Semiconductor wafer cleaning device and method

Abstract

The present invention relates to the field of semiconductor wafer cleaning technology, specifically a semiconductor wafer cleaning device and method thereof, comprising a housing, a clamping mechanism, a filtering mechanism, and a drying mechanism, wherein a mounting chamber is provided at one end of the housing, a drying chamber is provided at the other end of the housing, and a cleaning chamber is provided at the top of the housing. Cleaning net frames are evenly arranged inside the mounting chamber and the cleaning chamber, and three groups of wafer bodies are arranged inside the cleaning net frames. The filtering mechanism is used to circulate and filter the cleaning liquid, and the drying mechanism is used to dry the wafer bodies. This device not only facilitates users to fix the wafer bodies, but also can perform cleaning and drying operations, thereby improving the ability to automatically replace and filter the cleaning liquid after cleaning. At the same time, the cleaning liquid of this device is in automatic circulation filtration, thereby reducing losses, and is also convenient for users to replace the nano filter, thereby improving user work efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor wafer cleaning, in particular to a semiconductor wafer cleaning device and method thereof. Background Art

[0002] Cleaning semiconductor wafers is a crucial step in the semiconductor manufacturing process. During the wafer growth, photolithography, etching and other processes, they will inevitably be contaminated with various pollutants, such as particles, organic matter, and metal ions. If these pollutants are not removed, they will have a serious negative impact on the performance, reliability and yield of semiconductor devices. For example, particulate contaminants may cause circuit shorts or opens, metal ions may change the electrical properties of semiconductors, and organic matter may affect subsequent photoresist coating and photolithography accuracy.

[0003] At present, some existing semiconductor wafer cleaning machines cannot fix the wafer in the net during cleaning, which causes it to shake during cleaning, and may cause the wafer to collide and scratch with the inner wall of the net, thereby causing damage to the wafer. Summary of the Invention

[0004] The object of the present invention is to provide a semiconductor wafer cleaning device and method thereof, so as to solve the problem raised in the above background technology that some of the currently existing semiconductor wafer cleaning machines cannot fix the wafer in the net during cleaning, which causes it to shake during cleaning, and may cause the wafer to collide and scratch with the inner wall of the net, thereby causing damage to the wafer. Through this solution, the wafer body can be fixed, thereby avoiding the user from shaking the wafer body when moving and cleaning, thereby reducing the probability of damage. It is not only convenient for the user to fix the wafer body, but also can perform cleaning and drying work, thereby improving the ability to automatically replace and filter the cleaning liquid after cleaning. At the same time, the cleaning liquid of this device is in automatic circulation filtration, which can reduce loss and facilitate the user to replace the nano filter, thereby improving the user's work efficiency.

[0005] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: a semiconductor wafer cleaning device and method thereof, the device comprising a housing, a clamping mechanism, a filtering mechanism, and a drying mechanism, wherein a mounting chamber is provided at one end of the housing, a drying chamber is provided at the other end of the housing, a cleaning chamber is provided at the top of the housing, and the cleaning chamber is located between the mounting chamber and the drying chamber, three sets of sealed transparent covers are connected to the top of the housing via a rotating shaft, a placement chamber is provided at the bottom end of the housing, a generator is provided inside the placement chamber, three sets of ultrasonic transmitters are evenly provided at the bottom end of the cleaning chamber, and the bottom ends of the ultrasonic transmitters are located inside the placement chamber, two sets of first buckle grooves are symmetrically provided inside the mounting chamber, the cleaning chamber, and the drying chamber, cleaning net frames are evenly provided inside the mounting chamber and the cleaning chamber, and both ends of the cleaning net frames are respectively slidably connected to the first buckle grooves, three sets of wafer bodies are provided inside the cleaning net frames, and the wafer bodies are all fixed by the clamping mechanism, the filtering mechanism is used to circulate and filter the cleaning liquid, and the drying mechanism is used to dry the wafer bodies.

[0006] Preferably, the ultrasonic transmitter is electrically connected to the generator, and the generator is electrically connected to an external power supply via an external switch, so that the user can conveniently control the operation of the device.

[0007] Preferably, the clamping mechanism includes a base, an adjusting groove, a fixed arc plate, a limiting arc ring, a chip body, a sliding rod, a pull rod, a transmission groove, a pull plate, a worm gear, a worm and an adjusting rod. The bottom end of the cleaning screen frame is evenly provided with three groups of bases, the top of the base is provided with an adjusting groove, the middle of the base is provided with a transmission groove, both ends of the base are slidably connected with a sliding rod, and one end of the sliding rod is respectively located inside the adjusting groove, the other end of the sliding rod is fixedly connected with a fixed arc plate, and the fixed arc plates are symmetrically distributed, the sides of the fixed arc plates close to each other are respectively fitted with the outer side of the chip body, the middle of the fixed arc plate is fixedly connected with a limiting arc ring, and the limiting arc ring One side is fitted with the edge of the chip body, one end of the sliding rod is connected to the pull rod through a rotating shaft, the middle part of the adjusting groove is connected to the pull plate through a bearing, and one end of the pull plate extends to the inside of the transmission groove, the middle part of the transmission groove is connected to a worm gear through a bearing, and one end of the worm gear is fixedly connected to one end of the pull plate, the inside of the transmission groove is provided with a worm, and the worm is respectively engaged with the worm gear, an adjusting rod is provided between the bases, and both ends of the adjusting rod are connected to the base through bearings, both ends of the adjusting rod are located inside the transmission groove and fixedly connected to both ends of the worm, which is convenient for users to fix the chip body and avoid damage to the chip body due to shaking.

[0008] Preferably, the outer sides of the fixed arc plates are all in the shape of arcs that match the chip body, and the limiting arc rings are all in the shape of arcs that match the chip body, which facilitates fitting with the chip body and improves the fixing effect.

[0009] Preferably, the filter mechanism includes a filter storage tank, a first pipe, an electromagnetic valve, a nano filter, a sealing plate, a second pipe, a water pump, a second buckle groove, a first rotating groove, a second rotating groove, a rotating plate, a turning handle, a torsion spring and a plug plate, the bottom end of the shell is provided with a filter storage tank, the bottom end of the cleaning bin is connected to three groups of first pipes, and the bottom ends of the first pipes are all connected to the top of the filter storage tank, the middle part of the first pipes is provided with a electromagnetic valve, the middle part of the solenoid valve is provided with a nano filter, one end of the filter storage tank is slidably connected to the sealing plate, and one end of the sealing plate is connected to the nano filter by a snap buckle, the bottom end of the filter storage tank is connected to the second pipe, and the top end of the second pipe is connected to the cleaning bin, the middle part of the second pipe is provided with a water pump, one side of the filter storage tank is symmetrically fixedly connected to the second buckle groove, both ends of the sealing plate are A first rotating groove is provided, and a second rotating groove is provided on the inner wall of the first rotating groove, and a rotating plate is rotatably connected to the inside of the second rotating groove, and a rotating hand is rotatably connected to the inside of the first rotating groove, and one end of the rotating hand is fixedly connected to the rotating plate. A torsion spring is provided between the first rotating groove and the rotating hand, and both ends of the torsion spring are fixedly connected to the first rotating groove and the rotating hand respectively. The edges of the rotating plate are symmetrically fixedly connected with the plug plates, and the plug plates are slidably connected to the sealing plates respectively, and one end of the plug plates is respectively located inside the second buckle groove, and one side of the plug plates is inclined, and the inner wall of one side of the second buckle groove is a shape corresponding to the inclined surface of the plug plates, and the inclined surfaces of the plug plates are respectively fitted with the inner wall of one side of the second buckle groove, which can automatically circulate and filter the cleaning liquid, reduce its consumption, and also facilitate users to replace the nano filter.

[0010] Preferably, the rotating plate, the rotating handle and the plug plate are symmetrically distributed on the left and right, the two groups of the plug plates are evenly distributed on the upper and lower sides of the rotating plate, and the inclined directions of the two groups of the plug plates are symmetrically distributed, thereby improving the fixing effect of the sealing plate. The control ends of the solenoid valve and the water pump are electrically connected to the external power supply through external switches, which makes it convenient for users to control the operation of the device.

[0011] Preferably, the drying mechanism includes a nitrogen tank, a heater, a third pipe, a nitrogen nozzle and a fourth pipe. A nitrogen tank is provided at one end of the shell, and a heater is provided on one side of the nitrogen tank. The input end of the heater is connected to the third pipe, and one end of the third pipe is connected to the nitrogen tank. Nitrogen nozzles are evenly provided on the inner wall of the bottom end of the drying chamber and the inner wall of the top end of the sealed transparent cover, and the nitrogen nozzles are respectively corresponding to the positions of the chip bodies inside the cleaning frame. The output end of the heater is connected to the fourth pipe, and one end of the nitrogen nozzles is connected to the fourth pipe, so that the user can dry the chip bodies conveniently.

[0012] Preferably, the control end of the heater is electrically connected to an external power source via an external switch, so that the user can conveniently control the operation of the device.

[0013] How the device operates:

[0014] Step 1: Fixing. The user first places the cleaning screen frame into the installation chamber so that the two ends of the cleaning screen frame are inside the first buckle groove. Then the user rotates the adjusting rod, which drives the worm, worm gear and pull plate to rotate. The filter storage tank is moved to the side close to each other through the pull plate, pull rod and slide rod, so that the position of the fixed arc plate and the limiting arc ring can be adjusted. Then, the wafer body to be cleaned is placed between the two sets of fixed arc plates so that both sides of the wafer body are at the top of the limiting arc ring. Then, the user rotates the adjusting rod to continue tightening the fixed arc plate. At this time, the wafer body is fixed by the fixed arc plate and the limiting arc ring.

[0015] Step 2: Cleaning. The user places the cleaning screen frame and the wafer body into the cleaning chamber so that the cleaning liquid inside the cleaning chamber covers the wafer body. The user then closes the sealed transparent cover on one side of the cleaning chamber and starts the generator and ultrasonic transmitter. The generator causes the ultrasonic transmitter to generate ultrasonic waves, which in turn generates countless tiny bubbles in the cleaning liquid. These bubbles will quickly collapse after growing to a certain size, generating a strong impact force, thereby knocking down the contaminants on the surface of the wafer body. At the same time, the user can continue to place the cleaning screen frame and fix the wafer body in the installation chamber. After fixing the wafer body, the user closes the sealed transparent cover on one side of the installation chamber.

[0016] Step 3: Filtration. When the wafer body is cleaned, the solenoid valve is activated, and the cleaning liquid in the cleaning chamber enters the top of the filter storage tank through the first pipe. The nano filter in the middle of the filter storage tank can filter out impurities in the cleaning liquid. When the cleaning liquid is discharged, the clean cleaning liquid at the bottom of the filter storage tank can be input into the interior of the cleaning chamber through the water pump and the second pipe, so that the cleaning liquid can be recycled.

[0017] Step 4: Drying. Place the cleaned wafer body into the drying chamber. Then, the user closes the sealed transparent cover equipped with a nitrogen nozzle. The nitrogen inside the nitrogen tank enters the heater through the third pipe and is heated by the heater. The high-temperature nitrogen is then discharged through the fourth pipe and the nitrogen nozzle. Since the position of the nitrogen nozzle corresponds to the position of the wafer body in the cleaning frame, the high-temperature nitrogen can take away the moisture on the surface of the wafer body, thereby drying the wafer body. At the same time, the user can place the cleaning frame and wafer body inside the installation chamber into the cleaning chamber for cleaning. The user can continue to place the cleaning frame and fix the wafer body inside the installation chamber.

[0018] Step 5: Replacement. When the user needs to replace the nano filter, the user drives the rotating plate and the plug-in plate to rotate by turning the hand. At the same time, the torsion spring is compressed. When the plug-in plates are all retracted into the sealing plate, the user can take out the sealing plate and the nano filter, and then separate the nano filter and the sealing plate. After replacing the new nano filter, put it into the filter storage tank. At this time, the plug-in plate, the rotating plate and the turning hand can rotate the plug-in plate in the opposite direction under the action of the torsion spring's own rebound force. The inclined surface of the plug-in plate continuously conflicts with the inclined surface inside the second buckle groove, so that the sealing plate can be continuously close to the filter storage tank.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] When the user uses this device for cleaning, the user first places the cleaning screen frame into the installation bin so that the two ends of the cleaning screen frame are inside the first buckle groove, and the cleaning screen frame is limited by the two sets of first buckle grooves. Then the user rotates the adjusting rod to rotate the pull plate through the worm gear and worm, and the position of the fixed arc plate and the limiting arc ring can be adjusted through the pull plate and the slide rod. After the user adjusts it to the appropriate position, the wafer body to be cleaned is placed between the two sets of fixed arc plates so that both sides of the wafer body are at the top of the limiting arc ring. Then the user rotates the adjusting rod to fix the wafer body through the fixed arc plate and the limiting arc ring, thereby avoiding shaking of the wafer body when the user is transferring or cleaning, and avoiding damage to the wafer body due to collision, thereby improving the wafer body. In order to improve the utilization rate, after the user has fixed the wafer body, the cleaning net frame and the wafer body are placed inside the cleaning chamber so that the cleaning liquid inside the cleaning chamber covers the wafer body. Then the user closes the sealed transparent cover on one side of the cleaning chamber, and the user starts the generator and the ultrasonic transmitter. The generator enables the ultrasonic transmitter to generate ultrasonic waves. At this time, countless tiny bubbles will be generated in the cleaning liquid. After these bubbles grow to a certain extent, they will quickly collapse and generate a strong impact force, thereby impacting the pollutants on the surface of the wafer body. At the same time, the user can continue to place the cleaning net frame inside the installation chamber and fix the wafer body, thereby saving cleaning time. After the user fixes the wafer body, the sealed transparent cover on one side of the installation chamber is closed to prevent external dust from falling in. On the wafer body, when the wafer body is cleaned, the solenoid valve works, and the cleaning liquid inside the cleaning chamber enters the top of the filter storage tank through the first pipe, and the impurities in the cleaning liquid can be filtered through the nano filter. When the cleaning liquid is discharged, the clean cleaning liquid at the bottom of the filter storage tank can be input into the interior of the cleaning chamber through the water pump and the second pipe, so that the cleaning liquid can be recycled, thereby reducing pollution and reducing the consumption of cleaning liquid. The user then puts the cleaned wafer body into the interior of the drying chamber, and closes the sealed transparent cover with the nitrogen nozzle. The nitrogen inside the nitrogen tank enters the interior of the heater through the third pipe, and is heated by the heater. Then the high-temperature nitrogen is discharged through the fourth pipe and the nitrogen nozzle. The position of the head corresponds to the position of the wafer body in the cleaning frame. At this time, the high-temperature nitrogen can take away the moisture on the surface of the wafer body, thereby drying the wafer body. At the same time, the user can put the cleaning frame and the wafer body inside the installation chamber into the cleaning chamber for cleaning. The user can continue to place the cleaning frame and fix the wafer body inside the installation chamber, thereby repeating the work continuously, thereby improving the user's work efficiency. When the user needs to replace the nano filter, the user first turns the handle, and the handle drives the rotating plate and the plug-in plate to rotate. At the same time, the torsion spring is compressed. When the plug-in plates are all retracted inside the sealing plate, the user can take out the sealing plate and the nano filter. Then the user separates the nano filter and the sealing plate. After replacing the new nano filter,Place it inside the filter storage tank, and then the user resets the plug-in plate. At this time, the sealing plate and the filter storage tank are in a fixed state, which makes it convenient for the user to replace the nano filter, further ensuring the nano filter's filtering effect on the cleaning liquid. This device can fix the wafer body, thereby preventing the wafer body from shaking when the user moves and cleans it, thereby reducing the probability of damage. This device not only makes it convenient for the user to fix the wafer body, but also allows for cleaning and drying, thereby improving the ability to automatically replace and filter the cleaning liquid after cleaning. At the same time, the cleaning liquid of this device is in automatic circulation filtration, thereby reducing loss. This device also makes it convenient for the user to replace the nano filter, thereby improving the user's work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a three-dimensional schematic diagram of the present invention;

[0022] Figure 2 It is a cross-sectional perspective schematic diagram of the present invention;

[0023] Figure 3 It is a three-dimensional schematic diagram of the fixed arc plate and the wafer body in the present invention;

[0024] Figure 4 It is a first cross-sectional perspective schematic diagram of the clamping mechanism of the present invention;

[0025] Figure 5 is a second cross-sectional perspective schematic diagram of the clamping mechanism of the present invention;

[0026] Figure 6 is a cross-sectional perspective schematic diagram of the housing and the nano filter in the present invention;

[0027] Figure 7 It is a cross-sectional perspective schematic diagram of the drying mechanism in the present invention;

[0028] Figure 8 It is a cross-sectional perspective diagram of the second buckle groove and the second rotation groove in the present invention;

[0029] Figure 9 It is a cross-sectional perspective diagram of the second buckle slot and the inserting plate in the present invention.

[0030] In the figure: 1. housing; 2. mounting chamber; 3. cleaning chamber; 4. drying chamber; 5. sealing transparent cover; 6. storage chamber; 7. generator; 8. ultrasonic transmitter; 9. cleaning screen frame; 10. first buckle slot; 11. base; 12. adjustment slot; 13. fixed arc plate; 14. limiting arc ring; 15. wafer body; 16. slide bar; 17. pull rod; 18. transmission slot; 19. pull plate; 20. worm gear; 21. worm; 22 , adjusting rod; 23, filter storage tank; 24, first pipeline; 25, solenoid valve; 26, nano filter; 27, sealing plate; 28, second pipeline; 29, water pump; 30, second buckle slot; 31, first rotating slot; 32, second rotating slot; 33, rotating plate; 34, turning handle; 35, torsion spring; 36, plug-in plate; 37, nitrogen tank; 38, heater; 39, third pipeline; 40, nitrogen nozzle; 41, fourth pipeline. DETAILED DESCRIPTION

[0031] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0032] See also Figures 1-9 , an embodiment provided by the present invention:

[0033] A semiconductor wafer cleaning device and method thereof, the device comprises a shell 1, a clamping mechanism, a filtering mechanism and a drying mechanism, wherein a mounting chamber 2 is provided at one end of the shell 1, a drying chamber 4 is provided at the other end of the shell 1, a cleaning chamber 3 is provided at the top of the shell 1, and the cleaning chamber 3 is located between the mounting chamber 2 and the drying chamber 4, three sets of sealed transparent covers 5 are connected to the top of the shell 1 through a rotating shaft, a placement chamber 6 is provided at the bottom end of the shell 1, a generator 7 is provided inside the placement chamber 6, three sets of ultrasonic transmitters 8 are evenly provided at the bottom end of the cleaning chamber 3, and the bottom end of the ultrasonic transmitter 8 is located inside the placement chamber 6, two sets of first buckle grooves 10 are symmetrically provided inside the mounting chamber 2, the cleaning chamber 3 and the drying chamber 4, a cleaning net frame 9 is evenly provided inside the mounting chamber 2 and the cleaning chamber 3, and both ends of the cleaning net frame 9 are respectively slidably connected to the first buckle groove 10, three sets of wafer bodies 15 are provided inside the cleaning net frame 9, and the wafer bodies 15 are fixed by the clamping mechanism, the filtering mechanism is used to circulate and filter the cleaning liquid, and the drying mechanism is used to dry the wafer bodies 15;

[0034] See also Figure 3-Figure 5In this embodiment, the clamping mechanism includes a base 11, an adjusting groove 12, a fixed arc plate 13, a limiting arc ring 14, a chip body 15, a slide rod 16, a pull rod 17, a transmission groove 18, a pull plate 19, a worm gear 20, a worm 21 and an adjusting rod 22. Three groups of bases 11 are evenly arranged at the bottom end of the cleaning net frame 9. The top of the base 11 is provided with an adjusting groove 12, and the middle of the base 11 is provided with a transmission groove 18. Both ends of the base 11 are slidably connected to the slide rod 16, and one end of the slide rod 16 is respectively located inside the adjusting groove 12, and the other end of the slide rod 16 is fixedly connected to the fixed arc plate 13, and the fixed arc plates 13 are symmetrically distributed, and the fixed arc plates 13 are close to each other. One side is respectively fitted with the outer side of the chip body 15, the middle part of the fixed arc plate 13 is fixedly connected to the limiting arc ring 14, and one side of the limiting arc ring 14 is fitted with the edge of the chip body 15, one end of the slide rod 16 is connected to the pull rod 17 through the rotating shaft, the middle part of the adjustment groove 12 is connected to the pull plate 19 through the bearing, and one end of the pull plate 19 extends to the inside of the transmission groove 18, the middle part of the transmission groove 18 is connected to the worm gear 20 through the bearing, and one end of the worm gear 20 is respectively fixedly connected to one end of the pull plate 19, the inside of the transmission groove 18 is provided with a worm 21, and the worm 21 is respectively engaged with the worm gear 20, and an adjusting rod 22 is provided between the bases 11. Both ends of the adjusting rod 22 are connected to the base 11 through bearings, and both ends of the adjusting rod 22 are located inside the transmission groove 18 and are fixedly connected to the two ends of the worm 21. The user rotates the adjusting rod 22, and the adjusting rod 22 drives the worm 21 to rotate. The rotating worm 21 drives the worm wheel 20 and the pull plate 19 to rotate, and the pull plate 19 pulls one end of the pull rod 17 to perform a circular motion. At this time, one end of the pull rod 17 pulls the movement of the sliding rod 16 to move toward the side close to the pull plate 19. At this time, the sliding rods 16 approaching each other can pull the filter storage box 23 to move toward the side close to each other, so that the fixed arc plate 13 can be tightened, and then the fixed arc plate 13 can be adjusted by rotating the adjusting rod 22. After the user adjusts the positions of the fixed arc plates 13 and the limiting arc rings 14 to the appropriate positions, the wafer body 15 to be cleaned is placed between the two sets of fixed arc plates 13, so that both sides of the wafer body 15 are at the top of the limiting arc rings 14. Then, the user rotates the adjustment rod 22 to continue tightening the fixed arc plates 13. At this time, the wafer body 15 is fixed by the fixed arc plates 13 and the limiting arc rings 14, thereby preventing the user from shaking the wafer body 15 during transfer or cleaning, and avoiding damage to the wafer body 15 due to collision, thereby improving the utilization rate of the wafer body 15, facilitating the user to fix the wafer body 15, and preventing the wafer body 15 from shaking and being damaged.

[0035] See also Figure 6-Figure 9In this embodiment, the filtering mechanism includes a filter storage tank 23, a first pipe 24, a solenoid valve 25, a nano filter 26, a sealing plate 27, a second pipe 28, a water pump 29, a second buckle groove 30, a first rotating groove 31, a second rotating groove 32, a rotating plate 33, a rotating handle 34, a torsion spring 35 and a plug-in plate 36. The bottom end of the shell 1 is provided with a filter storage tank 23, the bottom end of the cleaning chamber 3 is connected to three groups of first pipes 24, and the bottom ends of the first pipes 24 are all connected to the top of the filter storage tank 23, the middle part of the first pipes 24 is provided with a solenoid valve 25, and the middle part of the solenoid valve 25 is provided with a nano filter 26. One end of the filter storage tank 23 is slidably connected to the sealing plate 27, and one end of the sealing plate 27 is connected to the nano filter 26 by a snap buckle. The bottom end of 23 is connected to the second pipe 28, and the top of the second pipe 28 is connected to the cleaning bin 3. A water pump 29 is provided in the middle of the second pipe 28. A second buckle groove 30 is symmetrically fixedly connected to one side of the filter storage tank 23. Both ends of the sealing plate 27 are provided with a first rotating groove 31. The inner wall of the first rotating groove 31 is provided with a second rotating groove 32. The interior of the second rotating groove 32 is rotatably connected to a rotating plate 33. The interior of the first rotating groove 31 is rotatably connected to a turning hand 34, and one end of the turning hand 34 is respectively fixedly connected to the turning plate 33. A torsion spring 35 is provided between the first rotating groove 31 and the turning hand 34, and both ends of the torsion spring 35 are respectively fixedly connected to the first rotating groove 31 and the turning hand 34. The edges of the rotating plate 33 are symmetrically fixedly connected with plug plates 36. The insert plates 36 are slidably connected to the sealing plates 27, and one end of the insert plates 36 is respectively located inside the second buckle groove 30. One side of the insert plates 36 is inclined, and the inner wall of one side of the second buckle groove 30 is in a shape corresponding to the inclined surface of the insert plates 36. The inclined surfaces of the insert plates 36 are respectively fitted with the inner wall of one side of the second buckle groove 30. When the wafer body 15 is cleaned, the solenoid valve 25 works, and the cleaning liquid inside the cleaning chamber 3 enters the top of the filter storage tank 23 through the first pipe 24. Impurities in the cleaning liquid can be filtered out by the nano filter 26 in the middle of the filter storage tank 23. When the cleaning liquid is discharged, the clean cleaning liquid at the bottom of the filter storage tank 23 can be input into the interior of the cleaning chamber 3 through the water pump 29 and the second pipe 28, thereby When the nano filter 26 is completely retracted into the sealing plate 27, the user can remove the sealing plate 27 and the nano filter 26. Then, the user separates the nano filter 26 from the sealing plate 27. After replacing the new nano filter 26, the user puts it into the filter storage tank 23. At this time, the inserting plate 36, the rotating plate 33 and the rotating hand 34 can rotate the inserting plate 36 in the opposite direction under the action of the torsion spring 35's own rebound force, and the inclined surface of the inserting plate 36 continuously conflicts with the inclined surface inside the second buckle groove 30.The sealing plate 27 can be continuously brought closer to the filter storage tank 23, thereby further improving the tightness between the sealing plate 27 and the filter storage tank 23. This device not only facilitates the user to replace the nano filter 26, but also ensures the filtering effect of the nano filter 26 on the cleaning liquid, and can automatically circulate and filter the cleaning liquid, reducing its consumption. It also facilitates the user to replace the nano filter 26.

[0036] See also Figure 6 and Figure 7 In this embodiment, the drying mechanism includes a nitrogen tank 37, a heater 38, a third pipe 39, a nitrogen nozzle 40 and a fourth pipe 41. A nitrogen tank 37 is provided at one end of the housing 1, and a heater 38 is provided on one side of the nitrogen tank 37. The input end of the heater 38 is connected to the third pipe 39, and one end of the third pipe 39 is connected to the nitrogen tank 37. Nitrogen nozzles 40 are evenly provided on the inner wall of the bottom end of the drying chamber 4 and the inner wall of the top end of the sealing transparent cover 5, and the nitrogen nozzles 40 are respectively corresponding to the positions of the wafer bodies 15 inside the cleaning frame 9. The output end of the heater 38 is connected to the fourth pipe 41. One end of the nitrogen nozzles 40 is connected to the inner wall of the bottom end of the drying chamber 4 and the inner wall of the top end of the sealing transparent cover 5. The fourth pipe 41 is connected. The user places the cleaned wafer body 15 into the interior of the drying chamber 4, and then closes the sealed transparent cover 5 equipped with the nitrogen nozzle 40. The nitrogen in the nitrogen tank 37 enters the interior of the heater 38 through the third pipe 39, is heated by the heater 38, and then the high-temperature nitrogen is discharged through the fourth pipe 41 and the nitrogen nozzle 40. Since the position of the nitrogen nozzle 40 corresponds to the position of the wafer body 15 in the cleaning frame 9, the high-temperature nitrogen can remove moisture on the surface of the wafer body 15, thereby drying the wafer body 15, which is convenient for the user to dry the wafer body 15.

[0037] It should be noted that the ultrasonic transmitter 8 is electrically connected to the generator 7, and the generator 7 is electrically connected to the external power supply through an external switch, which is convenient for the user to control the device to work. The outer sides of the fixed arc plate 13 are all arc-shaped and compatible with the wafer body 15, and the limiting arc rings 14 are all arc-shaped and compatible with the wafer body 15, which is convenient for fitting with the wafer body 15 and improving the fixing effect. The rotating plate 33, the rotating hand 34 and the plugging plate 36 are symmetrically distributed. The two groups of plugging plates 36 are evenly distributed on the upper and lower sides of the rotating plate 33. The inclined directions of the two groups of plugging plates 36 are symmetrically distributed, which improves the fixing effect of the sealing plate 27. The control ends of the solenoid valve 25 and the water pump 29 are respectively electrically connected to the external power supply through an external switch, which is convenient for the user to control the device to work. The control end of the heater 38 is electrically connected to the external power supply through an external switch, which is convenient for the user to control the device to work.

[0038] The device operates as follows:

[0039] Step 1: Fixing. The user first places the cleaning screen frame 9 into the installation chamber 2 so that the two ends of the cleaning screen frame 9 are inside the first buckle groove 10. Then the user rotates the adjusting rod 22. The adjusting rod 22 drives the worm 21, the worm gear 20 and the pull plate 19 to rotate. The filter storage tank 23 is moved to the side close to each other through the pull plate 19, the pull rod 17 and the slide bar 16, so that the position of the fixed arc plate 13 and the limiting arc ring 14 can be adjusted. Then, the wafer body 15 to be cleaned is placed between the two sets of fixed arc plates 13 so that both sides of the wafer body 15 are at the top of the limiting arc ring 14. Then, the user rotates the adjusting rod 22 to continue tightening the fixed arc plate 13. At this time, the wafer body 15 is fixed by the fixed arc plate 13 and the limiting arc ring 14.

[0040] Step 2: Cleaning. The user places the cleaning screen frame 9 and the wafer body 15 into the cleaning chamber 3 so that the cleaning liquid inside the cleaning chamber 3 covers the wafer body 15. Then the user closes the sealed transparent cover 5 on one side of the cleaning chamber 3. The user starts the generator 7 and the ultrasonic transmitter 8. The generator 7 causes the ultrasonic transmitter 8 to generate ultrasonic waves. At this time, countless tiny bubbles will be generated in the cleaning liquid. After these bubbles grow to a certain extent, they will quickly collapse, generating a strong impact force, thereby impacting the pollutants on the surface of the wafer body 15. At the same time, the user can continue to place the cleaning screen frame 9 and fix the wafer body 15 in the installation chamber 2. After fixing the wafer body 15, the user closes the sealed transparent cover 5 on one side of the installation chamber 2.

[0041] Step 3: Filtration. After the wafer body 15 is cleaned, the solenoid valve 25 is activated, and the cleaning liquid in the cleaning chamber 3 enters the top of the filter storage tank 23 through the first pipe 24. Impurities in the cleaning liquid are filtered out by the nano filter 26 in the middle of the filter storage tank 23. When the cleaning liquid is discharged, the clean cleaning liquid at the bottom of the filter storage tank 23 is input into the interior of the cleaning chamber 3 through the water pump 29 and the second pipe 28, so that the cleaning liquid can be recycled.

[0042] Step 4: Drying. Place the cleaned wafer body 15 into the drying chamber 4. Then, the user closes the sealed transparent cover 5 equipped with a nitrogen nozzle 40. The nitrogen in the nitrogen tank 37 enters the heater 38 through the third pipe 39 and is heated by the heater 38. The high-temperature nitrogen is then discharged through the fourth pipe 41 and the nitrogen nozzle 40. Since the position of the nitrogen nozzle 40 corresponds to the position of the wafer body 15 in the cleaning frame 9, the high-temperature nitrogen can take away the moisture on the surface of the wafer body 15, thereby drying the wafer body 15. At the same time, the user can place the cleaning frame 9 and the wafer body 15 in the installation chamber 2 into the cleaning chamber 3 for cleaning. The user can continue to place the cleaning frame 9 and fix the wafer body 15 in the installation chamber 2.

[0043] Step 5: Replacement. When the user needs to replace the nano filter 26, the user drives the rotating plate 33 and the plugging plate 36 to rotate by turning the handle 34. At the same time, the torsion spring 35 is compressed. When the plugging plate 36 is completely retracted into the sealing plate 27, the user can take out the sealing plate 27 and the nano filter 26, and then separate the nano filter 26 and the sealing plate 27. After replacing the new nano filter 26, put it into the filter storage tank 23. At this time, the plugging plate 36, the rotating plate 33 and the turning handle 34 can rotate the plugging plate 36 in the opposite direction under the action of the rebound force of the torsion spring 35. The inclined surface of the plugging plate 36 continuously conflicts with the inclined surface inside the second buckle groove 30, so that the sealing plate 27 can be continuously close to the filter storage tank 23.

[0044] When the user uses this device for cleaning, the user first puts the cleaning screen frame 9 into the installation bin 2 so that the two ends of the cleaning screen frame 9 are inside the first buckle groove 10, and the cleaning screen frame 9 is limited by the two sets of first buckle grooves 10. Then the user rotates the adjusting rod 22, and the adjusting rod 22 drives the worm 21 to rotate. The rotating worm 21 drives the worm gear 20 and the pull plate 19 to rotate, and the pull plate 19 pulls one end of the pull rod 17 to perform a circular motion. At this time, one end of the pull rod 17 pulls the slide bar 16 to move toward the side close to the pull plate 19. At this time, the slide bars 16 approaching each other can pull the filter liquid storage box 23 to move toward the side close to each other, so that the fixed arc plate 13 can be tightened, and then the fixed arc plate 13 can be adjusted by rotating the adjusting rod 22. The user adjusts the position of the fixed arc plate 13 and the limiting arc ring 14 to the appropriate position, and then places the chip body 15 to be cleaned between the two sets of fixed arc plates 13, so that both sides of the chip body 15 are at the top of the limiting arc ring 14, and then the user rotates the adjusting rod 22 to continue to tighten the fixed arc plate 13. At this time, the chip body 15 is fixed by the fixed arc plate 13 and the limiting arc ring 14, so as to avoid the chip body 15 from shaking when the user is transferring or cleaning, and avoid damage to the chip body 15 caused by collision, thereby improving the utilization rate of the chip body 15. After the user has fixed the chip body 15, the cleaning net frame 9 and the chip body 15 are placed in the interior of the cleaning chamber 3, so that the interior of the cleaning chamber 3 is filled with cleaning liquid. After the wafer body 15 is submerged, the user closes the sealed transparent cover 5 on one side of the cleaning chamber 3, and the user starts the generator 7 and the ultrasonic transmitter 8. The generator 7 causes the ultrasonic transmitter 8 to generate ultrasonic waves. At this time, countless tiny bubbles will be generated in the cleaning liquid. After these bubbles grow to a certain extent, they will quickly collapse, generating a strong impact force, thereby impacting the pollutants on the surface of the wafer body 15. At the same time, the user can continue to put the cleaning net frame 9 into the interior of the installation chamber 2, and fix the wafer body 15, thereby saving cleaning time. After the user fixes the wafer body 15, the sealed transparent cover 5 on one side of the installation chamber 2 is closed to prevent external dust from falling on the wafer body 15. When the wafer body 15 is cleaned, the solenoid valve 25 During operation, the cleaning liquid inside the cleaning chamber 3 enters the top of the filter storage tank 23 through the first pipe 24, and the impurities in the cleaning liquid can be filtered through the nano filter 26 in the middle of the filter storage tank 23. When the cleaning liquid is discharged, the clean cleaning liquid at the bottom of the filter storage tank 23 can be input into the interior of the cleaning chamber 3 through the water pump 29 and the second pipe 28, so that the cleaning liquid can be recycled, thereby reducing pollution and reducing the consumption of the cleaning liquid. The user then places the cleaned wafer body 15 into the interior of the drying chamber 4, and then closes the sealed transparent cover 5 equipped with a nitrogen nozzle 40. The nitrogen inside the nitrogen tank 37 enters the interior of the heater 38 through the third pipe 39 and is heated by the heater 38.Then, the high-temperature nitrogen is discharged through the fourth pipe 41 and the nitrogen nozzle 40. Since the position of the nitrogen nozzle 40 corresponds to the position of the wafer body 15 in the cleaning frame 9, the high-temperature nitrogen can remove the moisture on the surface of the wafer body 15, thereby drying the wafer body 15. At the same time, the user can place the cleaning frame 9 and the wafer body 15 in the installation chamber 2 into the cleaning chamber 3 for cleaning. The user can continue to place the cleaning frame 9 and the fixed wafer body 15 in the installation chamber 2, thereby repeating the work continuously, thereby improving the user's work efficiency. When the user needs to replace the nano filter 26, the user first turns the handle 34, and the handle 34 drives the rotating plate 33 and the inserting plate 36 to rotate. At the same time, the torsion spring 35 is compressed. When the inserting plate 36 is completely retracted into the sealing plate 27, the user can remove the sealing plate 27 and the nano filter 26. Then, the user separates the nano filter 26 and the sealing plate 27. After replacing the new nano filter 26, it is placed into the filter storage tank 23. At this time, the insert plate 36, the rotating plate 33 and the rotating handle 34 can rotate the insert plate 36 in the opposite direction under the action of the self-rebound force of the torsion spring 35. The inclined surface of the insert plate 36 continuously contacts the inclined surface inside the second buckle groove 30, which can make the sealing plate 27 continuously approach the filter storage tank 23, thereby further improving the tightness between the sealing plate 27 and the filter storage tank 23. This device not only facilitates the user to replace the nano filter 26, but also ensures the filtering effect of the nano filter 26 on the cleaning liquid. This device can fix the wafer body 15, thereby preventing the wafer body 15 from shaking when the user moves and cleans it, thereby reducing the probability of damage. This device not only facilitates the user to fix the wafer body 15, but also performs cleaning and drying work, thereby improving the automatic replacement and filtering of the cleaning liquid after cleaning. At the same time, the cleaning liquid of this device is in automatic circulation filtration, thereby reducing loss. This device also facilitates the user to replace the nano filter 26, thereby improving the user's work efficiency.

[0045] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be included therein. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

Claims

1. A semiconductor wafer cleaning device, characterized in that: The invention comprises a shell (1), a clamping mechanism, a filtering mechanism and a drying mechanism, wherein a mounting chamber (2) is provided at one end of the shell (1), a drying chamber (4) is provided at the other end of the shell (1), a cleaning chamber (3) is provided at the top end of the shell (1), and the cleaning chamber (3) is located between the mounting chamber (2) and the drying chamber (4), the top end of the shell (1) is connected to three groups of sealed transparent covers (5) via a rotating shaft, the bottom end of the shell (1) is provided with a placement chamber (6), a generator (7) is provided inside the placement chamber (6), and three groups of ultrasonic transmitters (8) are evenly provided at the bottom end of the cleaning chamber (3), and the ultrasonic transmitters (8) are arranged on the bottom end of the cleaning chamber (3). The bottom end of the device (8) is located inside the placement chamber (6), and two groups of first buckle grooves (10) are symmetrically opened inside the installation chamber (2), the cleaning chamber (3) and the drying chamber (4). Cleaning net frames (9) are evenly arranged inside the installation chamber (2) and the cleaning chamber (3), and both ends of the cleaning net frames (9) are respectively slidably connected to the first buckle grooves (10). Three groups of chip bodies (15) are arranged inside the cleaning net frames (9), and the chip bodies (15) are fixed by a clamping mechanism. The filtering mechanism is used to circulate and filter the cleaning liquid, and the drying mechanism is used to dry the chip bodies (15).

2. A semiconductor wafer cleaning device according to claim 1, characterized in that: The ultrasonic transmitter (8) is electrically connected to the generator (7), and the generator (7) is electrically connected to an external power supply via an external switch.

3. The semiconductor wafer cleaning device according to claim 1, wherein: The clamping mechanism includes a base (11), an adjusting groove (12), a fixed arc plate (13), a limiting arc ring (14), a chip body (15), a slide rod (16), a pull rod (17), a transmission groove (18), a pull plate (19), a worm wheel (20), a worm (21) and an adjusting rod (22). The bottom end of the cleaning screen frame (9) is evenly provided with three groups of bases (11), the top of the base (11) is provided with an adjusting groove (12), the middle of the base (11) is provided with a transmission groove (18), both ends of the base (11) are slidably connected to the slide rod (16), and one end of the slide rod (16) is respectively located inside the adjusting groove (12), the other end of the slide rod (16) is fixedly connected to the fixed arc plate (13), and the fixed arc plates (13) are symmetrically distributed, and the sides of the fixed arc plates (13) close to each other are respectively fitted with the outer side of the chip body (15), and the fixed arc plates (13) The middle of each of the adjusting slots (12) is fixedly connected to a limiting arc ring (14), and one side of the limiting arc ring (14) is in contact with the edge of the wafer body (15), one end of each of the sliding rods (16) is connected to a pull rod (17) via a rotating shaft, the middle of each of the adjusting slots (12) is connected to a pull plate (19) via a bearing, and one end of each of the pull plates (19) extends to the interior of the transmission slot (18), the middle of each of the transmission slots (18) is connected to a worm gear (20) via a bearing, and the worm gear (20) is connected to the worm gear (20). 0) are fixedly connected to one end of the pull plate (19), a worm (21) is provided inside the transmission groove (18), and the worm (21) is meshed with the worm wheel (20), an adjusting rod (22) is provided between the bases (11), and both ends of the adjusting rod (22) are connected to the base (11) through bearings, and both ends of the adjusting rod (22) are located inside the transmission groove (18) and fixedly connected to both ends of the worm (21).

4. The semiconductor wafer cleaning device according to claim 3, wherein: The outer sides of the fixed arc plates (13) are all in an arc shape that matches the chip body (15), and the limiting arc rings (14) are all in an arc shape that matches the chip body (15).

5. The semiconductor wafer cleaning device according to claim 1, wherein: The filtering mechanism comprises a filtering liquid storage tank (23), a first pipe (24), a solenoid valve (25), a nanometer filter (26), a sealing plate (27), a second pipe (28), a water pump (29), a second buckle groove (30), a first rotating groove (31), a second rotating groove (32), a rotating plate (33), a rotating handle (34), a torsion spring (35) and a plug plate (36). The bottom end of the housing (1) is provided with a filtering liquid storage tank (23), the bottom end of the cleaning chamber (3) is connected to three groups of first pipes (24), and the bottom ends of the first pipes (24) are all connected to the filtering liquid storage tank. The top of the filter tank (23) is connected, the middle of the first pipe (24) is provided with a solenoid valve (25), the middle of the solenoid valve (25) is provided with a nano filter (26), one end of the filter tank (23) is slidably connected to a sealing plate (27), and one end of the sealing plate (27) is connected to the nano filter (26) by a snap fastener, the bottom end of the filter tank (23) is connected to a second pipe (28), and the top of the second pipe (28) is connected to the cleaning chamber (3), the middle of the second pipe (28) is provided with a water pump (29), the filter tank (23) is connected to the cleaning chamber (3), and the middle of the second pipe (28) is provided with a water pump (29). A second buckle groove (30) is symmetrically fixedly connected to one side of the liquid box (23), a first rotation groove (31) is provided at both ends of the sealing plate (27), a second rotation groove (32) is provided on the inner wall of the first rotation groove (31), a rotation plate (33) is rotatably connected to the inside of the second rotation groove (32), a rotating hand (34) is rotatably connected to the inside of the first rotation groove (31), and one end of the rotating hand (34) is fixedly connected to the rotating plate (33), a torsion spring (35) is provided between the first rotation groove (31) and the rotating hand (34), and the torsion spring ( The two ends of the rotating plate (35) are respectively fixedly connected to the first rotating groove (31) and the rotating handle (34), the edges of the rotating plate (33) are symmetrically fixedly connected with the inserting plates (36), and the inserting plates (36) are respectively slidably connected to the sealing plates (27), one end of the inserting plates (36) is respectively located inside the second buckle groove (30), one side of the inserting plates (36) is inclined, and the inner wall of one side of the second buckle groove (30) is in a shape corresponding to the inclined surface of the inserting plates (36), and the inclined surfaces of the inserting plates (36) are respectively fitted with the inner wall of one side of the second buckle groove (30).

6. The semiconductor wafer cleaning device according to claim 5, characterized in that: The rotating plate (33), the rotating handle (34) and the plug plate (36) are symmetrically distributed on both sides of the rotating plate (33). The two groups of the plug plates (36) are evenly distributed on the upper and lower sides of the rotating plate (33). The inclined directions of the two groups of the plug plates (36) are symmetrically distributed. The control ends of the solenoid valve (25) and the water pump (29) are electrically connected to the external power supply through external switches.

7. The semiconductor wafer cleaning device according to claim 1, wherein: The drying mechanism comprises a nitrogen tank (37), a heater (38), a third pipe (39), a nitrogen nozzle (40) and a fourth pipe (41). One end of the housing (1) is provided with a nitrogen tank (37), and one side of the nitrogen tank (37) is provided with a heater (38). The input end of the heater (38) is connected to the third pipe (39), and one end of the third pipe (39) is connected to the nitrogen tank (37). The inner wall of the bottom end of the drying chamber (4) and the inner wall of the top end of the sealing transparent cover (5) are both evenly provided with nitrogen nozzles (40), and the nitrogen nozzles (40) are respectively corresponding to the positions of the wafer bodies (15) inside the cleaning net frame (9). The output end of the heater (38) is connected to the fourth pipe (41), and one end of the nitrogen nozzles (40) is connected to the fourth pipe (41).

8. The semiconductor wafer cleaning device according to claim 7, wherein: The control end of the heater (38) is electrically connected to an external power supply via an external switch.

9. A method for operating a semiconductor wafer cleaning device according to any one of claims 1 to 8, characterized in that: Step 1: Fixing. The user first places the cleaning screen frame (9) into the installation chamber (2) so that both ends of the cleaning screen frame (9) are inside the first buckle groove (10). Then, the user rotates the adjusting rod (22). The adjusting rod (22) drives the worm (21), the worm wheel (20) and the pull plate (19) to rotate. The filter liquid storage box (23) is moved to the side close to each other through the pull plate (19), the pull rod (17) and the slide rod (16), so that the position of the fixed arc plate (13) and the limiting arc ring (14) can be adjusted. Then, the wafer body (15) to be cleaned is placed between the two sets of fixed arc plates (13) so that both sides of the wafer body (15) are at the top of the limiting arc ring (14). Then, the user rotates the adjusting rod (22) to continue tightening the fixed arc plate (13). At this time, the wafer body (15) is fixed by the fixed arc plate (13) and the limiting arc ring (14); Step 2: Cleaning. The user places the cleaning net frame (9) and the wafer body (15) into the cleaning chamber (3) so that the cleaning liquid in the cleaning chamber (3) covers the wafer body (15). The user then closes the sealed transparent cover (5) on one side of the cleaning chamber (3). The user activates the generator (7) and the ultrasonic transmitter (8). The generator (7) causes the ultrasonic transmitter (8) to generate ultrasonic waves. At this time, countless tiny bubbles are generated in the cleaning liquid. These bubbles will quickly collapse after growing to a certain extent, generating a strong impact force, thereby impacting the pollutants on the surface of the wafer body (15). At the same time, the user can continue to place the cleaning net frame (9) and fix the wafer body (15) in the installation chamber (2). After fixing the wafer body (15), the user closes the sealed transparent cover (5) on one side of the installation chamber (2). Step 3: Filtration. When the wafer body (15) is cleaned, the solenoid valve (25) is operated, and the cleaning liquid in the cleaning chamber (3) enters the top of the filter storage tank (23) through the first pipe (24). Impurities in the cleaning liquid can be filtered through the nano filter (26) in the middle of the filter storage tank (23). When the cleaning liquid is discharged, the clean cleaning liquid at the bottom of the filter storage tank (23) can be input into the interior of the cleaning chamber (3) through the water pump (29) and the second pipe (28), so that the cleaning liquid can be recycled. Step 4: Drying. The cleaned wafer body (15) is then placed inside the drying chamber (4). The user then closes the sealed transparent cover (5) equipped with a nitrogen nozzle (40). The nitrogen inside the nitrogen tank (37) enters the interior of the heater (38) through the third pipe (39), is heated by the heater (38), and then the high-temperature nitrogen is discharged through the fourth pipe (41) and the nitrogen nozzle (40). Since the position of the nitrogen nozzle (40) corresponds to the position of the wafer body (15) in the cleaning frame (9), the high-temperature nitrogen can take away the moisture on the surface of the wafer body (15), thereby drying the wafer body (15). At the same time, the user can place the cleaning frame (9) and the wafer body (15) inside the installation chamber (2) into the cleaning chamber (3) for cleaning. The user can continue to place the cleaning frame (9) and the fixed wafer body (15) inside the installation chamber (2); Step 5: Replacement. When the user needs to replace the nano filter (26), the user drives the rotating plate (33) and the plug plate (36) to rotate by turning the hand (34), and the torsion spring (35) is compressed at the same time. When the plug plate (36) is completely received inside the sealing plate (27), the user can take out the sealing plate (27) and the nano filter (26), and then separate the nano filter (26) and the sealing plate (27). After replacing the new nano filter (26), it is placed inside the filter storage tank (23). At this time, the plug plate (36), the rotating plate (33) and the turning hand (34) can rotate the plug plate (36) in the opposite direction under the action of the torsion spring (35) itself. The inclined surface of the plug plate (36) continuously conflicts with the inclined surface inside the second buckle groove (30), so that the sealing plate (27) can be continuously moved closer to the filter storage tank (23).

Images