A Path Planning Method Based on UWB

Abstract

The present invention relates to the field of path planning technology, and specifically discloses a path planning method based on UWB, wherein the method comprises the following steps: S1: obtaining the working frequency band of electronic components, and calculating the working frequency band difference between electronic components; S2: calculating the maximum temperature rise of electronic components; S3: obtaining the working frequency, amplitude and power of target electronic components, calculating the electromagnetic interference range, and calculating the repulsion coefficient between target and non-target electronic components; S4: correcting the repulsion coefficient, screening out non-target electronic components with the lowest repulsion coefficient after correction, and calculating the final welding distance. The present invention calculates the electromagnetic interference range and repulsion coefficient of electronic components inside the UWB chip, calculates the final welding distance, and performs path planning according to the final welding distance, thereby reducing the impact of electromagnetic interference between electronic components and improving the performance and reliability of the UWB chip.

Description

Technical Field

[0001] The present invention relates to the technical field of path planning, and in particular to a path planning method based on UWB. Background Art

[0002] UWB, or ultra-wideband technology, is a wireless carrier communication technology that uses a frequency bandwidth of more than 1 GHz. It does not use a sinusoidal carrier, but uses nanosecond-level non-sinusoidal narrow pulses to transmit data. UWB technology is essentially a carrier-free spread spectrum technology that uses impulse pulses with a very low duty cycle as information carriers.

[0003] When designing the PCB layout, it is necessary to reasonably arrange the position of the UWB chip on the PCB according to the pin arrangement and functional requirements of the UWB chip. It is usually recommended to place the UWB chip in a relatively central position to facilitate connection with other components and reduce signal transmission distance and electromagnetic interference. In addition, special attention should be paid to the routing of the RF signal receiving pin of the UWB chip to the antenna. Differential lines should be used as much as possible to reduce noise and ensure normal signal transmission.

[0004] With the development of technology, the integration of UWB chips is getting higher and higher, but with the increase in chip integration, new problems are also coming. Electronic components will generate electromagnetic fields when they are powered on, and the electromagnetic fields will cause electromagnetic interference to other electronic components. Since the miniaturization of chips is an important trend in the semiconductor industry, the miniaturization of chips has brought about a higher degree of integration, resulting in an increase in the number of electronic components inside the UWB chip, and the electromagnetic interference between electronic components is becoming more and more serious. If an inappropriate PCB layout is used, the electromagnetic interference will be aggravated, affecting the accuracy of path planning and resulting in a decrease in measurement accuracy. Therefore, a method is needed to plan the PCB layout of the UWB chip, so as to optimize the PCB layout, improve the accuracy of path planning, and improve the performance and reliability of the UWB chip. Summary of the invention

[0005] The purpose of the present invention is to provide a UWB-based path planning method to solve the above technical problems.

[0006] The purpose of the present invention can be achieved through the following technical solutions: A UWB-based path planning method comprises the following steps: S1: Obtain the operating frequency band PD of the electronic components inside the UWB chip and calculate the operating frequency band difference ΔPD between the electronic components i，j =PD i -PD j , where PD i Represents the operating frequency band of the i-th electronic component, PD j represents the operating frequency band of the jth electronic component, and 0<i<j, if |ΔPDi，j |≥PD sta , then the i-th and j-th electronic components are high-frequency difference components. If |ΔPD i，j |<PD sta , then the i-th and j-th electronic components are low-frequency step difference components, where PD sta It is the preset frequency band judgment threshold; S2: Calculate the maximum temperature rise T of electronic components by formula cmax , the formula is specifically: ; Among them, T J Represents the node temperature in the UWB chip, P re Represents the heating power of electronic components, R JC Represents the thermal resistance from the inside of the UWB chip to the outer shell, R CS Represents the thermal resistance from the case to the heat sink, R SA Represents the thermal resistance from the heat sink to the environment; S3: Obtain the operating frequency P, signal amplitude FD and output power W of the target electronic component, and calculate the target interference range of the target electronic component ; Wherein, λ1 is a preset frequency adjustment coefficient, λ2 is a preset amplitude adjustment coefficient, and λ3 is a preset power adjustment coefficient; Calculate the rejection coefficient of target electronic components and non-target electronic components , where γ represents the preset rejection adjustment value, L represents the non-target interference range of the non-target electronic component, MAX(LM, L) represents the larger value of the target interference range LM and the non-target interference range L, MIN(LM, L) represents the smaller value of the target interference range LM and the non-target interference range L, and MT cmax Represents the maximum temperature rise of the target electronic component, FT cmax Represents the maximum temperature rise of non-target electronic components; S4: Correct the rejection coefficient PX. If the target electronic component and the non-target electronic component are high-frequency segment difference components, set the rejection coefficient PX=A1*PX. If the target electronic component and the non-target electronic component are low-frequency segment difference components, set the rejection coefficient PX=A2*PX, where A1 represents a preset first adjustment value, A2 represents a preset second adjustment value, and 0<A2<1<A1; Screen out non-target electronic components with the lowest corrected rejection coefficient PX and calculate the final welding distance , place the target electronic components and non-target electronic components on the PCB board according to the final welding distance L end Perform welding.

[0007] As a further solution of the present invention: in the step S1, when obtaining the working frequency band PD of the electronic components inside the UWB chip, ensure that the selected frequency band is not interfered by other electronic devices, and ensure that the electronic components themselves do not interfere with other devices.

[0008] As a further solution of the present invention: in step S1, the heating power P of the electronic component is calculated re When the heating power of the electronic component changes with the running time t of the electronic component, the heating power is calculated. , where t start Represents the time when the electronic component starts to operate, t end Represents the time when the electronic component stops functioning.

[0009] As a further solution of the present invention: in the step S2, if the UWB chip does not have a heat sink, another method for calculating the maximum temperature rise of the electronic component specifically includes: Obtain the working current I of the electronic component; If the operating current I is less than 100 mA, it is marked as a low-power component. Calculate the maximum temperature rise of the low-power component. , where R CA Represents the thermal resistance from case to air; If the operating current I is greater than or equal to 100 mA, it is marked as a high-power component. Calculate the maximum temperature rise of the high-power component. , where R JA Represents the thermal resistance between the PN junction and the environment.

[0010] As a further solution of the present invention: in the step S3, when calculating the electromagnetic interference range LM of the target electronic component, it is ensured that the target electronic component is in a rated working state and after a preset stabilization time t sta After that, the operating frequency P, amplitude FD and power W of the target electronic component are obtained.

[0011] As a further solution of the present invention: in step S3, if MT cmax =FT cmax , at this time, the repulsion coefficient between the target electronic component and the non-target electronic component is calculated .

[0012] As a further solution of the present invention: in step S3, if the rejection coefficient PX is greater than the preset rejection coefficient threshold PX max , the corresponding non-target electronic components are eliminated and do not participate in the subsequent correction of the rejection coefficient.

[0013] As a further solution of the present invention: in the step S4, if there are non-target electronic components with the same repulsion coefficient after correction, the non-target electronic component with the smallest electromagnetic interference range is selected to calculate the final welding distance L end .

[0014] Beneficial effects of the present invention: In the present invention, the operating frequency band PD of the electronic components inside the UWB chip is first obtained. When the electronic components work in their non-optimized frequency bands, more EMI may be generated. This is because the efficiency of the components at these frequencies is low, which may cause more energy to be lost in the form of electromagnetic radiation. In addition, some electronic components such as inductors and capacitors will resonate at specific frequencies, when their impedance is minimal, and are prone to generate strong EMI.

[0015] Calculate the difference in the operating frequency bands between electronic components, and place the electronic components with smaller operating frequency band differences in closer positions. Since the operating frequency bands between electronic components will affect each other, when electronic components with similar operating frequency bands are close to each other, better signal integrity can be maintained. This is because high-frequency signals are easily interfered during transmission. If the relevant electronic components are close, the signal path length can be reduced, thereby reducing signal attenuation and distortion. In addition, if the components working in the same frequency band are too far apart, more crosstalk may be generated due to long-distance interconnection lines. Placing them close together can reduce this risk and improve the stability and reliability of the circuit. Moreover, placing electronic components with similar operating frequency bands together can achieve the purpose of simplifying the PCB wiring design, making the related signal paths more compact and direct. It helps to reduce unnecessary electromagnetic radiation and reception, thereby reducing the risk of EMI. And according to the difference in the operating frequency bands of the electronic components, it is judged whether the two electronic components are high-frequency segment difference components or low-frequency segment difference components, and the electronic components are distinguished, which is convenient for subsequent processing of the electronic components.

[0016] Then calculate the maximum temperature rise T of the electronic components cmax The maximum temperature rise of an electronic component refers to the maximum value of the temperature rise of the component relative to the ambient temperature under normal working conditions. The maximum temperature rise is determined by the manufacturer based on the material and design of the component. Exceeding this temperature may cause the performance of the component to degrade or be damaged. The maximum temperature rise value serves as a safety standard to ensure that the component works within its design range to avoid damage due to overheating. In addition, the electrical characteristics of most electronic components will change with temperature. Calculating the maximum temperature rise of electronic components can fully consider the impact of temperature changes of electronic components when performing PCB layout, avoiding the problem of damage to electronic components due to high temperature. Extending the service life of electronic components.

[0017] Calculate the electromagnetic interference range LM of the target electronic component. Each target electronic component will generate an electromagnetic field of a certain intensity after power is turned on. Although the electromagnetic field intensity generated by the electronic component is small, due to the small internal space of the UWB chip, the electromagnetic interference of the electromagnetic field generated by the electronic component to other electronic components cannot be ignored when the distance is close. However, since the electromagnetic intensity of the electronic component itself is small, and the electromagnetic intensity will gradually decay with the increase of distance, when it reaches a certain distance, the electromagnetic intensity is already very small, and the electromagnetic interference can be ignored at this time. Moreover, the electromagnetic interference range of the electronic component is positively correlated with the operating frequency, amplitude and power of the electronic component. Generally speaking, the higher the frequency of the electronic component, the stronger the electromagnetic interference generated, because high-frequency signals are easier to propagate and are more likely to couple with other electronic components. Signal amplitude also affects the range of electromagnetic interference. A larger signal amplitude means that more energy is converted into electromagnetic radiation, thereby increasing the possibility of electromagnetic interference. The power output of the electronic component is directly related to the EMI intensity it generates. The greater the power, the stronger the electromagnetic interference generated. Because more electrical energy is converted into electromagnetic energy, the possibility of electromagnetic interference is increased.

[0018] According to the electromagnetic interference range, the rejection coefficient PX is calculated. It can be seen from the formula The value of is greater than or equal to 1, because the distance between electronic components is relative, only when the distance between the target electronic component and the non-target electronic component is equal The value of is equal to 1, which means that the target electronic component and the non-target electronic component are just in the right position, so it will not increase the rejection coefficient in subsequent calculations.

[0019] Finally, the repulsion coefficient is corrected. If the components are high-frequency segment difference components, the repulsion coefficient is further amplified. If the components are low-frequency segment difference components, the repulsion coefficient is reduced. The non-target electronic components with the lowest repulsion coefficient after correction are screened out, and the final welding distance L is calculated. end , and according to the final welding distance L end Plan the distance between electronic components inside the UWB chip.

[0020] In summary, the present invention calculates the electromagnetic interference range and rejection coefficient of the electronic components inside the UWB chip, calculates the final welding distance, and plans according to the final welding distance, thereby reducing the impact of electromagnetic interference between electronic components and improving the performance and reliability of the UWB chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The present invention will be further described below in conjunction with the accompanying drawings.

[0022] Figure 1 It is a flow chart of a UWB-based path planning method of the present invention. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0024] See also Figure 1 As shown, the present invention is a path planning method based on UWB, comprising the following steps: S1: Obtain the operating frequency band PD of the electronic components inside the UWB chip and calculate the operating frequency band difference ΔPD between the electronic components i，j =PD i -PD j , where PD i Represents the operating frequency band of the i-th electronic component, PD j represents the operating frequency band of the jth electronic component, and 0<i<j, if |ΔPD i，j |≥PD sta , then the i-th and j-th electronic components are high-frequency difference components. If |ΔPD i，j |<PD sta , then the i-th and j-th electronic components are low-frequency step difference components, where PD sta It is the preset frequency band judgment threshold; S2: Calculate the maximum temperature rise T of electronic components by formula cmax , the formula is specifically: ; Among them, T J Represents the node temperature in the UWB chip, P re Represents the heating power of electronic components, R JC Represents the thermal resistance from the inside of the UWB chip to the outer shell, R CS Represents the thermal resistance from the case to the heat sink, R SA Represents the thermal resistance from the heat sink to the environment; S3: Obtain the operating frequency P, signal amplitude FD and output power W of the target electronic component, and calculate the target interference range of the target electronic component ; Wherein, λ1 is a preset frequency adjustment coefficient, λ2 is a preset amplitude adjustment coefficient, and λ3 is a preset power adjustment coefficient; Calculate the rejection coefficient of target electronic components and non-target electronic components , where γ represents the preset rejection adjustment value, L represents the non-target interference range of the non-target electronic component, MAX(LM, L) represents the larger value of the target interference range LM and the non-target interference range L, MIN(LM, L) represents the smaller value of the target interference range LM and the non-target interference range L, and MT cmax Represents the maximum temperature rise of the target electronic component, FT cmax Represents the maximum temperature rise of non-target electronic components; S4: Correct the rejection coefficient PX. If the target electronic component and the non-target electronic component are high-frequency segment difference components, set the rejection coefficient PX=A1*PX. If the target electronic component and the non-target electronic component are low-frequency segment difference components, set the rejection coefficient PX=A2*PX, where A1 represents a preset first adjustment value, A2 represents a preset second adjustment value, and 0<A2<1<A1; Screen out non-target electronic components with the lowest corrected rejection coefficient PX and calculate the final welding distance , place the target electronic components and non-target electronic components on the PCB board according to the final welding distance L end Perform welding.

[0025] It should be noted that the operating frequency band PD of the electronic components inside the UWB chip is first obtained. When the electronic components work in their non-optimized frequency bands, more EMI may be generated. This is because the efficiency of the components is lower at these frequencies, which may cause more energy to be lost in the form of electromagnetic radiation. And some electronic components such as inductors and capacitors will resonate at specific frequencies, when their impedance is minimal, and they are prone to generate strong EMI. The EMI stands for electromagnetic interference, which refers to the phenomenon of undesirable effects of electromagnetic energy on electronic equipment, systems or the environment.

[0026] Calculate the difference in the operating frequency bands between electronic components, and place the electronic components with smaller operating frequency band differences in closer positions. Since the operating frequency bands between electronic components will affect each other, when electronic components with similar operating frequency bands are close to each other, better signal integrity can be maintained. This is because high-frequency signals are easily interfered during transmission. If the relevant electronic components are close, the signal path length can be reduced, thereby reducing signal attenuation and distortion. In addition, if the components working in the same frequency band are too far apart, more crosstalk may be generated due to long-distance interconnection lines. Placing them close together can reduce this risk and improve the stability and reliability of the circuit. Moreover, placing electronic components with similar operating frequency bands together can achieve the purpose of simplifying the PCB wiring design, making the related signal paths more compact and direct. It helps to reduce unnecessary electromagnetic radiation and reception, thereby reducing the risk of EMI. And according to the difference in the operating frequency bands of the electronic components, it is judged whether the two electronic components are high-frequency segment difference components or low-frequency segment difference components, and the electronic components are distinguished, which is convenient for subsequent processing of the electronic components.

[0027] Then calculate the maximum temperature rise T of the electronic components cmax The maximum temperature rise of an electronic component refers to the maximum value of the temperature rise of the component relative to the ambient temperature under normal working conditions. The maximum temperature rise is determined by the manufacturer based on the material and design of the component. Exceeding this temperature may cause the performance of the component to degrade or be damaged. The maximum temperature rise value serves as a safety standard to ensure that the component works within its design range to avoid damage due to overheating. In addition, the electrical characteristics of most electronic components will change with temperature. Calculating the maximum temperature rise of electronic components can fully consider the impact of temperature changes of electronic components when performing PCB layout, avoiding the problem of damage to electronic components due to high temperature. Extending the service life of electronic components.

[0028] Calculate the electromagnetic interference range LM of the target electronic component. Each target electronic component will generate an electromagnetic field of a certain intensity after power is turned on. Although the electromagnetic field intensity generated by the electronic component is small, due to the small internal space of the UWB chip, the electromagnetic interference of the electromagnetic field generated by the electronic component to other electronic components cannot be ignored when the distance is close. However, since the electromagnetic intensity of the electronic component itself is small, and the electromagnetic intensity will gradually decay with the increase of distance, when it reaches a certain distance, the electromagnetic intensity is already very small, and the electromagnetic interference can be ignored at this time. Moreover, the electromagnetic interference range of the electronic component is positively correlated with the operating frequency, amplitude and power of the electronic component. Generally speaking, the higher the frequency of the electronic component, the stronger the electromagnetic interference generated, because high-frequency signals are easier to propagate and are more likely to couple with other electronic components. Signal amplitude also affects the range of electromagnetic interference. A larger signal amplitude means that more energy is converted into electromagnetic radiation, thereby increasing the possibility of electromagnetic interference. The power output of the electronic component is directly related to the EMI intensity it generates. The greater the power, the stronger the electromagnetic interference generated. Because more electrical energy is converted into electromagnetic energy, the possibility of electromagnetic interference is increased.

[0029] According to the electromagnetic interference range, the rejection coefficient PX is calculated. It can be seen from the formula The value of is greater than or equal to 1, because the distance between electronic components is relative, only when the distance between the target electronic component and the non-target electronic component is equal The value of is equal to 1, which means that the target electronic component and the non-target electronic component are just in the right position, so it will not increase the rejection coefficient in subsequent calculations.

[0030] Finally, the repulsion coefficient is corrected. If the components are high-frequency segment difference components, the repulsion coefficient is further amplified. If the components are low-frequency segment difference components, the repulsion coefficient is reduced. The non-target electronic components with the lowest repulsion coefficient after correction are screened out, and the final welding distance L is calculated. end , and according to the final welding distance L end Plan the distance between electronic components inside the UWB chip.

[0031] Moreover, in actual situations, in addition to the internal PCB layout of the UWB chip affecting the working efficiency of the UWB chip, the antenna layout is also an important factor affecting the function of the UWB chip. UWB technology is known for its high-precision positioning capability, but the realization of this accuracy depends largely on the reasonable layout of the antenna. For example, when using the PDOA principle to measure the signal direction, at least two pairs of non-parallel antenna arrays are required to measure their respective azimuths, and then the true spatial angle is measured through the algorithm. Therefore, the number and layout of antennas directly affect the amount of raw data that the system can obtain and the measurement accuracy. The radiation pattern of the antenna is crucial to ensure the signal coverage of the system. In the UWB system, the ideal antenna should have good omnidirectional radiation characteristics to ensure uniform signal coverage in all directions. In addition, through reasonable antenna layout, signal shielding and interference can be avoided, thereby improving the stability and reliability of the system.

[0032] Therefore, when performing antenna layout, the antennas are arranged in a rectangular shape to provide higher gain and directivity.

[0033] In another preferred embodiment of the present invention, when obtaining the working frequency band PD of the electronic component inside the UWB chip, it is ensured that the selected frequency band is not interfered by other electronic devices, and it is ensured that the electronic component itself does not interfere with other devices.

[0034] It is worth noting that when obtaining the working frequency band PD of the electronic components inside the UWB chip, in order to make the result more accurate, it is necessary to obtain the working frequency band of the electronic components inside the UWB chip without interference. The purpose is to make the result more accurate and avoid errors in subsequent calculation results due to equipment factors.

[0035] Since electronic components are more susceptible to interference from equipment and have weak environmental resistance, in order to obtain more accurate results, it is necessary to obtain the working frequency band of the electronic components inside the UWB chip without interference from other factors, so as to reduce errors and make the final results more reasonable.

[0036] In another preferred embodiment of the present invention, the heating power P of the electronic component is calculated. re When the heating power of the electronic component changes with the running time t of the electronic component, the heating power is calculated. , where t start Represents the time when the electronic component starts to operate, t end Represents the time when the electronic component stops functioning.

[0037] It is understandable that because electronic components generate heat during operation, and the resistance of electronic components changes with temperature, the relationship between the resistance and temperature of most electronic components is not absolutely linear. However, the heating power P of electronic components is re The change of resistance of electronic components will cause the change of heating power of electronic components due to the relationship with the organization. This process is difficult to measure specifically. Therefore, it is preferred to obtain the variation curve F(t) of heating power of electronic components with the operation time t of electronic components, and then calculate the average value of heating power according to the variation curve F(t). The heating power of electronic components is replaced by the average value. This can omit cumbersome steps and achieve the purpose of simplifying the process.

[0038] In another preferred embodiment of the present invention, if the UWB chip does not have a heat sink, another method for calculating the maximum temperature rise of the electronic component specifically includes: Obtain the working current I of the electronic component; If the operating current I is less than 100 mA, it is marked as a low-power component. Calculate the maximum temperature rise of the low-power component. , where R CA Represents the thermal resistance from case to air; If the operating current I is greater than or equal to 100 mA, it is marked as a high-power component. Calculate the maximum temperature rise of the high-power component. , where R JA Represents the thermal resistance between the PN junction and the environment.

[0039] It should be noted that some UWB chips do not have heat sinks. The original formula cannot be used to calculate UWB chips without heat sinks, so a new formula is needed to calculate. If the operating current I is less than 100 mA, it is marked as a low-power component. If the operating current I is greater than or equal to 100 mA, it is marked as a high-power component. This can clearly define the boundary between high-power components and low-power components.

[0040] The magnitude of the working current of electronic components affects the maximum temperature rise, so it is necessary to distinguish them according to the magnitude of the working current, and then use different formulas to calculate high-power components and low-power components respectively, so as to make the calculation results more accurate.

[0041] In another preferred embodiment of the present invention, when calculating the electromagnetic interference range LM of the target electronic component, it is ensured that the target electronic component is in a rated working state and after a preset stabilization time t sta After that, the operating frequency P, amplitude FD and power W of the target electronic component are obtained.

[0042] It should be noted that when an electronic component is just powered on, it may become unstable. Therefore, in order to obtain the data of the electronic component stably, it is necessary to wait for the electronic component to run for a period of time and then obtain the data of the electronic component when the electronic component tends to be stable, so as to make the obtained data more accurate and avoid data errors caused by unstable state of the electronic component, which may lead to errors in the final result.

[0043] In another preferred embodiment of the present invention, if MT cmax =FT cmax , at this time, the repulsion coefficient between the target electronic component and the non-target electronic component is calculated .

[0044] Understandably, when MT cmax =FT cmax At this time, the rejection coefficient PX calculated by the formula is 0. It can be seen from the formula that the value of the rejection coefficient PX is greater than or equal to 0. Therefore, in order to increase the resistance of the present invention to extreme data, a more appropriate formula needs to be used for calculation when special circumstances arise.

[0045] In another preferred embodiment of the present invention, if the rejection coefficient PX is greater than a preset rejection coefficient threshold PX max , the corresponding non-target electronic components are eliminated and do not participate in the subsequent correction of the rejection coefficient.

[0046] It is worth noting that when the rejection coefficient PX is greater than the preset rejection coefficient threshold PX max , it means that the target electronic components and non-target electronic components are very incompatible at this time. Therefore, in order to simplify the operation steps, the corresponding non-target electronic components are eliminated and do not participate in the subsequent correction of the rejection coefficient, thereby reducing the amount of calculation and simplifying the operation steps.

[0047] In another preferred embodiment of the present invention, if there are non-target electronic components with equal repulsion coefficients after correction, the non-target electronic component with the smallest electromagnetic interference range is selected to calculate the final welding distance L end .

[0048] It is worth noting that if there are non-target electronic components with equal rejection coefficients after correction, the non-target electronic components with the smallest electromagnetic interference range are selected to calculate the final welding distance L end , the same rejection coefficient indicates the same degree of electromagnetic interference. At this time, the non-target electronic component with the smallest electromagnetic interference range is selected to calculate the final welding distance L end , not only can the final welding distance L end Smaller, in addition, due to the final welding distance L endSmaller size can also simplify soldering, facilitate soldering, reduce operation difficulty, and leave more space for other electronic components.

[0049] The above is a detailed description of an embodiment of the present invention, but the content is only a preferred embodiment of the present invention and cannot be considered to limit the scope of implementation of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the scope of the patent coverage of the present invention.

Claims

1. A UWB-based path planning method, characterized in that: The following steps are involved: S1: Obtain the operating frequency band PD of the electronic components inside the UWB chip and calculate the operating frequency band difference ΔPD between the electronic components i，j =PD i -PD j , where PD i Represents the operating frequency band of the i-th electronic component, PD j represents the operating frequency band of the jth electronic component, and 0<i<j, if |ΔPD i，j |≥PD sta , then the i-th and j-th electronic components are high-frequency difference components. If |ΔPD i，j |<PD sta , then the i-th and j-th electronic components are low-frequency step difference components, where PD sta It is the preset frequency band judgment threshold; S2: Calculate the maximum temperature rise T of electronic components by formula cmax , the formula is specifically: ； Among them, T J Represents the node temperature in the UWB chip, P re Represents the heating power of electronic components, R JC Represents the thermal resistance from the inside of the UWB chip to the outer shell, R CS Represents the thermal resistance from the case to the heat sink, R SA Represents the thermal resistance from the heat sink to the environment; S3: Obtain the operating frequency P, signal amplitude FD and output power W of the target electronic component, and calculate the target interference range of the target electronic component ; Wherein, λ1 is a preset frequency adjustment coefficient, λ2 is a preset amplitude adjustment coefficient, and λ3 is a preset power adjustment coefficient; Calculate the rejection coefficient of target electronic components and non-target electronic components , where γ represents the preset rejection adjustment value, L represents the non-target interference range of the non-target electronic component, MAX(LM, L) represents the larger value of the target interference range LM and the non-target interference range L, MIN(LM, L) represents the smaller value of the target interference range LM and the non-target interference range L, and MT cmax Represents the maximum temperature rise of the target electronic component, FT cmax Represents the maximum temperature rise of non-target electronic components; S4: Correct the rejection coefficient PX. If the target electronic component and the non-target electronic component are high-frequency segment difference components, set the rejection coefficient PX=A1*PX. If the target electronic component and the non-target electronic component are low-frequency segment difference components, set the rejection coefficient PX=A2*PX, where A1 represents a preset first adjustment value, A2 represents a preset second adjustment value, and 0<A2<1<A1; Screen out non-target electronic components with the lowest corrected rejection coefficient PX and calculate the final welding distance , place the target electronic components and non-target electronic components on the PCB board according to the final welding distance L end Perform welding.

2. The UWB-based path planning method according to claim 1, characterized in that: In the step S1, when obtaining the working frequency band PD of the electronic components inside the UWB chip, it is ensured that the selected frequency band is not interfered by other electronic devices, and at the same time, it is ensured that the electronic components themselves do not interfere with other devices.

3. The UWB-based path planning method according to claim 1, characterized in that: In step S1, the heating power P of the electronic component is calculated. re When the heating power of the electronic component changes with the running time t of the electronic component, the heating power is calculated. , where t start Represents the time when the electronic component starts to operate, t end Represents the time when the electronic component stops functioning.

4. The UWB-based path planning method according to claim 1, characterized in that: In the step S2, if the UWB chip does not have a heat sink, another method for calculating the maximum temperature rise of the electronic component specifically includes: Obtain the working current I of the electronic component; If the operating current I is less than 100 mA, it is marked as a low-power component. Calculate the maximum temperature rise of the low-power component. , where R CA Represents the thermal resistance from case to air; If the operating current I is greater than or equal to 100 mA, it is marked as a high-power component. Calculate the maximum temperature rise of the high-power component. , where R JA Represents the thermal resistance between the PN junction and the environment. , where R JA Represents the thermal resistance between the PN junction and the environment.

5. The UWB-based path planning method according to claim 1, characterized in that: In the step S3, when calculating the electromagnetic interference range LM of the target electronic component, it is ensured that the target electronic component is in a rated working state, and after a preset stabilization time tsta, the operating frequency P, amplitude FD and power W of the target electronic component are obtained.

6. The UWB-based path planning method according to claim 1, characterized in that: In step S3, if MTcmax=FTcmax, the repulsion coefficient between the target electronic component and the non-target electronic component is calculated. .

7. The UWB-based path planning method according to claim 1, characterized in that: In step S3, if the rejection coefficient PX is greater than the preset rejection coefficient threshold PX max , the corresponding non-target electronic components are eliminated and do not participate in the subsequent correction of the rejection coefficient.

8. The UWB-based path planning method according to claim 1, characterized in that: In step S4, if there are non-target electronic components with the same repulsion coefficient after correction, the non-target electronic component with the smallest electromagnetic interference range is selected to calculate the final welding distance L. end .

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