Temperature control method and device of electronic equipment, electronic equipment and storage medium

By regulating the working status of the application by using temperature sensors and user-perceived data in electronic devices, the problem of poor temperature regulation in the prior art is solved, and more refined and effective temperature control is achieved.

CN119759564APending Publication Date: 2025-04-04VIVO MOBILE COMM CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202411835267.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-12
Publication Date
2025-04-04

AI Technical Summary

Technical Problem

The prior art is not effective in regulating the temperature of electronic devices, especially the lack of targeted temperature control for different applications and scenarios, which affects user experience and equipment life.

Method used

Through the temperature information detected by each temperature sensor in the electronic device, the cooling pressure information of each application is determined, and the working status of the application is controlled to regulate the device temperature based on the user's perception of the application.

Benefits of technology

The fine control of the temperature of electronic equipment is achieved, the temperature regulation effect is improved, and the negative impact on user experience and equipment life is avoided.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN119759564A_ABST
    Figure CN119759564A_ABST
Patent Text Reader

Abstract

The present application discloses a temperature control method, device, electronic device and storage medium for an electronic device, belonging to the technical field of electronic devices. The method comprises: determining first cooling pressure information of each application according to first temperature information detected by each temperature sensor in the electronic device; determining the user's perception of each application according to the user's usage data of each application in the electronic device and the user's perception weight coefficient of each application; regulating the working state of each application according to the first cooling pressure information of each application and the user's perception of each application to regulate the temperature of the electronic device.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The present application belongs to the technical field of electronic equipment, and specifically relates to a temperature control method and device for electronic equipment, electronic equipment, and storage medium. Background Art

[0002] As the number and functions of applications in electronic devices increase, the electronic devices will generate heat during the operation of the applications. If the temperature of the electronic devices is too high, it will affect the user experience of the electronic devices and the service life of the electronic devices themselves.

[0003] At present, when it is detected that the temperature of an electronic device is too high, the operation strategy of the hardware resources of the application program running in the electronic device is usually changed. For example, the central processing unit (CPU) provides computing resources, and the application code runs on it. The CPU will provide certain resources to run the application code, such as 80% of its own resources to run the application code. When it is detected that the temperature of the electronic device is too high, the CPU can reduce its own operation capacity, such as to 50% of the original. In this way, the resources for running the application code still occupy 80%, but in fact the amount of code executed by the application per unit time is reduced to 50% of the original, so as to achieve the temperature control of the electronic device.

[0004] However, the above-mentioned strategy for regulating the temperature of the electronic device has a poor effect on regulating the temperature of the electronic device. Summary of the invention

[0005] The purpose of the embodiments of the present application is to provide a temperature control method, device, electronic device and storage medium for an electronic device, so as to improve the temperature control effect of the electronic device.

[0006] In a first aspect, an embodiment of the present application provides a temperature control method for an electronic device, the method comprising:

[0007] Determine first cooling pressure information of each application program according to first temperature information detected by each temperature sensor in the electronic device;

[0008] Determining the user's perception of each of the applications according to the user's usage data of each of the applications in the electronic device and the user's perception weight coefficient of each of the applications;

[0009] According to the first cooling pressure information of each application and the user's perception of each application, the working state of each application is regulated to regulate the temperature of the electronic device.

[0010] In a second aspect, an embodiment of the present application provides a temperature control device, the device comprising:

[0011] A first determining module, configured to determine first cooling pressure information of each application program according to first temperature information detected by each temperature sensor in the electronic device;

[0012] A second determination module is used to determine the user's perception of each of the applications according to the user's usage data of each of the applications in the electronic device and the user's perception weight coefficient of each of the applications;

[0013] The control module is used to control the working state of each application according to the first cooling pressure information of each application and the user's perception of each application, so as to control the temperature of the electronic device.

[0014] In a third aspect, an embodiment of the present application provides a readable storage medium, on which a program or instruction is stored, and when the program or instruction is executed by a processor, the steps of the method described in the first aspect are implemented.

[0015] In a fourth aspect, an embodiment of the present application provides a chip, comprising a processor and a communication interface, wherein the communication interface is coupled to the processor, and the processor is used to run a program or instruction to implement the method described in the first aspect.

[0016] In a fifth aspect, an embodiment of the present application provides a computer program product, which is stored in a storage medium and is executed by at least one processor to implement the method described in the first aspect.

[0017] In an embodiment of the present application, first temperature information detected by each temperature sensor in the electronic device is used to obtain first cooling pressure information of each application, and then based on the first cooling pressure information of each application and a comprehensive consideration of the user's perception of each application, the working state of each application in the electronic device is regulated, thereby achieving temperature regulation of the electronic device. Compared with the prior art of regulating the temperature of the electronic device by globally unified control of hardware resources, the temperature regulation scheme of the embodiment of the present application is more sophisticated and improves the temperature regulation effect on the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a schematic flow chart of a temperature control method provided in some embodiments of the present application;

[0019] Figure 2 is a schematic diagram of the association relationship between hardware resources and temperature sensors provided in some embodiments of the present application;

[0020] Figure 3 is a schematic diagram of the structure of a temperature control device shown in some embodiments of the present application;

[0021] Figure 4 is a schematic diagram of the structure of an electronic device shown in some embodiments of the present application;

[0022] Figure 5 It is a schematic diagram of the hardware structure of an electronic device shown in some embodiments of the present application. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present application to clearly describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the present application belong to the scope of protection of this application.

[0024] The terms "first", "second", etc. in the specification and claims of this application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or N. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0025] Before introducing the technical solution of the embodiment of the present application, the background technology of the embodiment of the present application is first introduced:

[0026] At present, when it is detected that the temperature of an electronic device is too high, the operation strategy of the hardware resources of the application programs running in the electronic device is usually changed. For example, the CPU will provide certain resources to run the code of each application program, such as 80% of its own resources to run the code of each application program. When it is detected that the temperature of the electronic device is too high, the CPU can reduce its own operation capacity, such as to 50% of the original. In this way, the resources for running the application code still occupy 80%, but in fact the amount of code executed by the application program per unit time is reduced to 50% of the original, so as to achieve the temperature control of the electronic device.

[0027] The above-mentioned strategy for regulating the temperature of electronic devices may affect the normal use of applications with high resource requirements if the CPU's operating capacity is reduced. For example, for audio and video playback applications, when the CPU runs at 80% of its resources, the audio and video can be played normally. However, if the CPU's operating capacity is reduced from 80% to 50%, the use of instant messaging applications will not be affected, but audio and video playback applications may experience lag when playing audio and video.

[0028] In addition, the above scheme lacks specificity in temperature control of electronic devices. For example, large network data traffic causes electronic devices to heat up, but limiting the CPU's operating resources does not solve the problem. The network continues to collect data, but the CPU may directly discard the message if it does not have time to process the data. As a result, the power consumption of the network module remains high and the overall control effect is weak.

[0029] In summary, the existing method directly limits the operating resources of the CPU without distinguishing between applications and scenarios, which will affect the user experience and has a poor temperature control effect on the electronic device. In order to solve the above problems, the embodiments of the present application provide a temperature control method, device, electronic device and storage medium, which obtains the first cooling pressure information of each application program through the first temperature information detected by each temperature sensor in the electronic device, and then controls the working state of each application program in the electronic device based on the first cooling pressure information of each application program and the user's perception of each application program, thereby realizing the temperature control of the electronic device. Compared with the prior art of controlling the temperature of the electronic device by globally and uniformly controlling the hardware resources, the temperature control scheme of the embodiments of the present application is more sophisticated and improves the temperature control effect of the electronic device.

[0030] The technical solution of the embodiment of the present application can be applied to a scenario in which the temperature of the electronic device is regulated by regulating the working status of each application in the electronic device when the temperature of the electronic device is high.

[0031] The temperature control method of the electronic device provided by the embodiment of the present application is described in detail below with reference to the accompanying drawings through specific embodiments and their application scenarios.

[0032] Figure 1 It is a flow chart of a temperature control method for an electronic device provided in an embodiment of the present application. The executor of the temperature control method for an electronic device may be an electronic device, which may be, but is not limited to, a personal computer (PC), a smart phone, a tablet computer or a personal digital assistant (PDA).

[0033] like Figure 1 As shown, the temperature control method of an electronic device provided in an embodiment of the present application may include steps 110 to 130.

[0034] Step 110: Determine first cooling pressure information of each application program according to first temperature information detected by each temperature sensor in the electronic device.

[0035] For any temperature sensor, the first temperature information corresponding thereto may be the temperature information detected by the temperature sensor at the temperature detection node where the temperature sensor is located.

[0036] The temperature detection node can be a node in an electronic device that can be used to detect the temperature of the electronic device. It should be noted that the location of the temperature detection node in the electronic device and the number of the temperature detection nodes can be set according to the performance of the electronic device and user needs, and are not limited in the embodiments of the present application.

[0037] For any application, the first cooling pressure information corresponding to it can be used to characterize the cooling pressure caused by each first temperature information on the application, and the first cooling pressure information can be a cooling pressure value. That is, if the application needs to be regulated when cooling the electronic device, how much will the pressure of each first temperature information affect the regulation of the application.

[0038] In some embodiments of the present application, in order to accurately obtain the first cooling pressure information of each application program, step 110 may specifically include:

[0039] Determine, according to the first temperature information detected by each temperature sensor in the electronic device, the second cooling pressure information corresponding to the first temperature information detected by each temperature sensor;

[0040] Determine third cooling pressure information corresponding to the hardware resource according to each second cooling pressure information and the association relationship between each temperature sensor and the hardware resource in the electronic device;

[0041] The first cooling pressure information of each application is determined according to the association relationship between the hardware resources and each application and the third cooling pressure information.

[0042] Among them, for the first temperature information detected by any temperature sensor, the corresponding second cooling pressure information can be the pressure information converted into the electronic device.

[0043] The third cooling pressure information may be the pressure of the hardware resources affected by the temperature sensor corresponding to each second cooling pressure flow information converted into each second cooling pressure flow information.

[0044] The number of the above-mentioned hardware resources can be at least one. The specific hardware resources can refer to hardware device resources or abstract resources of hardware device resources at the software implementation level, such as the CPU, which provides computing power resources on which the application code runs, and the software level abstraction is a process or thread, or even a higher-level abstraction is a job or task, which is executed through a general process or thread.

[0045] In some embodiments of the present application, the above-mentioned hardware resources may include but are not limited to: CPU, network processor (Neural-network Processing Unit, NPU), graphics processor (Graphics Processing Unit, GPU), universal flash storage (UFS), advanced digital signal processor (advanceddigital signal processor, ADSP), modem, mobile hotspot (Wireless Fidelity, Wi-Fi), Bluetooth Low Energy (Bluetooth Low Energy, Ble), camera and double data rate synchronous dynamic random access memory (Double Data Rate SDRAM, DDR).

[0046] In an embodiment of the present application, for each first temperature information, the second cooling pressure information corresponding to each first temperature information can be obtained by converting it into pressure information for the electronic device, and then based on the second cooling pressure information corresponding to each temperature sensor and the association between each temperature sensor and the hardware resources in the electronic device, the third cooling pressure information corresponding to the hardware resources can be determined, and then based on the association between the hardware resources and each application, the third cooling pressure information can be converted into the pressure value of each application associated with it, so that the first cooling pressure information of each application can be accurately obtained.

[0047] In some embodiments of the present application, in order to accurately determine the second cooling pressure information corresponding to each first temperature information, determining the second cooling pressure information corresponding to the first temperature information detected by each temperature sensor in the electronic device according to the first temperature information detected by each temperature sensor may specifically include:

[0048] For the first temperature information detected by each temperature sensor, the following steps are performed respectively to obtain the second cooling pressure information corresponding to the first temperature information detected by each temperature sensor:

[0049] In the case where the first temperature information changes within a preset time period, determining first sub-cooling pressure information caused by the first temperature information on the electronic device within the preset time period according to a change value of the first temperature information and a reference temperature information of the electronic device within the preset time period;

[0050] When the first temperature information is continuously higher than the first threshold value within a preset time period, integrating the change values ​​of the first temperature information and the reference temperature information within the preset time period to obtain second sub-cooling pressure information caused by the first temperature information on the electronic device within the preset time period;

[0051] According to the change trend of the first temperature information and the reference temperature information within the preset time period, third sub-cooling pressure information caused by the first temperature information on the electronic device within the preset time period is obtained;

[0052] The second cooling pressure information corresponding to the first temperature information is obtained according to the first sub-cooling pressure information, the second sub-cooling pressure information and the third sub-cooling pressure information.

[0053] Among them, the preset time period can be a pre-set period of time, such as 3 minutes or 2 minutes. The specific value of the preset time period can be set according to user needs and is not limited in the embodiments of the present application.

[0054] The reference temperature information may be pre-set temperature information of the electronic device for reference. The reference temperature information may be a temperature that causes the electronic device to generate heat but does not affect the normal operation of an application in the electronic device. For example, the reference temperature information may be 35°. The specific reference temperature information may be set according to the performance of the electronic device and user needs, and is not limited in the embodiments of the present application.

[0055] The first sub-cooling pressure information may be a change value between the first temperature information and the reference temperature information of the electronic device within a preset time period, and may be cooling pressure information caused to the electronic device.

[0056] The first threshold may be a preset temperature threshold, and the first threshold is that if the temperature of the first temperature information is continuously higher than the first threshold within a preset time period, the electronic device will heat up, thereby affecting the life of the electronic device. For example, the first threshold may be 45°. The value of the first threshold may be set according to the performance of the electronic device and user needs, and is not limited in the embodiments of the present application.

[0057] The second sub-cooling pressure information may be cooling pressure information caused to the electronic device by a change value of the first temperature information and the reference temperature information within a preset time period when the first temperature information is continuously higher than the first threshold within a preset time period.

[0058] The third sub-cooling pressure information may be the changing trend of the first temperature information and the reference temperature information within a preset time period, and the cooling pressure information caused to the electronic device.

[0059] In some embodiments of the present application, the high or low temperature itself usually represents certain pressure information, but the combination of temperature change trends can better reflect the actual possible pressure. Therefore, the temperature change ratio, change accumulation (i.e., integrating the changes) and change trend (i.e., differentiating the changes) can be combined to determine the second cooling pressure information corresponding to each first temperature information.

[0060] Here is the meaning of proportion, integration and differentiation:

[0061] Proportional: The proportional part adjusts the output according to the current deviation (the difference between the target value and the actual value). Increasing the proportional gain will make the system react faster to changes in the deviation, but may cause overshoot and oscillation.

[0062] Integration: The integration part adjusts the output by accumulating historical information of deviations. It compensates for long-term deviations to ensure that the system reaches a steady state. However, excessive integration gain may cause the system to respond slowly or become unstable.

[0063] Derivative: The derivative part adjusts the output according to the rate of change of the deviation. It can predict the future trend of the system and reduce overshoot and oscillation, but it may increase the impact of noise.

[0064] The above-mentioned temperature change ratio, change accumulation (i.e., integration of the change) and change trend (i.e., differentiation of the change) are combined into the embodiment of the present application to determine the second cooling pressure information corresponding to each first temperature information. Thus, for each first temperature information, the following steps can be performed respectively to obtain the second cooling pressure information corresponding to the first temperature information:

[0065] Ratio: When the first temperature information is greater than the reference temperature information of the electronic device, there is cooling pressure on the electronic device, and the greater the difference between the two, the greater the cooling pressure. The cooling pressure can be characterized by the difference between the two within a preset time period, that is, the first sub-cooling pressure information caused by the first temperature information on the electronic device within the preset time period can be determined based on the change value of the first temperature information and the reference temperature information of the electronic device within the preset time period.

[0066] In an example, taking the reference temperature information T0=35° and the first temperature information of a temperature sensor as T1, the difference between the first temperature information T1 and the reference temperature information T0 is represented by e(t) as it changes with time t. When the first temperature information T1 is higher than the reference temperature information T0, the electronic device is under cooling pressure, and the cooling pressure is represented by the difference between the first temperature information T1 and the reference temperature information T0 over time, and the first sub-cooling pressure information caused by the first temperature information on the electronic device within a preset time period is obtained.

[0067] It should be noted that, in order to improve the accuracy of the first sub-cooling pressure information, after obtaining the time difference between the first temperature information T1 and the reference temperature information T0, the time difference e(t) between the first temperature information T1 and the reference temperature information T0 can also be compared with a certain parameter K p Multiply by , so as to represent the first sub-cooling pressure information caused by the first temperature information on the electronic device within the preset time period, that is, the first sub-cooling pressure information caused by the first temperature information on the electronic device within the preset time period can be K P e(t).

[0068] It should be noted that the above parameter K p The value of can be set according to user needs and actual applications, and is not limited in the embodiments of the present application.

[0069] Integration: When the first temperature information is continuously at a high temperature within a preset time period, the cooling pressure brought by the first temperature information to the electronic device will become greater and greater as time goes on. Because of the continuous high temperature, the life of the components of the electronic device will be affected, and the probability of the user feeling hot will also increase. Therefore, the cooling pressure brought by the first temperature information to the electronic device can be determined based on the cumulative change of the first temperature information within the preset time period. That is, when the first temperature information is continuously higher than the first threshold within the preset time period, the change value of the first temperature information and the reference temperature information within the preset time period can be integrated and calculated to obtain the second sub-cooling pressure information caused by the first temperature information to the electronic device within the preset time period.

[0070] Continuing to refer to the above example, taking the first threshold of 45° as an example, e(t) can be integrated to obtain the second sub-cooling pressure information caused by the first temperature information on the electronic device within a preset time period.

[0071] It should be noted that when e(t) is integrated to obtain the second sub-cooling pressure information caused by the first temperature information on the electronic device within a preset time period, in order to avoid the influence of the model of the electronic device on the second sub-cooling pressure information, an adjustment coefficient K can be added after e(t) is integrated. iTo reduce the impact of the model of the electronic equipment on the second sub-cooling pressure information. The specific adjustment coefficient K i The value of can be set according to experience and the model of the electronic device, and is not limited in the embodiments of the present application.

[0072] In some embodiments of the present application, the cooling pressure information after adding the adjustment reference is determined as the second sub-cooling pressure information, that is, K i ∫e(t)dt is the second sub-cooling pressure information.

[0073] Differentiation: The pressure value is adjusted according to the changing trend of e(t), which is the differential of e(t) with respect to time. When the first temperature information decreases, the differential It is negative, that is, the current change trend of the first temperature information is downward, and the speed of its change is reflected in the size of the differential. This part can be used to reflect the size of the cooling pressure, that is, according to the change trend of the first temperature information and the reference temperature information in the preset time period, the third sub-cooling pressure information caused by the first temperature information on the electronic device in the preset time period can be obtained.

[0074] Continuing with the above example, we can differentiate e(t) and obtain

[0075] It should be noted that in order to improve the accuracy of the third sub-cooling pressure information, the parameter K d right By adjusting, the third sub-cooling pressure information can be obtained, that is, That is the third sub-cooling pressure information.

[0076] After determining the first sub-cooling pressure information caused by the temperature change ratio on the electronic device according to the temperature change ratio, determining the second sub-cooling pressure information caused by the temperature change accumulation on the electronic device according to the temperature change accumulation, and determining the third sub-cooling pressure information caused by the electronic device according to the change trend, the second cooling pressure information corresponding to the first temperature information can be obtained according to the first sub-cooling pressure information, the second sub-cooling pressure information and the third sub-cooling pressure information. Specifically, the second cooling pressure information corresponding to the first temperature information can be obtained according to the following formula (1):

[0077]

[0078] In the above formula (1), NTC pressure is the second cooling pressure information corresponding to the i-th temperature sensor.

[0079] In an embodiment of the present application, for each first temperature information, the second cooling pressure information corresponding to the first temperature information can be accurately determined based on the change value of the first temperature information within a preset time period, the accumulation of the change value of the first temperature information within the preset time period, and the change trend of the change value of the first temperature information within the preset time period.

[0080] In some embodiments of the present application, in order to accurately obtain the third cooling pressure information of the hardware resource, the third cooling pressure information corresponding to the hardware resource is determined according to each second cooling pressure information and the association relationship between each temperature sensor and the hardware resource in the electronic device, which may specifically include:

[0081] According to the association relationship between each temperature sensor and the hardware resources in the electronic device, respectively determine the cooling pressure information of each second cooling pressure information on the hardware resources;

[0082] According to the cooling pressure information of the hardware resources by each second cooling pressure information, the third cooling pressure information corresponding to the hardware resources is obtained.

[0083] In some embodiments of the present application, for each temperature sensor, after converting its corresponding first temperature information into first cooling pressure information, the pressure caused by the second cooling pressure information on the hardware resources can be determined according to the association between the temperature sensor and the hardware resources in the electronic device, that is, the cooling pressure information of the second cooling pressure information on the hardware resources, and then the third cooling pressure information corresponding to the hardware resources can be obtained based on the cooling pressure information of each second cooling pressure information on the hardware resources. Specifically, the cooling pressure information of each second cooling pressure information on the hardware resources can be summed to obtain the third cooling pressure information corresponding to the hardware resources.

[0084] In one example, reference Figure 2 ,exist Figure 2 In this example, the number of temperature sensors is 3. Figure 2 In the figure, ①, ② and ③ are used to represent three temperature sensors. Hardware resources are deployed around these three temperature sensors. Figure 2A CPU is deployed around temperature sensor ① and temperature sensor ②, and an NPU is deployed around temperature sensor ③. After obtaining the second cooling pressure information corresponding to temperature sensor ① and the second cooling pressure information corresponding to temperature sensor ②, the pressure caused by the second cooling pressure information of temperature sensor ① on the CPU can be calculated based on the association between temperature sensor ① and the hardware resource CPU, and the cooling pressure information of the second cooling pressure information of temperature sensor ① on the CPU can be obtained. Then, based on the association between temperature sensor ② and the hardware resource CPU, the pressure caused by the second cooling pressure information of temperature sensor ② on the CPU is calculated, and the cooling pressure information of the second cooling pressure information of temperature sensor ② on the CPU can be obtained. Then, the sum of the cooling pressure information caused by the second cooling pressure information of temperature sensor ① on the CPU and the cooling pressure information caused by the second cooling pressure information of temperature sensor ② on the CPU is used as the third cooling pressure information corresponding to the CPU.

[0085] In the case where there are multiple hardware resources, the third cooling pressure information corresponding to other hardware resources can be calculated according to the calculation method of the third cooling pressure information corresponding to the above-mentioned CPU, which will not be repeated here.

[0086] In an embodiment of the present application, by determining the correlation between each temperature sensor and the hardware resources in the electronic device, the cooling pressure information of each second cooling pressure information on the hardware resources can be determined respectively, and then the third cooling pressure information corresponding to the hardware resources can be accurately obtained based on the cooling pressure information of each second cooling pressure information on the hardware resources.

[0087] In some embodiments of the present application, in order to accurately obtain the cooling pressure information of each second cooling pressure information on the hardware resource, the cooling pressure information of each second cooling pressure information on the hardware resource is determined according to the association relationship between each temperature sensor and the hardware resource in the electronic device, which may include:

[0088] For each second cooling pressure information in the second cooling pressure information corresponding to each temperature sensor, the following steps are respectively performed to obtain the cooling pressure information of the second cooling pressure information on the hardware resource:

[0089] Acquire distance information between the temperature sensor corresponding to the second cooling pressure information and the hardware resources in the electronic device, and a specific heat capacity parameter at the temperature sensor corresponding to the second cooling pressure information;

[0090] According to the second cooling pressure information, the distance information and the specific heat capacity parameter, the cooling pressure information of the second cooling pressure information on the hardware resource is obtained.

[0091] For any second cooling pressure information, the specific heat capacity parameter at the corresponding temperature sensor may refer to the specific heat capacity parameter of the mainboard at the temperature sensor corresponding to the second cooling pressure information. The mainboard here may refer to the mainboard of the electronic device.

[0092] In some embodiments of the present application, there is a mainboard in each electronic device, and various hardware modules are provided on the mainboard, such as a CPU, a memory stick, etc. In theory, the specific heat capacity parameters of the same mainboard are the same, because the specific heat capacity parameters are related to the thermal conductivity properties of the mainboard, but because the temperatures at different hardware modules are different, the specific heat capacity parameters of the mainboards at different hardware modules will be different, but the specific heat capacity parameters of the mainboards at different hardware modules are not much different. Therefore, in the embodiments of the present application, the specific heat capacity parameters of the mainboard at each temperature sensor can be measured and obtained in real time, or in order to avoid measuring the specific heat capacity parameters of the mainboard at each temperature sensor, the specific heat capacity parameters of the mainboard at each temperature sensor are selected to be the same parameters, which is not limited in the embodiments of the present application.

[0093] In some embodiments of the present application, the reason for calculating the cooling pressure information of each second cooling pressure information on the hardware resources is: for example, the temperature measured by the temperature sensor 1 rises by 5°, then how much of this 5° is contributed by the CPU, that is, the current cooling pressure of the temperature sensor 1 represents the cooling pressure of the CPU.

[0094] In some embodiments of the present application, for each second cooling pressure information, the cooling pressure information of the second cooling pressure information on the hardware resource can be obtained based on the specific heat capacity parameter at the temperature sensor corresponding to the second cooling pressure information, and the distance information between the temperature sensor corresponding to the second cooling pressure information and the hardware resource.

[0095] Specifically, taking one hardware resource, which is a CPU, as an example, the second cooling pressure information corresponding to a certain temperature sensor for the cooling pressure information of the hardware resource can be obtained according to the following formula (2).

[0096]

[0097] In the above formula (2), NTC Pressure(i) is the second cooling pressure information corresponding to the i-th temperature sensor, D i 2 is the distance information between the i-th temperature sensor and the CPU, K c is the correlation factor corresponding to the i-th temperature sensor, and the correlation factor depends on the specific heat capacity parameter at the i-th temperature sensor.

[0098] In some embodiments of the present application, after obtaining the cooling pressure information of each second cooling pressure information on the hardware resource, the cooling pressure information of each second cooling pressure information on the hardware resource is summed to obtain the third cooling pressure information.

[0099] Continuing to refer to the above example, taking the hardware resource as one, which is a CPU, the third cooling pressure information corresponding to the CPU can be obtained according to the following formula (4):

[0100]

[0101] In the above formula (3), R Pressure is the third cooling pressure information, and n is the number of temperature sensors.

[0102] It should be noted that, when there are multiple temperature sensors associated with the CPU, the pressure caused by the second cooling pressure information corresponding to each temperature sensor can be obtained according to the above formula (3), and then the pressure caused by the second cooling pressure information corresponding to each temperature sensor can be summed to obtain the total cooling pressure of the CPU. Then, the pressure caused by the second cooling pressure information corresponding to each temperature sensor can be summed to obtain the total cooling pressure of the CPU, and the third cooling pressure information can be obtained.

[0103] In an embodiment of the present application, for each second cooling pressure information, the cooling pressure information of each second cooling pressure information on the hardware resource can be accurately obtained based on the specific heat capacity parameter at the temperature sensor corresponding to the second cooling pressure information, and the distance information between the temperature sensor corresponding to the second cooling pressure information and the hardware resource.

[0104] In some embodiments of the present application, in order to accurately determine the first cooling pressure information of the application, determining the first cooling pressure information of each application according to the association relationship between the hardware resources and each application and the third cooling pressure information may specifically include:

[0105] For each hardware resource, determine the proportion of each application associated with the hardware resource in the hardware resource;

[0106] Obtaining a pressure value of each application associated with the hardware resource according to the proportion corresponding to each application associated with the hardware resource and the third cooling pressure information of the hardware resource;

[0107] For each application, first cooling pressure information of the application is obtained according to the pressure value obtained by the application from each hardware resource.

[0108] In some embodiments of the present application, for a certain application, after obtaining the third cooling pressure information of each hardware resource, for any hardware resource, it is possible to calculate how much of all the third cooling pressure information of the hardware resource is brought by the application based on the proportion of the use of a certain application in the hardware resource. For example, taking the hardware resource as the CPU as an example, application 1 and application 2 are both running on the CPU. After obtaining the third cooling pressure information of the CPU, it is possible to determine how much of the third cooling pressure information of the CPU is brought by application 1 based on the proportion of resources used by application 1 in the CPU. In this way, when the working status of the application is finally adjusted, the working status of the application can be adjusted according to the pressure of each application.

[0109] In some embodiments of the present application, for each hardware resource, the pressure values ​​of multiple applications associated with the hardware resource can be calculated first, and then for each application, the first cooling pressure information of the application can be determined based on the pressure value obtained by the application from each hardware resource. Specifically, the pressure values ​​obtained by the application from each hardware resource can be summed to obtain the first cooling pressure information of the application.

[0110] For each hardware resource, when calculating the pressure values ​​of multiple applications associated with the hardware resource, the proportion of each application associated with the hardware resource in the hardware resource can be calculated first, and then the pressure value of each application associated with the hardware resource can be obtained based on the proportion corresponding to each application associated with the hardware resource and the third cooling pressure information of the hardware resource.

[0111] In some embodiments of the present application, the first cooling pressure information of any application program may be calculated according to the following formula (4):

[0112]

[0113] In the above formula (4), m is the number of hardware resources, L is the number of applications associated with the i-th hardware resource, and R a is the resource used by application a on the i-th hardware resource, is the proportion of application a in the i-th hardware resource, R Pressure (i) is the third cooling pressure information corresponding to the i-th hardware resource.

[0114] In an embodiment of the present application, for each hardware resource, the pressure values ​​of multiple applications associated with the hardware resource can be calculated first, and then for each application, the first cooling pressure information of the application can be accurately determined based on the pressure values ​​obtained by the application from each hardware resource.

[0115] Step 120: Determine the user's perception of each application based on the user's usage data of each application in the electronic device and the user's perception weight coefficient of each application.

[0116] Among them, for any application, the user's usage data of it may be the data of the user's use of it. For example, the running applications are application 1, application 2 and application 3, among which the user is operating application 1 on the front end, application 2 is downloading data in the background, and application 3 is playing music in the background. Then the user's usage of application 1, application 2 and application 3 is the user's usage data of application 1, application 2 and application 3.

[0117] In some embodiments of the present application, for any application, the corresponding usage data may include multiple usage status information of the user for the application, and the usage status information may be a status parameter used to characterize the user's perception of the application. The multiple usage status information here may include at least: foreground focus, visible background, audio usage, network traffic, Bluetooth connection, Global Positioning System (GPS) usage, recent use, virtual private network (VPN) and virtual screen.

[0118] The foreground focus mentioned above may be the current focus of the user, that is, the user is currently performing an operation in the foreground. For example, if the user is currently operating application 1 in the foreground, the current focus is application 1.

[0119] The visible background can be displayed in the foreground, but it is the background relative to the foreground focus. For example, the user is currently operating application 1 in the foreground, and application 2 is displayed in the form of a small window on the operation interface of application 1. Then, relative to application 1, it has a visible background, and its visible background is application 2.

[0120] The user's perceived weight coefficient for a certain application may be the user's perceived weight for each usage status information of the application. For a certain usage status information, the perceived weight coefficient may be the proportion of the usage status information in all usage status information.

[0121] In some embodiments of the present application, the setting of the perceived weight coefficients of multiple usage status information of the application can be set according to the running state of the application and the actual needs of the user. For example, taking the foreground focus and the visible background as an example, in actual operation, when there is a foreground focus, the user will generally pay more attention to the foreground focus, so in general, the coefficient of the foreground focus will be larger. On this basis, for the foreground focus, its visible background is generally what the user wants to pay attention to, so the weight of the visible background is also relatively large, but it is generally inferior to the foreground focus. In this way, according to user needs, the coefficients of multiple usage status information can be pre-set.

[0122] In one example, multiple usage status information including foreground focus, visible background, audio usage, network traffic, Bluetooth connection, GPS usage, recent usage, VPN and virtual screen are taken as an example, and the applications currently running in the electronic device are application 1, application 2, application 3, application 4, application 5 and application 6, wherein application 1 is a game application, application 2 is a video playback application, application 3 is an information reading application, application 4 is a system optimization application, application 5 is a utility application, and application 6 is an instant messaging application. The settings of the perception weight coefficients of the multiple usage status information corresponding to the above-mentioned application 1, application 2, application 3, application 4, application 5 and application 6 can be shown in the following Table 1. It should be noted that the perception weight coefficients of the multiple usage status information in the following Table 1 are only represented by letters and are not limited.

[0123] Table 1

[0124]

[0125] In some embodiments of the present application, in order to accurately obtain the user's perception of the application, step 120 may specifically include:

[0126] For each application, according to the relationship between the application and each usage status information, a relationship score of the application in each usage status information is obtained;

[0127] According to the relationship score of the application in each usage status information and the perception weight coefficient of each usage status information of the application, the user's perception of the application is obtained.

[0128] The relationship score of an application in a certain usage status information can be obtained based on the relationship between the application and the usage status information, and the relationship score can be in the range of {0,1}.

[0129] In some embodiments of the present application, the relationship score of the application in each usage status information is obtained based on the relationship between the application and each usage status information. Specifically, it can be determined whether the application has the usage status information, and the relationship score of the application in the usage status information can be obtained based on the determination result. Then, based on the relationship score of the application in each usage status information and the perception weight coefficient of each usage status information of the application, the user's perception of the application is obtained.

[0130] In an embodiment of the present application, based on the relationship between the application and each usage status information, the relationship score of the application in each usage status information is obtained, and then based on the relationship score of the application in each usage status information and the perception weight coefficient of each usage status information of the application, the user's perception of the application can be accurately obtained.

[0131] In some embodiments of the present application, in order to improve the flexibility of determining the relationship score of the application in the first usage status information, obtaining the relationship score of the application in each usage status information according to the relationship between the application and each usage status information may specifically include:

[0132] In the case of determining that the application has the first usage status information, determining that the relationship score of the application in the first usage status information is the first score;

[0133] In the case where it is determined that the application does not have the first usage status information, the relationship score of the application in the first usage status information is determined to be a second score.

[0134] The first usage status information may be any usage status information among multiple usage status information.

[0135] The first score may be a relationship score of the determined application in the first usage status information when it is determined that the application has the first usage status information. Specifically, the first score may be 1.

[0136] The second score may be a relationship score of the determined application in the first usage status information when it is determined that the application does not have the first usage status information. Specifically, the first score may be 0.

[0137] In some embodiments of the present application, when it is determined that the application has the first usage status information, the relationship score of the application in the first usage status information can be determined to be 1; when it is determined that the application does not have the first usage status information, the relationship score of the application in the first usage status information can be determined to be 0.

[0138] In the embodiment of the present application, the relationship score of the application in the first usage status information can be accurately determined according to whether the application has the first usage status information, thereby improving the flexibility of determining the relationship score of the application in the first usage status information.

[0139] In some embodiments of the present application, in order to accurately determine the user's perception of the application, the user's perception of the application is obtained according to the relationship score of the application in each usage status information and the perception weight coefficient of each usage status information of the application, which may specifically include:

[0140] determining the user's perception of the second usage status information according to the relationship score of the application in the second usage status information and the perception weight coefficient of the application in the second usage status information;

[0141] The user's perception of the application is determined according to the user's perception of each usage status information.

[0142] The second usage status information may be any usage status information among multiple usage status information.

[0143] In some embodiments of the present application, the product of the relationship score of the application in the second usage status information and the perception weight coefficient of the application in the second usage status information can be determined as the user's perception of the second usage status information, and then the user's perception of each usage status information is used to determine the user's perception of the application, as shown in the following formula (5):

[0144]

[0145] In the above formula (5), i is the ith application, w is the number of usage status information, state[i][j] is the relationship score of the ith application in the jth usage status information, and awaremap[i][j] is the perception weight coefficient of the ith application in the jth usage status information in Table 1 above.

[0146] In an embodiment of the present application, for each usage status information, the user's perception of the usage status information can be determined based on the relationship score of the application in the usage status information and the perception weight coefficient of the application in the usage status information. Then, based on the user's perception of each usage status information, the user's perception of the application can be accurately determined.

[0147] In some embodiments of the present application, the above-mentioned multiple usage status information may have little effect on the cooling pressure. In this case, in order to save computing power, before obtaining the relationship score of the application in each usage status information according to the relationship between the application and each usage status information, the above-mentioned method may also include:

[0148] According to the user score of each application in the multiple usage status information, the usage status information having the user score greater than a second threshold is selected from the multiple usage status information to obtain the target usage status information;

[0149] The step of obtaining the relationship score of the application in each usage status information according to the relationship between the application and each usage status information may specifically include:

[0150] According to the relationship between the application and the target usage status information, a relationship score of the application in the target usage status information is obtained.

[0151] The user rating may be a user's rating of a plurality of usage status information, and the user rating may be collected by visiting a plurality of users before step 110 .

[0152] The second threshold may be a pre-set user score threshold, and the value of the second threshold may be set according to user needs and is not limited in the embodiments of the present application.

[0153] The target usage status information may be at least one usage status information selected from the plurality of usage status information and having a user score greater than a second threshold.

[0154] In some embodiments of the present application, based on the user score of each application in multiple usage status information, usage status information with a user score greater than a second threshold can be selected from the multiple usage status information to obtain target usage status information, and then based on the relationship between the application and the target usage status information, the relationship score of the application in the target usage status information can be obtained, that is, w in the above formula (5) can be the number of target usage status information.

[0155] In an embodiment of the present application, by selecting usage status information with a user score greater than a second threshold from multiple usage status information, target usage status information is obtained, and then based on the relationship between the application and the target usage status information, the relationship score of the application in the target usage status information is obtained, which can save computing power.

[0156] Step 130: According to the first cooling pressure information of each application and the user's perception of each application, the working state of each application is regulated to regulate the temperature of the electronic device.

[0157] In some embodiments of the present application, in order to accurately control the working state of each application, step 130 may specifically include:

[0158] Determine, according to the first cooling pressure information of each application and the user's perception of each application, fourth cooling pressure information of each application on the electronic device;

[0159] According to the fourth cooling pressure information of each application program on the electronic device, the working state of each application program is regulated.

[0160] The fourth cooling pressure information may be cooling pressure information actually effective for each application on the electronic device, obtained by combining the user's perception of each application.

[0161] In some embodiments of the present application, the fourth cooling pressure information of each application on the electronic device can be determined according to the first cooling pressure information of each application and the user's perception of each application according to the following formula (6):

[0162] f app_aware_i (app) = f app_aware_factor_i (app)·A Pressure (resource,app) / k (6)

[0163] Among them, f app_aware_i (app) is the fourth cooling pressure information of the i-th application, and k is the maximum value of the perception weight coefficients of multiple usage status information of the i-th application.

[0164] Then, according to the fourth cooling pressure information of each application program on the electronic device, the working state of each application program is regulated.

[0165] In an embodiment of the present application, based on the first cooling pressure information of each application and the user's perception of each application, the fourth cooling pressure information of each application on the electronic device can be determined respectively, and then based on the fourth cooling pressure information of each application on the electronic device, the working state of each application can be regulated, so that the working state of each application can be accurately regulated.

[0166] In some embodiments of the present application, in order to further improve the accuracy of regulating the working state of each application, before regulating the working state of each application according to the fourth cooling pressure information of each application on the electronic device, the above method may further include:

[0167] For each application, the fourth cooling pressure information is smoothed and calibrated according to the user's perception of the application to obtain the fourth cooling pressure information after smoothing and calibrating;

[0168] The regulating the working state of each application according to the fourth cooling pressure information of each application on the electronic device may specifically include:

[0169] The working state of each application is regulated according to the fourth cooling pressure information after smoothing and calibrating of each application.

[0170] In some embodiments of the present application, for each application, the fourth cooling pressure information may be smoothed and calibrated according to the user's perception of the application to obtain the fourth cooling pressure information after smoothing and calibrating. Specifically, for a certain application, the fourth cooling pressure information of the application may be smoothed and calibrated according to the function conversion process shown in the following formula (7) to obtain the fourth cooling pressure information of the application after smoothing and calibrating:

[0171]

[0172] In the above formula (7), f app_aware_to_effective (app) is the fourth cooling pressure information after smoothing calibration; x=f app_aware_i (app); β is a value set according to prior experience, and when the fourth cooling pressure information of the application is greater than this value, the application is not processed; α is another value set according to prior experience, and when the user's perception of the two applications is difficult to distinguish, the value is used to distinguish the user's perception of the two applications well; k is the maximum value of the perception weight coefficients of multiple usage status information of the application.

[0173] In an embodiment of the present application, for each application, the fourth cooling pressure information is smoothly calibrated through the user's perception of the application to obtain the fourth cooling pressure information after the smooth calibration, and then the working state of each application is regulated according to the fourth cooling pressure information after the smooth calibrated application, thereby further improving the accuracy of regulating the working state of each application.

[0174] In some embodiments of the present application, in order to improve the control flexibility of the first application, the control of the working state of each application according to the fourth cooling pressure information of each application on the electronic device may specifically include:

[0175] When it is determined that the fourth cooling pressure information of the first application on the electronic device is less than or equal to the third threshold, the working state of the first application is not processed;

[0176] When it is determined that the fourth cooling pressure information of the first application on the electronic device is between the third threshold and the fourth threshold, regulating the working state of the first application according to the occupation of the hardware resources by the first application;

[0177] When it is determined that the fourth cooling pressure information of the first application on the electronic device is greater than or equal to the fourth threshold, the first application is forcibly exited.

[0178] The first application may be any application among the applications.

[0179] The third threshold may be a pre-set threshold of the fourth cooling pressure information of the electronic device by the first application. When the fourth cooling pressure information of the electronic device by the first application is less than or equal to the third threshold, no processing is performed on the first application. The value of the third threshold may be set according to user needs and is not limited in the embodiments of the present application.

[0180] The fourth threshold may be a pre-set threshold of the fourth cooling pressure information of the first application on the electronic device. When the fourth cooling pressure information of the first application on the electronic device is between the third threshold and the fourth threshold, the working state of the first application is regulated according to the amount of hardware resources occupied by the first application. The value of the fourth threshold may be set according to user needs and is not limited in the embodiments of the present application.

[0181] The fourth threshold mentioned above is greater than the third threshold.

[0182] In some embodiments of the present application, when it is determined that the fourth cooling pressure information of the first application on the electronic device is less than or equal to the third threshold, the working state of the first application may not be processed.

[0183] When it is determined that the fourth cooling pressure information of the first application on the electronic device is between the third threshold and the fourth threshold, the working state of the first application can be regulated according to the occupation of the hardware resources by the first application. Specifically, the frequency and / or amount of use of the hardware resources by the first application can be increased or decreased according to the occupation of the hardware resources by the first application.

[0184] When it is determined that the fourth cooling pressure information of the first application on the electronic device is greater than or equal to the fourth threshold, the first application is forcibly exited. That is, when it is determined that the fourth cooling pressure information of the first application on the electronic device is greater than or equal to the fourth threshold, the first application is forcibly exited.

[0185] Specifically, it is shown in the following formula (8):

[0186]

[0187] In the above formula (8), the values ​​of α and β are the same as those in the above formula (7), and will not be repeated here.

[0188] In an embodiment of the present application, different control methods may be adopted for the first application according to the fourth cooling pressure information of the electronic device by the first application, thereby improving the control flexibility of the first application.

[0189] In some embodiments of the present application, after the working state of each application is regulated according to the fourth cooling pressure information of each application on the electronic device, the method involved may further include:

[0190] After determining to regulate the working state of each application program, the fifth cooling pressure information of the hardware resources.

[0191] The fifth cooling pressure information may be cooling pressure information of hardware resources after adjusting the working status of each application program.

[0192] In some embodiments of the present application, after the working status of each application program is regulated, the cooling pressure information of the hardware resources may be re-determined.

[0193] In an embodiment of the present application, after regulating the working state of each application, the cooling pressure information of the hardware resources is re-determined so that the working state of each application can be further regulated according to the re-determined cooling pressure information of the hardware resources.

[0194] In some embodiments of the present application, in order to accurately determine the fifth cooling pressure information of the hardware resources, the fifth cooling pressure information of the hardware resources after the working state of each application is regulated may specifically include:

[0195] Determine the fourth sub-cooling pressure information of the forced exit application on the hardware resources, the fifth sub-cooling pressure information of the regulated application on the hardware resources, and the sixth sub-cooling pressure information of the unprocessed application on the hardware resources;

[0196] The fifth cooling pressure information of the hardware resources after regulating the working state of each application program is determined according to the third cooling pressure information, the fourth sub-cooling pressure information, the fifth sub-cooling pressure information and the sixth sub-cooling pressure information.

[0197] The fourth sub-cooling pressure information may be the cooling pressure information of the forced exit application on the hardware resources.

[0198] The fifth sub-cooling pressure information may be cooling pressure information of the regulated application on the hardware resources.

[0199] The sixth sub-cooling pressure information may be cooling pressure information of the application program that is not processed on the hardware resources.

[0200] In some embodiments of the present application, the fourth sub-cooling pressure information of the forced exit application on the hardware resources, the fifth sub-cooling pressure information of the regulated application on the hardware resources, and the sixth sub-cooling pressure information of the non-processed application on the hardware resources can be obtained, and then the fifth cooling pressure information of the hardware resources after the working status of each application is regulated can be determined based on the fourth cooling pressure information, the fourth sub-cooling pressure information, the fifth sub-cooling pressure information and the sixth sub-cooling pressure information.

[0201] Specifically, according to the fourth cooling pressure information, the fourth sub-cooling pressure information, the fifth sub-cooling pressure information and the sixth sub-cooling pressure information, after determining to adjust the working status of each application, the fifth cooling pressure information of the hardware resources can be the cooling pressure information of the hardware resources obtained by subtracting the cooling pressure information of the forced exit application on the hardware resources from the total pressure information of the hardware resources.

[0202] Then, the cooling pressure information of the application programs that are not to be processed on the hardware resources is reallocated to the cooling pressure information of the application programs that should be controlled on the hardware resources. The fifth cooling pressure information can be obtained. The specific information is shown in the following formula (9):

[0203]

[0204] In the above formula (9), is the fourth sub-cooling pressure information, l1 is the number of applications that are forced to exit; is the fifth sub-cooling pressure information, l2 is the number of applications to be regulated; is the sixth sub-cooling pressure information, and l3 is the number of applications that are not processed.

[0205] It should be noted that the above formula (9) is explained by taking one hardware resource, namely, a CPU, as an example.

[0206] In an embodiment of the present application, the fifth sub-cooling pressure information of the hardware resources of the application that is forced to exit, the fifth sub-cooling pressure information of the hardware resources of the application that is being regulated, and the sixth sub-cooling pressure information of the hardware resources of the application that is not being processed, can accurately determine the fifth cooling pressure information of the hardware resources after the working status of each application is regulated.

[0207] In some embodiments of the present application, in order to prevent the electronic device from malfunctioning due to heat generation, the process of steps 110 to 140 may be performed once at regular intervals, thereby maintaining a loop feedback process for the electronic device to control its heat generation.

[0208] The temperature control method of the electronic device provided in the embodiment of the present application can be executed by a temperature control device of the electronic device. In the embodiment of the present application, the temperature control device of the electronic device performing the temperature control method of the electronic device is taken as an example to illustrate the temperature control device of the electronic device provided in the embodiment of the present application.

[0209] Figure 3 FIG. 1 is a schematic diagram showing a temperature control device of an electronic device according to an exemplary embodiment. Figure 3 As shown, the temperature control device 500 of the electronic device may include:

[0210] A first determining module 510, configured to determine first cooling pressure information of each application program according to first temperature information detected by each temperature sensor in the electronic device;

[0211] A second determination module 520, configured to determine the user's perception of each of the applications in the electronic device according to the user's usage data of each of the applications and the user's perception weight coefficient of each of the applications;

[0212] The control module 530 is used to control the working state of each application according to the first cooling pressure information of each application and the user's perception of each application, so as to control the temperature of the electronic device.

[0213] In an embodiment of the present application, first temperature information detected by each temperature sensor in the electronic device is used to obtain first cooling pressure information of each application, and then based on the first cooling pressure information of each application and a comprehensive consideration of the user's perception of each application, the working state of each application in the electronic device is regulated, thereby achieving temperature regulation of the electronic device. Compared with the prior art of regulating the temperature of the electronic device by globally unified control of hardware resources, the temperature regulation scheme of the embodiment of the present application is more sophisticated and improves the temperature regulation effect on the electronic device.

[0214] In some embodiments of the present application, the first determining module 510 may include:

[0215] A first determining unit, configured to determine, according to first temperature information detected by each temperature sensor in the electronic device, second cooling pressure information corresponding to the first temperature information detected by each temperature sensor;

[0216] A second determining unit, configured to determine third cooling pressure information corresponding to the hardware resource according to each of the second cooling pressure information and an association relationship between each of the temperature sensors and the hardware resource in the electronic device;

[0217] The third determining unit is used to determine the first cooling pressure information of each application according to the association relationship between the hardware resources and each application and the third cooling pressure information.

[0218] In some embodiments of the present application, the second determining unit may include:

[0219] A first determining subunit, configured to determine the cooling pressure information of each of the second cooling pressure information on the hardware resources according to the association relationship between each of the temperature sensors and the hardware resources in the electronic device;

[0220] The second determining subunit is used to obtain the third cooling pressure information corresponding to the hardware resource according to the cooling pressure information of the hardware resource of each of the second cooling pressure information.

[0221] In some embodiments of the present application, the number of the hardware resource is at least one, and the third determining unit is specifically configured to:

[0222] For each hardware resource, determining the proportion of each application associated with the hardware resource in the hardware resource;

[0223] Obtaining a pressure value of each application associated with the hardware resource according to the proportion corresponding to each application associated with the hardware resource and the third cooling pressure information of the hardware resource;

[0224] For each application, first cooling pressure information of the application is obtained according to the pressure value obtained by the application from each of the hardware resources.

[0225] In some embodiments of the present application, the usage data of each application includes a plurality of usage status information of the user for the application, and the second determination module 520 may include:

[0226] A fourth determining unit is used to obtain, for each application program, a relationship score of the application program in each piece of usage status information according to a relationship between the application program and each piece of usage status information;

[0227] The fifth determining unit is used to obtain the user's perception of the application according to the relationship score of the application in each usage status information and the perception weight coefficient of each usage status information of the application.

[0228] In some embodiments of the present application, the control module 530 may include:

[0229] a sixth determining unit, configured to determine fourth cooling pressure information of each application on the electronic device according to the first cooling pressure information of each application and the user's perception of each application;

[0230] The control unit is used to control the working state of each application according to the fourth cooling pressure information of each application on the electronic device.

[0231] In some embodiments of the present application, the control unit is specifically used for:

[0232] When it is determined that the fourth cooling pressure information of the first application on the electronic device is less than or equal to the third threshold, the working state of the first application is not processed;

[0233] When it is determined that the fourth cooling pressure information of the first application on the electronic device is between the third threshold and the fourth threshold, regulating the working state of the first application according to the occupation of the hardware resources by the first application;

[0234] When it is determined that the fourth cooling pressure information of the first application on the electronic device is greater than or equal to the fourth threshold, forcibly exiting the first application;

[0235] The first application is any application among various applications.

[0236] The temperature control device of the electronic device in the embodiment of the present application can be an electronic device, or a component in the electronic device, such as an integrated circuit or a chip. The electronic device can be a terminal, or other devices other than a terminal. Exemplarily, the electronic device can be a mobile phone, a tablet computer, a laptop computer, a PDA, a car electronic device, a mobile Internet device (Mobile Internet Device, MID), an augmented reality (augmented reality, AR) / virtual reality (virtual reality, VR) device, a robot, a wearable device, an ultra-mobile personal computer (ultra-mobile personal computer, UMPC), a netbook or a personal digital assistant (personal digital assistant, PDA), etc., and can also be a server, a network attached storage (Network Attached Storage, NAS), a personal computer (personal computer, PC), a television (television, TV), a teller machine or a self-service machine, etc., which is not specifically limited in the embodiment of the present application.

[0237] The temperature control device of the electronic device in the embodiment of the present application may be a device having an operating system. The operating system may be an Android operating system, an iOS operating system, or other possible operating systems, which are not specifically limited in the embodiment of the present application.

[0238] The temperature control device of the electronic device provided in the embodiment of the present application can achieve Figure 1 To avoid repetition, the various processes implemented by the method embodiment are not described here.

[0239] Alternatively, if Figure 4 As shown, an embodiment of the present application also provides an electronic device 600, including a processor 601 and a memory 602, wherein the memory 602 stores programs or instructions that can be executed on the processor 601, and when the program or instructions are executed by the processor 601, the various steps of the temperature control method embodiment of the above-mentioned electronic device are implemented, and the same technical effect can be achieved. To avoid repetition, they are not repeated here.

[0240] It should be noted that the electronic devices in the embodiments of the present application include the mobile electronic devices and non-mobile electronic devices mentioned above.

[0241] Figure 5 A schematic diagram of the hardware structure of an electronic device to implement an embodiment of the present application.

[0242] The electronic device 700 includes but is not limited to: a radio frequency unit 701, a network module 702, an audio output unit 703, an input unit 704, a sensor 705, a display unit 706, a user input unit 707, an interface unit 708, a memory 709, and a processor 710.

[0243] Those skilled in the art will appreciate that the electronic device 700 may also include a power source (such as a battery) for supplying power to each component, and the power source may be logically connected to the processor 710 through a power management system, thereby implementing functions such as managing charging, discharging, and power consumption management through the power management system. Figure 5 The electronic device structure shown in the figure does not constitute a limitation on the electronic device. The electronic device may include more or fewer components than shown in the figure, or combine certain components, or arrange the components differently, which will not be described in detail here.

[0244] Among them, the processor 710 is used to determine the first cooling pressure information of each application according to the first temperature information detected by each temperature sensor in the electronic device; determine the user's perception of each application according to the user's usage data of each application in the electronic device and the user's perception weight coefficient of each application; and regulate the working state of each application according to the first cooling pressure information of each application and the user's perception of each application to regulate the temperature of the electronic device.

[0245] In this way, the first temperature information detected by each temperature sensor in the electronic device is used to obtain the first cooling pressure information of each application, and then the working state of each application in the electronic device is regulated based on the first cooling pressure information of each application and a comprehensive consideration of the user's perception of each application, thereby achieving temperature regulation of the electronic device. Compared with the prior art of regulating the temperature of the electronic device by globally unified control of hardware resources, the temperature regulation scheme of the embodiment of the present application is more sophisticated and improves the temperature regulation effect on the electronic device.

[0246] Optionally, the processor 710 is further used to determine, based on the first temperature information detected by each temperature sensor in the electronic device, second cooling pressure information corresponding to the first temperature information detected by each temperature sensor; determine, based on each of the second cooling pressure information and the association relationship between each of the temperature sensors and the hardware resources in the electronic device, third cooling pressure information corresponding to the hardware resources; and determine, based on the association relationship between the hardware resources and each application and the third cooling pressure information, the first cooling pressure information of each application.

[0247] In this way, for each first temperature information, the second cooling pressure information corresponding to each first temperature information can be obtained by converting it into pressure information for the electronic device, and then the third cooling pressure information corresponding to the hardware resources can be determined based on the second cooling pressure information corresponding to each temperature sensor and the association between each temperature sensor and the hardware resources in the electronic device. Then, based on the association between the hardware resources and each application, the third cooling pressure information can be converted into the pressure value of each application associated with it, so that the first cooling pressure information of each application can be accurately obtained.

[0248] Optionally, the processor 710 is also used to determine the cooling pressure information of each second cooling pressure information on the hardware resources based on the association between each temperature sensor and the hardware resources in the electronic device; and obtain the third cooling pressure information corresponding to the hardware resources based on the cooling pressure information of each second cooling pressure information on the hardware resources.

[0249] In this way, by determining the correlation between each temperature sensor and the hardware resources in the electronic device, the cooling pressure information of each second cooling pressure information on the hardware resources can be determined respectively, and then the third cooling pressure information corresponding to the hardware resources can be accurately obtained based on the cooling pressure information of each second cooling pressure information on the hardware resources.

[0250] Optionally, the number of the hardware resources is at least one, and the processor 710 is further used to determine, for each hardware resource, the proportion of each application associated with the hardware resource in the hardware resource; obtain the pressure value of each application associated with the hardware resource based on the proportion corresponding to each application associated with the hardware resource and the third cooling pressure information of the hardware resource; for each application, obtain the first cooling pressure information of the application based on the pressure value obtained by the application from each of the hardware resources.

[0251] In this way, for each hardware resource, the pressure values ​​of multiple applications associated with the hardware resource can be calculated first, and then for each application, the first cooling pressure information of the application can be accurately determined based on the pressure value obtained by the application from each hardware resource.

[0252] Optionally, the usage data of each application includes multiple usage status information of the user for the application. The processor 710 is further used to obtain, for each application, a relationship score of the application in each usage status information based on the relationship between the application and each usage status information; and obtain the user's perception of the application based on the relationship score of the application in each usage status information and the perception weight coefficient of each usage status information of the application.

[0253] In this way, based on the relationship between the application and each usage status information, the relationship score of the application in each usage status information is obtained, and then based on the relationship score of the application in each usage status information and the perception weight coefficient of each usage status information of the application, the user's perception of the application can be accurately obtained.

[0254] Optionally, the processor 710 is further used to determine the fourth cooling pressure information of each application on the electronic device based on the first cooling pressure information of each application and the user's perception of each application; and to regulate the working state of each application based on the fourth cooling pressure information of each application on the electronic device.

[0255] In this way, based on the first cooling pressure information of each application and the user's perception of each application, the fourth cooling pressure information of each application on the electronic device can be determined respectively, and then based on the fourth cooling pressure information of each application on the electronic device, the working state of each application can be regulated, so that the working state of each application can be accurately regulated.

[0256] Optionally, the processor 710 is further used to, if it is determined that the fourth cooling pressure information of the first application on the electronic device is less than or equal to a third threshold, not process the working state of the first application; if it is determined that the fourth cooling pressure information of the first application on the electronic device is between the third threshold and the fourth threshold, regulate the working state of the first application according to the occupation of hardware resources by the first application; if it is determined that the fourth cooling pressure information of the first application on the electronic device is greater than or equal to the fourth threshold, force the first application to exit; wherein the first application is any application among the applications.

[0257] In this way, according to the fourth cooling pressure information of the electronic device by the first application, different control methods can be adopted for the first application, thereby improving the control flexibility of the first application.

[0258] It should be understood that in the embodiment of the present application, the input unit 704 may include a graphics processor (Graphics Processing Unit, GPU) 7041 and a microphone 7042, and the graphics processor 7041 processes the image data of the static picture or video obtained by the image capture device (such as a color camera) in the video capture mode or the image capture mode. The display unit 706 may include a display panel 7061, and the display panel 7061 may be configured in the form of a liquid crystal display, an organic light emitting diode, etc. The user input unit 707 includes a touch panel 7071 and at least one of other input devices 7072. The touch panel 7071 is also called a touch screen. The touch panel 7071 may include two parts: a touch detection device and a touch controller. Other input devices 7072 may include, but are not limited to, a physical keyboard, function keys (such as volume control keys, switch keys, etc.), a trackball, a mouse, and a joystick, which will not be repeated here.

[0259] The memory 709 can be used to store software programs and various data. The memory 709 may mainly include a first storage area for storing programs or instructions and a second storage area for storing data, wherein the first storage area may store an operating system, an application program or instructions required for at least one function (such as a sound playback function, an image playback function, etc.), etc. In addition, the memory 709 may include a volatile memory or a non-volatile memory, or the memory 709 may include both volatile and non-volatile memories. Among them, the non-volatile memory may be a read-only memory (ROM), a programmable read-only memory (PROM), an erasable programmable read-only memory (EPROM), an electrically erasable programmable read-only memory (EEPROM), or a flash memory. The volatile memory may be a random access memory (RAM), a static random access memory (SRAM), a dynamic random access memory (DRAM), a synchronous dynamic random access memory (SDRAM), a double data rate synchronous dynamic random access memory (DDRSDRAM), an enhanced synchronous dynamic random access memory (ESDRAM), a synchronous link dynamic random access memory (SLDRAM) and a direct memory bus random access memory (DRRAM). The memory 709 in the embodiment of the present application includes but is not limited to these and any other suitable types of memory.

[0260] The processor 710 may include one or more processing units; optionally, the processor 710 integrates an application processor and a modem processor, wherein the application processor mainly processes operations related to an operating system, a user interface, and application programs, and the modem processor mainly processes wireless communication signals, such as a baseband processor. It is understandable that the modem processor may not be integrated into the processor 710.

[0261] An embodiment of the present application also provides a readable storage medium, on which a program or instruction is stored. When the program or instruction is executed by a processor, each process of the temperature control method embodiment of the above-mentioned electronic device is implemented, and the same technical effect can be achieved. To avoid repetition, it will not be repeated here.

[0262] The processor is the processor in the electronic device described in the above embodiment. The readable storage medium includes a computer readable storage medium, such as a computer read-only memory ROM, a random access memory RAM, a magnetic disk or an optical disk.

[0263] An embodiment of the present application further provides a chip, which includes a processor and a communication interface, wherein the communication interface is coupled to the processor, and the processor is used to run programs or instructions to implement the various processes of the temperature control method embodiment of the above-mentioned electronic device, and can achieve the same technical effect. To avoid repetition, it will not be repeated here.

[0264] It should be understood that the chip mentioned in the embodiments of the present application can also be called a system-level chip, a system chip, a chip system or a system-on-chip chip, etc.

[0265] An embodiment of the present application provides a computer program product, which is stored in a storage medium. The program product is executed by at least one processor to implement the various processes of the temperature control method embodiment of the electronic device as described above, and can achieve the same technical effect. To avoid repetition, it will not be repeated here.

[0266] It should be noted that, in this article, the terms "comprise", "include" or any other variant thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise one..." do not exclude the presence of other identical elements in the process, method, article or device including the element. In addition, it should be pointed out that the scope of the methods and devices in the embodiments of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in reverse order according to the functions involved, for example, the described method may be performed in an order different from that described, and various steps may also be added, omitted, or combined. In addition, the features described with reference to certain examples may be combined in other examples.

[0267] Through the description of the above implementation methods, those skilled in the art can clearly understand that the above-mentioned embodiment methods can be implemented by means of software plus a necessary general hardware platform, and of course by hardware, but in many cases the former is a better implementation method. Based on such an understanding, the technical solution of the present application, or the part that contributes to the prior art, can be embodied in the form of a computer software product, which is stored in a storage medium (such as ROM / RAM, a disk, or an optical disk), and includes a number of instructions for a terminal (which can be a mobile phone, a computer, a server, or a network device, etc.) to execute the methods described in each embodiment of the present application.

[0268] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. A temperature control method for an electronic device, characterized in that: The method comprises: Determine first cooling pressure information of each application program according to first temperature information detected by each temperature sensor in the electronic device; Determining the user's perception of each of the applications according to the user's usage data of each of the applications in the electronic device and the user's perception weight coefficient of each of the applications; According to the first cooling pressure information of each application and the user's perception of each application, the working state of each application is regulated to regulate the temperature of the electronic device.

2. The method according to claim 1, characterized in that The step of determining first cooling pressure information of each application program according to first temperature information detected by each temperature sensor in the electronic device includes: Determine, according to the first temperature information detected by each temperature sensor in the electronic device, the second cooling pressure information respectively corresponding to the first temperature information detected by each temperature sensor; Determine third cooling pressure information corresponding to the hardware resource according to each of the second cooling pressure information and the association relationship between each of the temperature sensors and the hardware resources in the electronic device; The first cooling pressure information of each application is determined according to the association relationship between the hardware resources and each application and the third cooling pressure information.

3. The method according to claim 2, characterized in that The determining, according to each of the second cooling pressure information and the association relationship between each of the temperature sensors and the hardware resources in the electronic device, the third cooling pressure information corresponding to the hardware resource includes: According to the association relationship between each of the temperature sensors and the hardware resources in the electronic device, respectively determine the cooling pressure information of each of the second cooling pressure information on the hardware resources; According to the cooling pressure information of the hardware resources for each of the second cooling pressure information, the third cooling pressure information corresponding to the hardware resources is obtained.

4. The method according to claim 2, characterized in that: The number of the hardware resource is at least one; The converting the third cooling pressure information corresponding to the hardware resource into the pressure value of each application associated with the hardware resource according to the association relationship between the hardware resource and each application to obtain the first cooling pressure information of each application includes: For each hardware resource, determining the proportion of each application associated with the hardware resource in the hardware resource; Obtaining a pressure value of each application associated with the hardware resource according to the proportion corresponding to each application associated with the hardware resource and the third cooling pressure information of the hardware resource; For each application, first cooling pressure information of the application is obtained according to the pressure value obtained by the application from each of the hardware resources.

5. The method according to claim 1, characterized in that The usage data of each application includes a plurality of usage status information of the user on the application; Determining the user's perception of each application in the electronic device according to the user's usage data of each application and the user's perception weight coefficient of each application includes: For each application, according to the relationship between the application and each piece of usage status information, obtain a relationship score of the application in each piece of usage status information; The user's perception of the application is obtained according to the relationship score of the application in each usage status information and the perception weight coefficient of each usage status information of the application.

6. The method according to claim 1, characterized in that The step of regulating the working state of each application according to the first cooling pressure information of each application and the user's perception of each application includes: Determining fourth cooling pressure information of each application on the electronic device according to the first cooling pressure information of each application and the user's perception of each application; The working state of each of the applications is regulated according to the fourth cooling pressure information of each of the applications on the electronic device.

7. The method according to claim 6, characterized in that The step of regulating the working state of each application according to the fourth cooling pressure information of each application on the electronic device includes: When it is determined that the fourth cooling pressure information of the first application on the electronic device is less than or equal to the third threshold, the working state of the first application is not processed; When it is determined that the fourth cooling pressure information of the first application on the electronic device is between the third threshold and the fourth threshold, regulating the working state of the first application according to the occupation of the hardware resources by the first application; When it is determined that the fourth cooling pressure information of the first application on the electronic device is greater than or equal to the fourth threshold, forcibly exiting the first application; The first application is any application among various applications.

8. A temperature control device for an electronic device, characterized in that: The device comprises: A first determining module, configured to determine first cooling pressure information of each application program according to first temperature information detected by each temperature sensor in the electronic device; A second determination module is used to determine the user's perception of each of the applications according to the user's usage data of each of the applications in the electronic device and the user's perception weight coefficient of each of the applications; The control module is used to control the working state of each application according to the first cooling pressure information of each application and the user's perception of each application, so as to control the temperature of the electronic device.

9. An electronic device, characterized in that: The device comprises a processor and a memory, wherein the memory stores a program or instruction that can be run on the processor, and when the program or instruction is executed by the processor, the steps of the temperature control method of the electronic device as described in any one of claims 1 to 7 are implemented.

10. A readable storage medium, characterized in that: The readable storage medium stores a program or instruction, and when the program or instruction is executed by the processor, the steps of the temperature control method of the electronic device according to any one of claims 1 to 7 are implemented.