Electronic equipment and vehicle

Abstract

The invention discloses an electronic device and a vehicle, and the electronic device comprises a copper bar which is provided with a through hole; the first circuit board is perpendicular to the copper bar, and the first circuit board is partially located in the through hole; the current sensor is arranged on the first circuit board, and at least part of the current sensor is located in the through hole. According to the electronic equipment and the vehicle, the sensitivity of the current sensor in the Z-axis direction can be remarkably reduced, and the consistency of the current sampling range is ensured.

Description

Technical Field

[0001] The present application relates to the field of vehicle technology, and more particularly to an electronic device and a vehicle. Background Art

[0002] At present, the electronic device includes a circuit board, a current sensor and a copper busbar arranged on the circuit board. The circuit board and the copper busbar are arranged in parallel. U-shaped grooves are opened on both sides of the copper busbar to form a neck in the middle. The current sensor is installed above the neck.

[0003] This structure has high requirements for the distance between the copper busbar and the current sensor in the Z-axis direction (the direction perpendicular to the circuit board, where the direction perpendicular to the circuit board refers to the direction perpendicular to the large plane of the circuit board). There are processing errors in actual processing, which causes the actual sampling range of the current sensor to be seriously inconsistent with the theoretical sampling range.

[0004] Therefore, improvements are needed to at least partially solve the above problems. Summary of the invention

[0005] A series of simplified concepts are introduced in the Summary of the Invention, which will be further described in detail in the Detailed Description of the Invention. The Summary of the Invention does not mean to attempt to define the key features and essential technical features of the claimed technical solution, nor does it mean to attempt to determine the scope of protection of the claimed technical solution.

[0006] In order to at least partially solve the above problem, according to a first aspect of the present invention, there is provided an electronic device, comprising:

[0007] A copper busbar, wherein the copper busbar is provided with a through hole;

[0008] A first circuit board, the first circuit board is perpendicular to the copper busbar, and the first circuit board is partially located in the through hole;

[0009] A current sensor is disposed on the first circuit board and is at least partially located in the through hole.

[0010] Exemplarily, the electronic device further includes a packaging component, which covers the current sensor, a portion of the first circuit board and a portion of the copper busbar at the through hole to fix the first circuit board and the copper busbar in connection.

[0011] Exemplarily, the package includes an injection-molded shell and a potting compound located in the injection-molded shell, wherein the potting compound covers the current sensor, the first end of the first circuit board, and a portion of the copper busbar at the through hole.

[0012] Exemplarily, the electronic device further includes a second circuit board, the second circuit board is perpendicular to the first circuit board, and the first circuit board is electrically connected to the second circuit board.

[0013] Exemplarily, the first circuit board has a plurality of extensions arranged at intervals, and at least one side of the extensions has a solder pad;

[0014] The second circuit board is provided with a plurality of via holes corresponding to the plurality of protruding portions;

[0015] The plurality of protruding portions are respectively inserted into the plurality of via holes, and the pad is connected to the second circuit board by welding.

[0016] Exemplarily, the length of the pad is greater than the thickness of the second circuit board;

[0017] Welding rings surrounding the via holes are arranged on both sides of the second circuit board.

[0018] Exemplarily, the distances between adjacent protruding portions are greater than 8 mil;

[0019] The distances between adjacent welding rings are greater than 8 mil.

[0020] Exemplarily, the center distance between adjacent protruding portions is not fixed; and / or,

[0021] The widths of the plurality of protruding portions are variable.

[0022] Exemplarily, there are at least three protruding portions.

[0023] Exemplarily, the electronic device is a motor controller, the second circuit board is configured as a control board, and the area of ​​the first circuit board is smaller than that of the control board.

[0024] According to a second aspect of the present invention, a vehicle is provided, comprising the electronic device as described above.

[0025] According to the electronic device and vehicle of the present invention, by setting a through hole on the copper busbar and vertically extending the first circuit board connected to the current sensor into the through hole, the sensitivity of the current sensor in the Z-axis direction can be significantly reduced, thereby ensuring the consistency of the current sampling range. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The following drawings of the present application are hereby used as part of the present application for understanding the present application. The drawings show the embodiments of the present application and their descriptions, and are used to explain the device and principle of the present application. In the drawings,

[0027] Figure 1 This is a three-dimensional schematic diagram of an electronic device according to an embodiment of the present application, wherein the packaging component is not shown;

[0028] Figure 2 for Figure 1 A schematic front view of an electronic device in FIG.

[0029] Figure 3 for Figure 1 A top view of the copper busbar in FIG.

[0030] Figure 4 is a front view schematic diagram of an electronic device according to an embodiment of the present application, wherein a packaging component is shown;

[0031] Figure 5 for Figure 1 A schematic structural diagram of a first side of a first circuit board;

[0032] Figure 6 for Figure 1 A schematic structural diagram of the second side of the first circuit board;

[0033] Figure 7 for Figure 1 A schematic diagram of the structure of the via hole on the second circuit board.

[0034] Description of reference numerals:

[0035] 100 - copper busbar, 110 - through hole, 200 - first circuit board, 210 - extension portion, 211 - pad, 300 - current sensor, 400 - package, 500 - second circuit board, 510 - via, 520 - soldering ring. DETAILED DESCRIPTION

[0036] In the following description, a large number of specific details are provided to provide a more thorough understanding of the present application. However, it is apparent to those skilled in the art that the present application can be implemented without one or more of these details. In other examples, in order to avoid confusion with the present application, some technical features well known in the art are not described.

[0037] It should be understood that the present application can be implemented in different forms and should not be construed as being limited to the embodiments presented herein. On the contrary, providing these embodiments will make the disclosure thorough and complete and fully convey the scope of the present application to those skilled in the art. In the accompanying drawings, the sizes and relative sizes of layers and regions may be exaggerated for clarity. The same reference numerals throughout represent the same elements.

[0038] It should be understood that although the terms first, second, third, etc. can be used to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the teachings of the present application, the first element, component, region, layer or part discussed below can be represented as a second element, component, region, layer or part.

[0039] Spatially relative terms such as "under", "beneath", "below", "under", "above", "above", etc., may be used herein for convenience of description to describe the relationship of one element or feature to other elements or features shown in the figures. It should be understood that the spatially relative terms are intended to encompass different orientations of the device in use and operation in addition to the orientation shown in the figures.

[0040] The purpose of the terms used herein is only to describe specific embodiments and is not intended to be limiting of the present application. When used herein, the singular forms "one", "an" and "said / the" are also intended to include plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "consisting of" and / or "comprising", when used in this specification, determine the presence of the features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups. When used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0041] Embodiments of the invention are described herein with reference to cross-sectional views as schematic diagrams of ideal embodiments (and intermediate structures) of the present application. Thus, variations in the shapes shown due to, for example, manufacturing techniques and / or tolerances can be expected. Therefore, embodiments of the present application should not be limited to the specific shapes shown herein, but include shape deviations due to, for example, manufacturing. Therefore, what is shown in the figures is schematic in nature, and their shapes are not intended to display the actual shape of the device and are not intended to limit the scope of the present application.

[0042] See attached Figure 1-7 An electronic device according to an embodiment of the present application is exemplarily described. The electronic device includes a copper bus 100 , a first circuit board 200 and a current sensor 300 .

[0043] See attached Figure 1 The copper busbar 100 is provided with a through hole 110, and the current sensor 300 is provided in the through hole 110 to detect the current on the copper busbar 100. The copper busbar 100 opening design can reduce the design and manufacturing cost of the copper busbar 100, because the opening is relatively large and can be made by stamping, which can effectively reduce the cost.

[0044] The through hole 100 is not limited to a circular hole, a rectangular hole, etc., and can also be a through slot with one side open, not limited to a rectangular slot, an annular slot, etc., as long as it penetrates the copper busbar 100 in the thickness direction of the copper busbar 100.

[0045] See attached Figure 1 , 2 The first circuit board 200 is mainly used to carry the current sensor 300. The current sensor 300 is arranged on the first circuit board 200. Specifically, the current sensor 300 can be arranged at the first end of the first circuit board 200. The first end of the first circuit board 200 is also Figure 2 The current sensor 300 is fixedly connected to the first end of the first circuit board 200 by welding, and is electrically connected to the first circuit board 200. The first circuit board 200 is perpendicular to the copper bus 100. Specifically, the first circuit board 200 is flat, the copper bus 100 is sheet-shaped, and the plane where the first circuit board 200 is located (that is, the plane perpendicular to the thickness direction of the first circuit board 200) is perpendicular to the plane where the copper bus 100 is located (that is, the plane perpendicular to the thickness direction of the copper bus 100). The first circuit board 200 is partially located in the through hole 110, so that the current sensor 300 provided on the first circuit board 200 is at least partially located in the through hole 110, so that the current sensor 300 can detect the current passing through the copper bus 100. Exemplarily, the current sensor 300 can be a giant magnetoresistance current sensor or a Hall sensor. When the current sensor 300 is a Hall sensor, the current sensor 300 includes a Hall chip, the Hall chip is electrically connected to the first circuit board 200 , and at least a portion of the Hall chip is located in the through hole 110 .

[0046] Since the electronic device of the present application vertically arranges the first circuit board 200 and the copper bus 100, and arranges the through hole 110 on the copper bus 100, and vertically inserts the first circuit board 200 connected to the current sensor 300 into the through hole 110, the current sensor 300 can be effectively reduced in the Z-axis direction (the direction perpendicular to the first circuit board 200, which is also the direction of the current sensor 300). Figure 3 The sensitivity of the current sampling range can be improved by reducing the influence of the Z-axis deviation caused by manufacturing and installation tolerances on the sensor sampling range. Thus, the deviation of the current sampling range can be effectively ensured to be small, and the inconsistency of current sampling of electronic equipment caused by assembly accuracy can be reduced.

[0047] At the same time, the cross-section of the through hole 110 can be configured to be slightly larger than the cross-section of the first end of the first circuit board 200 and the current sensor 300 as a whole, so that the first end of the first circuit board 200 and the current sensor 300 as a whole can be just inserted into the opening, reducing the installation error of the current sensor 300 and ensuring the consistency of the current sampling range.

[0048] See attached Figure 5 In this embodiment, the first end (attached Figure 5 The left end of the first circuit board 200 in the figure is approximately a rectangular parallelepiped, and by way of example, its length L may be 20 mm, its width W may be 8 mm, and the thickness of the first circuit board 200 may be 1.6 mm. The thickness of the current sensor 300 may be 2 mm.

[0049] See attached Figure 3 In this embodiment, the through hole 110 is rectangular, the length a of the through hole 110 is greater than the width of the first end of the first circuit board 200, and the width b of the through hole 110 is greater than the sum of the thicknesses of the first circuit board 200 and the current sensor 300, so that the first end of the first circuit board 200 and the current sensor 300 can be inserted into the through hole 110 as a whole. Exemplarily, the length a of the through hole 110 can be 10 mm, which is greater than the width W of the first end of the first circuit board 200; the width b of the through hole 110 can be 5 mm, which is greater than the sum of the thicknesses of the first circuit board 200 and the current sensor 300, which is 3.6 mm.

[0050] In some other embodiments, the shape of the through hole 110 can be "convex", matching the cross-section of the first end of the first circuit board 200 and the current sensor 300 as a whole in the Z-axis direction, and the area of ​​the through hole 110 is slightly larger than the cross-sectional area of ​​the first end of the first circuit board 200 and the current sensor 300 as a whole.

[0051] In this embodiment, the electronic device further includes a second circuit board 500, which is mainly used to fix the first circuit board 200. The second circuit board 500 is perpendicular to the first circuit board 200, that is, the plane where the first circuit board 200 is located (that is, the plane perpendicular to the thickness direction of the first circuit board 200) is perpendicular to the plane where the second circuit board 500 is located (that is, the plane perpendicular to the thickness direction of the second circuit board 500). The first circuit board 200 (that is, Figure 2 The lower end of the first circuit board 200 in the copper bus 100 is electrically connected to the second circuit board 500, so that the first circuit board 200 can be below the second circuit board 500 to keep it in a specific position to detect the current in the copper bus 100.

[0052] Specifically, see Appendix Figure 5 , 6 , one end of the first circuit board 200 (ie Figure 2The lower end of the first circuit board 200 in the middle has a plurality of extensions 210 arranged at intervals, and the plurality of extensions 210 are in the shape of comb teeth, and there are grooves between adjacent extensions 210. At least one side of the extension 210 has a pad 211, and illustratively, both sides of the extension 210 can be provided with pads 211. In this embodiment, the shape of the pad 211 is rectangular, and the material of the pad 211 can be a metal layer such as a copper layer. The second circuit board 500 is provided with a plurality of vias 610 corresponding to the extension 210, and the plurality of extensions 210 are respectively inserted into the plurality of vias 610, and the pads 211 are connected to the second circuit board 500 by welding. Thereby, the first circuit board 200 and the second circuit board 500 are electrically connected, and then, the current sensor 300 can be electrically connected to the second circuit board 500 through the first circuit board 200.

[0053] It should be noted that the number of the extensions 210 needs to be at least three. Among them, the pad 211 on at least one extension 210 is used for power supply, the pad 211 on at least one extension 210 is used for grounding, and the pad 211 on at least one extension 210 is used for signal transmission, so that the current sensor 300 can form a conductive connection with the second circuit board 500 through the first circuit board 200, receive power from the second circuit board 500, be grounded through the second circuit board 500, and transmit the detection result to the corresponding device on the second circuit board 500. In this embodiment, there are four extensions 210, the pad 211 on one extension 210 is used for power supply, the pad 211 on one extension 210 is used for grounding, and the pads 211 on the other two extensions 210 are used for signal transmission. Four vias 610 corresponding to the four extensions 210 are provided on the second circuit board 500.

[0054] See attached Figure 5 In this embodiment, the length H of the plurality of pads 211 is greater than the thickness of the second circuit board 500. The length H of the pad 211 is the length of the pad 211 in a direction perpendicular to the second circuit board 500. For example, the length H of the pad 211 may be 2 mm, and the thickness of the second circuit board 500 may be 1.6 mm. Thus, when soldering the pad 211 and the second circuit board 500 using solder, both the top layer and the bottom layer of the second circuit board 500 (i.e., both sides of the second circuit board 500) may be soldered and fixed to enhance stability.

[0055] See attached Figure 7In this embodiment, the vias 610 are all elliptical, and their sizes match the sizes of each extension 210 to ensure that each extension 210 can be inserted into the corresponding opening. In some other embodiments, the shape of the via 610 can also be rectangular. Both sides of the second circuit board 500 are provided with welding rings 520 surrounding the vias 610, and the pads 211 on both sides of the second circuit board 500 can be welded to the welding rings 520, thereby enhancing the stability of the connection.

[0056] See attached Figure 5 In this embodiment, the distances between adjacent extensions 210 are N1, N2, and N3, respectively, and N1, N2, and N3 are all greater than 8 mil (ie, 0.2032 mm) to ensure a basic electrical gap and avoid short circuits. For example, N1, N2, and N3 may be 2.54 mm, 2.5 mm, and 2.4 mm, respectively.

[0057] In this embodiment, the distances between adjacent welding rings 520 are also greater than 8 mils to ensure a basic electrical gap and avoid short circuits.

[0058] See attached Figure 5 In this embodiment, the center distances between adjacent protrusions 210 are Z1, Z2 and Z3, respectively, and the center distances between adjacent protrusions 210 are uncertain, so as to realize foolproof design and ensure that the second end of the first circuit board 200 and the via 610 on the second circuit board 500 are inserted in the correct direction. It should be noted that the center distance is uncertain here means that the center distance is not a fixed value, that is, it is not all equal, and at least one center distance value is different from the other center distances, so that if the second end of the first circuit board 200 is inserted into the via 610 on the second circuit board 500 in the wrong direction, the multiple pads 211 cannot be fully inserted into the corresponding via 610. Exemplarily, Z1, Z2 and Z3 can be 3.54mm, 3.6mm and 3.65mm, respectively. Correspondingly, the center distances between adjacent vias 610 are also Z1, Z2 and Z3, that is, 3.54mm, 3.6mm and 3.65mm, respectively.

[0059] See attached Figure 5In this embodiment, the widths of the respective protrusions 210 are M1, M2, M3 and M4, respectively, and the widths of the plurality of protrusions 210 are not fixed, so as to realize foolproof design and ensure that the second end of the first circuit board 200 and the via hole 610 on the second circuit board 500 are inserted in the correct direction. It should be noted that the not fixed width mentioned here means that the width is not a fixed value, that is, not all equal, and the width of at least one protrusion 210 is different from the widths of the other protrusions 210, so that if the second end of the first circuit board 200 is inserted into the via hole 610 on the second circuit board 500 in the wrong direction, the plurality of protrusions 210 cannot be fully inserted into the corresponding via hole 610. Exemplarily, M1, M2, M3 and M4 can be 1mm, 1mm, 1mm and 1.25mm, respectively.

[0060] In some other embodiments, the electronic device can be configured such that the center distance between adjacent protruding portions 210 is not fixed, and the widths of multiple protruding portions 210 are the same to achieve a fool-proof design, or the center distance between adjacent protruding portions 210 is the same, and the widths of multiple protruding portions 210 are not fixed to achieve a fool-proof design. Those skilled in the art can configure as needed.

[0061] See attached Figure 4 In this embodiment, the electronic device further includes a package 400, which covers the current sensor 300, part of the first circuit board 200 (that is, the first circuit board 200 at the current sensor 300) and part of the copper busbar 100 at the through hole 110, that is, the current sensor 300 is completely covered therein at the through hole 110, and part of the first circuit board 200 around the current sensor 300 and part of the copper busbar 100 near the through hole 110 are covered therein, so that the first circuit board 200 and the copper busbar 100 are fixedly connected. Thus, it is ensured that there is no relative displacement between the current sensor 300 and the copper busbar 100, and it is ensured that the electronic device can stably detect the current passing through the copper busbar 100 under severe vibration conditions, thereby enhancing the accuracy of current sampling.

[0062] Exemplarily, the package 400 includes an injection molded shell and a potting compound located in the injection molded shell. During packaging, the injection molded shell is first formed by injection molding, and the injection molded shell has a receiving cavity, and the through hole 110 and the current sensor 300 are both located in the receiving cavity. Then, the potting compound is filled in the injection molded shell, and the potting compound covers the current sensor 300, part of the first circuit board 200 (that is, the first circuit board 200 at the current sensor 300), and part of the copper bus 100 at the through hole 110. The method of first forming the injection molded shell and then filling the potting compound can effectively prevent the high temperature during injection molding from damaging the current sensor.

[0063] For example, the injection molded shell can be made of engineering plastics that are resistant to high temperatures of 180°C and low temperatures of -50°C, and the potting glue can be silicone potting glue, epoxy resin potting glue, or other potting glue with good impact resistance and resistance to thermal changes, so as to avoid the relative position between the current sensor 300 and the copper bus 100 changing due to thermal expansion and contraction of the package 400, thereby enhancing the accuracy of current sampling. The specific materials of the injection molded shell and the potting glue can be selected by those skilled in the art as needed, and this application does not make specific restrictions on this.

[0064] In some other embodiments, the packaging component 400 may not be provided in the electronic device, and the first circuit board 200 is only fixed by the second circuit board 500. The electronic device may be suitable for electronic devices without severe vibration.

[0065] In some other embodiments, the second circuit board 500 may not be provided in the electronic device, and the copper bus 100 , the first circuit board 200 and the current sensor 300 may be connected and fixed only by the packaging component 400 .

[0066] In this embodiment, the electronic device is a motor controller, and the second circuit board 500 is configured as a control board, on which a control device is arranged to control the motor. The area of ​​the first circuit board 200 is smaller than that of the control board, and the first circuit board 200 is mainly used to carry the current sensor 300 and realize the electrical connection between the current sensor 300 and the second circuit board 500. In this way, only a first circuit board 200 with a smaller area needs to be configured separately to carry the current sensor 300 to realize current detection, and there is no need to make significant improvements to the structure of the control board. It is simple and easy to implement, and can effectively reduce the design difficulty and design cost.

[0067] In this embodiment, the first circuit board 200 can be designed on the process edge of the second circuit board 500 to utilize waste and fully save production costs. As a control board, the second circuit board 500 needs to be designed as a rectangle in accordance with the production and patch requirements. However, since the internal structure of the electronic device is usually more complicated, it is impossible to achieve a completely rectangular design. This requires increasing the process edge to achieve the design, and the cost of increasing the process edge will also be calculated into the production cost of the circuit board. Therefore, the first circuit board 200 can be designed on the process edge of the second circuit board 500 to reduce the waste of the process edge and save production costs.

[0068] The present application also provides a vehicle, which includes the electronic device as described above.

[0069] Although example embodiments have been described herein with reference to the accompanying drawings, it should be understood that the above example embodiments are merely exemplary and are not intended to limit the scope of the present application to this. Those of ordinary skill in the art may make various changes and modifications therein without departing from the scope and spirit of the present application. All these changes and modifications are intended to be included within the scope of the present application as required by the appended claims.

[0070] Those of ordinary skill in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.

[0071] In the several embodiments provided in this application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic, for example, the division of the units is only a logical function division, and there may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another device, or some features can be ignored or not executed.

[0072] In the description provided herein, a large number of specific details are described. However, it is understood that the embodiments of the present application can be practiced without these specific details. In some instances, well-known methods, structures and techniques are not shown in detail so as not to obscure the understanding of this description.

[0073] Similarly, it should be understood that in order to streamline the present application and help understand one or more of the various inventive aspects, in the description of the exemplary embodiments of the present application, the various features of the present application are sometimes grouped together into a single embodiment, figure, or description thereof. However, the method of the present application should not be interpreted as reflecting the following intention: the claimed application requires more features than the features clearly stated in each claim. More specifically, as reflected in the corresponding claims, the inventive point is that the corresponding technical problem can be solved with features less than all the features of a single disclosed embodiment. Therefore, the claims following the specific embodiment are hereby explicitly incorporated into the specific embodiment, wherein each claim itself serves as a separate embodiment of the present application.

[0074] It will be understood by those skilled in the art that, except for mutually exclusive features, all features disclosed in this specification (including the accompanying claims, abstracts and drawings) and all processes or units of any method or device disclosed in this specification may be combined in any combination. Unless otherwise expressly stated, each feature disclosed in this specification (including the accompanying claims, abstracts and drawings) may be replaced by an alternative feature that provides the same, equivalent or similar purpose.

[0075] In addition, those skilled in the art will appreciate that, although some embodiments described herein include certain features included in other embodiments but not other features, the combination of features of different embodiments is meant to be within the scope of the present application and form different embodiments. For example, in the claims, any one of the claimed embodiments can be used in any combination.

[0076] It should be noted that the above-mentioned embodiments illustrate rather than limit the invention and that those skilled in the art will be able to design alternative embodiments without departing from the scope of the appended claims.

Claims

1. An electronic device, characterized in that: include: A copper busbar (100), wherein a through hole (110) is provided on the copper busbar (100); A first circuit board (200), the first circuit board (200) being perpendicular to the copper bus (100), and the first circuit board (200) being partially located in the through hole (110); A current sensor (300) is provided on the first circuit board (200) and is at least partially located in the through hole (110).

2. The electronic device according to claim 1, characterized in that: The electronic device further comprises a packaging component (400), wherein the packaging component (400) covers the current sensor (300), the first end of the first circuit board (200), and a portion of the copper busbar (100) at the through hole (110) so as to fix the first circuit board (200) and the copper busbar (100) in connection.

3. The electronic device according to claim 2, characterized in that: The package (400) comprises an injection-molded shell and a potting compound located in the injection-molded shell, wherein the potting compound covers the current sensor (300), a portion of the first circuit board (200) and a portion of the copper busbar (100) at the through hole (110).

4. The electronic device according to claim 1, characterized in that: The electronic device further comprises a second circuit board (500), wherein the second circuit board (500) is perpendicular to the first circuit board (200), and the first circuit board (200) is electrically connected to the second circuit board (500).

5. The electronic device according to claim 4, characterized in that: One end of the first circuit board (200) has a plurality of extension portions (210) arranged at intervals, and at least one side of the extension portion (210) has a solder pad (211); The second circuit board (500) is provided with a plurality of via holes (510) corresponding to the plurality of protruding portions (210); The plurality of protruding portions (210) are respectively inserted into the plurality of via holes (510), and the solder pad (211) is connected to the second circuit board (500) by welding.

6. The electronic device according to claim 5, characterized in that: The length of the solder pad (211) is greater than the thickness of the second circuit board (500); Welding rings (520) surrounding the via holes (510) are provided on both sides of the second circuit board (500).

7. The electronic device according to claim 6, characterized in that: The distances between adjacent extensions (210) are greater than 8 mil; The distances between adjacent welding rings (520) are all greater than 8 mil.

8. The electronic device according to claim 5, characterized in that: The center distance between adjacent protruding portions (210) is not fixed; and / or, The widths of the plurality of protruding portions (210) are variable.

9. The electronic device according to claim 5, characterized in that: There are at least three protruding parts (210).

10. The electronic device according to any one of claims 4 to 9, characterized in that: The electronic device is a motor controller, the second circuit board (500) is configured as a control board, and the area of ​​the first circuit board (200) is smaller than that of the control board.

11. A vehicle, characterized in that: The electronic device comprises the electronic device as claimed in any one of claims 1 to 10.

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