Method for enhancing the binding force of a particulate matter sensor chip's electrodes to the substrate and chip

Abstract

The application discloses a method for enhancing the bonding force between a particulate matter sensor chip electrode and a substrate and a chip, and comprises the following steps: preparing an electrode transition layer slurry, wherein the transition layer slurry comprises a solvent, aluminum oxide powder, platinum powder and an additive; weighing the solvent and the additive according to a proportion and mixing them in a homogenizer at 60 r / min for 60 min; placing a slurry tank in a water bath pot and heating at 60 DEG C for 120 min; placing the aluminum oxide powder and the platinum powder in the slurry tank according to a proportion and mixing them in the homogenizer at 60 r / min for 60 min; the method avoids the problem of shrinkage mismatch caused by the heterogeneity between the working electrode and the first substrate material, avoids the wrinkling and peeling of the working electrode, and improves the bonding force between the working electrode and the substrate by printing the working electrode after printing the electrode transition layer on the first substrate, thereby reducing the failure risk of the particulate matter sensor chip.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of particulate matter sensor, in particular to a method for enhancing the binding force between the electrode and the substrate of a particulate matter sensor chip and the chip. BACKGROUND

[0002] In order to remove particulate matter in vehicle exhaust to meet environmental requirements and existing regulations, a particulate matter collector (DPF) is widely used on diesel vehicles, which is also the most effective particulate matter aftertreatment technology at present. In order to ensure the reliable regeneration of the DPF and detect the concentration of exhaust particulate matter, a particulate matter sensor capable of real-time detection of particulate matter concentration needs to be installed downstream of the DPF.

[0003] The probe of the particulate matter sensor is installed in the exhaust passage and often works at a high temperature. Therefore, the chip part of the sensor probe needs to have high heat resistance, stability, and be able to withstand the impact of frequent temperature changes from low to high.

[0004] However, due to the difference in properties between the working electrode of the particulate matter sensor chip and the first substrate material, the shrinkage of the electrode and the first substrate does not match during the sintering process, which easily leads to electrode wrinkling and peeling, affecting the measurement accuracy and service life.

[0005] At the same time, the particulate matter sensor chip needs to work at a high temperature and needs to withstand the impact of temperature changes from high to low. However, since the working electrode of the chip needs to be exposed on the surface of the substrate, it is easy to cause the electrode to peel and fall off, affecting the service life of the particulate matter sensor.

[0006] Therefore, a method for enhancing the binding force between the electrode and the substrate of a particulate matter sensor chip and the chip are proposed. SUMMARY

[0007] The purpose of the present application is to provide a method for enhancing the binding force between the electrode and the substrate of a particulate matter sensor chip and the chip to solve the problems raised in the background art.

[0008] To achieve the above purpose, the present application provides the following technical solution: a method for enhancing the binding force between the electrode and the substrate of a particulate matter sensor chip, comprising the following steps:

[0009] S1, preparing an electrode transition layer slurry, the transition layer slurry comprising a solvent, aluminum oxide powder, platinum powder and an additive;

[0010] S2, weighing the solvent and the additive according to the proportion and placing them in a homogenizer for mixing at 60 r / min for 60 min;

[0011] S3, placing the slurry tank in a water bath pot and heating at 60℃ for 120 min;

[0012] S4, put the alumina powder and platinum powder in the slurry tank in proportion, put the slurry tank in the homogenizer and mix for 60 min at 60 r / min;

[0013] S5, roll for 180 min by using a three-roll machine;

[0014] S6, test the viscosity of the slurry by using a viscometer, and the viscosity range is 200-300 Pa·s;

[0015] S7, print the transition layer slurry on the substrate, and then stack the working electrode after being placed in the 60℃ oven for 30 min;

[0016] S8, after the chip is prepared, sinter it in the sintering furnace at 1430℃ for 120 min.

[0017] Preferably, in the step S1, the solvent is ethyl cellulose and terpineol, and the additive is polyethylene glycol, butylal resin and phthalate.

[0018] Preferably, in the step S1, the solvent is 10-30 parts, the alumina powder is 15-50 parts, the platinum powder is 10-50 parts, and the additive is 5-20 parts.

[0019] Preferably, in the step S6, a #52 rotor is selected, the rotation speed is 1 rpm, and the test temperature is 25℃.

[0020] The chip prepared by the method for enhancing the bonding force between the particle sensor chip enhanced electrode and the substrate according to any one of the above embodiments comprises a first substrate, an electrode transition layer is arranged on the upper surface of the first substrate, a reaction part of a working electrode is arranged on the electrode transition layer, the working electrode further comprises a first reaction electrode and a second reaction electrode, and an alumina protective layer is arranged on the first reaction electrode and the second reaction electrode.

[0021] Preferably, an electrostatic leading electrode is arranged between the first reaction electrode and the second reaction electrode, and the electrostatic leading electrode is located on the upper surface of the first substrate.

[0022] Preferably, a heating electrode is arranged on the lower surface of the first substrate, and a second substrate is arranged on the lower surface of the heating electrode.

[0023] Preferably, two heating electrode leads are connected to the heating electrode, a temperature measuring electrode lead is arranged on the surface of the second substrate, and the temperature measuring electrode lead is located between the two heating electrode leads.

[0024] Preferably, the heating electrode lead and the temperature measuring electrode lead are respectively connected to a heating electrode pin and a temperature measuring electrode pin through a through hole.

[0025] Compared with the prior art, the present application has the beneficial effects that the problem of shrinkage mismatch caused by the heterogeneity of the working electrode and the first base material is avoided, the working electrode is not wrinkled and peeled, the working electrode is printed after the first base printed electrode transition layer, the bonding force between the working electrode and the base is improved, and the risk of failure of the particulate matter sensor chip is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 The figure is a schematic diagram of the chip structure of the present application.

[0027] In the figure: 1, first base; 2, second base; 10, alumina protective layer; 11, electrode transition layer; 20, working electrode; 21, first reaction electrode; 22, second reaction electrode; 23, static electricity leading-out electrode; 24, heating electrode; 25, heating electrode lead wire; 26, temperature measuring electrode lead wire; 27, heating electrode pin; 28, temperature measuring electrode pin. DETAILED DESCRIPTION

[0028] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application.

[0029] The present application provides a technical solution: a method for enhancing the bonding force between the electrode and the base of a particulate matter sensor chip, comprising the following steps:

[0030] S1, preparing an electrode transition layer slurry, the transition layer slurry comprising 10-30 parts of a solvent, 15-50 parts of alumina powder, 10-50 parts of platinum powder, and 5-20 parts of an additive;

[0031] The solvent is ethyl cellulose and terpineol, and the additive is polyethylene glycol, butylal resin, and phthalate ester;

[0032] S2, weighing the solvent and the additive according to the proportion and placing them in a homogenizer for mixing at 60 r / min for 60 min;

[0033] S3, placing the slurry tank in a water bath pot and heating at 60℃ for 120 min;

[0034] S4, placing the alumina powder and the platinum powder in the slurry tank according to the proportion, and placing the slurry tank in the homogenizer for mixing at 60 r / min for 60 min;

[0035] S5, rolling with a three-roll machine for 180 min;

[0036] S6, testing the slurry viscosity range at 200-300 Pa·s by using a viscometer, selecting a #52 rotor, a rotation speed of 1 rpm, and a test temperature of 25℃;

[0037] S7, print the transition layer slurry on the substrate, and after printing, place in a 60℃ oven for 30min, and then stack the working electrode;

[0038] S8, after the chip is prepared, sinter in a sintering furnace at 1430℃ for 120min.

[0039] Example 1

[0040] Put 30 parts of solvent and 10 parts of additive into a homogenizer, mix at 60r / min for 60min; place the slurry tank in a water bath, heat at 60℃ for 120min;

[0041] Put 35 parts of alumina powder and 25 parts of platinum powder into a slurry tank, place in a homogenizer, mix at 60r / min for 60min, and roll in a three-roll machine for 180min;

[0042] Select a #52 rotor, rotate at 1rpm, test at 25℃, and the viscosity of the slurry is 218Pa·s;

[0043] Print the slurry on the first substrate, and after printing, place in a 60℃ oven for 30min, and then stack the working electrode;

[0044] After the chip is prepared, sinter in a sintering furnace at 1430℃ for 120min.

[0045] Example 2

[0046] Put 25 parts of solvent and 15 parts of additive into a homogenizer, mix at 60r / min for 60min; place the slurry tank in a water bath, heat at 60℃ for 120min;

[0047] Put 40 parts of alumina powder and 20 parts of platinum powder into a slurry tank, place in a homogenizer, mix at 60r / min for 60min, and roll in a three-roll machine for 180min;

[0048] Select a #52 rotor, rotate at 1rpm, test at 25℃, and the viscosity of the slurry is 253Pa·s;

[0049] Print the slurry on the first substrate, and after printing, place in a 60℃ oven for 30min, and then stack the working electrode;

[0050] After the chip is prepared, sinter in a sintering furnace at 1430℃ for 120min.

[0051] Example 3

[0052] Put 25 parts of solvent and 15 parts of additive into a homogenizer, mix at 60r / min for 60min; place the slurry tank in a water bath, heat at 60℃ for 120min;

[0053] Put 30 parts of alumina powder and 30 parts of platinum powder in a slurry tank, place in a homogenizer at 60 r / min for 60 min, and roll in a three-roll machine for 180 min;

[0054] Select #52 rotor, rotate at 1 rpm, test temperature 25℃, and test slurry viscosity 235 Pa·s;

[0055] Print the slurry on the first substrate, and after printing, place in a 60℃ oven for 30 min before stacking the working electrode;

[0056] After the chip is prepared, sinter it in a sintering furnace at 1430℃ for 120 min.

[0057] Example 4

[0058] Put 30 parts of solvent and 10 parts of additive in a homogenizer, mix at 60 r / min for 60 min; place the slurry tank in a water bath, heat at 60℃ for 120 min;

[0059] Put 45 parts of alumina powder and 15 parts of platinum powder in a slurry tank, place in a homogenizer at 60 r / min for 60 min, and roll in a three-roll machine for 180 min;

[0060] Select #52 rotor, rotate at 1 rpm, test temperature 25℃, and test slurry viscosity 243 Pa·s;

[0061] Print the slurry on the first substrate, and after printing, place in a 60℃ oven for 30 min before stacking the working electrode;

[0062] After the chip is prepared, sinter it in a sintering furnace at 1430℃ for 120 min.

[0063] Example 5

[0064] Put 30 parts of solvent and 10 parts of additive in a homogenizer, mix at 60 r / min for 60 min; place the slurry tank in a water bath, heat at 60℃ for 120 min;

[0065] Put 45 parts of alumina powder and 15 parts of platinum powder in a slurry tank, place in a homogenizer at 60 r / min for 60 min, and roll in a three-roll machine for 180 min;

[0066] Select #52 rotor, rotate at 1 rpm, test temperature 25℃, and test slurry viscosity 243 Pa·s;

[0067] Print the slurry on the first substrate, and after printing, place in a 60℃ oven for 30 min before stacking the working electrode;

[0068] After the chip is prepared, sinter it in a sintering furnace at 1430℃ for 120 min.

[0069] Meanwhile, to better compare the results, a comparative example was set up. The comparative example was that the working electrode was directly printed without printing the electrode transition layer on the first substrate, dried at 60°C for 30 minutes, and then sintered in a sintering furnace at 1430°C for 120 minutes after the chip was prepared.

[0070] The products produced in Examples 1-5 and the comparative examples were tested, and the following test results are shown in Table 1.

[0071]

[0072] Table 1

[0073] Based on the test results in Table 1, we can see that overlaying the working electrode after printing the electrode transition layer on the first substrate avoids the shrinkage mismatch caused by the heterogeneity of the working electrode and the first substrate material, thus preventing wrinkles and peeling of the working electrode. Furthermore, overlaying the working electrode after printing the electrode transition layer on the first substrate improves the bonding force between the working electrode and the substrate, reducing the risk of particulate sensor chip failure.

[0074] The chip prepared by the above-mentioned method for enhancing the bonding force between the electrode and the substrate in a particulate sensor chip, such as... Figure 1 As shown, an electrode transition layer 11 is provided on the upper surface of the first substrate 1. The reaction portion of the working electrode 20 is located on the electrode transition layer 11. The reaction portion, composed of the first reaction electrode 21 and the second reaction electrode 22, forms a pair of non-conductive working electrodes 20. The concentration of deposited particles is measured by the current generated by the reaction portion of the working electrode 20. The working electrode 20 also includes an electrostatic discharge electrode 23, which is located on the upper surface of the first substrate 1 and is used to discharge static electricity. An aluminum oxide protective layer 10 covers the conductors of the first reaction electrode 21 and the second reaction electrode 22.

[0075] The heating electrode 24 is located on the second substrate 2 and is connected to the heating electrode wire 25. The heating electrode 24 is used to heat the working electrode 20. The surface of the second substrate 2 is also provided with a temperature measuring electrode wire 26, which is used to test the chip temperature. The heating electrode wire 25 and the temperature measuring electrode wire 26 are connected to the heating electrode pin 27 and the temperature measuring electrode pin 28 respectively through the through hole.

[0076] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A method of enhancing the binding of a particulate matter sensor chip's electrodes to a substrate, characterized by, It comprises the following steps: S1, preparing electrode transition layer slurry, the transition layer slurry comprises solvent, alumina powder, platinum powder and additives, the solvent is ethyl cellulose and terpineol, the additives are polyethylene glycol, butylal resin and phthalate, the solvent is 10-30 parts, the alumina powder is 15-50 parts, the platinum powder is 10-50 parts, and the additives are 5-20 parts; S2, the solvent and the additives are weighed according to the proportion and placed in the homogenizer for mixing at 60r / min for 60min; S3, the slurry tank is placed in the water bath kettle, heated at 60℃ for 120min; S4, the alumina powder and the platinum powder are placed in the slurry tank according to the proportion, and the slurry tank is placed in the homogenizer for mixing at 60r / min for 60min; S5, using three-roller machine rolling for 180min; S6, using a viscometer, the slurry viscosity range is 200-300Pa·s; S7, printing the transition layer slurry on the substrate, after printing, placing in the 60℃ oven for 30min, and then stacking the working electrode; S8, after the chip is prepared, sintering in the sintering furnace at 1430℃ for 120min.

2. The method of claim 1, wherein: In the step S6, #52 rotor is selected, the rotating speed is 1rpm, and the test temperature is 25℃.

3. The chip prepared according to the method of claims 1-2 for enhancing the binding force between the electrode and the substrate, characterized in that: The first substrate (1) is provided with an electrode transition layer (11) on the upper surface, and the reaction part of the working electrode (20) is arranged on the electrode transition layer (11), wherein the working electrode (20) further comprises a first reaction electrode (21) and a second reaction electrode (22), and the first reaction electrode (21) and the second reaction electrode (22) are provided with an alumina protective layer (10).

4. The chip prepared according to the method of claim 3, wherein: An electrostatic discharge electrode (23) is arranged between the first reaction electrode (21) and the second reaction electrode (22), and the electrostatic discharge electrode (23) is located on the upper surface of the first substrate (1).

5. The chip prepared according to the method of claim 3, wherein: The lower surface of the first substrate (1) is provided with a heating electrode (24), and the lower surface of the heating electrode (24) is provided with a second substrate (2).

6. The chip prepared according to the method of claim 5, wherein: The heating electrode (24) is connected with two heating electrode leads (25), the surface of the second substrate (2) is provided with a temperature measuring electrode lead (26), and the temperature measuring electrode lead (26) is located between the two heating electrode leads (25).

7. The chip prepared according to the method of claim 6, wherein: The heating electrode lead (25) and the temperature measuring electrode lead (26) are respectively connected with a heating electrode pin (27) and a temperature measuring electrode pin (28) through the through holes.

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