Inductive structure, method of manufacturing the same, device, medium

Abstract

This application discloses an inductor structure and its fabrication method, equipment, and dielectric. The inductor structure includes an inductor winding, a magnet, and a metal frame. The magnet encloses the inductor winding to form a cuboid inductor body. The metal frame covers the top and / or bottom of the cuboid inductor body and connects to the inductor winding terminals that are extended and bent to the top and / or bottom of the cuboid inductor body. By adding a metal frame to the inductor surface, an inductor structure with electrical interconnect design is achieved, which is compatible with mature molding inductor manufacturing methods and semiconductor processes. Advanced system-in-package (SIIP) requires higher dimensional accuracy than general inductor manufacturing capabilities, limiting the flexibility of package design. The electrode reconfiguration method provided by this invention can solve this accuracy mismatch and improve design flexibility.

Description

Technical Field

[0001] This application belongs to the field of semiconductor packaging, and in particular relates to an inductor structure and its fabrication method, equipment, and dielectric. Background Technology

[0002] With the continuous development of semiconductor technology, in the field of highly integrated power chip packaging, in order to adapt to the ever-shrinking terminal devices, it is necessary to design power chips or modules to occupy as little space as possible.

[0003] Therefore, the industry has proposed using a vertical stacking method for each component to further reduce the planar space.

[0004] The inventors discovered that inductors commonly used in traditional manufacturing are primarily applied to planar power circuit structures. However, advanced system-in-package (SIP) technology for highly integrated power chips or modules demands higher dimensional accuracy from inductors than is typically achieved in traditional manufacturing processes. Therefore, current traditional inductor manufacturing methods are not entirely suitable for highly integrated power chips or modules designed and manufactured using advanced semiconductor packaging processes.

[0005] Furthermore, power chips or modules using the aforementioned vertical stacking pattern also present challenges in terms of the interconnection method of inductors during packaging. For example, there is a need for inductor terminals to be located on different surfaces, and traditional inductor terminals cannot meet the complex electrical interconnection and heat dissipation requirements. Summary of the Invention

[0006] To address the challenge of providing an inductor structure in existing technologies that meets the requirements of complex electrical interconnections and heat dissipation in magnetically integrated power modules, the technical solution of this application is as follows:

[0007] On one hand, an inductor structure is provided, comprising: an inductor winding, a magnet, and a metal frame, wherein the magnet encloses the inductor winding to form a cuboid inductor body, and the metal frame covers the top and / or bottom of the cuboid inductor body and is connected to the inductor winding terminals that extend and bend to the top and / or bottom of the cuboid inductor body.

[0008] The metal frame is a thin sheet, and its width is greater than the width of the inductor winding terminals.

[0009] On the other hand, a method for manufacturing the above-mentioned inductor structure is provided, including the following steps:

[0010] S11: The copper material is manufactured into an inductor winding of a fixed shape, which includes any of the following: Z-shaped, I-shaped, U-shaped, C-shaped, or spiral.

[0011] S12: Place the inductor winding into the mold cavity, fill it with magnetic powder, pre-press it to maintain a certain shape, and expose the inductor winding terminals.

[0012] S13: Surface mount thin metal frame;

[0013] S14: After pressing and molding, sintering is carried out to make the magnetic powder form a solid whole, and at the same time, the sintered material solidifies to form good bonding and conductivity.

[0014] The step of mounting the thin-film metal frame includes:

[0015] S1311: Apply sintered nano-metallic material coating using a steel mesh adapted to the inductor winding terminals, or apply material by dispensing at designated locations on the inductor winding terminals.

[0016] S1312: Mount the thin metal frame onto the specified position at the end of the inductor winding.

[0017] The step of mounting the thin-film metal frame includes:

[0018] S1321: Coating of sintered nano-metal materials on a thin metal frame, mounting a pre-formed inductor onto a designated position on the metal frame, then performing a nano-metal sintering and curing process, and then dividing the material.

[0019] S1322: The split inductor is then surface-mounted onto another metal frame and sintered to solidify, completing the connection on the other side.

[0020] In another aspect, an inductor structure is provided, comprising: an inductor winding, a magnet, a metal connecting piece, and a metal frame, wherein the magnet encloses the inductor winding and the metal connecting piece to form a cuboid inductor body, the metal connecting piece is located on the outer peripheral surface of the cuboid inductor body, and the metal frame covers the top and / or bottom of the cuboid inductor body and is connected to the inductor winding terminals and the metal connecting piece terminals that extend and bend to the top and / or bottom of the cuboid inductor body.

[0021] The metal frame consists of multiple metal frames, and the metal frames at the top and bottom of the cuboid inductor body have different shapes and arrangements.

[0022] On the other hand, a method for manufacturing the above-mentioned inductor structure is provided, including the following steps:

[0023] S21: The copper material is manufactured into an inductor winding of a fixed shape, which includes any of the following: Z-shaped, I-shaped, U-shaped, C-shaped, or spiral.

[0024] S22: Place the inductor winding and the corresponding metal connecting piece terminals into the mold cavity, fill it with magnetic powder, pre-press it to maintain a certain shape, and expose the inductor winding and metal connecting piece ends;

[0025] S23: Apply sintered nano-metallic material using a steel mesh that is compatible with the inductor winding ends and the metal connecting piece ends, or apply material by dispensing at designated locations on the inductor winding ends and the metal connecting piece ends; then attach a thin sheet metal frame to the designated locations on the inductor winding ends and the metal connecting piece ends.

[0026] S24: After pressing and molding, sintering is carried out to make the magnetic powder form a solid whole, and at the same time, the sintered material solidifies to form good bonding and conductivity.

[0027] On another front, an inductor structure fabrication apparatus is provided, comprising a memory and a processor coupled to each other, wherein the processor is used to execute program instructions stored in the memory to implement the aforementioned inductor structure fabrication method.

[0028] On another front, a computer-readable storage medium is provided, on which program instructions are stored, and when the program instructions are executed by a processor, a method for manufacturing the aforementioned inductor structure is provided.

[0029] The beneficial effects of this application are: it provides an inductor structure including an inductor winding, a magnet, and a metal frame. The magnet wraps around the inductor winding to form a cuboid inductor body. The metal frame covers the top and / or bottom of the cuboid inductor body and connects to the inductor winding terminals that are extended and bent to the top and / or bottom of the cuboid inductor body. By adding a metal frame to the inductor surface, the metal frame realizes the function of traditional inductor terminals and improves heat dissipation. This application's solution can achieve an inductor structure with convenient electrical interconnection design and is compatible with mature molding inductor manufacturing methods and semiconductor processes. Advanced system-in-package (SIIP) requires higher dimensional accuracy than general inductor manufacturing capabilities, limiting the flexibility of package design. The electrode reconfiguration method provided by this invention can solve this accuracy mismatch and improve design flexibility. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of an embodiment of the inductor structure of this application;

[0031] Figure 2 This is a schematic flowchart of an embodiment of the method for manufacturing the inductor structure of this application;

[0032] Figure 3 This is a schematic diagram of a sub-process of an embodiment of the method for manufacturing the inductor structure of this application;

[0033] Figure 4 yes Figure 3 Corresponding structural change diagram;

[0034] Figure 5This is a schematic diagram of a sub-process of an embodiment of the method for manufacturing the inductor structure of this application;

[0035] Figure 6 yes Figure 5 Corresponding structural change diagram;

[0036] Figure 7 This is a schematic diagram of an embodiment of the inductor structure of this application;

[0037] Figure 8 yes Figure 7 A flowchart illustrating an embodiment of the corresponding fabrication method for the inductor structure;

[0038] Figure 9 yes Figure 8 The corresponding structural decomposition diagram;

[0039] Figure 10 This is a schematic diagram of the framework of an embodiment of the inductor structure fabrication equipment provided in this application;

[0040] Figure 11 This is a schematic diagram of a framework of an embodiment of the computer-readable storage medium provided in this application. Detailed Implementation

[0041] To facilitate understanding of this application, a more detailed description is provided below with reference to the accompanying drawings and specific embodiments. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this application.

[0042] It should be noted that, unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of this application.

[0043] The following are the definitions of the technical terms used in the embodiments of this application:

[0044] Switching power supply module: A power supply module based on a switching buck-boost circuit topology.

[0045] Chip: The carrier of integrated circuits.

[0046] Magnetic integrated power chip: Adopting a system-level packaging design approach, magnetic devices or materials are integrated into the power module through advanced packaging technology, so that the application switching power supply module does not need to be configured with additional magnetic devices.

[0047] Molded inductors: Inductors formed by pressing soft magnetic powder cores and copper conductors through pressing equipment and molds, followed by heat treatment and other steps.

[0048] Lead frame: A thin metal sheet with a specific shape and structure that can realize functions such as electrical interconnection and heat dissipation, and is commonly made of copper.

[0049] SMT (Surface Mount Technology) is a process that uses automated equipment and stencils of specific shapes to apply solder paste or other bonding materials, place components, and fix molten materials.

[0050] Sintered metals: Utilizing the strong activation of the surface of metal nanoparticles, a stable structure is formed through solid-state bonding between nanoparticles at a temperature much lower than the melting point of the metal. Common examples include silver and copper nanoparticles.

[0051] Sintering: The inductor is heat-treated according to its material properties to form a dense internal structure.

[0052] The specific contents of this application will be described in detail below with reference to specific embodiments.

[0053] This application relates to an inductor form and manufacturing method, specifically to an inductor with high performance and electrical interconnection function based on molding, sintering, and metal lead frame, and the corresponding implementation method.

[0054] The inventors discovered that in the packaging of highly integrated power chips or modules, some new requirements have been placed on inductors. The main issues are described below:

[0055] 1. Common inductors are mainly used in planar power circuit structures and are not suitable for highly integrated power chips or modules with vertical stacking structures designed and manufactured through semiconductor packaging processes.

[0056] 2. The vertically stacked magnetic integrated power chip packaging design poses a challenge to the interconnection of inductors, resulting in the requirement that inductor terminals need to be located on different surfaces.

[0057] 3. For more complex and high-power electrical systems, the main way to achieve electrical interconnection is through printed circuit boards. Inductors occupy a large area, and using the area of ​​the inductor itself for electrical interconnection helps to reduce the area of ​​the electrical system.

[0058] 4. The current inductor industry belongs to the traditional manufacturing industry, and the manufacturing technology in semiconductor process is not widespread in the inductor industry. This invention integrates the two.

[0059] In view of this, this application provides an inductor manufacturing method with implementation of electrical interconnection design, and is compatible with mature molding inductor manufacturing methods and semiconductor processes. Advanced system-in-package (SIIP) requires higher dimensional accuracy than general inductor manufacturing capabilities, limiting the flexibility of package design. The electrode reconfiguration method provided by this invention can solve this accuracy mismatch and improve design flexibility.

[0060] on the one hand, Figure 1 This is a schematic diagram of an embodiment of the inductor structure of this application, with reference to... Figure 1 As shown, this application provides an inductor structure, including: an inductor winding 103, a magnet 102, and a metal frame 101, wherein the magnet 102 encloses the inductor winding 103 to form a cuboid inductor body, and the metal frame 101 covers the top and / or bottom of the cuboid inductor body and is connected to the terminals of the inductor winding 103 that are extended and bent to the top and / or bottom of the cuboid inductor body.

[0061] By incorporating a metal frame at the top and / or bottom, the flexibility of connecting the inductor to other devices is increased, while heat dissipation efficiency is also enhanced. Therefore, this inductor structure significantly improves the inductor's electrical interconnection and heat dissipation capabilities, enabling the inductor to perform functions beyond electromagnetic functions.

[0062] The metal frame 101 is a thin sheet, and the width of the metal frame 101 is greater than the width of the terminals of the inductor winding 103.

[0063] While it is possible to achieve top-mounted inductor terminals by extending and bending the inductor winding, the inductor winding is relatively thin, which can easily lead to a decrease in the flatness of the winding. The metal frame, on the other hand, can be set to be wider than the inductor winding, thereby meeting the needs of more flexible electrical interconnection.

[0064] on the other hand, Figure 2 This is a schematic flowchart of an embodiment of the method for manufacturing the inductor structure of this application, as shown below. Figure 2 As shown, this application provides a method for manufacturing the above-mentioned inductor structure, including the following steps:

[0065] S11: The copper material is manufactured into an inductor winding of a fixed shape, which includes any of the following: Z-shaped, I-shaped, U-shaped, C-shaped, or spiral.

[0066] S12: Place the inductor winding into the mold cavity, fill it with magnetic powder, pre-press it to maintain a certain shape, and expose the inductor winding terminals.

[0067] S13: Surface mount thin metal frame;

[0068] S14: After pressing and molding, sintering is carried out to make the magnetic powder form a solid whole, and at the same time, the sintered material solidifies to form good bonding and conductivity.

[0069] The fixed shape can also include other shapes, which can be adjusted according to the inductor design requirements.

[0070] in, Figure 3 This is a schematic diagram of a sub-process of an embodiment of the method for manufacturing the inductor structure of this application, as shown below. Figure 3 As shown, the mounting sheet metal frame in step S13 includes:

[0071] S1311: Apply sintered nano-metallic material coating using a steel mesh adapted to the inductor winding terminals, or apply material by dispensing at designated locations on the inductor winding terminals.

[0072] S1312: Mount the thin metal frame onto the specified position at the end of the inductor winding.

[0073] Figure 4 yes Figure 3 The corresponding structural change diagram, such as Figure 4 The diagram shown illustrates the structural changes throughout the entire process of the above method, specifically including:

[0074] 1. Make the windings into a fixed shape;

[0075] 2. Bend the winding ends so that one end of the terminal faces vertically upwards and the other end faces vertically downwards;

[0076] 3. Fill and pre-compress the magnetic powder to expose the inductor winding terminals;

[0077] 4. Apply sintering material coating to the terminals;

[0078] 5. Install the thin metal frame at the corresponding position;

[0079] 6. Press molding + sintering.

[0080] in, Figure 5 This is a schematic diagram of a sub-process of another embodiment of the method for manufacturing the inductor structure of this application, as shown below. Figure 5 As shown, the mounting sheet metal frame in step S13 includes:

[0081] S1321: Coating of sintered nano-metal materials on a thin metal frame, mounting a pre-formed inductor onto a designated position on the metal frame, then performing a nano-metal sintering and curing process, and then dividing the material.

[0082] S1322: The split inductor is then surface-mounted onto another metal frame, pressed into shape, sintered and cured to complete the connection on the other side.

[0083] Figure 6 yes Figure 5 The corresponding structural change diagram, such as Figure 6 The diagram shown illustrates the structural changes throughout the entire process of the above method, specifically including:

[0084] 1. Make the windings into a fixed shape;

[0085] 2. Bend the winding ends so that one end of the terminal faces vertically upwards and the other end faces vertically downwards;

[0086] 3. Fill and pre-compress the magnetic powder to expose the inductor winding terminals;

[0087] 4. Apply the sintering material to the metal frame;

[0088] 5. Mount the inductor to one side of the metal frame;

[0089] 6. Then flip the inductor over and mount it a second time onto the metal frame on the other side;

[0090] 7. Press and sinter.

[0091] On the other hand, Figure 7 This is a schematic diagram of an embodiment of the inductor structure of this application;

[0092] refer to Figure 7 This application also provides an inductor structure, including: an inductor winding 103, a magnet 102, a metal connecting piece 104, and a metal frame 101, wherein the magnet 102 wraps around the inductor winding 103 and the metal connecting piece 104 to form a cuboid inductor body, the metal connecting piece 104 is located on the outer peripheral surface of the cuboid inductor body, and the metal frame 101 covers the top and / or bottom of the cuboid inductor body and is connected to the terminals of the inductor winding 103 and the metal connecting piece 104 that are extended and bent to the top and / or bottom of the cuboid inductor body.

[0093] The thin metal sheet around the inductor is used to expand the flexibility of electrical interconnection. The top and bottom are connected by mounting with a metal frame, or heat dissipation is achieved by using the inductor body itself.

[0094] Therefore, by introducing metal connecting pieces on the outer periphery, the flexibility of the electrical interconnection of the inductor and the heat dissipation effect can be further improved.

[0095] There are multiple metal frames 101, and the metal frames 101 located at the top and bottom of the cuboid inductor body have different shapes and arrangements.

[0096] The number and arrangement of the metal frame and metal connecting pieces can be flexibly varied to meet different electrical interconnection requirements, inductance performance requirements, and heat dissipation requirements.

[0097] On the other hand, Figure 8 yes Figure 7 A flowchart illustrating one embodiment of the fabrication method for the corresponding inductor structure.

[0098] refer to Figure 8 As shown, this application also provides a method for manufacturing the above-mentioned inductor structure, including the following steps:

[0099] S21: The copper material is manufactured into an inductor winding of a fixed shape, which includes any of the following: Z-shaped, I-shaped, U-shaped, C-shaped, or spiral.

[0100] S22: Place the inductor winding and the corresponding metal connecting piece terminals into the mold cavity, fill it with magnetic powder, pre-press it to maintain a certain shape, and expose the inductor winding and metal connecting piece ends;

[0101] S23: Apply sintered nano-metallic material using a steel mesh that is compatible with the inductor winding ends and the metal connecting piece ends, or apply material by dispensing at designated locations on the inductor winding ends and the metal connecting piece ends; then attach a thin sheet metal frame to the designated locations on the inductor winding ends and the metal connecting piece ends.

[0102] S24: After pressing and molding, sintering is carried out to make the magnetic powder form a solid whole, and at the same time, the sintered material solidifies to form good bonding and conductivity.

[0103] The fixed shape can also include other shapes, which can be adjusted according to the inductor design requirements.

[0104] For details, please refer to [link / reference]. Figure 9 , Figure 9 yes Figure 8 The corresponding structural decomposition diagram. From Figure 9 As can be seen, the metal frames at the top and bottom of the inductor structure have different shapes, and they can be connected to the metal connecting pieces on the outer periphery of the inductor body to meet various electrical connection requirements.

[0105] In another aspect, this application also provides an inductor structure fabrication apparatus, including a memory and a processor coupled to each other, wherein the processor is used to execute program instructions stored in the memory to implement the above-described inductor structure fabrication method.

[0106] Specifically, please refer to Figure 10 The inductor structure fabrication apparatus 200 of this application may specifically include a processor 210 and a memory 220. The memory 220 is coupled to the processor 210.

[0107] Processor 210 is used for the operation of inductor structure fabrication equipment 200. Processor 210 can also be referred to as CPU (Central Processing Unit). Processor 210 may be an integrated circuit chip with signal processing capabilities. Processor 210 can also be a general-purpose processor, digital signal processor (DSP), application-specific integrated circuit (ASIC), field-programmable gate array (FPGA), or other programmable logic device, discrete gate or transistor logic device, or discrete hardware component. The general-purpose processor can be a microprocessor, or processor 210 can be any conventional processor.

[0108] The memory 220 is used to store computer programs and may be RAM, ROM, or other types of storage devices. Specifically, the memory may include one or more computer-readable storage media, which may be non-transitory. The memory may also include high-speed random access memory and non-volatile memory, such as one or more disk storage devices or flash memory devices. In some embodiments, the non-transitory computer-readable storage media in the memory is used to store at least one line of program code.

[0109] The processor 210 is used to execute computer programs stored in the memory 220 to implement the methods described in the various method embodiments of this application.

[0110] In some embodiments, the inductor structure fabrication apparatus 200 may further include a peripheral device interface 230 and at least one peripheral device. The processor 210, memory 220, and peripheral device interface 230 can be connected via a bus or signal line. Each peripheral device can be connected to the peripheral device interface 230 via a bus, signal line, or circuit board. Specifically, the peripheral device includes at least one of a radio frequency circuit 240, a display screen 250, an audio circuit 260, and a power supply 270.

[0111] Peripheral device interface 230 can be used to connect at least one I / O (Input / output) related peripheral device to processor 210 and memory 220. In some embodiments, processor 210, memory 220 and peripheral device interface 230 are integrated on the same chip or circuit board; in some other embodiments, any one or two of processor 210, memory 220 and peripheral device interface 230 can be implemented on separate chips or circuit boards, which is not limited in this embodiment.

[0112] The radio frequency (RF) circuit 240 is used to receive and transmit RF (Radio Frequency) signals, also known as electromagnetic signals. The RF circuit 240 communicates with communication networks and other communication devices via electromagnetic signals; it is the communication circuit of the inductor structure fabrication device 200. The RF circuit 240 converts electrical signals into electromagnetic signals for transmission, or converts received electromagnetic signals back into electrical signals. Optionally, the RF circuit 240 includes: an antenna system, an RF transceiver, one or more amplifiers, a tuner, an oscillator, a digital signal processor, a codec chipset, a user identity module card, etc. The RF circuit 240 can communicate with other terminals via at least one wireless communication protocol. This wireless communication protocol includes, but is not limited to: the World Wide Web, metropolitan area networks, intranets, various generations of mobile communication networks (2G, 3G, 4G, and 5G), wireless local area networks, and / or WiFi (Wireless Fidelity) networks. In some embodiments, the RF circuit 240 may also include circuitry related to NFC (Near Field Communication), which is not limited in this application.

[0113] Display screen 250 is used to display a UI (User Interface). This UI may include graphics, text, icons, videos, and any combination thereof. When display screen 250 is a touch display screen, it also has the ability to collect touch signals on or above its surface. These touch signals can be input as control signals to processor 210 for processing. In this case, display screen 250 can also be used to provide virtual buttons and / or a virtual keyboard, also known as soft buttons and / or a soft keyboard. In some embodiments, there may be one display screen 250, disposed on the front panel of the inductor structure fabrication device 200; in other embodiments, there may be at least two display screens 250, disposed on different surfaces of the inductor structure fabrication device 200 or in a folded design; in still other embodiments, display screen 250 may be a flexible display screen, disposed on a curved or folded surface of the inductor structure fabrication device 200. Furthermore, display screen 250 may even be configured as a non-rectangular, irregular shape, i.e., a non-rectangular screen. The display screen 250 can be made of materials such as LCD (Liquid Crystal Display) and OLED (Organic Light-Emitting Diode).

[0114] The audio circuit 260 may include a microphone and a speaker. The microphone is used to collect sound waves from the user and the environment, converting them into electrical signals that are input to the processor 210 for processing, or to the radio frequency circuit 240 for voice communication. For stereo sound acquisition or noise reduction purposes, multiple microphones may be used, each positioned at a different location in the inductor structure fabrication device 200. The microphone may also be an array microphone or an omnidirectional microphone. The speaker is used to convert electrical signals from the processor 210 or the radio frequency circuit 240 into sound waves. The speaker may be a conventional film speaker or a piezoelectric ceramic speaker. When the speaker is a piezoelectric ceramic speaker, it can convert electrical signals not only into audible sound waves but also into inaudible sound waves for purposes such as distance measurement. In some embodiments, the audio circuit 260 may also include a headphone jack.

[0115] Power supply 270 is used to power the various components in the inductor structure fabrication equipment 200. Power supply 270 can be AC ​​power, DC power, a disposable battery, or a rechargeable battery. When power supply 270 includes a rechargeable battery, the rechargeable battery can be a wired rechargeable battery or a wireless rechargeable battery. A wired rechargeable battery is a battery that is charged via a wired line, and a wireless rechargeable battery is a battery that is charged via a wireless coil. The rechargeable battery can also be used to support fast charging technology.

[0116] For a detailed description of the functions and execution processes of each functional module or component in the embodiments of the intelligent control platform of this application, please refer to the descriptions in the above-mentioned method embodiments of this application, which will not be repeated here.

[0117] In the embodiments provided in this application, it should be understood that the disclosed intelligent control platform and method can be implemented in other ways. For example, the embodiments of the intelligent control platform described above are merely illustrative. For instance, the division of modules or units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be indirect coupling or communication connection through some interfaces, devices, or units, and may be electrical, mechanical, or other forms.

[0118] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment, depending on actual needs.

[0119] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0120] In another aspect, this application provides a computer-readable storage medium storing a computer program that can be executed by a processor to implement any of the methods described above.

[0121] Please see Figure 11 If the integrated units described above are implemented as software functional units and sold or used as independent products, they can be stored in computer-readable storage medium 300. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions / computer programs to cause an intelligent control platform (which may be a personal computer, server, or network device, etc.) or processor to execute all or part of the steps of the methods of various embodiments of this application. The aforementioned storage medium includes various media such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks, as well as electronic devices such as computers, mobile phones, laptops, tablets, and cameras that have the aforementioned storage media.

[0122] The execution process of program data in a computer-readable storage medium can be described with reference to the above-described method embodiments of this application, and will not be repeated here.

[0123] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

[0124] Those skilled in the art will understand that, in the above-described method of the specific implementation, the order in which each step is written does not imply a strict execution order and does not constitute any limitation on the implementation process. The specific execution order of each step should be determined by its function and possible internal logic.

[0125] In summary, this application has the following beneficial effects:

[0126] The electrical interconnection and heat dissipation capabilities of inductors are greatly improved by using metal frames or selective electroplating, enabling inductors to provide functions other than electromagnetic functions.

[0127] Furthermore, the connection between the inductor and the metal frame is achieved by sintering nanomaterials, which effectively improves production efficiency.

[0128] Furthermore, the inductor structure of this application is simple, which not only improves the flexibility of electrical interconnection and heat dissipation, but also facilitates assembly.

[0129] Furthermore, this application provides various variations of the inductor structure, which can be flexibly designed according to different needs.

[0130] Furthermore, this application provides manufacturing methods for different inductor structures, which allow the manufacturing process to conform to the characteristics of the corresponding inductor structure, saving steps and improving accuracy.

Claims

1. An inductor structure, characterized in that, include: An inductor winding, a magnet, and a metal frame are provided. The magnet encloses the inductor winding and exposes the inductor winding terminals to form a cuboid inductor body. The metal frame is a thin sheet. The metal frame covers the top and / or bottom of the cuboid inductor body and is connected to the inductor winding terminals that are extended and bent to the top and / or bottom of the cuboid inductor body through mounting, so as to directly utilize the area of ​​the inductor itself for electrical interconnection and increase the heat dissipation area. The side of the metal frame connected to the inductor winding terminals is called the connecting side, and the side length of the connecting side is greater than the width of the inductor winding terminals.

2. A method for manufacturing an inductor structure as described in claim 1, characterized in that, Including the following steps: S11: The copper material is manufactured into an inductor winding of a fixed shape, wherein the fixed shape includes any one of the following: Z-shaped, I-shaped, U-shaped, C-shaped, or spiral. S12: Place the inductor winding into the mold cavity, fill it with magnetic powder, pre-press it to maintain a certain shape, and expose the inductor winding terminals. S13: Surface mount thin metal frame; S14: After pressing and molding, sintering is carried out to make the magnetic powder form a solid whole, and at the same time, the sintered material solidifies to form good bonding and conductivity.

3. The manufacturing method according to claim 2, characterized in that, The step of mounting the thin-film metal frame includes: S1311: Apply sintered nano-metallic material using a steel mesh adapted to the inductor winding end, or apply material by dispensing at a designated position on the inductor winding end. S1312: Attach the thin metal frame to the designated position at the end of the inductor winding.

4. The manufacturing method according to claim 2, characterized in that, The step of mounting the thin-film metal frame includes: S1321: Coating of sintered nano-metal materials on a thin metal frame, mounting a pre-formed inductor onto a designated position on the metal frame, then performing a nano-metal sintering and curing process, and then dividing the material. S1322: The split inductor is then surface-mounted onto another metal frame, pressed into shape, sintered and cured to complete the connection on the other side.

5. An inductor structure, characterized in that, include: The inductor comprises an inductor winding, a magnet, a metal connector, and a metal frame. The magnet encloses the inductor winding and the metal connector, exposing the inductor winding terminals and the metal connector terminals to form a cuboid inductor body. The metal connector is located on the outer periphery of the cuboid inductor body. The metal frame is a thin sheet type and covers the top and / or bottom of the cuboid inductor body. It is connected to the inductor winding terminals that extend and bend to the top and / or bottom of the cuboid inductor body, and / or to the metal connector terminals that extend to the top and / or bottom of the cuboid inductor body. The top and / or bottom metal frames can be designed with different shapes and arrangements according to different circuit requirements. The side of the metal frame connected to the inductor winding terminals is called the connecting side, and the side length of the connecting side is greater than the width of the inductor winding terminals.

6. The inductor structure according to claim 5, characterized in that, There are multiple metal frames, and the metal frames located at the top and bottom of the cuboid inductor body have different shapes and arrangements.

7. A method for manufacturing an inductor structure as described in claim 5, characterized in that, Including the following steps: S21: The copper material is manufactured into an inductor winding of a fixed shape, wherein the fixed shape includes any one of the following: Z-shaped, I-shaped, U-shaped, C-shaped, or spiral. S22: Place the inductor winding and the corresponding metal connecting piece terminals into the mold cavity, fill it with magnetic powder, pre-press it to maintain a certain shape, and expose the inductor winding and metal connecting piece ends; S23: Apply sintered nano-metallic material using a steel mesh that is compatible with the inductor winding ends and the metal connecting piece ends, or apply material by dispensing at designated locations on the inductor winding ends and the metal connecting piece ends; then attach a thin sheet metal frame to the designated locations on the inductor winding ends and the metal connecting piece ends. S24: After pressing and molding, sintering is carried out to make the magnetic powder form a solid whole, and at the same time, the sintered material solidifies to form good bonding and conductivity.

8. An inductor structure fabrication device, characterized in that, It includes a memory and a processor coupled to each other, the processor being used to execute program instructions stored in the memory to implement the method for manufacturing an inductor structure according to any one of claims 2-4, or the method for manufacturing an inductor structure according to claim 7.

9. A computer-readable storage medium having program instructions stored thereon, characterized in that, When the program instructions are executed by the processor, they implement the method for manufacturing the inductor structure according to any one of claims 2-4, or the method for manufacturing the inductor structure according to claim 7.

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