Method for enhancing binding force between electrode and substrate of particulate matter sensor chip and chip

Abstract

The invention discloses a method for enhancing the binding force between an electrode and a substrate of a particulate matter sensor chip and the chip, and the method comprises the following steps: preparing electrode transition layer slurry which comprises a solvent, alumina powder, platinum powder and an additive; the preparation method comprises the following steps: weighing a solvent and an additive in proportion, and mixing in a homogenizer at 60r / min for 60min; placing the slurry tank in a water bath kettle, and heating at 60 DEG C for 120 minutes; the preparation method comprises the following steps: putting alumina powder and platinum powder into a slurry tank in proportion, putting the slurry tank into a homogenizer, and mixing for 60 minutes at 60 r / min; the problem of shrinkage mismatching caused by heterogeneous materials of the working electrode and the first base body is avoided, wrinkling and peeling of the working electrode are avoided, meanwhile, the working electrode is overprinted after the electrode transition layer is printed on the first base body, the binding force between the working electrode and the base body is improved, and the failure risk of the particulate matter sensor chip is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of particle sensor technology, and in particular to a method for enhancing the bonding force between an electrode and a substrate of a particle sensor chip and a chip. Background Art

[0002] In order to remove particulate matter from vehicle exhaust to meet environmental requirements and existing regulations, particulate matter filters (DPFs) are widely used in diesel vehicles. This is also the most effective particulate matter after-treatment technology currently available. At the same time, in order to ensure reliable regeneration of DPF and detect exhaust particulate matter concentration, a particulate matter sensor that can detect particulate matter concentration in real time needs to be installed downstream of the DPF.

[0003] The particulate matter sensor probe is installed in the exhaust passage and often works at higher temperatures. Therefore, the chip part of the sensor probe needs to have higher heat resistance and stability, and be able to withstand the impact of frequent temperature changes from low temperature to high temperature.

[0004] However, due to the difference in properties between the working electrode of the particle sensor chip and the first matrix material, the shrinkage of the electrode and the first matrix does not match during the sintering process, which can easily lead to electrode wrinkling and peeling, affecting the measurement accuracy and life.

[0005] At the same time, the particle sensor chip needs to work at a relatively high temperature and needs to withstand sudden temperature changes from high to low. However, since the working electrode of the chip needs to be exposed on the surface of the substrate, it is easy to cause the electrode to peel and fall off, affecting the working life of the particle sensor.

[0006] To this end, a method for enhancing the bonding force between an electrode and a substrate of a particle sensor chip and a chip are proposed. Summary of the invention

[0007] The object of the present invention is to provide a method for enhancing the bonding force between an electrode and a substrate of a particle sensor chip and a chip, so as to solve the problems raised in the above background technology.

[0008] To achieve the above object, the present invention provides the following technical solution: A method for enhancing the bonding force between an electrode and a substrate of a particle sensor chip, comprising the following steps:

[0009] S1. preparing an electrode transition layer slurry, wherein the transition layer slurry comprises a solvent, alumina powder, platinum powder and an additive;

[0010] S2, weigh the solvent and additives in proportion, place them in a homogenizer and mix at 60r / min for 60min;

[0011] S3. Place the slurry tank in a water bath and heat at 60°C for 120 min.

[0012] S4. Place alumina powder and platinum powder in a slurry tank according to the proportion, and place the slurry tank in a homogenizer and mix at 60r / min for 60min;

[0013] S5, rolling with a three-roller mill for 180 minutes;

[0014] S6. Use a viscometer to test the slurry viscosity in the range of 200-300 Pa·s;

[0015] S7, printing the transition layer slurry on the substrate, placing it in a 60°C oven for 30 minutes after printing, and then overprinting the working electrode;

[0016] S8. After the chip is prepared, it is sintered in a sintering furnace at 1430° C. for 120 minutes.

[0017] Preferably, in step S1, the solvent is ethyl cellulose or terpineol, and the additive is polyethylene glycol, butyral resin or phthalate.

[0018] Preferably, in step S1, the solvent is 10 to 30 parts, the alumina powder is 15 to 50 parts, the platinum powder is 10 to 50 parts, and the additive is 5 to 20 parts.

[0019] Preferably: in step S6, a #52 rotor is selected, the rotation speed is 1 rpm, and the test temperature is 25°C.

[0020] A chip prepared by the method for enhancing the bonding strength between an electrode and a substrate of a particulate matter sensor chip as described in any one of the above-mentioned methods comprises a first substrate, an electrode transition layer is provided on the upper surface of the first substrate, a reaction part of a working electrode is provided on the electrode transition layer, the working electrode further comprises a first reaction electrode and a second reaction electrode, and an aluminum oxide protective layer is provided on the first reaction electrode and the second reaction electrode.

[0021] Preferably, a static electricity extraction electrode is provided between the first reaction electrode and the second reaction electrode, and the static electricity extraction electrode is located on the upper surface of the first substrate.

[0022] Preferably, a heating electrode is disposed on the lower surface of the first substrate, and a second substrate is disposed on the lower surface of the heating electrode.

[0023] Preferably, two heating electrode wires are connected to the heating electrode, a temperature measuring electrode wire is provided on the surface of the second substrate, and the temperature measuring electrode wire is located between the two heating electrode wires.

[0024] Preferably, the heating electrode wire and the temperature measuring electrode wire are respectively connected to the heating electrode pin and the temperature measuring electrode pin through the conducting hole.

[0025] Compared with the prior art, the beneficial effects of the present invention are: avoiding the problem of shrinkage mismatch caused by the heterogeneity of the working electrode and the first substrate material, avoiding wrinkles and peeling of the working electrode, and at the same time, overprinting the working electrode after printing the electrode transition layer on the first substrate, thereby improving the bonding force between the working electrode and the substrate and reducing the risk of failure of the particulate matter sensor chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic diagram of the chip structure of the present invention.

[0027] In the figure: 1, first substrate; 2, second substrate; 10, aluminum oxide protective layer; 11, electrode transition layer; 20, working electrode; 21, first reaction electrode; 22, second reaction electrode; 23, electrostatic extraction electrode; 24, heating electrode; 25, heating electrode wire; 26, temperature measuring electrode wire; 27, heating electrode pin; 28, temperature measuring electrode pin. DETAILED DESCRIPTION

[0028] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0029] The present invention provides a technical solution: a method for enhancing the bonding force between an electrode and a substrate of a particle sensor chip, comprising the following steps:

[0030] S1. preparing an electrode transition layer slurry, wherein the transition layer slurry comprises 10 to 30 parts of a solvent, 15 to 50 parts of alumina powder, 10 to 50 parts of platinum powder and 5 to 20 parts of an additive;

[0031] The solvents are ethyl cellulose and pinene alcohol, and the additives are polyethylene glycol, butyral resin, and phthalate;

[0032] S2, weigh the solvent and additives in proportion, place them in a homogenizer and mix at 60r / min for 60min;

[0033] S3. Place the slurry tank in a water bath and heat at 60°C for 120 min.

[0034] S4. Place alumina powder and platinum powder in a slurry tank according to the proportion, and place the slurry tank in a homogenizer and mix at 60r / min for 60min;

[0035] S5, rolling with a three-roller mill for 180 minutes;

[0036] S6. Use a viscometer, select a #52 rotor, a speed of 1 rpm, a test temperature of 25°C, and test the slurry viscosity in the range of 200 to 300 Pa·s;

[0037] S7, printing the transition layer slurry on the substrate, placing it in a 60°C oven for 30 minutes after printing, and then overprinting the working electrode;

[0038] S8. After the chip is prepared, it is sintered in a sintering furnace at 1430° C. for 120 minutes.

[0039] Example 1

[0040] 30 parts of solvent and 10 parts of additives were placed in a homogenizer and mixed at 60r / min for 60min; the slurry tank was placed in a water bath and heated at 60℃ for 120min;

[0041] 35 parts of alumina powder and 25 parts of platinum powder were placed in a slurry tank, placed in a homogenizer and mixed at 60 r / min for 60 min, and rolled on a three-roll mill for 180 min;

[0042] Select #52 rotor, speed 1rpm, test temperature 25℃, test slurry viscosity 218Pa·s;

[0043] The slurry is printed on the first substrate, and after printing, it is placed in a 60°C oven for 30 minutes before overprinting the working electrode;

[0044] After the chip is prepared, it is sintered in a sintering furnace at 1430°C for 120 minutes.

[0045] Example 2

[0046] 25 parts of solvent and 15 parts of additives were placed in a homogenizer and mixed at 60r / min for 60min; the slurry tank was placed in a water bath and heated at 60℃ for 120min;

[0047] 40 parts of alumina powder and 20 parts of platinum powder were placed in a slurry tank, placed in a homogenizer and mixed at 60 r / min for 60 min, and rolled on a three-roll mill for 180 min;

[0048] Select #52 rotor, speed 1rpm, test temperature 25℃, test slurry viscosity 253Pa·s;

[0049] The slurry is printed on the first substrate, and after printing, it is placed in a 60°C oven for 30 minutes before overprinting the working electrode;

[0050] After the chip is prepared, it is sintered in a sintering furnace at 1430°C for 120 minutes.

[0051] Example 3

[0052] 25 parts of solvent and 15 parts of additives were placed in a homogenizer and mixed at 60r / min for 60min; the slurry tank was placed in a water bath and heated at 60℃ for 120min;

[0053] 30 parts of alumina powder and 30 parts of platinum powder were placed in a slurry tank, placed in a homogenizer and mixed at 60 r / min for 60 min, and rolled on a three-roll mill for 180 min;

[0054] Select #52 rotor, speed 1rpm, test temperature 25℃, test slurry viscosity 235Pa·s;

[0055] The slurry is printed on the first substrate, and after printing, it is placed in a 60°C oven for 30 minutes before overprinting the working electrode;

[0056] After the chip is prepared, it is sintered in a sintering furnace at 1430°C for 120 minutes.

[0057] Example 4

[0058] 30 parts of solvent and 10 parts of additives were placed in a homogenizer and mixed at 60r / min for 60min; the slurry tank was placed in a water bath and heated at 60℃ for 120min;

[0059] 45 parts of alumina powder and 15 parts of platinum powder were placed in a slurry tank, placed in a homogenizer and mixed at 60 r / min for 60 min, and rolled on a three-roll mill for 180 min;

[0060] Select #52 rotor, speed 1rpm, test temperature 25℃, test slurry viscosity 243Pa·s;

[0061] The slurry is printed on the first substrate, and after printing, it is placed in a 60°C oven for 30 minutes before overprinting the working electrode;

[0062] After the chip is prepared, it is sintered in a sintering furnace at 1430°C for 120 minutes.

[0063] Example 5

[0064] 20 parts of solvent and 10 parts of additive were placed in a homogenizer and mixed at 60r / min for 60min; the slurry tank was placed in a water bath and heated at 60℃ for 120min;

[0065] 25 parts of alumina powder and 45 parts of platinum powder were placed in a slurry tank, placed in a homogenizer and mixed at 60 r / min for 60 min, and rolled on a three-roll mill for 180 min;

[0066] Select #52 rotor, speed 1rpm, test temperature 25℃, test slurry viscosity 265Pa·s;

[0067] The slurry is printed on the first substrate, and after printing, it is placed in a 60°C oven for 30 minutes before overprinting the working electrode;

[0068] After the chip is prepared, it is sintered in a sintering furnace at 1430°C for 120 minutes.

[0069] At the same time, for better comparison, a comparative example is set up. In the comparative example, the electrode transition layer is not printed on the first substrate, and the working electrode is directly printed and dried at 60° C. for 30 minutes. After the chip is prepared, it is sintered at 1430° C. in a sintering furnace for 120 minutes.

[0070] The products produced in the above-mentioned embodiments 1-5 and comparative examples were tested, and the following test results were obtained as shown in Table 1.

[0071]

[0072] Table 1

[0073] From the test results in Table 1, we can see that printing the electrode transition layer on the first substrate and then overprinting the working electrode avoids the shrinkage mismatch caused by the heterogeneity of the working electrode and the first substrate material, and avoids wrinkling and peeling of the working electrode. At the same time, overprinting the working electrode after printing the electrode transition layer on the first substrate improves the bonding force between the working electrode and the substrate, reducing the risk of failure of the particle sensor chip.

[0074] The chip prepared by the above-mentioned method of enhancing the bonding force between the electrode and the substrate of the particle sensor chip, such as Figure 1 As shown, an electrode transition layer 11 is provided on the upper surface of the first substrate 1, and the reaction part of the working electrode 20 is located on the electrode transition layer 11. The reaction part composed of the first reaction electrode 21 and the second reaction electrode 22 is a pair of working electrodes 20 that are not connected to each other, and the concentration of deposited particles is measured by the current generated by the reaction part of the working electrode 20. The working electrode 20 also includes a static electricity extraction electrode 23, which is located on the upper surface of the first substrate 1 and is used to extract static electricity. A layer of aluminum oxide protective layer 10 is covered above the wires of the first reaction electrode 21 and the second reaction electrode 22.

[0075] The heating electrode 24 is located on the second substrate 2, and the heating electrode 24 is connected to the heating electrode wire 25. The heating electrode 24 is used to heat the working electrode 20. A temperature measuring electrode wire 26 is also provided on the surface of the second substrate 2. The temperature measuring electrode wire 26 is used to test the chip temperature. The heating electrode wire 25 and the temperature measuring electrode wire 26 are respectively connected to the heating electrode pin 27 and the temperature measuring electrode pin 28 through the conducting hole.

[0076] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A method for enhancing the bonding strength between an electrode and a substrate of a particle sensor chip, characterized in that: The following steps are involved: S1. preparing an electrode transition layer slurry, wherein the transition layer slurry comprises a solvent, alumina powder, platinum powder and an additive; S2, weigh the solvent and additives in proportion, place them in a homogenizer and mix at 60r / min for 60min; S3. Place the slurry tank in a water bath and heat at 60°C for 120 min. S4. Place alumina powder and platinum powder in a slurry tank according to the proportion, and place the slurry tank in a homogenizer and mix at 60r / min for 60min; S5, rolling with a three-roller mill for 180 minutes; S6. Use a viscometer to test the slurry viscosity in the range of 200-300 Pa·s; S7, printing the transition layer slurry on the substrate, placing it in a 60°C oven for 30 minutes after printing, and then overprinting the working electrode; S8. After the chip is prepared, it is sintered in a sintering furnace at 1430° C. for 120 minutes.

2. The method for enhancing the bonding strength between the electrode and the substrate of a particle sensor chip according to claim 1, characterized in that: In step S1, the solvent is ethyl cellulose and terpineol, and the additive is polyethylene glycol, butyral resin, and phthalate.

3. The method for enhancing the bonding strength between the electrode and the substrate of a particle sensor chip according to claim 1, characterized in that: In the step S1, the solvent is 10 to 30 parts, the alumina powder is 15 to 50 parts, the platinum powder is 10 to 50 parts, and the additive is 5 to 20 parts.

4. The method for enhancing the bonding strength between the electrode and the substrate of a particle sensor chip according to claim 1, characterized in that: In step S6, a #52 rotor is selected, the rotation speed is 1 rpm, and the test temperature is 25°C.

5. A chip prepared by the method for enhancing the bonding force between an electrode and a substrate of a particle sensor chip according to any one of claims 1 to 4, characterized in that: The invention comprises a first substrate (1), wherein an electrode transition layer (11) is provided on the upper surface of the first substrate (1), a reaction portion of a working electrode (20) is provided on the electrode transition layer (11), the working electrode (20) further comprises a first reaction electrode (21) and a second reaction electrode (22), and an aluminum oxide protective layer (10) is provided on the first reaction electrode (21) and the second reaction electrode (22).

6. The chip prepared by the method for enhancing the bonding force between the electrode and the substrate of the particle sensor chip according to claim 5, characterized in that: An electrostatic extraction electrode (23) is provided between the first reaction electrode (21) and the second reaction electrode (22), and the electrostatic extraction electrode (23) is located on the upper surface of the first substrate (1).

7. The chip prepared by the method for enhancing the bonding force between the electrode and the substrate of the particle sensor chip according to claim 5, characterized in that: A heating electrode (24) is provided on the lower surface of the first substrate (1), and a second substrate (2) is provided on the lower surface of the heating electrode (24).

8. The chip prepared by the method for enhancing the bonding force between the electrode and the substrate of the particle sensor chip according to claim 7, characterized in that: The heating electrode (24) is connected to two heating electrode wires (25), and a temperature measuring electrode wire (26) is provided on the surface of the second substrate (2), wherein the temperature measuring electrode wire (26) is located between the two heating electrode wires (25).

9. The chip prepared by the method for enhancing the bonding force between the electrode and the substrate of the particle sensor chip according to claim 8, characterized in that: The heating electrode wire (25) and the temperature measuring electrode wire (26) are respectively connected to a heating electrode pin (27) and a temperature measuring electrode pin (28) through a conducting hole.

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