A PCB silk-screen printing configuration method, device, and computer device

Abstract

The present application relates to a PCB silk screen configuration method, device and computer equipment. The method includes: determining the types of silk screens that need to be equipped on the PCB board; determining the structural parameters of the silk screens that need to be equipped on the PCB board based on the pre-built placement rules of different types of silk screens; optimizing the structural parameters of the silk screens that need to be equipped on the PCB board to obtain the initial configuration silk screens of the PCB board; based on the spatial position relationship between the initial configuration silk screens of the PCB board and the body corresponding to the initial configuration silk screens, as well as the spatial position relationship between the initial configuration silk screens of the PCB board, globally adjusting the initial configuration silk screens to obtain the final configuration silk screens of the PCB board. This method can solve the problems of the existing PCB silk screen configuration method, which does not support the automatic silk screen arrangement of new designs, has a small application range, and cannot meet complex and diverse scenarios and business needs.

Description

Technical Field

[0001] The present application relates to the technical field of PCB design, and in particular to a PCB silk screen configuration method, device and computer equipment. Background Art

[0002] With the development of electronic technology, PCB design has gradually gained attention. As an important part of PCB design, PCB silk screen printing plays a role in product production traceability and test verification support. Therefore, the accuracy of silk screen placement is particularly important.

[0003] The existing PCB silk screen configuration method is mainly based on the historical silk screen design information to complete the adjustment of silk screen characters, or, by obtaining the coordinates of the device body to achieve the placement of PCB position number silk screen and size. Among them, the adjustment of silk screen characters based on historical silk screen design information is mainly based on the historical silk screen design information and the relevant attributes of the current silk screen characters to move the current silk screen characters to complete the adjustment of the silk screen characters. However, this PCB silk screen configuration method does not support the automatic silk screen layout of new designs. The method of obtaining the coordinates of the device body to achieve the placement of PCB position number silk screen and size only solves the silk screen information such as the position number and package of the silk screen adjustment, and does not systematically solve all the factors affected by the silk screen. It has a small scope of application and cannot meet complex and diverse scenarios and business needs.

[0004] The existing PCB silk screen configuration method does not support the automated silk screen layout of new designs, has a limited application range, and cannot meet complex and diverse scenarios and business needs. Currently, no effective solution has been proposed. Summary of the Invention

[0005] Based on this, it is necessary to provide a PCB silk screen configuration method, device and computer equipment to address the above technical problems.

[0006] In a first aspect, the present application provides a PCB screen printing configuration method. The method comprises the following steps:

[0007] Determine the types of silk screens that the PCB board needs to be equipped with;

[0008] Determining structural parameters of each of the silk screens that the PCB board needs to be equipped with based on the types of each of the silk screens that the PCB board needs to be equipped with and pre-established placement rules for different types of silk screens;

[0009] Optimizing the structural parameters of each of the silk screens required for the PCB board to obtain optimized parameters of each of the silk screens required for the PCB board;

[0010] Using the optimized parameters of the silk screens required for the PCB board, setting the initial configurations of the silk screens required for the PCB board, and obtaining the initial configuration silk screens of the PCB board;

[0011] Based on the spatial positional relationship between each of the initial configuration silk screens of the PCB board and the body corresponding to the initial configuration silk screen, and the spatial positional relationship between each of the initial configuration silk screens of the PCB board, each of the initial configuration silk screens is globally adjusted to obtain each of the final configuration silk screens of the PCB board.

[0012] In one embodiment, optimizing the structural parameters of each of the silk screens required for the PCB board to obtain the optimized parameters of each of the silk screens required for the PCB board includes the following steps:

[0013] The particle swarm algorithm is used to optimize and solve the multi-dimensional structural parameters of each of the silk screens that the PCB board needs to be equipped with, so as to obtain the optimized parameters of each of the silk screens that the PCB board needs to be equipped with.

[0014] In one embodiment, the particle swarm algorithm is used to optimize and solve the multi-dimensional structural parameters of each screen printing required for the PCB board to obtain the optimized parameters of each screen printing required for the PCB board, including the following steps:

[0015] Based on the multi-dimensional structured parameters of each silk screen that the PCB board needs to be equipped with, a particle swarm parameter in the particle swarm algorithm is constructed, and a rule for the particle swarm parameter in the particle swarm algorithm is defined; wherein the rule for the particle swarm parameter includes solving a convergence range and an adjustment speed;

[0016] By using the defined particle swarm parameter rules, the dimension-reduced parameters of each of the silk screens that the PCB board needs to be equipped with are optimized and solved to obtain the optimized parameters of each of the silk screens that the PCB board needs to be equipped with.

[0017] In one embodiment, the rule for defining the particle swarm parameters in the particle swarm algorithm comprises the following steps:

[0018] Determining a convergence range of particle swarm parameters in the particle swarm algorithm based on the size of the silk screen body structure and a preset error range of the silk screen position;

[0019] Based on the size of the body structure of the silk screen, the adjustment speed of the particle swarm parameters in the particle swarm algorithm is determined.

[0020] In one embodiment, the global adjustment of each initial configuration silk screen based on the spatial positional relationship between each initial configuration silk screen of the PCB board and the body corresponding to the initial configuration silk screen, and the spatial positional relationship between each initial configuration silk screen of the PCB board to obtain each final configuration silk screen of the PCB board includes the following steps:

[0021] Based on the spatial positional relationship between each of the initial configuration silk screens on the PCB board and the bodies corresponding to the initial configuration silk screens, and the spatial positional relationship between each of the initial configuration silk screens on the PCB board, determining whether there is overlap and ambiguity between the initial configuration silk screens on the PCB board;

[0022] By introducing a genetic penalty function, the overlap and ambiguity between the initial configuration silk screens of the PCB board are adjusted to obtain the final configuration silk screens of the PCB board.

[0023] In one embodiment, determining whether there is overlap and ambiguity between the initial configuration silk screens of the PCB board based on the spatial positional relationship between the initial configuration silk screens of the PCB board and the bodies corresponding to the initial configuration silk screens, and the spatial positional relationship between the initial configuration silk screens of the PCB board, includes the following steps:

[0024] For each of the initial configuration silk screens of the PCB board and the body corresponding to the initial configuration silk screen, a bounding box is defined respectively, to obtain a first bounding box and a second bounding box of the PCB board; the first bounding box is the bounding box of the initial configuration silk screen, and the second bounding box is the bounding box of the body corresponding to the initial configuration silk screen;

[0025] Determining whether there is an intersection between the initial configuration silk screens of the PCB board based on consistency of relative positions between the first bounding boxes and the second bounding boxes;

[0026] Determining direction vectors and distances between each of the initial configuration silk screens on the PCB board based on a spatial positional relationship between the initial configuration silk screens on the PCB board;

[0027] Based on the directional vector angles and distances between each pair of the initial configuration silk screens of the PCB board, as well as a preset ambiguous angle threshold and a preset ambiguous distance threshold, it is determined whether there is ambiguity between each of the initial configuration silk screens of the PCB board; the preset ambiguous angle threshold is an angle value used to determine whether the directional vector angle between two silk screens meets the ambiguity judgment requirement; the preset ambiguous distance threshold is a distance value used to determine whether the distance between two silk screens meets the ambiguity requirement.

[0028] In one embodiment, the method of introducing a genetic penalty function to adjust the overlap and ambiguity between the initial configuration silk screens of the PCB board to obtain the final configuration silk screens of the PCB board includes the following steps:

[0029] Constructing a screen printing intersection penalty function based on the intersection determination results between the initial configuration screen printings of the PCB board;

[0030] Constructing a silk screen ambiguity penalty function based on the ambiguity determination results between the initial configuration silk screens of the PCB board;

[0031] The silk screen intersection penalty function and the silk screen ambiguity penalty function are used to perform target optimization on the parameters of each of the initial configuration silk screens of the PCB board to obtain each of the final configuration silk screens of the PCB board.

[0032] In one embodiment, determining the types of silk screens that the PCB board needs to be equipped with includes the following steps:

[0033] Based on the PCB board and the configuration information corresponding to the PCB board, the types of the silk screens that the PCB board needs to be equipped with are determined; the configuration information includes a circuit diagram and text information.

[0034] In one embodiment, the types of silk screen printing include pad and via silk screen printing, text silk screen printing, and device silk screen printing; and determining the types of silk screen printing that the PCB board needs to be equipped with based on the PCB board and the configuration information corresponding to the PCB board includes the following steps:

[0035] Determining the pad and via silk screens that the PCB needs to be equipped with based on the pads and vias that need to be equipped with silk screens;

[0036] Determining, based on the text information in the configuration information corresponding to the PCB board, the text silk screen that the PCB board needs to be equipped with; the text silk screen includes a high-frequency signal silk screen, a device identification silk screen, a process or production device silk screen, a package silk screen, and a network label silk screen;

[0037] Based on the circuit diagram in the configuration information corresponding to the PCB board, the device silk screen that the PCB board needs to be equipped with is determined; the device silk screen includes the device position number silk screen.

[0038] In one embodiment, the text silk screen includes high-frequency signal silk screen; the method further includes the following steps:

[0039] Determining the materials to be included in the PCB board based on the material codes in the text information;

[0040] Using a preset simulation signal database, simulating each of the materials to be equipped in the PCB board, and determining the materials in the PCB board having high-frequency signals;

[0041] Based on the material having high-frequency signals in the PCB board, the high-frequency signal silk screen to be provided in the PCB board is determined.

[0042] In one embodiment, the placement rules of the different types of silk screens include at least one of basic silk screen placement rules, high-frequency signal silk screen placement rules, pad and via silk screen placement rules, and process or production device silk screen placement rules; the basic silk screen placement rules include device position number silk screen placement rules, device identification silk screen placement rules, package silk screen placement rules, and network label silk screen placement rules.

[0043] In a second aspect, the present application further provides a PCB screen printing configuration device. The device comprises:

[0044] Type determination module, used to determine the types of silk screens that the PCB board needs to be equipped with;

[0045] a parameter determination module, configured to determine structural parameters of each of the silk screens that the PCB board needs to be equipped with based on the type of each of the silk screens that the PCB board needs to be equipped with and pre-established placement rules for different types of silk screens;

[0046] An optimization module, configured to optimize the structural parameters of each of the silk screens required to be provided on the PCB board, and obtain optimized parameters of each of the silk screens required to be provided on the PCB board;

[0047] a silk screen setting module, configured to set the initial configuration of each silk screen required for the PCB board using the optimized parameters of each silk screen required for the PCB board, and obtain each initial configuration silk screen of the PCB board;

[0048] and an adjustment module for globally adjusting each of the initial configuration silk screens of the PCB board based on the spatial positional relationship between each of the initial configuration silk screens of the PCB board and the body corresponding to the silk screen, as well as the spatial positional relationship between each of the initial configuration silk screens of the PCB board, to obtain each of the final configuration silk screens of the PCB board.

[0049] In a third aspect, the present application further provides a computer device comprising a memory and a processor, wherein the memory stores a computer program, and the processor implements the PCB screen printing configuration method described in the first aspect when executing the computer program.

[0050] The above-mentioned PCB silk screen configuration method, device and computer equipment, through pre-established placement rules for different types of silk screens, can determine the structural parameters corresponding to each silk screen that the PCB board needs to be equipped with, when determining the type of each silk screen that the PCB board needs to be equipped with. It classifies the silk screens and determines the placement rules for the silk screens of different classifications, and then reduces the dimension of the structural parameters corresponding to each silk screen that the PCB board needs to be equipped with, and then optimizes the structural parameters of the silk screen after dimension reduction to obtain the optimized parameters of each silk screen, and obtains the initial configuration silk screen of the PCB board based on the optimized parameters of each silk screen. Because the silk screen at this time only performs dimensionality reduction and optimization based on a single silk screen, there may be problems such as overlap and ambiguity between the silk screens. Therefore, it is necessary to globally adjust the initial configuration silk screen to obtain the final configuration of each silk screen on the PCB board. This method supports newly designed automated silk screen layout and is applicable to multiple types of silk screens in various scenarios, with universality. It solves the problem that the existing PCB silk screen configuration method does not support the automatic silk screen layout of new designs, has a small application range, and cannot meet complex and diverse scenarios and business needs.

[0051] The details of one or more embodiments of the present application are set forth in the following drawings and description to make other features, objects, and advantages of the present application more readily apparent. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0053] Figure 1 A hardware structure block diagram of a terminal for a PCB screen printing configuration method provided in one embodiment of the present application;

[0054] Figure 2 A flowchart of a PCB screen printing configuration method provided in one embodiment of the present application;

[0055] Figure 3 This is a schematic diagram of the PCB silk screen configuration result provided by an embodiment of the present application;

[0056] Figure 4 A flowchart of a PCB screen printing configuration method provided in a preferred embodiment of the present application;

[0057] Figure 5 This is a structural block diagram of a PCB screen printing configuration device provided in one embodiment of the present application. DETAILED DESCRIPTION

[0058] In order to more clearly understand the purpose, technical solutions and advantages of the present application, the present application is described and illustrated below in conjunction with the accompanying drawings and embodiments.

[0059] Unless otherwise defined, technical or scientific terms used in this application shall have the ordinary meanings as understood by persons of ordinary skill in the art to which this application belongs. The terms "a," "an," "the," "these," and similar expressions in this application do not denote limitations on quantity and may be singular or plural. The terms "comprise," "include," "have," and any variations thereof, as used in this application, are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or device comprising a series of steps or modules (units) is not limited to the listed steps or modules (units) but may include unlisted steps or modules (units) or other steps or modules (units) inherent to the process, method, product, or device. The terms "connected," "connected," "coupled," and similar expressions used in this application are not limited to physical or mechanical connections but may include electrical connections, whether direct or indirect. As used in this application, "plurality" means two or more. "And / or" describes an association between associated objects, indicating that three possible relationships exist. For example, "A and / or B" can mean: A exists alone; A and B exist simultaneously; or B exists alone. Generally, the character " / " indicates that the objects in the preceding and following relationship are in an "or" relationship. The terms "first", "second", "third", etc. involved in this application are only used to distinguish similar objects and do not represent a specific ordering of the objects.

[0060] The method embodiment provided in this embodiment can be executed in a terminal, a computer or a similar computing device. For example, running on a terminal, Figure 1 : is a hardware structure diagram of the terminal of the PCB screen printing configuration method of this embodiment. Figure 1 As shown, the terminal may include one or more ( Figure 1The processor 102 (only one is shown) and a memory 104 for storing data, wherein the processor 102 may include but is not limited to a processing device such as a microprocessor MCU or a programmable logic device FPGA. The terminal may also include a transmission device 106 for communication functions and an input / output device 108. It will be understood by those skilled in the art that Figure 1 The structure shown is only for illustration and does not limit the structure of the above terminal. Figure 1 More or fewer components than shown, or with Figure 1 Different configurations shown.

[0061] The memory 104 can be used to store computer programs, for example, software programs and modules of application software, such as the computer program corresponding to the PCB silk screen configuration method in this embodiment. The processor 102 executes various functional applications and data processing by running the computer program stored in the memory 104, that is, implementing the above-mentioned method. The memory 104 may include a high-speed random access memory and may also include a non-volatile memory, such as one or more magnetic storage devices, flash memory, or other non-volatile solid-state memory. In some examples, the memory 104 may further include a memory remotely located relative to the processor 102, and these remote memories may be connected to the terminal via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0062] Transmission device 106 is used to receive or transmit data via a network. This network may include a wireless network provided by the terminal's communications provider. In one embodiment, transmission device 106 includes a network interface controller (NIC), which can be connected to other network devices via a base station to enable communication with the Internet. In another embodiment, transmission device 106 may be a radio frequency (RF) module, which is used to communicate with the Internet wirelessly.

[0063] In this embodiment, a PCB screen printing configuration method is provided. Figure 2 : is a flow chart of the PCB screen printing configuration method of this embodiment, such as Figure 2 As shown, the process includes the following steps:

[0064] Step S210: determining the types of silk screens that the PCB board needs to be equipped with.

[0065] Silkscreen, also known as screen printing, is a printing technique that uses a silk screen as a printing plate. The basic principle is to apply ink or pigment to the screen and then transfer the ink or pigment to the printed material through pressure, creating patterns, letters, numbers, or text. Silkscreen is commonly used to create useful information on printed circuit boards (PCBs). During the assembly process, it can be used to mark component values, part numbers, polarity, and other information. It can also include version and manufacturer information.

[0066] In this step, the types of silk screen printing may include pad and via silk screen printing, text silk screen printing, and device silk screen printing. Among them, the text silk screen printing includes high-frequency signal silk screen printing, process or production device silk screen printing, package silk screen printing, and network label silk screen printing.

[0067] Determining the types of silkscreens required for the PCB board can be performed based on the PCB board and its corresponding configuration information. The configuration information includes a circuit diagram and text information corresponding to the PCB board. The text information can include device identification, device packaging text information, network designation, material code, and production or process device text information.

[0068] The device identifier is used to identify the chip name, interface type, and coding instructions for matching multiple identical interface identifiers with functions. The device package text information includes the two-dimensional structural dimension information of the device package, the device pin marking information, the positive and negative pole marking information, and the multi-pin marking information. The two-dimensional structural dimension information of the device package includes the device package body size information, pad size information, and spacing information. The network label is used to identify different interface device pin networks for easy wiring or debugging. The material code is a unique code for the material, used to identify its location and characteristics in the design. Specifically, it can be a short text or symbol to identify one or more of the material, product name, specification, or category. The production or process device text information includes one or more of the following: CODE code, manufacturer's logo, serial number, batch number, warnings and regulations, PCB board unique identification number, company logo, version number, date code, product-specific requirements, and other standards or logo printing.

[0069] Step S220 : determining structural parameters of each silk screen that the PCB board needs to be equipped with based on the types of each silk screen that the PCB board needs to be equipped with and pre-established placement rules of different types of silk screens.

[0070] The aforementioned pre-established placement rules for different types of silkscreen can be pre-established placement rules corresponding to each type of silkscreen. Specifically, the aforementioned placement rules can include one or more of basic silkscreen placement rules, high-frequency signal silkscreen placement rules, pad and via silkscreen placement rules, and process or production device silkscreen placement rules. The aforementioned basic silkscreen placement rules can include one or more of device bit number silkscreen placement rules, device identification silkscreen placement rules, package silkscreen placement rules, and network label silkscreen placement rules.

[0071] The structured information in the above-mentioned pre-constructed placement rules of different types of silk screens may include one or more of the silk screen body, silk screen layer, interference area, optimization initial value, optimization position range, optimization target, silk screen direction, silk screen size, whether there is an associated position, whether it is allowed to be on a different plane from the device, and silk screen optimization value.

[0072] The structured information SI in the pre-built placement rules of different types of silk screen printing can be expressed as:

[0073] SI= [SA SL SIA OI OP OT SD SS AP DA OV];

[0074] Among them: SA represents the silk screen area, SL represents the layer where the silk screen is located, SIA represents the silk screen interference area, SD represents the silk screen direction, SS represents the silk screen size, AP represents whether there is an associated position, DA represents whether it is allowed to be out of plane with the device, OI represents the individual optimization initial value, OP represents the optimization position range, OT represents the optimization target, and OV represents the silk screen optimization value.

[0075] For example, the structured information of the pre-built device designator silkscreen placement rule can be:

[0076] SA: Component number silk screen; SL: Default is the component side; SIA: The entire board area, including components, pads, windows and other interference areas; OI: Component frame area; OP: A certain distance around the component, recommended to be 50mil-200mil, such as in dense areas, the distance can be increased but needs to be indicated; OT: Component body; SD: From left to right or from bottom to top, the silk screen on the back needs to be mirrored; SS: Normal size, recommended 25mil-30mil; AP: Yes; DA: No; OV: None.

[0077] The structured information of the above-mentioned pre-built device identification silk screen placement rule can be:

[0078] SA: Component identification silk screen; SL: Default is the component side; SIA: The entire board area, including components, pads, windows and other interference areas; OI: Component frame area; OP: A certain distance around the component, recommended to be 50mil-200mil. If it is a dense area, the distance can be increased but it needs to be indicated; OT: Component body; SD: From left to right or from bottom to top, the silk screen on the back needs to be mirrored; SS: Slightly larger than normal text, recommended to be more than 60mil; AP: Yes; DA: No; OV: None.

[0079] For pin silk screen, it needs to be placed close to the device pins and as far as possible outside the device body. The silk screen directions of multiple pins of the same device should be kept consistent. Therefore, the structured information of the above pre-built package silk screen placement rules can be:

[0080] SA: Text silk screen of device package; SL: Same side, back side or double sides can be selected; SIA: The entire board area, including devices, pads, windows and other interference areas; OI: Device frame area; OP: A certain distance around the device, recommended to be 50mil-200mil; OT: Device pins; SD: From left to right or from bottom to top, the back silk screen needs to be mirrored; SS: Normal size, recommended to be 25mil-30mil or above; AP: Yes; DA: Yes; OV: None.

[0081] Generally, for different interface device pin networks, in order to facilitate wiring or debugging, the network signal silk screen is placed on the same side or back of the device, close to the pins, placed on the outside of the device body, and the silk screen placement direction is kept consistent as much as possible. Therefore, the structured information of the above pre-built network label silk screen placement rules can be:

[0082] SA: Text silk screen of device package; SL: Same side, back side or double sides can be selected; SIA: The entire board area, including devices, pads, windows and other interference areas; OI: Device frame area; OP: A certain distance around the device, recommended to be 50mil-200mil; OT: Device pins; SD: From left to right or from bottom to top, the back silk screen needs to be mirrored; SS: Normal size, recommended to be 25mil-30mil or above; AP: Yes; DA: Yes; OV: None.

[0083] When pre-building high-frequency signal silkscreen placement rules, high-frequency signals are obtained through materials, and then the PCB network signal chain is obtained. The above-mentioned acquisition of the PCB network signal chain can extract signal chain information from the PCB design file. A signal chain is the path for a signal to be transmitted from one point (such as a chip pin) to another point (such as a pin of another chip or a test point). This usually includes elements such as signal lines (Clines) and vias (Via). The process of defining the acquired PCB network signal chain as an ordered dictionary structure T is as follows:

[0084] T = {"Key_num:Value"};

[0085] Among them, the Key_num type is Cline or Via and contains a digital identifier. Cline can include electrical characteristics such as line width, line length, and impedance, and Via can include information such as the diameter, depth, and connected layer of the via. The digital identifier is used to distinguish different instances of the same type (signal line or via) to ensure the uniqueness of each key. Value is the attribute field information of Cline or Via.

[0086] If there is high-frequency information on the PCB board and the link structure is at the TOP layer or BOT layer, it is necessary to obtain the structural information and convert it into geometric position information. At this time, the structured information of the high-frequency signal silk screen placement rule can be:

[0087] SA: None; SL: Actual level; SIA: TOP / BOTTOM geometric position of high-frequency information; OI: None; OP: None; OT: None; SD: None; SS: None; AP: None; DA: Yes; OV: None.

[0088] The structured information of the above pre-built pad and via silkscreen placement rules can be:

[0089] SA: None; SL: Actual level; SIA: Hole structure automated test pad; OI: None; OP: None; OT: None; SD: None; SS: None; AP: None; DA: Yes; OV: None.

[0090] The structured information of the above-mentioned pre-built process or production device silk screen placement rules can be:

[0091] SA: silk screen body area; SL: TOP / BOT or agreed layer; SIA: the entire board area, including components, pads, windows and other interference areas; OI: near the center point of the interference-free area in the plane; OP: none; OT: the entire board; SD: from left to right or from bottom to top, the back silk screen needs to be mirrored; SS: none; AP: none; DA: yes; OV: none.

[0092] The above-mentioned determination of the structural parameters of each silk screen that the PCB board needs to be equipped with based on the types of each silk screen that the PCB board needs to be equipped with and the pre-constructed placement rules of different types of silk screens can be based on the types of each silk screen that the PCB board needs to be equipped with, determining the placement rules of the silk screen corresponding to the types of each silk screen that needs to be equipped, and then, based on the structured information of the silk screen placement rules corresponding to the types of each silk screen that needs to be equipped, determining the structural parameters of each silk screen that the PCB board needs to be equipped with.

[0093] Step S230 , optimizing the structural parameters of each silk screen that needs to be equipped on the PCB board, and obtaining the optimized parameters of each silk screen that needs to be equipped on the PCB board.

[0094] In this step, the above-mentioned optimization of the structural parameters of each silk screen that needs to be equipped on the PCB board to obtain the optimized parameters of each silk screen that needs to be equipped on the PCB board can be performed by using a particle swarm algorithm to optimize the multi-dimensional structural parameters of each silk screen that needs to be equipped on the PCB board to obtain the optimized parameters of each silk screen that needs to be equipped on the PCB board.

[0095] Step S240 , using the optimized parameters of each silk screen that the PCB board needs to be equipped with, setting the initial configuration of each silk screen that the PCB board needs to be equipped with, and obtaining each initial configuration silk screen of the PCB board.

[0096] Step S250, based on the spatial position relationship between each initial configuration silk screen of the PCB board and the body corresponding to the initial configuration silk screen, and the spatial position relationship between each initial configuration silk screen of the PCB board, each initial configuration silk screen is globally adjusted to obtain each final configuration silk screen of the PCB board.

[0097] After optimizing the structural parameters of each silkscreen required for the PCB board and obtaining the optimized parameters for each silkscreen, the silkscreens are placed in the corresponding spatial locations. However, there may be problems such as silkscreen positions being reversed, incorrect order, and inconsistent relative positions of the silkscreens relative to the main body. In addition, the relationship between silkscreens may cause ambiguity in the silkscreen text. Therefore, it is necessary to globally adjust each initial configuration silkscreen to resolve these issues. The main body corresponding to the silkscreen can be the component corresponding to the silkscreen.

[0098] The above-mentioned global adjustment of each initial configuration silk screen to obtain each final configuration silk screen of the PCB board can be achieved by introducing a genetic penalty function to adjust the intersection and ambiguity of each initial configuration silk screen of the PCB board to obtain each final configuration silk screen of the PCB board. The above-mentioned genetic penalty function can be implemented by adding a penalty term to the objective function to penalize solutions that do not meet the constraints, thereby guiding the search process towards a feasible solution. Specifically, the silk screen intersection penalty function and the silk screen ambiguity penalty function can be constructed, and then the silk screen intersection penalty function and the silk screen ambiguity penalty function can be used to perform target optimization on the parameters of each initial configuration silk screen of the PCB board to obtain each final configuration silk screen of the PCB board.

[0099] In the above steps S210 to S250, by pre-establishing the placement rules for different types of silk screens, the structural parameters corresponding to each silk screen required on the PCB board can be determined when the types of silk screens required on the PCB board are determined. By classifying the silk screens and determining the placement rules for the silk screens of different classifications, the structural parameters corresponding to each silk screen required on the PCB board are reduced in dimension, and then the structural parameters of the silk screens after dimension reduction are optimized to obtain the optimized parameters for each silk screen. Based on the optimized parameters of each silk screen, the initial configuration silk screens of the PCB board are obtained. Because the silk screens in this case only undergo dimensionality reduction and optimization based on a single silk screen, there may be problems such as overlap and ambiguity between the silk screens. Therefore, it is necessary to globally adjust the initial configuration silk screens to obtain the final configuration of each silk screen on the PCB board. This method supports newly designed automated silk screen layout and is applicable to multiple types of silk screens in various scenarios, with universality. It solves the problem that the existing PCB silk screen configuration method does not support the automatic silk screen layout of new designs, has a small application range, and cannot meet complex and diverse scenarios and business needs.

[0100] In one embodiment, step S230, optimizing the structural parameters of each silk screen required for the PCB board to obtain the optimized parameters of each silk screen required for the PCB board, includes:

[0101] In step S232 , a particle swarm algorithm is used to optimize and solve the multi-dimensional structural parameters of each silk screen that the PCB board needs to be equipped with, so as to obtain the optimized parameters of each silk screen that the PCB board needs to be equipped with.

[0102] The method of using a particle swarm algorithm to optimize and solve the multidimensional structured parameters of each screen printing required for a PCB board to obtain the optimized parameters of each screen printing required for the PCB board can be based on the multidimensional structured parameters of each screen printing required for the PCB board, constructing particle swarm parameters in the particle swarm algorithm, defining rules for the particle swarm parameters in the particle swarm algorithm, and then, using the defined rules for the particle swarm parameters, optimizing and solving the reduced-dimensional parameters of each screen printing required for the PCB board to obtain the optimized parameters of each screen printing required for the PCB board. The multidimensional structured parameters can include at least two of the following: position, size, color, font, direction, etc.

[0103] Specifically, in one embodiment, step S232 utilizes a particle swarm algorithm to optimize and solve the multi-dimensional structural parameters of each silk screen required for the PCB board, thereby obtaining the optimized parameters of each silk screen required for the PCB board, including:

[0104] Step S2322: Based on the multi-dimensional structured parameters of each silk screen that the PCB board needs to be equipped with, construct the particle swarm parameters in the particle swarm algorithm and define the rules of the particle swarm parameters in the particle swarm algorithm; wherein the rules of the particle swarm parameters include solving the convergence range and adjusting the speed.

[0105] In this embodiment, in step S210, the types of each silk screen that the PCB board needs to be equipped with are determined, and the types of each silk screen that the PCB board needs to be equipped with are divided into types. In step S220, based on the types of each silk screen that the PCB board needs to be equipped with and the pre-established placement rules of different types of silk screens, the structured parameters of each silk screen that the PCB board needs to be equipped with are determined, and the structured parameters of each silk screen that the PCB board needs to be equipped with are reduced to two dimensions: type and structured parameters corresponding to each type. Based on this, the multi-dimensional parameters of multiple types are a two-dimensional structure. Therefore, based on the multi-dimensional structured parameters of each silk screen that the PCB board needs to be equipped with, the particle swarm parameters in the particle swarm algorithm are constructed, and the dimension of the constructed particle parameters is two-dimensional.

[0106] The above multi-dimensional structured parameters of each silk screen that needs to be equipped on the PCB board are used to construct the particle swarm parameters in the particle swarm algorithm. In the particle swarm algorithm, a community of N particles is constructed, each particle represents a silk screen individual, and has a 2-dimensional position vector X i and the 2D velocity vector V i , for the particularity of silk screen adjustment. The position vector X of each particle i satisfy:

[0107] ;

[0108] Among them, i represents the index of the particle, represents the i-th particle, X i1 and X i2 Represents the spatial position vector of the particle in 2D space.

[0109] The flight speed of the i-th particle (the velocity vector V i )satisfy:

[0110] ;

[0111] V i1 and V i2 Represents the velocity vector of the particle in 2D space.

[0112] Particles evolve through velocity updates and position updates. The velocity of the particle V id The update process can be expressed as:

[0113] ;

[0114] Among them, ω is the inertia factor, C1 and C2 are acceleration constants, which are used to control the speed of the particle approaching the individual extreme value and the global extreme value respectively, and are set to dynamic changing values. Random(0,1) represents a random number in the interval [0,1]. X id is the particle's position vector, P id is the individual extreme value of the i-th variable, P gd is the global optimal solution, and d is the number of iterations.

[0115] Particle position X id The update process can be expressed as:

[0116] ;

[0117] During the particle swarm optimization process, the exploration and development behavior of the particles can be controlled by dynamically adjusting the inertia factor ω and the acceleration constants C1 and C2 during iteration. The dynamic change adjustment rules of the above three parameters ensure that the overall optimization process meets the rule of decreasing inertia factor ω, decreasing C1, and increasing C2. After a finite number of iterations, the three parameters are quickly optimized, accelerating the overall tuning efficiency. Due to the special nature of silk screen tuning, the values after a finite number of iterations will be lower than those of other optimizations. The above-mentioned acceleration of the overall tuning efficiency after a finite number of iterations can be achieved by adjusting the convergence requirements of the parameters based on the overall characteristics of silk screen adjustment, so that rapid convergence is achieved while meeting the adjustment requirements. Specifically, the rules of the defined particle swarm parameters can be used to optimize and solve the reduced-dimensional parameters of each silk screen required for the PCB board, thereby obtaining the optimized parameters for each silk screen required for the PCB board.

[0118] In step S2324, the defined particle swarm parameter rules are used to optimize the reduced-dimensional parameters of each silk screen that the PCB board needs to be equipped with, and the optimized parameters of each silk screen that the PCB board needs to be equipped with are obtained.

[0119] When the particle swarm parameters reach the convergence condition, the optimal solution of the particle swarm is obtained. In the optimal solution of the particle swarm, each particle corresponds to the multidimensional parameters of a silk screen. Therefore, the optimization parameters of each silk screen that the PCB board needs to be equipped with can be determined based on the optimal solution of the particle swarm.

[0120] In steps S2322 to S2324, based on the multidimensional structured parameters of each screen printing required on the PCB board, the particle swarm algorithm (PSO) parameters are constructed, and the PSO parameter rules are defined. Furthermore, the defined PSO parameter rules are used to optimize the reduced-dimensional parameters of each screen printing required on the PCB board, thereby obtaining the optimized parameters for each screen printing required on the PCB board. By determining the optimized parameters for each screen printing required on the PCB board, the optimization of a single screen printing is performed.

[0121] In addition, in one embodiment, the rules for defining the particle swarm parameters in the particle swarm algorithm include:

[0122] Step S1, based on the size of the silk screen body structure and the preset error range of the silk screen position, determine the solution convergence range of the particle swarm algorithm parameters.

[0123] Since the placement of the silk screen does not require the solution to reach the minimum point, the convergence range of the solution can be adjusted based on the size of the main structure and the minimum error range to improve the overall algorithm optimization efficiency. In addition, the speed of the silk screen needs to be dynamically adjusted according to the main size of the silk screen structure to make the results easier to converge.

[0124] Based on this, the rules for particle swarm parameters can be defined. Specifically, the convergence range of the particle swarm parameters in the particle swarm algorithm can be determined based on the size of the silk screen body structure and the error range of the preset silk screen position.

[0125] The solution convergence range of the particle swarm parameters in the particle swarm algorithm can be expressed as:

[0126] ;

[0127] Among them, ePoilon is the convergence condition tolerance, is the coordinate value of the initial center point of the screen printing. The initial value is the closest position between the corresponding particle and the device path. Silk screen information coordinates of each path for a single device, The coordinates of each path information of a single device body; is the coordinate value of the device center point, and o is the converged maximum offset dynamic parameter combined with the size of the silk screen structure.

[0128] Step S2: determining the adjustment speed of the particle swarm parameters in the particle swarm algorithm based on the size of the silk screen body structure.

[0129] The above-mentioned body structure size based on silk screen determines the adjustment speed of particle swarm parameters in particle swarm algorithm, which can be expressed as:

[0130] ;

[0131] Among them, vLimit is the speed range of adjustment, L x is the horizontal distance of the silk screen path, L y is the vertical distance of the silk screen printing path, i represents the number of iterations, a and b represent the acceleration constants of the speed range in the horizontal and vertical directions of the silk screen printing, respectively, which are dynamically adjusted according to the size of the device body.

[0132] It should be noted that this embodiment lists the parameter optimization rules of the most influential factors in the particle swarm, and new optimization rules can also be added according to actual scenarios. This embodiment does not make specific limitations here.

[0133] In the above steps S1 to S2, the solution convergence range of the particle swarm parameters in the particle swarm algorithm is determined by the size of the main structure of the silk screen and the error range of the preset silk screen position, and then the adjustment speed of the particle swarm parameters in the particle swarm algorithm is determined based on the size of the main structure of the silk screen. The rules of the particle swarm parameters in the particle swarm algorithm are defined by determining the solution convergence range and adjustment speed of the particle swarm parameters in the particle swarm algorithm, so as to realize the optimization of the parameters after dimensionality reduction of each silk screen that needs to be equipped on the PCB board by utilizing the defined particle swarm parameter rules, and obtain the optimized parameters of each silk screen that needs to be equipped on the PCB board.

[0134] In one embodiment, step S250, based on the spatial positional relationship between each initial configuration silk screen of the PCB board and the body corresponding to the initial configuration silk screen, and the spatial positional relationship between each initial configuration silk screen of the PCB board, globally adjusts each initial configuration silk screen to obtain each final configuration silk screen of the PCB board, including:

[0135] Step S252: Based on the spatial positional relationship between each initial configuration silk screen of the PCB board and the body corresponding to the initial configuration silk screen, and the spatial positional relationship between each initial configuration silk screen of the PCB board, determine whether there is any overlap or ambiguity between the initial configuration silk screens of the PCB board.

[0136] In this step, the presence of intersections between the initial configuration silk screens of the PCB board refers to the situation where the relative positions of the initial configuration silk screens of the PCB board and their corresponding bodies are inconsistent. The presence of ambiguity between the initial configuration silk screens of the PCB board refers to the situation where the angle between the direction vectors of the initial configuration silk screens of the PCB board is less than a preset ambiguity angle threshold, and the distance between the direction vectors of the initial configuration silk screens of the PCB board is less than a preset ambiguity distance threshold.

[0137] In step S254, a genetic penalty function is introduced to adjust the overlap and ambiguity between the initial configuration silk screens of the PCB board, so as to obtain the final configuration silk screens of the PCB board.

[0138] In the above steps S252 to S254, based on the spatial positional relationship between each initial configuration silk screen of the PCB board and the body corresponding to the initial configuration silk screen, as well as the spatial positional relationship between each initial configuration silk screen of the PCB board, it is determined whether there is intersection and ambiguity between the initial configuration silk screens of the PCB board. By introducing a genetic penalty function, the position space is changed or particles are pushed away from unreasonable positions, and the intersection and ambiguity of each initial configuration silk screen of the PCB board are adjusted to obtain each final configuration silk screen of the PCB board. By adjusting the intersection and ambiguity of each initial configuration silk screen of the PCB board, the problem of intersection and ambiguity between the positions of each initial configuration silk screen of the PCB board is solved.

[0139] In addition, in one embodiment, step S252 determines whether there is overlap or ambiguity between the initial configuration silk screens of the PCB board based on the spatial positional relationship between the initial configuration silk screens of the PCB board and the bodies corresponding to the initial configuration silk screens, as well as the spatial positional relationship between the initial configuration silk screens of the PCB board, including:

[0140] In step S2522, a bounding box is defined for each initial configuration silk screen of the PCB board and the body corresponding to the initial configuration silk screen, respectively, to obtain a first bounding box and a second bounding box of each PCB board; the first bounding box is the bounding box of the initial configuration silk screen, and the second bounding box is the bounding box of the body corresponding to the initial configuration silk screen.

[0141] The first bounding box is used to indicate the location of the silkscreen, and the second bounding box is used to indicate the location of the body corresponding to the silkscreen. The shape of the bounding box can be set to one of a rectangle, a square, or other shapes depending on the specific situation, which is not specifically limited in this embodiment. The size of the bounding box can be set according to specific needs, which is not specifically limited in this embodiment.

[0142] Step S2524 : determining whether there is an intersection between the initial configuration silk screens of the PCB board based on the consistency of the relative positions between the first bounding boxes and the second bounding boxes.

[0143] The above relative position may include the first bounding box being located above, below, to the left, or to the right of the second bounding box.

[0144] Specifically, if the relative positions of the first and second bounding boxes of any two silk screens are consistent, there is no intersection between the two silk screens. If the relative positions of the first and second bounding boxes of any two silk screens are inconsistent, there is an intersection between the two silk screens. By traversing all silk screen pairs, it is determined whether there is an intersection between the silk screens in the initial configuration of the PCB board.

[0145] Step S2526 , based on the spatial positional relationship between the initial configuration silk screens of the PCB board, determining the direction vector angles and distances between each pair of the initial configuration silk screens of the PCB board.

[0146] In order to calculate the angle between the direction vectors of two silk screens, it is necessary to determine the direction vectors of the two silk screens. To determine the direction vectors of the two silk screens, it is necessary to determine them based on the starting point and the ending point of the two silk screens.

[0147] The specific process can be exemplified as follows:

[0148] For example, if there are two silk screens, the first silk screen and the second silk screen, the starting point of the first silk screen is P1 and the ending point is P2, and the starting point of the second silk screen is P3 and the ending point is P4. The coordinates of P1 are (x1, y1), the coordinates of P2 are (x2, y2), the coordinates of P3 are (x3, y3), and the coordinates of P4 are (x4, y4).

[0149] The calculation process of the direction vector V1 of the first screen print is as follows:

[0150] V1=P2-P1=(x2-x1,y2-y1);

[0151] The calculation process of the direction vector V2 of the second silk screen is as follows:

[0152] V2=P4-P3=(x4-x3, y4-y3);

[0153] The calculation process of the angle θ between the direction vectors of the first silk screen and the second silk screen is as follows:

[0154] ;

[0155] in, is the magnitude of the direction vector V1, is the magnitude of the direction vector V2.

[0156] The distance d between the first and second silk screens can be calculated using the Euclidean distance formula:

[0157] ;

[0158] Step S2528 determines whether there is ambiguity between the initial configuration silk screens of the PCB board based on the direction vector angles and distances between each pair of initial configuration silk screens of the PCB board, as well as a preset ambiguous angle threshold and a preset ambiguous distance threshold. The preset ambiguous angle threshold is an angle value used to determine whether the direction vector angle between two silk screens meets the ambiguity judgment requirement. The preset ambiguous distance threshold is a distance value used to determine whether the distance between two silk screens meets the ambiguity requirement.

[0159] For example, the preset ambiguity angle threshold is 45°, and the preset ambiguity distance threshold is 30 mil. Then, only when the direction vector angle between the two silk screens is less than 45° and the distance is less than 30 mil, it is determined that there is ambiguity between the two silk screens. Otherwise, there is no ambiguity between the two silk screens.

[0160] This embodiment traverses all silk screen pairs to determine whether there is ambiguity between the initial configuration silk screens of the PCB board.

[0161] In the above steps S2522 to S2528, by determining whether there is any intersection or ambiguity between the initial configuration silk screens of the PCB board, it is convenient to subsequently adjust the situation where there is any intersection or ambiguity among the initial configuration silk screens of the PCB board by introducing a genetic penalty function, so as to obtain the final configuration silk screens of the PCB board.

[0162] Furthermore, in one embodiment, step S254, by introducing a genetic penalty function, adjusts the overlap and ambiguity between the initial configuration silk screens of the PCB board to obtain the final configuration silk screens of the PCB board, including:

[0163] Step S2542: constructing a screen printing intersection penalty function based on the intersection determination results between the initial configuration screen printings of the PCB board.

[0164] Specifically, the process of constructing the silk screen intersection penalty function P(x) based on the intersection determination results between the silk screens of each initial configuration of the PCB board is as follows:

[0165] ;

[0166] g(x) is a constraint rule, which here refers to the function for determining whether the silk screens are crossed or connected in series.

[0167] Step S2544 : constructing a silk screen ambiguity penalty function based on the ambiguity determination results between the silk screens of the initial configurations of the PCB board.

[0168] The process of constructing the silkscreen ambiguity penalty function Q(x) based on the ambiguity judgment results between the initial configuration silkscreens of the PCB board is as follows:

[0169] ;

[0170] Step S2546 , using the silk screen intersection penalty function and the silk screen ambiguity penalty function, target optimization is performed on the parameters of each initial configuration silk screen of the PCB board to obtain each final configuration silk screen of the PCB board.

[0171] The specific optimization process is as follows:

[0172] ;

[0173] Among them, f(x) is the particle swarm optimization objective function, and F(x) is the overall optimization objective function.

[0174] In the above steps S2542 to S2546, by constructing a silk screen intersection penalty function and a silk screen ambiguity penalty function, and using the silk screen intersection penalty function and the silk screen ambiguity penalty function, the parameters of each initial configuration silk screen of the PCB board are optimized, the unreasonable positions between the silk screens are adjusted, and the final configuration silk screens of the PCB board are obtained.

[0175] In one embodiment, step S210, determining the types of silk screens that the PCB board needs to be equipped with, includes:

[0176] Step S212: Determine the types of silk screens that the PCB needs to be equipped with based on the PCB and the configuration information corresponding to the PCB; the configuration information includes circuit diagrams and text information.

[0177] The above-mentioned text information may include one or more of the following: text information of the device package, network label, material code, device identification, and text information of the production or process device. The above-mentioned determination of the types of silk screens required for the PCB board based on the PCB board and the configuration information corresponding to the PCB board may include determining the required pad and via silk screens based on the pads and vias on the PCB board that require silk screens, determining the required text silk screens based on the text information in the configuration information corresponding to the PCB board, and determining the required device silk screens based on the circuit diagram in the configuration information corresponding to the PCB board.

[0178] In addition, in one embodiment, the types of silk screen printing include pad and via silk screen printing, text silk screen printing, and device silk screen printing. Step S212, based on the PCB board and the configuration information corresponding to the PCB board, determines the types of silk screen printing that the PCB board needs to be equipped with, including:

[0179] Step S2122: Determine the pad and via silk screens that the PCB board needs to be equipped with based on the pads and vias that need to be equipped with silk screens.

[0180] There are generally two types of automated test pads: pads and vias. Pads serve as device test points for manual or automated device testing; vias, through surface mount pad holes or through-holes, serve as test points for automated testing. Automated testing itself generally does not add redundant silkscreen nodes, but due to production testing requirements, a stencil layer is typically added to protect the pads. For devices with larger bodies than pads, automated test pads are placed within general pads. For automated test pads with hole structures, a via structure with a stencil is obtained.

[0181] In PCB design, the "pastemask" layer is a crucial component of the soldering process for assembling surface mount devices (SMDs). The stencil's function during SMD soldering is to prevent solder paste from being applied to areas that should not be soldered. Solder paste is the material used to connect SMD components to PCB pads, and the pastemask layer acts as a barrier, ensuring that solder paste is applied only to specific soldering areas. The design of the pastemask layer is crucial in PCB manufacturing, as it directly impacts the soldering quality and overall performance of SMD components. When designing a PCB, designers must carefully consider the layout of the pastemask layer, ensuring it aligns with other layers (such as pad layers and component layers) to ensure an accurate and reliable soldering process.

[0182] In this step, the above-mentioned determination of the pads and via silk screens required for the PCB board based on the pads and vias required to be silk screened in the PCB board can be based on the PCB board. The pads and vias required to be silk screened in the PCB board can be determined based on the PCB board. Furthermore, the pads and via silk screens required for the PCB board can be determined based on the pads and vias required to be silk screened in the PCB board.

[0183] Step S2124, based on the text information in the configuration information corresponding to the PCB board, determine the text silk screen that the PCB board needs to be equipped with; the text silk screen includes high-frequency signal silk screen, device identification silk screen, process or production device silk screen, package silk screen and network label silk screen.

[0184] Among them, the above-mentioned determination of the text silk screen that the PCB board needs to be equipped with based on the text information in the equipment information corresponding to the PCB board can be based on the text information of the device package in the text information to determine the package silk screen that the PCB board needs to be equipped with, based on the network label in the text information to determine the network label silk screen that the PCB board needs to be equipped with, based on the material code in the text information to determine the high-frequency signal silk screen that the PCB board needs to be equipped with, based on the device identification in the text information to determine the device identification silk screen that the PCB board needs to be equipped with, based on the production or process device text information in the text information to determine the process or production device silk screen that the PCB board needs to be equipped with, etc. It should be noted that other content of the text information can also be set according to needs to further determine other types of silk screens that the PCB board needs to be equipped with. The specific content of the text information and the type of silk screen are not specifically limited in this embodiment.

[0185] Step S2126: Determine the device silk screen that the PCB needs to be equipped with based on the circuit diagram in the configuration information corresponding to the PCB; the device silk screen includes the device bit number silk screen.

[0186] PCBs contain multiple components, each with a unique device name. These device names use device numbers as unique identifiers to facilitate quick component location during assembly, repair, and identification. Device numbers are typically represented by a combination of letters and numbers, with letters representing the component type and numbers representing the component number. For example, a resistor might have the device number R1, and a capacitor might have the device number C2.

[0187] In this step, the above-mentioned determination of the device silk screen that the PCB board needs to be equipped with based on the circuit diagram in the equipment information corresponding to the PCB board can be carried out by reading the device bit numbers corresponding to different device names in the circuit diagram in the equipment information corresponding to the PCB board to determine the device bit number silk screen that the PCB board needs to be equipped with.

[0188] In the above steps S2122 to S2126, the types of silk screens that the PCB board needs to be equipped with are determined based on the PCB board and the equipment information corresponding to the PCB board. The types of silk screens that the PCB board needs to be equipped with facilitate subsequent determination of the structural parameters of the silk screens that the PCB board needs to be equipped with according to the pre-established placement rules of different types of silk screens, so as to reduce the dimensionality of the structural parameters corresponding to the silk screens that the PCB board needs to be equipped with to a two-dimensional space, thereby facilitating the subsequent optimization of the structural parameters of the silk screens after dimensionality reduction to obtain the optimized parameters of each silk screen.

[0189] Furthermore, in one embodiment, the text silk screen printing includes high-frequency signal silk screen printing; the method further includes:

[0190] Step S1: Determine the materials to be included in the PCB board based on the material codes in the text information.

[0191] When configuring PCB screen printing, the screen printing material itself has a certain dielectric constant. When placed in the transmission path of high-frequency or radio frequency signals, it changes the reference material dielectric constant of the original signal. Because low-frequency signals have longer wavelengths and are less sensitive to material properties, this change is generally insensitive to low-frequency signals. However, for high-frequency signals, due to their shorter wavelengths, the signal becomes extremely sensitive to changes in material properties. This change in dielectric constant can lead to significant changes in signal transmission characteristics, such as impedance mismatch. Impedance mismatch results in significant energy waste and increased losses, and cannot be optimized at the algorithm level. Therefore, when configuring PCB screen printing, it is necessary to identify high-frequency signal networks—that is, to determine the materials on the PCB board that carry high-frequency signals. Specifically, a method for identifying materials on the PCB board that carry high-frequency signals can be to determine the materials to be included in the PCB board based on the material codes in the text information. Then, using a preset simulation signal database, simulation is performed on each material to determine the materials on the PCB board that carry high-frequency signals.

[0192] Because the material code is the unique code of the material, the various materials to be equipped in the PCB board can be determined through the material code in the text information.

[0193] Step S2: simulating various materials to be included in the PCB board using a preset simulation signal database to determine materials in the PCB board that have high-frequency signals.

[0194] The preset simulation signal database can be a collection of signal data generated during various simulation experiments or simulation processes. These signals can include time series data of various physical quantities, such as voltage, current, frequency, and phase. Furthermore, the simulation signal database can include information such as material codes, material descriptions, frequency ranges, and application scenarios.

[0195] The preset simulation signal database is a pre-established material-based simulation signal database. This database is used to simulate each material to be included in the PCB board by inputting it into the preset simulation signal database to identify materials in the PCB board that have high-frequency signals. Specifically, the preset simulation signal database can be used to match each material to be included in the PCB board with simulation signal data associated with the current material, thereby identifying the material in the PCB board that has high-frequency signals.

[0196] Before using a preset simulation signal database to simulate various materials to be included in a PCB and identify materials with high-frequency signals, it is necessary to construct a preset simulation signal database. This construction of the preset simulation signal database can involve identifying the high-frequency signal network using devices such as radio frequency modules, identifying the network paths of resistors, capacitors, and inductors in the high-frequency matching circuit, and connecting the high-frequency signal main loop in series to generate complete high-frequency signal network data. The preset simulation signal database is then constructed based on this complete high-frequency signal network data.

[0197] For example, the above simulation signal database can be shown in Table 1:

[0198] Table 1

[0199]

[0200] Among them: "New Part Number" is the material code; "PIN Number" is the pin number; "XNet Name" is the network name, which indicates the original network name of the pin and matches the network name in the actual project; "BUS NAME" is the network group name; "Net Type" is the network type, which can be used to determine the signal subtype and apply different electrical templates to judge the simulation results; "Edge Sampling" is edge sampling, which can be used to determine the actual operating rate of the signal; "Signal Type" is the signal protocol type, which can be used to determine the signal type of this network. "Impedance" is the nominal impedance value of the signal, which serves as the basis for impedance analysis judgment. "WI-FI" is a wireless local area network technology that allows electronic devices to connect to the network via wireless signals, enabling data transmission and internet access. It should be noted that the field design will be adjusted according to the specific scenario depending on the simulation type. For example, when performing active signal and power simulation, a classification field for active device models can be added.

[0201] Step S3: Based on the material with high-frequency signals in the PCB board, determine the high-frequency signal silk screen to be equipped in the PCB board.

[0202] In the above steps S1 to S3, the various materials to be equipped in the PCB board are determined based on the material codes in the text information. Then, the various materials to be equipped in the PCB board are simulated using a preset simulation signal database. Based on the output signals in the simulation, the materials with high-frequency signals in the PCB board are determined. Finally, based on the materials with high-frequency signals in the PCB board, the high-frequency signal silk screen to be equipped in the PCB board is determined.

[0203] Figure 3This is a schematic diagram of the PCB silk screen configuration result provided by an embodiment of the present application. Figure 3 As shown, yellow is the device number silk screen, white is the device identification silk screen, green is the package silk screen, and blue is the network label silk screen. This silk screen is currently placed on the back of the device.

[0204] The present embodiment is described and illustrated below through preferred embodiments.

[0205] Figure 4 This is a flow chart of a PCB screen printing configuration method provided by a preferred embodiment of the present application. Figure 4 As shown, the PCB silk screen configuration method includes the following steps:

[0206] Step S401, determining the types of silk screens that the PCB board needs to be equipped with;

[0207] Step S402: determining structural parameters of each silk screen required for the PCB board based on the type of each silk screen required for the PCB board and pre-established placement rules for different types of silk screens;

[0208] Step S403: Based on the multi-dimensional structured parameters of each silk screen that the PCB board needs to be equipped with, construct the particle swarm parameters in the particle swarm algorithm and define the rules of the particle swarm parameters in the particle swarm algorithm; wherein the rules of the particle swarm parameters include solving the convergence range and adjusting the speed;

[0209] Step S404: Using the defined particle swarm parameter rules, the reduced-dimensional parameters of each silk screen required for the PCB board are optimized to obtain the optimized parameters of each silk screen required for the PCB board;

[0210] Step S405, using the optimized parameters of each silk screen required for the PCB board, setting the initial configuration of each silk screen required for the PCB board, and obtaining each initial configuration silk screen of the PCB board;

[0211] Step S406, based on the spatial positional relationship between each initial configuration silk screen of the PCB board and the body corresponding to the initial configuration silk screen, and the spatial positional relationship between each initial configuration silk screen of the PCB board, determining whether there is overlap and ambiguity between the initial configuration silk screens of the PCB board;

[0212] Step S407, constructing a screen printing intersection penalty function based on the intersection determination results between the initial configuration screen printings of the PCB board;

[0213] Step S408: constructing a silk screen ambiguity penalty function based on the ambiguity determination results between the silk screens of the initial configurations of the PCB board;

[0214] Step S409 , using the silk screen intersection penalty function and the silk screen ambiguity penalty function, target optimization is performed on the parameters of each initial configuration silk screen of the PCB board to obtain each final configuration silk screen of the PCB board.

[0215] Steps S401 to S409 above, through pre-established placement rules for different types of silk screens, can determine the structural parameters corresponding to each silk screen required on the PCB board, once the types of silk screens required on the PCB board are determined. By classifying the silk screens and determining the placement rules for the silk screens of different classifications, the structural parameters corresponding to each silk screen required on the PCB board are reduced in dimension, and then the structural parameters of the reduced silk screens are optimized to obtain the optimized parameters for each silk screen. Based on the optimized parameters for each silk screen, the initial configuration of each silk screen for the PCB board is obtained. Because the silk screen parameters in this case are only reduced in dimension and optimized based on a single silk screen, there may be problems such as overlap and ambiguity between the silk screens. Therefore, it is necessary to globally adjust the initial configuration of the silk screens to obtain the final configuration of each silk screen on the PCB board. This method supports newly designed automated silk screen layout and is applicable to multiple types of silk screens in various scenarios, making it versatile. It solves the problem that the existing PCB silk screen configuration method does not support the automatic silk screen layout of new designs, has a small application range, and cannot meet complex and diverse scenarios and business needs.

[0216] It should be understood that, although the various steps in the flowcharts involved in the various embodiments described above are displayed in sequence according to the instructions of the arrows, these steps are not necessarily executed in sequence in the order indicated by the arrows. Unless otherwise specified herein, there is no strict order restriction on the execution of these steps, and these steps can be executed in other orders. Moreover, at least a portion of the steps in the flowcharts involved in the various embodiments described above can include multiple steps or multiple stages, and these steps or stages are not necessarily executed and completed at the same time, but can be executed at different times, and the execution order of these steps or stages is not necessarily to be carried out in sequence, but can be executed in turn or alternately with other steps or at least a portion of steps or stages in other steps.

[0217] Based on the same inventive concept, a PCB screen printing configuration device is also provided in this embodiment. The device is used to implement the above-mentioned embodiments and preferred embodiments. The details that have been described will not be repeated here. The terms "module," "unit," "subunit," etc. used below may refer to a combination of software and / or hardware that implements a predetermined function. Although the devices described in the following embodiments are preferably implemented in software, implementation using hardware, or a combination of software and hardware, is also possible and contemplated.

[0218] In one embodiment, Figure 5This is a structural block diagram of a PCB screen printing configuration device provided by an embodiment of the present application. Figure 5 As shown, the PCB silk screen configuration device includes:

[0219] Type determination module 51, used to determine the types of silk screens that need to be provided on the PCB board;

[0220] A parameter determination module 52 is configured to determine structural parameters of each silk screen required for the PCB board based on the type of silk screen required for the PCB board and pre-established placement rules for different types of silk screens;

[0221] An optimization module 53 is used to optimize the structural parameters of each silk screen that needs to be equipped on the PCB board, and obtain the optimized parameters of each silk screen that needs to be equipped on the PCB board;

[0222] The silk screen setting module 54 is used to set the initial configuration of each silk screen required for the PCB board using the optimized parameters of each silk screen required for the PCB board, and obtain each initial configuration silk screen of the PCB board;

[0223] And an adjustment module 55 is used to globally adjust each initial configuration silk screen based on the spatial position relationship between each initial configuration silk screen of the PCB board and the body corresponding to the silk screen, and the spatial position relationship between each initial configuration silk screen of the PCB board to obtain each final configuration silk screen of the PCB board.

[0224] The above-mentioned PCB screen printing configuration device uses pre-established placement rules for different types of screen printing. Furthermore, upon determining the types of screen printing required on a PCB board, it can determine the structural parameters corresponding to each screen printing required on the PCB board. By classifying the screen printing and determining placement rules for the screen printings of different categories, it performs dimensionality reduction on the structural parameters corresponding to each screen printing required on the PCB board. It then optimizes the structural parameters of the reduced screen printings to obtain optimized parameters for each screen printing. Based on the optimized parameters for each screen printing, the initial configuration screen printing configuration for the PCB board is obtained. Because the dimensionality reduction and optimization of the screen printing parameters in this case are based only on a single screen printing, there may be overlap and ambiguity between screen printings. Therefore, it is necessary to globally adjust the initial configuration screen printing configuration to obtain the final configuration of each screen printing on the PCB board. This method supports newly designed automated screen printing layouts and is applicable to multiple types of screen printings in various scenarios, thus being universal. This method addresses the problems of existing PCB screen printing configuration methods, which lack support for newly designed automated screen printing layouts, have a limited scope of application, and cannot meet complex and diverse scenarios and business needs.

[0225] It should be noted that the above modules can be functional modules or program modules, and can be implemented through software or hardware. For modules implemented through hardware, the above modules can be located in the same processor; or the above modules can be located in different processors in any combination.

[0226] In one embodiment, a computer device is provided, including a memory and a processor, wherein a computer program is stored in the memory, and when the processor executes the computer program, any one of the PCB screen printing configuration methods in the above embodiments is implemented.

[0227] Those skilled in the art will appreciate that all or part of the processes in the above-mentioned embodiments can be implemented by instructing the relevant hardware through a computer program. The computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the above-mentioned embodiments. In particular, any reference to memory, database, or other media used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can take various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM). The databases involved in the various embodiments provided herein may include at least one of a relational database and a non-relational database. Non-relational databases may include, but are not limited to, distributed databases based on blockchains. The processors involved in the various embodiments provided herein may be, but are not limited to, general-purpose processors, central processing units (CPUs), graphics processors (GPUs), digital signal processors (DSPs), programmable logic devices (PLDs), data processing logic devices based on quantum computing, and the like.

[0228] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0229] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present application shall be determined by the appended claims.

Claims

1. A PCB screen printing configuration method, characterized in that: The method comprises: Determine the types of silk screens that the PCB board needs to be equipped with; Based on the types of the silk screens that the PCB needs to be equipped with and pre-established placement rules for different types of silk screens, structural parameters of the silk screens that the PCB needs to be equipped with are determined; the structural parameters of the silk screens are parameters of a two-dimensional structure; the two-dimensional structure includes two dimensions: type and structural parameters corresponding to each type; Optimizing the structural parameters of each of the silk screens required for the PCB board to obtain optimized parameters of each of the silk screens required for the PCB board; Using the optimized parameters of the silk screens required for the PCB board, setting the initial configurations of the silk screens required for the PCB board, and obtaining the initial configuration silk screens of the PCB board; Based on the spatial positional relationship between each of the initial configuration silk screens of the PCB board and the body corresponding to the initial configuration silk screen, and the spatial positional relationship between each of the initial configuration silk screens of the PCB board, each of the initial configuration silk screens is globally adjusted to obtain each of the final configuration silk screens of the PCB board.

2. The PCB screen printing configuration method according to claim 1, characterized in that: Optimizing the structural parameters of each of the silk screens required for the PCB board to obtain the optimized parameters of each of the silk screens required for the PCB board includes: The particle swarm algorithm is used to optimize and solve the multi-dimensional structural parameters of each of the silk screens that the PCB board needs to be equipped with, so as to obtain the optimized parameters of each of the silk screens that the PCB board needs to be equipped with.

3. The PCB screen printing configuration method according to claim 2, characterized in that: The particle swarm algorithm is used to optimize and solve the multi-dimensional structural parameters of each of the silk screens that the PCB board needs to be equipped with, and the optimized parameters of each of the silk screens that the PCB board needs to be equipped with are obtained, including: Based on the structural parameters of the two-dimensional structures of each of the silk-screens that the PCB board needs to be equipped with, constructing the particle swarm parameters of the two-dimensional structure in the particle swarm algorithm, and defining the rules of the particle swarm parameters in the particle swarm algorithm; wherein the rules of the particle swarm parameters include solving the convergence range and the adjustment speed; By using the defined particle swarm parameter rules, the dimension-reduced parameters of each of the silk screens that the PCB board needs to be equipped with are optimized and solved to obtain the optimized parameters of each of the silk screens that the PCB board needs to be equipped with.

4. The PCB screen printing configuration method according to claim 3, characterized in that: The rules for defining the particle swarm parameters in the particle swarm algorithm include: Determining a convergence range of particle swarm parameters in the particle swarm algorithm based on the size of the silk screen body structure and a preset error range of the silk screen position; Based on the size of the body structure of the silk screen, the adjustment speed of the particle swarm parameters in the particle swarm algorithm is determined.

5. The PCB screen printing configuration method according to claim 1, characterized in that: The method of globally adjusting each of the initial configuration silk screens based on the spatial positional relationship between each of the initial configuration silk screens of the PCB board and the bodies corresponding to the initial configuration silk screens, and the spatial positional relationship between each of the initial configuration silk screens of the PCB board, to obtain each of the final configuration silk screens of the PCB board, includes: Based on the spatial positional relationship between each of the initial configuration silk screens on the PCB board and the bodies corresponding to the initial configuration silk screens, and the spatial positional relationship between each of the initial configuration silk screens on the PCB board, determining whether there is overlap and ambiguity between the initial configuration silk screens on the PCB board; By introducing a genetic penalty function, the overlap and ambiguity between the initial configuration silk screens of the PCB board are adjusted to obtain the final configuration silk screens of the PCB board.

6. The PCB screen printing configuration method according to claim 5, characterized in that: The determining whether there is overlap and ambiguity between the initial configuration silk screens of the PCB board based on the spatial positional relationship between the initial configuration silk screens of the PCB board and the bodies corresponding to the initial configuration silk screens, and the spatial positional relationship between the initial configuration silk screens of the PCB board, includes: For each of the initial configuration silk screens of the PCB board and the body corresponding to the initial configuration silk screen, a bounding box is defined respectively, to obtain a first bounding box and a second bounding box of the PCB board; the first bounding box is the bounding box of the initial configuration silk screen, and the second bounding box is the bounding box of the body corresponding to the initial configuration silk screen; Determining whether there is an intersection between the initial configuration silk screens of the PCB board based on consistency of relative positions between the first bounding boxes and the second bounding boxes; Determining, based on the spatial positional relationship between the initial configuration silk screens of the PCB board, the direction vector angles and distances between each pair of the initial configuration silk screens of the PCB board; Based on the directional vector angles and distances between each pair of the initial configuration silk screens of the PCB board, as well as a preset ambiguous angle threshold and a preset ambiguous distance threshold, it is determined whether there is ambiguity between each of the initial configuration silk screens of the PCB board; the preset ambiguous angle threshold is an angle value used to determine whether the directional vector angle between two silk screens meets the ambiguity judgment requirement; the preset ambiguous distance threshold is a distance value used to determine whether the distance between two silk screens meets the ambiguity requirement.

7. The PCB screen printing configuration method according to claim 6, characterized in that: The method of introducing a genetic penalty function to adjust the overlap and ambiguity between the initial configuration silk screens of the PCB board to obtain the final configuration silk screens of the PCB board includes: Constructing a screen printing intersection penalty function based on the intersection determination results between the initial configuration screen printings of the PCB board; Constructing a silk screen ambiguity penalty function based on the ambiguity determination results between the initial configuration silk screens of the PCB board; The silk screen intersection penalty function and the silk screen ambiguity penalty function are used to perform target optimization on the parameters of each of the initial configuration silk screens of the PCB board to obtain each of the final configuration silk screens of the PCB board.

8. The PCB screen printing configuration method according to claim 1, characterized in that: Determining the types of silk screens that the PCB board needs to be equipped with includes: Based on the PCB board and the configuration information corresponding to the PCB board, the types of the silk screens that the PCB board needs to be equipped with are determined; the configuration information includes a circuit diagram and text information.

9. The PCB screen printing configuration method according to claim 8, characterized in that: The types of silk screen printing include pad and via silk screen printing, text silk screen printing, and device silk screen printing; and determining the types of each silk screen printing that the PCB board needs to be equipped with based on the PCB board and the configuration information corresponding to the PCB board includes: Determining the pad and via silk screens that the PCB needs to be equipped with based on the pads and vias that need to be equipped with silk screens; Determining, based on the text information in the configuration information corresponding to the PCB board, the text silk screen that the PCB board needs to be equipped with; the text silk screen includes a high-frequency signal silk screen, a device identification silk screen, a process or production device silk screen, a package silk screen, and a network label silk screen; Based on the circuit diagram in the configuration information corresponding to the PCB board, the device silk screen that the PCB board needs to be equipped with is determined; the device silk screen includes the device position number silk screen.

10. The PCB screen printing configuration method according to claim 9, characterized in that: The text silk screen printing includes high-frequency signal silk screen printing; the method further includes: Determining the materials to be included in the PCB board based on the material codes in the text information; Using a preset simulation signal database, simulating each of the materials to be equipped in the PCB board, and determining the materials in the PCB board having high-frequency signals; Based on the material having high-frequency signals in the PCB board, the high-frequency signal silk screen to be provided in the PCB board is determined.

11. The PCB screen printing configuration method according to claim 1, characterized in that: The placement rules of the different types of silk screens include at least one of basic silk screen placement rules, high-frequency signal silk screen placement rules, pad and via silk screen placement rules, and process or production device silk screen placement rules; the basic silk screen placement rules include device position number silk screen placement rules, device identification silk screen placement rules, package silk screen placement rules, and network label silk screen placement rules.

12. A PCB screen printing configuration device, characterized in that: The device comprises: Type determination module, used to determine the types of silk screens that the PCB board needs to be equipped with; a parameter determination module for determining structural parameters of each silk screen required for the PCB board based on the type of each silk screen required for the PCB board and pre-established placement rules for different types of silk screens; the structural parameters of the silk screen are parameters of a two-dimensional structure; the two-dimensional structure includes two dimensions: type and structural parameters corresponding to each type; An optimization module, configured to optimize the structural parameters of each of the silk screens required to be provided on the PCB board, and obtain optimized parameters of each of the silk screens required to be provided on the PCB board; a silk screen setting module, configured to set the initial configuration of each silk screen required for the PCB board using the optimized parameters of each silk screen required for the PCB board, and obtain each initial configuration silk screen of the PCB board; and an adjustment module for globally adjusting each of the initial configuration silk screens of the PCB board based on the spatial positional relationship between each of the initial configuration silk screens of the PCB board and the body corresponding to the silk screen, as well as the spatial positional relationship between each of the initial configuration silk screens of the PCB board, to obtain each of the final configuration silk screens of the PCB board.

13. A computer device comprising a memory and a processor, wherein the memory stores a computer program, wherein: When the processor executes the computer program, the steps of the PCB screen printing configuration method according to any one of claims 1 to 11 are implemented.

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