An electronic device, controller, and vehicle

Abstract

The application discloses an electronic device, a controller and a vehicle, relates to the technical field of vehicles, and aims to solve the problem of poor transmission stability of the electronic device. The electronic device comprises a first busbar, a second busbar and a body. The first busbar comprises a first sub-busbar and a second sub-busbar connected with the first sub-busbar. The second busbar comprises a third sub-busbar and a fourth sub-busbar connected with the third sub-busbar. The fourth sub-busbar and the second sub-busbar are arranged in a stacked mode, at least part of the second sub-busbar forms a first external terminal, and at least part of the fourth sub-busbar forms a second external terminal. The body is arranged between the first sub-busbar and the third sub-busbar. The positive electrode of the body is connected with the first sub-busbar, the negative electrode of the body is connected with the third sub-busbar, or the negative electrode of the body is connected with the first sub-busbar, and the positive electrode of the body is connected with the third sub-busbar.

Description

Technical Field

[0001] This invention relates to the field of vehicle technology, and more particularly to an electronic device, a controller, and a vehicle. Background Technology

[0002] In vehicle electronic systems, the controller refers to the electronic unit used to process and manage various functions, and electronic devices are an important component of the controller. In the prior art, the output terminals of electronic devices are arranged side by side, with holes at the output ends for nut connection. Different electronic devices are electrically connected to each other using a one-to-one correspondence between output and input terminals, via nuts.

[0003] However, this electronic device suffers from poor transmission stability. Summary of the Invention

[0004] The purpose of this invention is to provide an electronic device, a controller, and a vehicle, which aims to solve the problem of poor transmission stability of electronic devices.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] In a first aspect, this application provides an electronic device including a first busbar, a second busbar, and a body. The first busbar includes a first sub-busbar and a second sub-busbar connected to the first sub-busbar. The second busbar includes a third sub-busbar and a fourth sub-busbar connected to the third sub-busbar. The third sub-busbar and the first sub-busbar are disposed opposite each other and spaced apart. The fourth sub-busbar and the second sub-busbar are stacked, with at least a portion of the second sub-busbar forming a first external terminal and at least a portion of the fourth sub-busbar forming a second external terminal. The body is disposed between the first sub-busbar and the third sub-busbar. The positive terminal of the body is connected to the first sub-busbar, and the negative terminal of the body is connected to the third sub-busbar; alternatively, the negative terminal of the body is connected to the first sub-busbar, and the positive terminal of the body is connected to the third sub-busbar.

[0007] The second and fourth sub-rows of the electronic device provided in this application embodiment are stacked, and at least a portion of the second sub-row forms a first external terminal and at least a portion of the fourth sub-row forms a second external terminal. In this way, the inductance generated by the current lines in the second and fourth sub-rows is opposite in direction and cancels each other out, reducing the equivalent inductance loop formed between the first and second external terminals, thereby improving the transmission stability of the electronic device.

[0008] In some embodiments, one of the fourth sub-row and the second sub-row includes a first end and the other has a first edge, with the first end located outside the first edge.

[0009] In some embodiments, the first end forms a first external terminal of the electronic device, and the portion of the first edge located on the other side forms a second external terminal of the electronic device.

[0010] In some embodiments, the first end is the end of the second sub-row away from the first sub-row, and the first edge is the edge of the fourth sub-row away from the third sub-row.

[0011] In some embodiments, the second sub-row includes a first conductive portion located on one side of the body. The arrangement direction of the body and the first conductive portion is orthogonal to the arrangement direction of the first sub-row and the third sub-row. The fourth sub-row includes a second conductive portion, which is stacked on top of the first conductive portion.

[0012] In some embodiments, the electronic device further includes a fifth sub-row connected between the first sub-row and the first conductive portion, and the fifth sub-row is located between the body and the first conductive portion.

[0013] In some embodiments, the first edge is located at the second conductive portion, and the first end is the end of the first conductive portion.

[0014] In some embodiments, the second sub-row further includes a third conductive portion connected to and intersecting with the first conductive portion. The fourth sub-row further includes a fourth conductive portion connected to and intersecting with the second conductive portion. The fourth conductive portion and the third conductive portion are stacked. The first end is the end of the fourth conductive portion, and the first edge is located in the third conductive portion.

[0015] In some embodiments, the electronic device further includes a first insulating element disposed between the second sub-row and the fourth sub-row.

[0016] In some embodiments, the first insulating member includes a first insulating portion and a second insulating portion. The first insulating portion is disposed between the second sub-row and the fourth sub-row. The second insulating portion intersects with the first insulating portion and is located between a first end and a first edge.

[0017] In some embodiments, the electronic device further includes a first input terminal and a second input terminal. The first input terminal is connected to the positive terminal of the body. The second input terminal is connected to the negative terminal of the body.

[0018] In some embodiments, the electronic device further includes a housing, the housing including a first receiving space, and the electronic device is housed in the first receiving space.

[0019] In some embodiments, a partition is provided inside the housing, a first receiving space is located on one side of the partition, a second receiving space is provided on the other side of the partition, and a first external terminal and a second external terminal are located in the second receiving space.

[0020] In some embodiments, the ends of the partition are insulated ends.

[0021] In some embodiments, a packaging material is provided in the first accommodating space, and the packaging material fills the space between the first electronic device and the inner wall of the housing and the partition.

[0022] Secondly, this application provides a controller, including a first electronic device, a second electronic device, a first connector, and a second connector. The first electronic device is any of the electronic devices described in the first aspect above. The first connector connects a first external terminal and a first input terminal. The second connector connects a second external terminal and a second input terminal.

[0023] In some embodiments, the first electronic device and the second electronic device are stacked.

[0024] In some embodiments, the second electronic device includes a body, a first input terminal, and a second input terminal. The body includes a middle portion and a second edge. The first input terminal is located on the side of the second edge opposite to the middle portion. The second input terminal is located on the side of the first input terminal opposite to the second edge.

[0025] In some embodiments, the first input terminal is spaced apart from the second input terminal along the thickness direction of the body and stacked on top of each other.

[0026] In some embodiments, the second electronic device further includes a second insulating member disposed between the first input terminal and the second input terminal.

[0027] In some embodiments, the second electronic device further includes a heat sink, which is stacked with the main body.

[0028] In some embodiments, the second electronic device further includes a heat sink connected to the side of the heat sink away from the main body.

[0029] In some embodiments, the first connector includes a first connecting portion, a second connecting portion, and a third connecting portion. The first connecting portion is connected to a first external terminal. The second connecting portion is connected to a first input terminal. The plane on which the first connecting portion is located intersects with the plane on which the second connecting portion is located. The third connecting portion connects the first connecting portion and the second connecting portion. The second connector includes a fourth connecting portion, a fifth connecting portion, and a sixth connecting portion. The fourth connecting portion is connected to a second external terminal. The fifth connecting portion is connected to a second input terminal. The plane on which the fourth connecting portion is located intersects with the plane on which the fifth connecting portion is located. The sixth connecting portion connects the fourth connecting portion and the fifth connecting portion, and the sixth connecting portion is stacked on top of the third connecting portion.

[0030] In some embodiments, the first connecting portion is soldered to the first external terminal, the second connecting portion is soldered to the first input terminal, the fourth connecting portion is soldered to the second external terminal, and the fifth connecting portion is soldered to the second input terminal.

[0031] In some embodiments, the controller further includes a third insulating element disposed between the first connector and the second connector.

[0032] In some embodiments, there are multiple first connecting portions, which are spaced apart along the length direction of the first edge. There are also multiple fourth connecting portions, which are spaced apart along the length direction of the first edge.

[0033] In some embodiments, the controller further includes a base having a first surface and a second surface facing away from each other. The first surface has a mounting groove, a first electronic device is mounted in the mounting groove, and a second electronic device is disposed on a region on the second surface opposite to the mounting groove.

[0034] In some embodiments, the second surface includes a convex region that protrudes away from the first surface, and the second electronic device is disposed on the top surface of the convex region, the convex region being opposite to the mounting groove in the thickness direction of the base.

[0035] In some embodiments, the sidewall of the mounting groove is provided with an opening that extends through the side of the convex region, and the second and fourth sub-rows pass through the opening.

[0036] In some embodiments, the portion of the base between the bottom surface of the mounting groove and the top surface of the convex region is a first base portion, and a cooling water channel is provided in the base, with at least a portion of the cooling water channel located within the first base portion.

[0037] In some embodiments, the top surface of the convex region is provided with a clearance opening, which communicates with a cooling water channel.

[0038] The second electronic device includes a heat sink and a heat sink component disposed on the side of the heat sink away from the main body. The heat sink covers the clearance opening, and the heat sink component is located in the cooling water channel.

[0039] In some embodiments, the mounting groove is provided with encapsulating material, which fills the space between the first electronic device and the inner wall of the mounting groove.

[0040] Thirdly, this application provides a vehicle including the electronic device described in any of the first aspects above, and / or the controller described in any of the second aspects above.

[0041] The technical effects of any of the implementation methods in the second to third aspects mentioned above can be found in the technical effects of the corresponding implementation methods in the first aspect, and will not be repeated here. Attached Figure Description

[0042] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0043] Figure 1 A schematic diagram of the structure of an electronic device provided for related technologies;

[0044] Figure 2 A schematic diagram of the structure of a vehicle provided in this application embodiment;

[0045] Figure 3 This is an exploded view of a controller provided in an embodiment of this application;

[0046] Figure 4 This is a schematic diagram of the structure of a first electronic device provided in an embodiment of this application;

[0047] Figure 5 for Figure 4 A schematic diagram of the first electronic device from another angle is shown.

[0048] Figure 6 A schematic diagram of the structure of a first electronic device provided for other embodiments of this application;

[0049] Figure 7 A schematic diagram of the structure of a shell provided in an embodiment of this application;

[0050] Figure 8 for Figure 7 The diagram shows a structural schematic of a first electronic device encapsulated within a housing.

[0051] Figure 9 This is a schematic diagram of the structure of a second electronic device provided in an embodiment of this application;

[0052] Figure 10 This is a schematic diagram of the structure of a first connector provided in an embodiment of this application;

[0053] Figure 11 This is a schematic diagram of the structure of a second connector provided in an embodiment of this application;

[0054] Figure 12 A schematic diagram of the structure of a first connector provided for other embodiments of this application;

[0055] Figure 13 A schematic diagram of the structure of a second connector provided for other embodiments of this application;

[0056] Figure 14This is a schematic diagram of the structure of a base provided in an embodiment of this application;

[0057] Figure 15 This is a structural schematic diagram of a base from another perspective, provided in an embodiment of this application.

[0058] Figure 16 This is a schematic diagram of the structure for installing the first connector in an embodiment of this application;

[0059] Figure 17 This is a schematic diagram of the structure for installing the third insulating element in an embodiment of this application;

[0060] Figure 18 This is a schematic diagram of the structure for installing the second connector in an embodiment of this application;

[0061] Figure 19 A schematic diagram of the structure for installing the first connector in other embodiments of this application;

[0062] Figure 20 A schematic diagram of the structure for installing the third insulating element in other embodiments of this application;

[0063] Figure 21 A schematic diagram of the structure for installing the second connector in other embodiments of this application;

[0064] Figure 22 A schematic diagram of the structure of a first busbar, a body, and a second busbar provided in an embodiment of this application;

[0065] Figure 23 This is a schematic diagram of a first electronic device mounted to a housing, provided as an embodiment of this application.

[0066] Figure 24 for Figure 23 A magnified view of a portion of point A in the middle;

[0067] Figure 25 for Figure 23 The diagram shows the structure of the shell after it has been filled with encapsulation material.

[0068] Figure label:

[0069] 1' Electronic components; 2' Output terminals;

[0070] 100. Vehicle; 10. Chassis; 20. Vehicle body; 30. Controller; 40. First electronic device; 41. First busbar; 411. First sub-busbar; 412. Second sub-busbar; 4121. First conductive part; 4122. Third conductive part; 413. First external terminal; 414. First edge; 415. Fifth sub-busbar; 42. Second busbar; 421. Third sub-busbar; 422. Fourth sub-busbar; 4221. Second conductive part; 4222. Fourth conductive part; 423. Second external terminal; 424. First end; 43. Body; 44. First insulating component; 441. First insulating part; 442. Second insulating part; 45. First connecting terminal; 46. Second connecting terminal; 47. Housing; 471. 472. First receiving space; 473. Second receiving space; 474. Partition; 475. Insulating end; 50. Second electronic device; 51. Main body; 511. Middle part; 512. Second edge; 52. First input terminal; 53. Second input terminal; 54. Second insulating component; 55. Heat sink; 56. Heat sink; 60. First connector; 61. First connecting part; 62. Second connecting part; 63. Third connecting part; 70. Second connector; 71. Fourth connecting part; 72. Fifth connecting part; 73. Sixth connecting part; 74. Third insulating component; 80. Base; 81. First surface; 811. Mounting groove; 812. Opening; 813. Clearance opening; 82. Second surface; 83. First base part. Detailed Implementation

[0071] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0072] In the description of this invention, it should be understood that the terms "upper," "lower," "left," "right," "front," "rear," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or relative positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Unless otherwise specified, the above-described orientation can be flexibly set in practical applications, provided that the relative positional relationship shown in the accompanying drawings is satisfied.

[0073] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0074] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "communication" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection. They can refer to a direct connection or an indirect connection through an intermediate medium, or a communication between the internal components of two elements. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0075] In embodiments of the invention, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, article, or apparatus that includes that element.

[0076] In embodiments of the present invention, the terms "exemplary" or "for example" are used to indicate that something is an example, illustration, or description. Any embodiment or design described as "exemplary" or "for example" in embodiments of the present invention should not be construed as being more preferred or advantageous than other embodiments or designs. Rather, the use of the terms "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0077] In vehicle electronic systems, the controller refers to the electronic unit used to process and manage various functions, and electronic devices are an important component of the controller.

[0078] In related technologies, see Figure 1 , Figure 1 This diagram illustrates the structure of an electronic device for related technologies. The output terminals 2' of the electronic device 1' are arranged side-by-side, with holes at the output ends for nut connection. Different electronic devices are electrically connected via nuts, using a one-to-one correspondence between output and input terminals.

[0079] However, this electronic device suffers from poor transmission stability.

[0080] Based on this, see Figure 2 , Figure 2 This is a schematic diagram of the structure of a vehicle provided in an embodiment of this application. The vehicle 100 provided in this application may include a chassis 10, a vehicle body 20, and a controller 30.

[0081] It is understood that the vehicle 100 can be a gasoline-powered vehicle, an electric vehicle, a hybrid vehicle, a natural gas vehicle, a methanol vehicle, a solar-powered vehicle, etc. For example, the vehicle 100 can be a passenger car such as a sedan, a sport utility vehicle (SUV), or a multi-purpose vehicle (MPV), or it can be a bus, a truck, a semi-trailer, etc. This application does not impose specific limitations in this regard.

[0082] The chassis 10 can be equipped with a motor and other components of the vehicle 100 to form the overall shape of the vehicle 100, and receive power from the motor to enable the vehicle 100 to move and ensure normal driving.

[0083] The vehicle body 20 can be mounted on the chassis 10. The interior of the vehicle body 20 forms a cabin, which includes seats for the driver, passengers, or cargo. It should be noted that when the vehicle 100 is a passenger car or sedan, its vehicle body 20 is generally a single-piece structure. When the vehicle 100 is a truck, its vehicle body 20 generally consists of a cab and a cargo box.

[0084] The controller 30 can be mounted on the chassis 10. The controller 30 manages the stability and handling of the vehicle 100, including functions such as anti-skid control (TCS), electronic stability control (ESP), and automatic driving control (AWD). The controller 30 is also responsible for engine fuel injection, ignition timing, speed, and other parameters to optimize engine performance, improve fuel efficiency, and reduce emissions. The controller 30 is one of the most critical components of the vehicle 100.

[0085] It should be noted that the above-mentioned components are only examples of some components of vehicle 100, and are not a limitation on the specific structure of vehicle 100.

[0086] In the circuit system of controller 30, inductance that is formed accidentally or unintended is called stray inductance (SI). Stray inductance is usually caused by the relative position between conductors, wiring layout, package design, or magnetic fields in the surrounding environment. The presence of stray inductance can cause problems such as circuit loss or signal attenuation in the circuit system.

[0087] Based on this, see Figure 3 , Figure 3This is an exploded view of a controller 30 provided in an embodiment of this application. The controller 30 includes a first electronic device 40, a second electronic device 50, a first connector 60, and a second connector 70. The first electronic device 40 and the second electronic device 50 are stacked. This makes the controller 30 more compact, shortens the connection loop between the first electronic device 40 and the second electronic device 50, and reduces stray inductance. Furthermore, the controller 30 can perform more functions within a limited space, making it suitable for the needs of miniaturized electronic products.

[0088] In some embodiments, the first connector 60 connects to the first external terminal 413 of the first electronic device 40 and the first input terminal 52 of the second electronic device 50. The second connector 70 connects to the second external terminal 423 of the first electronic device 40 and the second input terminal 53 of the second electronic device 50. The first connector 60 and the second connector 70 connect the external terminal and the input terminal respectively, simplifying the overall circuit connection design, reducing wiring complexity, and improving assembly efficiency.

[0089] The first electronic device 40 can be a capacitor. The first electronic device 40 will be described in detail below.

[0090] For details, see Figure 4 as well as Figure 5 , Figure 4 This is a schematic diagram of the structure of a first electronic device provided in an embodiment of this application. Figure 5 for Figure 4 The diagram shows another structural view of the first electronic device, in which... Figure 5 for Figure 4 From a slanted view, the first electronic device 40 includes a first busbar 41, a second busbar 42, and a body 43. The first busbar 41 includes a first sub-busbar 411 and a second sub-busbar 412 connected to the first sub-busbar 411. The second busbar 42 includes a third sub-busbar 421 and a fourth sub-busbar 422 connected to the third sub-busbar 421. The third sub-busbar 421 and the first sub-busbar 411 are arranged opposite to and spaced apart from each other. The fourth sub-busbar 422 and the second sub-busbar 412 are stacked, with at least a portion of the second sub-busbar 412 forming a first external terminal 413 and at least a portion of the fourth sub-busbar 422 forming a second external terminal 423.

[0091] In this way, the inductance generated by the current lines in the second sub-row 412 and the fourth sub-row 422 are in opposite directions and cancel each other out, reducing the equivalent inductance formed between the first external terminal 413 and the second external terminal 423, thereby improving the transmission stability of the first electronic device 40.

[0092] In addition, this can increase the connection area of ​​the external terminals of the first electronic device 40, reduce the risk of poor contact, and avoid problems such as unstable current, signal loss or noise caused by poor contact.

[0093] The main body 43 is located between the first sub-row 411 and the third sub-row 421. The positive terminal of the main body 43 is connected to the first sub-row 411, and the negative terminal of the main body 43 is connected to the third sub-row 421. This arrangement makes the overall structure more compact, reduces the size, and facilitates the installation of the first electronic device 40.

[0094] In some other embodiments, the negative terminal of the body 43 is connected to the first sub-row 411, and the positive terminal of the body 43 is connected to the third sub-row 421.

[0095] In some embodiments, one of the fourth sub-row 422 and the second sub-row 412 includes a first end portion 424, and the other has a first edge 414, with the first end portion 424 located outside the first edge 414. That is, in the extending direction of the fourth sub-row 422 and the second sub-row 412, the length of the first end portion 424 is longer than the length of the first edge 414.

[0096] In this way, the extensions of the second sub-row 412 and the fourth sub-row 422 are staggered, which makes it easier for the second sub-row 412 and the fourth sub-row 422 to be connected to other components.

[0097] The fourth sub-row 422 includes a first end 424, and the second sub-row 412 has a first edge 414. Alternatively, the second sub-row 412 may include the first end 424, and the fourth sub-row 422 may have the first edge 414. This application does not limit this, and the specific description will be based on the actual needs.

[0098] For example, see [link to previous article] Figure 4 The second sub-row 412 includes a first end 424, and the fourth sub-row 422 has a first edge 414. The first end 424 forms a first external terminal 413 of the first electronic device 40, and the portion of the first edge 414 on the other side forms a second external terminal 423 of the first electronic device 40.

[0099] This allows for efficient use of space, helps reduce the overall size of electronic devices, and improves space utilization.

[0100] In some embodiments, the first end 424 is the end of the second sub-row 412 away from the first sub-row 411, and the first edge 414 is the edge of the fourth sub-row 422 away from the third sub-row 421.

[0101] This configuration, by rationally arranging the positions of the first end 424 and the first edge 414, can optimize the electrical connection path, reduce connection length, lower stray inductance and resistance, and improve circuit performance.

[0102] In some embodiments, the second sub-row 412 includes a first conductive portion 4121, which is located on one side of the body 43. The arrangement direction of the body 43 and the first conductive portion 4121 is orthogonal to the arrangement direction of the first sub-row 411 and the third sub-row 421. The fourth sub-row 422 includes a second conductive portion 4221, which is stacked with the first conductive portion 4121.

[0103] In this way, by stacking the first conductive part 4121 and the second conductive part 4221, stray inductance can be effectively reduced. At the same time, this design can make effective use of limited space, making the overall layout more compact and improving space efficiency.

[0104] In some embodiments, the first electronic device 40 further includes a fifth sub-row 415, which is connected between the first sub-row 411 and the first conductive portion 4121, and is located between the body 43 and the first conductive portion 4121.

[0105] In this way, by adding a fifth sub-row 415 between the first sub-row 411 and the first conductive part 4121, the first sub-row 411 can be extended, changing the direction of extension of the first sub-row 411. In addition, this arrangement helps to enhance the stability of the overall structure, provides additional support for the first conductive part 4121, thereby resisting the influence of external forces and improving mechanical strength.

[0106] In some embodiments, the first edge 414 is located at the second conductive portion 4221, and the first end 424 is the end of the first conductive portion 4121.

[0107] This simplifies the connections between components, improves assembly efficiency, reduces production complexity, and minimizes potential sources of failure.

[0108] In some other embodiments, see Figure 6 , Figure 6 This is a schematic diagram of the structure of a first electronic device provided in other embodiments of this application. The second sub-row 412 has a first edge 414, and the fourth sub-row 422 includes a first end 424.

[0109] Specifically, the second sub-row 412 also includes a third conductive portion 4122, which is connected to and intersects with the first conductive portion 4121. The fourth sub-row 422 also includes a fourth conductive portion 4222, which is connected to and intersects with the second conductive portion 4221. The fourth conductive portion 4222 and the third conductive portion 4122 are stacked. The first end 424 is the end of the fourth conductive portion 4222, and the first edge 414 is located in the third conductive portion 4122. In this way, by setting the third conductive portion 4122 and the fourth conductive portion 4222, the position and angle of the first end 424 and the first edge 414 can be changed, which can adapt to different processing and usage scenarios. During the processing, electronic devices can be processed at the same workstation, simplifying the processing process and improving processing efficiency.

[0110] However, this application does not limit the angle at which the third conductive portion 4122 intersects with the first conductive portion 4121 or the angle at which the fourth conductive portion 4222 intersects with the second conductive portion 4221.

[0111] For example, the angle between the third conductive portion 4122 and the first conductive portion 4121 is 90°, and the angle between the fourth conductive portion 4222 and the second conductive portion 4221 is 90°. This facilitates processing, allows the processing device to operate on the same side, and improves processing efficiency.

[0112] In some embodiments, the first insulating member 44 includes a first insulating portion 441 and a second insulating portion 442.

[0113] The first insulating portion 441 is disposed between the second sub-row 412 and the fourth sub-row 422. The second insulating portion 442 intersects with the first insulating portion 441 and is located between the first end 424 and the first edge 414.

[0114] In this way, by setting the second insulating part 442, the first end 424 and the first edge 414 can be completely insulated, reducing the problem of high voltage arcing.

[0115] The second insulating portion 442 can be in the shape of a flat plate, a curved plate, or other irregular shapes. This application does not impose any restrictions on this, and the specific shape can be determined according to the actual needs.

[0116] For example, see [link to previous article] Figure 6 The second insulating portion 442 is in the shape of a planar plate and is arranged perpendicularly to the first insulating portion 441. This reduces the height of the second insulating portion 442, making the overall structure of the electronic device more compact.

[0117] In some embodiments, see continue to see Figure 4 The first electronic device 40 also includes a first insulating member 44, which is disposed between the second sub-row 412 and the fourth sub-row 422.

[0118] This ensures that the second sub-row 412 and the fourth sub-row 422 are sufficiently insulated, which allows the relative distance between the second sub-row 412 and the fourth sub-row 422 to be as small as possible, so that the magnetic fields generated by the second sub-row 412 and the fourth sub-row 422 can be canceled out as much as possible, thereby further reducing stray inductance.

[0119] The first insulating member 44 extends to a length greater than or equal to the length of the fourth sub-row 422, so as to ensure that the end of the fourth sub-row 422 is insulated from the second sub-row 412.

[0120] The extension length of the first insulating member 44 is less than the length of the second sub-row 412, so as to ensure that the end of the second sub-row 412 exposes a certain area of ​​connection area, which is convenient for installation and electrical connection.

[0121] The first insulating member 44 extends beyond the second sub-row 412 and the fourth sub-row 422 on both sides, meaning the width of the first insulating member 44 is greater than the width of the second sub-row 412 and the fourth sub-row 422, to ensure insulation on both sides of the second sub-row 412 and the fourth sub-row 422.

[0122] In some embodiments, see continue to see Figure 5 The first electronic device 40 also includes a first connection terminal 45 and a second connection terminal 46. The first connection terminal 45 is connected to the positive terminal of the body 43. The second connection terminal 46 is connected to the negative terminal of the body 43.

[0123] In this way, the first connection terminal 45 and the second connection terminal 46 are connected to a DC power supply or an AC power supply, and the current is transmitted to the positive and negative terminals of the body 43.

[0124] In some embodiments, the first electronic device 40 further includes a housing 47, which includes a first receiving space 471, and the first electronic device 40 is housed in the first receiving space 471.

[0125] In this way, the housing 47 can protect the first electronic device 40 from dust and moisture entering and causing damage to the first electronic device 40.

[0126] In some embodiments, see Figure 7 as well as Figure 8 , Figure 7 This is a schematic diagram of the structure of a shell provided in an embodiment of this application. Figure 8 for Figure 7The schematic diagram of the structure of the first electronic device encapsulated in the housing is shown. The housing 47 is provided with a partition 473. The first receiving space 471 is located on one side of the partition 473, and the other side of the partition 473 is provided with a second receiving space 472. The first external terminal 413 and the second external terminal 423 are located in the second receiving space 472.

[0127] In this way, the partition 473 can effectively isolate the first accommodating space 471 and the second accommodating space 472. The first electronic device 40 is located in the first accommodating space 471, and other devices are located in the second accommodating space 472. This can prevent electrical signals from interfering with each other and help improve the stability and safety of the equipment.

[0128] In some embodiments, the end of the partition 473 is an insulating end 474.

[0129] In this way, sufficient insulation can be achieved between the first electronic device 40 and the partition 473, and the relative distance between the first electronic device 40 and the partition 473 can be minimized, making the structure of the first electronic device 40 compact and its size small.

[0130] The insulating end 474 can be an insulating strip, coated with insulating material, or mounted with an insulating block, etc. This application does not impose any restrictions on this.

[0131] In some embodiments, the first accommodating space 471 is provided with encapsulation material, which fills the space between the first electronic device 40 and the inner wall of the housing 47 and the partition 473.

[0132] In this way, the first electronic device 40 is fixed within the first receiving space 471 by the encapsulation material, resulting in a stable structure and high mechanical strength. Furthermore, the first electronic device 40 can dissipate heat directly through the encapsulation material and the housing 47, leading to better heat dissipation.

[0133] The encapsulation material can be epoxy resin, polyester resin, silicone, etc.

[0134] The second electronic device 50 can be a power module. The second electronic device 50 will be described below.

[0135] For details, see Figure 9 , Figure 9 This is a schematic diagram of the structure of a second electronic device provided in an embodiment of this application. The second electronic device 50 includes a main body 51, a first input terminal 52, and a second input terminal 53. The main body 51 includes a middle portion 511 and a second edge 512. The first input terminal 52 is located on the side of the second edge 512 opposite to the middle portion 511. The second input terminal 53 is located on the side of the first input terminal 52 opposite to the second edge 512.

[0136] In this way, the first input terminal 52 and the second input terminal 53 are misaligned, which facilitates the connection of the first input terminal 52 and the second input terminal 53 to other devices.

[0137] The number of the first input terminal 52 and the second input terminal 53 can be 3, 6, 9, etc. This application does not impose any restrictions on this, and the specific number can be set according to the actual needs.

[0138] In some embodiments, the first input terminal 52 is spaced apart from the second input terminal 53 along the thickness direction of the body 51 and is stacked.

[0139] In this way, the first input terminal 52 and the second input terminal 53 are staggered along the thickness direction of the main body 51, which can shorten the distance between the first input terminal 52 and the second input terminal 53, thereby reducing stray inductance.

[0140] In some embodiments, the second electronic device 50 further includes a second insulating member 54 disposed between the first input terminal 52 and the second input terminal 53.

[0141] This allows for sufficient insulation between the first input terminal 52 and the second input terminal 53, minimizing the relative distance between them, shortening the connection loop, and thus reducing stray inductance.

[0142] In some embodiments, the second electronic device 50 further includes a heat sink 55, which is stacked with the main body 51.

[0143] In this way, the heat sink 55 can effectively absorb the heat generated by the second electronic device 50 during operation and quickly conduct it away, reducing the operating temperature of the second electronic device 50. The stacked design can form a larger contact area, improve heat conduction performance, and increase heat dissipation efficiency.

[0144] In some embodiments, the electronic device further includes a heat sink 56 connected to the side of the heat sink 55 facing away from the main body 51. In this way, the heat sink 56 provides additional heat exchange area, enabling more efficient dissipation of heat absorbed by the heat sink 55 into the environment, thereby improving the overall system's heat dissipation capacity.

[0145] The heat sink 56 can be arranged in a pin-like form. This application does not limit the number of heat sinks 56; the specific number can be determined according to the actual situation.

[0146] For example, there are multiple heat sinks 56, which are arranged in an array on the side of the heat sink 55 away from the main body 51. This facilitates manufacturing.

[0147] The following section describes the connectors of the controller 30.

[0148] In some embodiments, see Figure 10 , Figure 10 This is a schematic diagram of a first connector provided in an embodiment of this application. The first connector 60 includes a first connecting portion 61, a second connecting portion 62, and a third connecting portion 63. The first connecting portion 61 is connected to a first external terminal 413. The second connecting portion 62 is connected to a first input terminal 52. The plane on which the first connecting portion 61 is located intersects with the plane on which the second connecting portion 62 is located. The third connecting portion 63 connects the first connecting portion 61 and the second connecting portion 62.

[0149] In this way, the first connector 60 is modularly designed, allowing communication between the first external terminal 413 and the first input terminal 52. By using the first connector 60, the connection area is increased, the connection strength is enhanced, and loosening of the connection is prevented.

[0150] See Figure 11 , Figure 11 This is a schematic diagram of a second connector provided in an embodiment of this application. The second connector 70 includes a fourth connecting portion 71, a fifth connecting portion 72, and a sixth connecting portion 73. The fourth connecting portion 71 is connected to a second external terminal 423. The fifth connecting portion 72 is connected to a second input terminal 53. The plane on which the fourth connecting portion 71 is located intersects with the plane on which the fifth connecting portion 72 is located. The sixth connecting portion 73 connects the fourth connecting portion 71 and the fifth connecting portion 72, and the sixth connecting portion 73 is stacked on top of the third connecting portion 63.

[0151] In this way, the second connector 70 is modularly designed, allowing communication between the second external terminal 423 and the second input terminal 53. The second connector 70 increases the connection area, enhances the connection strength, and prevents loosening.

[0152] In some embodiments, the first connecting portion 61 is soldered to the first external terminal 413, and the second connecting portion 62 is soldered to the first input terminal 52. The fourth connecting portion 71 is soldered to the second external terminal 423, and the fifth connecting portion 72 is soldered to the second input terminal 53.

[0153] In this way, the first connector 60 and the second connector 70 are more securely connected by welding.

[0154] The welding method can be laser welding, ultrasonic welding, spot welding, etc. This application does not impose any restrictions on this; the specific method can be set according to the actual needs.

[0155] In some embodiments, the controller 30 further includes a third insulating member 74 disposed between the first connector 60 and the second connector 70.

[0156] In this way, by setting the third insulating member 74, the first connector 60 and the second connector 70 can be fully insulated, so that the relative distance between the first connector 60 and the second connector 70 can be minimized, thereby reducing the stray inductance between the first connector 60 and the second connector 70.

[0157] In some other embodiments, the side of the second connector 70 facing the first connector 60 may be provided with an insulating sheet or insulating material. This improves the insulation between the first connector 60 and the second connector 70, while preventing the insulation from failing due to breakage of the third insulating member 74 or other problems.

[0158] To prevent the third insulating member 74 from sliding, adhesive can be applied to the side of the third insulating member 74 facing the first connector to make it adhesive.

[0159] In some other embodiments, see Figure 12 and Figure 13 , Figure 12 This is a schematic diagram of the structure of a first connector provided in other embodiments of this application. Figure 13 The diagram below shows a second connector structure for other embodiments of this application. In order to enable the first connector 60 and the second connector 70 to be adapted to the first electronic device 40, the first connector 60 and the second connector 70 are designed in a Z-shape, which facilitates the installation and connection of the first connector 60 and the second connector 70.

[0160] In this way, the first connector 60 and the second connector 70 can be welded in the same direction, simplifying the processing and improving processing efficiency.

[0161] In some embodiments, see continue to see Figure 10 as well as Figure 11 There are multiple first connecting portions 61, which are spaced apart along the length direction of the first edge 414. There are also multiple fourth connecting portions 71, which are spaced apart along the length direction of the first edge 414.

[0162] In this way, the stress generated by the pressure on the first connecting part 61 and the fourth connecting part 71 during the welding process can be reduced, so that the first connecting part 61 can fully form surface contact with the first external terminal 413 and the fourth connecting part 71 can fully form surface contact with the second external terminal 423, thereby avoiding welding pores and cold solder joints caused by insufficient contact between the first connecting part 61 and the fourth connecting part 71.

[0163] The number of first connecting portions 61 can be two, three, four, etc. This application does not impose any restrictions on this, and the specific number can be set according to the actual needs.

[0164] In some embodiments, see Figure 14 as well as Figure 15 , Figure 14 This is a schematic diagram of the structure of a base provided in an embodiment of this application. Figure 15 This is a structural schematic diagram of a base from another perspective, provided as an embodiment of this application. Figure 15 for Figure 14 The schematic diagram shows the base 80 as viewed from below. The controller 30 also includes the base 80, which has a first surface 81 and a second surface 82 facing each other. The first surface 81 is... Figure 14 The surface of the middle base facing downwards, the second surface is Figure 14 The base 80 faces upwards.

[0165] The first surface 81 is provided with a mounting groove 811, the first electronic device 40 is mounted in the mounting groove 811, and the second electronic device 50 is provided on the second surface 82 in the area opposite to the mounting groove 811.

[0166] In this way, the first electronic device 40 and the second electronic device 50 are distributed on both sides of the base 80, which effectively saves space and allows more functions to be integrated in a limited space.

[0167] In some embodiments, the second surface 82 includes a convex region that protrudes away from the first surface 81, and the second electronic device 50 is disposed on the top surface of the convex region. The convex region is opposite to the mounting groove 811 in the thickness direction of the base 80.

[0168] This design reduces the size of the base 80, further saving space for the controller 30.

[0169] In some embodiments, the sidewall of the mounting groove 811 is provided with an opening 812, which extends through the side of the convex region, and the second sub-row 412 and the fourth sub-row 422 pass through the opening 812.

[0170] In this way, the second sub-row 412 and the fourth sub-row 422 passing through the opening 812 can facilitate the connection between the first electronic device 40 and the second electronic device 50, and at the same time reduce the connection loop of the first electronic device 40 and the second electronic device 50, thereby reducing stray inductance.

[0171] In some embodiments, the portion of the base 80 between the bottom surface of the mounting groove 811 and the top surface of the convex region is a first base portion 83, and the base 80 is provided with cooling water channels, at least a portion of which is located within the first base portion 83.

[0172] In this way, the cooling water channel is located inside the first base portion 83, which can simultaneously cool the first electronic device 40 and the second electronic device 50, effectively reducing the operating temperature of the first electronic device 40 and the second electronic device 50, improving thermal management, and extending the service life of the first electronic device 40 and the second electronic device 50.

[0173] In some other embodiments, the base 80 has a hollow bottom surface and is also provided with cooling channels to cool other electronic components.

[0174] In some embodiments, the top surface of the convex region is provided with a clearance opening 813, which communicates with the cooling water channel. The second electronic device 50 includes a heat sink 55 and a heat sink 56 disposed on the side of the heat sink 55 away from the main body 51. The heat sink 55 covers the clearance opening 813, and the heat sink 56 is located in the cooling water channel.

[0175] In this way, the heat sink 56 is located within the cooling water channel, allowing for efficient heat dissipation directly through liquid cooling. This enhances the heat dissipation effect, reduces the temperature of the heat sink 55 and the second electronic component 50, and ensures that they operate within a safe temperature range. Furthermore, embedding the heat sink 56 within the cooling water channel saves overall space in the device, resulting in a more compact design without compromising heat dissipation performance.

[0176] In some embodiments, the mounting groove 811 is provided with an encapsulating material, which fills the space between the first electronic device 40 and the inner wall of the mounting groove 811. The encapsulating material fills the gap between the mounting groove 811 and the first electronic device 40, completely encapsulating the first electronic device 40 within the mounting groove 811.

[0177] In this way, the first electronic device 40 is completely sealed and encapsulated by the packaging material, preventing damage to the first electronic device 40 due to oxidation. In addition, this allows the first electronic device 40 to dissipate heat through the heat conduction of the base 80, improving heat dissipation efficiency.

[0178] The encapsulation material provides additional mechanical support, effectively securing the first electronic device 40, reducing the impact of vibration and shock, and enhancing overall stability. The encapsulation material effectively protects the first electronic device 40 from damage by dust, moisture, and other external contaminants, increasing its lifespan.

[0179] This application also provides a manufacturing method for manufacturing a controller, comprising:

[0180] S101, Assemble the first electronic device.

[0181] S102, Assemble the second electronic device.

[0182] S103. Install the first and second connectors. Specifically, encapsulate the first electronic device into the mounting slot, filling it with encapsulation material to make the first electronic device and the housing a single unit. Install the second electronic device into the clearance opening, and secure it tightly to the clearance opening by installing a locking nut. Connect the first connecting portion and the first output terminal, connect the second connecting portion and the first input terminal, apply pressure to the first connector, use laser focusing for positioning, and weld the first and second connecting portions. Install the third insulating component. Connect the fourth connecting portion to the second external terminal, and the fifth connecting portion to the second input terminal. Apply pressure to the second connector, use laser focusing for positioning, and weld the fourth and fifth connecting portions.

[0183] In some embodiments, installing the first connector and the second connector includes:

[0184] S201. Connect the first connecting part and the first external terminal, connect the second connecting part and the first input terminal, apply pressure to the first connector, and weld the first connecting part and the second connecting part.

[0185] S202, Install the third insulating component.

[0186] S203, connect the fourth connecting part and the second external terminal, connect the fifth connecting part and the second input terminal, apply pressure to the second connector, and weld the third connecting part and the fourth connecting part.

[0187] Among them, see Figures 16-18 , Figure 16 This is a schematic diagram of the structure for installing the first connector in an embodiment of this application. Figure 17 This is a schematic diagram of the structure for installing the third insulating element in an embodiment of this application. Figure 18 The diagram below shows the structure of the second connector in an embodiment of this application. First, the first connector 60 is connected to the first electronic device 40 and the second electronic device 50. Then, the third insulating member 74 is installed. Finally, the second connector 70 is connected to the first electronic device 40 and the second electronic device 50.

[0188] Specifically, connecting the first connector 60 to the first electronic device 40 and the second electronic device 50 includes: a first connecting portion 61 connecting to a first external terminal 413; a second connecting portion 62 connecting to a first input terminal 52; applying pressure to the first connector 60; and laser welding the first connecting portion 61 and the second connecting portion 62. Installing the third insulating member 74 includes covering the first connector 60 with the third insulating member 74. Connecting the second connector 70 to the first electronic device 40 and the second electronic device 50 includes: a fourth connecting portion 71 connecting to a second external terminal 423; a fifth connecting portion 72 connecting to a second input terminal 53; applying pressure to the second connector 70; and welding the fourth connecting portion 71 and the fifth connecting portion 72.

[0189] This makes the connection between the first connector 60 and the second connector 70 more secure.

[0190] In some other embodiments, see Figures 19-21 , Figure 19 This is a schematic diagram of the structure for installing the first connector in other embodiments of this application. Figure 20 This is a schematic diagram of the structure for installing the third insulating element in other embodiments of this application. Figure 21 This is a schematic diagram of the structure for installing the second connector in other embodiments of this application. First, the first connector 60 is connected to the first electronic device 40 and the second electronic device 50, then the third insulating member 74 is installed, and finally the second connector 70 is connected to the first electronic device 40 and the second electronic device 50.

[0191] Because the first and second connectors are designed in a Z-shape, the first, second, third, and fourth connecting parts face the same side. During welding, the welding machine does not need to change the angle and can complete the welding of the four connecting parts on the same side, saving processing steps and improving processing efficiency.

[0192] In some embodiments, assembling electronic devices includes:

[0193] The first electronic component is assembled into the mounting slot.

[0194] The encapsulation material is filled between the mounting slot and the first electronic component.

[0195] In this way, the encapsulation material fills the space between the mounting groove and the first electronic component, completely encapsulating the first electronic component within the mounting groove. The first electronic component is connected to the housing through the encapsulation material, increasing the contact area and improving heat dissipation efficiency. Furthermore, since a traditional outer casing is not required, heat dissipation is more convenient, further improving heat dissipation efficiency.

[0196] The thickness of the encapsulation material is 0.5-1.5 mm. For example, the thickness of the encapsulation material is 1 mm.

[0197] In some embodiments, the package includes:

[0198] Fill the encapsulation material so that the liquid level of the encapsulation material is higher than that of the first electronic device.

[0199] The mounting slot is evacuated and vented repeatedly, at least twice.

[0200] This allows air to escape from the packaging material, making the packaging more robust and providing better protection for the primary electronic device.

[0201] For details, see Figure 22 as well as Figure 23 , Figure 22 This application provides a schematic diagram of the structure of a first busbar, a body, and a second busbar, as shown in the embodiments of the present application. Figure 23 This is a schematic diagram of a first electronic device mounted to a housing according to an embodiment of this application. A metallized film is wound and sputter-coated with gold to obtain a body 43. The solder joint of a first busbar 41 is soldered to the positive electrode of the body 43. The first busbar 41 is embedded into the positioning groove of a first insulating member 44, with the first insulating member 44 overlapping the first busbar 41. A second busbar 42 is embedded into the other side of the first insulating member 44, with the first insulating member 44 overlapping the second busbar 42. The solder joint of the second busbar 42 is soldered to the negative electrode of the body 43, completing the assembly of the electronic device.

[0202] To insulate the first electronic device 40 from the bottom of the housing 47, encapsulation material is filled into the bottom of the first accommodating space 471 of the housing 47. A vacuum is then drawn and degassed, repeated at least twice, to minimize air bubbles or pores in the encapsulation material. The encapsulation material is then allowed to solidify over a period of time.

[0203] See Figure 23 and combined Figure 24 , Figure 24 for Figure 23 A partially enlarged schematic diagram at point A shows that an insulating strip 475 is embedded into the top of the partition 473 to form an insulating end 474, and the first electronic device 40 is installed into the first receiving space 471. A second busbar 42 is embedded into the insulating end 474, ensuring a certain insulating distance between the two edges of the second busbar 42 and the wall of the housing 47. The electronic device is moved towards the partition 473, ensuring a certain insulating distance between the side of the first electronic device 40 facing away from the partition 473 and the wall. This positions the first electronic device 40, ensuring insulation between it and the wall of the housing 47.

[0204] See Figure 23 and combined Figure 25 , Figure 25 for Figure 23 The diagram shows the structure of the shell after filling with encapsulation material. The encapsulation material is filled to the first accommodating space 471, so that the encapsulation material is more than 3mm higher than the upper surface of the electronic device, so that the encapsulation material completely covers the first electronic device 40. The vacuuming and degassing are performed again, and the cycle is repeated more than 2 times. The shell is heated to solidify the encapsulation material.

[0205] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0206] The above are merely specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. An electronic device, characterized in that, include: The first mother row (41) includes a first sub-row (411) and a second sub-row (412) connected to the first sub-row (411). A second busbar (42) includes a third sub-busbar (421) and a fourth sub-busbar (422) connected to the third sub-busbar (421); the third sub-busbar (421) and the first sub-busbar (411) are arranged opposite to each other and spaced apart; the fourth sub-busbar (422) and the second sub-busbar (412) are stacked, the second sub-busbar (412) includes a first external terminal (413), and the fourth sub-busbar (422) includes a second external terminal (423); and The main body (43) is disposed between the first sub-row (411) and the third sub-row (421); the positive electrode of the main body (43) is connected to the first sub-row (411), and the negative electrode of the main body (43) is connected to the third sub-row (421), or the negative electrode of the main body (43) is connected to the first sub-row (411), and the positive electrode of the main body (43) is connected to the third sub-row (421); The current carried by the second sub-row (412) flows in the opposite direction to the current carried by the fourth sub-row (422).

2. The electronic device according to claim 1, characterized in that, One of the fourth sub-row (422) and the second sub-row (412) includes a first end (424) and the other has a first edge (414); along the extending direction of the fourth sub-row (422) and the second sub-row (412), the length of the first end (424) is greater than the length of the first edge (414).

3. The electronic device according to claim 2, characterized in that, The first end (424) forms a first external terminal (413), and the portion of the other at the first edge (414) forms a second external terminal (423).

4. The electronic device according to claim 3, characterized in that, The first end (424) is the end of the second sub-row (412) away from the first sub-row (411), and the first edge (414) is the edge of the fourth sub-row (422) away from the third sub-row (421).

5. The electronic device according to claim 4, characterized in that, The second sub-row (412) includes a first conductive portion (4121), which is located on one side of the body (43); the arrangement direction of the body (43) and the first conductive portion (4121) is orthogonal to the arrangement direction of the first sub-row (411) and the third sub-row (421); The fourth sub-row (422) includes a second conductive portion (4221), which is stacked with the first conductive portion (4121).

6. The electronic device according to claim 5, characterized in that, Also includes: The fifth sub-row (415) is connected between the first sub-row (411) and the first conductive portion (4121).

7. The electronic device according to claim 5 or 6, characterized in that, The first edge (414) is located in the second conductive portion (4221), and the first end (424) is the end of the first conductive portion (4121).

8. The electronic device according to claim 5 or 6, characterized in that, The second sub-row (412) further includes a third conductive portion (4122), which is connected to and intersects with the first conductive portion (4121); the fourth sub-row (422) further includes a fourth conductive portion (4222), which is connected to and intersects with the second conductive portion (4221); the fourth conductive portion (4222) and the third conductive portion (4122) are stacked; the first end (424) is the end of the fourth conductive portion (4222), and the first edge (414) is located in the third conductive portion (4122).

9. The electronic device according to claim 2, characterized in that, Also includes: The first insulating element (44) is disposed between the second sub-row (412) and the fourth sub-row (422).

10. The electronic device according to claim 9, characterized in that, The first insulating element (44) includes: A first insulating portion (441) is disposed between the second sub-row (412) and the fourth sub-row (422); and The second insulating portion (442) intersects with the first insulating portion (441) and is located between the first end (424) and the first edge (414).

11. The electronic device according to claim 7, characterized in that, Also includes: The first connecting terminal (45) is connected to the positive terminal of the body (43); as well as The second connection terminal (46) is connected to the negative terminal of the body (43).

12. The electronic device according to claim 1, characterized in that, Also includes: The housing (47) includes a first receiving space (471) in which the electronic device is housed.

13. The electronic device according to claim 12, characterized in that, The housing (47) is provided with a partition (473), the first accommodating space (471) is located on one side of the partition (473), and the other side of the partition (473) is provided with a second accommodating space (472). The first external terminal (413) and the second external terminal (423) are located in the second accommodating space (472).

14. The electronic device according to claim 13, characterized in that, The end of the partition (473) is an insulated end (474).

15. The electronic device according to claim 14, characterized in that, The first accommodating space (471) is provided with encapsulation material, which fills the space between the electronic device (40) and the inner wall of the housing (47) and the partition (473).

16. A controller, characterized in that, include: The first electronic device (40) is the electronic device according to any one of claims 1-15; Second electronic device (50); A first connector (60) is connected to a first external terminal (413) and a second electronic device (50); and The second connector (70) connects to the second external terminal (423) and the second electronic device (50).

17. The controller according to claim 16, characterized in that, The first electronic device (40) and the second electronic device (50) are stacked together.

18. The controller according to claim 17, characterized in that, The second electronic device includes: The main body (51) includes a middle portion (511) and a second edge (512); The first input terminal (52) is located on the side of the second edge (512) opposite to the center (511); the first connector (60) connects the first external terminal (413) and the first input terminal (52); and The second input terminal (53) is located between the first input terminal (52) and the second edge (512), and the second connector (70) connects the second external terminal (423) and the second input terminal (53).

19. The controller according to claim 18, characterized in that, The first input terminal (52) is spaced apart from the second input terminal (53) along the thickness direction of the main body (51) and stacked.

20. The controller according to claim 18 or 19, characterized in that, Also includes: The second insulating element (54) is disposed between the first input terminal (52) and the second input terminal (53).

21. The controller according to claim 20, characterized in that, Also includes: Heat sink (55) is stacked with the main body (51).

22. The controller according to claim 21, characterized in that, Also includes: Heat sink (56) is connected to the side of the heat sink (55) away from the main body (51).

23. The controller according to claim 22, characterized in that, The first connector (60) includes: The first connecting portion (61) is connected to the first external terminal (413). The second connecting portion (62) is connected to the first input terminal (52); the plane where the first connecting portion (61) is located intersects the plane where the second connecting portion (62) is located; and The third connecting portion (63) connects the first connecting portion (61) and the second connecting portion (62). The second connector (70) includes: The fourth connection portion (71) is connected to the second external terminal (423); The fifth connection portion (72) is connected to the second input terminal (53); the plane where the fourth connection portion (71) is located intersects the plane where the fifth connection portion (72) is located; and The sixth connecting portion (73) connects the fourth connecting portion (71) and the fifth connecting portion (72), and the sixth connecting portion (73) is stacked with the third connecting portion (63).

24. The controller according to claim 23, characterized in that, The first connecting portion (61) is welded to the first external terminal (413), and the second connecting portion (62) is welded to the first input terminal (52); The fourth connection portion (71) is welded to the second external terminal (423), and the fifth connection portion (72) is welded to the second input terminal (53).

25. The controller according to claim 22, characterized in that, Also includes: A third insulating element (74) is disposed between the first connector (60) and the second connector (70).

26. The controller according to claim 24, characterized in that, The number of the first connecting portions (61) is multiple, and the multiple first connecting portions (61) are arranged at intervals along the length direction of the first edge (414); The number of the fourth connecting portions (71) is multiple, and the multiple fourth connecting portions (71) are arranged at intervals along the length direction of the first edge (414).

27. The controller according to claim 22, characterized in that, Also includes: The base (80) has a first surface (81) and a second surface (82) facing each other. The first surface (81) has a mounting groove (811). The first electronic device (40) is mounted in the mounting groove (811). The second electronic device (50) is located on the second surface (82) in the area opposite to the mounting groove (811).

28. The controller according to claim 27, characterized in that, The second surface (82) includes a convex region that protrudes away from the first surface (81), and the second electronic device (50) is disposed on the top surface of the convex region, the convex region being opposite the mounting groove (811) in the thickness direction of the base (80).

29. The controller according to claim 28, characterized in that, The side wall of the mounting groove (811) is provided with an opening (812), which penetrates the side of the convex area, and the second sub-row (412) and the fourth sub-row (422) pass through the opening (812).

30. The controller according to claim 29, characterized in that, The portion of the base (80) between the bottom surface of the mounting groove (811) and the top surface of the convex area is a first base portion (83), and a cooling water channel is provided in the base (80), at least a portion of which is located in the first base portion (83).

31. The controller according to claim 30, characterized in that, The top surface of the convex region is provided with a clearance opening (813), which is connected to the cooling water channel; The second electronic device (50) includes a heat sink (55) and a heat sink component (56) disposed on the side of the heat sink (55) away from the main body (51), the heat sink (55) covering the clearance opening (813), and the heat sink component (56) located in the cooling water channel.

32. The controller according to claim 27, characterized in that, The mounting groove (811) is provided with encapsulation material, which fills the space between the first electronic device (40) and the inner wall of the mounting groove (811).

33. A vehicle, characterized in that, include: The electronic device according to any one of claims 1-15, and / or the controller (30) according to any one of claims 16-32.

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