Vertically stacked power module structure and its manufacturing method, equipment, and medium

Abstract

The present application discloses a vertically stacked power module structure and its manufacturing method, equipment, and medium. The vertically stacked power module structure includes a chip, a PCB frame layer, an inductor structure, and a PCB circuit layer. The inductor structure is embedded in the PCB frame layer, and the chip is mounted on the top of the PCB circuit layer. The inductor structure includes an inductor winding, a magnet, and a metal frame, wherein the magnet wraps the inductor winding to form a rectangular inductor body, and the metal frame covers multiple outer side surfaces of the rectangular inductor body to form a magnetic shielding layer. The PCB circuit layer is located at the top and bottom of the PCB frame layer and is composed of a dielectric layer, a copper conductive layer, copper through-holes, and a solder mask layer. The dielectric layer of the PCB frame layer is provided with copper through-holes at positions corresponding to the winding terminals of the inductor structure on the adjacent copper conductive layer, and copper through-holes are provided at positions corresponding to the metal frame of the inductor structure on the adjacent copper conductive layer. By designing the inductor shielding layer and the PCB through-hole structure, electromagnetic shielding and heat dissipation enhancement are achieved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor packaging, and in particular to a vertically stacked power module structure and its manufacturing method, equipment, and medium. Background Art

[0002] With the continuous development of semiconductor technology, in the field of highly integrated power chip packaging, in order to adapt to the ever-shrinking terminal equipment, it is necessary to design power chips or modules to occupy as little space as possible.

[0003] Therefore, the industry has proposed a method of vertically stacking components to further reduce the plane space.

[0004] The inventors discovered that, on the one hand, the control signal interconnection of the switching power supply module integrated with the digital power control chip is sensitive to electromagnetic interference. When the inductor is assembled with these chips into a highly integrated power supply module, the distance between the inductor and these signals is shortened, and its electromagnetic field can easily affect the control signal, especially in high-current applications. Therefore, the inductor needs to be electromagnetically shielded to improve the stability of the power supply module. On the other hand, in order to pursue a smaller size, the heat dissipation density of the highly integrated power supply module increases, and it is necessary to provide a heat dissipation channel for the chip as much as possible to ensure its normal operation. The application of PCB embedding technology to improve the integration of the power supply module will cause the heat dissipation path of the chip itself to become longer, making it risky to overheat. Therefore, a more sophisticated heat dissipation design is required. Summary of the Invention

[0005] In order to solve the problem of how to provide a vertically stacked power module structure in the prior art to meet the requirements of electromagnetic shielding and enhanced heat dissipation in magnetic integrated power modules, the technical solution of this application is as follows:

[0006] On the one hand, a vertically stacked power module structure is provided, comprising: a chip, a PCB frame layer, an inductor structure, and a PCB circuit layer. The inductor structure is embedded in the PCB frame layer, and the PCB circuit layer covers the top and bottom of the PCB frame layer to form a PCB as a whole. The chip is mounted on the top of the PCB as a whole.

[0007] The inductor structure includes an inductor winding, a magnet and a metal frame, wherein the magnet wraps the inductor winding to form a rectangular inductor body, and the metal frame covers multiple outer sides of the rectangular inductor body to form a magnetic shielding layer;

[0008] The PCB circuit layer is provided with a dielectric layer, a copper conductive layer, and a solder resist layer from the inside out;

[0009] The solder mask layer is located on the outermost layer of the PCB circuit layer to form a pad pattern that matches the chip pins;

[0010] The dielectric layer is provided with copper through holes at positions corresponding to the adjacent copper conductive layer and the winding terminals of the inductor structure, so as to form electrical interconnection between the winding terminals and the copper conductive layer and enhance heat dissipation;

[0011] The dielectric layer is provided with copper through holes at positions corresponding to the adjacent copper conductive layer and the metal frame of the inductor structure, so as to enhance heat dissipation between the metal frame and the copper conductive layer.

[0012] The metal frame is a thin sheet type, and includes one or more metal sheets.

[0013] There are one or more inductor windings.

[0014] The copper through hole includes any one or more of a solid hole slot and a surface copper-clad hole slot.

[0015] On the other hand, a method for manufacturing the vertically stacked power module structure is provided, comprising the steps of:

[0016] S31: fabricating an inductor structure with a magnetic shielding layer;

[0017] S32: preparing a PCB frame layer, and embedding the inductor structure in the PCB frame layer;

[0018] S33: Embedding and coating the PCB frame layer;

[0019] S34: Make the PCB circuit layer, including the copper conductive layer, dielectric layer and solder mask layer. At the same time, make copper through holes according to the design to form the electrical circuit and the thermal conductive hole connected to the magnetic shielding layer.

[0020] S35: Chips and components are mounted to complete the production of the vertically stacked power module.

[0021] The steps for making an inductor structure with a magnetic shielding layer include: assembling a metal sheet on the periphery of the magnet of the inductor winding, and the assembly method includes pasting, molding, or using a metal plating process to achieve metal coverage on the surface of the inductor.

[0022] The steps of making the inductor structure with the magnetic shielding layer include: prefabricating the metal sheet into a specific wrapping shape and then performing electromagnetic shielding assembly.

[0023] Among them, the production method is full-plate production, and multiple inductor structures are embedded at the same time.

[0024] On the other hand, a device for manufacturing a vertically stacked power module structure is provided, comprising a memory and a processor coupled to each other, wherein the processor is configured to execute program instructions stored in the memory to implement the above-mentioned method for manufacturing the vertically stacked power module structure.

[0025] On the other hand, a computer-readable storage medium is provided, on which program instructions are stored. When the program instructions are executed by a processor, the manufacturing method of the vertically stacked power module structure is implemented.

[0026] The beneficial effects of the present application are: providing a vertically stacked power module structure, comprising: a chip, a PCB frame layer, an inductor structure, and a PCB circuit layer, wherein the inductor structure is embedded in the PCB frame layer, and the chip is mounted on top of the PCB circuit layer; the inductor structure comprises an inductor winding, a magnet, and a metal frame, wherein the magnet wraps the inductor winding to form a rectangular inductor body, and the metal frame covers multiple outer side surfaces of the rectangular inductor body to form a magnetic shielding layer; the PCB circuit layer is located at the top and bottom of the PCB frame layer, and is composed of a dielectric layer, a copper conductive layer, copper through-holes, and a solder mask layer. The dielectric layer of the PCB frame layer is provided with copper through-holes at positions corresponding to the winding terminals of the inductor structure on the adjacent copper conductive layer, and copper through-holes are provided at positions corresponding to the metal frame of the inductor structure on the adjacent copper conductive layer. By forming electromagnetic shielding and providing through-holes, a heat conduction channel is formed when the inductor is embedded in the PCB magnetic integration, thereby achieving an enhanced heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 This is a schematic structural diagram of an embodiment of the inductor structure of the present application;

[0028] Figure 2 This is a flow chart of an embodiment of a method for manufacturing an inductor structure of the present application;

[0029] Figure 3 This is a sub-flow diagram of an embodiment of a method for manufacturing an inductor structure of the present application;

[0030] Figure 4 yes Figure 3 Schematic diagram of the corresponding structural changes;

[0031] Figure 5 This is a sub-flow diagram of an embodiment of a method for manufacturing an inductor structure of the present application;

[0032] Figure 6 yes Figure 5 Schematic diagram of the corresponding structural changes;

[0033] Figure 7 This is a schematic structural diagram of an embodiment of the inductor structure of the present application;

[0034] Figure 8 yes Figure 7 A schematic flow chart of an embodiment of a corresponding manufacturing method of the inductor structure;

[0035] Figure 9 yes Figure 8 Corresponding structural decomposition diagram;

[0036] Figure 10 This is a structural diagram of an embodiment of a vertically stacked power module structure of the present application;

[0037] Figure 11 This is a schematic structural diagram of an embodiment of the inductor structure metal frame of the present application with six sides continuously covered;

[0038] Figure 12 This is a schematic structural diagram of an embodiment of the present invention in which the metal frame of the inductor structure is non-continuously covered on four sides;

[0039] Figure 13 This is a structural diagram of an embodiment of the prefabricated wrapped shape of the inductor structure metal frame of the present application;

[0040] Figure 14 This is a flow chart of an embodiment of a method for manufacturing a vertically stacked power module structure of the present application;

[0041] Figure 15A This is a schematic top view of an embodiment of a single-phase module of a vertically stacked power module structure of the present application;

[0042] Figure 15B This is a schematic top view of an embodiment of a vertically stacked power module structure of a dual-phase module and an N-phase module of the present application;

[0043] Figure 15C This is a schematic diagram of the structural changes of an embodiment of a method for manufacturing a vertically stacked power module structure of the present application;

[0044] Figure 15D This is a schematic diagram of the structural changes of an embodiment of a method for manufacturing a vertically stacked power module structure of the present application;

[0045] Figure 15E This is a schematic diagram of the structural changes of an embodiment of a method for manufacturing a vertically stacked power module structure of the present application;

[0046] Figure 15F This is a schematic diagram of the structural changes of an embodiment of a method for manufacturing a vertically stacked power module structure of the present application;

[0047] Figure 15G This is a schematic diagram of the structural changes of an embodiment of a method for manufacturing a vertically stacked power module structure of the present application;

[0048] Figure 15H This is a schematic diagram of the structural changes of an embodiment of a method for manufacturing a vertically stacked power module structure of the present application;

[0049] Figure 15I This is a schematic diagram of the structural changes of an embodiment of a method for manufacturing a vertically stacked power module structure of the present application;

[0050] Figure 15J This is a schematic diagram of the structural changes of an embodiment of a method for manufacturing a vertically stacked power module structure of the present application;

[0051] Figure 16 This is a schematic diagram of a framework of an embodiment of a device for manufacturing a vertically stacked power module structure provided by the present application;

[0052] Figure 17 It is a schematic diagram of a framework of an embodiment of a computer-readable storage medium provided by this application. DETAILED DESCRIPTION

[0053] To facilitate understanding of the present application, the present application is described in more detail below with reference to the accompanying drawings and specific embodiments. The accompanying drawings provide preferred embodiments of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described in this specification. Rather, the purpose of providing these embodiments is to provide a more thorough and comprehensive understanding of the disclosure of the present application.

[0054] It should be noted that, unless otherwise defined, all technical and scientific terms used in this specification have the same meanings as those commonly understood by those skilled in the art to which this application belongs. The terms used in this specification are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0055] The following are definitions of the professional terms used in the examples of this application:

[0056] Digital power module: A digital-analog hybrid electronic module designed and manufactured based on power topology to provide power energy conversion.

[0057] Chip: integrated circuit carrier.

[0058] Vertical stacking: A form of integration in which chips and other electronic devices are stacked in the vertical direction.

[0059] Packaging: Integrating one or more chips and other electronic devices into one and achieving electrical interconnection with peripheral circuits.

[0060] Magnetic integrated power module: The inductor package is integrated into the power module, so that the application power module does not need to be configured with an external inductor.

[0061] Molded inductor: An inductor formed by molding a soft magnetic powder core and a copper conductor through pressing equipment and a mold, and then undergoing heat treatment and other steps.

[0062] Metal frame: A thin metal sheet with a specific shape and structure that can achieve functions such as electrical interconnection and heat dissipation, usually made of copper.

[0063] SMT surface mounting: The process of using automated equipment and a steel mesh with a specific shape to apply solder paste or other connecting materials, place components, and fix the materials by melting and solidifying.

[0064] Sintered metal: Utilizing the strong activation of the surface of metal nanoparticles, a stable structure is formed through solid-state bonding between nanoparticles at a temperature much lower than the melting point of the metal. Common examples include silver and copper nanoparticles.

[0065] Sintering: Heat treatment is performed on the inductor according to the material properties to form a dense structure inside.

[0066] The specific contents of this application are described in detail below with reference to specific embodiments.

[0067] The present application relates to a power module form and manufacturing method, specifically to a power module design and manufacturing method based on a PCB embedded process and a copper interconnection process, and in conjunction with an inductor structure with magnetic shielding, heat dissipation, and electrical interconnection functions based on molding and metal frame manufacturing, ultimately realizing a high-performance power module and corresponding implementation method.

[0068] The inventors have found that in the packaging of high-power-density, high-integration digital power modules, some new requirements are put forward for the packaging structure and inductance. The main issues are described as follows:

[0069] 1. The magnetically integrated digital power module needs to integrate the power part and the control part in a limited volume. As the power density of the power module increases and the distance between the power part and the control part inside the module decreases, the control signal inside the power module is easily interfered by the power part, causing the power module to work unstable.

[0070] 2. Common inductors are mainly used in planar power circuit structures and are not suitable for highly integrated power modules with vertical stacking structures.

[0071] 3. The vertically stacked magnetic integrated power module packaging design concept poses a challenge to the interconnection method of inductors, resulting in the need for inductor terminals to be located on different surfaces and the design requirement for electromagnetic shielding.

[0072] In light of this, this application provides an inductor manufacturing method that implements electrical interconnect design and is compatible with established compression-molded inductor manufacturing methods and semiconductor processes. Advanced system-level packaging (SLP) requires device dimensional accuracy that exceeds the typical capabilities of inductor manufacturing, limiting the flexibility of package design. The electrode reconstruction method provided by this invention can address this precision mismatch and enhance design flexibility.

[0073] on the one hand, Figure 1 This is a schematic diagram of the structure of an embodiment of the inductor structure of the present application, refer to Figure 1 As shown, the present application provides an inductor structure, including: an inductor winding 103, a magnet 102 and a metal frame 101, wherein the magnet 102 wraps the inductor winding 103 to form a rectangular inductor body, and the metal frame 101 covers the top and / or bottom of the rectangular inductor body and is connected to the inductor winding 103 terminals extended and bent to the top and / or bottom of the rectangular inductor body.

[0074] By providing a metal frame at the top and / or bottom, the flexibility of connecting the inductor to other devices can be expanded, while also improving heat dissipation efficiency. This inductor structure significantly enhances the inductor's electrical interconnection and heat dissipation capabilities, allowing the inductor to provide functions beyond electromagnetics.

[0075] The metal frame 101 is in a thin sheet shape, and the width of the metal frame 101 is greater than the width of the terminals of the inductor winding 103 .

[0076] Although it is also possible to set the inductor terminal on the top by extending the inductor winding and bending it, the inductor winding is relatively thin, and this method easily leads to a decrease in the flatness of the winding. The metal frame can be set to a width larger than the inductor winding, thereby meeting more flexible electrical interconnection needs.

[0077] on the other hand, Figure 2 FIG. 1 is a flow chart of an embodiment of a method for manufacturing an inductor structure of the present application. Figure 2 As shown, the present application provides a method for manufacturing the above-mentioned inductor structure, comprising the steps of:

[0078] S11: manufacturing the copper material into an inductor winding of a fixed shape, wherein the fixed shape includes any one of the following: Z-shape, I-shape, U-shape, C-shape, and spiral shape;

[0079] S12: placing the inductor winding into the mold cavity, loading magnetic powder, and pre-pressing it to maintain a certain shape and expose the inductor winding terminals;

[0080] S13: Mounting sheet metal frame;

[0081] S14: After pressing and forming, sintering is performed to form the magnetic powder into a solid whole. At the same time, the sintered material solidifies to form good connection and conductivity.

[0082] The fixed shape may also include other shapes, which are adjusted according to the inductor design requirements.

[0083] in, Figure 3 This is a sub-flow diagram of an embodiment of a method for manufacturing an inductor structure of the present application. Figure 3 As shown, the step S13 of mounting the thin metal frame includes:

[0084] S1311: Use a steel mesh that matches the inductor winding end to apply sintered nano-metal material, or use glue dispensing to apply material at a designated location on the inductor winding end.

[0085] S1312: Mount the sheet metal frame at the designated position of the inductor winding end.

[0086] Figure 4 yes Figure 3 The corresponding structural change diagram is as follows: Figure 4 As shown, a schematic diagram of the structural changes of the entire process of the above method is shown, specifically including:

[0087] 1. Make the winding into a fixed shape;

[0088] 2. Bend the winding ends so that the terminal at one end faces vertically upward and the terminal at the other end faces vertically downward;

[0089] 3. Fill and pre-press the magnetic powder to expose the inductor winding terminals;

[0090] 4. Apply sintering material to the terminal;

[0091] 5. Install the thin metal frame at the corresponding position;

[0092] 6. Pressing molding + sintering.

[0093] in, Figure 5 FIG. 1 is a schematic diagram of a sub-flow diagram of another embodiment of the method for manufacturing the inductor structure of the present application. Figure 5 As shown, the step S13 of mounting the thin metal frame includes:

[0094] S1321: Coating the sintered nano-metal material on the thin metal frame, attaching the preformed inductor to the designated position of the metal frame, then sintering and curing the nano-metal once, and then dividing;

[0095] S1322: The split inductor is surface mounted on another metal frame and pressed into shape and sintered to complete the connection on the other side.

[0096] Figure 6 yes Figure 5 The corresponding structural change diagram is as follows: Figure 6 As shown, a schematic diagram of the structural changes of the entire process of the above method is shown, specifically including:

[0097] 1. Make the winding into a fixed shape;

[0098] 2. Bend the winding ends so that the terminal at one end faces vertically upward and the terminal at the other end faces vertically downward;

[0099] 3. Fill and pre-press the magnetic powder to expose the inductor winding terminals;

[0100] 4. Apply the sintered material on the metal frame;

[0101] 5. Mount the inductor to the metal frame on one side;

[0102] 6. Flip the inductor over and mount it to the metal frame on the other side for the second time.

[0103] 7. Pressing and sintering.

[0104] On the other hand, Figure 7 This is a schematic structural diagram of an embodiment of the inductor structure of the present application;

[0105] refer to Figure 7 The present application also provides an inductor structure, including: an inductor winding 103, a magnet 102, a metal connecting piece 104 and a metal frame 101, wherein the magnet 102 wraps the inductor winding 103 and the metal connecting piece 104 to form a rectangular inductor body, the metal connecting piece 104 is located on the outer peripheral surface of the rectangular inductor body, and the metal frame 101 covers the top and / or bottom of the rectangular inductor body, and is connected to the inductor winding 103 terminals and the metal connecting piece 104 terminals extended and bent to the top and / or bottom of the rectangular inductor body.

[0106] The metal sheet around the inductor is used to expand the flexibility of electrical interconnection. The top and bottom are mounted through a metal frame to achieve conduction, or the inductor body is used to achieve heat dissipation.

[0107] It can be seen that by introducing the metal connecting piece on the peripheral surface, the flexibility of the electrical interconnection of the inductor can be further improved, and the heat dissipation effect can be enhanced.

[0108] There are multiple metal frames 101 , and the metal frames 101 located at the top and bottom of the rectangular parallelepiped inductor body have different shapes and arrangements.

[0109] Among them, the number and arrangement of metal frames and metal connecting plates can be flexibly changed to meet different electrical interconnection requirements, inductance performance requirements and heat dissipation requirements.

[0110] On the other hand, Figure 8 yes Figure 7 FIG. 1 is a flow chart of an embodiment of a corresponding manufacturing method of the inductor structure.

[0111] refer to Figure 8 As shown, the present application also provides a method for manufacturing the above-mentioned inductor structure, comprising the steps of:

[0112] S21: manufacturing the copper material into an inductor winding of a fixed shape, wherein the fixed shape includes any one of the following: Z-shape, I-shape, U-shape, C-shape, and spiral shape;

[0113] S22: placing the inductor winding and the corresponding metal connecting piece terminal into the mold cavity, and loading magnetic powder, and pre-pressing it to maintain a certain shape and expose the inductor winding and the metal connecting piece terminal;

[0114] S23: Use a steel mesh that matches the inductor winding end and the metal connecting piece end to apply sintered nano-metal material, or use a dispensing method to apply material at designated locations on the inductor winding end and the metal connecting piece end; then attach a thin metal frame to the designated locations on the inductor winding end and the metal connecting piece end;

[0115] S24: After pressing and forming, sintering is performed to form the magnetic powder into a solid whole. At the same time, the sintered material solidifies to form good connection and conductivity.

[0116] The fixed shape may also include other shapes, which are adjusted according to the inductor design requirements.

[0117] For details, please refer to Figure 9 , Figure 9 yes Figure 8 The corresponding structural decomposition diagram. Figure 9 As can be seen in the figure, the metal frames at the top and bottom of the inductor structure have different shapes, and by connecting them with the metal connecting pieces on the outer surface of the inductor body, various electrical connection requirements can be met.

[0118] Based on the above solution, the above inductor structure can be further packaged into a PCB and mounted with the chip to form a vertically stacked power module structure. The following is a specific embodiment:

[0119] On the other hand, reference Figure 10 and Figure 15J As shown, the present application provides a vertically stacked power module structure, comprising:

[0120] Chip 201, PCB frame layer 204, inductor structure and PCB circuit layer. The inductor structure is embedded in the PCB frame layer 204. The PCB circuit layer covers the top and bottom of the PCB frame layer 204 and forms the entire PCB. Chip 201 is mounted on the top of the entire PCB.

[0121] The inductor structure includes an inductor winding 103, a magnet 102, and a metal frame 101. The magnet 102 wraps the inductor winding 103 to form a rectangular inductor body, and the metal frame 101 covers multiple outer sides of the rectangular inductor body to form a magnetic shielding layer.

[0122] The PCB circuit layer is provided with a dielectric layer 203, a copper conductive layer 205, and a solder resist layer 206 from the inside to the outside;

[0123] The solder resist layer 206 is located on the outermost layer of the PCB circuit layer to form a pad pattern that matches the pins of the chip 201;

[0124] The dielectric layer 203 is provided with a copper through hole 202 at a position corresponding to the position of the copper conductive layer 205 adjacent to the dielectric layer 203 and the terminal of the inductor winding 103 of the inductor structure (refer to Figure 15J The first copper through hole on the lower left side) is provided to allow the inductor winding 103 terminal to be electrically interconnected with the copper conductive layer 205 and to enhance heat dissipation;

[0125] The dielectric layer 203 is provided with copper through holes 202 at positions corresponding to the adjacent copper conductive layer 205 and the metal frame 101 of the inductor structure (refer to Figure 15J The 2nd to 5th copper through holes on the lower left side) are provided to enhance heat dissipation between the metal frame 101 and the copper conductive layer.

[0126] Among them, the purpose of the magnetic shielding layer composed of metal is not only to form electromagnetic shielding, but also to form a heat conduction channel when the inductor is embedded in the PCB magnetic integration.

[0127] This is because, in the design of a mixed digital-analog switching power supply module, due to the integration of a digital power control chip, its control signal is very sensitive to electromagnetic interference. When the inductor and these chips are assembled into a highly integrated power supply module (such as the vertically stacked power supply module structure described in this application), the distance between the inductor and these signals becomes increasingly smaller, resulting in the electromagnetic field of the inductor being extremely likely to affect the control signal emitted by the digital power control chip, especially in high current applications. Therefore, the inductor needs to be electromagnetically shielded to improve the stability of the power supply module.

[0128] Furthermore, in pursuit of smaller size, highly integrated power modules have a dramatically increased heat dissipation density, necessitating the provision of as much heat dissipation channels as possible for the chip to ensure proper operation. However, using PCB embedding technology to increase the integration of power modules inherently lengthens the chip's heat dissipation path, increasing the risk of overheating. Therefore, a more sophisticated heat dissipation design is required.

[0129] This application demonstrates a method and form for implementing a vertically stacked, highly integrated power module using a PCB embedding process. This form can be applied to the design of mixed-analog switching power modules. The key concept is to achieve electromagnetic shielding and enhanced heat dissipation through the design of an inductor shielding layer and PCB through-hole structures.

[0130] Among them, reference Figure 11 、 Figure 12 As shown, the metal frame is a thin sheet type, comprising one or more thin metal sheets. The wrapping method can be a continuous wrapping of six sides around the rectangular inductor body, or a discontinuous wrapping of four sides around the rectangular inductor body. The optimal wrapping scheme can be designed based on electromagnetic field analysis.

[0131] Further, refer to Figure 13 As shown, the metal frame can also be designed as a prefabricated package shape and then assembled to further improve assembly efficiency.

[0132] There are multiple inductor windings, and multiple inductor windings can be set in the same inductor structure according to actual needs.

[0133] The copper through hole includes any one or more of a solid hole slot and a surface copper-clad hole slot. The hole slot described in this application includes any one of a hole and a slot.

[0134] On the other hand, reference Figure 14 As shown, a method for manufacturing the above-mentioned vertically stacked power module structure is provided, comprising the steps of:

[0135] S31: fabricating an inductor structure with a magnetic shielding layer;

[0136] S32: preparing a PCB frame layer and embedding the inductor structure in the PCB frame layer;

[0137] S33: Embed and coat the PCB frame layer to form a dielectric layer;

[0138] S34: Make the PCB circuit layer, including the copper conductive layer, dielectric layer and solder mask layer. At the same time, make copper through holes according to the design to form the electrical circuit and the thermal conductive hole connected to the magnetic shielding layer.

[0139] S35: Chip and component placement to complete the vertical stacked power module production.

[0140] The step S31 of manufacturing the inductor structure with the magnetic shielding layer is described in detail with reference to the various methods in the aforementioned inductor structure embodiments, which will not be described in detail here.

[0141] Furthermore, step S31 of manufacturing the inductor structure with a magnetic shielding layer includes: assembling a metal sheet on the periphery of the magnet of the inductor winding, and the assembling method includes pasting, molding, or using a metal plating process to achieve metal coverage on the surface of the inductor.

[0142] Furthermore, the steps for making the inductor structure with the magnetic shielding layer include: prefabricating the metal sheet into a specific wrapped shape and then assembling the electromagnetic shielding; or forming a specific pattern and then performing metal plating.

[0143] In order to improve efficiency, the above-mentioned production method is a full-plate production in actual production, that is, multiple inductor structures are embedded into the PCB frame layer at the same time.

[0144] Furthermore, Figures 15A to 15JThe specific structural change diagram is shown. This process belongs to the industry's advanced PCB process, and this structure that can achieve both electromagnetic shielding and improved thermal conductivity has not been seen before. This embodiment takes the example of embedding a single-winding inductor to produce a magnetic integrated power module. Figures 15A to 15G The diagrams shown are schematic cross-sections of a single inductor. Actual production can involve full-panel production with multiple inductors embedded. It should be noted that this example illustrates a module with only one outer layer of copper; similar structures can be achieved with multiple layers of copper.

[0145] Specifically, Figure 15A 、 Figure 15B This is a top view of an embodiment of the vertically stacked power module structure of this application. The upper row is the control chip, the lower row is the power chip, and the rest are passive components such as resistors and capacitors. Figure 15A For single-phase modules, Figure 15B The left picture in the middle is a two-phase module, and the right picture is a four-phase or N-phase module.

[0146] FIG. 15C to FIG. 15I for Figure 15A Section B of the middle module, Figure 15J for Figure 15A Schematic diagram of section A of the middle module.

[0147] FIG. 15C to FIG. 15I The structural changes during the manufacturing process of the above method are shown, wherein the difference between the right figure and the left figure in some drawings is that a copper through hole 202 is added in the medium outside the inductor structure of the PCB frame layer.

[0148] Figure 15C To obtain a cross-sectional view of an inductor structure with a magnetic shielding layer.

[0149] Figure 15D A cross-sectional diagram of preparing a PCB frame and embedding the inductor in the PCB.

[0150] Figure 15E For embedded cladding, a cross-sectional view of the dielectric layer is made.

[0151] Figure 15F The cross-sectional diagram of copper hole production is shown, including the formation of electrical circuits and thermal conductive holes connected to the magnetic shielding layer. It can be a solid hole slot or a surface copper-clad hole slot, and there is no restriction on the hole size or copper thickness.

[0152] Figure 15G Demonstrates the copper conductive layer used in making PCB circuit layers.

[0153] Figure 15H Demonstrates the production of solder mask in PCB circuit layer.

[0154] Figure 15I The overall structure after chip mounting is completed is shown.

[0155] Furthermore, the PCB frame layer is formed by pressing a single dielectric layer or multiple dielectric layers. According to electrical design requirements, copper conductive layers can also be added between the multiple dielectric layers to form more electromagnetic shielding.

[0156] Furthermore, if Figure 15D 、 Figure 15E As shown, a specific portion of the PCB frame layer is removed to form a space for embedding the inductor structure. After the inductor structure is placed in the space, a dielectric layer material is added to cover the inductor structure and fill the gap in the space (this is also the function of the dielectric layer 203 close to the inductor structure), completing the embedding and encapsulation.

[0157] Furthermore, the dielectric layer and the copper conductive layer can be a stacked structure that overlaps each other. Depending on the electrical interconnection design, the number of stacked layers can be multiple layers; multiple layers of non-coplanar copper conductive layers can be electrically interconnected through copper through-holes.

[0158] Further, refer to Figure 15I the right side of Figure 15J As shown, copper through holes may be provided at corresponding positions of the dielectric material between the copper conductive layer 205 , the metal frame 101 of the inductor structure, and the copper conductive layer 205 in the PCB frame layer 204 , thereby enhancing the heat dissipation effect.

[0159] Furthermore, according to the electrical interconnection design, the terminals of the inductor winding extended and bent to the outer side surface of the rectangular inductor body can be connected to the magnetic shielding layer (not shown in the figure), thereby realizing diversified electrical interconnection.

[0160] It can be seen that the present application innovatively proposes an inductor shielding layer design and a thermal conductive design in which the PCB is interconnected with the inductor shielding layer through copper through-holes, while realizing an inductor embedded in a PCB magnetic integrated power module with optimized electromagnetic shielding and thermal conductivity.

[0161] On the other hand, the present application also provides a vertically stacked power module structure manufacturing device, including a memory and a processor coupled to each other, and the processor is used to execute program instructions stored in the memory to implement the above-mentioned vertically stacked power module structure manufacturing method.

[0162] Specifically, see Figure 16 The vertical stacked power module structure manufacturing device 200 of the present application may specifically include a processor 210 and a memory 220 . The memory 220 is coupled to the processor 210 .

[0163] Processor 210 is used to operate the vertically stacked power module structure manufacturing apparatus 200. Processor 210 may also be referred to as a CPU (Central Processing Unit). Processor 210 may be an integrated circuit chip with signal processing capabilities. Processor 210 may also be a general-purpose processor, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), or other programmable logic device, a discrete gate or transistor logic device, or a discrete hardware component. A general-purpose processor may be a microprocessor, or processor 210 may be any conventional processor.

[0164] The memory 220 is used to store computer programs and can be RAM, ROM, or other types of storage devices. Specifically, the memory can include one or more computer-readable storage media, which can be non-transitory. The memory can also include high-speed random access memory and non-volatile memory, such as one or more disk storage devices and flash memory storage devices. In some embodiments, the non-transitory computer-readable storage medium in the memory is used to store at least one program code.

[0165] The processor 210 is configured to execute the computer program stored in the memory 220 to implement the methods described in the various method embodiments of the present application.

[0166] In some embodiments, the vertically stacked power module structure manufacturing apparatus 200 may further include a peripheral device interface 230 and at least one peripheral device. The processor 210, memory 220, and peripheral device interface 230 may be connected via a bus or signal lines. Each peripheral device may be connected to the peripheral device interface 230 via a bus, signal lines, or circuit boards. Specifically, the peripheral device may include at least one of a radio frequency circuit 240, a display screen 250, an audio circuit 260, and a power supply 270.

[0167] The peripheral device interface 230 can be used to connect at least one I / O (Input / Output)-related peripheral device to the processor 210 and the memory 220. In some embodiments, the processor 210, the memory 220, and the peripheral device interface 230 are integrated on the same chip or circuit board; in some other embodiments, any one or two of the processor 210, the memory 220, and the peripheral device interface 230 can be implemented on separate chips or circuit boards, which is not limited in this embodiment.

[0168] The RF circuit 240 is used to receive and transmit RF (Radio Frequency) signals, also known as electromagnetic signals. The RF circuit 240 communicates with communication networks and other communication devices via electromagnetic signals. The RF circuit 240 serves as the communication circuit for the vertically stacked power module structure manufacturing apparatus 200. The RF circuit 240 converts electrical signals into electromagnetic signals for transmission, or converts received electromagnetic signals into electrical signals. Optionally, the RF circuit 240 includes an antenna system, an RF transceiver, one or more amplifiers, a tuner, an oscillator, a digital signal processor, a codec chipset, a user identity module card, and the like. The RF circuit 240 can communicate with other terminals via at least one wireless communication protocol. Such wireless communication protocols include, but are not limited to, the World Wide Web, metropolitan area networks, intranets, various generations of mobile communication networks (2G, 3G, 4G, and 5G), wireless local area networks, and / or WiFi (Wireless Fidelity) networks. In some embodiments, the RF circuit 240 may also include circuitry related to Near Field Communication (NFC), although this application does not limit this.

[0169] The display screen 250 is used to display a UI (User Interface). The UI may include graphics, text, icons, videos, or any combination thereof. When the display screen 250 is a touch screen display, the display screen 250 is also capable of collecting touch signals on or above the surface of the display screen 250. The touch signals can be input as control signals to the processor 210 for processing. In this case, the display screen 250 can also be used to provide virtual buttons and / or virtual keyboards, also known as soft buttons and / or soft keyboards. In some embodiments, there can be one display screen 250, disposed on the front panel of the vertically stacked power module structure manufacturing apparatus 200; in other embodiments, there can be at least two display screens 250, disposed on different surfaces of the vertically stacked power module structure manufacturing apparatus 200 or in a folding design; in still other embodiments, the display screen 250 can be a flexible display, disposed on a curved surface or a folding surface of the vertically stacked power module structure manufacturing apparatus 200. Furthermore, the display screen 250 can be configured as a non-rectangular irregular shape, i.e., a special-shaped screen. The display screen 250 can be made of materials such as LCD (Liquid Crystal Display) and OLED (Organic Light-Emitting Diode).

[0170] The audio circuit 260 may include a microphone and a speaker. The microphone is used to collect sound waves from the user and the environment, and convert the sound waves into electrical signals and input them into the processor 210 for processing, or input them into the radio frequency circuit 240 to achieve voice communication. For the purpose of stereo acquisition or noise reduction, there can be multiple microphones, which are respectively arranged at different parts of the vertically stacked power module structure manufacturing equipment 200. The microphone can also be an array microphone or an omnidirectional acquisition type microphone. The speaker is used to convert the electrical signal from the processor 210 or the radio frequency circuit 240 into sound waves. The speaker can be a traditional thin film speaker or a piezoelectric ceramic speaker. When the speaker is a piezoelectric ceramic speaker, it can not only convert the electrical signal into sound waves audible to humans, but also convert the electrical signal into sound waves inaudible to humans for purposes such as ranging. In some embodiments, the audio circuit 260 may also include a headphone jack.

[0171] Power supply 270 is used to power the various components in vertically stacked power module structure manufacturing apparatus 200. Power supply 270 can be AC power, DC power, a disposable battery, or a rechargeable battery. When power supply 270 includes a rechargeable battery, the rechargeable battery can be a wired rechargeable battery or a wireless rechargeable battery. A wired rechargeable battery is charged via a wired line, while a wireless rechargeable battery is charged via a wireless coil. The rechargeable battery can also be used to support fast charging technology.

[0172] For a detailed description of the functions and execution processes of each functional module or component in the embodiment of the intelligent control platform of the present application, please refer to the description in the above-mentioned embodiment of each method of the present application, which will not be repeated here.

[0173] In the several embodiments provided in this application, it should be understood that the disclosed intelligent control platform and method can be implemented in other ways. For example, the various embodiments of the intelligent control platform described above are merely illustrative. For example, the division of modules or units is only a logical function division. In actual implementation, there may be other division methods, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be an indirect coupling or communication connection through some interfaces, devices or units, which can be electrical, mechanical or other forms.

[0174] Units described as separate components may or may not be physically separate, and components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of these units may be selected to achieve the purpose of this embodiment according to actual needs.

[0175] In addition, the functional units in the various embodiments of the present application may be integrated into a single processing unit, or each unit may exist physically separately, or two or more units may be integrated into a single unit. The aforementioned integrated units may be implemented in the form of hardware or software functional units.

[0176] On the other hand, the present application provides a computer-readable storage medium storing a computer program, which can be executed by a processor to implement any of the above methods.

[0177] See also Figure 17 If the above-mentioned integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium 300. Based on this understanding, the technical solution of the present application, or the part that contributes to the prior art, or all or part of the technical solution can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes a number of instructions / computer programs to enable an intelligent control platform (which can be a personal computer, server, or network device, etc.) or a processor to execute all or part of the steps of the various embodiments of the present application. The aforementioned storage medium includes various media such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk, as well as electronic devices such as computers, mobile phones, laptops, tablet computers, cameras, etc. that have the above-mentioned storage media.

[0178] The description of the execution process of the program data in the computer-readable storage medium can refer to the description in the above-mentioned method embodiments of the present application, and will not be repeated here.

[0179] The above description is merely an embodiment of the present application and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

[0180] Those skilled in the art will understand that in the above-mentioned method of the specific implementation method, the writing order of each step does not mean a strict execution order and does not constitute any limitation on the implementation process. The specific execution order of each step should be determined by its function and possible internal logic.

[0181] In summary, this application has the following beneficial effects:

[0182] The electrical interconnection and heat dissipation capabilities of the inductor are greatly improved through a metal frame or selective electroplating, allowing the inductor to provide other functions in addition to electromagnetic functions.

[0183] Furthermore, the connection between the inductor and the metal frame is achieved by sintering the nano-metal material, that is, the connection is made using the sintered nano-metal material, which effectively improves the production efficiency.

[0184] Furthermore, the inductor structure of the present application is simple, which improves the electrical interconnection flexibility and heat dissipation capability while also being easy to assemble.

[0185] Furthermore, the present application provides a variety of variations of the inductor structure, which can be flexibly designed according to different needs.

[0186] Furthermore, the present application provides manufacturing methods corresponding to different inductor structures, so that the manufacturing process can be tailored to the characteristics of the corresponding inductor structure, saving steps and improving accuracy.

[0187] Furthermore, only one PCB is required to assemble the power module, which has high assembly precision, high integration, increased power density, and reduced application-side design requirements.

[0188] Furthermore, the power loop between the chip and the inductor is very short, which reduces losses and improves energy conversion efficiency.

[0189] Furthermore, the use of metal-clad inductors can achieve simultaneous optimization of electromagnetic shielding and module thermal conductivity, thereby eliminating the electromagnetic interference of the inductor on the digital power control signal and optimizing the heat dissipation of the power chip.

Claims

1. A vertically stacked power module structure, characterized in that: include: A chip, a PCB frame layer, an inductor structure, and a PCB circuit layer, wherein the inductor structure is embedded in the PCB frame layer, the PCB circuit layer covers the top and bottom of the PCB frame layer, and constitutes the PCB as a whole, and the chip is mounted on the top of the PCB as a whole; The inductor structure includes an inductor winding, a magnet, and a metal frame, wherein the magnet wraps the inductor winding to form a rectangular inductor body, and the metal frame covers multiple outer side surfaces of the rectangular inductor body to form a magnetic shielding layer; The PCB circuit layer is provided with a dielectric layer, a copper conductive layer, and a solder resist layer from the inside out; The solder resist layer is located on the outermost layer of the PCB circuit layer to form a pad pattern that matches the chip pins; The dielectric layer is provided with copper through holes at positions corresponding to the adjacent copper conductive layer and the winding terminals of the inductor structure, so that the winding terminals and the copper conductive layer are electrically interconnected and heat dissipation is enhanced; The dielectric layer is provided with copper through holes at positions corresponding to the adjacent copper conductive layer and the magnetic shielding layer of the inductor structure, so as to enhance heat dissipation between the magnetic shielding layer and the copper conductive layer; The metal frame for forming the magnetic shielding layer is in a sheet type, and includes a plurality of metal sheets, wherein each of the metal sheets covers an outer side surface of the rectangular parallelepiped inductor body.

2. The vertically stacked power module structure according to claim 1, characterized in that: The number of the inductor winding is one or more.

3. The vertically stacked power module structure according to claim 1, characterized in that: The copper through hole includes any one or more combinations of solid hole slots and surface copper-clad hole slots.

4. A method for manufacturing a vertically stacked power module structure according to claim 1, characterized in that: Including steps: S31: fabricating an inductor structure with a magnetic shielding layer; S32: preparing a PCB frame layer, and embedding the inductor structure in the PCB frame layer; S33: Embedding and coating the PCB frame layer; S34: Make the PCB circuit layer, including the copper conductive layer, dielectric layer and solder mask layer. At the same time, make copper through holes according to the design to form the electrical circuit and the thermal conductive hole connected to the magnetic shielding layer. S35: Chips and components are mounted to complete the vertically stacked power module structure.

5. The production method according to claim 4, characterized in that: The step S31 of making the inductor structure with a magnetic shielding layer includes: assembling a metal sheet on the periphery of the magnet of the inductor winding, and the assembling method includes pasting, molding, or using a metal plating process to achieve metal coverage on the surface of the inductor.

6. The manufacturing method according to claim 4, characterized in that: The step S31 of manufacturing the inductor structure with the magnetic shielding layer includes: prefabricating the metal sheet into a wrapped shape and then performing electromagnetic shielding assembly.

7. The production method according to claim 4, characterized in that: The manufacturing method is full-plate manufacturing, and multiple inductor structures are embedded at the same time.

8. A device for manufacturing a vertically stacked power module structure, characterized in that: It comprises a memory and a processor coupled to each other, wherein the processor is used to execute program instructions stored in the memory to implement the manufacturing method of the vertically stacked power module structure according to any one of claims 4 to 7.

9. A computer-readable storage medium having program instructions stored thereon, characterized in that: When the program instructions are executed by the processor, the method for manufacturing the vertically stacked power module structure according to any one of claims 4 to 7 is implemented.

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