Ice bonding strength testing system with multi-parameter coordinated regulation and control

Abstract

The invention belongs to the technical field of testing, and discloses a multi-parameter coordinated regulation ice bonding strength testing system. The system comprises a loading device, a water cooling device, a thermoelectric refrigeration device, a regulation and control box and a test platform. According to the invention, the stepping motor and the lead screw are used as loading devices, so that the loading speed is controlled; the controllable thermoelectric refrigeration device is adopted to detect the temperature of the test platform, so that the semiconductor refrigeration sheet is controlled, the internal temperature of the test platform is maintained at the target temperature, and the temperature change speed is controllable. The axial loading system uses a conical barrel as a liquid container, so that breakage in ice during testing is avoided as much as possible; the microscope is used for observing the freezing condition of ice in the liquid container and whether cracks or bubbles exist or not, the phenomenon that the bonding strength testing result is influenced by the structure problem when the ice is frozen is avoided, the system is arranged in the humidity control box, and the bonding influence caused by original moisture on the surface of the tested metal is avoided by controlling the humidity of the testing environment.

Description

Technical Field

[0001] The invention belongs to the field of testing technology and relates to an ice bonding strength testing system with multi-parameter coordinated regulation. Background Art

[0002] In many research fields such as de-icing, research on the properties of artificial ice-related materials, and clamping with ice, obtaining the bonding strength of ice is an essential part. However, in the prior art, there are relatively few test methods for the bonding strength of ice, and there is a lack of systematic testing equipment. Therefore, it is of great significance to develop an ice bonding strength test system with controllable test environment and strain rate. This is also conducive to guiding the research on material-related performance parameters, supporting various material theories, and can serve as a basis for research on ice-related content in various fields.

[0003] The bonding strength in both axial and radial directions is of great significance to be measured. The existing ice bonding strength testing system can only measure the axial or radial direction alone, but cannot measure the axial and radial directions together.

[0004] The existing ice bond strength test system cannot observe the surface humidity of the metal being tested. The wetness of the test object surface will affect the surface ice bond strength. If the test object surface is not completely wetted, a large number of defects will appear in the bonding interface between the ice and the test object surface, thus affecting the ice bond strength.

[0005] In addition, the existing test system is also unable to observe the degree of freezing of the ice surface. If there are bubbles on the frozen surface, the contact area between the ice and the test plane will be reduced, thereby reducing the ice bonding strength. There is also no guarantee that the ice will not break in the middle of the test, which will affect the test results.

[0006] Existing testing systems are also unable to control loading rate and temperature. Temperature is an important factor affecting static ice bond strength. The ice bond strength at different temperatures is different. Increased temperature will reduce the ice bond strength, thus affecting the test results. In addition, uncontrollable temperature will make it impossible to measure gradient changes. The loading rate will also affect the microstructure of the ice and the arrangement of the crystals, which may lead to changes in bond strength. Different loading rates will cause changes in the internal stress of the ice, thus affecting the measurement of bond strength. Faster loading rates may cause brittle failure of the ice, while slower loading rates may give the ice more time to undergo plastic deformation.

[0007] The National Key Laboratory of Aerodynamics designed a device for measuring the bonding strength between ice and surfaces in patent CN201510615227.1, which measures the bonding strength of ice through a ring and a fixed plate. However, in this patent, the ice is frozen by natural cooling. Not only is the cooling efficiency of the ice low, but the moisture on the surface of the test platform cannot be controlled, which affects the degree of ice adhesion. This major does not have a temperature sensor controller and cannot measure the bonding strength of ice under different temperature gradients. Moreover, the loading rate cannot be controlled. The patent also does not mention the observation of the degree of freezing of the ice, and cannot guarantee that the ice has not broken during the test, thereby affecting the test results.

[0008] Kunshan Liantao Electronics Co., Ltd. designed a bonding strength test fixture and device in patent CN202310272617.8, which drives the second component of the product to be tested to separate from the first component through a connector, thereby realizing the bonding strength test of the product. This patent can only realize the test of axial bonding strength and cannot control the loading rate.

[0009] Shenzhen Institute of Advanced Technology, in patent CN202011430815.5, designed a device and method for preparing test samples. By selecting templates of different shapes, samples of different shapes can be obtained. The samples are glued to the templates and then pulled apart to perform bonding strength tests. This patent cannot test radial bonding strength or control loading speed.

[0010] In patent CN202110351476.X, North China University of Technology designed a static ice bonding strength test device, which adds water to the icer, and then uses a push-pull force measuring device to apply force to the icer or solid test material to separate the icer from the solid test material, while testing the force strength. This patent can only test the bonding strength of radial ice, but cannot control the test temperature, humidity, and loading rate.

[0011] Yunnan Provincial Transportation Planning and Design Institute Co., Ltd. designed a variable condition pavement icing adhesion strength test device in patent CN202120600057.0. This patent uses the test device to adjust the temperature control box to the required test low temperature, so that the covering layer and the test pavement material specimens are fully frozen. After the freezing is completed, turn on the test controller to control the moving ring to move upward on the spiral rod, perform a tensile test, and record the force value when the covering layer and the test pavement material specimen are separated, which is recorded as the pavement icing adhesion strength test result. This patent can only test the axial ice adhesion strength, but cannot observe the freezing condition of the ice and the surface humidity, and cannot guarantee the accuracy of the experimental results.

[0012] Therefore, in order to measure the bonding strength between ice and various materials in a more systematic and accurate manner, it is necessary to develop a test system for ice bonding strength in which the temperature and loading speed can be controlled, the freezing conditions can be observed, and the axial and radial directions can be measured. Summary of the invention

[0013] In order to solve the above problems existing in the prior art, facing the requirements of temperature gradient and loading rate in ice adhesion strength test, the present invention proposes an ice adhesion strength test system with multi-parameter coordinated regulation.

[0014] The technical solution of the present invention:

[0015] A multi-parameter coordinated control ice bonding strength test system, comprising a radial loading device, an axial loading device, a water cooling device, a thermoelectric cooling device, a control box and a test platform;

[0016] The radial loading device and the axial loading device have the same structure, and both include a stepper motor driver 1, a stepper motor 2, a lead screw 3 and a dynamometer 4; wherein the lead screw 3 and the stepper motor 2 match each other, and the dynamometer 4 is installed on the top of the slider of the lead screw 3;

[0017] The test platform comprises a liquid container 5, a test object 6, a test bench 7, a semiconductor cooling sheet 9, a heat sink 10, a conical barrel-shaped liquid container 24 and an axial test head 25; wherein the liquid container 5 has openings at both ends for holding a small amount of liquid, which is placed on the test object 6, with the upper opening for adding liquid and the lower opening for direct contact between the liquid and the test object; the test object 6 is placed flat on the test bench 7; the semiconductor cooling sheet 9 is installed below the test bench 7 for cooling the test bench 7; the heat sink 10 is installed on the heat dissipation surface of the semiconductor cooling sheet 9 for heat dissipation of the semiconductor cooling sheet 9; when performing an axial test, the conical barrel-shaped liquid container 24 is used to hold the liquid, the upper end of the container is larger than the lower end opening, and is in a cone shape from top to bottom, and the test head of the thrust gauge is replaced with the axial test head 25 for testing;

[0018] The water cooling device includes a circulating water tank 13, a heat sink 10 and a water pipe 16; the circulating water tank 13 is provided with a circulating water tank outlet 14 and a circulating water tank inlet 15, which are matched with the heat sink inlet 19 and the heat sink outlet 18 respectively through the water pipe 16;

[0019] The thermoelectric refrigeration device includes a semiconductor refrigeration sheet 9 and a temperature sensor controller 21; the semiconductor refrigeration sheet 9 has a refrigeration surface and a heat dissipation surface, wherein the refrigeration surface is connected to the experimental table 7, and the heat dissipation surface is matched with the heat dissipation water tank 10 to achieve rapid refrigeration of the experimental table 7; the measuring end 17 of the temperature sensor is closely attached to the inner wall of the experimental table 7, and is used to monitor the internal temperature thereof in real time;

[0020] The control box is a humidity control box 12, which includes a microscope 11, a box shell 26, a humidity sensor 27, a drying device 28 and a humidifying device 29; the humidity control box 12 is transparent for easy observation; the humidity control box 12 is installed with a drying device 28 and a humidifying device 29 to adjust the internal temperature of the box; the side wall of the humidity control box 12 is equipped with a humidity sensor 27; the microscope 11 is located next to the experimental table 7, and the humidity control box 12 encloses the experimental table 7 in the box.

[0021] Furthermore, thermal grease 20 is applied between the outer bottom surface of the experimental table 7 and the cooling surface of the semiconductor refrigeration plate 9, and between the heat dissipation surface of the semiconductor refrigeration plate 9 and the upper surface of the heat dissipation water tank 10 to improve the heat conduction efficiency.

[0022] Furthermore, a locking mechanism 22 is provided at the connection between the water pipe 16 and the circulating water tank 13 and the heat dissipation water tank 10 to ensure the airtightness of the interface.

[0023] Furthermore, the thermoelectric cooling device also includes a DC power supply 23 for supplying power to the semiconductor cooling plate 9 .

[0024] Furthermore, a gasket 8 is provided at the outer bottom of the experimental table 7 to isolate the heat transfer between the machine tool guide rail and the experimental table 7.

[0025] Furthermore, the stepper motor controller 1 is used to control the stepper motor 2 to change the movement rate of the lead screw 3 .

[0026] Beneficial effects of the present invention: The present invention adopts a stepper motor and a lead screw as a loading device to control the loading speed; adopts a controllable thermoelectric refrigeration device to detect the temperature of the test platform to control the semiconductor refrigeration plate, ensure that the internal temperature of the test platform is maintained at the target temperature, and realize the controllable temperature change speed. The axial loading system uses a conical barrel as a liquid container to avoid the internal fracture of the ice during the test as much as possible; the test platform is equipped with a microscope to observe the freezing of the ice inside the liquid container, whether there are cracks or bubbles, so as to avoid the structural problems when the ice is frozen affecting the bonding strength test results; this test system is set in a humidity control box, and by controlling the humidity of the test environment, the bonding effect caused by the original moisture on the metal surface of the test is avoided. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 The present invention is a flow chart of an ice bonding strength testing system with controllable testing environment and strain rate.

[0028] Figure 2 Schematic diagram of an ice adhesion strength testing system with controllable testing environment and strain rate.

[0029] Figure 3It is an overall oblique schematic diagram of an ice adhesion strength testing system with controllable testing environment and strain rate.

[0030] In the figure: 1 stepper motor driver; 2 stepper motor; 3 lead screw; 4 dynamometer; 5 liquid container; 6 test object; 7 test bench; 8 gasket; 9 semiconductor refrigeration plate; 10 heat sink; 11 microscope; 12 humidity control box; 13 circulating water tank; 14 circulating water tank outlet; 15 circulating water tank inlet; 16 water pipe; 17 measuring end of temperature sensor; 18 heat sink outlet; 19 heat sink inlet; 20 thermal grease; 21 temperature sensor controller; 22 locking mechanism; 23 DC power supply; 24 conical barrel liquid container; 25 axial test head; 26 box shell; 27 humidity controller; 28 drying device; 29 humidifying device. DETAILED DESCRIPTION

[0031] The specific implementation of the present invention is further described below in conjunction with the accompanying drawings and technical solutions.

[0032] Example:

[0033] like Figure 2 As shown, it is a schematic diagram of the three-dimensional structure of the present invention, Figure 3 The oblique view of the test system of the embodiment of the present invention. The embodiment provides an adhesion test system under static working conditions, which is used to test the adhesion strength between ice and the test object in radial and axial directions, including a loading device, a test platform, a thermoelectric cooling device, a water cooling device, and a control box, wherein the loading device is used to apply radial thrust or axial tension to the liquid container to separate the ice in the liquid container from the test object; the test platform is used to place containers and test objects for experiments; the thermoelectric cooling device is used to cool the test platform to freeze the water in the liquid container into ice; the water cooling device is used to cool the semiconductor chip in the thermoelectric cooling device; and the control box is used to monitor the humidity and temperature of the space environment including the test platform.

[0034] In this embodiment, in the radial loading device, when the lead screw 3 moves, it drives the dynamometer 4 to move in a specified direction, and the radial test head of the dynamometer pushes the liquid container 5. The bottom end of the test head should be close to the test object to reduce the influence of the torque on the test result;

[0035] In this embodiment, in the axial loading device, when the lead screw 3 moves, it drives the dynamometer 4 to move in a specified direction, and the axial test head of the dynamometer pulls up the conical liquid container 24; the shape design of the conical container enables the axial test head to stably pull up the conical liquid container, thereby avoiding the influence of the friction between the test head and the container on the axial bonding strength test;

[0036] In this embodiment, the microscope 11 in the test platform is used to observe and record the inside of the liquid container, the freezing state of the ice, and whether there are bubbles and cavities, so as to ensure the accuracy of the ice test results;

[0037] In this embodiment, a grid structure is provided inside the heat dissipation water tank 10 in the water cooling device to increase the contact area with water and achieve efficient heat dissipation;

[0038] In this embodiment, the output end of the temperature sensor controller 21 in the controllable thermoelectric refrigeration device matches the semiconductor refrigeration chip 9. When the internal temperature reaches the set value, the controller will automatically disconnect the power supply from the semiconductor refrigeration chip, so that the internal temperature of the experimental table 7 is maintained within the predetermined target temperature range, and the temperature of the experimental table can be quickly or slowly lowered to the target temperature, thereby being able to measure the adhesion strength of ice at different temperatures and different temperature change rates.

[0039] In this embodiment, inside the control box, the box shell 26 encloses the test platform in the box to ensure the dryness of the metal surface during the test, thereby reducing the effect of the self-heating environment humidity on the ice bonding strength; a humidity sensor 27 is installed on the side wall of the box to monitor the humidity changes inside the box.

[0040] The test system of the embodiment is used and operated as follows:

[0041] 1. Turn on the temperature sensor controller 21 to start cooling the semiconductor cooling plate 9 to the set temperature. Turn on the circulating water tank 13 to allow the heat dissipation water tank to dissipate heat for the semiconductor cooling plate.

[0042] 2. Add a small amount of water to the liquid container 5 and wait for complete condensation. Observe through the microscope 11 until the freezing degree of the ice meets the requirements, and then turn on the loading device. The thrust gauge in the loading device will move with the lead screw to apply a load to the liquid container until the liquid container is separated from the test object, observe the thrust gauge reading, and record the data.

Claims

1. A multi-parameter coordinated control ice adhesion strength test system, characterized in that: The multi-parameter coordinated control ice bonding strength test system includes a radial loading device, an axial loading device, a water cooling device, a thermoelectric cooling device, a control box and a test platform; The radial loading device and the axial loading device have the same structure, and both include a stepper motor driver (1), a stepper motor (2), a lead screw (3) and a dynamometer (4); wherein the lead screw (3) and the stepper motor (2) match each other, and the dynamometer (4) is installed on the top of the slider of the lead screw (3); The test platform comprises a liquid container (5), a test object (6), a test bench (7), a semiconductor cooling sheet (9), a heat sink (10), a conical barrel-shaped liquid container (24) and an axial test head (25); wherein the liquid container (5) is opened at both ends and is used to hold a small amount of liquid, and is placed on the test object (6), with the upper opening for adding liquid and the lower opening for direct contact between the liquid and the test object; the test object (6) is placed flat on the test bench (7); the semiconductor cooling sheet (9) is installed below the test bench (7) and is used to cool the test bench (7); the heat sink (10) is installed on the heat dissipation surface of the semiconductor cooling sheet (9) and is used to dissipate heat from the semiconductor cooling sheet (9); when performing an axial test, the conical barrel-shaped liquid container (24) is used to hold liquid, the upper opening of which is larger than the lower opening and is in a conical shape from top to bottom, and the test head of the thruster is replaced with the axial test head (25) for testing; The water cooling device comprises a circulating water tank (13), a heat sink (10) and a water pipe (16); the circulating water tank (13) is provided with a circulating water tank water outlet (14) and a circulating water tank water inlet (15), which are respectively matched with the heat sink water inlet (19) and the heat sink water outlet (18) through the water pipe (16); The thermoelectric refrigeration device comprises a semiconductor refrigeration plate (9) and a temperature sensor controller (21); the semiconductor refrigeration plate (9) has a refrigeration surface and a heat dissipation surface, wherein the refrigeration surface is connected to the experimental table (7), and the heat dissipation surface matches the heat dissipation water tank (10) to achieve rapid refrigeration of the experimental table (7); the measuring end (17) of the temperature sensor is closely attached to the inner wall of the experimental table (7) for real-time monitoring of the internal temperature thereof; The control box is a humidity control box (12), which comprises a microscope (11), a box shell (26), a humidity sensor (27), a drying device (28) and a humidifying device (29); the humidity control box (12) is transparent for easy observation; the humidity control box (12) is equipped with a drying device (28) and a humidifying device (29) for adjusting the temperature inside the box; the side wall of the humidity control box (12) is equipped with a humidity sensor (27); the microscope (11) is located next to the experimental table (7), and the humidity control box (12) encloses the experimental table (7) in the box.

2. The multi-parameter coordinated control ice adhesion strength testing system according to claim 1, characterized in that: Thermal conductive silicone grease (20) is applied between the outer bottom surface of the experimental table (7) and the cooling surface of the semiconductor cooling plate (9), and between the heat dissipation surface of the semiconductor cooling plate (9) and the upper surface of the heat dissipation water tank (10) to improve the heat conduction efficiency.

3. The multi-parameter coordinated control ice adhesion strength testing system according to claim 1, characterized in that: The connection between the water pipe (16), the circulating water tank (13) and the heat dissipation water tank (10) is provided with a locking mechanism (22) for ensuring the airtightness of the interface.

4. The multi-parameter coordinated control ice adhesion strength testing system according to claim 1, characterized in that: The thermoelectric refrigeration device also includes a DC power supply (23) for supplying power to the semiconductor refrigeration sheet (9).

5. The multi-parameter coordinated control ice adhesion strength testing system according to claim 1, characterized in that: A gasket (8) is provided at the bottom of the outer side of the experimental table (7) for isolating heat transfer between the machine tool guide rail and the experimental table (7).

6. The multi-parameter coordinated control ice adhesion strength testing system according to claim 1, characterized in that: The stepper motor controller (1) is used to control the stepper motor (2) to change the movement speed of the lead screw (3).

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