A heat dissipation device for a microcomputer host with temperature adaptive control

Abstract

The present invention relates to the field of data correction technology, and specifically to a microcomputer host heat dissipation device with temperature adaptive control. The device is equipped with a heat dissipation guide pipe and a high-speed data processing unit on the heat dissipation device body, so that the heat dissipation guide pipe can determine the special airflow crosstalk influence of each area and screen out the affected area based on the correction result of the monitoring temperature by the high-speed data processing unit, taking into account the correlation and distance of the monitored temperature changes between different areas. The error influence is obtained by combining the regional temperature difference between the areas, and the adjustment direction of the monitored temperature of the target area is determined by combining the ambient temperature difference between the target area and the external ambient temperature. The monitored temperature of the target area can be corrected by adjusting the direction and combining the error influence. The present invention ensures the rationality of the temperature representation of the target area, so that the heat dissipation device can provide a scientific and effective heat dissipation strategy.

Description

Technical Field

[0001] The present invention relates to the technical field of data correction, and in particular to a microcomputer host heat dissipation device with temperature adaptive control. Background Art

[0002] Microcomputer hosts are favored by users because of their small size, powerful functions and portability. However, with the improvement of microcomputer host performance, hardware heating has become a key issue that needs to be optimized. Excessive hardware temperature will affect the performance and life of the device. Therefore, an efficient heat dissipation solution is needed to ensure the stable operation of the host.

[0003] The existing heat dissipation system of the microcomputer host can control the heat dissipation device to perform adaptive heat dissipation according to the real-time monitored hardware temperature information, and can control the wind speed, heat dissipation position and other parameters of the heat dissipation device in real time according to the monitored temperature to perform targeted heat dissipation for each area in the host. However, in the actual monitoring process, because the internal structure of the micro host is relatively compact and the heating capacity of different hardware parts is different, it is easy for hot air flow crosstalk to occur between different areas, resulting in inaccurate monitored temperature, and it is impossible to determine a scientific and effective heat dissipation strategy based on the monitored temperature. Summary of the invention

[0004] In order to solve the technical problem that the monitoring temperature is inaccurate due to the crosstalk of thermal airflow between different areas in the microcomputer host, and a scientific and effective heat dissipation strategy cannot be determined according to the monitored temperature, the purpose of the present invention is to provide a microcomputer host heat dissipation device with temperature adaptive control, and the technical solution adopted is as follows: The present invention proposes a microcomputer host heat dissipation device with temperature adaptive control, the device includes a heat dissipation device body, the heat dissipation device body includes a heat dissipation guide pipe and a high-speed data processing unit, the high-speed data processing unit obtains the monitored temperature of each area of ​​the microcomputer host and corrects it, and adaptively controls the intelligent valve on the heat dissipation guide pipe according to the corrected temperature to dissipate heat for the area; the method for the high-speed data processing unit to correct the monitored temperature of each area includes: Obtain the monitoring temperature sequence of each area during the monitoring period; for the target area, obtain the thermal airflow crosstalk influence between the target area and each other area according to the change correlation of the monitoring temperature sequence between the target area and other areas, and the distance; filter out the influence area of ​​the target area according to the thermal airflow crosstalk influence; Obtaining a regional temperature difference between the target region and the impact region; obtaining an error impact degree of the target region according to the regional temperature difference and the thermal airflow crosstalk impact degree; According to the regional temperature difference, an internal temperature error direction parameter of the target region is obtained; an ambient temperature difference between the target region and the external environment is obtained; and an adjustment direction of the monitoring temperature of the target region is determined according to the internal temperature error direction parameter and the ambient temperature difference; Based on the adjustment direction, the monitored temperature of the target area is adjusted according to the error influence and the ambient temperature difference to obtain a corrected temperature.

[0005] Furthermore, the change correlation is a Pearson correlation coefficient between the monitored temperature sequences.

[0006] Furthermore, the method for obtaining the thermal airflow crosstalk influence degree includes: The distances between the target area and other areas are negatively correlated and normalized to obtain a distance weight; and the product of the distance weight and the change correlation is used as the thermal airflow crosstalk influence.

[0007] Furthermore, the method for screening the impact area includes: Other areas where the thermal airflow crosstalk influence is greater than a preset influence threshold are used as influence areas of the target area.

[0008] Furthermore, the method for obtaining the regional temperature difference includes: The temperature difference of the region is obtained by subtracting the temperature mean of the monitoring temperature sequence of the impact region from the temperature mean of the monitoring temperature sequence of the target region.

[0009] Furthermore, the method for obtaining the error influence degree includes: For each affected area, the product of the absolute value of the corresponding area temperature difference and the thermal airflow crosstalk influence is used as the initial influence of the affected area; the average initial influence of all affected areas is used as the error influence.

[0010] Furthermore, the internal temperature error direction parameter is the average regional temperature difference of all affected regions.

[0011] Furthermore, the method for obtaining the ambient temperature difference includes: The ambient temperature difference is obtained by subtracting the temperature mean of the monitoring temperature sequence of the external environment from the temperature mean of the monitoring temperature sequence of the target area.

[0012] Furthermore, the method for obtaining the adjustment direction includes: taking the sum of the ambient temperature difference and the internal temperature error direction parameter as a discrimination coefficient, if the discrimination coefficient is a negative number, the adjustment direction is decreasing; if the discrimination coefficient is a positive number, the adjustment direction is increasing.

[0013] Furthermore, the method for obtaining the corrected temperature includes: The error influence degree and the absolute value of the ambient temperature difference are multiplied and normalized to obtain an adjustment coefficient; and the monitoring temperature of the target area is adjusted using the adjustment coefficient according to the adjustment direction.

[0014] The present invention has the following beneficial effects: In the embodiment of the present invention, a heat dissipation guide pipe and a high-speed data processing unit are installed on the heat dissipation device body, so that the heat dissipation guide pipe can perform targeted heat dissipation on the required heat dissipation area according to the correction result of the monitoring temperature by the high-speed data processing unit. When the high-speed data processing unit corrects the monitoring temperature, it determines the characteristic airflow crosstalk influence of each area and screens out the affected area by considering the correlation and distance between the monitored temperature changes in different areas. The degree to which the target area is affected by the temperature of other areas can be determined by further analysis of the affected area. Therefore, the embodiment of the present invention combines the regional temperature difference between the areas to obtain the error influence, and further combines the ambient temperature difference between the target area and the external ambient temperature to determine the adjustment direction of the monitored temperature of the target area. By adjusting the direction and combining the error influence, the monitored temperature of the target area can be effectively corrected, which ensures the rationality of the temperature characterization of the target area, so that the heat dissipation device can provide a scientific and effective heat dissipation strategy. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions and advantages in the embodiments of the present invention or the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0016] Figure 1 A schematic diagram of a shell of a heat dissipation device body provided by an embodiment of the present invention; Figure 2 A schematic diagram of a heat dissipation power device of a heat dissipation device body provided by an embodiment of the present invention; Figure 3 A schematic diagram of a heat dissipation and flow guiding pipeline provided by an embodiment of the present invention; Figure 4 A schematic diagram of the operation of a high-speed data processing unit provided by one embodiment of the present invention; Figure 5 A schematic diagram of a method for correcting monitored temperature in a high-speed data processing unit provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0017] In order to further explain the technical means and effects adopted by the present invention to achieve the predetermined invention purpose, the following is a detailed description of the specific implementation, structure, features and effects of a microcomputer host heat dissipation device with temperature adaptive control proposed by the present invention in combination with the accompanying drawings and preferred embodiments. In the following description, different "one embodiment" or "another embodiment" does not necessarily refer to the same embodiment. In addition, specific features, structures or characteristics in one or more embodiments may be combined in any suitable form.

[0018] Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.

[0019] An embodiment of the present invention provides a microcomputer host heat dissipation device with temperature adaptive control. The device includes a heat dissipation device body, and the heat dissipation device body includes a heat dissipation guide pipe and a high-speed data processing unit. The heat dissipation guide pipe is used to accurately dissipate heat to the target area inside the host. The high-speed data processing unit is integrated with a basic algorithm for adaptively controlling the heat dissipation guide pipe and dissipating heat according to the temperature information of each area. The algorithm is a prior art and a technical means well known to those skilled in the art, and will not be described in detail here. The high-speed data processing unit is also integrated with a monitoring temperature correction algorithm, which can obtain the monitoring temperature of each area of ​​the microcomputer host and make corrections, and adaptively control the intelligent valve on the heat dissipation guide pipe according to the corrected temperature to dissipate heat to each area.

[0020] The following is a detailed description of a specific solution of a microcomputer host heat dissipation device with temperature adaptive control provided by the present invention in conjunction with the accompanying drawings. Figure 1 , which shows a schematic diagram of the shell of a heat dissipation device body provided by an embodiment of the present invention. The shell in the embodiment of the present invention includes a shell body 1, a heat dissipation guide interface 2, a dust filter 3, a first fixing nut 4, a low-power exhaust fan 5, a power supply structure 6, a movable bracket 7 and a cable tie 8. The first fixing nut 4 is used to fix the dust filter 3. The detachable dust filter can effectively prevent external dust from entering the host, and is convenient for cleaning and maintenance to ensure heat dissipation efficiency. The cable tie 8 connects the circuit in the device with the external power supply circuit, control circuit and other lines. All lines pass through the cable tie 8 to ensure the neatness and beauty of the lines in the host. The low-power exhaust fan 5 is connected to the internal space of the device. Through operation, the hot air gathered inside the shell can be discharged in time to prevent local overheating and accelerate the circulation of cold air. The device shell in the embodiment of the present invention removes redundant structures such as external exposed lines and heat dissipation holes. The design of the boxed shell can not only effectively integrate the cold air generated by the heat dissipation device, but also use the low-power exhaust fan to ensure the rapid circulation of the internal cold air, thereby improving the heat dissipation performance.

[0021] The heat dissipation device body in the embodiment of the present invention can expose the heat dissipation power device after the dust filter 3 is disassembled. Figure 2 , which shows a schematic diagram of a heat dissipation power device of a heat dissipation device body provided by an embodiment of the present invention, and the heat dissipation power device includes: a heat dissipation fan motor 9, a heat dissipation fan body 10, a fixed shaft 11, a shaft motor 12, and a connecting shaft 13. Among them, the fixed shaft 11 has the function of fixing and multi-directional rotation in the horizontal plane. The device is used to fix the heat dissipation fan body 10 to realize the multi-directional air supply function of the heat dissipation fan. The heat dissipation fan body 10 and the fixed shaft 11 are combined with the heat dissipation guide pipes connected to the heat dissipation guide interface 2 in different directions to effectively target the local hot spot phenomenon of the computer host device during operation, and accurately dissipate heat for each area inside the host. The heat dissipation guide ducts are distributed around the heat dissipation fan body 10 and on the surface of the outer shell structure, and are used to connect the heat dissipation device with various electronic component areas inside the host. Please refer to Figure 3 , which shows a schematic diagram of a heat dissipation guide pipe provided by an embodiment of the present invention, the heat dissipation guide pipe mainly includes a second fixing nut 14 and an intelligent valve 15, wherein the second fixing nut 14 plays a fixing role, and the two sections of the heat dissipation guide pipe are respectively connected to the heat dissipation device and the air outlet near the internal structural components of the host. The intelligent valve 15 has a built-in micro motor, which can be connected to the host control circuit together with the heat dissipation fan motor 9 and the shaft motor 12. The opening state of the intelligent valve 15, the fan speed of the heat dissipation fan motor 9, and the fan shaft angle are all intelligently controlled by the PID controller. By intelligently controlling the opening state of the valve, the fan speed, and the shaft angle, the hot spot area inside the host can be accurately dissipated. The heat dissipation guide pipe that accurately controls the flow of cold air to the hot spot area can ensure continuous and appropriate cold air delivery, thereby effectively keeping the equipment running within a safe temperature range.

[0022] In the embodiment of the present invention, the high-speed data processing unit can correct the actual temperature of each area during operation and output the optimal temperature control strategy by processing and analyzing the temperature fluctuation patterns of different areas of the host and the temperature correlation between the areas. Figure 4, which shows a schematic diagram of the operation of a high-speed data processing unit provided by an embodiment of the present invention. The high-speed data processing unit integrates multiple circuit data, and finally feeds back the information to the control circuit and controls the heat dissipation device through information interaction. The temperature sampling circuit uses an integrated sensor to monitor the temperature of each area of ​​the host in real time, and uploads it to the high-speed data processing unit in real time. It should be noted that in order to facilitate data processing, the data will be subjected to certain preprocessing operations in the high-speed data processing unit. The preprocessing operations include data filtering and data standardization, which are intended to eliminate the influence of noise data and data dimensions. The control circuit has a built-in PID controller, which can adjust the power and heat dissipation state of the heat dissipation device according to the corrected temperature to achieve efficient temperature control and heat dissipation management. In addition, multiple communication protocols are supported between the various module interfaces to ensure that each data can be effectively transmitted. The over-temperature protection circuit is used when the device temperature reaches the warning value, and the system automatically starts the voltage reduction operation to prevent the device from being damaged due to excessive temperature.

[0023] See also Figure 5 , which shows a schematic diagram of a method for correcting a monitoring temperature of a high-speed data processing unit provided by an embodiment of the present invention, the method comprising: Step S1: Obtain the monitoring temperature sequence of each area during the monitoring period; for the target area, obtain the thermal airflow crosstalk influence between the target area and each other area according to the change correlation of the monitoring temperature sequence between the target area and other areas, as well as the distance; filter out the affected area of ​​the target area according to the thermal airflow crosstalk influence.

[0024] In an embodiment of the present invention, for each area inside the host, a monitoring temperature sequence of each area within the monitoring period is obtained at each moment, the monitoring period is set to the 20 minutes before the current moment, and the sampling frequency is set to collect once per second. That is, the temperature change characteristics of each area at the current moment are characterized by the monitoring temperature sequence. If the temperature change characteristics between different areas are the same, and the distance between the two areas is close, it means that thermal air flow crosstalk has occurred between the areas, and there is an obvious error in the collected monitoring temperature. Therefore, the embodiment of the present invention takes any area as the target area, and obtains the thermal air flow crosstalk influence between the target area and each other area according to the change correlation of the monitoring temperature sequence between the target area and other areas, as well as the distance. It should be noted that the monitoring temperature correction method for each area in the embodiment of the present invention is the same method step, so the embodiment of the present invention only takes one target area as an example.

[0025] Preferably, in one embodiment of the present invention, the change correlation is the Pearson correlation coefficient between the monitored temperature sequences. The larger the Pearson correlation coefficient, the more correlated the linear changes between the two sequences.

[0026] Preferably, in one embodiment of the present invention, considering that the closer the distance between two areas is, the easier it is to generate thermal contagion, the distance between the target area and other areas is negatively correlated and normalized to obtain a distance weight, that is, the larger the distance weight is, the more likely it is to generate thermal crosstalk, and the greater the change correlation is, the more likely it is to generate crosstalk between the two areas, so the product of the distance weight and the Pearson correlation coefficient is used as the thermal crosstalk influence. In the embodiment of the present invention, because the target area and the other area are not the same area, the distance cannot be 0, so the inverse of the distance between the two areas is directly used as the distance weight.

[0027] For the target area, the greater the thermal crosstalk influence between other areas and the target area, the more likely the target area is to be affected by the other areas. Therefore, the affected areas of the target area can be screened out according to the thermal crosstalk influence.

[0028] In an embodiment of the present invention, other areas where the thermal airflow crosstalk influence is greater than a preset influence threshold are used as influence areas of the target area. After the thermal airflow crosstalk influence is normalized, the influence threshold is set to 0.5. It should be noted that the normalization method uses range normalization for normalization, and the normalization methods involved in subsequent steps can all be processed using range normalization. Those skilled in the art may also choose other existing technologies for normalization, which will not be limited or elaborated here.

[0029] Step S2: Obtain the regional temperature difference between the target region and the affected region; obtain the error influence degree of the target region according to the regional temperature difference and the thermal airflow crosstalk influence degree.

[0030] For the target area and the affected area, the greater the regional temperature difference between the two, according to the laws of thermodynamics, the more serious the temperature impact will be. If the regional temperature difference indicates that the temperature of the target area is larger, according to the laws of thermodynamics, it can be explained that the heat of the target area is more likely to be transferred to the affected area, which means that the monitored temperature of the target area at this time is smaller than the actual temperature. Similarly, if the target area temperature is smaller, it means that the target area at this time is more likely to be affected by the heat of the affected area, resulting in the monitored temperature being larger than the actual temperature. Therefore, the embodiment of the present invention can further obtain the error influence of the target area based on the regional temperature difference and the influence of thermal airflow crosstalk.

[0031] Preferably, in an embodiment of the present invention, the method for obtaining the regional temperature difference includes: The temperature difference of the region is obtained by subtracting the temperature mean of the monitoring temperature sequence of the affected region from the temperature mean of the monitoring temperature sequence of the target region. That is, the regional temperature difference can be positive or negative. If it is positive, it means that the temperature of the target region is higher, and if it is negative, it means that the temperature of the target region is lower.

[0032] Furthermore, because the regional temperature difference may be negative, the absolute value should be taken when actually determining the error influence degree. The method for obtaining the error influence degree includes: For each affected area, the product of the absolute value of the corresponding regional temperature difference and the thermal crosstalk influence is used as the initial influence of the affected area. That is, for each affected area, the greater the absolute value of the regional temperature difference and the thermal crosstalk influence, the more likely the affected area is to affect the temperature of the target area, and the greater the initial influence. Because there are multiple affected areas for the target area, the average initial influence of all affected areas is used as the error influence.

[0033] Step S3: obtaining the internal temperature error direction parameter of the target area according to the regional temperature difference; obtaining the ambient temperature difference between the target area and the external environment; and determining the adjustment direction of the monitoring temperature of the target area according to the internal temperature error direction parameter and the ambient temperature difference.

[0034] As described in step S2 above, the regional temperature difference can characterize the error direction of the monitored temperature in the target area, so the internal temperature error direction parameter of the target area can be obtained according to the regional temperature difference. Further considering that the ambient temperature will also affect the monitored temperature of the target area, the ambient temperature difference between the target area and the external environment can be further obtained. Similar to the regional temperature difference, if the temperature of the target area is greater than that of the external environment, it means that the monitored temperature of the target area at this time is smaller than the actual temperature; otherwise, it means that the monitored temperature is larger than the actual temperature. Therefore, the adjustment direction of the monitored temperature of the target area is determined according to the internal temperature error direction parameter and the ambient temperature difference.

[0035] In an embodiment of the present invention, it is considered that the regional temperature difference is data with positive and negative signs, and one target area corresponds to multiple impact areas, so the internal temperature error direction parameter is the average regional temperature difference of all impact areas. And the method for obtaining the ambient temperature difference is: subtract the temperature mean of the monitoring temperature sequence of the external environment from the temperature mean in the monitoring temperature sequence of the target area to obtain the ambient temperature difference. That is, the ambient temperature difference and the internal temperature error direction parameter are both data with positive and negative signs, and the data ranges of the two are consistent, and both are temperature data. Therefore, the method for obtaining the adjustment direction in an embodiment of the present invention includes: taking the sum of the ambient temperature difference and the internal temperature error direction parameter as the discriminant coefficient, if the discriminant coefficient is a negative number, the adjustment direction is to decrease; if the discriminant coefficient is a positive number, the adjustment direction is to increase.

[0036] Step S4: Based on the adjustment direction, the monitoring temperature of the target area is adjusted according to the error influence and the ambient temperature difference to obtain a corrected temperature.

[0037] The error impact degree represents the degree to which the target area is affected by the affected area, and the ambient temperature difference can represent the degree to which the target area is affected by the external environment. Therefore, after determining the adjustment direction, the monitoring temperature of the target area can be adjusted according to the error impact degree and the ambient temperature difference to obtain the corrected temperature.

[0038] Preferably, in one embodiment of the present invention, the error influence degree and the absolute value of the ambient temperature difference are multiplied and normalized to obtain an adjustment coefficient; and the monitoring temperature of the target area is adjusted using the adjustment coefficient according to the adjustment direction. In the embodiment of the present invention, if the adjustment direction is increasing, the adjustment coefficient is added to a positive integer 1 to obtain an adjustment ratio, and the monitoring temperature at the current moment is multiplied by the adjustment ratio to obtain a corrected temperature; if the adjustment direction is decreasing, the adjustment coefficient is subtracted from a positive integer 1 to obtain an adjustment ratio, and the monitoring temperature at the current moment is multiplied by the adjustment ratio to obtain a corrected temperature.

[0039] The high-speed data processing unit will eventually adjust the control strategy according to the deviation between the corrected temperature and the set safety temperature, and automatically adjust the PID parameters to adapt to the temperature changes in different working environments. In addition, in the embodiment of the present invention, in order to prevent the host from being damaged by excessive temperature, the system sets the upper and lower limits of the temperature. When the temperature approaches the set limit, the system will activate the alarm mechanism or take protective measures, such as automatically increasing the fan to the maximum speed, or even triggering shutdown protection, to ensure the safe operation of the hardware.

[0040] In summary, in an embodiment of the present invention, a heat dissipation guide pipe and a high-speed data processing unit are installed on the heat dissipation device body, so that the heat dissipation guide pipe can determine the characteristic airflow crosstalk influence of each area and screen out the affected area based on the correction result of the monitored temperature by the high-speed data processing unit, taking into account the correlation and distance of the monitored temperature changes between different areas. The error influence is obtained by combining the regional temperature difference between the areas, and the adjustment direction of the monitored temperature of the target area is determined by combining the ambient temperature difference between the target area and the external ambient temperature. The monitored temperature of the target area can be corrected by adjusting the direction and combining the error influence. The present invention ensures the rationality of the temperature characterization of the target area, so that the heat dissipation device can provide a scientific and effective heat dissipation strategy.

[0041] It should be noted that the sequence of the above embodiments of the present invention is only for description and does not represent the advantages and disadvantages of the embodiments. The processes depicted in the accompanying drawings do not necessarily require the specific order or continuous order shown to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0042] The various embodiments in this specification are described in a progressive manner, and the same or similar parts between the various embodiments can be referenced to each other, and each embodiment focuses on the differences from other embodiments.

Claims

1. A heat dissipation device for a microcomputer host with temperature adaptive control, the device comprising a heat dissipation device body, characterized in that: The heat dissipation device body includes a heat dissipation guide pipe and a high-speed data processing unit. The high-speed data processing unit obtains the monitored temperature of each area of ​​the microcomputer host and makes corrections, and adaptively controls the intelligent valve on the heat dissipation guide pipe according to the corrected temperature to dissipate heat for the area; The method for the high-speed data processing unit to correct the monitored temperature of each area includes: Obtain the monitoring temperature sequence of each area during the monitoring period; for the target area, obtain the thermal airflow crosstalk influence between the target area and each other area according to the change correlation of the monitoring temperature sequence between the target area and other areas, and the distance; filter out the influence area of ​​the target area according to the thermal airflow crosstalk influence; Obtaining a regional temperature difference between the target region and the impact region; obtaining an error impact degree of the target region according to the regional temperature difference and the thermal airflow crosstalk impact degree; According to the regional temperature difference, an internal temperature error direction parameter of the target region is obtained; an ambient temperature difference between the target region and the external environment is obtained; and an adjustment direction of the monitoring temperature of the target region is determined according to the internal temperature error direction parameter and the ambient temperature difference; Based on the adjustment direction, the monitored temperature of the target area is adjusted according to the error influence and the ambient temperature difference to obtain a corrected temperature.

2. A microcomputer host heat dissipation device with temperature adaptive control according to claim 1, characterized in that: The change correlation is the Pearson correlation coefficient between the monitored temperature sequences.

3. The microcomputer host heat dissipation device with temperature adaptive control according to claim 1, characterized in that: The method for obtaining the thermal airflow crosstalk influence degree includes: The distances between the target area and other areas are negatively correlated and normalized to obtain a distance weight; and the product of the distance weight and the change correlation is used as the thermal airflow crosstalk influence.

4. The microcomputer host heat dissipation device with temperature adaptive control according to claim 1, characterized in that: The method for screening the impact area includes: Other areas where the thermal airflow crosstalk influence is greater than a preset influence threshold are used as influence areas of the target area.

5. The microcomputer host heat dissipation device with temperature adaptive control according to claim 1, characterized in that: The method for obtaining the regional temperature difference includes: The temperature difference of the region is obtained by subtracting the temperature mean of the monitoring temperature sequence of the impact region from the temperature mean of the monitoring temperature sequence of the target region.

6. The microcomputer host heat dissipation device with temperature adaptive control according to claim 5, characterized in that: The method for obtaining the error influence degree includes: For each affected area, the product of the absolute value of the corresponding area temperature difference and the thermal airflow crosstalk influence is used as the initial influence of the affected area; the average initial influence of all affected areas is used as the error influence.

7. The microcomputer host heat dissipation device with temperature adaptive control according to claim 5, characterized in that: The internal temperature error direction parameter is the average regional temperature difference of all affected regions.

8. The microcomputer host heat dissipation device with temperature adaptive control according to claim 7, characterized in that: The method for obtaining the ambient temperature difference includes: The ambient temperature difference is obtained by subtracting the temperature mean of the monitoring temperature sequence of the external environment from the temperature mean of the monitoring temperature sequence of the target area.

9. A microcomputer host heat dissipation device with temperature adaptive control according to claim 8, characterized in that: The method for obtaining the adjustment direction includes: taking the sum of the ambient temperature difference and the internal temperature error direction parameter as a discrimination coefficient, if the discrimination coefficient is a negative number, the adjustment direction is decreasing; if the discrimination coefficient is a positive number, the adjustment direction is increasing.

10. The microcomputer host heat dissipation device with temperature adaptive control according to claim 1, characterized in that: The method for obtaining the corrected temperature includes: The error influence degree and the absolute value of the ambient temperature difference are multiplied and normalized to obtain an adjustment coefficient; and the monitoring temperature of the target area is adjusted using the adjustment coefficient according to the adjustment direction.

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