of Fe is b3, wherein 0<b3≤0.35%; and / or the mass fraction of Mg is b4, wherein 0<b4≤1%; and / or the mass fraction of Cu is b5, wherein 0<b5≤0.1%; and / or the mass fraction of Mn is b6, wherein 0<b6≤0.1%; and / or the mass fraction of B is b7, wherein 0<b7≤0.1%; and / or the mass fraction of Zn is b8, wherein 0<b8≤0.25%; and / or the mass fraction of Ti is b9, wherein 0<b9≤0.05%.

[0066] By adjusting the mass fraction and type of added chemical elements, different types of alloys are formed, thereby changing the thermal resistance, hardness and other properties of aluminum alloy parts or copper alloy parts.

[0067] For reference Figure 3 and Figure 4 In one embodiment, the first alloy part 11 includes an embedding part 111, and the embedding part 111 of the first alloy part 11 is embedded in the second alloy part 12; or, the second alloy part 12 includes an embedding part 111, and the embedding part 111 of the second alloy part 12 is embedded in the first alloy part 11.

[0068] The shape of the embedding piece 111 can be a cube, a column, etc., without limitation.

[0069] The insert 111 embedded in the first alloy part 11 or the second alloy part 12 can obtain a better thermal conductivity effect, thereby effectively improving the heat exchange efficiency, reducing the volume of the heat exchanger, making the structure compact, reducing the required occupied space, increasing the power density per unit mass and thus improving efficiency to match actual vehicle loading requirements.

[0070] For reference Figure 3 In one embodiment, the dimension of the insert 111 in the thickness direction of the composite plate is h1, satisfying: h1<δ0, and 0mm

[0071] Optionally, h1 can be 1mm, 4mm, 6mm, 8mm, 10mm, etc. without limitation.

[0072] When there is only one embedding piece 111 in the thickness direction of the composite plate, h1 is the size of the single embedding piece 111 in the thickness direction of the composite plate; when there are multiple embedding pieces 111 in the thickness direction of the composite plate, h1 is the sum of the sizes of the multiple embedding pieces 111 in the thickness direction of the composite plate, and the multiple embedding pieces 111 are spaced apart in the thickness direction of the composite plate.

[0073] The dimension of the insert 111 in the thickness direction of the composite plate is smaller than that of the main body 10 in the thickness direction, so that the first alloy member 11 and the second alloy member 12 always exist in the thickness direction of the composite plate, so that the thermal conductivity of the composite plate in the thickness direction is good.

[0074] For reference Figure 3 and Figure 4 In one embodiment, there are multiple embedded parts 111 of the first alloy member 11, and the multiple embedded parts 111 of the first alloy member 11 are arranged at intervals in the length direction of the composite plate and / or the width direction of the composite plate;

[0075] Alternatively, the number of the embedded parts 111 of the second alloy member 12 is multiple, and the embedded parts 111 of the multiple second alloy members 12 are arranged at intervals in the length direction of the composite plate and / or the width direction of the composite plate.

[0076] Optionally, multiple embedments 111 of first alloy parts 11 are spaced apart in the length direction of the composite plate, and / or, multiple embedments 111 of first alloy parts 11 are spaced apart in the width direction of the composite plate; or, multiple embedments 111 of second alloy parts 12 are spaced apart in the length direction of the composite plate, and / or, multiple embedments 111 of second alloy parts 12 are spaced apart in the width direction of the composite plate.

[0077] ​The inserts 111 may be arranged at equal intervals in the length direction of the composite board, or may be arranged at intervals in the length direction of the composite board, without limitation. And / or, the inserts 111 may be arranged at equal intervals in the width direction of the composite board, or may be arranged at intervals in the width direction of the composite board, without limitation.

[0078] The insert 111 is embedded in the first alloy member 11 or the second alloy member 12 in a one-to-one correspondence in the length and / or width direction of the composite plate. The composite plate in which the insert 111 is embedded in the first alloy member 11 or the second alloy member 12 can obtain a better thermal conductivity effect, thereby effectively improving the heat exchange efficiency, reducing the volume of the heat exchanger, and having a compact structure, reducing the required occupied space, increasing the power density per unit mass, and thus improving efficiency, thereby matching actual vehicle loading requirements.

[0079] Optionally, when the second alloy member 12 includes an embedding member 111 and the embedding member 111 is embedded in the first alloy member 11 , reference may be made to the aforementioned embedding structure in which the first alloy member 11 includes the embedding member 111 and the embedding member 111 is embedded in the second alloy member 12 .

[0080] For reference Figure 4 In one embodiment, the number of the embedded components 111 in the width direction of the composite plate is (m-1), the size of the main body 10 in the width direction of the composite plate is W, the size of the i-th embedded component 111 in the width direction of the composite plate is xi, satisfying: 0<xi≤100mm, and i≤m-1 and i is a positive integer; the spacing between the i-th embedded component 111 and the (i+1)-th embedded component 111 in the width direction of the composite plate is di, satisfying: 0<di≤100mm; satisfying:

[0081]

[0082] di can be 5mm, 20mm, 40mm, 60mm, 80mm, 100mm, etc. without restriction.

[0083] The difference in the spacing between three adjacent inserts 111 in the width direction of the composite plate is Δd, which satisfies:

[0084] Δd=|d id i+1|, when Δd is equal to 0, the embedding members 111 are arranged at equal distances, and when Δd is greater than 0, the embedding members 111 are arranged at unequal distances.

[0085] In one embodiment, the number of the inserts 111 in the length direction of the composite plate is (n-1), the size of the main body 10 in the length direction of the composite plate is L, the size of the jth insert 111 in the length direction of the composite plate is yj, satisfying: 0<yj≤1000mm, and j≤n-1 and j is a positive integer; the spacing between the jth insert 111 and the (j+1)th insert 111 in the length direction of the composite plate is pj, satisfying: 0<pj≤100mm; satisfying:

[0086]

[0087] yj can be 100mm, 200mm, 400mm, 600mm, 800mm, 1000mm, etc. without restriction.

[0088] The difference in the spacing between three adjacent inserts 111 in the length direction of the composite plate is Δp, which satisfies:

[0089] △p=|pj-pj+1|, when △p is equal to 0, the embedding parts 111 are arranged at equal distances, and when △p is greater than 0, the embedding parts 111 are arranged at unequal distances.

[0090] The distribution of the inserts 111 in the length direction and the width direction of the composite plate satisfies:

[0091]

[0092] The length, width, thickness and spacing between the inserts 111 can be designed for different heat dissipation parts, and can match the application scenarios of various systems. At the same time, compared with the continuous first alloy part 11, the insert 111 can further reduce the weight of the composite plate and achieve lightweight design requirements.

[0093] In one embodiment, the composite plate further includes a primer layer and a corrosion-resistant layer, wherein the primer layer wraps the main body 10 and the corrosion-resistant layer wraps the primer layer.

[0094] The material of the base layer can be copper, and the base layer can be formed on the outside of the main body 10 by electroplating. During the electroplating process, the positive copper metal ions are reduced to metal atoms, adsorbed on the surface of the main body 10, and migrate on the surface of the main body 10 until they are incorporated into the lattice to form the base layer. The electroplating process is "driven" by the difference between the reaction potential and the equilibrium potential, so that the base layer is dense and flat, and has good bonding with the main body, ensuring the adhesion of the subsequent corrosion-resistant layer and preventing the corrosion-resistant layer from falling off.

[0095] The material of the corrosion-resistant layer can be nickel, and the corrosion-resistant layer can be formed on the outside of the base layer by electroplating. Specifically, the thickness of the corrosion-resistant layer is 10 μm, and the peel strength is 35 N / mm. By setting the corrosion-resistant layer, a smooth surface layer is obtained while ensuring excellent corrosion resistance, thereby further reducing flow resistance and enhancing the ability to radiate heat to the environment.

[0096] In one embodiment, the present invention is different from the heat conduction of the traditional single plane module. The composite plate of the present invention can form a variety of three-dimensional forms to achieve all-round multi-space heat conduction. The composite plate is used as a heat sink in systems such as vehicles, and multiple composite plates can be assembled in series and / or in parallel. Specifically, the composite plate is connected and fixed to the heat sink to be cooled, so that the composite plate as a heat sink has a smaller volume and lighter weight while meeting the thermal conductivity. The composite plate can also be used as a structural material at the same time. While completing the transfer between the heat sinks inside the system, it realizes the connection and force of the multi-layer spatial three-dimensional layout, with high space utilization, and more convenient production, installation, and disassembly.

[0097] For reference Figure 5 The present invention provides a method for preparing a composite plate, comprising the following steps:

[0098] Step S100, providing a first alloy and a semi-molten second alloy;

[0099] Step S200 , placing a semi-molten second alloy on the first alloy and performing continuous casting and rolling to obtain a main body 10 of a composite plate, wherein the main body 10 is the main body 10 of a composite plate as described in any one of the aforementioned embodiments.

[0100] In step S200, continuous casting and rolling can be performed in an oxygen-free environment, and the rolling speed of the oxygen-free continuous casting and rolling can be 0.3m / s-1.8m / s, specifically, 0.3m / s, 0.8m / s, 1m / s, 1.8m / s, etc. The present invention performs continuous casting and rolling under high temperature and oxygen-free conditions, solves the problem of oxidation of the first alloy and the second alloy during the composite process of the first alloy part 11 and the second alloy part 12, realizes 100% metallurgical composite of the first alloy part 11 and the second alloy part 12 through equipment control and process adjustment, solves the problems of oxidation and eutectic defects of alloy composite, and does not have a brittle phase between the first alloy part 11 and the second alloy part 12; meets the precise requirements of the temperature and time of the heat penetration composite between the two metals, controls the formation and expansion of the eutectic layer, i.e., the transition layer 13, and realizes the continuous casting and semi-molten rolling composite of the first alloy and the second alloy metal. Compared with the composite plate composited with conductive adhesive or other forms of connection, the composite plate using semi-molten rolling composite has a higher heat resistance value. By adopting the method of composite rolling of the first alloy and the second alloy, the first alloy part 11 and the second alloy part 12 can be prepared as a whole, reducing the brazing process. Since the thermal conductivity of the brazing material is much lower than that of the first alloy and the second alloy, it is beneficial to improve the stability of the main body 10 and also reduce the thermal resistance of the main body 10.

[0101] For reference Figure 6 In one implementation, step S100 includes:

[0102] Step S11, providing an initial second alloy;

[0103] Step S12, smelting the initial second alloy to obtain a primary second alloy liquid;

[0104] Step S13, adding chemical elements to the primary second alloy liquid to obtain a secondary second alloy liquid;

[0105] Step S14, refining and degassing the secondary second alloy liquid to obtain a tertiary second alloy liquid;

[0106] Step S15, allowing the second alloy liquid to stand for three times to obtain a semi-molten second alloy.

[0107] When the second alloy in step S100 is an aluminum alloy, the initial second alloy is an aluminum ingot. In step S12, the temperature of smelting the aluminum ingot can be 700°C-850°C, optionally, 700°C, 750°C, 800°C, 850°C, etc., without limitation.

[0108] In step S13, the chemical element may be at least one of Si, Fe, Mg, Cu, Mn, B, Zn, and Ti. The chemical element is first heated to a molten state and then added into the aluminum alloy liquid.

[0109] In step S14, the temperature of refining and degassing is 750°C-810°C, optionally, 750°C, 770°C, 780°C, 810°C, etc., without limitation. The gas in the secondary aluminum alloy liquid is mainly hydrogen. The degassing method includes introducing an inert gas such as nitrogen or argon. The gas forms small bubbles in the secondary aluminum alloy liquid, and the bubbles absorb inclusions and hydrogen in the secondary aluminum alloy liquid during the floating process. When the bubbles float to the liquid surface and are removed, the purpose of degassing and slag removal is achieved.

[0110] Step S15, let the three aluminum alloy liquid stand, and pour it into the preheated casting nozzle, and the cast three aluminum alloy liquid is cooled and crystallized to obtain a semi-molten aluminum alloy. The standing temperature is 650℃-850℃, and optionally, it can be 650℃, 750℃, 780℃, 850℃, etc., without limitation. The standing time is 5min-10min, and optionally, the standing time is 5min, 6min, 8min, 10min, etc., without limitation.

[0111] For reference Figure 7 In one implementation, step S100 includes:

[0112] Step S21, providing an initial first alloy;

[0113] Step S22, degreasing the initial first alloy to obtain a primary treated first alloy;

[0114] Step S23, deoxidizing the primary-treated first alloy to obtain the secondary-treated first alloy;

[0115] Step S24, preheating the first alloy for secondary treatment to obtain the first alloy.

[0116] In step S22, the degreasing treatment includes cleaning, pickling, passivation, etc. The working temperature of the degreasing treatment can be 40°C-60°C to avoid excessively high temperatures that damage the copper surface.

[0117] In step S23, the deoxidation method may be a mechanical method, an immersion cleaning method, a solution method, a passivation treatment, etc., without limitation.

[0118] In step S24, the temperature of the preheat treatment is 230°C-250°C, optionally, it can be 230°C, 2340°C, 238°C, 240°C, etc., without limitation.

[0119] In one embodiment, in the process of continuously casting and rolling to obtain the main body 10 in step S200, a billet is first obtained after continuous rolling, and the billet is annealed at a temperature of 180°C-360°C and an annealing time of 1h-15h; the annealed billet is also subjected to homogenization heat treatment at a temperature of 520°C-580°C and a holding time of 8h-22h; the billet after the homogenization heat treatment is sawed and milled to cut off the head and tail of the billet, the cutting length is not less than 100mm, and the oxide scale on the surface of the billet is milled off, and the milling depth is not less than 5mm.

[0120] In one embodiment, the main body 10 can also be formed by directly welding the second alloy part 12 on the surface of the first alloy part 11. The welding requirements are -40°C to 150°C (30min), the conversion time is less than 30s, and the thermal resistance deviation is not more than 20% under 1000 cycles.

[0121] The present invention provides a heat dissipation device, comprising a heat dissipation component and a composite plate as described in any one of the above embodiments, wherein the composite plate dissipates heat from the heat dissipation component.

[0122] Optionally, the heat dissipation component may be a battery, a chip, etc.

[0123] Optionally, the composite plate can be used as at least part of the heat sink to dissipate heat for the heat sink, and the heat sink can be made entirely of the composite plate or partially of the composite plate. The heat sink can include one composite plate or multiple composite plates stacked together.

[0124] The present invention provides a vehicle, comprising the heat dissipation device described in any one of the above embodiments. The heat dissipation device of the present invention can meet the heat dissipation requirements of the heat dissipation parts and help improve the weight reduction of the heat dissipation system of the vehicle.

[0125] The technical solution of the present invention is described in detail below through specific embodiments.

[0126] The thickness of the main body 10 of Examples 1 to 5 is the thickness δ0 of the first alloy part 11 and the second alloy part 12, and δ0 is 3 mm. The first alloy part 11 of Examples 1 to 5 is a copper alloy part, and the second alloy part 12 is an aluminum alloy part.

[0127] Example 1

[0128] like Figure 1 The composite plate shown is formed by stacking aluminum alloy parts on copper alloy parts. The thickness δ0 of the composite plate is 3 mm, the thickness δ1 of the copper alloy part is 2.5 mm, △δ=|δ1-δ0|=0.5 mm; the maximum temperature change △T of the heat dissipation part is measured to be 1.677 K, and the calculated λ is 1.677 K / mm.

[0129] The copper alloy contains 99.9% by mass of Cu+Ag, 0.001% by mass of Bi, 0.001% by mass of Sb, 0.001% by mass of As, and 0.02% by mass of Fe.

[0130] The aluminum alloy contains 99.49% by mass of Al, 0.2% by mass of Si, 0.3% by mass of Fe, 0.001% by mass of Mg, 0.001% by mass of Cu, and 0.003% by mass of Mn.

[0131] Example 2

[0132] like Figure 1 The composite plate shown is formed by stacking aluminum alloy parts on copper alloy parts. The thickness δ0 of the composite plate is 3 mm, the thickness δ1 of the copper alloy part is 2 mm, △δ=|δ1-δ0|=1 mm; the maximum temperature change △T of the heat dissipation part is measured to be 2.753 K, and the calculated λ is 1.377 K / mm.

[0133] The copper alloy contains 99.9% by mass of Cu+Ag, 0.001% by mass of Bi, 0.001% by mass of Sb, and 0.01% by mass of Fe.

[0134] The aluminum alloy contains 99.39% by mass of Al, 0.23% by mass of Si, 0.35% by mass of Fe, 0.001% by mass of Mg, 0.001% by mass of Cu, and 0.006% by mass of Mn.

[0135] Example 3

[0136] like Figure 1 The composite plate shown is formed by stacking aluminum alloy parts on copper alloy parts. The thickness δ0 of the composite plate is 3 mm, the thickness δ1 of the copper alloy part is 1.5 mm, △δ=|δ1-δ0|=1.5 mm; the maximum temperature change △T of the heat dissipation part is measured to be 3.929 K, and the calculated λ is 1.310 K / mm.

[0137] The copper alloy contains 99.9% by mass of Cu+Ag, 0.001% by mass of Bi, and 0.002% by mass of Sb.

[0138] The aluminum alloy contains 99.6% by mass of Al, 0.1% by mass of Si, 0.2% by mass of Fe, 0.001% by mass of Mg, 0.001% by mass of Cu, and 0.001% by mass of Mn.

[0139] Example 4

[0140] like Figure 1 The composite plate shown is formed by stacking aluminum alloy parts on copper alloy parts. The thickness δ0 of the composite plate is 3 mm, the thickness δ1 of the copper alloy part is 1 mm, △δ=|δ1-δ0|=2 mm; the maximum temperature change △T of the heat dissipation part is measured to be 5.292 K, and the calculated λ is 1.323 K / mm.

[0141] The compositions of the copper alloy and the aluminum alloy are the same as those in Example 1.

[0142] Example 5

[0143] like Figure 1 The composite plate shown is formed by stacking aluminum alloy parts on copper alloy parts. The thickness δ0 of the composite plate is 3 mm, the thickness δ1 of the copper alloy part is 0.5 mm, △δ=|δ1-δ0|=2.5 mm; the maximum temperature change △T of the heat dissipation part is measured to be 6.913 K, and the calculated λ is 1.383 K / mm.

[0144] The compositions of the copper alloy and the aluminum alloy are the same as those in Example 1.

[0145] Example 6

[0146] like Figure 3 In the composite plate shown, the copper alloy part is composed of 6 embedded parts, and the 6 embedded parts are embedded in the aluminum alloy part. The number of embedded parts in the width direction of the composite plate is 6, and the number of embedded parts in the length direction of the composite plate is 1. The thickness δ0 of the composite plate is 3mm, the thickness δ1 of the copper alloy part is 2.5mm, △δ=|δ1-δ0|=0.5mm; the maximum temperature change △T of the heat dissipation part is measured to be 1.758K, and the calculated λ is 1.758K / mm.

[0147] The compositions of the copper alloy and the aluminum alloy are the same as those in Example 1.

[0148] Reference example

[0149] The main body 10 is entirely made of a copper alloy, and the thickness δ1 of the copper alloy is 3 mm. The copper alloy contains 99.9% by mass of Cu+Ag, 0.001% by mass of Bi, and 0.002% by mass of Sb.

[0150] Comparative Example 1

[0151] like Figure 1The composite plate shown is formed by stacking aluminum alloy parts on copper alloy parts. The thickness δ0 of the composite plate is 3 mm, the thickness δ1 of the copper alloy part is 0.2 mm, △δ=|δ1-δ0|=2.8 mm; the maximum temperature change △T of the heat dissipation part is measured to be 21.6 K, and the calculated λ is 3.857 K / mm.

[0152] The compositions of the copper alloy and the aluminum alloy are the same as those in Example 1.

[0153] Comparative Example 2

[0154] like Figure 1 The composite plate shown is formed by stacking aluminum alloy parts on copper alloy parts. The thickness δ0 of the composite plate is 3 mm, the thickness δ1 of the copper alloy part is 2.7 mm, △δ=|δ1-δ0|=0.3 mm; the maximum temperature change △T of the heat dissipation part is measured to be 0.56 K, and the calculated λ is 0.933 K / mm.

[0155] The compositions of the copper alloy and the aluminum alloy are the same as those in Example 1.

[0156] The test method of the maximum temperature change obtained by the heat dissipation part test is as follows: the heat dissipation performance test is performed on the composite plates of the embodiment, the comparative example and the reference example, and the heat dissipation part of the same power is fixed at the geometric center of the surface of the composite plate. After starting and running for 2 hours, the temperature at the geometric center of the surface of the heat dissipation part is detected and recorded, which is the maximum temperature of the heat dissipation part. The test results are shown in Table 1. In Table 1, the maximum temperature of the heat dissipation part after the heat dissipation part is dissipated by the composite plate is T1, the maximum temperature of the heat dissipation part after the heat dissipation part is dissipated by the reference example is T2, and the maximum temperature change of the first alloy part is △T, △T=T1-T2.

[0157] The weight reduction ratio is calculated as follows: The weight reduction ratio is the ratio of the weight of the main body 10 of the embodiment and the comparative example to the weight of the main body 10 of the reference example. The test method of the relevant data in Table 2 has been described in the above embodiment. Table 2 shows the test results of the electrical conductivity, tensile strength and other properties of the embodiment and the comparative example.

[0158] When the reference example is a pure copper alloy part, T2 is 129.743°C and the weight of the reference example is 537g.

[0159] Table 1

[0160] T1(℃) ΔT(K) λ(K / mm) Weight(g) Weight reduction ratio Example 1 131.420 1.677 1.677 473 12％ Example 2 132.496 2.753 1.377 410 24％ Example 3 133.672 3.929 1.310 347 35％ Example 4 135.035 5.292 1.323 288 46％ Example 5 136.656 6.913 1.383 220 59％ Example 6 131.501 1.758 1.758 443 18％ Comparative Example 1 151.343 21.6 3.857 187 65％ Comparative Example 2 130.311 0.56 0.933 508 5％

[0161] Table 2

[0162]

[0163] The temperature of the heat dissipation element is below 150°C to ensure efficiency and safety. From the test results in Table 1, it can be seen that the composite plate prepared by the main body 10 of Examples 1 to 6 can meet the temperature requirements of the heat dissipation element, effectively reduce the central temperature of the heat dissipation element, and significantly improve the composite efficiency of unit mass power density, which is beneficial to the lightweight and heat conduction of the system. At the same time, the design requirements of lightweight and low cost can be met. Therefore, the composite plate of the present invention is suitable for making a heat dissipation device for a vehicle, which is beneficial to improving the lightweight and cruising range of the vehicle.

[0164] It can be seen from Table 1 that the λ of comparative example 1 is greater than 1.77K / mm, and the corresponding ΔT>20k, which exceeds the maximum operating temperature of the heat dissipation component to be cooled. Therefore, comparative example 1 cannot meet the heat dissipation requirements; the λ of comparative example 2 is less than 1.07K / mm, and the corresponding weight reduction ratio is 5%, and the corresponding ΔT is 0.56K. Compared with examples 1 to 6, although the maximum temperature change of the heat dissipation component to be cooled does not change much, the mass of the composite plate is not significantly reduced. Therefore, it is believed that comparative example 2 cannot achieve both heat dissipation effect and lightweight.

[0165] As can be seen from Table 2, the composite plates of Examples 1 to 6 have good electrical conductivity and tensile strength while ensuring heat dissipation effect and light weight, and meet the requirement of no cracks at 90° bend (1t), while the tensile strength of Comparative Example 1 is poor and does not meet the requirement of no cracks at 90° bend (1t), and Comparative Example 2 also does not meet the requirement of no cracks at 90° bend (1t). Therefore, the composite plate of the present invention is suitable for manufacturing a heat dissipation device for a vehicle.

[0166] In the description of the embodiments of the present invention, it should be noted that the orientation or positional relationship of terms such as "center", "up", "down", "left", "right", "vertical", "horizontal", "inside" and "outside" are based on the orientation or positional relationship described in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0167] What is disclosed above is only a preferred embodiment of the present invention, and it certainly cannot be used to limit the scope of rights of the present invention. Ordinary technicians in this field can understand that all or part of the processes of the above embodiment and equivalent changes made according to the claims of the present invention still fall within the scope covered by the present invention.

Claims

1. A composite board, characterized in that: The composite plate is suitable for dissipating heat from a heat sink, and includes a main body, wherein the main body includes a first alloy member and a second alloy member connected to each other, wherein the density of the first alloy member is ρ1, and the density of the second alloy member is ρ2, satisfying: ρ1>ρ2; the maximum temperature change obtained by testing the heat sink is △T, satisfying: 0<△T≤20K; in a cross section passing through the first alloy member and the second alloy member at the same time in the thickness direction of the composite plate, the thickness of the first alloy member and the second alloy member is δ0, and the thickness of the first alloy member is δ1, △δ=|δ1-δ0|, satisfying: 0<△δ<50mm; the thermal resistance value of the main body is λ, λ=△T / 2△δ, satisfying: 1.07K / mm≤λ≤1.77K / mm.

2. The composite panel according to claim 1, characterized in that: The first alloy part is a copper alloy part, and the second alloy part is an aluminum alloy part. Preferably, the copper alloy part includes Cu and Ag, and preferably, also includes at least one of Bi, Sb, As, Fe, Pb and S; and / or, the aluminum alloy part includes Al, and preferably, also includes at least one of Si, Fe, Mg, Cu, Mn, B, Zn and Ti.

3. The composite panel according to claim 2, characterized in that: In the copper alloy part, the following conditions are satisfied: the mass fraction of Cu+Ag is a1, wherein 99.7%≤a1<100%; preferably, the following conditions are also satisfied: the mass fraction of Bi is a2, wherein 0<a2≤0.001%; ​​and / or the mass fraction of Sb is a3, wherein 0<a3≤0.002%; and / or the mass fraction of As is a4, wherein 0<a4≤0.002%; and / or the mass fraction of Fe is a5, wherein 0<a5≤0.005%; and / or the mass fraction of Pb is a6, wherein 0<a6≤0.005%; and / or the mass fraction of S is a7, wherein 0<a7≤0.005%; and / or; In the aluminum alloy part, the following conditions are satisfied: the mass fraction of Al is b1, wherein 97.30%≤b1<100%; preferably, the following conditions are also satisfied: the mass fraction of Si is b2, wherein 0<b2≤0.75%; and / or the mass fraction of Fe is b3, wherein 0<b3≤0.35%; and / or the mass fraction of Mg is b4, wherein 0<b4≤1%; and / or the mass fraction of Cu is b5, wherein 0<b5≤0.1%; and / or the mass fraction of Mn is b6, wherein 0<b6≤0.1%; and / or the mass fraction of B is b7, wherein 0<b7≤0.1%; and / or the mass fraction of Zn is b8, wherein 0<b8≤0.25%; and / or the mass fraction of Ti is b9, wherein 0<b9≤0.05%.

4. The composite panel according to claim 1, characterized in that: The first alloy member includes an embedded member, and the embedded member of the first alloy member is embedded in the second alloy member; Alternatively, the second alloy member includes an embedded member, and the embedded member of the second alloy member is embedded in the first alloy member.

5. The composite panel according to claim 4, characterized in that: The dimension of the embedding part in the thickness direction of the composite plate is h1, which satisfies: h1<δ0, and 0<h1≤10mm.

6. The composite panel according to claim 4, characterized in that: There are a plurality of embedded parts of the first alloy part, and the plurality of embedded parts of the first alloy part are arranged at intervals in the length direction of the composite plate and / or in the width direction of the composite plate; Alternatively, there are multiple embedded parts of the second alloy member, and the multiple embedded parts of the second alloy member are arranged at intervals in the length direction of the composite plate and / or the width direction of the composite plate.

7. The composite panel according to claim 1, characterized in that: The composite plate further comprises a primer layer and a corrosion-resistant layer, wherein the primer layer wraps the main body, and the corrosion-resistant layer wraps the primer layer.

8. A method for preparing a composite board, characterized in that: The steps include: providing a first alloy and a semi-molten second alloy; The semi-molten second alloy is disposed on the first alloy and continuously cast and rolled to obtain a main body, wherein the main body is the main body of the composite plate according to any one of claims 1 to 7.

9. The method for preparing a composite board according to claim 8, characterized in that: Provide a semi-molten second alloy, including: providing an initial second alloy; Melting the initial second alloy to obtain a primary second alloy liquid; adding chemical elements to the primary second alloy liquid to obtain a secondary second alloy liquid; Refining and degassing the secondary second alloy liquid to obtain a tertiary second alloy liquid; The second alloy liquid is allowed to stand for three times to obtain the semi-molten second alloy.

10. The method for preparing a composite board according to claim 8, characterized in that: Providing a first alloy further comprising: providing an initial first alloy; Degreasing the initial first alloy to obtain a first-processed first alloy; deoxidizing the primary-treated first alloy to obtain a secondary-treated first alloy; The secondary treated first alloy is preheated to obtain the first alloy.

11. A heat dissipation device, characterized in that: The invention comprises a heat dissipation component and a composite plate according to any one of claims 1 to 7, wherein the composite plate dissipates heat from the heat dissipation component.

12. A vehicle, characterized in that: Comprising the heat dissipation device as claimed in claim 11.

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