High-surge ESD (Electro-Static Discharge) static suppressor

Abstract

The invention discloses a high-surge ESD electrostatic suppressor, and relates to the technical field of electrostatic suppressors, the high-surge ESD electrostatic suppressor comprises an insulating substrate, and terminal electrodes are symmetrically arranged on the two sides of the substrate; the plurality of internal electrodes are embedded in the insulating substrate and are electrically connected with the conductive polymer layer; the conductive polymer layer is arranged among the plurality of internal electrodes and is used for ESD energy absorption and conduction; salient point units arranged in an array are arranged between the conductive polymer layer and the internal electrode; connecting interfaces between the insulating substrate and the conductive polymer layer are respectively provided with a transition interface; a frame unit wrapping the outer side of the conductive polymer layer is arranged above the insulating substrate, the two ends of the frame unit are in lap joint with the tops of the end electrodes, the frame unit and the insulating substrate are mutually connected through connecting pieces, and through holes are formed in the positions, corresponding to the connecting pieces, of the end electrodes and the internal electrodes respectively; according to the invention, the long-term ESD suppression stability and reliability of the device are improved.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of electrostatic suppressors, and particularly relates to a high-inrush ESD electrostatic suppressor. BACKGROUND

[0002] ESD is an abbreviation of electrostatic discharge, and when an electrostatic source contacts other objects, there is a charge flow according to the charge neutralization mechanism, and enough electric quantity is transmitted to offset the voltage. In the process of high-speed electric quantity transmission, potential damage voltage, current and electromagnetic field will be generated, and the object will be destroyed in a serious case. Two damage mechanisms of ESD are that heat generated by ESD current causes thermal failure of equipment and that ESD induces an excessively high voltage to cause insulation breakdown. An ESD electrostatic suppressor needs to be used in electronic products such as mobile phones, computers, liquid crystal televisions and digital cameras to suppress static electricity, so as to protect the electronic products, and has the advantages of ultra-low capacitance value, fast response speed and high surge current bearing capacity.

[0003] The patent document with the patent publication number CN215073574U discloses a high-inrush ESD electrostatic suppressor, and relates to the technical field of electrostatic suppressors. The high-inrush ESD electrostatic suppressor comprises a suppressor body, and the top and bottom of the suppressor body are fixedly connected with an upper heat conduction plate and a lower heat conduction plate respectively. The upper surface of the upper heat conduction plate is fixedly connected with an upper heat dissipation plate, and the top of the upper heat dissipation plate is provided with a heat dissipation strip. The lower surface of the lower heat conduction plate is fixedly connected with a lower heat dissipation plate. By arranging the upper heat conduction plate, the upper heat dissipation plate, the lower heat conduction plate and the lower heat dissipation plate, the heat dissipation capacity of the suppressor body is improved, and the aging of the suppressor body due to high temperature is effectively prevented, so that the service life is improved. The problem that the ESD electrostatic suppressor in the prior art has a slow heat dissipation speed and is prone to aging and reduction of service life is solved.

[0004] However, in high-integration electronic packaging, interface bonding is not firm and microstructure deformation is a key factor leading to thermal and electrical performance degradation, especially in high-power devices using ceramic or metal heat dissipation layers. Insufficient adhesion between the TIM (thermal interface material) layer and the packaging / heat dissipation substrate can form micro-bubbles or peel off during operation, seriously affecting the heat conduction path, leading to local heat dissipation failure, especially during ESD (electrostatic discharge) release, causing abnormal temperature rise in the center of the polymer and even ablation. For polymer-type ESD devices, micro-delamination may occur between the conductive polymer layer and the electrode or substrate interface under repeated thermal cycling, which is caused by the difference in thermal expansion and contraction between the multi-layer heterogeneous materials and the uneven interfacial bonding force, affecting the normal use effect of the ESD electrostatic suppressor. SUMMARY

[0005] In order to solve the defects of the prior art, the application provides a high-inrush ESD static electricity suppressor.

[0006] In order to solve the above technical problems, the application provides the following technical scheme: The application provides a high-inrush ESD static electricity suppressor, which comprises: An insulating substrate; End electrodes symmetrically arranged on both sides of the substrate; A plurality of internal electrodes embedded in the interior of the insulating substrate, and the internal electrodes are electrically connected with a conductive polymer layer; The conductive polymer layer is arranged between the plurality of internal electrodes and is used for ESD energy absorption and conduction; The conductive polymer layer and the internal electrodes are arranged with an array of convex units therebetween; The connecting interfaces between the insulating substrate and the conductive polymer layer are respectively provided with transition interfaces; A frame unit is arranged above the insulating substrate and covers the outer side of the conductive polymer layer, both ends of the frame unit are overlapped on the top of the end electrodes, the frame unit and the insulating substrate are connected with each other through a connecting piece, and the end electrodes and the internal electrodes are respectively provided with through holes at positions corresponding to the connecting piece.

[0007] As a preferred technical scheme of the application, the convex units are made of polydimethylsiloxane material.

[0008] As a preferred technical scheme of the application, the convex units are columnar or spherical, the maximum cross-sectional diameter of the convex units is 3-10 mu m, and the convex units are distributed in the contact area of the conductive polymer and the internal electrode.

[0009] As a preferred technical scheme of the application, the transition interface is sawtooth-shaped or corrugated with a periodic structure, and in each period, the length of the transition interface is 10-50 mu m and the height is 3-10 mu m.

[0010] As a preferred technical scheme of the application, the frame unit is composed of polyimide composite material, and the internal structure is honeycomb or cross grid type.

[0011] As a preferred technical scheme of the application, the connecting piece is a metal heat-conducting column.

[0012] As a preferred technical scheme of the application, the connecting piece is a nickel-plated copper column with a diameter of 50-150 mu m.

[0013] As a preferred technical scheme of the application, the conductive polymer layer has uniformly embedded conductive fillers, and the conductive fillers include carbon nanotubes, conductive polymer composite particles or metal micropowder.

[0014] The beneficial effects of the present application are: 1. In the present application, by introducing an array of convex units between the conductive polymer layer and the internal electrode, a columnar / spherical structure composed of flexible material (polydimethylsiloxane) is used to form an elastic buffer interface on the contact surface, which not only significantly relieves the microstructure stress caused by thermal expansion and contraction, but also maintains reliable contact between the electrode and the polymer, thereby inhibiting the "micro delamination" problem during thermal cycling and improving the long-term ESD suppression stability and reliability of the device.

[0015] 2. In the present application, a transition interface with a periodic structure (sawtooth / corrugated) is provided between the insulating substrate and the conductive polymer layer, which significantly improves the mechanical engagement strength between the materials and plays a role in stress dispersion and heat conduction buffering, effectively preventing interface peeling under large current discharge or repeated thermal shock. At the same time, the metal heat-conducting connector provided between the frame unit and the insulating substrate not only provides structural fixation, but also forms a continuous heat conduction path, reducing the heat conduction bottleneck and improving the heat conduction efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0016] The accompanying drawings are included to provide a further understanding of the present application, and constitute a part of the specification, together with the embodiments of the present application, to explain the present application, and do not constitute a limitation on the present application. In the drawings:

[0017] Fig. 1 is a schematic diagram of the overall structure of the present application.

[0018] Fig. 2 is a schematic diagram of the structure of the power assembly.

[0019] Fig. 3 is a schematic diagram of the structure of the cleat unit.

[0020] In the figure: 1, insulating substrate; 2, end electrode; 3, internal electrode; 4, conductive polymer layer; 5, convex unit; 6, transition interface; 7, frame unit; 8, connector. DETAILED DESCRIPTION

[0021] The technical solutions in the present application will be described clearly and completely in the present application in combination with the drawings. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. The components of the present application described and shown in the drawings can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative work belong to the scope of protection of the present application.

[0022] It should be noted that similar reference numbers and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. Meanwhile, in the description of the present application, the terms "first", "second", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0023] As shown in Figs. 1-3 A high surge ESD electrostatic suppressor includes an insulating substrate 1, end electrodes 2, internal electrodes 3, and a conductive polymer layer 4. The end electrodes 2 are symmetrically arranged on both sides of the substrate. A plurality of internal electrodes 3 are embedded in the insulating substrate 1, and the internal electrodes 3 are electrically connected with the conductive polymer layer 4. The conductive polymer layer 4 is arranged between the plurality of internal electrodes 3 for ESD energy absorption and conduction. An array of bump units 5 is arranged between the conductive polymer layer 4 and the internal electrodes 3 to achieve flexible fitting and release packaging stress. Transition interfaces 6 are arranged at the connection interfaces between the insulating substrate 1 and the conductive polymer layer 4 to improve the interface bonding strength and buffer thermal stress concentration. A frame unit 7 is arranged above the insulating substrate 1 and covers the outside of the conductive polymer layer 4. The frame unit 7 is overlapped at the top of the end electrodes 2 at both ends. The end electrodes 2 and the internal electrodes 3 are respectively provided with through holes at positions corresponding to the connecting pieces 8.

[0024] The convex point unit 5 refers to an elastic support structure distributed on the contact surface of the conductive polymer and the electrode, which can be a columnar or spherical body made of polydimethylsiloxane material, and can absorb the stress generated by the thermal expansion difference through elastic deformation; the transition interface 6 refers to the microstructure bonding surface between the substrate and the polymer layer, which can be in the form of periodic corrugation or sawtooth, and can enhance the mechanical interlocking by increasing the contact area; the frame unit 7 refers to the support structure covering the conductive layer, which can be a honeycomb-shaped polyimide composite material, and can form an integral fixation with the substrate through the connecting piece 8; the through hole refers to a heat-conducting channel penetrating through the electrode, which can be formed by laser drilling, and can establish a longitudinal heat-conducting path in cooperation with the connecting piece 8.

[0025] Specifically, the insulating substrate 1 serves as a support body to carry the electrode and the functional layer, and the end electrode 2 provides external electrical connection; the internal electrode 3 is embedded in the substrate and forms an electric charge conduction network with the conductive polymer layer 4; the convex point unit 5 forms an elastic buffer layer on the contact surface of the electrode and the polymer, which can absorb stress and maintain close contact of the contact surface when the material expands due to temperature change; the transition interface 6 forms a mechanical interlocking structure on the bonding surface of the substrate and the polymer, which can disperse thermal stress through periodic undulating morphology and prevent interface crack propagation; the frame unit 7 wraps the edge of the conductive polymer layer 4 and is fixed with the substrate through the metal connecting piece 8 to form a constraint protection structure. The through hole allows the connecting piece 8 to penetrate through the electrode to establish a continuous heat-conducting channel from the internal electrode 3 to the outside of the package.

[0026] Through the above technical solutions, the application effectively suppresses the interface peeling phenomenon of high-power ESD devices during thermal cycling, maintains the reliable contact of the conductive polymer layer 4 and the electrode; the transition interface 6 structure enhances the bonding strength between heterogeneous materials, and the frame unit 7 and the connecting piece 8 form a stable packaging support system; the through hole design optimizes the longitudinal heat-conducting path and reduces the risk of local overheating; the overall structure maintains compact packaging size while realizing the synergistic improvement of interface stress relief and heat conduction efficiency.

[0027] Further, as shown in Figs. 2-3 The convex point unit 5 is made of polydimethylsiloxane material, and the convex point unit 5 is columnar or spherical, and the maximum cross-sectional diameter of the convex point unit 5 is 3-10 μm, which is distributed in the contact area of the conductive polymer and the internal electrode 3.

[0028] The polydimethylsiloxane material refers to an organic silicon compound with low elastic modulus and high deformation recovery capability, which can be realized by a liquid precursor through a thermal curing forming process, and the material forms an elastomer structure after curing. The material forms a deformable buffer interface in the contact area of the conductive polymer layer 4 and the internal electrode 3, and absorbs thermal stress deformation through its flexible properties.

[0029] Among them, the columnar or spherical form refers to the convex point unit 5 presenting an axially symmetrical or spherically symmetrical geometric shape in three-dimensional space. Specifically, a regularly arranged columnar structure can be formed on the surface of the polydimethylsiloxane material by photolithography or micro-molding process, or spherical particles can be formed on the electrode surface by spraying process. This symmetrical form can evenly disperse stress from different directions and avoid local stress concentration.

[0030] Among them, the maximum cross-sectional diameter of 3 to 10 microns refers to the maximum size range of a single bump unit 5 perpendicular to the stress transfer direction. Specifically, the diameter of the bump unit 5 can be controlled by adjusting the micromachining process parameters so that it has sufficient mechanical strength to maintain physical contact between electrodes while avoiding insufficient contact area due to excessive size.

[0031] Distributed in the contact area between the conductive polymer and the internal electrode 3 means that the bump units 5 are concentrated in the interface area between the conductive polymer layer 4 and the internal electrode 3. Specifically, the bump units 5 can be accurately set at the junction of heterogeneous materials through mask positioning technology to form a continuous stress buffer zone.

[0032] Specifically, at the contact interface between the conductive polymer and the internal electrode 3, the columnar or spherical bump unit 5 undergoes reversible deformation under thermal expansion or mechanical load due to its symmetrical geometry and elastic deformation ability. When the material produces dimensional differences due to temperature changes, the flexible support of the bump unit 5 can absorb the interface shear stress and avoid crack expansion caused by rigid contact. At the same time, the array-arranged bump units 5 disperse local stress peaks through synergistic action, making the interface stress distribution tend to be uniform, thereby inhibiting the formation of micro-delamination. By limiting the diameter range of the bump unit 5, it is ensured that it has sufficient deformation space while maintaining the contact area, avoiding the decrease in stress buffering capacity due to being too large or too small.

[0033] Further, if Fig. 3 As shown, the transition interface 6 is in a sawtooth or corrugated shape with a periodic structure, and each period has a specific length and height range. Preferably, in each period, the length of the transition interface 6 is 10-50 μm and the height is 3-10 μm.

[0034] The transition interface 6 refers to an intermediate layer structure located in the contact area of ​​the two materials. Specifically, a laser micro-etching or chemical etching process can be used to form a preset geometric morphology on the surface of the insulating substrate 1 to establish a mechanical interlock between the substrate and the polymer.

[0035] Among them, the periodic structure refers to geometric units that are repeatedly arranged along the extension direction of the interface. Specifically, CNC micromachining equipment can be used to form uniformly distributed corrugated or sawtooth profiles, and its continuous undulating shape can be used to increase the contact area between heterogeneous materials.

[0036] The serrated or corrugated shape refers to a continuous surface morphology with alternating protrusions and depressions, which can be specifically realized by using a trapezoidal cross-section or an arc cross-section, and a multi-level stress buffer zone is formed by a regularly distributed concave and convex structure.

[0037] Specifically, the transition interface 6 forms a mechanical bite effect through a periodically arranged geometric structure, so that the insulating base 1 and the conductive polymer layer 4 form a three-dimensional interlocking bond during the curing process. The serrated or wavy undulations form a multi-directional stress dispersion path at the interface. When the material is deformed due to thermal expansion, the periodic structure absorbs the lateral shear stress through local deformation, avoiding the expansion of interface cracks caused by stress concentration. At the same time, the continuously distributed concave and convex structures form a gradient contact in the vertical direction, so that the longitudinal stress generated by the thermal expansion difference is released step by step, maintaining the stability of the interface bonding state.

[0038] Furthermore, the frame unit 7 is made of a high modulus polyimide composite material, and its internal structure is a honeycomb or cross grid type.

[0039] Among them, high modulus polyimide composite material refers to a composite system formed by adding reinforcing fillers with polyimide resin as the matrix, for example, a composite of polyimide resin and carbon fiber or ceramic particles. This material achieves high mechanical strength and thermal stability through the synergistic effect of the molecular chain rigid structure and filler, and can inhibit the deformation of the frame unit 7 during high-temperature packaging, thereby maintaining a stable connection with the insulating base 1.

[0040] A honeycomb or cross-grid internal structure refers to a porous support system formed by regularly arranged pores or grid units. For example, hexagonal honeycomb holes or orthogonal cross grids are prepared by laser etching or compression molding. This type of structure forms multi-level supports through geometric topological design, which reduces its own weight while improving its compressive and shear resistance. Its continuous cavity can disperse the packaging stress and avoid interface cracking caused by local stress concentration.

[0041] Specifically, the frame unit 7 uses a high modulus polyimide composite material as the main body, which can withstand external mechanical stress and maintain structural integrity during the packaging process, avoiding connection failure due to softening or deformation of the material. The honeycomb or cross-grid internal structure optimizes the heat conduction path by increasing the contact area between the frame unit 7 and the insulating base 1, so that the heat generated during the packaging process can be quickly discharged through the high thermal conductivity of the composite material. In addition, the regularly arranged pores or grid units evenly disperse the thermal stress and reduce the shear stress caused by the difference in thermal expansion coefficient at the interface, thereby inhibiting the interface peeling phenomenon.

[0042] Further, if Fig. 2As shown, the connecting piece 8 is a metal heat-conducting column, the connecting piece 8 is a nickel-plated copper column with a diameter of 50-150 μm, the metal heat-conducting column can be provided in a spiral bolt structure, a spiral groove is formed on the outer wall of the metal heat-conducting column, and the spiral groove is used to form a spiral structure with the insulating base 1, so as to enhance the clamping force and the heat conduction capacity. The metal heat-conducting column can also be fixed on the insulating base 1 by adhesion or other ways. Similarly, the other end of the metal heat-conducting column can also be fixedly connected with the frame unit 7 by adhesion or other ways.

[0043] The metal heat-conducting column refers to a columnar heat-conducting component made of metal material, which can be specifically implemented by a nickel-plated copper column. The cylindrical structure of the metal heat-conducting column forms a continuous heat conduction channel while achieving mechanical fixation. The spiral bolt structure refers to a column with a spiral groove on the outer wall, which is inserted into the insulating base 1 in a rotating manner to form a spiral clamping interface. The geometric characteristics of the spiral groove increase the contact area and produce a mechanical interlocking effect. The spiral groove refers to a groove structure distributed circumferentially along the outer surface of the column, which can be specifically formed by machining or etching processes. The spiral distribution makes the heat conduction path form a continuous gradient. The adhesion fixation refers to the combination of the metal heat-conducting column and the insulating base 1 by conductive adhesive or solder. The adhesion fixation can be specifically implemented by silver paste or epoxy resin, and is fixed by the interfacial adhesion force.

[0044] Specifically, when the metal heat-conducting column adopts the spiral bolt structure, the spiral groove is threadedly formed with the inner wall of the insulating base 1 to form a spiral clamping. Under the action of axial pressure, radial expansion force is generated, so that a mechanical interlocking structure of multi-point contact is formed between the metal heat-conducting column and the insulating base 1. This interlocking structure effectively resists the shear stress caused by thermal cycling or mechanical vibration by increasing the frictional contact area.

[0045] At the same time, the continuous spiral heat conduction interface formed by the spiral groove allows heat to spread uniformly along the spiral path, avoiding local heat accumulation caused by traditional planar contact. When the adhesion fixation is adopted, the metal heat-conducting column is chemically bonded to the insulating base 1 by an adhesive. After the adhesive layer is cured, a uniform interfacial bonding layer is formed, which is suitable for packaging scenarios with low mechanical strength requirements.

[0046] It should be noted that the nickel-plated copper column refers to a columnar structure with a copper base and a nickel layer plated on the surface. The nickel layer can be formed on the surface of the copper column by electroplating process to achieve a dense nickel layer. The nickel layer can improve the oxidation resistance and enhance the bonding strength with adjacent materials. The diameter of 50 to 150 microns refers to the cross-sectional size range of the copper column, which can be controlled by precise machining or micro-forming process. This size range can balance the heat conduction efficiency and mechanical support requirements in a limited space.

[0047] Specifically, when the nickel-plated copper pillar is used as the connecting piece 8, the high thermal conductivity of the copper substrate enables the heat to be quickly transferred from the conductive polymer layer 4 to the frame unit 7, and the nickel-plated layer effectively prevents the copper from being oxidized to form an insulating layer under high-temperature environment, avoiding the interruption of the heat conduction path. The diameter of the pillar is controlled within the range of 50 to 150 microns, which not only ensures sufficient cross-sectional area to maintain low thermal resistance, but also avoids excessive diameter that causes stress concentration or insufficient mechanical strength. Under high-temperature or high-current working conditions, the nickel-plated copper pillar forms a stable heat conduction channel through its metal characteristics, while providing reliable mechanical fixation through physical contact between the pillar and the insulating substrate 1, suppressing the interface delamination caused by thermal expansion difference.

[0048] Further, the conductive polymer layer 4 has uniformly embedded conductive fillers, which include carbon nanotubes, conductive polymer composite particles, or metal micropowder.

[0049] Among them, the conductive filler refers to a conductive substance dispersed in the polymer matrix, which can be realized by one or a combination of carbon nanotubes, conductive polymer composite particles, or metal micropowder, embedded in the polymer layer by physical mixing or in-situ polymerization, and uniformly embedded to present a non-aggregated and continuous distribution form in the polymer matrix. Specifically, it can be realized by solution blending, ultrasonic dispersion, or mechanical stirring process, so that the filler spacing is controlled within the range of nanometers to microns.

[0050] Carbon nanotubes refer to one-dimensional nanomaterials with high aspect ratio, which can be realized by single-walled or multi-walled carbon nanotubes, and their dispersibility in polymers is enhanced by surface modification; conductive polymer composite particles refer to conductive polymer microparticles composed of polyaniline, polypyrrole, or polythiophene, which can be prepared by chemical oxidation polymerization or emulsion polymerization process, and form a core-shell structure to improve the interfacial compatibility; metal micropowder refers to micron-sized powder of silver, copper, or nickel, which can be prepared by ball milling or vapor deposition method, and is coated with an insulating layer to prevent oxidation.

[0051] Specifically, the conductive fillers are uniformly dispersed in the polymer matrix to form a three-dimensional conductive network. Carbon nanotubes are interconnected within the matrix by their high aspect ratio characteristics, forming a through electron migration path and reducing the charge transfer impedance. Conductive polymer composite particles promote carrier hopping conduction through the conjugation effect between molecular chains, improving local conductivity efficiency. Metal micropowder establishes a low-resistance channel with its intrinsic high conductivity to accelerate the discharge of static energy. The synergistic effect of the three fillers disperses the Joule heat generated during discharge in multiple dimensions, avoiding excessive heat accumulation in a single area. The uniform distribution of fillers ensures that the conductive network is continuously covered in space, maintaining the mechanical flexibility of the polymer layer and avoiding response delay caused by local conductive path breakage.

[0052] Finally, it should be noted that the above only describes the preferred embodiments of the present application and is not intended to limit the present application. Although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art will appreciate that the technical solutions described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalent ones. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A high surge ESD electrostatic suppressor, characterized in that: include: Insulating substrate (1); End electrodes (2) are symmetrically arranged on both sides of the substrate; A plurality of internal electrodes (3) are embedded in the insulating substrate (1), and the internal electrodes (3) are electrically connected to the conductive polymer layer (4); A conductive polymer layer (4) is provided between the plurality of internal electrodes (3) and is used for ESD energy absorption and conduction; Arrayed convex point units (5) are provided between the conductive polymer layer (4) and the internal electrode (3); The connection interface between the insulating substrate (1) and the conductive polymer layer (4) is respectively provided with a transition interface (6); A frame unit (7) is provided above the insulating base (1) and is coated on the outside of the conductive polymer layer (4). Both ends of the frame unit (7) are overlapped on the top of the terminal electrode (2). The frame unit (7) and the insulating base (1) are connected to each other through a connector (8). The terminal electrode (2) and the internal electrode (3) are respectively provided with through holes at positions corresponding to the connector (8).

2. A high surge ESD suppressor according to claim 1, characterized in that: The convex point unit (5) is made of polydimethylsiloxane material.

3. A high surge ESD suppressor according to claim 2, characterized in that: The convex point units (5) are columnar or spherical, have a maximum cross-sectional diameter of 3 to 10 μm, and are distributed in the contact area between the conductive polymer and the internal electrode (3).

4. The high surge ESD suppressor according to claim 1, characterized in that: The transition interface (6) is in a sawtooth or corrugated shape with a periodic structure. In each period, the length of the transition interface (6) is 10 to 50 μm, and the height is 3 to 10 μm.

5. The high surge ESD suppressor according to claim 1, characterized in that: The frame unit (7) is made of a polyimide composite material, and its internal structure is a honeycomb or cross-grid type.

6. The high surge ESD suppressor according to claim 1, characterized in that: The connecting piece (8) is a metal heat-conducting column.

7. The high surge ESD suppressor according to claim 6, characterized in that: The connecting piece (8) is a nickel-plated copper column with a diameter of 50-150 μm.

8. The high surge ESD suppressor according to claim 1, characterized in that: The conductive polymer layer (4) has uniformly embedded conductive fillers, and the conductive fillers include carbon nanotubes, conductive polymer composite particles or metal powders.

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