A multi-layer circuit board with enhanced shielding

Abstract

The present invention discloses a multi-layer circuit board with enhanced shielding, comprising a multi-layer substrate, each of which is formed by laminating and pressing a plurality of base layers and copper plates in sequence, a winding unit is arranged on the substrate, and the surface of each layer of the substrate is wrapped and laminated with an enhanced shielding layer, and the enhanced shielding layer is one or more of copper foil, aluminum foil, and conductive polymer. The present invention coats a layer of enhanced shielding layer outside each layer of the substrate, thereby enhancing the shielding effect against external electromagnetic interference and ensuring the stability of signal transmission.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit boards, and in particular to a multi-layer circuit board with enhanced shielding. Background Art

[0002] The disc motor with printed circuit board as stator is gradually replacing the motor with traditional stator because of its compact structure, small size and high speed.

[0003] The bottleneck restricting the further development of this type of motor today is that in order to obtain greater power, the cross-sectional area of ​​the wires on the circuit board needs to be increased so that it can pass a larger current. The traditional way is to increase the number of layers of the circuit board and increase the cross-sectional area of ​​the overlapping wires by stacking multiple layers. This method can increase the cross-sectional area of ​​the wires to a certain extent, but when the number of layers accumulates to more than 12 layers, new problems will arise: the thickness of the circuit board is greatly increased. The thickness of common phenolic paper laminates, epoxy paper laminates, polyester glass felt laminates, and epoxy glass cloth laminates is at least 0.2mm, but because multi-layer lamination is required, the substrate thickness is usually selected to be more than 1mm. The thickness of the 12 layers of plates is more than 1.2cm. A circuit board of such thickness, combined with a conventional copper conductor, will also generate more heat when the current increases. Therefore, the temperature of this circuit board is difficult to control, which limits the thickness of this circuit board and limits the power of this stator.

[0004] In addition, existing circuit boards have poor shielding effects against external electromagnetic interference, resulting in unstable signal transmission. Summary of the Invention

[0005] In view of the above problems, the present invention provides a multi-layer circuit board with enhanced shielding.

[0006] The technical solutions of the present invention are as follows:

[0007] A multi-layer circuit board with enhanced shielding includes a multi-layer substrate, each of which is formed by laminating and stacking several layers of base layers and copper plates in sequence. A winding unit is provided on the substrate, and the surface of each layer of the substrate is wrapped and laminated with an enhanced shielding layer, which is one or more of copper foil, aluminum foil, and conductive polymer.

[0008] In a further technical solution, the winding unit is formed by spraying nanographene ink on a substrate using a spraying device.

[0009] In a further technical solution, the substrate is provided with an inner wire plate, a conductor plate and an outer wire plate in an annular manner from the inside to the outside;

[0010] The winding unit includes a wire segment arranged on the wire plate in the radial direction, an inner end conductor arranged on the inner wire plate to connect the inner ends of the two wire segments, and an outer end conductor arranged on the outer wire plate to connect the outer ends of the two wire segments;

[0011] The wire segment, the inner end conductor and the outer end conductor are all formed by spraying nanographene ink on a substrate using a spraying device and form a spiral winding unit.

[0012] In a further technical solution, the total thickness of the multi-layer substrate is 1 mm-10 mm.

[0013] In a further technical solution, a heat-saturating wire is inserted into each layer of the substrate.

[0014] The beneficial effects of the present invention are:

[0015] 1. The present invention uses nanographene as a conductor, which generates little heat and has little loss, greatly reducing the energy consumption of the motor. At the same time, the nanographene ink sprayed has higher connectivity and a high yield rate;

[0016] 2. The present invention inserts a heat spreader wire into the substrate to evenly distribute the large amount of heat generated locally inside the multi-layer circuit board, thereby increasing heat transfer and reducing local temperature. Compared with local heat spreaders, the heat spreader wire increases the heat dissipation area, enhances the heat dissipation performance of the multi-layer circuit board, and reduces the impact on the working components above the circuit board.

[0017] 3. The present invention coats each substrate with a reinforced shielding layer, thereby enhancing the shielding effect against external electromagnetic interference and ensuring the stability of signal transmission. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a side view of a multi-layer circuit board with enhanced shielding according to an embodiment of the present invention;

[0019] Figure 2 4 is a top view of a multi-layer circuit board with enhanced shielding according to an embodiment of the present invention.

[0020] Description of reference numerals:

[0021] 100, substrate; 110, reinforced shielding layer; 120, inner wire plate; 130, wire plate; 131, connection hole; 140, outer wire plate; 200, winding unit; 210, wire segment; 220, inner conductor; 230, outer conductor. DETAILED DESCRIPTION

[0022] The embodiments of the present invention will be further described below with reference to the accompanying drawings.

[0023] Example:

[0024] A multi-layer circuit board with enhanced shielding, such as Figure 1-2 As shown, it includes a multi-layer substrate 100, each layer of the substrate 100 is formed by stacking and pressing several layers of base layers and copper plates in sequence, and a winding unit 200 is provided on the substrate 100. The surface of each layer of the substrate 100 is wrapped and adhered with an enhanced shielding layer 110, and the enhanced shielding layer 110 is one or more of copper foil, aluminum foil, and conductive polymer.

[0025] In another embodiment, Figure 2 As shown, the winding unit 200 is formed by spraying nanographene ink on the substrate 100 using a spraying device.

[0026] In another embodiment, Figure 2 As shown, the base plate 100 is provided with an inner wire plate 120, a conductor plate 130 and an outer wire plate 140 in a circular manner from the inside to the outside;

[0027] The winding unit 200 includes a wire segment 210 radially arranged on the wire plate 130, an inner conductor 220 arranged on the inner wire plate 120 to connect the inner ends of the two wire segments 210, and an outer conductor 230 arranged on the outer wire plate 140 to connect the outer ends of the two wire segments 210.

[0028] The wire segment 210, the inner conductor 220 and the outer conductor 230 are all formed by spraying nanographene ink on the substrate 100 using a spraying device and form a spiral winding unit 200;

[0029] The conductor plate 130 is provided with connection holes 131 at both ends of the corresponding conductor segments 210 . The connection holes 131 are used to connect the conductor segments 210 on upper and lower layers.

[0030] In another embodiment, the total thickness of the multi-layer substrate 100 is 1 mm-10 mm.

[0031] In another embodiment, Figure 1 As shown, each layer of the substrate 100 is respectively connected with a heat spreader wire.

[0032] The above-described embodiments merely represent specific implementations of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the spirit of the present invention, and all such variations and improvements fall within the scope of protection of the present invention.

Claims

1. A multi-layer circuit board with enhanced shielding, comprising a multi-layer substrate, each layer of the substrate being formed by laminating and stacking a plurality of base layers and copper plates in sequence, and a winding unit being arranged on the substrate, characterized in that: The surface of each layer of the substrate is wrapped and attached with a reinforced shielding layer, and the reinforced shielding layer is one or more of copper foil, aluminum foil, and conductive polymer.

2. The multi-layer circuit board with enhanced shielding according to claim 1, characterized in that: The winding unit is formed by spraying nanographene ink on a substrate using a spraying device.

3. The multi-layer circuit board with enhanced shielding according to claim 2, characterized in that: The substrate is provided with an inner wire plate, a conductor plate and an outer wire plate in a circular manner from the inside to the outside; The winding unit comprises a wire segment arranged on the wire board in the radial direction, an inner conductor arranged on the inner wire board and connecting the inner ends of the two wire segments, and an outer conductor arranged on the outer wire board and connecting the outer ends of the two wire segments; The wire segment, the inner end conductor and the outer end conductor are all formed by spraying nanographene ink on a substrate using a spray device and form a spiral winding unit.

4. The multi-layer circuit board with enhanced shielding according to claim 1, characterized in that: The total thickness of the multi-layer substrate is 1mm-10mm.

5. The multi-layer circuit board with enhanced shielding according to claim 1, characterized in that: Each layer of the substrate is respectively plugged with a heat-saturating wire.

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