Method, device, equipment and medium for simulating inductive return current of stripline structure

Abstract

The present application discloses a method, device, equipment and medium for simulating the inductive return current of a stripline structure. The method comprises: dividing the stripline of an integrated circuit into a plurality of segments, obtaining the magnetic field of the current of each segment to the observation point, superimposing the magnetic field of the current of each segment to the observation point, obtaining the overall magnetic field of the stripline to any observation point at any position of the integrated circuit, and obtaining the inductive return current caused by the stripline current on the ground plane according to the overall magnetic field, so that there is no need to perform finite element segmentation on the entire airspace of the package substrate and the circuit board, and only the stripline in the problem structure needs to be segmented, thereby saving a large amount of computer storage space, and greatly reducing large and super-large matrix operations, reducing the time consumption of calculation, realizing the segmentation of only the conductor without segmenting the entire space domain, reducing the number of variables and the matrix scale, greatly reducing the amount of calculation, and being able to quickly simulate the inductive return current of the stripline structure.

Description

Technical Field

[0001] The present application relates to the technical field of integrated circuit simulation, and in particular to a method, device, equipment and medium for simulating an inductive return current of a stripline structure. Background Art

[0002] Stripline structures are high-frequency transmission conductors placed between dielectrics between two parallel ground planes (or power planes). With the rapid development of the integrated circuit industry, circuit structures are becoming more and more complex, so the demand for simulating larger and more complex interconnected circuits has also increased. A rigorous full-wave approach is needed to fully consider all interconnect phenomena, such as crosstalk, and distortion. Since full-wave analysis considers all higher-order modes in addition to transmission line modes (i.e., transverse electromagnetic (TEM) modes), the results they provide simulate the physical characteristics of complex 3-D interconnects more accurately than traditional 2-D analysis tools. Among them, the distribution of return currents referenced to the ground plane in the package substrate and circuit board is a necessary condition for calculating the crosstalk between interconnect wires.

[0003] In the related art, the more commonly used simulation method is the finite element method (FEM). FEM technology discretizes the entire problem space. Therefore, when the problem space becomes larger, the simulator needs a larger memory to store variables, and solving ultra-large-scale matrices requires a large amount of calculation and takes a long time. This is a disadvantage of large-scale 3-D simulators in the related art.

[0004] The above statements are only used to provide background information related to the present application and do not necessarily constitute prior art. Summary of the invention

[0005] The purpose of the present application is to provide a method, device, apparatus and medium for simulating an inductive return current of a stripline structure. In order to have a basic understanding of some aspects of the disclosed embodiments, a simple summary is given below. This summary is not a general review, nor is it intended to identify key / important components or to describe the scope of protection of these embodiments. Its only purpose is to present some concepts in a simple form as a preface to the detailed description that follows.

[0006] According to one aspect of an embodiment of the present application, a method for simulating a ground plane induction return current of a stripline structure is provided, comprising:

[0007] Dividing the stripline of the integrated circuit into multiple segments;

[0008] Obtaining the magnetic field of the current of each segment relative to an observation point;

[0009] Superimpose the magnetic field of each segmented current on the observation point to obtain the overall magnetic field of the strip line on any observation point at the integrated circuit;

[0010] According to the overall magnetic field, an induced return current on the ground plane caused by the stripline current is obtained.

[0011] In some embodiments of the present application, obtaining the magnetic field of the current of each segment relative to the observation point includes:

[0012] According to electric potential energy and magnetic potential energy, obtain the relationship between magnetic field and electric potential energy and magnetic potential energy;

[0013] Decompose the magnetic field into the sum of TMz modes at each level and the superposition of the sum of TEz modes at each level;

[0014] Obtain the magnetic field of the TMz mode and the TEz mode in double integral form in polar coordinates.

[0015] In some embodiments of the present application, obtaining the relationship between the magnetic field and the electric potential energy and the magnetic potential energy according to the electric potential energy and the magnetic potential energy includes:

[0016] Based on the electric potential energy, magnetic potential energy and Maxwell equations of electromagnetic field, the relationship between magnetic field and electric potential energy and magnetic potential energy is derived.

[0017] In some embodiments of the present application, the relationship between the magnetic field and the electric potential energy and the magnetic potential energy is derived according to the electric potential energy, the magnetic potential energy and the Maxwell equations of the electromagnetic field, including:

[0018] Introduce electric potential energy and magnetic potential energy, use magnetic vector potential to solve Maxwell's equations and obtain the magnetic field strength;

[0019] The Lorentz gauge is applied to the magnetic field intensity to obtain the Lorentz gauge magnetic field intensity.

[0020] In some embodiments of the present application, obtaining the magnetic field in the double integral form of the TMz mode and the TEz mode in polar coordinates includes:

[0021] Perform a two-dimensional Fourier transform on the electromagnetic field Maxwell equations of the TMz mode and TEz mode, and map the spatial domain xy plane into k x k y frequency domain, forming k x k y Double integral in the frequency domain;

[0022] The k x k y The double integral in the frequency domain is converted into the double integral in polar coordinates through polar coordinate transformation;

[0023] The double integral in polar coordinates is converted into the sum of function values ​​at all poles contained in the lower half plane through the Cauchy residue theorem.

[0024] In some embodiments of the present application, the k x k y The double integral in the frequency domain is converted into a double integral in polar coordinates through polar coordinate transformation, including:

[0025] Using polar coordinates k x =k ρ cosθ,k y =k ρ sinθ, expand the lower limit of integration from zero to negative infinity, and the magnetic field is

[0026]

[0027] In some embodiments of the present application, decomposing the magnetic field into the sum of TMz modes at each level and the superposition of the sum of TEz modes at each level includes:

[0028] TM z The expressions of the magnetic field in each direction in this mode are

[0029]

[0030] TM H z (x,y,z)=0;

[0031] TE z The expressions of the magnetic field in each direction in this mode are

[0032]

[0033] Based on TM z The expression of magnetic field in each direction and TE in the mode z The expressions of the magnetic field in each direction in the mode decompose the magnetic field.

[0034] In some embodiments of the present application, obtaining the magnetic field of the current of each segment relative to the observation point further includes:

[0035] According to the residue theorem, the integral is converted into a series summation to obtain the closed-loop explicit expression of the magnetic field generated by the strip line.

[0036] According to another aspect of an embodiment of the present application, a simulation device for a ground plane induced return current of a stripline structure is provided, comprising:

[0037] A stripline segmentation module, used to segment the stripline of the integrated circuit into a plurality of segments;

[0038] A magnetic field acquisition module, used to acquire the magnetic field of each segmented current relative to an observation point;

[0039] A magnetic field superposition module, used for superimposing the magnetic field of each segmented current on the observation point to obtain the overall magnetic field of the strip line on any position observation point of the integrated circuit;

[0040] The current acquisition module is used to acquire the induced return current caused by the stripline current on the ground plane according to the overall magnetic field.

[0041] According to another aspect of an embodiment of the present application, an electronic device is provided, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the method described in any embodiment of the present application.

[0042] According to another aspect of an embodiment of the present application, a computer-readable storage medium is provided, on which a computer program is stored. The computer program is executed by a processor to implement the method described in any embodiment of the present application.

[0043] The technical solution provided by one aspect of the embodiments of the present application may have the following beneficial effects:

[0044] The induced return current simulation method of the stripline structure provided in the embodiment of the present application divides the stripline of the integrated circuit into multiple segments, obtains the magnetic field of the current of each segment to the observation point, superimposes the magnetic field of the current of each segment to the observation point, obtains the overall magnetic field of the stripline to any observation point at the position of the integrated circuit, and obtains the induced return current caused by the stripline current on the ground plane based on the overall magnetic field. In this way, there is no need to perform finite element segmentation on the entire airspace of the packaging substrate and the circuit board, and only the stripline in the problem structure needs to be segmented, thereby saving a large amount of computer storage space, and greatly reducing large and super-large matrix operations, reducing calculation time, achieving the segmentation of only the conductor without segmenting the entire space domain, reducing the number of variables and the matrix scale, greatly reducing the amount of calculation, and being able to quickly simulate the induced return current of the stripline structure.

[0045] The above description is only an overview of the technical solution of the embodiment of the present application. In order to more clearly understand the technical means of the embodiment of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the embodiment of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0047] Figure 1 A flow chart of an inductive return current simulation method of a stripline structure according to an embodiment of the present application is shown.

[0048] Figure 2 A schematic diagram of a layered stripline with horizontal surface current according to an embodiment of the present application is shown.

[0049] Figure 3 A schematic diagram of the integral profile and pole position obtained by applying the residue method according to an embodiment of the present application is shown.

[0050] Figure 4 A schematic diagram of sinusoidal current distribution in a signal line according to an embodiment of the present application is shown.

[0051] Figure 5 A 3D view of current distribution of the induced current on the ground plane according to an embodiment of the present application is shown.

[0052] Figure 6 A current distribution contour diagram of the induced current on the ground plane according to an embodiment of the present application is shown.

[0053] Figure 7 A structural block diagram of an inductive return current simulation device with a stripline structure according to an embodiment of the present application is shown.

[0054] Figure 8 A structural block diagram of an electronic device according to an embodiment of the present application is shown.

[0055] Fig. 9 A schematic diagram of a computer-readable storage medium according to an embodiment of the present application is shown. DETAILED DESCRIPTION

[0056] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application is further described below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not intended to limit the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0057] It will be understood by those skilled in the art that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as those generally understood by those skilled in the art to which this application belongs. It should also be understood that terms such as those defined in general dictionaries should be understood to have meanings consistent with the meanings in the context of the prior art, and will not be interpreted with idealized or overly formal meanings unless specifically defined as here.

[0058] The simulation method of the finite element method (FEM) in the related art discretizes the entire problem space, resulting in that when the problem space becomes larger, the simulator needs a large memory for storing variables, and the calculation amount is large and the simulation time is long. The embodiment of the present application provides an induced return current simulation method of a stripline structure, which divides the stripline of the integrated circuit into multiple segments, obtains the magnetic field of the current of each segment to the observation point, superimposes the magnetic field of the current of each segment to the observation point, and obtains the overall magnetic field of the stripline to any position observation point of the integrated circuit. According to the overall magnetic field, the induced return current caused by the stripline current on the ground plane is obtained. In this way, there is no need to perform finite element segmentation on the entire airspace of the packaging substrate and the circuit board. It is only necessary to segment the stripline in the problem structure, thereby saving a lot of computer storage space, and greatly reducing large and ultra-large matrix operations, reducing calculation time, and realizing the segmentation of only the conductor without segmenting the entire space domain, reducing the number of variables and the matrix scale, greatly reducing the calculation amount, and being able to quickly simulate the induced return current of the stripline structure.

[0059] Table The meaning of each symbol in this article

[0060]

[0061] The following describes, in conjunction with the accompanying drawings, a method, device, equipment and medium for simulating an inductive return current of a stripline structure proposed according to an embodiment of the present application.

[0062] refer to Figure 1 As shown, an embodiment of the present application provides an inductive return current simulation method of a stripline structure, which may include steps S10 to S40:

[0063] S10, dividing the strip line of the integrated circuit into a plurality of segments.

[0064] An integrated circuit may include a package substrate or a circuit board.

[0065] S20, obtaining the magnetic field of the current of each segment relative to the observation point.

[0066] Exemplarily, obtaining the magnetic field of the current of each segment to the observation point includes steps S201 to S203:

[0067] S201, obtaining the relationship between the magnetic field and the electric potential energy and the magnetic potential energy according to the electric potential energy and the magnetic potential energy;

[0068] Specifically, based on electric potential energy, magnetic potential energy and Maxwell's equations for electromagnetic fields, the relationship between magnetic field and electric potential energy and magnetic potential energy is derived.

[0069] Exemplarily, based on electric potential energy, magnetic potential energy and Maxwell's equations for electromagnetic fields, deriving the relationship between magnetic field and electric potential energy and magnetic potential energy can include: introducing electric potential energy and magnetic potential energy, using magnetic vector potential to solve Maxwell's equations to obtain magnetic field strength; applying the Lorentz norm to the magnetic field strength to obtain the magnetic field strength after the Lorentz norm.

[0070] S202, decomposing the magnetic field into the sum of TMz modes at each level and the superposition of the sum of TEz modes at each level.

[0071] Exemplarily, the magnetic field is decomposed into the sum of each level of TMz mode and the superposition of the sum of each level of TEz mode, including:

[0072] TM z The expressions of the magnetic field in each direction in this mode are

[0073]

[0074] TM H z (x,y,z)=0;

[0075] TE z The expressions of the magnetic field in each direction in this mode are

[0076]

[0077] Based on TM z The expression of magnetic field in each direction and TE in the mode z The expressions of the magnetic field in each direction in the mode decompose the magnetic field.

[0078] S203 , obtaining the magnetic field of the TMz mode and the TEz mode in the form of double integration in polar coordinates.

[0079] Exemplarily, obtaining the magnetic field in the double integral form of the TMz mode and the TEz mode in polar coordinates may include: performing a two-dimensional Fourier transform on the electromagnetic field Maxwell equations of the TMz mode and the TEz mode, mapping the spatial domain xy plane into k x k y frequency domain, forming k x k y Double integral in the frequency domain; x k yThe double integral in the frequency domain is converted into a double integral in polar coordinates through polar coordinate transformation; the double integral in polar coordinates is converted into the sum of function values ​​at all poles contained in the lower half plane through the Cauchy residue theorem.

[0080] For example, the k x k y The double integral in the frequency domain is converted into a double integral in polar coordinates through polar coordinate transformation, including:

[0081] Using polar coordinates k x =k ρ cosθ,k y =k ρ sinθ, expand the lower limit of integration from zero to negative infinity, and the magnetic field is

[0082]

[0083] Obtaining the magnetic field of the current of each segment to the observation point may also include:

[0084] According to the residue theorem, the integral is converted into a series summation to obtain the closed-loop explicit expression of the magnetic field generated by the strip line.

[0085] S30, superimposing the magnetic field of each segmented current on the observation point to obtain the overall magnetic field of the strip line on any observation point at the integrated circuit.

[0086] S40: Acquire an induced return current caused by the stripline current on the ground plane according to the overall magnetic field.

[0087] In a specific example, a method for simulating an inductive return current of a stripline structure includes the following steps:

[0088] 1) Under the premise of knowing the current spatial distribution on the stripline, divide the stripline into small segments along the length direction. The length of each small segment is one tenth of the wavelength of the frequency at the highest frequency required for simulation, that is, λ / 10.

[0089] In this way, the current of a known stripline is decomposed into the superposition of each small segment of known current. If the electromagnetic field spatial distribution of any small segment of current is obtained and superimposed, the electromagnetic field spatial distribution of the known stripline can be obtained.

[0090] 2) Calculate the magnetic field of each small current segment on the observation point.

[0091] 2a) Introduce the physical quantities of electric potential energy and magnetic potential energy, and derive the relationship between magnetic field and electric potential energy and magnetic potential energy based on Maxwell's equations for electromagnetic fields.

[0092] 2b) Since the package substrate and circuit board are stacked structures in the z direction, the electric field is decomposed into the sum of TMz modes at each level and the superposition of the sum of TEz modes at each level to facilitate decoupling calculation.

[0093] 2c) Perform a two-dimensional Fourier transform on the above-mentioned Maxwell equations of electromagnetic fields in the TMz and TEz modes, and map the spatial domain xy plane into k x k y frequency domain, forming a double integral.

[0094] 2d) Then k x k y The double integral in the frequency domain is transformed into polar coordinates, k x =k ρ cosθ,k y =k ρ sinθ, converted to k ρ and the double integral of the angle θ.

[0095] 2e) The polar coordinate k above ρ The integral of the modal series is converted into the sum of the function values ​​at all poles contained in the lower half plane by the Cauchy residue theorem. The Sommerfield integral is analytically evaluated by applying the residue theory. Summing the residues at the poles in the complex plane gives a fast and computable modal series expansion that does not require any numerical integration. The special functions that appear in the modal series expansion are fast and computable Bessel functions. Compared with numerical integration, this method greatly improves the computational efficiency.

[0096] 2f) The above angular integral is in the form of a Bessel function, whose value can be calculated using a ready-made formula.

[0097] 3) The magnetic fields of the observation points of each of the above-mentioned small current segments are superimposed to obtain the overall magnetic field of the strip line on the observation points at any position of the package substrate and the circuit board.

[0098] 4) According to step 1), the surface current is the difference between the vertical components of the magnetic field on both sides of the dielectric surface. Since the magnetic field on both sides of the ground plane is obtained, the induced return current caused by the stripline current on the ground plane of the package substrate or circuit board is obtained.

[0099] 5) The method of this example avoids the segmentation of the finite element FEM (Finite Element Method) in the entire airspace of the package substrate and the circuit board. It only needs to segment the strip lines in the problem structure, thereby saving computer storage space, avoiding large and super-large matrix operations, and reducing the amount of calculation. In this embodiment, through the above step 3), the problem of large amount of calculation due to the difficulty of integral calculation is solved, the amount of calculation is reduced, and the method of this example does not require any numerical integral calculation, so the calculation time is greatly reduced. Therefore, by only segmenting the conductor without segmenting the entire space domain, the number of variables and the size of the matrix are reduced, and the problem of complex double integral calculation is solved. The problem of slow simulation due to highly oscillating and slowly convergent numerical integral calculations on the computer is solved, and the overall problem can be quickly simulated.

[0100] PEC, or Perfect Electric Conductor, is an ideal electric conductor model whose notable feature is that the electric field E is distributed vertically on the surface. The relationship between the current induced on the ground plane of the perfect electric conductor (PEC) and the magnetic field is determined by the boundary conditions. At the interface between the dielectric and the ground plane of the perfect electric conductor (PEC):

[0101] The relationship between the current induced in a PEC ground plane and the magnetic field is determined by the boundary conditions. At the interface between the dielectric and the PEC ground plane:

[0102]

[0103] For the upper perfect electric conductor (PEC) ground plane (see Figure 2 ), represents the magnetic field inside the plane of a perfect electric conductor (PEC), represents the magnetic field in the dielectric. Therefore,

[0104]

[0105] and

[0106]

[0107] Substituting equation (1.2) and equation (1.3) into equation (1.1), the expression becomes

[0108]

[0109] in Represents the dielectric region above the horizontally applied current.

[0110] For the lower perfect electric conductor (PEC) conducting plane,

[0111]

[0112] and

[0113]

[0114] Similarly, formula (1.1) is transformed into

[0115]

[0116] The geometry of the horizontal current source is Figure 2 So, it is located at (x,y,z 0 ) is a tiny current source located between two ground planes (z = 0, z = d), which are ideally conductive top and bottom ground planes that constrain the layered dielectric material ( μ, see previous table).

[0117] Under the premise of knowing the strength of the current source, it is necessary to obtain the magnetic field expression of any point (x, y, z) in space, so as to obtain the induced current on the ground plane using the above boundary conditions.

[0118] Using TM z and TE z The field is solved by a combination of TM modes because the z direction is perpendicular to the layered surfaces of a layered dielectric. z and TE z The modes will be decoupled, greatly simplifying the electric field solution. The relationship between the potential and the field is given by Maxwell's equations. In the previous table, all the symbols used before writing Maxwell's equations are listed. Using the symbols already defined, Maxwell's equations can be written as

[0119]

[0120] For the case where only the current flows on the interconnect surface, the magnetic vector potential is chosen to solve Maxwell's equations

[0121]

[0122] After applying the Lorentz gauge

[0123]

[0124] The electric field can be expressed as

[0125]

[0126] Substituting equation (2.8) into equation (2.9) and according to the identity get

[0127]

[0128] Combining (2.2) and (2.7) into (2.10), we obtain the Helmholtz wave equation for the magnetic vector potential

[0129]

[0130] in By using the duality principle, the Helmholtz wave equation for the electric vector potential is obtained. This expression is useful for modeling situations where the structure involves multiple ground planes. For such aperture problems, the equivalent magnetic current flowing in the aperture is obtained and the electric vector potential is chosen to be used.

[0131]

[0132] in For TM z model,

[0133]

[0134] TM H z (x,y,z)=0.(2.17)

[0135] For TE z model,

[0136]

[0137] TE E z (x,y,z)=0; (2.20)

[0138]

[0139] The two-dimensional Fourier transform pair is defined as

[0140]

[0141] Perform Fourier transform in x and y directions.

[0142] Therefore, the TMz electric field can be expressed in the frequency domain as follows

[0143]

[0144] in,

[0145]

[0146] Similarly, the TEz electric field can be expressed as

[0147]

[0148] in,

[0149]

[0150] In common packaging substrates and circuit boards, the dielectric between each layer is the same and uniform. Figure 2 In the problem, assuming μ 1 =μ 2 =μ and The problem is set up by dividing the region between the plates into upper and lower regions at the locations of the surface current sources. By making this separation, boundary conditions can be applied more easily. The solution to equations (2.35) and (2.42) can be written as:

[0151]

[0152] Among them, B 1TM ,B 2TM ,B 1TE ,B 2TE C 1TM ,C 2TM ,C 1TE and C 2TE are coefficients determined by applying boundary conditions. The boundary conditions for the horizontal current source problem ( Figure 2 ) is as follows: Due to the conductor properties of the metal plate,

[0153] In z e =d,

[0154]

[0155] In z e =d,

[0156]

[0157] In z e =0,

[0158]

[0159] In z e =0,

[0160]

[0161] As well as the electrical continuity characteristics at the junction of conductor lines, that is, the characteristics of electric field continuity and magnetic field continuity, and the boundary characteristics of surface current

[0162] exist

[0163] exist

[0164] exist

[0165] exist

[0166] Substituting equations (2.43)-(2.46) into equations (2.47)-(2.54) and solving the resulting equations, we obtain the values ​​of the coefficients:

[0167] Substituting (2.41)-(2.46) into (2.47)-(2.54) and solving the resulting equations yields the values ​​of the coefficients:

[0168] B 1TE =B 2TE =0, (2.55)

[0169] C 1TM =C 2TM =0, (2.56)

[0170]

[0171] Among them, k ρ 2 =k x 2 +k y 2 =k 2 -k z 2 .

[0172] Finally, substitute equations (2.55)-(2.60) into equations (2.29)-(2.42), and the spectral domain magnetic field of the horizontal current source is obtained as follows:

[0173]

[0174] Define z i and z ni , i=1,2 is the area where the observation point is located, whether it is zone 1 or zone 2:

[0175] z 1 =dz e ,z 2 =z e , (2.24)

[0176] and z n1 =z o ,z n2 =dz o (2.25)

[0177] The || symbol in the above equation indicates that the field is excited by a horizontal current.

[0178] According to the magnetic field formula (2.70)-(2.71) excited by the horizontal current dipole, equations (1.4) and (1.7) are further simplified to

[0179]

[0180] That is, in order to obtain the current referenced to the ground plane in the stripline structure, the magnetic field strength (y direction) needs to be derived.

[0181] After inverse Fourier transforming equations (2.70) and (2.71), the spatial domain expression of the magnetic field is obtained:

[0182]

[0183] and

[0184]

[0185] Here, the Green's function is defined as

[0186]

[0187] Then after polar coordinate transformation,

[0188] k x =k ρ cosθ,

[0189] k y =k ρ sinθ,

[0190] The magnetic field in the Y direction is expressed as

[0191]

[0192] in

[0193]

[0194]

[0195] in

[0196] (x e -x o )=ρcosθ mn , (y e -y o )=ρsinθ mn , is the polar coordinate transformation of space.

[0197] in

[0198]

[0199] is a zero-order Bessel function, from which a numerical solution can be quickly obtained through series expansion.

[0200] Then the above expression of magnetic field in the y direction can be simplified to

[0201]

[0202] To calculate the integral, residue theory is used to calculate the integral in, for example, Eq. (10) to obtain an explicit expression for the electric field, and thus obtain the required modal series expansion. That is, by calculating the integral k ρ The value of the integral is obtained by summing the values ​​of the integral at the poles in the lower half of the complex plane.

[0203]

[0204] where the desired pole is the Green function G||(k ρ )’s extreme point.

[0205]

[0206] As defined above

[0207] z n1 =z o , z n2 =dz o , 1 =dz,z 2 = z,

[0208]

[0209] When the observation area i = 1, z ni =z n1 =z o ,

[0210]

[0211] When the observation area i = 2, z ni =z n2 =dz o ,

[0212]

[0213] Therefore, the required pole is sin(k z d), that is, sin(k z d)=nπ,n=0,1,2,…

[0214] According to the relation k ρ 2 =k 2 -kz 2 get

[0215]

[0216] n=0,1,2,3,…

[0217] For applications of the residue theorem, its integration path and the location of the poles, refer to Figure 3 shown.

[0218] The current distribution on the ground plane is derived from the current on the ground plane. Here we run a stripline signal line example to show the initial results of the current distribution. The fill parameter between the ground planes is ε r =4.4 and tanδ=0.0001, the spacing between the ground planes is d=600μm, assuming the operating frequency is 5GHz, the signal trace is placed along the x-axis and located in the middle of the two planes, the line width is b=200μm, the length is l=λ, that is, one wavelength, and the voltage gap source is located in the middle of the signal trace.

[0219] exist Figure 4 In the figure, the sinusoidal current distribution in a stripline signal line is shown. Figure 5 Compared to the return path of the induced current in the ground plane drawn in , the current in the ground plane has a similar shape but extends longer due to the presence of the signal trace. The induced current is directly above the signal trace, forming a minimum loop inductance with the signal trace. The calculated results prove that the return current flows directly above and below the signal trace. This loop has the minimum stored potential energy required to stabilize the system. If Figure 5 Integrating the current distribution along the y direction, the peak current is about 0.06A, which is Figure 5 Considering that the induced current exists in both the top and bottom ground planes, the total induced current is equal to the current in the signal trace. Figure 6 The current distribution contour diagram, i.e., cloud diagram, of the induced current on the ground plane is shown.

[0220] The method of the embodiment of the present application can obtain the current distribution on the ground plane caused by the existence of the signal trace, that is, through the characteristics of the boundary conditions of Maxwell's equations on the ground plane of an ideal electric conductor (perfect electric conductor (PEC), the surface current is the difference between the vertical components of the magnetic field on both sides of the dielectric surface. That is, by calculating the magnetic field at the boundary of the ground plane of the integrated circuit (package substrate or circuit board), the induced current of the upper and lower ground planes caused by the existence of the current of the stripline conductor is obtained. This method avoids the problem of connecting the electromagnetic field of the entire space by finite element (FEM) segmentation, thereby saving a large amount of storage memory, solving the problem of large storage space requirements caused by ultra-large-scale matrix operations, and solving the problem of long time-consuming filling of matrix elements and long time-consuming matrix solution of 3-D full-wave simulator.

[0221] The above description of various embodiments tends to emphasize the differences between the various embodiments. The same or similar aspects can be referenced to each other, and for the sake of brevity, they will not be repeated herein.

[0222] refer to Figure 7 As shown, another embodiment of the present application provides a simulation device for a ground plane induced return current of a stripline structure, comprising:

[0223] A stripline segmentation module, used to segment the stripline of the integrated circuit into a plurality of segments;

[0224] A magnetic field acquisition module, used to acquire the magnetic field of each segmented current relative to an observation point;

[0225] A magnetic field superposition module, used for superimposing the magnetic field of each segmented current on the observation point to obtain the overall magnetic field of the strip line on any position observation point of the integrated circuit;

[0226] The current acquisition module is used to acquire the induced return current caused by the stripline current on the ground plane according to the overall magnetic field.

[0227] Exemplarily, the magnetic field acquisition module is further specifically used for:

[0228] According to electric potential energy and magnetic potential energy, obtain the relationship between magnetic field and electric potential energy and magnetic potential energy;

[0229] Decompose the magnetic field into the sum of TMz modes at each level and the superposition of the sum of TEz modes at each level;

[0230] Obtain the magnetic field of the TMz mode and the TEz mode in double integral form in polar coordinates.

[0231] Exemplarily, according to the electric potential energy and the magnetic potential energy, the relationship between the magnetic field and the electric potential energy and the magnetic potential energy is obtained, including:

[0232] Based on the electric potential energy, magnetic potential energy and Maxwell equations of electromagnetic field, the relationship between magnetic field and electric potential energy and magnetic potential energy is derived.

[0233] Exemplarily, according to electric potential energy, magnetic potential energy and Maxwell equations of electromagnetic field, the relationship between magnetic field and electric potential energy and magnetic potential energy is derived, including:

[0234] Introduce electric potential energy and magnetic potential energy, use magnetic vector potential to solve Maxwell's equations and obtain the magnetic field strength;

[0235] The Lorentz gauge is applied to the magnetic field intensity to obtain the Lorentz gauge magnetic field intensity.

[0236] Exemplarily, obtaining the magnetic field in the double integral form of the TMz mode and the TEz mode in polar coordinates includes:

[0237] Perform a two-dimensional Fourier transform on the electromagnetic field Maxwell equations of the TMz mode and TEz mode, and map the spatial domain xy plane into k x k y frequency domain, forming k x k y Double integral in the frequency domain;

[0238] The k x k y The double integral in the frequency domain is converted into the double integral in polar coordinates through polar coordinate transformation;

[0239] The double integral in polar coordinates is converted into the sum of function values ​​at all poles contained in the lower half plane through the Cauchy residue theorem.

[0240] Exemplarily, obtaining the magnetic field of the current of each segment relative to the observation point also includes:

[0241] According to the residue theorem, the integral is converted into a series summation to obtain the closed-loop explicit expression of the magnetic field generated by the strip line.

[0242] The simulation device for the ground plane induced return current of the stripline structure provided in the embodiment of the present application can achieve the same beneficial technical effect as the simulation method for the ground plane induced return current of the stripline structure provided in the embodiment of the present application.

[0243] Another embodiment of the present application provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement a method of any of the above embodiments.

[0244] refer to Figure 8As shown, the electronic device 10 may include: a processor 100, a memory 101, a bus 102 and a communication interface 103, and the processor 100, the communication interface 103 and the memory 101 are connected via the bus 102; the memory 101 stores a computer program that can be run on the processor 100, and when the processor 100 runs the computer program, it executes the method provided in any of the aforementioned embodiments of the present application.

[0245] The memory 101 may include a high-speed random access memory (RAM), and may also include a non-volatile memory, such as at least one disk storage. The communication connection between the device network element and at least one other network element is realized through at least one communication interface 103 (which may be wired or wireless), and the Internet, wide area network, local area network, metropolitan area network, etc. may be used.

[0246] The bus 102 may be an ISA bus, a PCI bus, or an EISA bus, etc. The bus may be divided into an address bus, a data bus, a control bus, etc. The memory 101 is used to store a program, and the processor 100 executes the program after receiving an execution instruction. The method disclosed in any implementation of the aforementioned embodiment of the present application may be applied to the processor 100, or implemented by the processor 100.

[0247] The processor 100 may be an integrated circuit chip with signal processing capabilities. In the implementation process, each step of the above method can be completed by an integrated logic circuit of hardware in the processor 100 or an instruction in the form of software. The above processor 100 may be a general-purpose processor, which may include a central processing unit (CPU), a network processor (NP), etc.; it may also be a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA) or other programmable logic devices, discrete gates or transistor logic devices, discrete hardware components. The methods, steps and logic block diagrams disclosed in the embodiments of the present application can be implemented or executed. The general-purpose processor may be a microprocessor or the processor may also be any conventional processor, etc. The steps of the method disclosed in the embodiments of the present application can be directly embodied as a hardware decoding processor for execution, or a combination of hardware and software modules in the decoding processor for execution. The software module may be located in a mature storage medium in the field such as a random access memory, a flash memory, a read-only memory, a programmable read-only memory or an electrically erasable programmable memory, a register, etc. The storage medium is located in the memory 101, and the processor 100 reads the information in the memory 101 and completes the steps of the above method in combination with its hardware.

[0248] The electronic device provided in the embodiment of the present application and the method provided in the embodiment of the present application are based on the same inventive concept and have the same beneficial effects as the method adopted, operated or implemented by them.

[0249] Another embodiment of the present application provides a computer-readable storage medium, on which a computer program is stored, and the computer program is executed by a processor to implement the method of any of the above embodiments. Fig. 9 As shown, the computer-readable storage medium shown is a CD 20 on which a computer program (ie, a program product) is stored. When the computer program is run by a processor, the method provided by any of the aforementioned embodiments will be executed.

[0250] It should be noted that examples of computer-readable storage media may also include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other optical or magnetic storage media, which are not listed here one by one.

[0251] The computer-readable storage medium provided in the above-mentioned embodiments of the present application and the method provided in the embodiments of the present application are based on the same inventive concept and have the same beneficial effects as the method adopted, run or implemented by the application program stored therein.

[0252] It should be noted that:

[0253] The term "module" is not intended to be limited to a specific physical form. Depending on the specific application, a module can be implemented as hardware, firmware, software, and / or a combination thereof. In addition, different modules can share common components or even be implemented by the same components. There may or may not be clear boundaries between different modules.

[0254] The algorithm and display provided herein are not inherently related to any specific computer, virtual device or other equipment. Various general devices can also be used together with examples based on this. According to the above description, it is obvious to construct the structure required for this type of device. In addition, the application is not directed to any specific programming language yet. It should be understood that various programming languages ​​can be utilized to realize the content of the application described herein, and the description made to specific languages ​​above is for the purpose of disclosing the best mode of implementation of the application.

[0255] It should be understood that, although the steps in the flowchart of the accompanying drawings are displayed in sequence as indicated by the arrows, these steps are not necessarily executed in sequence in the order indicated by the arrows. Unless otherwise specified herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least a part of the steps in the flowchart of the accompanying drawings may include multiple sub-steps or multiple stages, and these sub-steps or stages are not necessarily executed at the same time, but can be executed at different times, and their execution order is not necessarily sequential, but can be executed in turn or alternately with other steps or at least a part of the sub-steps or stages of other steps.

[0256] The above embodiments only express the implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several modifications and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. A method for simulating ground plane induced return current of a stripline structure, characterized in that: include: Dividing the stripline of the integrated circuit into multiple segments; Obtaining the magnetic field of the current of each segment relative to an observation point; Superimpose the magnetic field of each segmented current on the observation point to obtain the overall magnetic field of the strip line on any observation point at the integrated circuit; According to the overall magnetic field, an induced return current on the ground plane caused by the stripline current is obtained.

2. The method according to claim 1, characterized in that The step of obtaining the magnetic field of each segmented current relative to an observation point comprises: According to electric potential energy and magnetic potential energy, obtain the relationship between magnetic field and electric potential energy and magnetic potential energy; Decompose the magnetic field into the sum of TMz modes at each level and the superposition of the sum of TEz modes at each level; Obtain the magnetic field of the TMz mode and the TEz mode in double integral form in polar coordinates.

3. The method according to claim 2, characterized in that The method of obtaining the relationship between the magnetic field, the electric potential energy and the magnetic potential energy according to the electric potential energy and the magnetic potential energy comprises: Based on the electric potential energy, magnetic potential energy and Maxwell equations of electromagnetic field, the relationship between magnetic field and electric potential energy and magnetic potential energy is derived.

4. The method according to claim 3, characterized in that The relationship between the magnetic field and the electric potential energy and the magnetic potential energy is derived based on the electric potential energy, the magnetic potential energy and the electromagnetic field Maxwell equations, including: Introduce electric potential energy and magnetic potential energy, use magnetic vector potential to solve Maxwell's equations and obtain the magnetic field strength; The Lorentz gauge is applied to the magnetic field intensity to obtain the Lorentz gauge magnetic field intensity.

5. The method according to claim 2, characterized in that: The step of obtaining the magnetic field in the double integral form of the TMz mode and the TEz mode in polar coordinates includes: Perform a two-dimensional Fourier transform on the electromagnetic field Maxwell equations of the TMz mode and TEz mode, and map the spatial domain xy plane into k x k y frequency domain, forming k x k y Double integral in the frequency domain; The k x k y The double integral in the frequency domain is converted into the double integral in polar coordinates through polar coordinate transformation; The double integral in polar coordinates is converted into the sum of function values ​​at all poles contained in the lower half plane through the Cauchy residue theorem.

6. The method according to claim 5, characterized in that The k x k y The double integral in the frequency domain is converted into a double integral in polar coordinates through polar coordinate transformation, including: Using polar coordinates k x =k ρ cosθ,k y =k ρ sinθ, expand the lower limit of integration from zero to negative infinity, and the magnetic field is obtained as 7. The method according to claim 2, characterized in that The decomposition of the magnetic field into the sum of the TMz modes at each level and the superposition of the sum of the TEz modes at each level includes: TM z The expressions of the magnetic field in each direction in this mode are TM H z (x,y,z)=0; TE z The expressions of the magnetic field in each direction in this mode are Based on TM z The expression of magnetic field in each direction and TE in the mode z The expressions of the magnetic field in each direction in the mode decompose the magnetic field.

8. The method according to claim 2, characterized in that: The step of obtaining the magnetic field of each segmented current relative to the observation point further includes: According to the residue theorem, the integral is converted into a series summation to obtain the closed-loop explicit expression of the magnetic field generated by the strip line.

9. A device for simulating ground plane induced return current in a stripline structure, characterized in that: include: A stripline segmentation module, used to segment the stripline of the integrated circuit into a plurality of segments; A magnetic field acquisition module, used for acquiring the magnetic field of each segmented current relative to an observation point; A magnetic field superposition module, used for superimposing the magnetic field of each segmented current on the observation point to obtain the overall magnetic field of the strip line on any position observation point of the integrated circuit; The current acquisition module is used to acquire the induced return current caused by the stripline current on the ground plane according to the overall magnetic field.

10. An electronic device, characterized in that: The device comprises a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the method according to any one of claims 1 to 8.

11. A computer-readable storage medium having a computer program stored thereon, characterized in that: The computer program is executed by a processor to implement the method according to any one of claims 1 to 8.

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