Characterization device and characterization method thereof

Abstract

The invention relates to a characterization device and a characterization method thereof. The characterization device comprises a base, a conveying module, a rotating module, a first support, a second support, a calibration camera, a moving module and a characterization module. In the actual use process of the characterization device, the to-be-characterized part is calibrated through the calibration module and then is characterized, after machining is completed, the machined part can be subjected to morphology characterization through the characterization module so as to detect the machining effect, the characterization effect is good, and characterization deviation cannot occur.

Description

Technical Field

[0001] The present application relates to the technical field of material surface morphology characterization, and in particular to a characterization device and a characterization method thereof. Background Art

[0002] Material morphology characterization is an important branch of surface science, which aims to understand and characterize the properties of material surfaces. The properties affected by material morphology have an important impact on the actual application performance of the material, and are related to the physical, chemical, optical, electrical and other properties of the material. Therefore, morphology characterization is widely used in research fields such as material science, life science, geology, as well as in production and manufacturing scenarios such as failure detection and defect detection.

[0003] In the field of material surface morphology characterization, mainstream solutions include scanning electron microscope systems, atomic force microscope systems, depth of field microscope systems, confocal microscope systems, optical microscope systems, white light interferometry systems, and laser ranging systems.

[0004] However, the existing characterization devices cannot achieve high-precision positioning of the object to be characterized and high-precision characterization effect. If the object to be characterized has a small deviation, it will lead to abnormal characterization results. Summary of the invention

[0005] Based on this, it is necessary to provide a characterization device and a characterization method thereof to solve the problem that the existing characterization device cannot achieve high-precision positioning of the part to be characterized and high-precision characterization effect, and if a small amount of deviation occurs in the part to be characterized, abnormal characterization results will be caused.

[0006] A characterization device is used for characterizing the morphology of a part to be characterized, the characterization device comprising: a base, a transmission module, a rotation module, a first bracket, a second bracket, a calibration camera, a mobile module and a characterization module;

[0007] The transmission module is arranged on the base, the rotation module is arranged on the transmission module, the transmission module is used to drive the rotation module to move along the first direction and be able to transport to the processing assembly, and the rotation module is used to drive the part to be characterized to rotate around the axis of the second direction;

[0008] The first bracket and the second bracket are spaced apart on the base along the first direction, and the first bracket is located on a side of the second bracket away from the processing assembly;

[0009] The calibration camera is disposed on the first bracket and faces the transmission module;

[0010] The moving module is arranged on the second bracket, the characterization module is arranged on the moving module and faces the transmission module, and the moving module drives the characterization module to move along the third direction;

[0011] The second direction is a vertical direction, and the first direction, the second direction and the third direction are perpendicular to each other.

[0012] In actual use of the above-mentioned characterization device, the transmission module drives the rotating module to move along the first direction, and the rotating module can drive the part to be characterized to rotate around the axis of the second direction, and the calibration data of the part to be characterized is obtained through the calibration camera installed on the first bracket. According to the calibration data, the posture of the part to be characterized is adjusted by the rotating module and the transmission module, so that the part to be characterized with the posture adjustment is transported to the second bracket, and the depth of field microscope moves along the third direction and characterizes and collects the surface micro-nano structure of each characterization point spaced by a second distance along the third direction. The laser distance measuring device moves along the third direction and characterizes and collects the thickness data of the surface morphology of each characterization point spaced by a second distance along the third direction, so that the characterization is more accurate.

[0013] In one embodiment, the characterization device comprises two first brackets and two calibration cameras corresponding to each other;

[0014] The two first brackets are arranged on both sides of the conveying module along the third direction, and the calibration camera is arranged on the corresponding first bracket and faces the conveying module.

[0015] In one embodiment, the characterization module includes: a depth of field microscope device, a laser distance measuring device, and a support portion;

[0016] The support portion is disposed on the moving module and faces the transmission module, and the moving module drives the support portion to move along the third direction;

[0017] The depth-of-field microscope device and the laser distance measuring device are both arranged on the supporting part and face the transmission module.

[0018] In one embodiment, the characterization module further includes a positioning and calibration camera, and the positioning and calibration camera is disposed on the supporting portion.

[0019] In one embodiment, the characterization device further comprises a translation stage, and the calibration camera comprises a camera portion, a light source, and a telecentric lens;

[0020] The camera unit is disposed on the translation platform, and the translation platform is disposed on the first bracket and drives the camera unit to move along the second direction;

[0021] One end of the telecentric lens is connected to the camera unit and the other end faces the transmission module. The light source is arranged on the telecentric lens and faces the transmission module.

[0022] In one embodiment, the depth of field microscope device includes a depth of field microscope portion, a lifting portion, and a control portion;

[0023] The lifting part is arranged on the supporting part, the depth-of-field microscopic part is arranged on the lifting part, the depth-of-field microscopic part and the lifting part are both connected to the control part, and the control part is used to control the lifting part to drive the depth-of-field microscopic part to move along the second direction;

[0024] The control unit is used to control the imaging of the depth-of-field microscopy unit, and the depth-of-field microscopy unit transmits the generated three-dimensional image to the control unit.

[0025] An embodiment of the present application further provides a characterization method of a characterization device, wherein the characterization device is used to characterize the surface morphology of a component to be characterized. The characterization method of the characterization device comprises the following steps:

[0026] S100: transporting the rotating module along the first direction by means of a conveying module, and calibrating the posture of the object to be characterized according to the calibration signal of the calibration camera by means of the rotating module;

[0027] S200: the conveying module drives one end of the object to be characterized to move to the bottom of the characterization module;

[0028] S300: The moving module drives the supporting part to move along the third direction, so that the depth of field microscope device measures the three-dimensional image of multiple sites arranged at intervals along the third direction, and the laser ranging device measures the thickness of the sample to be measured at multiple sites arranged at intervals along the third direction.

[0029] In one embodiment, in the step of the laser distance measuring device measuring the thickness of the sample to be measured in the third direction;

[0030] When the laser distance measuring device measures the object to be characterized along the third direction, if the average value of the thickness of the sample to be measured at multiple measuring points at the position is higher than the sum of the allowable tolerance of the sample to be measured and the maximum thickness of the sample to be measured, or is lower than the difference between the minimum thickness of the sample to be measured and the allowable tolerance of the sample to be measured, then the measurement is abnormal;

[0031] If the average value of the thickness of the sample to be tested at all measuring points of the sample to be tested is higher than the sum of the allowable tolerance of the sample to be tested and the maximum thickness of the sample to be tested, or is lower than the difference between the minimum thickness of the sample to be tested and the allowable tolerance of the sample to be tested, the measurement is abnormal.

[0032] In one embodiment, in the step of measuring the three-dimensional images of multiple sites arranged at intervals along the third direction by the depth of field microscope device, the three-dimensional images of all sites are spliced ​​to obtain a three-dimensional image of the surface to be characterized of the workpiece to be measured.

[0033] In one embodiment, the characterization method of the characterization device further comprises the following steps:

[0034] S400: the conveying module drives the object to be represented to move a first distance away from the first bracket, and repeats step S300;

[0035] S500 : repeating step S400 multiple times until the object 210 to be characterized passes through the second bracket 150 .

[0036] In the process of using the above-mentioned characterization device to characterize the surface morphology of the part to be characterized, the transmission module drives the rotating module to move along the first direction, and the rotating module can drive the part to be characterized to rotate around the axis of the second direction, and the calibration data of the part to be characterized is obtained by the calibration camera installed on the first bracket. Specifically, reference points are marked at at least three corners of the part to be characterized, and two calibration cameras are arranged along the third direction, so that the inclination degree of the part to be characterized in the third direction can be measured and calibrated. Specifically, the two cameras respectively measure the coordinates of the two points at one end of the part to be characterized close to the processing component relative to the transmission module, and the above two coordinates form a straight line for comparison with the third direction. If the angle is 0, it means that the calibration is completed, and subsequent characterization and processing can be carried out. If the angle is not zero, the part to be characterized is rotated by controlling the rotating module, and calibration is performed again until the angle is 0, and then subsequent characterization and processing are carried out. According to the calibration data, the posture of the part to be characterized is adjusted by the rotating module and the transmission module, so that the part to be characterized with the posture adjusted is transported to the second bracket, and the surface morphology of the part to be characterized is characterized by the characterization module. The transmission module drives the part to be characterized to move a first distance along the first direction, and then the positioning calibration camera detects whether the part to be characterized has moved the first distance, and then a characterization point is taken at each second distance along the third direction for the part to be characterized at this position. The depth of field microscope moves along the third direction and characterizes and collects the surface micro-nano structure for each characterization point along the third direction at a second distance. The laser distance measuring device moves along the third direction and characterizes and collects the thickness data of the surface morphology for each characterization point along the third direction at a second distance, so that the characterization is more accurate. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 A top view of a processing system according to an embodiment.

[0038] Figure 2 for Figure 1 Side view of the first bracket in the figure.

[0039] Figure 3 for Figure 1 Side view of the second bracket.

[0040] Figure 4 for Figure 3 Side view of the middle support.

[0041] Figure 5 for Figure 4 Schematic diagram of camera calibration in .

[0042] Figure 6 for Figure 4 Schematic diagram of the medium depth of field microscopy setup.

[0043] Figure 7 Flow chart of a characterization method for a characterization device.

[0044] Description of Figure Numbers:

[0045] 100- characterization device;

[0046] 110- base;

[0047] 120-transmission module; 121-displacement stage;

[0048] 130-rotation module;

[0049] 140-first bracket;

[0050] 150-second bracket;

[0051] 160-calibration camera; 161-reference point; 162-camera unit; 163-light source; 164-telecentric lens;

[0052] 170-Mobile module;

[0053] 180-characterization module; 181-depth of field microscope device; 1811-depth of field microscope unit; 1812-lifting unit; 1813-control unit; 182-laser distance measuring device; 183-support unit; 184-positioning calibration camera;

[0054] 200-processing system; 210-parts to be characterized; 211-processed parts; 220-processing components;

[0055] OX-first direction; OY-second direction; OZ-third direction. DETAILED DESCRIPTION

[0056] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0057] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0058] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0059] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0060] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0061] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0062] See also Figure 1 , Figure 1 A structural schematic diagram of a characterization device 100 in an embodiment of the present application is shown. The characterization device 100 provided in an embodiment of the present application includes: a base 110, a transmission module 120, a rotation module 130, a first bracket 140, a second bracket 150, a calibration camera 160, a mobile module 170 and a characterization module 180.

[0063] See also Figure 1 and Figure 2 In the above-mentioned characterization device 100, the transmission module 120 is arranged on the base 110, and the rotating module 130 is arranged on the transmission module 120. The transmission module 120 is used to drive the rotating module 130 to move along the first direction OX and can be transported to the processing assembly 220. The rotating module 130 is used to drive the to-be-characterized object 210 to rotate around the axis of the second direction OY. The first bracket 140 and the second bracket 150 are arranged on the base 110 at intervals along the first direction OX, and the first bracket 140 is located on the side of the second bracket 150 away from the processing assembly 220. The calibration camera 160 is arranged on the first bracket 140 and faces the transmission module 120. The moving module 170 is arranged on the second bracket 150, and the characterization module 180 is arranged on the moving module 170 and faces the transmission module 120. The moving module 170 drives the characterization module 180 to move along the third direction OZ. The second direction OY is a vertical direction, and the first direction OX, the second direction OY and the third direction OZ are perpendicular to each other. The processing component may be a processing component of a laser processing system or a processing component of other processing systems, such as cutting or the like. Alternatively, only characterization may be performed without processing, that is, characterization data may be obtained after characterization is completed.

[0064] In actual use of the above-mentioned characterization device 100, the transmission module 120 drives the rotating module 130 to move along the first direction OX, and the rotating module 130 can drive the part to be characterized 210 to rotate around the axis of the second direction OY, and obtain the calibration data of the part to be characterized 210 through the calibration camera 160 installed on the first bracket 140. The posture of the part to be characterized 210 is adjusted by the rotating module 130 according to the calibration data, so that the part to be characterized 210 with the posture adjustment is transported to the second bracket 150 through 120. The surface morphology of the part to be characterized 210 is characterized by the characterization module 180 set on the second bracket 150, and the morphology data obtained by the characterization is transported to the subsequent processing component 220, so that the processing component 220 can perform precision processing on the part to be characterized 210. After the part to be characterized 210 is processed, it becomes a finished part 211. The conveying module 120 conveys the finished part 211 to the calibration camera 160 for calibration, and then the finished part 211 is characterized by the characterization module 180 to detect the processing effect. At the same time, the rotating module 130 can also drive the part to be characterized 210 to rotate, preferably 90°, so that the part to be characterized 210 can be processed at two angles, thereby improving the processing efficiency and processing effect, reducing the complexity of the subsequent processing assembly 220, that is, the processing assembly can only process along the third direction OZ to process any orientation of the part to be characterized 210, thereby improving the processing precision, efficiency and quality.

[0065] The processing component 220 in the laser processing system 200 includes a control module and a laser processing head. Other processing systems 200, such as cutting, corrosion and other systems, can be processed by the control module to control the cutting head or corrosion nozzle. The specific prior art will not be described in detail. The characterization data can be sent to the control module of the processing component 220 by signal connection, and the control module focuses and moves the laser processing head according to the above-mentioned characterization data to achieve precision processing of the part to be characterized.

[0066] See also Figure 1 and Figure 2 In one embodiment, the characterization device 100 includes two first brackets 140 and two calibration cameras 160 corresponding to each other. The two first brackets 140 are arranged on both sides of the transmission module 120 along the third direction OZ, and the calibration camera 160 is arranged on the corresponding first bracket 140 and faces the transmission module 120.

[0067] See also Figure 1, mark reference points 161 at at least three corners of the part to be characterized 210, and two calibration cameras 160 are set along the third direction OZ, so that the inclination degree of the third direction OZ of the part to be characterized 210 can be measured and calibrated. Specifically, the two cameras respectively measure the coordinates of the two points at one end of the part to be characterized 210 close to the processing component 220 relative to the transmission module 120, and form a straight line with the above two coordinates to compare with the third direction OZ. If the angle is 0, it means that the calibration is completed, and subsequent characterization and processing can be carried out. If the angle is not zero, the part to be characterized 210 is rotated by controlling the rotation module 130, and calibration is performed again until the angle is 0, and then subsequent characterization and processing are carried out. At the same time, special angle calibration can also be carried out. For example, if the calibration angle is 10° with the third direction OZ, the above two coordinates are calibrated to be 10° with the third direction OZ, and then subsequent processing is carried out. There is no limitation on special angles, and the above is only an example.

[0068] See also Figure 3 and Figure 4 In one embodiment, the characterization module 180 includes: a depth of field microscope device 181, a laser distance measuring device 182, and a support portion 183. The support portion 183 is disposed on the moving module 170 and faces the transmission module 120. The moving module 170 drives the support portion 183 to move along the third direction OZ. The depth of field microscope device 181 and the laser distance measuring device 182 are both disposed on the support portion 183 and face the transmission module 120.

[0069] Among them, the depth of field microscope device 181 is used to photograph the surface micro-nano structure of the surface to be characterized of the part to be characterized 210 or the processed part 211, and the laser ranging device 182 is used to characterize the thickness data of the surface morphology and form a three-dimensional structural diagram through data fitting methods such as interpolation analysis.

[0070] Specifically, the surface micro-nanostructure photographed by the depth-of-field microscope 181 and the thickness of the surface morphology measured by the laser ranging device 182 can be sent to the control module of the processing component 220 via a signal connection. The control module focuses and moves the laser processing head according to the above-mentioned characterization data to achieve precision processing of the part to be characterized.

[0071] Specifically, in the process of topography characterization, one may choose to measure the thickness of the surface topography only by the laser distance measuring device 182, or only the surface micro-nano structure photographed by the depth of field microscope device 181. The two may also be used together for characterization.

[0072] See also Figure 4In one embodiment, the characterization module 180 further includes a positioning and calibration camera 184, which is disposed on the support portion 183. The positioning and calibration camera 184 is used to detect whether the part 210 to be characterized has reached a position where morphological characterization is required. Specifically, the transmission module 120 drives the part 210 to be characterized to move a first distance along the first direction OX, and then the positioning and calibration camera 184 detects whether the part 210 to be characterized has moved the first distance, and then the part 210 to be characterized at this position takes a characterization point at intervals of a second distance along the third direction OZ. The depth-of-field microscope device 181 moves along the third direction OZ and characterizes and collects surface micro-nano structures for each characterization point at intervals of a second distance along the third direction OZ. The laser ranging device 182 moves along the third direction OZ and characterizes and collects thickness data of the surface morphology for each characterization point at intervals of a second distance along the third direction OZ.

[0073] See also Figure 5 In one embodiment, the characterization device 100 further includes a translation stage 121, and the calibration camera 160 includes a camera unit 162, a light source 163, and a telecentric lens 164. The camera unit 162 is disposed on the translation stage 121, and the translation stage 121 is disposed on the first bracket 140 and drives the camera unit 162 to move along the second direction OY. One end of the telecentric lens 164 is connected to the camera unit 162 and the other end faces the transmission module 120. The light source 163 is disposed on the side of the telecentric lens 164 or the side of the camera unit 162 and faces the transmission module 120.

[0074] Among them, the translation stage 121 drives the camera unit 162 to move along the second direction OY to change the distance of the camera unit relative to the object to be characterized, so as to achieve clear imaging of the reference point. The telecentric lens further ensures clear imaging when there is a certain fluctuation in the thickness of the characterized object or when it is used for a long time, thereby achieving more stable characterization imaging.

[0075] See also Figure 6 In one embodiment, the depth of field microscope device 181 includes a depth of field microscope section 1811, a lifting section 1812, and a control section 1813. The lifting section 1812 is disposed on the support section 183, and the depth of field microscope section 1811 is disposed on the lifting section 1812. The depth of field microscope section 1811 and the lifting section 1812 are both connected to the control section 1813, and the control section 1813 is used to control the lifting section 1812 to drive the depth of field microscope section 1811 to move along the second direction OY. The control section 1813 is used to control the depth of field microscope section 1811 to form an image, and the depth of field microscope section 1811 transmits the generated three-dimensional image to the control section 1813. Therefore, the lifting section 1812 can make the depth of field microscope section 1811 close to or away from the object to be characterized 210 to adjust the focus.

[0076] See also Figure 7An embodiment of the present application further provides a characterization method of a characterization device, wherein the characterization device 100 is used to characterize the surface morphology of the object 210 to be characterized. The characterization method of the characterization device includes the following steps:

[0077] S100 : The transmission module 120 and the rotation module 130 calibrate the posture of the object to be characterized 210 according to the calibration signal of the calibration camera 160 .

[0078] S200 : The conveying module 120 drives the end of the to-be-characterized object 210 close to the processing assembly 220 to move to the bottom of the characterization module 180 .

[0079] S300: The moving module 170 drives the supporting part 183 to move along the third direction OZ, so that the depth of field microscope device 181 measures the three-dimensional image of multiple sites arranged at intervals along the third direction OZ; and / or the laser ranging device 182 measures the thickness of the sample to be tested at multiple sites arranged at intervals along the third direction OZ.

[0080] S400: The conveying module 120 drives the object to be characterized 210 to move a first distance away from the first bracket, and repeats step S300.

[0081] S500 : repeating step S400 multiple times until the object 210 to be characterized passes through the second bracket 150 .

[0082] After step S300 is completed, local characterization data of the part to be characterized can be obtained. If the part to be characterized needs to be completely characterized, step S400 and step S500 are continued.

[0083] In the process of using the above-mentioned characterization device 100 to characterize the surface morphology of the object to be characterized 210, the transmission module 120 drives the rotating module 130 to move along the first direction OX, and the rotating module 130 can drive the object to be characterized 210 to rotate around the axis of the second direction OY, and the calibration data of the object to be characterized 210 is obtained by the calibration camera 160 installed on the first bracket 140. Specifically, the reference points 161 are marked at at least three corners of the object to be characterized 210, and two calibration cameras 160 are arranged along the third direction OZ, so that the inclination degree of the object to be characterized 210 in the third direction OZ can be measured and calibrated. Specifically, the two cameras respectively measure the coordinates of two points at one end of the object to be characterized 210 close to the processing component 220 relative to the transmission module 120, and the above two coordinates form a straight line and compare with the third direction OZ. If the angle is 0, it means that the calibration is completed, and subsequent characterization and processing can be carried out. If the angle is not zero, the object to be characterized 210 is rotated by controlling the rotating module 130, and calibration is performed again until the angle is 0, and then subsequent characterization and processing are carried out. According to the calibration data, the posture of the part to be characterized 210 is adjusted by the rotating module 130 and the transmission module, so that the part to be characterized 210 with the posture adjusted is transported to the second bracket 150, and the surface morphology of the part to be characterized 210 is characterized by the characterization module 180. The transmission module 120 drives the part to be characterized 210 to move a first distance along the first direction OX, and then the positioning calibration camera 184 detects whether the part to be characterized 210 has moved the first distance, and then the part to be characterized 210 at this position takes a characterization point at every second distance along the third direction OZ. The depth of field microscope 181 moves along the third direction OZ and characterizes and collects the surface micro-nano structure of each characterization point at a second distance along the third direction OZ. The laser distance measuring device 182 moves along the third direction OZ and characterizes and collects the thickness data of the surface morphology of each characterization point at a second distance along the third direction OZ. The depth of field microscope device 181 and the laser distance measuring device 182 can characterize the part to be characterized at the same time, or select one of them for characterization, as needed, so as to obtain the required characterization data. The morphological data obtained by the characterization is transmitted to the subsequent processing component 220, so that the processing component 220 can perform precision processing on the part to be characterized 210. After the part to be characterized 210 is processed, it becomes a processed part 211. The transmission module 120 transmits the processed part 211 to the calibration camera for calibration, and then the processed part 211 is morphologically characterized through the characterization module 180 to detect the processing effect. At the same time, the rotating module 130 can also drive the part to be characterized 210 to rotate, preferably 90°, so that the part to be characterized 210 can be processed at two angles, thereby improving the processing efficiency and processing effect, and reducing the complexity of the subsequent processing component 220, that is, the processing component can only set the processing part along the third direction OZ to process any angle of the part to be characterized 210, which improves the precision of the processing and improves the processing efficiency and quality.

[0084] In one embodiment, in the step of measuring the thickness of the sample to be measured in the third direction OZ by the laser distance measuring device 182: when the laser distance measuring device 182 measures the object to be characterized 210 along the third direction OZ, if the average value of the thickness of the sample to be measured at multiple measurement points at the position is higher than the sum of the allowable tolerance of the sample to be measured and the maximum thickness of the sample to be measured, or is lower than the difference between the minimum thickness of the sample to be measured and the allowable tolerance of the sample to be measured, then the measurement is abnormal. If the average value of the thickness of the sample to be measured at all measurement points of the sample to be measured is higher than the sum of the allowable tolerance of the sample to be measured and the maximum thickness of the sample to be measured, or is lower than the difference between the minimum thickness of the sample to be measured and the allowable tolerance of the sample to be measured, then the measurement is abnormal.

[0085] Specifically, when the laser ranging device 182 measures the part to be characterized 210 along the third direction OZ, if the average value of the thickness of the sample to be measured at multiple measuring points at the position is higher than the sum of the allowable tolerance of the sample to be measured and the maximum thickness of the sample to be measured, or is less than the difference between the minimum thickness of the sample to be measured and the allowable tolerance of the sample to be measured, the measurement is abnormal. This step only analyzes and alarms the data abnormality of a group of characterization points arranged along the third direction OZ. If the data of one point in a group of characterization points arranged along the third direction OZ is abnormal, data compensation can also be performed, such as the data compensation of the point is the average value of the data points on both sides of the point along the third direction OZ. It can also be compensated as the average value of a group of points along the third direction OZ, and the specific compensation method is not repeated. If the average value of the thickness of the sample to be measured at all measuring points of the sample to be measured is higher than the sum of the allowable tolerance of the sample to be measured and the maximum thickness of the sample to be measured, the measurement is abnormal. That is, if after completing the thickness characterization of the entire surface to be characterized, it is found that the average value of all points is greater than the sum of the allowable tolerance and the maximum height of the sample to be tested, or is less than the difference between the minimum thickness of the sample to be tested and the allowable tolerance of the sample to be tested, it means that the thickness measurement of the entire characterization process is abnormal, and a direct alarm is issued without the need for data compensation.

[0086] In this embodiment, an alarm module may be provided to be connected to the laser distance measuring device 182. When the measurement is abnormal, the alarm module alarm will prompt the operator that the measurement data is abnormal, and conduct an investigation.

[0087] In one embodiment, in the step of measuring the three-dimensional images of multiple sites arranged at intervals along the third direction OZ by the depth of field microscope device 181, the three-dimensional images of all sites are spliced ​​to obtain a three-dimensional image of the surface to be characterized of the workpiece to be measured. Thus, multiple three-dimensional images of the surface to be characterized along the third direction OZ can be formed by moving multiple first distances along the first direction OX, and a complete three-dimensional image can be formed by splicing.

[0088] The characterization device 100 can be used to characterize the part to be characterized, and can also be connected to a processing component to guide processing after characterization. Specifically, it is not limited to the field of laser processing, and can be applicable to any scenario requiring surface morphology characterization.

[0089] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0090] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A characterization device for performing morphological characterization on a part to be characterized, characterized in that: The characterization device comprises: a base, a transmission module, a rotation module, a first bracket, a second bracket, a calibration camera, a mobile module and a characterization module; The transmission module is arranged on the base, the rotation module is arranged on the transmission module, the transmission module is used to drive the rotation module to move along the first direction, and the rotation module is used to drive the object to be represented to rotate around the axis of the second direction; The first bracket and the second bracket are spaced apart and arranged on the base along the first direction; The calibration camera is disposed on the first bracket and faces the transmission module; The moving module is arranged on the second bracket, the characterization module is arranged on the moving module and faces the transmission module, and the moving module drives the characterization module to move along the third direction; The second direction is a vertical direction, and the first direction, the second direction and the third direction are perpendicular to each other.

2. The characterization device according to claim 1, characterized in that The characterization device comprises two first brackets and two calibration cameras corresponding to each other; The two first brackets are arranged on both sides of the conveying module along the third direction, and the calibration camera is arranged on the corresponding first bracket and faces the conveying module.

3. The characterization device according to claim 2, characterized in that The characterization module comprises: a depth of field microscope, a laser distance measuring device and a support part; The support portion is disposed on the moving module and faces the transmission module, and the moving module drives the support portion to move along the third direction; The depth-of-field microscope device and the laser distance measuring device are both arranged on the supporting part and face the transmission module.

4. The characterization device according to claim 3, characterized in that The characterization module further includes a positioning and calibration camera, and the positioning and calibration camera is disposed on the supporting portion.

5. The characterization device according to claim 3, characterized in that The characterization device further includes a translation stage, and the calibration camera includes a camera portion, a light source, and a telecentric lens; The camera unit is disposed on the translation platform, and the translation platform is disposed on the first bracket and drives the camera unit to move along the second direction; One end of the telecentric lens is connected to the camera unit and the other end faces the transmission module. The light source is arranged on the telecentric lens and faces the transmission module.

6. The characterization device according to claim 3, characterized in that The depth of field microscope device comprises a depth of field microscope part, a lifting part and a control part; The lifting part is arranged on the supporting part, the depth-of-field microscopic part is arranged on the lifting part, the depth-of-field microscopic part and the lifting part are both connected to the control part, and the control part is used to control the lifting part to drive the depth-of-field microscopic part to move along the second direction; The control unit is used to control the imaging of the depth-of-field microscopy unit, and the depth-of-field microscopy unit transmits the generated three-dimensional image to the control unit.

7. A characterization method for a characterization device, using the characterization device according to any one of claims 3 to 6 to characterize the surface morphology of a part to be characterized, characterized in that: The characterization method of the characterization device comprises the following steps: S100: transporting the rotating module along the first direction through the conveying module, and calibrating the posture of the object to be characterized according to the calibration signal of the calibration camera through the rotating module; S200: the conveying module drives one end of the object to be characterized to move to the bottom of the characterization module; S300: the moving module drives the supporting part to move along the third direction, so that the depth of field microscope device measures the three-dimensional images of a plurality of sites arranged at intervals along the third direction; and / or The laser distance measuring device is used to measure the thickness of the sample to be measured at a plurality of locations spaced apart along the third direction.

8. The characterization method of the characterization device according to claim 7, characterized in that: In the step of the laser distance measuring device measuring the thickness of the sample to be measured in the third direction; When the laser distance measuring device measures the object to be characterized along the third direction, if the average value of the thickness of the sample to be measured at multiple measuring points at the position is higher than the sum of the allowable tolerance of the sample to be measured and the maximum thickness of the sample to be measured, or is lower than the difference between the minimum thickness of the sample to be measured and the allowable tolerance of the sample to be measured, then the measurement is abnormal; If the average value of the thickness of the sample to be tested at all measuring points of the sample to be tested is higher than the sum of the allowable tolerance of the sample to be tested and the maximum thickness of the sample to be tested, or is lower than the difference between the minimum thickness of the sample to be tested and the allowable tolerance of the sample to be tested, the measurement is abnormal.

9. The characterization method of the characterization device according to claim 7, characterized in that: In the step of measuring the three-dimensional images of a plurality of sites arranged at intervals along the third direction by the depth of field microscope device, the three-dimensional images of all sites are spliced ​​to obtain a three-dimensional image of the surface to be characterized of the workpiece to be measured.

10. The characterization method of the characterization device according to claim 7, characterized in that: The characterization method of the characterization device further comprises the following steps: S400: the conveying module drives the object to be represented to move a first distance away from the first bracket, and repeats step S300; S500 : repeating step S400 multiple times until the object 210 to be characterized passes through the second bracket 150 .

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