Bonding pressure control method and device of chip bonding equipment

Abstract

The invention relates to the technical field of integrated circuits, in particular to a bonding pressure control method and device for chip bonding equipment. According to the bonding pressure control method of the chip bonding equipment, the chip bonding equipment comprises a bonding head, a force control unit and a pressure detection piece, the force control unit is connected with the bonding head, and the bonding pressure control method of the chip bonding equipment comprises the steps that the bonding head is moved to a designated position so that the bonding head and the pressure detection piece can be oppositely arranged; based on the multiple output values, the bonding head is controlled to descend for multiple times, the pressure value detected by the pressure detection piece is received every time the bonding head descends, and the output values are used for representing the force applied to the bonding head by the force control unit; obtaining a plurality of output values and corresponding pressure values, and constructing a force control measurement meter; and the bonding pressure of the chip bonding equipment is controlled based on the force control measurement meter.

Description

Technical Field

[0001] The present application relates to the field of integrated circuit technology, and in particular to a bonding pressure control method and device for a chip bonding device. Background Art

[0002] Bonding equipment is a key equipment used in semiconductor packaging and back-end testing. In bonding equipment, a bonding head is usually used to control the pressure under bonding. In related technologies, the bonding head is connected to a high-speed proportional valve, and a high-speed proportional valve is set to adjust the pressure value.

[0003] During the bonding process, the pressure control accuracy is required to be high to ensure the stability and reliability of the bonding process. However, the pressure cannot be monitored in real time during the bonding process, which leads to low bonding efficiency. Summary of the invention

[0004] Based on this, it is necessary to provide a bonding pressure control method and device for a chip bonding device to address the problem of low bonding efficiency in the prior art.

[0005] In order to achieve the above object, on the one hand, a bonding pressure control method of a chip bonding device is provided, wherein the chip bonding device comprises a bonding head, a force control unit and a pressure detection component, wherein the force control unit is connected to the bonding head, and the bonding pressure control method of the chip bonding device comprises:

[0006] Moving the bonding head to a specified position so that the bonding head and the pressure detection member are arranged opposite to each other;

[0007] Based on multiple output values, control the bonding head to descend multiple times, and receive the pressure value detected by the pressure detection member each time the bonding head descends, wherein the output value is used to represent the force applied by the force control unit to the bonding head;

[0008] Acquire a plurality of the output values ​​and the corresponding pressure values ​​to construct a force control measurement table;

[0009] The bonding pressure of the chip bonding device is controlled based on the force control measurement table.

[0010] In one embodiment, controlling the bonding head to descend multiple times based on the multiple output values, and receiving the pressure value detected by the pressure detection component each time the bonding head descends, comprises:

[0011] Obtaining the output value;

[0012] According to the output value, controlling the bonding head to descend;

[0013] The pressure value detected by the pressure detecting element is received.

[0014] In one embodiment, the force control unit includes a proportional valve, and obtaining the output value includes:

[0015] A plurality of voltage values ​​of the proportional valve are acquired, and the voltage values ​​are determined as the output values.

[0016] In one embodiment, controlling the bonding head to descend according to the output value includes:

[0017] The bonding head is controlled to descend a preset distance.

[0018] In one embodiment, controlling the bonding head to descend a preset distance includes:

[0019] The bonding head is controlled to stay at the preset distance for a preset time period.

[0020] In one embodiment, after controlling the bonding head to descend according to the output value, the method further comprises:

[0021] The bonding head is controlled to return to the designated position.

[0022] In one embodiment, controlling the bonding pressure of the chip bonding device based on the force control measurement table includes:

[0023] Get the target pressure value;

[0024] Calculating a target output value corresponding to the target pressure value based on the force control measurement table;

[0025] Based on the target output value, the bond head is controlled to descend to control the bonding pressure.

[0026] In one embodiment, the calculating the target output value corresponding to the target pressure value based on the force control measurement table includes:

[0027] Based on the force control measurement table, calculating a fitting function of the force control measurement table;

[0028] The target output value is calculated based on the fitting function and the target pressure value.

[0029] In one embodiment, obtaining a fitting function of the force control measurement table based on the force control measurement table includes:

[0030] Determining in the force control measurement table the numerical interval into which the target pressure value falls;

[0031] The fitting function is calculated based on the two endpoint values ​​of the numerical interval.

[0032] On the other hand, a bonding pressure control device of a chip bonding device is also provided, the device comprising:

[0033] A moving module, used for moving the bonding head to a specified position so that the bonding head and the pressure detection component are arranged relative to each other;

[0034] a determination module, used to determine a plurality of output values, wherein the output values ​​are used to represent the force applied by the force control unit to the bonding head;

[0035] A descending module, used for controlling the bonding head to descend multiple times based on a plurality of output values, and receiving a pressure value detected by the pressure detection member each time the bonding head descends, wherein the output value is used for indicating the force applied by the force control unit to the bonding head;

[0036] A construction module, used for acquiring a plurality of the output values ​​and the corresponding pressure values, and constructing a force control measurement table;

[0037] A control module is used to control the bonding pressure of the chip bonding device based on the force control measurement table.

[0038] The bonding pressure control method and device of the chip bonding equipment of the present application have the following beneficial effects: first, by constructing a force control measurement table to obtain the relationship between the output value and the corresponding pressure value, the wafer can be bonded according to the force control measurement table, thereby improving the bonding efficiency of the wafer. Secondly, the force control measurement table of the chip bonding equipment can be obtained regularly to determine the aging of the chip bonding equipment, thereby reducing the probability of abnormal conditions in wafer bonding. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0040] Figure 1 It is a flow chart of a bonding pressure control method of a chip bonding device provided in an embodiment;

[0041] Figure 2 is a schematic diagram of a chip bonding device provided in an embodiment;

[0042] Figure 3 A flowchart of a bonding pressure control method of a chip bonding device provided in another embodiment;

[0043] Figure 4A flowchart of a bonding pressure control method of a chip bonding device provided in yet another embodiment;

[0044] Figure 5 It is a schematic diagram of a bonding pressure control device of a chip bonding device provided in one embodiment.

[0045] In order to better describe and illustrate the embodiments and / or examples of the inventions disclosed herein, reference may be made to one or more drawings. The additional details or examples used to describe the drawings should not be considered as limiting the scope of any of the disclosed inventions, the embodiments and / or examples currently described, and the best modes of these inventions currently understood. DETAILED DESCRIPTION

[0046] In order to facilitate understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are given in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0047] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0048] In each embodiment, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in each embodiment can be understood according to the specific situation.

[0049] It should be understood that when an element or layer is referred to as being "on, adjacent to, or connected to other elements or layers, it may be directly on, adjacent to, or connected to other elements or layers, or there may be intervening elements or layers. In contrast, when an element is referred to as being "directly on, directly adjacent to, or directly connected to other elements or layers, there may be no intervening elements or layers. It should be understood that, although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers, and / or parts, these elements, components, regions, layers, and / or parts should not be limited by these terms. These terms are merely used to distinguish one element, component, region, layer, doping type, or part from another element, component, region, layer, or part. Therefore, without departing from the teachings of the present embodiment, the first element, component, region, layer, or part discussed below may be represented as a second element, component, region, layer, or part.

[0050] Spatial relationship terms such as "under", "below", "below", "under", "above", "above", etc., may be used herein to describe the relationship between an element or feature shown in the figures and other elements or features. It should be understood that in addition to the orientations shown in the figures, spatial relationship terms also include different orientations of the device in use and operation. For example, if the device in the accompanying drawings is turned over, the element or feature described as "under other elements" or "under it" or "under it" will be oriented as "on" other elements or features. Therefore, the exemplary terms "under" and "under" may include both upper and lower orientations. In addition, the device may also include additional orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptors used herein are interpreted accordingly.

[0051] When used herein, the singular forms "a", "an", and "said / the" may also include plural forms, unless the context clearly indicates otherwise. It should also be understood that when the terms "consisting of" and / or "comprising" are used in this specification, the presence of the features, integers, steps, operations, elements and / or parts can be determined, but the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups is not excluded. At the same time, when used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0052] Embodiments of the present application are described herein with reference to cross-sectional views that are schematic diagrams of ideal embodiments (and intermediate structures) of the present application, so that variations in the shapes shown due to, for example, manufacturing techniques and / or tolerances can be expected. Therefore, embodiments of the present application should not be limited to the specific shapes of the regions shown herein, but include shape deviations due to, for example, manufacturing techniques. The regions shown in the figures are schematic in nature, and their shapes do not represent the actual shapes of the regions of the device and do not limit the scope of the embodiments of the present application.

[0053] In one embodiment, see Figure 1 , this embodiment provides a bonding pressure control method for a chip bonding device. The bonding pressure control method for a chip bonding device can be applied to a control device for a chip bonding device. As an example, the chip bonding device can include at least a bonding head, a force control unit and a pressure detection component, and the force control unit is connected to the bonding head and can control the force when the bonding head descends. The pressure detection component can include a pressure sensor, and the pressure detection component can be connected to the control device of the chip bonding device. The bonding pressure control method for a chip bonding device can include the following steps:

[0054] Step S2: Move the bonding head to a designated position so that the bonding head and the pressure detection component are arranged opposite to each other.

[0055] Step S4: Based on the multiple output values, the bonding head is controlled to descend multiple times, and each time the bonding head descends, the pressure value detected by the pressure detection component is received, and the output value is used to represent the force applied by the force control unit to the bonding head.

[0056] Step S6: Acquire multiple output values ​​and corresponding pressure values, and construct a force control measurement table.

[0057] Step S8: Controlling the bonding pressure of the chip bonding device based on the force control measurement table.

[0058] In step S2, the designated position may be a position directly above the pressure detection member and where the bonding head contacts the pressure detection member but does not generate pressure. Figure 2 , the chip bonding equipment may include an axis card, which can perform servo position loop closed-loop control on the X-axis, Y-axis and Z-axis to control the movement of the bond head. At this time, the Z-axis can be controlled to automatically rise to a safe position to prevent mechanical collision caused by the movement of the X-axis and Y-axis. After that, the bond head can be moved to the top of the pressure detection part through the X-axis and Y-axis, and the Z-axis can be controlled to make the bond head drop to a position where it contacts the pressure detection part but does not generate pressure. Of course, this process can be adjusted manually.

[0059] In step S4, as an example, an output value may be obtained first, and the bonding head may be lowered with the output value, and the pressure value detected by the pressure detection component may be read. It can be understood that during a lowering process, the output value corresponds to the pressure value, and the pressure value may represent the force applied by the force control unit to the bonding head (the pressing pressure of the bonding head). The above process may be repeated until the pressure value corresponding to each output value is obtained.

[0060] In step S6, a force control measurement table may be constructed based on each output value and the corresponding pressure value. The force control measurement table may include a form of a table, a curve or a function.

[0061] In step S8, when performing wafer bonding, the target pressure value of the bonding head can be determined, and the target output value corresponding to the target pressure value can be obtained based on the force control measurement table. Afterwards, the target output value can be used to control the bonding head to descend, thereby obtaining the required bonding pressure.

[0062] In this embodiment, firstly, the relationship between the output value and the corresponding pressure value is obtained by constructing a force control measurement table, and the wafer can be bonded according to the force control measurement table, thereby improving the bonding efficiency of the wafer. Secondly, in this embodiment, the force control measurement table of the chip bonding equipment can be obtained regularly to determine the aging of the chip bonding equipment, thereby reducing the probability of abnormal conditions in wafer bonding.

[0063] In one embodiment, see Figure 3 and Figure 4 , step S4 may include:

[0064] Step S42: Obtain output value.

[0065] Step S43: Control the bonding head to descend according to the output value.

[0066] Step S44: receiving the pressure value detected by the pressure detection component.

[0067] In step S42, the output value may be a plurality of preset values. At this time, the current output value may be obtained. As an example, the force control unit may include a proportional valve, and the proportional valve may be electrically connected to the bonding head. Step S42 may include:

[0068] S420: Acquire multiple voltage values ​​of the proportional valve, and determine the voltage value as the output value.

[0069] As an example, the multiple output values ​​may be the corresponding analog voltage values ​​of the proportional valve. As an example, the chip bonding device may include an analog IO card, and the analog IO card may have an ADC acquisition channel and a DAC output channel. The output signal of the pressure detection component can be connected to the ADC input channel of the analog IO card, and the multiple voltage values ​​of the proportional valve can be input to the DAC output channel of the analog IO card. When the corresponding analog voltage value is determined, the proportional valve can adjust the air pressure value of the air outlet according to the size of the analog voltage value, thereby achieving the effect of adjusting the pressing pressure of the bonding head.

[0070] In step S43, based on the output value, the bonding head may be controlled to decrease the pressing pressure corresponding to the current output value.

[0071] In step S44, the detected pressure value may be the pressure value corresponding to the current output value. Afterwards, the current output value and the pressure value may be recorded in the force control measurement table. It is understood that after the current output value detection is completed, the next output value may be obtained in step S42, and the above steps may be repeated to perform a detection on each output value. Of course, each output value may also be detected multiple times. For example, each output value may be detected three times, and three corresponding pressure values ​​may be obtained, and the average value of the three pressure values ​​may be calculated, and the average value may be used as the pressure value corresponding to the output value.

[0072] Specifically, in a possible example, step S43 may include:

[0073] Step S430: Control the bonding head to descend a preset distance.

[0074] As an example, the preset distance may be 100 μm, 150 μm or 200 μm, etc. This embodiment does not limit the specific value of the preset distance, and the value may be adjusted according to the actual process. In each descent of the bonding head, the bonding head may be controlled to descend by the preset distance, so as to be closer to the actual bonding situation.

[0075] In another possible example, step S43 may include:

[0076] Step S45: controlling the bonding head to stay at a preset distance for a preset time period.

[0077] After the bond head is lowered to the preset distance, the bond head can be controlled to stay at the preset distance for a preset time. As an example, the preset time can be 2 seconds, 5 seconds or 10 seconds. The bond head is controlled to stay at the preset distance for a preset time so that the pressure value detected by the pressure detection component is stable, thereby obtaining a more accurate force control measurement table.

[0078] In another possible example, step S44 may include:

[0079] Step S46: Control the bonding head to return to the specified position.

[0080] After the current output value is detected, the bonding head can be controlled to return to the specified position and obtain the next output value, and the above steps are repeated until each output value is detected.

[0081] In this embodiment, the bonding head is controlled to descend multiple times, so as to quickly obtain pressure values ​​corresponding to multiple output values, and then quickly obtain a force control measurement table.

[0082] In one embodiment, step S8 includes:

[0083] Step S80: Obtain the target pressure value.

[0084] Step S82: Calculate the target output value corresponding to the target pressure value based on the force control measurement table.

[0085] Step S83: Based on the target output value, control the bonding head to descend to control the bonding pressure.

[0086] In step S80 to step S82, when the target pressure value falls within the range of the force control measurement table, a target output value corresponding to the target pressure value may be calculated according to the force control measurement table.

[0087] In step S83, the target output value is used to control the bond head to descend, so that the pressing pressure of the bond head to descend can be more accurately controlled. Of course, in this process, the chip bonding device may not be provided with a pressure detection component.

[0088] Specifically, in a possible example, step S82 may include:

[0089] Step S820: Based on the force control measurement table, a fitting function of the force control measurement table is calculated.

[0090] Step S822: Calculate the target output value based on the fitting function and the target pressure value.

[0091] In step S820 to step S822, as an example, the fitting function may be a straight line function. Of course, the fitting function may also be a power function, a curve function, etc. Afterwards, the target pressure value may be brought into the fitting function to calculate the target output value.

[0092] Further, in order to obtain a more accurate target output value, step S820 may include:

[0093] Step S8200: Determine the value interval that the target pressure value falls into in the force control measurement table.

[0094] Step S8202: Calculate the fitting function based on the two endpoint values ​​of the numerical interval.

[0095] In step S8200 to step S8202, as an example, the target pressure value can be compared with each pressure value in the force control measurement table to determine the numerical interval in which the target pressure value falls. Afterwards, a fitting function (e.g., a straight line function) can be calculated based on the two end point values ​​of the numerical interval. The target pressure value is brought into the fitting function to calculate the target output value. As an example, the target output value can be the target output value of the proportional valve.

[0096] For example, the target pressure value is force[a], and force[a] is between force[b] and force[c] in the force control measurement table. Then, the linear equation f(x)=kx+b is fitted according to (dacoutput[b], force[b]), (dacoutput[c], force[c]). Then, let f(x)=force(a), and the target output value can be calculated. Among them, dacoutput[b] and dacoutput[c] can be the outputs of the proportional valves corresponding to force[b] and force[c] respectively.

[0097] In this example, a fitting function is calculated by calculating the force control measurement table to obtain a more accurate target output value, which is beneficial to wafer bonding.

[0098] It should be understood that although Figure 1 , Figure 3 and Figure 4 The steps in the flowchart are shown in sequence as indicated by the arrows, but these steps are not necessarily executed in the order indicated by the arrows. Unless otherwise specified in this document, there is no strict order restriction for the execution of these steps, and these steps can be executed in other orders. Moreover, Figure 1 , Figure 3 and Figure 4 At least part of the steps may include multiple steps or multiple stages. These steps or stages are not necessarily performed at the same time, but can be performed at different times. The execution order of these steps or stages is not necessarily sequential, but can be performed in turn or alternately with other steps or at least part of the steps or stages in other steps.

[0099] Based on the same inventive concept, the embodiment of the present application also provides a bonding pressure control device for a chip bonding device for implementing the bonding pressure control method for the chip bonding device involved above. The implementation scheme for solving the problem provided by the device is similar to the implementation scheme recorded in the above method, so the specific limitations in the embodiments of the bonding pressure control device for one or more chip bonding devices provided below can refer to the limitations of the bonding pressure control method for the chip bonding device above, and will not be repeated here.

[0100] In one embodiment, Figure 5 As shown, a bonding pressure control device of a chip bonding device is provided, comprising: a moving module, a determining module, a descending module, a constructing module and a controlling module.

[0101] The moving module is used to move the bonding head to a specified position so that the bonding head and the pressure detection component are arranged relative to each other.

[0102] The determination module is used to determine a plurality of output values, and the output values ​​are used to represent the force applied by the force control unit to the bonding head.

[0103] The descending module is used to control the bonding head to descend multiple times based on multiple output values, and receives the pressure value detected by the pressure detection component each time the bonding head descends. The output value is used to represent the force applied by the force control unit to the bonding head.

[0104] The construction module is used to obtain multiple output values ​​and corresponding pressure values, and construct a force control measurement table.

[0105] The control module is used to control the bonding pressure of the chip bonding device based on the force control measurement table.

[0106] In one embodiment, the descending module is further used to obtain an output value; control the bonding head to descend according to the output value; and receive the pressure value detected by the pressure detection component.

[0107] In one embodiment, the force control unit includes a proportional valve, and the descending module is further used to obtain multiple voltage values ​​of the proportional valve and determine the voltage value as the output value.

[0108] In one embodiment, the descending module is further used to control the bonding head to descend a preset distance.

[0109] In one embodiment, the descending module is further used to control the bonding head to stay at a preset distance for a preset time period.

[0110] In one embodiment, the descending module is also used to control the bonding head to return to a specified position.

[0111] In one embodiment, the control module is further used to obtain a target pressure value; and to calculate a target output value corresponding to the target pressure value based on a force control measurement table. The calibration device of the chip bonding device also includes a control module, which is used to control the bonding head to descend based on the target output value to control the bonding pressure.

[0112] In one embodiment, the control module is further configured to calculate a fitting function of the force control measurement table based on the force control measurement table; and calculate a target output value based on the fitting function and the target pressure value.

[0113] In one embodiment, the control module is further used to determine the numerical interval into which the target pressure value falls in the force control measurement table; and calculate the fitting function based on the two endpoint values ​​of the numerical interval.

[0114] Each module in the bonding pressure control device of the above-mentioned chip bonding equipment can be fully or partially implemented by software, hardware and their combination. The above-mentioned modules can be embedded in or independent of the processor in the computer device in the form of hardware, or can be stored in the memory of the computer device in the form of software, so that the processor can call and execute the corresponding operations of each of the above modules.

[0115] In an exemplary embodiment, a computer device is provided, which may be a server. The computer device includes a processor, a memory, an input / output interface (Input / Output, referred to as I / O) and a communication interface. The processor, the memory and the input / output interface are connected through a system bus, and the communication interface is connected to the system bus through the input / output interface. The processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program and a database. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The database of the computer device is used to store the bonding pressure control data of the chip bonding device. The input / output interface of the computer device is used to exchange information between the processor and the external device. The communication interface of the computer device is used to communicate with an external terminal through a network connection. When the computer program is executed by the processor, a bonding pressure control method of a chip bonding device is implemented.

[0116] In one embodiment, a computer device is further provided, including a memory and a processor, wherein a computer program is stored in the memory, and the processor implements the steps in the above method embodiments when executing the computer program.

[0117] In one embodiment, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by a processor, the steps in the above-mentioned method embodiments are implemented.

[0118] In one embodiment, a computer program product is provided, including a computer program, which implements the steps in the above method embodiments when executed by a processor.

[0119] In the description of the present application, the descriptions with reference to the terms "some embodiments", "other embodiments", "ideal embodiments", etc., mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In the present application, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example. In addition, these specific features, structures or characteristics can be combined in one or more embodiments in any suitable manner. It should be understood that "this embodiment" or "one embodiment" mentioned throughout the specification means that the specific features, structures or characteristics related to the embodiment are included in at least one embodiment of the present application. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification may not necessarily refer to the same embodiment.

[0120] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features of the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of the present application.

[0121] The embodiments described above only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all fall within the scope of protection of the present application. Therefore, the scope of protection of the patent of the present application shall be subject to the attached claims. The above description is only a preferred implementation method of the present application, and does not limit the scope of the patent of the present application. All equivalent structural transformations made by using the contents of the specification and drawings of the present application under the inventive concept of the present application, or direct / indirect application in other related technical fields are included in the scope of protection of the patent of the present application.

Claims

1. A bonding pressure control method for a chip bonding device, characterized in that: The chip bonding device comprises a bonding head, a force control unit and a pressure detection component, wherein the force control unit is connected to the bonding head, and the bonding pressure control method of the chip bonding device comprises: Moving the bonding head to a specified position so that the bonding head and the pressure detection member are arranged opposite to each other; Based on multiple output values, control the bonding head to descend multiple times, and receive the pressure value detected by the pressure detection member each time the bonding head descends, wherein the output value is used to represent the force applied by the force control unit to the bonding head; Acquire a plurality of the output values ​​and the corresponding pressure values ​​to construct a force control measurement table; The bonding pressure of the chip bonding device is controlled based on the force control measurement table.

2. The bonding pressure control method of the chip bonding equipment according to claim 1, characterized in that: The step of controlling the bonding head to descend multiple times based on the plurality of output values, and receiving the pressure value detected by the pressure detection member each time the bonding head descends, comprises: Obtaining the output value; According to the output value, controlling the bonding head to descend; The pressure value detected by the pressure detecting element is received.

3. The bonding pressure control method of the chip bonding equipment according to claim 2, characterized in that: The force control unit includes a proportional valve, and obtaining the output value includes: A plurality of voltage values ​​of the proportional valve are acquired, and the voltage values ​​are determined as the output values.

4. The bonding pressure control method of the chip bonding equipment according to claim 3, characterized in that: The step of controlling the bonding head to descend according to the output value comprises: The bonding head is controlled to descend a preset distance.

5. The bonding pressure control method of the chip bonding equipment according to claim 4, characterized in that: After controlling the bonding head to descend according to the output value, the method further comprises: The bonding head is controlled to stay at the preset distance for a preset time period.

6. The bonding pressure control method of the chip bonding equipment according to claim 3, characterized in that: After receiving the pressure value detected by the pressure detection component, the method includes: The bonding head is controlled to return to the designated position.

7. The bonding pressure control method of the chip bonding equipment according to claim 1, characterized in that: The step of controlling the bonding pressure of the chip bonding device based on the force control measurement table includes: Get the target pressure value; Calculating a target output value corresponding to the target pressure value based on the force control measurement table; Based on the target output value, the bond head is controlled to descend to control the bonding pressure.

8. The bonding pressure control method of the chip bonding equipment according to claim 7, characterized in that: The calculating the target output value corresponding to the target pressure value based on the force control measurement table includes: Based on the force control measurement table, calculating a fitting function of the force control measurement table; The target output value is calculated based on the fitting function and the target pressure value.

9. The bonding pressure control method of the chip bonding equipment according to claim 8, characterized in that: The step of obtaining a fitting function of the force control measurement table based on the force control measurement table includes: Determining in the force control measurement table the numerical interval into which the target pressure value falls; The fitting function is calculated based on the two endpoint values ​​of the numerical interval.

10. A bonding pressure control device for a chip bonding device, characterized in that: The device comprises: A moving module, used for moving the bonding head to a specified position so that the bonding head and the pressure detection component are arranged relative to each other; a determination module, used to determine a plurality of output values, wherein the output values ​​are used to represent the force applied by the force control unit to the bonding head; A descending module, used for controlling the bonding head to descend multiple times based on a plurality of output values, and receiving a pressure value detected by the pressure detection member each time the bonding head descends, wherein the output value is used for indicating the force applied by the force control unit to the bonding head; A construction module, used for acquiring a plurality of the output values ​​and the corresponding pressure values, and constructing a force control measurement table; A control module is used to control the bonding pressure of the chip bonding device based on the force control measurement table.

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