Vibration processing method and device, electronic equipment and storage medium

Abstract

The invention discloses a vibration processing method and device, electronic equipment and a storage medium, and relates to the technical field of structure optimization and data analysis processing, and the method comprises the steps: carrying out the modal analysis of a three-dimensional model of a product structure containing a piezoelectric assembly, and obtaining a target modal shape diagram; performing harmonic response frequency sweeping analysis on the inherent frequency range locked according to the target modal shape diagram to obtain a resonance band frequency range; and if the preset electrical parameter excitation frequency is in the resonant frequency band range, performing transient dynamic analysis according to the excitation frequency to determine whether the surface amplitude and acceleration of the product meet expected requirements, and if yes, performing vibration processing according to a target electrical parameter determined according to the excitation frequency and a target product structure determined according to the product structure. According to the invention, the structure product and the electrical input parameters which accord with the touch effect can be quickly obtained, the research and development design period and the test cost of the coupling touch product are effectively reduced, and a user has a better product touch feeling.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment structure optimization data analysis and processing, and in particular to a vibration processing method, device, electronic equipment and storage medium. Background Art

[0002] Electronic vibration devices will produce different degrees of vibration response under the piezoelectric effect of piezoelectric ceramics, and will have different vibration effects under different voltage excitation frequencies. Different structural forms under the same voltage excitation frequency will also have a greater impact on the touch.

[0003] Generally speaking, the natural frequency of piezoelectric components (such as piezoelectric ceramics) and the entire product is usually relatively high. When developing the product, it is difficult to determine the iterative impact of the electric-solid coupling, which makes it difficult to quickly determine the appropriate electrical parameters (such as voltage excitation frequency). It is impossible to quickly adjust the product according to the appropriate electrical input parameters so that the user can have a better product tactile sensation and touch experience when touching the product.

[0004] The above contents are only used to assist in understanding the technical solution of the present application and do not constitute an admission that the above contents are prior art. Summary of the invention

[0005] The main purpose of this application is to provide a vibration processing method, device, electronic device and storage medium, aiming to solve the technical problem of how to quickly and accurately determine the product structure and electrical parameters so that users can have a better product touch when touching the product adjusted according to the determined electrical parameters and product structure.

[0006] To achieve the above objectives, the present application proposes a vibration processing method, which comprises the following steps:

[0007] Perform modal analysis on the three-dimensional model of the product structure containing the piezoelectric component to obtain the target modal vibration shape diagram;

[0008] Locking the natural frequency range of the product structure according to the target modal vibration shape diagram, performing harmonic response sweep analysis on the natural frequency range, and obtaining a resonance band frequency range;

[0009] Determine whether the excitation frequency in the preset electromechanical parameters is within the resonance band frequency range;

[0010] If it is within the resonance band frequency range, a transient dynamic analysis is performed according to the excitation frequency to obtain a relationship between the surface amplitude and the acceleration changing with time, and whether the surface amplitude and the acceleration meet the expected requirements is determined according to the relationship;

[0011] If the expected requirements are met, the excitation frequency is determined to be the target frequency, the product structure is determined to be the target product structure, and vibration processing is performed according to the target frequency and the target product structure.

[0012] Optionally, the step of performing modal analysis on a three-dimensional model of a product structure including a piezoelectric component to obtain a target modal vibration shape diagram includes:

[0013] Performing modal analysis on the three-dimensional model to obtain a modal vibration shape diagram;

[0014] Detecting the modal vibration shapes in the modal vibration shape diagram to determine whether there is a matching modal vibration shape that matches the preset product vibration shape;

[0015] If the matching mode vibration shape exists, detecting whether the frequency of the matching mode vibration shape matches the multiple frequency of the excitation frequency in the preset electromechanical parameters;

[0016] If the frequency of the matching modal vibration shape matches the multiple frequency of the excitation frequency in the preset electromechanical parameters, the modal vibration shape diagram is determined to be the target modal vibration shape diagram.

[0017] Optionally, after the step of determining whether there is a matching mode shape that matches the preset product shape, the method further includes:

[0018] If the matching mode shape does not exist, optimizing the structure and / or constraint form of the product structure to obtain a first product structure;

[0019] The step of performing modal analysis on the three-dimensional model of the product structure including the piezoelectric component is performed according to the first product structure until a matching modal vibration shape that matches the preset product vibration shape is detected in the latest modal vibration shape diagram.

[0020] Optionally, after the step of detecting whether the frequency of the matching mode shape matches the multiple frequency of the excitation frequency in the preset electromechanical parameters, the method further comprises:

[0021] If the frequency of the matching mode shape does not match the frequency multiple of the excitation frequency, optimizing the structure and / or constraint form of the product structure to obtain a second product structure;

[0022] The step of performing modal analysis on the three-dimensional model of the product structure including the piezoelectric component is performed according to the second product structure until a frequency of the latest matching modal vibration shape and a frequency multiple of the excitation frequency are detected.

[0023] Optionally, the step of determining whether the excitation frequency in the preset electrical parameters is within the resonance band frequency range includes:

[0024] Determine the maximum amplitude of the resonance band frequency range, and detect whether the frequency corresponding to the maximum amplitude matches the frequency multiple of the excitation frequency;

[0025] If the frequency corresponding to the maximum amplitude matches the frequency multiple of the excitation frequency, then determining that the excitation frequency is within the resonance band frequency range;

[0026] If the frequency corresponding to the maximum amplitude does not match the frequency multiple of the excitation frequency, it is determined that the excitation frequency is not within the resonance band frequency range.

[0027] Optionally, after the step of determining whether the excitation frequency in the preset electrical parameters is within the resonance band frequency range, the method further comprises:

[0028] If the excitation frequency is not within the resonance band frequency range, optimizing the structure and / or constraint form of the product structure to obtain a third product structure;

[0029] The step of performing modal analysis on the three-dimensional model of the product structure including the piezoelectric component is performed according to the third product structure until it is detected that the excitation frequency is within the latest resonance band frequency range.

[0030] Optionally, after the step of determining whether the surface amplitude and the acceleration meet expected requirements according to the change relationship, the method further comprises:

[0031] If the expected requirements are not met, determining a preset frequency range and input voltage parameters in the preset electrical parameters, wherein the excitation frequency is within the preset frequency range;

[0032] The input parameters for transient dynamics analysis are updated according to the preset frequency range and / or the input voltage parameters, wherein the input parameters include an excitation frequency and an input voltage corresponding to the excitation frequency.

[0033] In addition, to achieve the above-mentioned purpose, the present application also proposes a vibration processing device, comprising:

[0034] Modal analysis module, used to perform modal analysis on the three-dimensional model of the product structure containing the piezoelectric component to obtain the target modal vibration shape diagram;

[0035] A harmonic response sweep analysis module, used to lock the natural frequency range of the product structure according to the target modal vibration shape diagram, perform a harmonic response sweep analysis on the natural frequency range, and obtain a resonance band frequency range;

[0036] A judging module, used for judging whether the excitation frequency in the preset electrical parameters is within the resonance band frequency range;

[0037] A transient dynamics analysis module, for performing transient dynamics analysis according to the excitation frequency if the frequency range is within the resonance band, obtaining a relationship between surface amplitude and acceleration over time, and determining whether the surface amplitude and acceleration meet expected requirements based on the relationship;

[0038] A determination module is used to determine that the excitation frequency is a target frequency, determine that the product structure is a target product structure, and perform vibration processing according to the target excitation frequency and the target product structure if the expected requirements are met.

[0039] In addition, to achieve the above-mentioned purpose, the present application also proposes an electronic device, which includes: a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the computer program is configured to implement the steps of the vibration processing method described above.

[0040] In addition, to achieve the above-mentioned purpose, the present application also proposes a storage medium, which is a computer-readable storage medium, and a computer program is stored on the storage medium. When the computer program is executed by a processor, the steps of the vibration processing method described above are implemented.

[0041] In the present application, a modal analysis is performed on a three-dimensional model diagram of a preset product structure including a piezoelectric component to obtain a target modal vibration shape diagram, and a harmonic response sweep frequency analysis is performed on the natural frequency range locked according to the target modal vibration shape diagram to obtain a resonance band frequency range, and when the excitation frequency in the preset electrical parameters is within the resonance band frequency range, a transient dynamic analysis is performed on the excitation frequency to obtain a change relationship between the surface amplitude and acceleration over time, and when it is determined according to the change relationship that the surface amplitude and acceleration meet the expected requirements, the target electrical parameters are determined according to the excitation frequency, the target product structure is determined according to the product structure, and then vibration processing is performed according to the target electrical parameters and the target product structure. It can be realized that the electrical parameters are closely related to the natural frequency of the product, that is, the voltage excitation frequency is determined according to the natural frequency of the product, thereby avoiding the phenomenon that the voltage excitation frequency cannot be accurately determined due to the iterative influence of the electric-solid coupling effect that is difficult to determine, and realizing the rapid and accurate determination of the electrical parameters. It is also possible to quickly optimize and adjust the product structure to obtain a product structure corresponding to the desired vibration mode, and then after the product corresponding to the target product structure is adjusted and set according to the target electrical parameters, the user can touch the product so that the user has a better product touch when touching the product adjusted according to the determined electrical parameters. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0043] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0044] Figure 1 A schematic diagram of a flow chart of a first embodiment of a vibration treatment method of the present application;

[0045] Figure 2 A schematic diagram of a three-dimensional model provided in the first embodiment of the vibration processing method of the present application;

[0046] Figure 3 This is a complete schematic diagram of the vibration treatment method of this application;

[0047] Figure 4 It is the longitudinal vibration mode shape diagram of the preset model modal analysis in the vibration processing method of this application;

[0048] Figure 5 The longitudinal vibration mode shape diagram after adjusting the structural material parameters in the vibration treatment method of this application;

[0049] Figure 6 This is a schematic diagram of the amplitude and frequency in the vibration processing method of this application;

[0050] Figure 7 Schematic diagram of the amplitude-time curve obtained by transient dynamic analysis in the vibration processing method of this application

[0051] Figure 8 This is a schematic diagram of the module architecture of the vibration processing device of the present application;

[0052] Fig. 9 Schematic diagram of the device structure of the hardware operating environment involved in the vibration processing method in the embodiment of the present application.

[0053] The purpose, features and advantages of this application will be further described in conjunction with the embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0054] It should be understood that the specific embodiments described herein are only used to explain the technical solutions of the present application and are not used to limit the present application.

[0055] In order to better understand the technical solution of the present application, a detailed description will be given below in conjunction with the accompanying drawings and specific implementation methods.

[0056] In this embodiment, in order to assist in understanding the vibration processing method in this embodiment, the following explanation is given in conjunction with the dynamic equation of self-excited vibration of a damping system.

[0057] Optionally, the formula corresponding to the dynamic equation of the self-excited vibration of the damping system can be shown as the following formula (I).

[0058]

[0059] Where m is the mass matrix of the system, which may include the structural mass of the preset product structure. c is the viscous damping coefficient of the system. k is the stiffness matrix of the system, which may include the stiffness of the preset product structure. x represents the displacement vector. and Represents the velocity and acceleration vector. 0 may represent that the external force vector acting on the system is 0. The system in this embodiment may be a system corresponding to a product corresponding to a preset product structure having a piezoelectric component. That is, the component architecture of the system may include a preset product structure having a piezoelectric component.

[0060] Optionally, in the absence of external force, the natural frequency corresponding to the preset product structure can be calculated using the following formula (II).

[0061]

[0062] where ω is the natural frequency.

[0063] Optionally, the natural frequency, damping ratio and modal vibration shape of the system at different orders corresponding to the preset product structure can be obtained through modal analysis. By changing the physical parameters such as stiffness, mass or constraint position of the preset product structure, a modal vibration shape and frequency closer to the preset can be obtained. The natural frequency and modal vibration shape of the system can have different degrees of influence on the amplitude and acceleration of structural vibration. Therefore, in the product development and design stage, the physical parameters of the touch surface can be obtained through a series of analysis and iterative optimization, which can provide a reference for the selection of electrical input parameters to improve the actual trigger vibration of the product.

[0064] Based on this, the embodiment of the present application provides a vibration processing method, referring to Figure 1 , Figure 1 This is a schematic flow chart of the first embodiment of the vibration processing method of the present application.

[0065] In this embodiment, the vibration processing method includes steps S10 to S50.

[0066] Step S10, performing modal analysis on a three-dimensional model diagram of a preset product structure including a piezoelectric component to obtain a target modal vibration shape diagram;

[0067] Optionally, the preset product structure including the piezoelectric component may be a product structure of a system device that needs to be provided with a piezoelectric component, such as a product structure of various electronic devices (such as smart phones, computers, etc.). For example, the product structure of VR (virtual reality) equipment, the product structure of AR (augmented reality) equipment, the product structure of XR (extended reality) equipment, etc. The piezoelectric component may include piezoelectric ceramics.

[0068] Optionally, the three-dimensional model may include a structural model of a preset product structure. When constructing a product structure conceptual model, a structural model of the preset product structure may be constructed, the structural model including all key components and connection methods, and the correct material properties and physical parameters, such as product structure stiffness and product structure mass, are specified for each part of the structural model. Boundary conditions are set to define fixed points, support points, and constraints of the system corresponding to the preset product structure in actual work, so as to ensure the authenticity and reliability of the structural model contained in the three-dimensional model diagram. Optionally, the three-dimensional model diagram of the preset product structure including the piezoelectric component in this embodiment may be as follows: Figure 2 shown.

[0069] Optionally, modal analysis can be an analysis step for identifying the natural frequencies and modal vibration shapes of the system corresponding to the preset product structure. The modal vibration shape diagram may include the natural frequencies and the modal vibration shapes corresponding thereto. Optionally, the modal vibration shape diagram may display the vibration modes of the system at different natural frequencies and the modal vibration shapes corresponding to the vibration modes. The vibration mode may be a vibration mode of up and down vibration, a vibration mode of left and right vibration, a vibration mode of front and back vibration, etc.

[0070] Optionally, when the three-dimensional model diagram of the preset product structure including the piezoelectric component is constructed, it is also necessary to determine the preset electrical parameters corresponding to the system, which are parameters of the electrical part of the product corresponding to the preset product structure. The preset electrical parameters may include voltage amplitude (such as 220V, 380V, etc.), frequency range (such as 50Hz-60Hz), etc., so as to perform subsequent harmonic response sweep analysis and / or transient analysis according to the preset electrical parameters.

[0071] Optionally, a modal analysis can be performed on a three-dimensional model (i.e., a structural model) of a product structure including a piezoelectric component to determine all possible vibration modes of the system and the modal vibration shape of each vibration mode at its corresponding natural frequency. A target modal vibration shape diagram is constructed based on the natural frequency and the modal vibration shape. Optionally, when constructing the target modal vibration shape diagram, the target modal vibration shape diagram can be obtained by simulation based on a finite element analysis method or other numerical simulation software.

[0072] Step S20, locking the natural frequency range of the product structure according to the target modal vibration shape diagram, performing harmonic response sweep analysis on the natural frequency range, and obtaining the resonance band frequency range;

[0073] Optionally, the natural frequencies included in the target modal vibration shape diagram can be compared with the preset frequencies of the product structure to check whether the natural frequencies corresponding to the target modal vibration shape are close to or have a multiple relationship with the preset frequency. If they are close to or have a multiple relationship, the natural frequency range can be determined based on the maximum natural frequency and the minimum natural frequency among the natural frequencies included in the target modal vibration shape diagram.

[0074] Optionally, the resonance band frequency range may be a structural resonance band range or a probability range of resonance, that is, a frequency range in which a product corresponding to a preset product structure may cause resonance.

[0075] Optionally, a harmonic response sweep analysis may be performed on the natural frequency range to determine the response of the system to inputs of different frequencies, thereby finding a frequency interval that may cause resonance, that is, a resonance band frequency range.

[0076] Optionally, when performing harmonic response sweep analysis, the excitation signal of the natural frequency range can be set according to the preset electromechanical parameters, and the excitation can be gradually increased at each natural frequency within the natural frequency range to obtain and record the first response data of the system, and analyze the first response data of the system to identify which natural frequencies may cause system resonance corresponding to the product vibration direction, and record the maximum amplitude of these natural frequencies that may cause system resonance corresponding to the product vibration direction. The resonance band frequency range is determined based on the natural frequencies that may cause system resonance.

[0077] Step S30, determining whether the excitation frequency in the preset electrical parameters is within the resonance band frequency range;

[0078] Optionally, the preset electrical parameters may be electrical parameters estimated and predicted in advance by the user, including frequency range, voltage amplitude, etc. Any preset frequency within the frequency range may be selected as the excitation frequency.

[0079] Optionally, it may be determined whether the excitation frequency is within the resonance band frequency range, and different operations may be performed according to different determination results.

[0080] In a feasible embodiment, in step S30, the step of determining whether the excitation frequency in the preset electrical parameters is within the resonance band frequency range includes steps a10-a30.

[0081] Step a10, determining the maximum amplitude of the resonance band frequency range, and detecting whether the frequency corresponding to the maximum amplitude matches the frequency multiple of the excitation frequency;

[0082] Step a20, if the frequency corresponding to the maximum amplitude matches the frequency multiple of the excitation frequency, then it is determined that the excitation frequency is within the resonance band frequency range;

[0083] Step a30: If the frequency corresponding to the maximum amplitude does not match the frequency multiple of the excitation frequency, it is determined that the excitation frequency is not within the resonance band frequency range.

[0084] Optionally, the maximum amplitude corresponding to the main vibration mode can be determined within the resonance band frequency range and used as the maximum amplitude of the resonance band frequency range. The main vibration mode is the main vibration mode corresponding to the preset main vibration mode of the system, that is, the main vibration mode of the system product corresponding to the preset product structure. For example, the modal vibration mode based on the up and down vibration of the system. And the frequency corresponding to the maximum amplitude can be determined in the graph obtained by the harmonic response sweep analysis.

[0085] Optionally, it is possible to detect whether the frequency corresponding to the maximum amplitude matches the frequency multiple of the excitation frequency. Optionally, it is possible to detect whether the frequency corresponding to the maximum amplitude is close to or has a frequency multiple relationship with the excitation frequency. If the frequency corresponding to the maximum amplitude is close to or has a frequency multiple relationship with the excitation frequency, it is possible to determine that the frequency corresponding to the maximum amplitude matches the frequency multiple of the excitation frequency, and that the excitation frequency is within the resonant band frequency range. Otherwise, it is determined that the frequency corresponding to the maximum amplitude does not match the frequency multiple of the excitation frequency, and that the excitation frequency is not within the resonant frequency range.

[0086] Optionally, the absolute difference between the frequency corresponding to the maximum amplitude and the excitation frequency or the frequency multiple of the excitation frequency can be calculated. If the absolute difference is less than or equal to a threshold value set in advance, it is determined that the frequency corresponding to the maximum amplitude is close to the excitation frequency. If the absolute difference is greater than a threshold value set in advance, it is determined that the two are not close, and it can be determined whether there is a frequency multiple relationship between the frequency corresponding to the maximum amplitude and the excitation frequency, such as twice or three times the excitation frequency. If there is a frequency multiple relationship, it can be determined that the frequency corresponding to the maximum amplitude matches the frequency multiple of the excitation frequency, and the excitation frequency is determined to be within the resonance band frequency range. If there is no frequency multiple relationship, it can be determined that the frequency corresponding to the maximum amplitude does not match the frequency multiple of the excitation frequency, and the excitation frequency is not within the resonance frequency range.

[0087] In this embodiment, by determining the maximum amplitude of the resonance band frequency range, and when the frequency corresponding to the maximum amplitude matches the frequency multiple of the excitation frequency, it is determined that the excitation frequency is within the resonance band frequency range, and when the frequency corresponding to the maximum amplitude does not match the frequency multiple of the excitation frequency, it is determined that the excitation frequency is not within the resonance band frequency range. Thus, it is possible to effectively detect whether the excitation frequency is within the resonance band frequency range.

[0088] Further, in a feasible embodiment, in step S30, after the step of judging whether the excitation frequency in the preset electrical parameters is within the resonance band frequency range, steps b10-b20 are included.

[0089] Step b10, if the excitation frequency is not within the resonance band frequency range, optimizing the structure and / or constraint form of the product structure to obtain a third product structure;

[0090] Step b20, performing a modal analysis on the three-dimensional model of the product structure including the piezoelectric component according to the third product structure, until it is detected that the excitation frequency is within the latest resonance band frequency range.

[0091] Optionally, if it is determined that the excitation frequency is not within the resonance band frequency range, it is determined that the structure and / or constraint form of the product structure needs to be optimized, such as changing the structural dimensions, materials or constraint form of the product structure, etc., to perform optimization iterations to obtain a new product structure, and use it as the third product structure.

[0092] Optionally, optimizing the constraint form of the product structure may include optimizing and updating at least one of a position constraint, a size constraint, and a shape constraint of the product structure.

[0093] Optionally, when optimizing the structure of the product structure, the mass or stiffness of the product structure can be adjusted. Optionally, according to the above formula (II), the natural frequency is closely related to the mass and stiffness of the product structure. Therefore, after adjusting the mass or stiffness of the product structure, the corresponding natural frequency will be updated, which will lead to the update of the analysis results of the modal analysis, harmonic response sweep analysis and transient analysis. Therefore, the surface amplitude and acceleration that ultimately meet the expected requirements can be obtained by adjusting the mass or stiffness of the product structure.

[0094] Optionally, the resonance band frequency ranges corresponding to different product structures may be different. Therefore, after obtaining the third product structure, the step flow of step S10 above may be performed on the third product structure until the excitation frequency is detected to be within the latest resonance band frequency range. The latest resonance band frequency range is the resonance band frequency range corresponding to the optimized product structure.

[0095] In this embodiment, by optimizing the result and / or constraint form of the product structure when the excitation frequency is not within the resonance band frequency range, a third product structure is obtained, and then the above step S20 is performed based on the third product structure until the excitation frequency is detected to be within the latest resonance band frequency range, thereby ensuring the effectiveness of the determined product structure.

[0096] Step S40, if it is within the resonance band frequency range, then a transient dynamic analysis is performed according to the excitation frequency to obtain the relationship between the surface amplitude and acceleration changing with time, and whether the surface amplitude and acceleration meet the expected requirements is determined according to the relationship;

[0097] Optionally, when it is determined that the excitation frequency is within the frequency range of the resonance band, a transient dynamic analysis can be performed on the excitation frequency. When performing the transient dynamic analysis, the excitation frequency in the preset electromechanical parameters can be used as an input condition to apply transient excitation to the system, such as a step function or a pulse signal, to detect the response of the system over time, and generate a time response curve based on the detection results. Optionally, the time response curve can include a displacement-time curve, an acceleration-time curve, a velocity-time curve, etc. The results are analyzed based on the generated time response curve to determine the relationship between the surface amplitude and the acceleration over time. Optionally, the surface amplitude can be the maximum displacement amplitude of the surface node or key position of the system under a specific excitation. Optionally, the maximum value of the displacement at different time points in the time response curve can be used as the surface amplitude.

[0098] Optionally, after determining the change relationship, the surface amplitude and acceleration may be checked according to the change relationship to determine whether the expected requirements are met. Optionally, the expected requirements may be standard requirements set in advance by the user, and different requirements may be set for the surface amplitude and acceleration according to different scenarios.

[0099] Optionally, a preset time range corresponding to the time response curve may be determined, and each surface amplitude and acceleration within the preset time range may be checked to determine whether they meet expected requirements.

[0100] For the surface amplitude and acceleration, overall evaluation, critical time point evaluation, peak evaluation, frequency component evaluation, etc. can be performed. When at least one of the overall evaluation, critical time point evaluation, peak evaluation, and frequency component evaluation passes, it can be determined that the surface amplitude and acceleration meet the expected requirements.

[0101] Optionally, when performing an overall evaluation, determine whether the maximum value of each surface amplitude in the time response curve is less than a first preset amplitude threshold (such as 1 μm), and whether the minimum value of each surface amplitude is greater than a second preset amplitude threshold (such as 0.1 μm) based on the change relationship. Determine whether the maximum value of each acceleration in the time response curve is less than the first preset acceleration threshold, and whether the minimum value of each acceleration is greater than the second preset acceleration threshold based on the change relationship. If the maximum value of each surface amplitude is less than the first preset amplitude threshold, and the minimum value is greater than the second preset amplitude threshold, and the maximum value of each acceleration is less than the first preset acceleration threshold, and the minimum value is greater than the second preset acceleration threshold, then the overall evaluation result can be determined to be passed.

[0102] Optionally, when performing the critical time point evaluation, the steady-state response time point in the time response curve is determined, and it is determined whether the surface amplitude and acceleration at the steady-state response time point are within an expected range (e.g., less than a first preset threshold and greater than a second preset threshold). If the surface amplitude and acceleration are within the expected range, the critical time point evaluation result is determined to be passed.

[0103] Optionally, when performing peak evaluation, it is determined whether the peak values ​​(values ​​corresponding to the crest and trough) corresponding to the surface amplitude and acceleration in the time response curve are within an expected range. If so, the evaluation result of the key time point is determined to be passed.

[0104] Optionally, when performing frequency component evaluation, the time response data of each surface amplitude and acceleration in the time response curve may be Fourier transformed to analyze the frequency components thereof. If the main frequencies are distributed within the expected range, the frequency component evaluation result is determined to be passed.

[0105] In a feasible embodiment, in step S40, after the step of determining whether the surface amplitude and acceleration meet the expected requirements according to the change relationship, steps S60-S70 are included.

[0106] Step S60, if the expected requirements are not met, determining a preset frequency range and input voltage parameters in the preset electrical parameters, wherein the excitation frequency is within the preset frequency range;

[0107] Step S70 , updating input parameters for transient dynamics analysis according to a preset frequency range and / or input voltage parameters, wherein the input parameters include an excitation frequency and an input voltage corresponding to the excitation frequency.

[0108] Optionally, if it is checked that the surface amplitude and acceleration do not meet the expected requirements, the preset frequency range in the preset electrical parameters can be determined. The preset frequency range is a frequency range determined by input in advance. And a preset frequency can be reselected in this frequency range as a new excitation frequency. And when the new excitation frequency is in the resonance band frequency range, a transient dynamic analysis is performed on the new excitation frequency, and the relationship between the surface amplitude and acceleration changing with time is obtained again, and the surface amplitude and acceleration are determined based on the change relationship. If the expected requirements are not met, it is necessary to continue to select the next new excitation frequency from the frequency range, and execute the step of performing a transient dynamic analysis on the new excitation frequency when the new excitation frequency is in the resonance band frequency range. Until it is detected that the surface amplitude and acceleration meet the expected requirements.

[0109] Optionally, since the input voltage affects the surface amplitude and the excitation frequency affects the acceleration when performing transient dynamics analysis, that is, different input voltages will result in different surface amplitudes when performing transient dynamics analysis, and different excitation frequencies will result in different accelerations when performing transient dynamics analysis. Therefore, the input voltage can be adjusted, and then the transient dynamics analysis can be performed on the excitation frequency until the surface amplitude and acceleration are detected to meet the expected requirements.

[0110] In this embodiment, when the surface amplitude and acceleration do not meet the expected requirements, the input parameters for transient dynamic analysis are updated according to the preset frequency range and input voltage parameters until it is detected that the surface amplitude and acceleration meet the expected requirements, and then the final required electrical parameters can be determined based on the input parameters, thereby ensuring the validity of the final determined electrical parameters.

[0111] Step S50: if the expected requirements are met, target electrical parameters are determined according to the excitation frequency, target product structure is determined according to the product structure, and vibration processing is performed according to the target electrical parameters and target product structure.

[0112] Optionally, if the surface amplitude and acceleration meet the expected requirements, the voltage excitation frequency can be directly determined according to the excitation frequency, for example, the frequency within the range of 10% above and below the excitation frequency is used as the voltage excitation frequency, or the frequency within the range of 20% above and below the excitation frequency is used as the voltage excitation frequency.

[0113] Optionally, after determining the voltage excitation frequency, the preset electrical parameters can be updated and adjusted according to the voltage excitation frequency to obtain target electrical parameters to assist the user in selecting appropriate electrical parameters. Optionally, the target electrical parameters can also include an input voltage determined when performing transient dynamic analysis on the excitation frequency.

[0114] Optionally, the current product structure may be used as the target product structure, and the product corresponding to the target product structure may be vibrated according to the electromechanical parameters so that the user can feel a more obvious vibration.

[0115] In this embodiment, a modal analysis is performed on a three-dimensional model diagram of a preset product structure including a piezoelectric component to obtain a target modal vibration shape diagram, and a harmonic response sweep frequency analysis is performed on the natural frequency range locked according to the target modal vibration shape diagram to obtain a resonance band frequency range, and when the excitation frequency in the preset electrical parameters is within the resonance band frequency range, a transient dynamic analysis is performed on the excitation frequency to obtain a change relationship between the surface amplitude and acceleration over time, and when it is determined according to the change relationship that the surface amplitude and acceleration meet the expected requirements, the target electrical parameters are determined according to the excitation frequency, the target product structure is determined according to the product structure, and then vibration processing is performed according to the target electrical parameters and the target product structure. It can be realized that the electrical parameters are closely related to the natural frequency of the product, that is, the voltage excitation frequency is determined according to the natural frequency of the product, thereby avoiding the phenomenon that the voltage excitation frequency cannot be accurately determined due to the iterative influence of the electric-solid coupling effect that is difficult to determine, and realizing the rapid and accurate determination of the electrical parameters. It is also possible to quickly optimize and adjust the product structure to obtain a product structure corresponding to the desired vibration mode, and then after the product corresponding to the target product structure is adjusted and set according to the target electrical parameters, the user can have a better product touch after touching the product.

[0116] Based on the first embodiment of the present application, a second embodiment of the present application is proposed. In the second embodiment of the present application, the same or similar contents as those in the above embodiment can be referred to the above description and will not be described in detail later. On this basis, in step S10, a modal analysis is performed on a three-dimensional model of a product structure including a piezoelectric component to obtain a target modal vibration shape diagram, including steps c10-c40.

[0117] Step c10, performing modal analysis on the three-dimensional model to obtain a modal vibration shape diagram;

[0118] Step c20, detecting the mode shapes in the mode shape diagram to determine whether there is a matching mode shape that matches the preset product mode shape;

[0119] Optionally, when performing modal analysis on a three-dimensional model of a product structure including piezoelectric components, the three-dimensional model can be meshed to obtain a finite element model, and the finite element model can be subjected to modal analysis using a preset modal analysis unit (such as a unit having finite element analysis software functions) to obtain a modal vibration shape diagram including multiple natural frequencies and a modal vibration shape corresponding to each natural frequency.

[0120] Optionally, the modal vibration shape diagram may be a low-order modal vibration shape diagram, such as a modal vibration shape diagram including the first six orders. Optionally, the modal vibration shapes of the first few orders in the modal vibration shape diagram may be detected, such as the modal vibration shapes of the first six orders. Determine whether there is a modal vibration shape that matches the preset product vibration shape (i.e., a matching modal vibration shape). Optionally, the preset product vibration shape may be a vibration shape in the main vibration direction of the product, such as longitudinal vibration, etc.

[0121] Further, in a feasible embodiment, in step c20, after the step of determining whether there is a matching mode vibration shape that matches the preset product vibration shape, steps d10-d20 are included.

[0122] Step d10, if there is no matching mode shape, optimizing the structure and / or constraint form of the product structure to obtain a first product structure;

[0123] Step d20, performing a modal analysis on the three-dimensional model of the product structure including the piezoelectric component according to the first product structure, until a matching modal vibration shape that matches the preset product vibration shape is detected in the latest modal vibration shape diagram.

[0124] Optionally, if there is no matching modal vibration shape that matches the preset product vibration shape in the modal vibration shape diagram, it is determined that the structure and / or constraint form of the product structure needs to be optimized, such as changing the structural dimensions, materials or constraint form of the product structure (such as position constraints, size constraints and shape constraints of the product structure), etc., to perform optimization iterations to obtain a new product structure, and use it as the first product structure.

[0125] Optionally, after acquiring the first product structure, step S10 in the above embodiment may be continued until a matching modal vibration shape matching the preset product vibration shape is detected in the latest modal vibration shape diagram, at which time subsequent steps may be continued, such as step c30.

[0126] In this embodiment, by detecting that there is no matching modal vibration shape that matches the preset product vibration shape in the modal vibration shape diagram, the structure and / or constraint form of the product structure can be optimized to obtain a first product structure, and the modal analysis step is performed according to the first product structure until a matching modal vibration shape that matches the preset product vibration shape is detected in the modal vibration shape diagram, and the product structure can be optimized in a timely manner to obtain a product structure that meets user needs.

[0127] Step c30, if there is a matching mode vibration shape, detecting whether the frequency of the matching mode vibration shape matches the multiple frequency of the excitation frequency in the preset electrical parameters;

[0128] Optionally, if there is a matching modal vibration mode that matches the preset product vibration mode in the modal vibration mode diagram, the frequency of the matching modal vibration mode in the modal vibration mode diagram can be determined, such as determining the frequency corresponding to the maximum amplitude in the matching modal vibration mode, and detecting whether the frequency matches the multiple of the excitation frequency in the preset electrical parameters.

[0129] Optionally, it is possible to detect whether the frequency corresponding to the maximum amplitude in the matching modal vibration mode is close to or has a multiple frequency relationship with the excitation frequency. If the frequency is close to or has a multiple frequency relationship with the excitation frequency, it can be determined that the frequency of the matching modal vibration mode matches the multiple frequency of the excitation frequency. Otherwise, the frequency of the matching modal vibration mode does not match the multiple frequency of the excitation frequency.

[0130] Optionally, the absolute difference between the frequency corresponding to the maximum amplitude in the matching modal vibration mode and the excitation frequency can be calculated. If the absolute difference is less than or equal to a pre-set threshold, it is determined that the frequency is close to the excitation frequency. If the absolute difference is greater than a pre-set threshold, it can be determined that the two are not close. It can be determined whether there is a frequency multiple relationship between the frequency corresponding to the maximum amplitude in the matching modal vibration mode and the excitation frequency, such as twice or three times the excitation frequency. If there is a frequency multiple relationship, it can be determined that the frequency of the matching modal vibration mode matches the frequency multiple of the excitation frequency. If there is no frequency multiple relationship, it can be determined that the frequency of the matching modal vibration mode does not match the frequency multiple of the excitation frequency.

[0131] Further, in a feasible embodiment, after the step of detecting whether the frequency of the matching mode vibration shape matches the multiple frequency of the excitation frequency in the preset electrical parameters in step d30, steps e10-e30 are included.

[0132] Step e10, if the frequency of the matching mode vibration shape does not match the frequency multiple of the excitation frequency, optimizing the structure and / or constraint form of the product structure to obtain a second product structure;

[0133] Step e20, performing a modal analysis on the three-dimensional model of the product structure including the piezoelectric component according to the second product structure, until the frequency of the latest matching modal vibration shape and the frequency multiple of the excitation frequency are detected.

[0134] Optionally, if the frequency of the matching modal vibration mode and the frequency multiple of the excitation frequency do not match, it is determined that the structure and / or constraint form of the product structure needs to be optimized, such as changing the structural dimensions, materials or constraint form of the product structure (such as position constraints, size constraints and shape constraints of the product structure), etc., to perform optimization iterations to obtain a new product structure, and use it as the second product structure.

[0135] Optionally, after the second product structure is acquired, step S10 in the above embodiment may be continued to be performed until the frequency of the latest matching mode shape and the frequency multiple of the excitation frequency are detected to match, and subsequent steps are continued to be performed.

[0136] In this embodiment, when it is detected that the frequency of the matching modal vibration shape in the modal vibration shape diagram and the frequency multiple of the excitation frequency do not match, the structure and / or constraint form of the product structure can be optimized to obtain a second product structure, and the modal analysis step is performed according to the second product structure until it is detected that the frequency of the matching modal vibration shape in the modal vibration shape diagram and the frequency multiple of the excitation frequency match, and the product structure can be optimized in time to obtain a product structure that meets user needs.

[0137] Step c40: if the frequency of the matched mode vibration shape matches the multiple frequency of the excitation frequency in the preset electromechanical parameters, then the mode vibration shape diagram is determined to be the target mode vibration shape diagram.

[0138] Optionally, if it is detected that the frequency of the matching modal vibration shape matches the multiple frequency match of the excitation frequency in the preset electrical parameters, the modal vibration shape diagram can be determined as the target modal vibration shape diagram, and step S20 in the above embodiment is continued to be executed until the target electrical parameters and target product structure that meet the user's needs are determined, and vibration processing is then performed based on the target electrical parameters and target product structure.

[0139] In this embodiment, a modal vibration shape diagram is obtained by performing modal analysis on the three-dimensional model, and when a matching modal vibration shape that matches the preset product vibration shape exists in the modal vibration shape diagram, and the frequency of the matching modal vibration shape matches the multiple frequency of the excitation frequency in the preset electrical parameters, the modal vibration shape diagram is determined to be a target modal vibration shape diagram, thereby ensuring the validity of the determined target modal vibration shape diagram.

[0140] In addition, to assist in understanding the overall process of the vibration processing method in this embodiment, an example is given below.

[0141] For example, Figure 3As shown, first determine the electronic component concept model and parameter settings, and build a physical model, such as a three-dimensional model of a product structure containing a piezoelectric component, and then perform modal analysis on the three-dimensional model to obtain the target modal vibration shape diagram, and check whether the low-order modal vibration shape in the target modal vibration shape diagram contains the first modal vibration shape corresponding to the main vibration direction of the product. If not, adjust the structural constraint form, re-update the product structure, and re-perform modal analysis on the three-dimensional model of the new product structure. If so, check whether the modal frequency of the main vibration shape in the target modal vibration shape diagram is close to the preset frequency multiple. If not, determine that the two do not match, and adjust the structural mass or stiffness, update the product structure, and continue to perform modal analysis on the three-dimensional model of the new product structure. If so, perform harmonic response analysis (i.e., harmonic response sweep analysis) on the natural frequency range locked according to the target modal vibration shape diagram, and detect whether the peak corresponding frequency is close to the preset frequency or multiple frequency relationship. If not, adjust the structural mass or stiffness, re-update the product structure, and re-perform modal analysis on the three-dimensional model of the new product structure. If so, perform transient dynamic analysis. And check whether the dynamic parameters meet the expectations (for example, whether the surface amplitude and acceleration meet the expected requirements). If not, adjust the input voltage and frequency (i.e., the excitation frequency) and re-perform transient dynamic analysis. If yes, output the structural model. At this time, the product structure corresponding to the output structural model can be used as the target product structure, the excitation frequency can be used as the determined target electromechanical parameter, and the product built according to the target product structure can be vibrated according to the target electromechanical parameter, so that the user has a good touch when touching the product.

[0142] In addition, for example Figure 4-Figure 7 As shown in FIG. 1 , if the excitation frequency in the preset electrical parameters is determined to be 240 Hz, the preset voltage (i.e., the input voltage when performing transient dynamics analysis) is 75 V. Figure 4 As shown, if the product structure containing the piezoelectric component is a cover plate, and the material of the cover plate is an aluminum alloy material, the modal analysis of the three-dimensional model of the cover plate obtains that the frequency corresponding to the longitudinal vibration mode is 1518Hz. Among them, the longitudinal vibration mode is the preset product vibration mode. It can be clearly seen that the frequency corresponding to the longitudinal vibration mode is far from the excitation frequency. Therefore, the structure or constraint form of the product structure can be optimized. For example, the material of the cover plate can be changed from aluminum alloy material to injection molded PBT material, and thinned to obtain the following Figure 5 The three-dimensional model shown in Figure 1 can be further modified as shown in Figure 1. Figure 5 The modal analysis of the three-dimensional model shown in the figure shows that the frequency corresponding to the longitudinal vibration mode is 477.8Hz, which is close to the excitation frequency and close to the frequency doubling relationship. Therefore, the natural frequency range of the cover can be locked according to the target modal vibration mode diagram obtained by the modal analysis at this time, and the harmonic response sweep frequency analysis of the natural frequency range can be performed to obtain the following: Figure 6The peak value shown in the figure appears in the amplitude frequency diagram of the longitudinal vibration mode frequency to determine the resonance band frequency range, and when it is determined that the excitation frequency is in the resonance waiting frequency range, a transient dynamic analysis of the excitation frequency is performed, such as Figure 7 As shown in the figure, the surface amplitude curve is extracted to determine the relationship between the surface amplitude and acceleration over time, and the surface amplitude and acceleration are determined according to the transformation relationship to determine whether they meet the expected requirements. If they do, then Figure 5 The product structure of the cover plate corresponding to the three-dimensional model shown is used as the final target product structure. The excitation frequency is used as the final excitation frequency in the target electromechanical parameters. In order to vibrate the cover plate designed according to the target product structure according to the target electromechanical parameters, the user has a better product touch when touching the cover plate.

[0143] In addition, the present application embodiment provides a vibration processing device, referring to Figure 8 , the vibration processing device comprises:

[0144] The modal analysis module A10 is used to perform modal analysis on a three-dimensional model of a product structure including a piezoelectric component to obtain a target modal vibration shape diagram;

[0145] The harmonic response sweep analysis module A20 is used to lock the natural frequency range of the product structure according to the target modal vibration shape diagram, perform harmonic response sweep analysis on the natural frequency range, and obtain the resonance band frequency range;

[0146] A determination module A30 is used to determine whether the excitation frequency in the preset electrical parameters is within the resonance band frequency range;

[0147] The transient dynamics analysis module A40 is used to perform transient dynamics analysis according to the excitation frequency if the frequency range is within the resonance band, obtain the relationship between the surface amplitude and acceleration over time, and determine whether the surface amplitude and acceleration meet the expected requirements based on the relationship;

[0148] The determination module A50 is used to determine the excitation frequency as the target frequency and the product structure as the target product structure if the expected requirements are met, and perform vibration processing according to the target excitation frequency and the target product structure.

[0149] The vibration processing device provided by the present application adopts the vibration processing method in the above embodiment, which can solve the technical problem of how to quickly and accurately determine the product structure and electrical parameters so that the user can have a better product touch when touching the product adjusted according to the determined electrical parameters and product structure. Compared with the prior art, the beneficial effects of the vibration processing device provided by the present application are the same as the beneficial effects of the vibration processing method provided by the above embodiment, and the other technical features in the vibration processing device are the same as the features disclosed in the above embodiment method, which will not be repeated here.

[0150] The present application provides an electronic device, which includes: at least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores instructions executable by the at least one processor, and the instructions are executed by the at least one processor so that the at least one processor can execute the vibration processing method in the above-mentioned embodiment 1.

[0151] Reference below Fig. 9 , which shows a schematic diagram of the structure of an electronic device suitable for implementing an embodiment of the present application. The electronic device in the embodiment of the present application may include, but is not limited to, mobile terminals such as mobile phones, laptop computers, digital broadcast receivers, PDAs (Personal Digital Assistants), PADs (Portable Application Descriptions), PMPs (Portable Media Players), vehicle-mounted terminals (such as vehicle-mounted navigation terminals), etc., and fixed terminals such as digital TVs, desktop computers, etc. The device shown in the figure is only an example and should not bring any limitation to the functions and scope of use of the embodiments of the present application.

[0152] The electronic device may include a processing device 1001 (e.g., a central processing unit, a graphics processor, etc.), which can perform various appropriate actions and processes according to a program stored in a read-only memory (ROM) 1002 or a program loaded from a storage device 1003 to a random access memory (RAM) 1004. In RAM 1004, various programs and data required for device operation are also stored. The processing device 1001, ROM 1002, and RAM 1004 are connected to each other via a bus 1005. An input / output (I / O) interface 1006 is also connected to the bus. Generally, the following systems can be connected to the I / O interface 1006: an input device 1007 including, for example, a touch screen, a touch pad, a keyboard, a mouse, an image sensor, a microphone, an accelerometer, a gyroscope, etc.; an output device 1008 including, for example, a liquid crystal display (LCD), a speaker, a vibrator, etc.; a storage device 1003 including, for example, a magnetic tape, a hard disk, etc.; and a communication device 1009. The communication device 1009 can allow the electronic device to communicate with other devices wirelessly or by wire to exchange data. Although the figure shows an electronic device with various systems, it should be understood that it is not required to implement or have all the systems shown. More or fewer systems can be implemented or have alternatively.

[0153] In particular, according to the embodiments disclosed in the present application, the process described above with reference to the flowchart can be implemented as a computer software program. For example, the embodiments disclosed in the present application include a computer program product, which includes a computer program carried on a computer-readable medium, and the computer program includes a program code for executing the method shown in the flowchart. In such an embodiment, the computer program can be downloaded and installed from a network through a communication device, or installed from a storage device 1003, or installed from a ROM 1002. When the computer program is executed by the processing device 1001, the above-mentioned functions defined in the method of the embodiment disclosed in the present application are executed.

[0154] The electronic device provided by the present application adopts the vibration processing method in the above embodiment, which can solve the technical problem of how to quickly and accurately determine the product structure and electrical parameters so that the user can have a better product touch when touching the product adjusted according to the determined electrical parameters and product structure. Compared with the prior art, the beneficial effects of the electronic device provided by the present application are the same as the beneficial effects of the vibration processing method provided by the above embodiment, and the other technical features in the electronic device are the same as the features disclosed in the method of the previous embodiment, which will not be repeated here.

[0155] It should be understood that the various parts disclosed in this application can be implemented by hardware, software, firmware or a combination thereof. In the description of the above embodiments, specific features, structures, materials or characteristics can be combined in any one or more embodiments or examples in a suitable manner.

[0156] The above are only specific implementations of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

[0157] The present application provides a computer-readable storage medium having computer-readable program instructions (ie, computer programs) stored thereon, and the computer-readable program instructions are used to execute the vibration processing method in the above-mentioned embodiment.

[0158] The computer-readable storage medium provided in the present application may be, for example, a USB flash drive, but is not limited to electrical, magnetic, optical, electromagnetic, infrared, or semiconductor systems, systems or devices, or any combination of the above. More specific examples of computer-readable storage media may include, but are not limited to: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In this embodiment, the computer-readable storage medium may be any tangible medium containing or storing a program that can be used by or in combination with an instruction execution system, system or device. The program code contained on the computer-readable storage medium may be transmitted using any appropriate medium, including but not limited to: wires, optical cables, RF (Radio Frequency), etc., or any suitable combination of the above.

[0159] The computer-readable storage medium may be included in the electronic device, or may exist independently without being installed in the electronic device.

[0160] The computer-readable storage medium carries one or more programs. When the one or more programs are executed by an electronic device, the electronic device can execute the steps in the vibration processing method.

[0161] Computer program code for performing the operations of the present application may be written in one or more programming languages ​​or a combination thereof, including object-oriented programming languages ​​such as Java, Smalltalk, C++, and conventional procedural programming languages ​​such as "C" or similar programming languages. The program code may be executed entirely on the user's computer, partially on the user's computer, as a separate software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In the case of a remote computer, the remote computer may be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0162] The flow chart and block diagram in the accompanying drawings illustrate the possible architecture, function and operation of the system, method and computer program product according to various embodiments of the present application. In this regard, each box in the flow chart or block diagram can represent a module, a program segment or a part of a code, and the module, the program segment or a part of the code contains one or more executable instructions for realizing the specified logical function. It should also be noted that in some implementations as replacements, the functions marked in the box can also occur in a sequence different from that marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram and / or flow chart, and the combination of the boxes in the block diagram and / or flow chart can be implemented with a dedicated hardware-based system that performs a specified function or operation, or can be implemented with a combination of dedicated hardware and computer instructions.

[0163] The modules involved in the embodiments described in this application may be implemented by software or hardware, wherein the name of the module does not constitute a limitation on the unit itself in some cases.

[0164] The readable storage medium provided by the present application is a computer-readable storage medium, which stores computer-readable program instructions (i.e., computer programs) for executing the above-mentioned vibration processing method, and can solve the technical problem of how to quickly and accurately determine the product structure and electrical parameters so that the user can have a better product touch when touching the product adjusted according to the determined electrical parameters and product structure. Compared with the prior art, the beneficial effects of the computer-readable storage medium provided by the present application are the same as the beneficial effects of the vibration processing method provided by the above-mentioned embodiment, which will not be repeated here.

[0165] The present application also provides a computer program product, including a computer program, which implements the steps of the vibration processing method as described above when the computer program is executed by a processor.

[0166] The computer program product provided by the present application can solve the technical problem of how to quickly and accurately determine the product structure and electrical parameters so that the user can have a better product touch when touching the product adjusted according to the determined electrical parameters and product structure. Compared with the prior art, the beneficial effects of the computer program product provided by the present application are the same as the beneficial effects of the vibration processing method provided by the above embodiment, which will not be repeated here.

[0167] The above are only some embodiments of the present application, and are not intended to limit the patent scope of the present application. All equivalent structural changes made using the contents of the present application specification and drawings under the technical concept of the present application, or direct / indirect application in other related technical fields are included in the patent protection scope of the present application.

Claims

1. A vibration treatment method, characterized in that: The vibration treatment method comprises the following steps: Perform modal analysis on the three-dimensional model of the product structure containing the piezoelectric component to obtain the target modal vibration shape diagram; Locking the natural frequency range of the product structure according to the target modal vibration shape diagram, performing harmonic response sweep analysis on the natural frequency range, and obtaining a resonance band frequency range; Determine whether the excitation frequency in the preset electromechanical parameters is within the resonance band frequency range; If it is within the resonance band frequency range, a transient dynamic analysis is performed according to the excitation frequency to obtain a relationship between the surface amplitude and the acceleration changing with time, and based on the relationship, it is determined whether the surface amplitude and the acceleration meet the expected requirements; If the expected requirements are met, target electrical parameters are determined according to the excitation frequency, and target product structure is determined according to the product structure, and vibration processing is performed based on the target electrical parameters and the target product structure.

2. The vibration processing method according to claim 1, characterized in that: The step of performing modal analysis on the three-dimensional model of the product structure including the piezoelectric component to obtain the target modal vibration shape diagram includes: Performing modal analysis on the three-dimensional model to obtain a modal vibration shape diagram; Detecting the modal vibration shapes in the modal vibration shape diagram to determine whether there is a matching modal vibration shape that matches the preset product vibration shape; If the matching mode vibration shape exists, detecting whether the frequency of the matching mode vibration shape matches the multiple frequency of the excitation frequency in the preset electromechanical parameters; If the frequency of the matching modal vibration shape matches the multiple frequency of the excitation frequency in the preset electromechanical parameters, the modal vibration shape diagram is determined to be the target modal vibration shape diagram.

3. The vibration processing method according to claim 2, characterized in that: After the step of determining whether there is a matching mode shape that matches the preset product shape, the method further includes: If the matching mode shape does not exist, optimizing the structure and / or constraint form of the product structure to obtain a first product structure; The step of performing modal analysis on the three-dimensional model of the product structure including the piezoelectric component is performed according to the first product structure until a matching modal vibration shape that matches the preset product vibration shape is detected in the latest modal vibration shape diagram.

4. The vibration processing method according to claim 2, characterized in that: After the step of detecting whether the frequency of the matching mode shape matches the multiple frequency of the excitation frequency in the preset electromechanical parameters, the method further comprises: If the frequency of the matching mode shape does not match the frequency multiple of the excitation frequency, optimizing the structure and / or constraint form of the product structure to obtain a second product structure; The step of performing modal analysis on the three-dimensional model of the product structure including the piezoelectric component is performed according to the second product structure until a frequency of the latest matching modal vibration shape and a frequency multiple of the excitation frequency are detected.

5. The vibration processing method according to claim 1, characterized in that: The step of determining whether the excitation frequency in the preset electrical parameters is within the resonance band frequency range comprises: Determine the maximum amplitude of the resonance band frequency range, and detect whether the frequency corresponding to the maximum amplitude matches the frequency multiple of the excitation frequency; If the frequency corresponding to the maximum amplitude matches the frequency multiple of the excitation frequency, then determining that the excitation frequency is within the resonance band frequency range; If the frequency corresponding to the maximum amplitude does not match the frequency multiple of the excitation frequency, it is determined that the excitation frequency is not within the resonance band frequency range.

6. The vibration processing method according to claim 1, characterized in that: After the step of determining whether the excitation frequency in the preset electrical parameters is within the resonance band frequency range, the following steps are included: If the excitation frequency is not within the resonance band frequency range, optimizing the structure and / or constraint form of the product structure to obtain a third product structure; The step of performing modal analysis on the three-dimensional model of the product structure including the piezoelectric component is performed according to the third product structure until it is detected that the excitation frequency is within the latest resonance band frequency range.

7. The vibration processing method according to claim 1, characterized in that: After the step of determining whether the surface amplitude and the acceleration meet the expected requirements according to the change relationship, the method further comprises: If the expected requirements are not met, determining a preset frequency range and input voltage parameters in the preset electrical parameters, wherein the excitation frequency is within the preset frequency range; According to the preset frequency range and / or the input voltage parameter, the input parameters for transient dynamics analysis are updated, wherein the input parameters include an excitation frequency and an input voltage corresponding to the excitation frequency.

8. A vibration processing device, characterized in that: The vibration processing device comprises: Modal analysis module, used to perform modal analysis on the three-dimensional model of the product structure containing the piezoelectric component to obtain the target modal vibration shape diagram; A harmonic response sweep analysis module, used to lock the natural frequency range of the product structure according to the target modal vibration shape diagram, perform a harmonic response sweep analysis on the natural frequency range, and obtain a resonance band frequency range; A judging module, used for judging whether the excitation frequency in the preset electrical parameters is within the resonance band frequency range; A transient dynamics analysis module, for performing transient dynamics analysis according to the excitation frequency if the frequency range is within the resonance band, obtaining a relationship between surface amplitude and acceleration over time, and determining whether the surface amplitude and acceleration meet expected requirements based on the relationship; A determination module is used to determine that the excitation frequency is a target frequency, determine that the product structure is a target product structure, and perform vibration processing according to the target excitation frequency and the target product structure if the expected requirements are met.

9. An electronic device, characterized in that: The electronic device comprises: a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the computer program is configured to implement the steps of the vibration processing method according to any one of claims 1 to 7.

10. A storage medium, characterized in that: The storage medium is a computer-readable storage medium, and a computer program is stored on the storage medium. When the computer program is executed by a processor, the steps of the vibration processing method according to any one of claims 1 to 7 are implemented.

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