Adaptive Integration Method of Flexible Printed Circuit Board in Smart Home Environment

Abstract

The present invention relates to the technical field of flexible circuit board integration, and discloses an adaptive integration method of a flexible circuit board in a smart home environment, including: performing thermal analysis between a module to be processed and a data processor to analyze the data processing duration of the data processor for the module to be processed; based on the thermal analysis result and the data processing duration, selecting a target device, a target module, and a target processor from home appliances, the module to be processed, and the data processor; simulating the bending form of the flexible circuit board with respect to the target module at the installation position, calculating the bending curvature of the bending form, and selecting the final position of the flexible circuit board in the installation position through the bending curvature; configuring a magnetic attraction device of the flexible circuit board; after notifying the magnetic attraction device to control the module connection end of the flexible circuit board to be connected to the target module, using a control operation to instruct the flexible circuit board to perform adaptive integration on the target module. The present invention can release the communication connection between the flexible circuit board and the idle device.

Description

Technical Field

[0001] The present invention relates to an adaptive integration method of a flexible circuit board in a smart home environment, belonging to the technical field of flexible circuit board integration. Background Art

[0002] The flexible circuit board is based on polyimide or polyester film, and has characteristics such as light weight, thin thickness, free bending and folding, etc. It can be arranged arbitrarily according to the spatial layout requirements, move and stretch arbitrarily in three-dimensional space, and can adapt to various complex shapes and narrow spaces in smart home devices, realizing the integration of component assembly and wire connection. Although the one-time initial cost of the flexible circuit board is relatively high, in the case of large-scale production and complex design, due to its ability to reduce the number of hardware, reduce assembly man-hours, improve production efficiency, etc., the comprehensive cost will gradually decrease, which is beneficial to the cost control and market promotion of smart home products.

[0003] Currently, in a smart home environment, generally, the control core of the smart home is integrated into the flexible circuit board, while the external detection devices, control devices, etc. of the smart home are not integrated into the flexible circuit board. That is, the external detection devices, control devices are connected to the control core on the flexible circuit board, so as to achieve the functional integration between the external detection devices, control devices and the control core on the flexible circuit board. For example, the moving wheels, environmental detection sensors, cleaning devices, etc. of a smart sweeping robot are not integrated into the flexible circuit board. Only the control core of the smart sweeping robot is integrated on the flexible circuit board. The control core receives and processes the control information sent by the user through the mobile phone, so as to control the operation of the moving wheels, environmental detection sensors, cleaning devices, and realize the joint intelligent machine control of these 4 items including the moving wheels, environmental detection sensors, cleaning devices and the control core on the flexible circuit board. This process of joint intelligent machine control is called the integration between various functions. For the existing technology, in the same smart home device, except for the control core, there are many functions that are not integrated into the flexible circuit board. If the flexible circuit board needs to control all these functions at the same time, it is necessary to make the control core on the flexible circuit board connect to other functions at the same time. If the smart home device is a large device and there are many connected functions, a flexible circuit board with a sufficient volume is required to connect to other devices. For example, a flexible circuit board with a sufficient width needs to connect to the device at the extreme left and the device at the extreme right at the same time. Secondly, even when some devices are not frequently called by the flexible circuit board, it is still necessary to maintain the connection between the flexible circuit board and this device. This makes it necessary to maintain the connection between the flexible circuit board and the device even when the flexible circuit board does not need to communicate with the device.

[0004] Therefore, there is an urgent need for a solution to release the communication connection between the flexible circuit board and the idle device. Summary of the Invention

[0005] The present invention provides an adaptive integration method of a flexible circuit board in a smart home environment, and its main purpose is to release the communication connection between the flexible circuit board and the idle device.

[0006] To achieve the above object, an adaptive integration method of a flexible circuit board in a smart home environment provided by the present invention includes:

[0007] Query home appliances in the smart home environment, divide the to-be-processed modules and data processors of the home appliances, perform thermal analysis between the to-be-processed modules and the data processors to obtain a thermal analysis result, and analyze the data processing duration of the data processors with respect to the to-be-processed modules;

[0008] Based on the thermal analysis result and the data processing duration, select a target device, a target module, and a target processor from the home appliances, the to-be-processed modules, and the data processors, and install the target processor on a preset flexible board to obtain a flexible circuit board, where the flexible circuit board includes a device connection end and a module connection end;

[0009] Simulate the installation position of the flexible circuit board in the target device, and simulate the bending form of the flexible circuit board with respect to the target module at the installation position, calculate the bending curvature of the bending form, and select the final position of the flexible circuit board in the installation position through the bending curvature;

[0010] After installing the flexible circuit board at the final position, configure the magnetic attraction device of the flexible circuit board, connect the device connection end of the flexible circuit board to the magnetic attraction device, and receive control information sent by a user in the smart home environment in the flexible circuit board;

[0011] Analyze the control target and control operation corresponding to the control information in the flexible circuit board, and based on the control target, notify the magnetic attraction device to control the connection between the module connection end of the flexible circuit board and the target module, and use the control operation to instruct the flexible circuit board to perform adaptive integration on the target module to obtain an adaptive integration result.

[0012] Optionally, the performing thermal analysis between the to-be-processed module and the data processor to obtain a thermal analysis result includes:

[0013] Obtain the connecting wires between the to-be-processed module and the data processor;

[0014] Intercept the bare wires in the connecting wires;

[0015] Query the resistance, current, length, and cross-sectional radius of the bare wires;

[0016] Calculate the resistivity of the bare wire using the resistance, the current, the cross-sectional radius, and the length;

[0017] Measure the surface temperature and the ambient temperature of the bare wire;

[0018] Calculate the thermal conductivity of the bare wire based on the length, the cross-sectional radius, and the surface temperature;

[0019] Calculate the convective heat transfer coefficient of the bare wire based on the surface temperature and the ambient temperature;

[0020] Create a thermoelectric analysis system in a preset thermoelectric analysis software;

[0021] In the thermoelectric analysis system, create a material model of the bare wire based on the resistivity, the thermal conductivity, and the convective heat transfer coefficient;

[0022] Construct a geometric model corresponding to the material model using the length and the cross-sectional radius;

[0023] Set the boundary conditions of the geometric model;

[0024] After taking the current as the input data of the geometric model and the material model, determine the temperature contour map corresponding to the geometric model and the material model;

[0025] Take the temperature contour map as the thermal analysis result;

[0026] Among them, the boundary conditions include the end-face voltage and the end-face current.

[0027] Optionally, the analysis of the data processing duration of the data processor for the to-be-processed module includes:

[0028] Query the single-module duration of the data processor for the to-be-processed module;

[0029] Obtain the module processing order of the data processor for the to-be-processed module;

[0030] According to the single-module duration and the module processing order, calculate the data processing duration of the data processor for the to-be-processed module using the following formula:

[0031]

[0032] Among them, represents the data processing duration, represents the th module to be processed in the module processing order needs to wait for the The single-module duration of a module to be processed, and n represents the number of modules to be processed.

[0033] Optionally, selecting a target device, a target module, and a target processor from the home appliance, the module to be processed, and the data processor based on the thermal analysis result and the data processing duration includes:

[0034] Setting a temperature threshold for the thermal analysis result and a duration threshold for the data processing duration;

[0035] Identifying the maximum temperature in the thermal analysis result;

[0036] When the maximum temperature is lower than the temperature threshold and the data processing duration is greater than the duration threshold, obtaining the home appliance, the module to be processed, and the data processor corresponding to the thermal analysis result and the data processing duration, to obtain a target device, a target module, and a target processor.

[0037] Optionally, simulating the bending form of the flexible circuit board with respect to the target module at the installation position includes:

[0038] Connecting the output wire of the flexible circuit board to the receiving wire of the target module;

[0039] Querying the fixed-output distance between the fixed end of the flexible circuit board and the output wire;

[0040] Querying the fixed-receiving distance between the fixed end of the flexible circuit board and the receiving wire;

[0041] When the fixed-output distance is greater than the fixed-receiving distance, determining that the flexible circuit board needs to be bent when connecting the output wire and the receiving wire;

[0042] When the flexible circuit board needs to be bent, identifying the bendable space between the flexible circuit board and the target module;

[0043] Performing circuit board bending with a preset number of bending times on the flexible circuit board within the bendable space to obtain a bending form.

[0044] Optionally, calculating the bending curvature of the bending form includes:

[0045] Performing mesh division on the bending surface corresponding to the bending form to obtain divided meshes;

[0046] Extracting the grid center points of the divided meshes;

[0047] Calculating the grid curvature of the divided meshes according to the grid center points;

[0048] Calculate the bending curvature of the bending form according to the grid curvature.

[0049] Optionally, the magnetic attraction device for configuring the flexible circuit board includes:

[0050] Obtain the target module;

[0051] Based on the module processing sequence corresponding to the target module, construct a magnet loop between each target module;

[0052] Obtain the spare magnet corresponding to the magnet loop;

[0053] Configure the sliding control device when the spare magnet slides on the magnet loop;

[0054] Calculate the adsorption force of the spare magnet on the flexible circuit board;

[0055] When the adsorption force is less than the traction force of the sliding control device on the magnet, select the target magnet on the magnet loop from the spare magnets;

[0056] After installing the target magnet on the magnet loop, use the magnet loop with the target magnet installed and the sliding control device as the magnetic attraction device for the flexible circuit board.

[0057] Optionally, the calculation of the adsorption force of the spare magnet on the flexible circuit board includes:

[0058] Use the following formula to calculate the adsorption force of the spare magnet on the flexible circuit board:

[0059]

[0060] where F represents the adsorption force, represents the vacuum permeability, V represents the magnetic energy volume of the spare magnet, M represents the magnetic moment of the spare magnet, and d represents the distance between the spare magnet and the bare wire of the flexible circuit board.

[0061] Optionally, based on the control target, notify the magnetic attraction device to control the connection between the module connection end of the flexible circuit board and the target module, including:

[0062] Obtain the magnet loop with the target magnet installed and the sliding control device in the magnetic attraction device;

[0063] Transmit the control target to the sliding control device;

[0064] Compare the control target with the current target corresponding to the target magnet in the sliding control device;

[0065] When the current target corresponding to the control target and the target magnet is consistent, use the target magnet to connect the module connection end of the flexible circuit board to the target module;

[0066] When the current target corresponding to the control target and the target magnet is inconsistent, query the relative position of the control target relative to the current target in the sliding control device;

[0067] Use the sliding control device to pull the target magnet to slide on the magnet loop to the relative position;

[0068] At the relative position, use the target magnet to connect the module connection end of the flexible circuit board to the target module.

[0069] Optionally, the use of the control operation to instruct the flexible circuit board to perform adaptive integration on the target module to obtain an adaptive integration result includes:

[0070] Transmit the control operation from the flexible circuit board to the target module;

[0071] In the target module, receive the control operation;

[0072] According to the control operation, run the module function in the target module;

[0073] Return the operation data of the target module regarding the module function to the flexible circuit board to complete the adaptive integration of the flexible circuit board on the target module and obtain an adaptive integration result.

[0074] Compared with the problems described in the background art, in the embodiment of the present invention, thermal analysis is performed between the to-be-processed module and the data processor to analyze the heat condition of the wire caused by the current flow when the to-be-processed module and the data processor are connected by exposed wires, so as to avoid potential safety hazards caused by excessive wire heat. Further, in the embodiment of the present invention, by analyzing the data processing duration of the data processor for the to-be-processed module, the waiting duration required before each current module is connected to the flexible circuit board in sequence is analyzed. The longer the waiting duration, the longer the flexible circuit board needs to process the previous module, and it will not quickly call the current module for processing. That is to say, the flexible circuit board will not frequently switch between the previous module and the current module. Then, the combination of the previous module and the current module can be selected as the subsequent target module, because this can reduce the number of times the flexible circuit board bends in different forms when switching between different modules, thereby extending the service life of the flexible circuit board. In the embodiment of the present invention, based on the thermal analysis result and the data processing duration, a target device, a target module, and a target processor are selected from the home device, the to-be-processed module, and the data processor, so as to select functional modules in the same device with small heat and long data processing duration. Further, in the embodiment of the present invention, the bending curvature of the bending form is calculated to evaluate the bending degree of the flexible circuit board at a random installation position by using the bending curvature, so as to select the installation positions that minimize the bending degree. In the embodiment of the present invention, the magnetic attraction device of the flexible circuit board is configured to use the magnetic attraction device to disconnect the communication connection with the target module when the flexible circuit board does not need to communicate and process data with the target module, and communicate with other target modules, so as to release the communication connection between the flexible circuit board and the idle device. Therefore, the method for adaptive integration of the flexible circuit board in the smart home environment provided by the embodiment of the present invention can release the communication connection between the flexible circuit board and the idle device. BRIEF DESCRIPTION OF THE DRAWINGS

[0075] Figure 1 It is a schematic flowchart of a method for adaptive integration of a flexible circuit board in a smart home environment provided by an embodiment of the present invention;

[0076] Figure 2 It is a schematic diagram of a magnetic attraction device for implementing the method for adaptive integration of the flexible circuit board in the smart home environment provided by an embodiment of the present invention;

[0077] Figure 3 It is a schematic diagram of a module for implementing the method for adaptive integration of the flexible circuit board in the smart home environment provided by an embodiment of the present invention.

[0078] The implementation, functional features, and advantages of the present invention will be further described in conjunction with the embodiments and with reference to the accompanying drawings. Specific Embodiments

[0079] It should be understood that the specific embodiments described herein are only for explaining the present invention and are not used to limit the present invention.

[0080] The embodiments of the present application provide an adaptive integration method of a flexible circuit board in a smart home environment. The execution subject of the adaptive integration method of the flexible circuit board in the smart home environment includes, but is not limited to, at least one of electronic devices such as a server, a terminal, etc. that can be configured to execute the method provided by the embodiments of the present application. In other words, the adaptive integration method of the flexible circuit board in the smart home environment can be executed by software or hardware installed on a terminal device or a server device. The server includes, but is not limited to: a single server, a server cluster, a cloud server, or a cloud server cluster, etc.

[0081] Embodiment 1:

[0082] Refer to Figure 1 As shown, it is a schematic flowchart of an adaptive integration method of a flexible circuit board in a smart home environment provided by an embodiment of the present invention. In this embodiment, the adaptive integration method of the flexible circuit board in the smart home environment includes:

[0083] S1. Query home devices in the smart home environment, divide the to-be-processed modules and data processors of the home devices, perform a thermal analysis between the to-be-processed modules and the data processors, obtain a thermal analysis result, and analyze the data processing duration of the data processors with respect to the to-be-processed modules.

[0084] In the embodiments of the present invention, the home devices are, for example, a smart sweeping robot, a lighting control device, an audio display device, etc. Further, the to-be-processed module refers to various functions in the same home device, such as the moving wheels, environmental detection sensors, cleaning devices, etc. of a smart sweeping robot, and the data processor refers to the data processing center and data control center in the same home device responsible for various functions.

[0085] Further, in the embodiments of the present invention, a thermal analysis is performed between the to-be-processed module and the data processor to analyze the heat condition of the wire caused by the current flowing through when the to-be-processed module and the data processor are connected by a bare wire, so as to avoid potential safety hazards caused by excessive wire heat.

[0086] In one embodiment of the present invention, the thermal analysis between the to-be-processed module and the data processor to obtain a thermal analysis result includes: obtaining the connecting wires between the to-be-processed module and the data processor; intercepting the bare wires in the connecting wires; querying the resistance, current, length, and cross-sectional radius of the bare wires; calculating the resistivity of the bare wires using the resistance, the current, the cross-sectional radius, and the length; measuring the surface temperature and the ambient temperature of the bare wires; and calculating the thermal conductivity of the bare wires according to the length, the cross-sectional radius, and the surface temperature using the following formula:

[0087]

[0088] Wherein, represents the thermal conductivity , represents the cross-sectional area calculated from the cross-sectional radius , represents the heat flux , represents the gradient of the surface temperature , represents the reciprocal of the gradient of the surface temperature, represents the differential length on the bare wire, represents the length of the bare wire, represents the temperature value;

[0089] According to the surface temperature and the ambient temperature, calculate the convective heat transfer coefficient of the bare wire using the following formula:

[0090]

[0091] Wherein, represents the convective heat transfer coefficient, represents the area where the bare wire contacts the air fluid , represents the heat flux , represents the temperature difference between the surface temperature of the bare wire solid and the ambient temperature of the air fluid ;

[0092] Create a thermoelectric analysis system in a preset thermoelectric analysis software; in the thermoelectric analysis system, create a material model of the bare wire based on the resistivity, the thermal conductivity, and the convective heat transfer coefficient; construct a geometric model corresponding to the material model by using the length and the cross-sectional radius; set the boundary conditions of the geometric model; after taking the current as the input data of the geometric model and the material model, determine the temperature contour map corresponding to the geometric model and the material model; take the temperature contour map as the thermal analysis result; wherein, the boundary conditions include the end face voltage and the end face current.

[0093] Wherein, the bare wire refers to a wire without a protective layer, the current refers to the current flowing through the bare wire in a historical period, the cross-sectional radius refers to the bottom radius of the cylinder of the bare wire, and the thermoelectric analysis software is, for example, ANSYS WORKBENCH.

[0094] Optionally, the process of calculating the resistivity of the bare wire by using the resistance, the current, the cross-sectional radius, and the length means: multiplying the resistance by the cross-sectional area corresponding to the cross-sectional radius to obtain a product result; dividing the product result by the length to obtain the resistivity. Further, the process of measuring the surface temperature and the ambient temperature of the bare wire is realized by a temperature sensor. The process of creating a thermoelectric analysis system in a preset thermoelectric analysis software means clicking on the "Thermal-Electric Analysis System" item in ANSYS WORKBENCH. The process of creating the material model of the bare wire is realized by clicking on the "engineering data" item in ANSYS WORKBENCH. The construction of the geometric model corresponding to the material model is realized by clicking on the "geometry" item in ANSYS WORKBENCH. The process of setting the boundary conditions of the geometric model means setting the end face voltage and the end face current on the bare wire. The end face voltage refers to the termination point where the voltage flows through the bare wire and the voltage value of 0 at the termination point. The end face current refers to the starting point where the current flows through the bare wire and the input current value at the starting point. The determination of the temperature contour map corresponding to the geometric model and the material model is obtained by calculating and analyzing the temperature data on the surface of the constructed bare wire model by using the "solve" in ANSYS WORKBENCH.

[0095] Further, in the embodiment of the present invention, by analyzing the data processing duration of the data processor for the to-be-processed module, the waiting duration required for each current module to be connected to the flexible circuit board in sequence is analyzed. The longer the waiting duration, it indicates that the flexible circuit board needs to process the previous module for a long time and will not quickly call the current module for processing. That is to say, the flexible circuit board will not frequently switch between the previous module and the current module. Then, the combination of the previous module and the current module can be selected as the subsequent target module because this can reduce the number of times the flexible circuit board bends in different forms due to switching between different modules, thereby extending the service life of the flexible circuit board.

[0096] In an embodiment of the present invention, the analysis of the data processing duration of the data processor for the to-be-processed module includes: querying the single-module duration of the data processor for the to-be-processed module; obtaining the module processing sequence of the data processor for the to-be-processed module; and calculating the data processing duration of the data processor for the to-be-processed module according to the single-module duration and the module processing sequence by using the following formula:

[0097]

[0098] Wherein, represents the data processing duration, represents the single-module duration of the th to-be-processed module that the th to-be-processed module in the module processing sequence needs to wait for, and n represents the number of to-be-processed modules.

[0099] Wherein, the single-module duration refers to the duration when the data processor conducts data communication and data connection with a single to-be-processed module in the to-be-processed module, and the module processing sequence refers to the sequence in which the data processor schedules the to-be-processed modules and processes the to-be-processed modules in sequence. For example, if the single to-be-processed modules in the to-be-processed module are A (cleaning function), B (detection function), and C (moving function), and the data processor runs A, B, and C in sequence, then the order of A, B, and C is the module processing sequence. The value of is actually the single-module duration of the

[0100] S2. Based on the thermal analysis result and the data processing duration, select a target device, a target module, and a target processor from the home appliance, the to-be-processed module, and the data processor, and install the target processor on a preset flexible board to obtain a flexible circuit board, wherein the flexible circuit board includes a device connection end and a module connection end.

[0101] In an embodiment of the present invention, based on the thermal analysis result and the data processing duration, a target device, a target module, and a target processor are selected from the home device, the to-be-processed module, and the data processor, so as to select a functional module in the same device with low heat and long data processing duration.

[0102] It should be noted that the target module and the target processor need to be in the same target device.

[0103] In an embodiment of the present invention, the selecting of the target device, the target module, and the target processor from the home device, the to-be-processed module, and the data processor based on the thermal analysis result and the data processing duration includes: setting a temperature threshold of the thermal analysis result and a duration threshold of the data processing duration; identifying the maximum temperature in the thermal analysis result; when the maximum temperature is lower than the temperature threshold and the data processing duration is greater than the duration threshold, obtaining the home device, the to-be-processed module, and the data processor corresponding to the thermal analysis result and the data processing duration, so as to obtain the target device, the target module, and the target processor.

[0104] Among them, the temperature threshold is used to screen the target device, the target module, and the target processor with low temperature, and the duration threshold is used to screen the target device, the target module, and the target processor with long duration. It should be noted that the temperature threshold and the duration threshold are obtained according to a large amount of test data in actual scenarios, and the values are different in different scenarios, which will not be further elaborated here.

[0105] Optionally, the process of installing the target processor on the preset flexible board to obtain a flexible circuit board refers to attaching wires, electronic components, etc. required by the target processor to the preset flexible board.

[0106] Among them, the preset flexible board is the predecessor of a flexible circuit board without a circuit installed. The device connection end refers to the end of the flexible circuit board connected to the magnetic attraction device, and the module connection end refers to the end of the flexible circuit board connected to the target module.

[0107] S3. Simulate the installation position of the flexible circuit board in the target device, and simulate the bending form of the flexible circuit board with respect to the target module at the installation position, calculate the bending curvature of the bending form, and select the final position of the flexible circuit board in the installation position through the bending curvature.

[0108] In an embodiment of the present invention, the installation position refers to any random position in the target device where the flexible circuit board can be placed.

[0109] In an embodiment of the present invention, simulating the bending state of the flexible circuit board with respect to the target module at the installation position includes: connecting the output wire of the flexible circuit board to the receiving wire of the target module; querying the fixed-output distance between the fixed end of the flexible circuit board and the output wire; querying the fixed-receiving distance between the fixed end of the flexible circuit board and the receiving wire; when the fixed-output distance is greater than the fixed-receiving distance, determining that the flexible circuit board needs to be bent when connecting the output wire and the receiving wire; when the flexible circuit board needs to be bent, identifying the bendable space between the flexible circuit board and the target module; and performing circuit board bending with a preset number of bending times on the flexible circuit board within the bendable space to obtain the bending state.

[0110] Among them, the output wire refers to the wire at the output end of the flexible circuit board, the receiving wire refers to the wire at the data receiving end of the target module, the fixed end of the flexible circuit board refers to the end where the flexible circuit board is fixed at the installation position, the fixed-output distance refers to the distance traveled on the flexible circuit board when going from the fixed end to the output wire, the fixed-receiving distance refers to the straight-line distance between the fixed end and the receiving wire, the bendable space refers to the space area where the flexible circuit board can be bent and folded in various forms after the flexible circuit board is placed at the installation position, and the preset number of bending times refers to 1 time, that is, only bending a certain position of the flexible circuit board once, rather than bending multiple positions of the flexible circuit board (bending multiple positions requires bending multiple times).

[0111] Further, in an embodiment of the present invention, the bending curvature of the bending state is calculated to use the bending curvature to evaluate the bending degree of the flexible circuit board at a random installation position, so as to select the installation positions that minimize the bending degree.

[0112] In an embodiment of the present invention, calculating the bending curvature of the bending state includes: performing mesh division on the bending surface corresponding to the bending state to obtain divided meshes; extracting the mesh center points of the divided meshes; and calculating the mesh curvature of the divided meshes according to the mesh center points by using the following formula:

[0113]

[0114] Among them, represents the mesh curvature, represents the normal vector perpendicular to the tangent plane at the mesh center point, represents the tangent vector of the tangent plane at the mesh center point, represents the independent variable, represents the second derivative of represents the first derivative of represents the curvature in the direction, when is the maximum curvature, when is the maximum curvature, represents the differential of represents the differential of and represent two mutually orthogonal vectors on the tangent plane at the center point of the grid;

[0115] According to the grid curvature, the bending curvature of the bending shape is calculated using the following formula:

[0116]

[0117] where represents the bending curvature, represents the th grid curvature of the divided grid, represents the number of divided grids.

[0118] Among them, the divided grid refers to multiple rectangular grids of the same size obtained after the bending surface is segmented.

[0119] Optionally, the process of selecting the final position of the flexible circuit board in the installation position through the bending curvature can be to select the installation position corresponding to the minimum bending curvature as the final position, or to set a threshold for the bending curvature and use the installation position corresponding to the bending curvature lower than the threshold as the final position.

[0120] S4. After installing the flexible circuit board at the final position, configure the magnetic attraction device of the flexible circuit board. After connecting the device connection end of the flexible circuit board to the magnetic attraction device, receive the control information sent by the user in the smart home environment in the flexible circuit board.

[0121] In the embodiment of the present invention, by configuring the magnetic attraction device of the flexible circuit board, when the flexible circuit board does not need to communicate and process data with the target module, the communication connection with the target module can be disconnected and connected to other target modules, so as to release the communication connection between the flexible circuit board and the idle device.

[0122] In one embodiment of the present invention, the magnetic attraction device for configuring the flexible circuit board includes: obtaining a target module; constructing a magnet loop between each target module based on the module processing sequence corresponding to the target module; obtaining a spare magnet corresponding to the magnet loop; configuring a sliding control device for the spare magnet when it slides on the magnet loop; calculating the adsorption force of the spare magnet on the flexible circuit board using the following formula:

[0123]

[0124] where F represents the adsorption force, represents the vacuum permeability, V represents the magnetic energy volume of the spare magnet, M represents the magnetic moment of the spare magnet, and d represents the distance between the spare magnet and the bare wire of the flexible circuit board;

[0125] When the adsorption force is less than the traction force of the sliding control device on the magnet, select the target magnet on the magnet loop from the spare magnets; after installing the target magnet on the magnet loop, take the magnet loop with the target magnet installed and the sliding control device as the magnetic attraction device for the flexible circuit board.

[0126] where the spare magnet refers to magnets of different materials, and the sliding control device is used to receive the information sent by the flexible circuit board about which target module to connect to, and traction tools such as a traction rope are used to pull the magnet to slide on the magnet loop until it finally slides to the position where the target module is located. It should be noted that in order for the magnet to attract the flexible circuit board, a magnetizable substance, such as an iron block, needs to be installed on the output wire of the flexible circuit board. When there is a magnet on the target module, the magnet will attract the output end of the flexible circuit board to connect with the receiving end of the target module. The traction force refers to the traction force exerted by the sliding control device on the magnet when pulling the magnet to slide on the magnet loop, which can cause the magnet to move from the previous target module to the next target module.

[0127] Refer to Figure 2 shown, which is a schematic diagram of the magnetic attraction device for implementing the adaptive integration method of the flexible circuit board in a smart home environment provided by an embodiment of the present invention. In Figure 2 1 represents the first target module in the module processing sequence corresponding to the target module, 2 represents the second target module, 3 represents the third target module, 4 represents the magnet, 5 represents the flexible circuit board, 6 represents the fixed end of the flexible circuit board. It should be noted that the fixed end is connected to both the installation position and the traction control center of the sliding control device. Therefore, the fixed end of the flexible circuit board is also the device connection end. 7 represents the magnet loop, and 4 can slide on 7, thus flowing through 1, 2, and 3 in sequence.

[0128] S5. Analyze the control objective and control operation corresponding to the control information in the flexible circuit board. Based on the control objective, notify the magnetic attraction device to control the module connection end of the flexible circuit board to be connected to the target module. After the connection, use the control operation to instruct the flexible circuit board to perform adaptive integration on the target module, and obtain an adaptive integration result.

[0129] Optionally, the process of "analyze the control objective and control operation corresponding to the control information in the flexible circuit board" refers to using the data processing center in the flexible circuit board to analyze which target module of the device the user wants to manipulate (control objective) and the content of the manipulation (control operation). For example, during the process of viewing the data collected by the sensor of a smart floor sweeping robot, the control objective is the sensor module of the smart floor sweeping robot, and the control operation is data return, that is, returning the environmental data collected by the sensor to the flexible circuit board.

[0130] In an embodiment of the present invention, the step of "based on the control objective, notify the magnetic attraction device to control the module connection end of the flexible circuit board to be connected to the target module" includes: obtaining the magnet loop and the sliding control device for installing the target magnet in the magnetic attraction device; transmitting the control objective to the sliding control device; comparing the control objective with the current objective corresponding to the target magnet in the sliding control device; when the control objective is consistent with the current objective corresponding to the target magnet, using the target magnet to connect the module connection end of the flexible circuit board to the target module; when the control objective is inconsistent with the current objective corresponding to the target magnet, querying the relative position of the control objective relative to the current objective in the sliding control device; using the sliding control device to pull the target magnet to slide on the magnet loop to the relative position; at the relative position, using the target magnet to connect the module connection end of the flexible circuit board to the target module.

[0131] Wherein, the relative position refers to the position of the control objective relative to the current objective on the magnet loop.

[0132] In an embodiment of the present invention, the step of "using the control operation to instruct the flexible circuit board to perform adaptive integration on the target module and obtain an adaptive integration result" includes: transmitting the control operation from the flexible circuit board to the target module; in the target module, receiving the control operation; according to the control operation, running the module function in the target module; returning the operation data of the target module regarding the module function to the flexible circuit board to complete the adaptive integration of the flexible circuit board on the target module and obtain an adaptive integration result.

[0133] Compared with the problems described in the background art, in the embodiment of the present invention, thermal analysis is performed between the to-be-processed module and the data processor to analyze the heat condition of the wire caused by the current flow when the to-be-processed module and the data processor are connected by a bare wire, so as to avoid potential safety hazards caused by excessive wire heat. Further, in the embodiment of the present invention, by analyzing the data processing duration of the data processor for the to-be-processed module, the waiting duration required for each current module to be connected to the flexible circuit board in sequence is analyzed. The longer the waiting duration, the longer the flexible circuit board needs to process the previous module for a long time and will not quickly call the current module for processing. That is to say, the flexible circuit board will not frequently switch between the previous module and the current module. Then, the combination of the previous module and the current module can be selected as the subsequent target module because this can reduce the number of times the flexible circuit board bends in different forms when switching between different modules, thereby extending the service life of the flexible circuit board. In the embodiment of the present invention, based on the thermal analysis result and the data processing duration, a target device, a target module, and a target processor are selected from the home device, the to-be-processed module, and the data processor to select functional modules in the same device with small heat and long data processing time. Further, in the embodiment of the present invention, the bending curvature of the bending form is calculated to evaluate the bending degree of the flexible circuit board at a random installation position by using the bending curvature, so as to select installation positions that minimize the bending degree. In the embodiment of the present invention, the magnetic attraction device of the flexible circuit board is configured to use the magnetic attraction device to disconnect the communication connection with the target module and connect to other target modules when the flexible circuit board does not need to communicate and process data with the target module, so as to release the communication connection between the flexible circuit board and the idle device. Therefore, the adaptive integration method of the flexible circuit board provided in the embodiment of the present invention can release the communication connection between the flexible circuit board and the idle device.

[0134] Embodiment 2:

[0135] As Figure 2 shown, it is a functional module diagram of an adaptive integration system of a flexible circuit board in a smart home environment according to the present invention.

[0136] The adaptive integration system 300 of a flexible circuit board in a smart home environment according to the present invention can be installed in an electronic device. According to the functions achieved, the adaptive integration system of the flexible circuit board in a smart home environment can include a duration analysis module 301, a processor installation module 302, a position selection module 303, an information receiving module 304, and an adaptive integration module 305. The modules described in the present invention can also be referred to as units, which refer to a series of computer program segments that can be executed by a processor of an electronic device and can complete fixed functions, and are stored in the memory of the electronic device.

[0137] In the embodiments of the present invention, the functions of each module / unit are as follows:

[0138] The duration analysis module 301 is configured to query home appliances in the smart home environment, divide the to-be-processed modules and data processors of the home appliances, perform thermal analysis between the to-be-processed modules and the data processors to obtain a thermal analysis result, and analyze the data processing duration of the data processor with respect to the to-be-processed modules;

[0139] The processor installation module 302 is configured to select a target device, a target module, and a target processor from the home appliances, the to-be-processed modules, and the data processors based on the thermal analysis result and the data processing duration, and install the target processor on a preset flexible board to obtain a flexible circuit board, where the flexible circuit board includes a device connection end and a module connection end;

[0140] The position selection module 303 is configured to simulate the installation position of the flexible circuit board in the target device, simulate the bending form of the flexible circuit board with respect to the target module at the installation position, calculate the bending curvature of the bending form, and select the final position of the flexible circuit board in the installation position through the bending curvature;

[0141] The information receiving module 304 is configured to configure the magnetic attraction device of the flexible circuit board after installing the flexible circuit board at the final position, connect the device connection end of the flexible circuit board to the magnetic attraction device, and receive control information sent by a user in the smart home environment in the flexible circuit board;

[0142] The adaptive integration module 305 is configured to analyze the control target and control operation corresponding to the control information in the flexible circuit board, notify the magnetic attraction device to control the connection between the module connection end of the flexible circuit board and the target module based on the control target, and use the control operation to instruct the flexible circuit board to perform adaptive integration on the target module to obtain an adaptive integration result.

[0143] Specifically, each module in the adaptive integration system 200 of the flexible circuit board in the smart home environment in the embodiments of the present invention adopts the same technical means as those in the Figure 1 adaptive integration method of the flexible circuit board in the smart home environment described above, and can produce the same technical effects, which will not be elaborated here.

[0144] For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and without departing from the spirit or basic characteristics of the present invention, the present invention can be implemented in other specific forms.

[0145] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit them. Although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present invention can be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of the present invention.

Claims

1. A method for adaptive integration of flexible circuit boards in a smart home environment, characterized in that: The method comprises: Querying home devices in a smart home environment, dividing the home devices into modules to be processed and data processors, performing thermal analysis between the modules to be processed and the data processors, and obtaining thermal analysis results, specifically comprising: obtaining connecting wires between the modules to be processed and the data processors; cutting off the exposed wires in the connecting wires; querying the resistance, current, length and cross-sectional radius of the exposed wire; Calculating the resistivity of the exposed wire using the resistance, the current, the cross-sectional radius, and the length; measuring the surface temperature of the exposed wire and the ambient temperature; Calculating the thermal conductivity of the exposed wire according to the length, the cross-sectional radius, and the surface temperature; calculating a convection heat transfer coefficient of the exposed wire according to the surface temperature and the ambient temperature; Create a thermoelectric analysis system in the preset thermoelectric analysis software; In the thermoelectric analysis system, a material model of the exposed wire is created based on the resistivity, the thermal conductivity, and the convection heat transfer coefficient; constructing a geometric model corresponding to the material model using the length and the cross-sectional radius; Setting boundary conditions of the geometric model; After using the current as input data of the geometric model and the material model, determining a temperature cloud map corresponding to the geometric model and the material model; Taking the temperature cloud map as a thermal analysis result; Wherein, the boundary conditions include end surface voltage and end surface current; Analyzing the data processing time of the module to be processed by the data processor; Based on the thermal analysis results and the data processing time, a target device, a target module, and a target processor are selected from the household device, the module to be processed, and the data processor, and the target processor is mounted on a preset flexible board to obtain a flexible circuit board, wherein the flexible circuit board includes a device connection end and a module connection end; Simulating an installation position of the flexible circuit board in the target device, simulating a bending shape of the flexible circuit board relative to the target module at the installation position, calculating a bending curvature of the bending shape, and selecting a final position of the flexible circuit board at the installation position based on the bending curvature; After the flexible circuit board is installed in the final position, a magnetic device of the flexible circuit board is configured, and after the device connection end of the flexible circuit board is connected to the magnetic device, control information sent by the user in the smart home environment is received in the flexible circuit board; The control target and control operation corresponding to the control information are analyzed in the flexible circuit board. Based on the control target, the magnetic attraction device is notified to control the module connection end of the flexible circuit board to connect with the target module. Then, the control operation is used to instruct the flexible circuit board to adaptively integrate the target module to obtain an adaptive integration result.

2. The method for adaptive integration of a flexible circuit board in a smart home environment according to claim 1, wherein: The analyzing the data processing time of the module to be processed by the data processor includes: querying the data processor about the single module duration of the module to be processed; Obtaining a module processing order of the data processor with respect to the module to be processed; According to the single module duration and the module processing order, the data processing duration of the data processor for the module to be processed is calculated using the following formula: in, Indicates the data processing time. Indicates the first The pending modules need to wait for The single module duration of the modules to be processed, n represents the number of modules to be processed.

3. The method for adaptive integration of a flexible circuit board in a smart home environment as claimed in claim 1, characterized in that: The selecting a target device, a target module, and a target processor from the household device, the module to be processed, and the data processor based on the thermal analysis result and the data processing time includes: Setting a temperature threshold of the thermal analysis result and a time threshold of the data processing time; identifying a maximum temperature in the thermal analysis results; When the maximum temperature is lower than the temperature threshold and the data processing time is greater than the time threshold, the household device, the module to be processed and the data processor corresponding to the thermal analysis result and the data processing time are obtained to obtain the target device, the target module and the target processor.

4. The method for adaptive integration of a flexible circuit board in a smart home environment as claimed in claim 1, wherein: The simulating a bending state of the flexible circuit board relative to the target module at the installation position includes: connecting the output wire of the flexible circuit board to the receiving wire of the target module; querying a fixed-output distance between a fixed end of the flexible printed circuit board and the output wire; querying a fixed-receiving distance between a fixed end of the flexible printed circuit board and the receiving wire; When the fixed-output distance is greater than the fixed-receiving distance, determining that the flexible printed circuit board needs to be bent when connecting the output wire and the receiving wire; When the flexible circuit board needs to be bent, identifying a bendable space between the flexible circuit board and the target module; The flexible circuit board is bent a preset number of times in the bendable space to obtain a bent shape.

5. The method for adaptive integration of a flexible circuit board in a smart home environment according to claim 1, wherein: The calculating the curvature of the curved shape includes: Meshing the curved surface corresponding to the curved shape to obtain a mesh; Extracting the center point of the divided grid; Calculating the grid curvature of the divided grid according to the grid center point; The curvature of the curved shape is calculated according to the grid curvature.

6. The method for adaptively integrating a flexible circuit board in a smart home environment according to claim 1, wherein: The magnetic attraction device configured with the flexible circuit board includes: Get the target module; Building a magnet loop between each target module based on a module processing order corresponding to the target module; Obtaining a spare magnet corresponding to the magnet loop; A sliding control device is provided for the spare magnet when it slides on the magnet loop; Calculating the adsorption force of the spare magnet on the flexible circuit board; When the adsorption force is less than the pulling force of the sliding control device on the spare magnet, selecting a target magnet on the magnet loop from the spare magnet; After the target magnet is installed on the magnet loop, the magnet loop on which the target magnet is installed and the sliding control device are used as a magnetic attraction device for the flexible circuit board.

7. The method for adaptively integrating a flexible circuit board in a smart home environment according to claim 6, wherein: The calculating the adsorption force of the spare magnet on the flexible circuit board includes: The adsorption force of the spare magnet on the flexible circuit board is calculated using the following formula: Where F represents the adsorption force, represents the vacuum magnetic permeability, V represents the magnetic energy volume of the backup magnet, M represents the magnetic moment of the backup magnet, and d represents the distance between the backup magnet and the exposed wire of the flexible circuit board.

8. The method for adaptively integrating a flexible circuit board in a smart home environment according to claim 1, wherein: The step of notifying the magnetic device to control the module connection end of the flexible circuit board to connect with the target module based on the control target includes: Obtaining a magnet loop and a sliding control device for installing a target magnet in the magnetic attraction device; transmitting the control target to the sliding control device; comparing, in the sliding control device, whether the control target is consistent with a current target corresponding to the target magnet; When the control target is consistent with the current target corresponding to the target magnet, connecting the module connection end of the flexible circuit board to the target module using the target magnet; When the control target is inconsistent with the current target corresponding to the target magnet, querying the relative position of the control target with respect to the current target in the sliding control device; Using the sliding control device to pull the target magnet to slide on the magnet loop to the relative position; At the relative position, the module connection end of the flexible circuit board is connected to the target module using the target magnet.

9. The method for adaptively integrating a flexible circuit board in a smart home environment according to claim 1, wherein: The step of using the control operation to instruct the flexible circuit board to adaptively integrate the target module to obtain an adaptive integration result includes: transmitting the control operation from the flexible circuit board to the target module; In the target module, receiving the control operation; According to the control operation, running the module functions in the target module; The operating data of the target module regarding the module function is returned to the flexible circuit board to complete the adaptive integration of the target module by the flexible circuit board and obtain an adaptive integration result.

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