A high-solid content epoxy molding compound composition, a high-solid content epoxy molding compound and a preparation method and application thereof

Abstract

The present invention relates to a high-solid content epoxy molding compound composition, a high-solid content epoxy molding compound and a preparation method and application thereof, wherein the composition comprises the following raw materials in percentage by mass: 88-92% filler, 3-7% epoxy resin, 3-5% phenolic resin, 0.05-0.2% accelerator, 0.1-0.5% stress release agent, 0.1-0.4% colorant, and 0.2-0.4% release agent. The preparation method is as follows: S1 melts and mixes the filler, epoxy resin, stress release agent, and colorant, and obtains a mixture A after crushing; S2 melts and mixes the filler, phenolic resin, accelerator, and release agent, and obtains a mixture B after crushing; S3 melts and mixes the mixture A and the mixture B, and obtains a high-solid content epoxy molding compound after crushing. Compared with the prior art, the epoxy molding compound prepared by the present invention has a high solid content, meets the V-0 flame retardant grade, has a high thermal conductivity, a low thermal expansion coefficient, a low water absorption rate, and good insulation.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic packaging, and in particular to a high-solid content epoxy molding compound and a preparation method and application thereof. Background Art

[0002] Epoxy molding compound is a thermosetting material used to protect semiconductor chips. It is mainly composed of fillers, resins and various additives. The selection, ratio and preparation process of each raw material will affect its molding performance. Traditionally, functional raw materials are added to improve its molding performance.

[0003] Since the filler content accounts for the majority of the plastic encapsulation material, its content has an important influence on the performance of the plastic encapsulation material. Increasing the filler content is also beneficial to improving thermal conductivity and flame retardancy, reducing thermal expansion coefficient, reducing water absorption, and increasing insulation. However, a higher filler content will bring about problems in processability, such as the inability to fully mix the resin and filler during melt mixing, thereby limiting further improvement of the performance of the plastic encapsulation material. The present invention achieves the densest packing by selecting fillers with appropriate particle size distribution, thereby making it possible to simultaneously increase the solid content and meet processability. Summary of the invention

[0004] The purpose of the present invention is to overcome the processability problems caused by the high filler content in the epoxy molding compound, thereby providing a high-solid content epoxy molding compound composition, a high-solid content epoxy molding compound and a preparation method and application thereof.

[0005] The purpose of the present invention can be achieved by the following technical solutions:

[0006] One of the technical solutions of the present invention is to provide a high solid content epoxy molding compound composition, comprising the following raw materials in percentage by mass:

[0007] Filler 88-92%, epoxy resin 3-7%, phenolic resin 3-5%, accelerator 0.05-0.2%, stress release agent 0.1-0.5%, colorant 0.1-0.4%, release agent 0.2-0.4%.

[0008] In some specific embodiments, the filler is selected from any one or more of silicon dioxide, aluminum oxide, aluminum nitride, boron nitride or silicon nitride.

[0009] In some specific embodiments, the epoxy resin is selected from any one or more of o-cresol epoxy resin, polyaromatic ring epoxy resin, and multifunctional epoxy resin.

[0010] In some specific embodiments, the phenolic resin is selected from any one or more of linear phenolic resin, polyaromatic ring phenolic resin, and multifunctional phenolic resin.

[0011] In some specific embodiments, the accelerator is TPP-BQ and / or 2-methylimidazole.

[0012] In some specific embodiments, the stress release agent is silicone oil.

[0013] In some embodiments, the colorant is carbon black.

[0014] In some specific embodiments, the release agent is carnauba wax and / or polyethylene wax.

[0015] In some specific embodiments, the filler particle size satisfies: D10<5 μm, D50<25 μm, D90≤60 μm.

[0016] The second technical solution of the present invention is to provide a method for preparing a high-solid content epoxy sealant, based on the high-solid content epoxy molding compound composition described in one of the above technical solutions,

[0017] The steps include:

[0018] S1, melt-mixing a portion of the filler, epoxy resin, stress release agent, and colorant in proportion, and crushing to obtain a mixture A;

[0019] S2, melt-mix the remaining portion of the filler, phenolic resin, accelerator, and release agent in proportion, and grind to obtain a mixture B;

[0020] S3, melt-mixing the mixture A and the mixture B, and crushing them to obtain a high-solid content epoxy molding compound.

[0021] In some specific embodiments, the mass ratio of the filler in step S1 to the filler in step S2 is 1:1.

[0022] In some specific embodiments, in step S1, the temperature of melt mixing is 70-90° C. and the time is 10-30 min.

[0023] In some specific embodiments, in step S2, the temperature of melt mixing is 70-90° C. and the time is 10-30 min.

[0024] In some specific embodiments, in step S3, the temperature of melt mixing is 70-90° C. and the time is 3-8 min.

[0025] The third technical solution of the present invention is to provide a high-solid content epoxy molding compound, which is obtained by the preparation method described in the second technical solution above.

[0026] A fourth technical solution of the present invention is to provide an application of the high-solid content epoxy molding compound as described in the third technical solution above, wherein the high-solid content epoxy molding compound is used in semiconductor packaging.

[0027] Compared with the prior art, the present invention has the following beneficial effects:

[0028] (1) The filler content of conventional epoxy molding compound products is generally below 85%, mainly because too high a filler content cannot be mixed evenly with the resin, thus affecting the performance of the molding compound. The present invention achieves the most dense packing by selecting fillers with appropriate particle size distribution, thereby making it possible to simultaneously increase the solid content and meet the processability.

[0029] (2) The high content of fillers makes the plastic encapsulation material intrinsically flame retardant, and can reach the V-0 flame retardant grade without the need for external flame retardants. The increase in filler content makes the prepared epoxy plastic encapsulation material have: higher thermal conductivity, which is more conducive to the heat dissipation of electronic devices; lower thermal expansion coefficient, reducing thermal stress and improving packaging reliability; lower water absorption, reducing the degradation of electrical performance caused by water; good insulation, improving the safety and reliability of electronic devices.

[0030] (3) The present invention uses only a conventional single device such as an open mixing mill to mix the materials, which is easy to operate and requires little equipment investment. DETAILED DESCRIPTION

[0031] The present invention is described in detail below in conjunction with specific embodiments. This embodiment is implemented based on the technical solution of the present invention, and provides a detailed implementation method and a specific operation process, but the protection scope of the present invention is not limited to the following embodiments.

[0032] In the following examples and comparative examples, unless otherwise specified, raw materials or processing techniques are conventional commercially available raw materials or conventional processing techniques in the art.

[0033] Experimental Materials:

[0034] (1) Multifunctional epoxy resin: purchased from Jinan Shengquan Group Co., Ltd., brand 331.

[0035] (2) Multifunctional phenolic resin: purchased from Jinan Shengquan Group Co., Ltd., brand KM80.

[0036] (3) o-Cresol type epoxy resin: purchased from Jinan Shengquan Group Co., Ltd., brand KL7M.

[0037] (4) Polyaromatic ring type phenolic resin: purchased from Jinan Shengquan Group Co., Ltd., brand KL65.

[0038] (5) Polyaromatic ring type epoxy resin: purchased from Jinan Shengquan Group Co., Ltd., brand number 323.

[0039] (6) Linear phenolic resin: purchased from Jinan Shengquan Group Co., Ltd., brand number 8011.

[0040] Embodiment 1:

[0041] This embodiment provides a high solid content epoxy molding compound, including the following raw materials of quality:

[0042] 176g silica (whose particle size distribution is D10=3μm, D50=21μm, D90=60μm), 13.9g multifunctional epoxy resin, 7.7g multifunctional phenolic resin, 0.2g TPP-BQ, 0.8g silicone oil, 0.8g carbon black, 0.6g carnauba wax, wherein the filler content is 88%.

[0043] The preparation method thereof comprises the following steps:

[0044] 1) 88g of silicon dioxide, 13.9g of multifunctional epoxy resin, 0.8g of silicone oil and 0.8g of carbon black were melt-mixed in an open mill. The temperature of the open mill was set to 85°C and the mixing time was 15min. After mixing evenly, the mixture was cooled and crushed to obtain a mixture A;

[0045] 2) 88g of silica, 7.7g of multifunctional phenolic resin, 0.2g of TPP-BQ, and 0.6g of carnauba wax were melted and mixed in an open mill. The temperature of the open mill was set to 80°C and the mixing time was 10min. After mixing evenly, the mixture was cooled and crushed to obtain a mixture B;

[0046] 3) Mixture A and mixture B are placed in an open mill for melting and mixing. The temperature of the open mill is set to 85°C and the mixing time is 5 minutes. After mixing evenly, the mixture is cooled and crushed to obtain a high solid content epoxy molding compound.

[0047] Embodiment 2:

[0048] This embodiment provides a high solid content epoxy molding compound, including the following raw materials of quality:

[0049] 184g silica (with a particle size distribution of D10=3μm, D50=21μm, D90=60μm), 7.1g o-cresol type epoxy resin, 6.6g polyaromatic ring type phenolic resin, 0.2g 2-methylimidazole, 1.0g silicone oil, 0.6g carbon black, 0.5g polyethylene wax, wherein the filler content is 92%.

[0050] The preparation method thereof comprises the following steps:

[0051] 1) 92g of silicon dioxide, 7.1g of o-cresol epoxy resin, 1.0g of silicone oil and 0.6g of carbon black were melt-mixed in an open mill. The temperature of the open mill was set to 70°C and the mixing time was 20min. After mixing evenly, the mixture was cooled and crushed to obtain a mixture A;

[0052] 2) 92g of silicon dioxide, 6.6g of polyaromatic ring phenolic resin, 0.2g of 2-methylimidazole and 0.5g of polyethylene wax were melt-mixed in an open mill. The temperature of the open mill was set to 75°C and the mixing time was 20min. After mixing evenly, the mixture was cooled and crushed to obtain a mixture B;

[0053] 3) Mixture A and mixture B are placed in an open mill for melting and mixing. The temperature of the open mill is set to 75°C and the mixing time is 3 minutes. After mixing evenly, the mixture is cooled and crushed to obtain a high solid content epoxy molding compound.

[0054] Embodiment 3:

[0055] This embodiment provides a high solid content epoxy molding compound, including the following raw materials of quality:

[0056] 180g aluminum nitride (whose particle size distribution is D10=2μm, D50=24μm, D90=55μm), 7.9g polyaromatic ring epoxy resin, 9.9g linear phenolic resin, 0.2g TPP-BQ, 0.8g silicone oil, 0.7g carbon black, 0.5g carnauba wax, wherein the filler content is 90%.

[0057] The preparation method thereof comprises the following steps:

[0058] 1) 90g aluminum nitride, 7.9g polyaromatic epoxy resin, 0.8g silicone oil and 0.7g carbon black were melt-mixed in an open mill. The temperature of the open mill was set to 80°C and the mixing time was 20min. After mixing evenly, the mixture was cooled and crushed to obtain a mixture A;

[0059] 2) 90g aluminum nitride, 9.9g polyaromatic ring phenolic resin, 0.2g TPP-BQ, and 0.5g polyethylene wax were melt-mixed in an open mill. The temperature of the open mill was set to 80°C and the mixing time was 20min. After mixing evenly, the mixture was cooled and crushed to obtain a mixture B;

[0060] 3) Mixture A and mixture B are placed in an open mill for melting and mixing. The temperature of the open mill is set to 80°C and the mixing time is 6 minutes. After mixing evenly, the mixture is cooled and crushed to obtain a high solid content epoxy molding compound.

[0061] The high solid content epoxy molding compound prepared in Examples 1 to 3 was subjected to performance testing: thermal conductivity, flame retardancy, thermal expansion coefficient, water absorption and volume resistivity tests were performed in accordance with GB / T 40564-2021.

[0062] The test results are shown in the table below:

[0063]

[0064] The above description of the embodiments is to facilitate the understanding and use of the invention by those skilled in the art. It is obvious that those skilled in the art can easily make various modifications to these embodiments and apply the general principles described herein to other embodiments without creative work. Therefore, the present invention is not limited to the above embodiments, and improvements and modifications made by those skilled in the art based on the disclosure of the present invention without departing from the scope of the present invention should be within the scope of protection of the present invention.

Claims

1. A high solid content epoxy molding compound composition, characterized in that: The invention comprises the following raw materials in percentage by mass: 88-92% of filler, 3-7% of epoxy resin, 3-5% of phenolic resin, 0.05-0.2% of accelerator, 0.1-0.5% of stress release agent, 0.1-0.4% of colorant and 0.2-0.4% of release agent.

2. The high solid content epoxy molding compound composition according to claim 1, characterized in that: The filler is selected from any one or more of silicon dioxide, aluminum oxide, aluminum nitride, boron nitride or silicon nitride; The epoxy resin is selected from any one or more of o-cresol epoxy resin, polyaromatic ring epoxy resin, and multifunctional epoxy resin; The phenolic resin is selected from any one or more of linear phenolic resin, polyaromatic ring phenolic resin and multifunctional phenolic resin; The accelerator is TPP-BQ and / or 2-methylimidazole; The stress release agent is silicone oil; The colorant is carbon black; The release agent is carnauba wax and / or polyethylene wax.

3. The high solid content epoxy molding compound composition according to claim 1, characterized in that: The filler particle size satisfies: D10<5μm, D50<25μm, D90≤60μm.

4. A method for preparing a high solid content epoxy sealant, characterized in that: Based on the high solid content epoxy molding compound composition according to any one of claims 1 to 3, The steps include: S1, melt-mixing a portion of the filler, epoxy resin, stress release agent, and colorant in proportion, and crushing to obtain a mixture A; S2, melt-mix the remaining portion of the filler, phenolic resin, accelerator, and release agent in proportion, and grind to obtain a mixture B; S3, melt-mixing the mixture A and the mixture B, and crushing them to obtain a high-solid content epoxy molding compound.

5. The preparation method according to claim 4, characterized in that: The mass ratio of the filler in step S1 to the filler in step S2 is 1:

1.

6. The preparation method according to claim 4, characterized in that: In step S1, the temperature of melt mixing is 70-90° C. and the time is 10-30 min.

7. The preparation method according to claim 4, characterized in that: In step S2, the temperature of melt mixing is 70-90°C and the time is 10-30 minutes.

8. The preparation method according to claim 4, characterized in that: In step S3, the temperature of melt mixing is 70-90° C. and the time is 3-8 min.

9. A high solid content epoxy molding compound, characterized in that: The high solid content epoxy molding compound is obtained by using the preparation method described in any one of claims 4 to 8.

10. An application of the high solid content epoxy molding compound as claimed in claim 9, characterized in that: The high solid content epoxy molding compound is used in semiconductor packaging.

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