Inductor structure, manufacturing method thereof, equipment and medium

Abstract

The invention discloses an inductor structure and a manufacturing method, device and medium thereof, the inductor structure comprises an inductor winding, a magnet and a metal frame, the magnet wraps the inductor winding to form a cuboid inductor body, and the metal frame covers the top and / or the bottom of the cuboid inductor body. And the inductor winding terminals extend and are bent to the top and / or the bottom of the cuboid inductor main body. A metal frame is additionally arranged on the surface of the inductor, so that an inductor structure with an electrical interconnection design is realized, and the inductor structure adapts to a mature compression molding inductor manufacturing method and a semiconductor manufacturing process. The requirement of advanced system-level packaging for the dimensional precision of a device is higher than the general capacity of inductor manufacturing, the flexibility of packaging design is limited, the condition that the precision is not matched can be solved through an electrode reconstruction mode provided by the invention, and the design flexibility is improved.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor packaging, and in particular, relates to an inductor structure and a manufacturing method, equipment, and medium thereof. Background Art

[0002] With the continuous development of semiconductor technology, in the field of high-integration power chip packaging, in order to adapt to the ever-shrinking terminal equipment, it is necessary to design power chips or modules to occupy as little space as possible.

[0003] Therefore, the industry has proposed a method of vertically stacking components to further reduce the plane space.

[0004] The inventors found that the inductors commonly used in the traditional manufacturing industry are mainly used in planar power circuit structures, while the advanced system-level packaging technology in the packaging of highly integrated power chips or modules requires higher dimensional accuracy of inductor devices than the general capabilities of inductor manufacturing in the current traditional manufacturing industry. Therefore, the inductor manufacturing in the current traditional manufacturing industry is not fully suitable for highly integrated power chips or modules designed and manufactured through semiconductor advanced packaging processes.

[0005] Furthermore, the power chip or module using the above-mentioned vertical stacking mode also poses challenges to the interconnection method of the inductor during packaging. For example, there is a need for the inductor terminals to be located on different surfaces, and traditional inductor terminals cannot meet the complex electrical interconnection and heat dissipation requirements. Summary of the invention

[0006] In order to solve the problem of how to provide an inductor structure in the prior art to meet the requirements of complex electrical interconnection and heat dissipation in magnetic integrated power modules, the technical solution of this application is as follows: On the one hand, an inductor structure is provided, comprising: an inductor winding, a magnet and a metal frame, wherein the magnet wraps the inductor winding to form a rectangular inductor body, the metal frame covers the top and / or bottom of the rectangular inductor body, and is connected to the inductor winding terminals extended and bent to the top and / or bottom of the rectangular inductor body.

[0007] The metal frame is in the form of a thin sheet, and the width of the metal frame is greater than the width of the inductor winding terminal.

[0008] On the other hand, a method for manufacturing the above-mentioned inductor structure is provided, comprising the steps of: S11: manufacturing the copper material into an inductor winding of a fixed shape, wherein the fixed shape includes any one of the following: Z-shape, I-shape, U-shape, C-shape, and spiral shape; S12: placing the inductor winding into the mold cavity, loading magnetic powder, and pre-pressing it to keep a certain shape and expose the inductor winding terminal; S13: Mounting sheet metal frame; S14: After pressing and molding, sintering is performed to form the magnetic powder into a solid whole, and the sintered material solidifies to form good connection and conductivity.

[0009] The steps of mounting the thin sheet metal frame include: S1311: Use a steel mesh that matches the end of the inductor winding to coat the sintered nano-metal material, or use a dispensing method to apply the material at a specified position on the end of the inductor winding; S1312: Mount the sheet metal frame at the designated position of the inductor winding end.

[0010] The steps of mounting the thin sheet metal frame include: S1321: coating the thin metal frame with sintered nano-metal material, mounting the preformed inductor on a designated position of the metal frame, sintering and curing the nano-metal once, and dividing the nano-metal; S1322: The segmented inductor is surface mounted on another metal frame and sintered to solidify, completing the connection on the other side.

[0011] On the other hand, an inductor structure is provided, comprising: an inductor winding, a magnet, a metal connecting sheet and a metal frame, wherein the magnet wraps the inductor winding and the metal connecting sheet to form a rectangular inductor body, the metal connecting sheet is located on the outer peripheral surface of the rectangular inductor body, the metal frame covers the top and / or bottom of the rectangular inductor body, and is connected to the inductor winding terminals and the metal connecting sheet terminals extended and bent to the top and / or bottom of the rectangular inductor body.

[0012] There are multiple metal frames, and the shapes and arrangements of the metal frames located at the top and bottom of the rectangular inductor body are different.

[0013] On the other hand, a method for manufacturing the above-mentioned inductor structure is provided, comprising the steps of: S21: manufacturing the copper material into an inductor winding of a fixed shape, wherein the fixed shape includes any one of the following: Z-shape, I-shape, U-shape, C-shape, and spiral shape; S22: placing the inductor winding and the corresponding metal connecting piece terminal into the mold cavity, and loading magnetic powder, and pre-pressing it to keep a certain shape and expose the inductor winding and the metal connecting piece terminal; S23: coating the sintered nano-metal material using a steel mesh matched with the inductor winding end and the metal connecting piece end, or dispensing the material at the designated positions of the inductor winding end and the metal connecting piece end by dispensing; and then attaching the sheet-type metal frame to the designated positions of the inductor winding end and the metal connecting piece end; S24: After pressing and molding, sintering is performed to form the magnetic powder into a solid whole, and the sintered material solidifies to form good connection and conductivity.

[0014] On the other hand, an inductor structure manufacturing device is provided, including a memory and a processor coupled to each other, wherein the processor is used to execute program instructions stored in the memory to implement the above-mentioned inductor structure manufacturing method.

[0015] On the other hand, a computer-readable storage medium is provided, on which program instructions are stored, and when the program instructions are executed by a processor, the above-mentioned method for manufacturing the inductor structure is implemented.

[0016] The beneficial effects of the present application are: providing an inductor structure including an inductor winding, a magnet and a metal frame, wherein the magnet wraps the inductor winding to form a rectangular inductor body, the metal frame covers the top and / or bottom of the rectangular inductor body, and is connected to the inductor winding terminals extended and bent to the top and / or bottom of the rectangular inductor body, and by adding a metal frame to the surface of the inductor, the metal frame is used to realize the function of the traditional inductor terminal and improve the heat dissipation function. The present application scheme can realize an inductor structure with convenient electrical interconnection design, and is compatible with mature molded inductor manufacturing methods and semiconductor processes. Advanced system-level packaging has higher dimensional accuracy requirements for devices than the general capabilities of inductor manufacturing, which limits the flexibility of packaging design, and the electrode reconstruction method provided by the present invention can solve this precision mismatch and improve design flexibility. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a structural schematic diagram of an embodiment of an inductor structure of the present application; Figure 2 It is a flow chart of an embodiment of a method for manufacturing an inductor structure of the present application; Figure 3 It is a schematic diagram of a sub-flow of an embodiment of a method for manufacturing an inductor structure of the present application; Figure 4 yes Figure 3 Schematic diagram of the corresponding structural changes; Figure 5 It is a schematic diagram of a sub-flow of an embodiment of a method for manufacturing an inductor structure of the present application; Figure 6 yes Figure 5 Schematic diagram of the corresponding structural changes; Figure 7 is a structural schematic diagram of an embodiment of an inductor structure of the present application; Figure 8 yes Figure 7 A schematic flow chart of an embodiment of a corresponding manufacturing method of the inductor structure; Fig. 9 yes Figure 8The corresponding structural decomposition diagram; Fig.10 It is a schematic diagram of a framework of an embodiment of an inductor structure manufacturing device provided by the present application; Fig.11 It is a schematic diagram of a framework of an embodiment of a computer-readable storage medium provided by the present application. DETAILED DESCRIPTION

[0018] In order to facilitate the understanding of the present application, the present application is described in more detail below in conjunction with the accompanying drawings and specific embodiments. The preferred embodiments of the present application are provided in the accompanying drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described in this specification. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive.

[0019] It should be noted that, unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as those commonly understood by those skilled in the art of the present application. The terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0020] The following are definitions of the professional terms used in the embodiments of this application: Switching power supply module: A power supply module based on the switching buck-boost circuit topology.

[0021] Chip: integrated circuit carrier.

[0022] Magnetic integrated power chip: adopts the system-level packaging design concept, and integrates magnetic devices or materials into the power module through advanced packaging technology, so that the application of switching power modules does not require additional configuration of magnetic devices.

[0023] Molded inductor: An inductor formed by molding a soft magnetic powder core and a copper conductor through pressing equipment and a mold, and then undergoing heat treatment and other steps.

[0024] Lead frame: A thin metal sheet with a specific shape and structure that can achieve functions such as electrical interconnection and heat dissipation, usually made of copper.

[0025] SMT surface mounting: The process of using automated equipment and a steel mesh with a specific shape to apply solder paste or other connecting materials, place components, and fix molten materials.

[0026] Sintered metal: Utilizing the strong activation of the surface of metal nanoparticles, a stable structure is formed through solid-state bonding between nanoparticles at a temperature much lower than the melting point of the metal. Common examples are silver and copper nanoparticles.

[0027] Sintering: The inductor is heat treated according to the material properties to form a dense structure inside.

[0028] The specific contents of this application are described in detail below in conjunction with specific embodiments.

[0029] The present application relates to an inductor form and a manufacturing method, and specifically to an inductor that achieves high performance and has electrical interconnection function based on compression molding, sintering, and a metal lead frame, and a corresponding implementation method.

[0030] The inventors have found that in the packaging of highly integrated power chips or modules, some new requirements are put forward for inductors. The main problems are described as follows: 1. Common inductors are mainly used in planar power circuit structures and are not suitable for highly integrated power chips or modules with vertical stacking structures designed and manufactured through semiconductor packaging processes.

[0031] 2. The vertically stacked magnetic integrated power chip packaging design concept poses a challenge to the interconnection method of inductors, and there is a need for the inductor terminals to be located on different surfaces.

[0032] 3. For more complex and high-power electrical systems, the main way to achieve electrical interconnection is through printed circuit boards. The area occupied by inductors is relatively large. Using the area of ​​the inductors themselves for electrical interconnection can help reduce the area of ​​the electrical system.

[0033] 4. The current inductor industry belongs to the traditional manufacturing industry. The manufacturing technology in the semiconductor process has not been popularized in the inductor industry. The present invention integrates the two. In view of this, the present application provides an inductor manufacturing method with an electrical interconnection design, which is compatible with the mature compression molding inductor manufacturing method and semiconductor process. Advanced system-level packaging requires higher dimensional accuracy of devices than the general capabilities of inductor manufacturing, which limits the flexibility of packaging design. The electrode reconstruction method provided by the present invention can solve this precision mismatch and improve design flexibility.

[0034] on the one hand, Figure 1 is a schematic diagram of the structure of an embodiment of the inductor structure of the present application, refer to Figure 1 As shown, the present application provides an inductor structure, including: an inductor winding 103, a magnet 102 and a metal frame 101, wherein the magnet 102 wraps the inductor winding 103 to form a rectangular inductor body, and the metal frame 101 covers the top and / or bottom of the rectangular inductor body and is connected to the inductor winding 103 terminals extended and bent to the top and / or bottom of the rectangular inductor body.

[0035] By providing a metal frame at the top and / or bottom, the flexibility of connecting the inductor with other devices can be expanded on the one hand, and the heat dissipation efficiency can be increased on the other hand. It can be seen that the inductor structure greatly improves the electrical interconnection and heat dissipation capabilities of the inductor, allowing the inductor to provide other functions in addition to the electromagnetic function.

[0036] The metal frame 101 is in a thin sheet shape, and the width of the metal frame 101 is greater than the width of the terminal of the inductor winding 103 .

[0037] Although it is also possible to set the inductor terminal on the top by extending the inductor winding and bending it, the inductor winding is relatively thin, and this method is likely to cause the winding flatness to decrease. The metal frame can be set to a width larger than the inductor winding, thereby meeting more flexible electrical interconnection needs.

[0038] on the other hand, Figure 2 FIG. 1 is a flow chart of an embodiment of a method for manufacturing an inductor structure of the present application. Figure 2 As shown, the present application provides a method for manufacturing the above-mentioned inductor structure, comprising the steps of: S11: manufacturing the copper material into an inductor winding of a fixed shape, wherein the fixed shape includes any one of the following: Z-shape, I-shape, U-shape, C-shape, and spiral shape; S12: placing the inductor winding into the mold cavity, loading magnetic powder, and pre-pressing it to keep a certain shape and expose the inductor winding terminal; S13: Mounting sheet metal frame; S14: After pressing and molding, sintering is performed to form the magnetic powder into a solid whole, and the sintered material solidifies to form good connection and conductivity.

[0039] The fixed shape may also include other shapes, which are adjusted according to the inductor design requirements.

[0040] in, Figure 3 is a schematic diagram of a sub-flow diagram of an embodiment of a method for manufacturing an inductor structure of the present application. Figure 3 As shown, the step S13 of mounting the thin sheet metal frame includes: S1311: Use a steel mesh that matches the end of the inductor winding to coat the sintered nano-metal material, or use a dispensing method to apply the material at a specified position on the end of the inductor winding; S1312: Mount the sheet metal frame at the designated position of the inductor winding end.

[0041] Figure 4 yes Figure 3 The corresponding structural change diagram is as follows: Figure 4 As shown, a schematic diagram of the structural changes of the whole process of the above method is shown, which specifically includes: 1. Make the winding into a fixed shape; 2. Bend the winding ends so that one end of the terminal faces vertically upward and the other end faces vertically downward; 3. Fill and pre-press the magnetic powder to expose the inductor winding terminals; 4. Apply sintering material to the terminal; 5. Install the thin metal frame at the corresponding position; 6. Pressing molding + sintering.

[0042] in, Figure 5 FIG. 1 is a schematic diagram of a sub-flow chart of another embodiment of the method for manufacturing the inductor structure of the present application. Figure 5 As shown, the step S13 of mounting the thin sheet metal frame includes: S1321: coating the thin metal frame with sintered nano-metal material, mounting the preformed inductor on a designated position of the metal frame, sintering and curing the nano-metal once, and dividing the nano-metal; S1322: The segmented inductor is surface mounted on another metal frame and pressed into shape, sintered and solidified to complete the connection on the other side.

[0043] Figure 6 yes Figure 5 The corresponding structural change diagram is as follows: Figure 6 As shown, a schematic diagram of the structural changes of the whole process of the above method is shown, which specifically includes: 1. Make the winding into a fixed shape; 2. Bend the winding ends so that the terminal at one end faces vertically upward and the terminal at the other end faces vertically downward; 3. Fill and pre-press the magnetic powder to expose the inductor winding terminals; 4. Apply the sintered material on the metal frame; 5. Mount the inductor to the metal frame on one side; 6. Flip the inductor over and mount it to the metal frame on the other side for the second time. 7. Pressing and sintering.

[0044] On the other hand, Figure 7 is a structural schematic diagram of an embodiment of an inductor structure of the present application; refer to Figure 7The present application also provides an inductor structure, including: an inductor winding 103, a magnet 102, a metal connecting sheet 104 and a metal frame 101, wherein the magnet 102 wraps the inductor winding 103 and the metal connecting sheet 104 to form a rectangular inductor body, the metal connecting sheet 104 is located on the outer peripheral surface of the rectangular inductor body, and the metal frame 101 covers the top and / or bottom of the rectangular inductor body, and is connected to the inductor winding 103 terminal and the metal connecting sheet 104 terminal extended and bent to the top and / or bottom of the rectangular inductor body.

[0045] The metal sheet around the inductor is used to expand the flexibility of electrical interconnection. The top and bottom are mounted through a metal frame to achieve conduction, or the inductor body is used to achieve heat dissipation.

[0046] It can be seen that by introducing the metal connecting sheet on the outer peripheral surface, the flexibility of the electrical interconnection of the inductor can be further improved, and the heat dissipation effect can be improved.

[0047] There are multiple metal frames 101 , and the metal frames 101 located at the top and bottom of the rectangular parallelepiped inductor body have different shapes and arrangements.

[0048] Among them, the number and arrangement of metal frames and metal connecting plates can be flexibly changed to meet different electrical interconnection requirements, inductance performance requirements and heat dissipation requirements.

[0049] On the other hand, Figure 8 yes Figure 7 FIG. 1 is a flow chart of an embodiment of a corresponding manufacturing method of the inductor structure.

[0050] refer to Figure 8 As shown, the present application also provides a method for manufacturing the above-mentioned inductor structure, comprising the steps of: S21: manufacturing the copper material into an inductor winding of a fixed shape, wherein the fixed shape includes any one of the following: Z-shape, I-shape, U-shape, C-shape, and spiral shape; S22: placing the inductor winding and the corresponding metal connecting piece terminal into the mold cavity, and loading magnetic powder, and pre-pressing it to keep a certain shape and expose the inductor winding and the metal connecting piece terminal; S23: coating the sintered nano-metal material using a steel mesh matched with the inductor winding end and the metal connecting piece end, or dispensing the material at the designated positions of the inductor winding end and the metal connecting piece end by dispensing; and then attaching the sheet-type metal frame to the designated positions of the inductor winding end and the metal connecting piece end; S24: After pressing and molding, sintering is performed to form the magnetic powder into a solid whole, and the sintered material solidifies to form good connection and conductivity.

[0051] The fixed shape may also include other shapes, which are adjusted according to the inductor design requirements.

[0052] For details, please refer to Fig. 9 , Fig. 9 yes Figure 8 The corresponding structural decomposition diagram. Fig. 9 It can be seen that the metal frames at the top and bottom of the inductor structure have different shapes, and by connecting with the metal connecting pieces on the outer peripheral surface of the inductor body, various electrical connection requirements can be met.

[0053] On the other hand, the present application also provides an inductor structure manufacturing device, including a memory and a processor coupled to each other, and the processor is used to execute program instructions stored in the memory to implement the above-mentioned inductor structure manufacturing method.

[0054] Specifically, see Fig.10 The inductor structure manufacturing device 200 of the present application may specifically include a processor 210 and a memory 220 . The memory 220 is coupled to the processor 210 .

[0055] The processor 210 is used for the operation of the inductor structure manufacturing device 200. The processor 210 may also be referred to as a CPU (Central Processing Unit). The processor 210 may be an integrated circuit chip having the ability to process signals. The processor 210 may also be a general-purpose processor, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field programmable gate array (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components. The general-purpose processor may be a microprocessor or the processor 210 may also be any conventional processor, etc.

[0056] The memory 220 is used to store computer programs, and may be a RAM, a ROM, or other types of storage devices. Specifically, the memory may include one or more computer-readable storage media, which may be non-transitory. The memory may also include a high-speed random access memory, and a non-volatile memory, such as one or more disk storage devices, flash memory storage devices. In some embodiments, the non-transitory computer-readable storage medium in the memory is used to store at least one program code.

[0057] The processor 210 is used to execute the computer program stored in the memory 220 to implement the methods described in the various method embodiments of the present application.

[0058] In some embodiments, the inductor structure manufacturing device 200 may further include: a peripheral device interface 230 and at least one peripheral device. The processor 210, the memory 220 and the peripheral device interface 230 may be connected via a bus or a signal line. Each peripheral device may be connected to the peripheral device interface 230 via a bus, a signal line or a circuit board. Specifically, the peripheral device includes: at least one of a radio frequency circuit 240, a display screen 250, an audio circuit 260 and a power supply 270.

[0059] The peripheral device interface 230 may be used to connect at least one peripheral device related to I / O (Input / output) to the processor 210 and the memory 220. In some embodiments, the processor 210, the memory 220, and the peripheral device interface 230 are integrated on the same chip or circuit board; in some other implementations, any one or two of the processor 210, the memory 220, and the peripheral device interface 230 may be implemented on a separate chip or circuit board, which is not limited in this embodiment.

[0060] The radio frequency circuit 240 is used to receive and transmit RF (Radio Frequency) signals, also known as electromagnetic signals. The radio frequency circuit 240 communicates with the communication network and other communication devices through electromagnetic signals, and the radio frequency circuit 240 is the communication circuit of the inductor structure manufacturing device 200. The radio frequency circuit 240 converts the electrical signal into an electromagnetic signal for transmission, or converts the received electromagnetic signal into an electrical signal. Optionally, the radio frequency circuit 240 includes: an antenna system, an RF transceiver, one or more amplifiers, a tuner, an oscillator, a digital signal processor, a codec chipset, a user identity module card, and the like. The radio frequency circuit 240 can communicate with other terminals through at least one wireless communication protocol. The wireless communication protocol includes but is not limited to: the World Wide Web, a metropolitan area network, an intranet, various generations of mobile communication networks (2G, 3G, 4G and 5G), a wireless local area network and / or a WiFi (Wireless Fidelity) network. In some embodiments, the radio frequency circuit 240 may also include circuits related to NFC (NearField Communication), which is not limited in this application.

[0061] The display screen 250 is used to display a UI (User Interface). The UI may include graphics, text, icons, videos, and any combination thereof. When the display screen 250 is a touch display screen, the display screen 250 also has the ability to collect touch signals on the surface or above the surface of the display screen 250. The touch signal can be input to the processor 210 as a control signal for processing. At this time, the display screen 250 can also be used to provide virtual buttons and / or virtual keyboards, also known as soft buttons and / or soft keyboards. In some embodiments, the display screen 250 can be one, arranged on the front panel of the inductive structure manufacturing device 200; in other embodiments, the display screen 250 can be at least two, respectively arranged on different surfaces of the inductive structure manufacturing device 200 or in a folding design; in other embodiments, the display screen 250 can be a flexible display screen, arranged on a curved surface or a folding surface of the inductive structure manufacturing device 200. Even, the display screen 250 can also be set to a non-rectangular irregular shape, that is, a special-shaped screen. The display screen 250 can be made of materials such as LCD (Liquid Crystal Display) and OLED (Organic Light-Emitting Diode).

[0062] The audio circuit 260 may include a microphone and a speaker. The microphone is used to collect sound waves from the user and the environment, and convert the sound waves into electrical signals and input them into the processor 210 for processing, or input them into the radio frequency circuit 240 to achieve voice communication. For the purpose of stereo acquisition or noise reduction, there may be multiple microphones, which are respectively arranged at different parts of the inductance structure manufacturing device 200. The microphone may also be an array microphone or an omnidirectional acquisition microphone. The speaker is used to convert the electrical signal from the processor 210 or the radio frequency circuit 240 into sound waves. The speaker may be a traditional film speaker or a piezoelectric ceramic speaker. When the speaker is a piezoelectric ceramic speaker, it can not only convert the electrical signal into sound waves audible to humans, but also convert the electrical signal into sound waves inaudible to humans for purposes such as ranging. In some embodiments, the audio circuit 260 may also include a headphone jack.

[0063] The power supply 270 is used to power various components in the inductor structure manufacturing device 200. The power supply 270 can be an alternating current, a direct current, a disposable battery, or a rechargeable battery. When the power supply 270 includes a rechargeable battery, the rechargeable battery can be a wired rechargeable battery or a wireless rechargeable battery. A wired rechargeable battery is a battery that is charged through a wired line, and a wireless rechargeable battery is a battery that is charged through a wireless coil. The rechargeable battery can also be used to support fast charging technology.

[0064] For a detailed description of the functions and execution processes of each functional module or component in the embodiment of the intelligent control platform of the present application, reference can be made to the description in the above-mentioned embodiment of each method of the present application, which will not be repeated here.

[0065] In the several embodiments provided in the present application, it should be understood that the disclosed intelligent control platform and method can be implemented in other ways. For example, the various embodiments of the intelligent control platform described above are only schematic. For example, the division of modules or units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be an indirect coupling or communication connection through some interfaces, devices or units, which can be electrical, mechanical or other forms.

[0066] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the present embodiment.

[0067] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0068] On the other hand, the present application provides a computer-readable storage medium storing a computer program, where the computer program can be executed by a processor to implement any of the above methods.

[0069] See also Fig.11, if the above-mentioned integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium 300. Based on this understanding, the technical solution of the present application is essentially or the part that contributes to the prior art or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including several instructions / computer programs to enable an intelligent control platform (which can be a personal computer, server, or network device, etc.) or a processor (processor) to perform all or part of the steps of each implementation method of the present application. The aforementioned storage medium includes: various media such as USB flash drives, mobile hard disks, read-only memories (ROM, Read-Only Memory), random access memories (RAM, Random Access Memory), magnetic disks or optical disks, and electronic devices such as computers, mobile phones, laptops, tablet computers, cameras, etc. with the above-mentioned storage media.

[0070] The description of the execution process of the program data in the computer-readable storage medium can refer to the description in the above-mentioned method embodiments of the present application, which will not be repeated here.

[0071] The above descriptions are merely embodiments of the present application and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

[0072] Those skilled in the art will appreciate that, in the above method of specific implementation, the order in which the steps are written does not imply a strict execution order and does not constitute any limitation on the implementation process. The specific execution order of the steps should be determined by their functions and possible internal logic.

[0073] In summary, this application has the following beneficial effects: The electrical interconnection and heat dissipation capabilities of the inductor are greatly improved through a metal frame or selective electroplating, so that the inductor can provide other functions in addition to the electromagnetic function.

[0074] Furthermore, the connection between the inductor and the metal frame is achieved by sintering the nano-metal material, that is, the connection is made using the sintered nano-metal material, which effectively improves the production efficiency.

[0075] Furthermore, the inductor structure of the present application is simple, which improves the flexibility of electrical interconnection and heat dissipation capability while being easy to assemble.

[0076] Furthermore, the present application provides a variety of variations of the inductor structure, which can be flexibly designed according to different requirements.

[0077] Furthermore, the present application provides manufacturing methods corresponding to different inductor structures, so that the manufacturing method can be tailored to the characteristics of the corresponding inductor structure, saving steps and improving accuracy.

Claims

1. An inductor structure, characterized in that: include: An inductor winding, a magnet and a metal frame, wherein the magnet wraps the inductor winding to form a rectangular inductor body, the metal frame covers the top and / or bottom of the rectangular inductor body, and is connected to the inductor winding terminals extended and bent to the top and / or bottom of the rectangular inductor body.

2. The inductor structure according to claim 1, characterized in that: The metal frame is in a thin sheet type, and a width of the metal frame is greater than a width of the inductor winding terminal.

3. A method for manufacturing an inductor structure as claimed in claim 1, characterized in that: Includes steps: S11: manufacturing the copper material into an inductor winding of a fixed shape, wherein the fixed shape includes any one of the following: Z-shape, I-shape, U-shape, C-shape, and spiral shape; S12: placing the inductor winding into a mold cavity, and loading magnetic powder, and pre-pressing it to keep a certain shape and expose the inductor winding terminals; S13: Mounting sheet metal frame; S14: After pressing and molding, sintering is performed to form the magnetic powder into a solid whole, and the sintered material solidifies to form good connection and conductivity.

4. The method according to claim 3, characterized in that: The steps of mounting the sheet metal frame include: S1311: coating the sintered nano-metal material using a steel mesh matched with the end of the inductor winding, or applying the material at a designated position of the end of the inductor winding by glue dispensing; S1312: Mount a thin sheet metal frame at a designated position at the end of the inductor winding.

5. The manufacturing method according to claim 3, characterized in that: The steps of mounting the sheet metal frame include: S1321: coating the thin metal frame with sintered nano-metal material, mounting the preformed inductor on a designated position of the metal frame, sintering and curing the nano-metal once, and dividing the nano-metal; S1322: The segmented inductor is surface mounted on another metal frame and pressed into shape, sintered and solidified to complete the connection on the other side.

6. An inductor structure, characterized in that: include: An inductor winding, a magnet, a metal connecting sheet and a metal frame, wherein the magnet wraps the inductor winding and the metal connecting sheet to form a rectangular inductor body, the metal connecting sheet is located on the outer circumference of the rectangular inductor body, the metal frame covers the top and / or bottom of the rectangular inductor body, and is connected to the inductor winding terminals and the metal connecting sheet terminals extended and bent to the top and / or bottom of the rectangular inductor body.

7. The inductor structure according to claim 6, characterized in that: There are multiple metal frames, and the shapes and arrangements of the metal frames located at the top and bottom of the rectangular parallelepiped inductor body are different.

8. A method for manufacturing an inductor structure as claimed in claim 5, characterized in that: Includes steps: S21: manufacturing the copper material into an inductor winding of a fixed shape, wherein the fixed shape includes any one of the following: Z-shape, I-shape, U-shape, C-shape, and spiral shape; S22: placing the inductor winding and the corresponding metal connecting piece terminal into the mold cavity, and loading magnetic powder, and pre-pressing it to keep a certain shape and expose the inductor winding and the metal connecting piece terminal; S23: coating the sintered nano-metal material using a steel mesh matched with the inductor winding end and the metal connecting piece end, or dispensing the material at the designated positions of the inductor winding end and the metal connecting piece end by dispensing; and then attaching the sheet-type metal frame to the designated positions of the inductor winding end and the metal connecting piece end; S24: After pressing and molding, sintering is performed to form the magnetic powder into a solid whole, and the sintered material solidifies to form good connection and conductivity.

9. An inductor structure manufacturing device, characterized in that: It comprises a memory and a processor coupled to each other, wherein the processor is used to execute program instructions stored in the memory to implement the method for manufacturing the inductor structure according to any one of claims 3 to 5, or the method for manufacturing the inductor structure according to claim 8.

10. A computer-readable storage medium having program instructions stored thereon, characterized in that: When the program instructions are executed by the processor, the method for manufacturing the inductor structure described in any one of claims 3 to 5 or the method for manufacturing the inductor structure described in claim 8 is implemented.

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