Packaging structure of active implant

Abstract

The invention belongs to the technical field of rehabilitation medical treatment, and discloses an active implant packaging structure, which comprises a ceramic plate and a ceramic cover plate, a groove is formed in one side of the ceramic plate, a PCBA board is embedded in the groove of the ceramic plate, the PCBA board is located between the ceramic plate and the ceramic cover plate, and the ceramic cover plate is embedded in the groove of the ceramic plate. The ceramic cover plate and the PCBA plate are packaged on the ceramic plate through transparent sapphire laser welding; a plurality of small holes are formed in the plane end of the ceramic plate, metal contacts are arranged in the small holes in a penetrating mode, the metal contacts are in feed-through connection with the PCBA plate, gaps between the metal contacts and the small holes and the metal contacts are sealed through welding flux, and the metal contacts are electrode metal contacts and data metal contacts. According to the scheme, only one feed-through needs to be prepared, and compared with a traditional two-feed-through structure, the number of the feed-through is reduced; meanwhile, due to the fact that the number of feed-through is reduced, the usage amount of gold brazing filler metal is reduced, machining of metal pieces is not needed, and the product cost is remarkably reduced.

Description

Technical Field

[0001] The present invention relates to the field of rehabilitation medical technology, and more particularly to a packaging structure of an active implant. Background Art

[0002] Active implants are one of the brain-computer interface product groups. Brain-computer interface (BCI) is a revolutionary human-computer interaction that has huge potential applications by scientifically regulating brain activity to promote effective rehabilitation or improve performance in certain aspects.

[0003] The main components of the brain-computer interface include acquisition probes, stimulation probes, etc. Among them, the acquisition probe is used to connect the acquisition electrodes, process the neural signals collected from the brain, and convert them into data signals. The stimulation probe is used to receive data signals and convert them into neural signals to act on the spinal cord and other parts. Taking the acquisition probe as an example, the traditional structure is that the electrode feedthrough and the data feedthrough are separated on the two outer ends of the probe to receive and output signals. The PCBA (including the chip) is located inside the probe and is welded to the metal contacts of the electrode feedthrough and the data feedthrough respectively, and is responsible for signal conversion processing.

[0004] Both electrode feedthrough and data feedthrough are composed of metal contacts, ceramic plate, solder, and metal flange / housing, as shown below Figure 1 . There are several small holes distributed on the ceramic plate, and the metal contacts penetrate the small holes of the ceramic plate and are soldered firmly with solder. The metal contact components are generally composed of biologically excellent materials such as niobium, platinum and iridium. In order to ensure mutual insulation, they are occasionally distributed on the ceramic plate. The material of the ceramic plate is generally medical-grade alumina, zirconium oxide, sapphire, etc. The gap between the holes in the ceramic plate and the metal contacts needs to be sealed with solder. The solder material is generally biologically excellent and stable gold. The PCBA is sandwiched between two feedthroughs, and the metal shell wraps and seals it. It is not easy to weld the feedthrough to the metal shell. Generally, the feedthrough is first brazed to the metal flange with gold, and then the metal flange and the metal shell are laser welded. The materials of the two are generally titanium metals such as TA2 and TC4.

[0005] Problems:

[0006] 1. Expensive:

[0007] In traditional probe products, feedthrough is the main source of cost for the entire product. Since the brazing of ceramic holes and metal contacts requires the use of expensive gold as solder, and the two separate feedthrough structures require titanium metal support connection, which also requires gold brazing. In addition, two titanium shells, titanium frames, and two titanium flanges are required. Due to the structural precision requirements, these parts usually need to be machined and sandblasted, which further increases the cost.

[0008] 2. The process is difficult to stabilize: A large number of brazing operations are required during the product manufacturing process, and the product has very high requirements for air tightness, which makes the process much more difficult. The slightest carelessness will lead to product scrapping. During the brazing process, titanium metal, ceramics, and gold are put into the furnace together. Due to the large difference in thermal expansion coefficients between them, it is easy to cause titanium metal deformation, which makes the next laser welding difficult. In addition, the PCBA needs to be welded to the data feedthrough on one side first, and then welded to the electrode feedthrough on the other side in a small space, which places extremely high requirements on the manufacturer's operation.

[0009] 3. Product design limitations: Active implant products are expected to be permanently implanted in the human body, and the acquisition probe may be implanted between the skull and the cerebral cortex, which places high demands on the volume and thickness of the product. The traditional two separate feedthrough structures, with the PCBA sandwiched in the middle, require welding space in addition to the thickness of the feedthrough itself, which makes it difficult for the product to meet the needs of limited space inside the human body. Summary of the invention

[0010] The purpose of the present invention is to solve the shortcomings in the prior art and to propose a packaging structure of an active implant.

[0011] To solve the above problems, the present invention adopts the following technical solutions:

[0012] A packaging structure of an active implant, comprising a ceramic plate and a ceramic cover plate, wherein a groove is provided on one side of the ceramic plate, a PCBA board is embedded in the groove of the ceramic plate, the PCBA board is located between the ceramic plate and the ceramic cover plate, and the ceramic cover plate and the PCBA board are packaged on the ceramic plate by transparent sapphire laser welding;

[0013] The planar end of the ceramic plate is provided with a plurality of small holes, and metal contacts are interspersed in the small holes. The metal contacts are connected to the PCBA board through a feedthrough, and the gaps between the metal contacts and the small holes and the metal contacts are sealed by solder. The metal point contacts are electrode metal contacts and data metal contacts.

[0014] As a further description of the above technical solution: the number of the grooves 3 is one, two or more.

[0015] As a further description of the above technical solution: the electrode metal contact and the data metal contact are separated into two areas at the plane end of the ceramic plate.

[0016] As a further description of the above technical solution: the electrode metal contacts are distributed in a ring around the data metal contacts.

[0017] Compared with the prior art, the advantages of the present invention are:

[0018] 1. Cost reduction: This solution only needs to prepare one feedthrough, which reduces the number of feedthroughs compared to the traditional two-feedthrough structure. At the same time, since the number of feedthroughs is reduced, the amount of gold solder used is also reduced, and there is no need to machine metal parts, which significantly reduces the cost of the product.

[0019] 2. Improved airtight stability: In the traditional solution, a large number of brazing locations are unstable factors that affect the airtightness of the product. This solution reduces the number of brazing locations and reduces the risk of airtightness problems caused by brazing, thereby improving the airtight stability of the product.

[0020] 3. Reduce deformation: In the traditional solution, titanium metal is easy to deform during brazing due to the difference in thermal expansion coefficient. In this solution, by abandoning the structure and process related to titanium metal, the deformation of the product is reduced, which helps to improve product quality.

[0021] 4. Easy assembly, improved efficiency and reduced defect rate: In the traditional solution, it is difficult to solder PCBA on both sides in a small space. This solution simplifies the structure and makes assembly easier. This not only improves production efficiency, but also reduces the defect rate caused by difficult operation, and improves the overall production efficiency of the product.

[0022] 5. Reduced product thickness: This solution optimizes the structure to eliminate the thickness increase factor caused by two feedthroughs and complex welding space requirements in the traditional structure. The product can become thinner, which can reduce the degree of damage to the patient and improve the patient's comfort and safety in application scenarios with strict thickness requirements, such as active implants, especially acquisition probes implanted between the skull and the cerebral cortex.

[0023] 6. Enhanced structural adaptability: The product grooves in this solution can be one, two or more, which can adapt to the requirements of multiple PCBAs. Compared with traditional structures, it is more flexible in design and more scalable, and can better meet the packaging requirements of active implants with different functions and performance requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 A schematic diagram of the structure of the prior art

[0025] Figure 2 It is a structural schematic diagram of the present invention;

[0026] Figure 3 It is a structural schematic diagram of the PCBA board of the present invention;

[0027] Figure 4 One of the schematic diagrams of the arrangement of the data metal contacts and the electrode metal contacts of the present invention;

[0028] Figure 5This is the second schematic diagram of the arrangement of the data metal contacts and the electrode metal contacts of the present invention.

[0029] Description of the numbers in the figure:

[0030] 1. Ceramic board; 2. Ceramic cover; 3. Groove; 4. PCBA board; 5. Small hole; 6. Metal contact. DETAILED DESCRIPTION

[0031] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention; it is obvious that the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments, and all other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making creative work are within the scope of protection of the present invention.

[0032] See also Figure 2-5 , a packaging structure of an active implant, comprising a ceramic plate 1 and a ceramic cover plate 2, a groove 3 is provided on one side of the ceramic plate 1, a PCBA board 4 is embedded in the groove 3 of the ceramic plate 1, the PCBA board 4 is located between the ceramic plate 1 and the ceramic cover plate 2, and the ceramic cover plate 2 and the PCBA board 4 are packaged on the ceramic plate 1 by transparent sapphire laser welding; a plurality of small holes 5 are provided on the plane end of the ceramic plate 1, metal contacts 6 are interspersed in the small holes 5, the metal contacts 6 are connected to the PCBA board 4 by feedthrough, the gap between the metal contacts 6 and the small holes 5 and the metal contacts 6 is sealed by solder, and the metal point contacts 6 are electrode metal contacts and data metal contacts. In this scheme, the PCBA board 4 is directly installed in the structure formed by the ceramic plate 1 and the ceramic cover plate 2, and only one feedthrough needs to be prepared, less gold solder is used, and no additional metal parts are required, which reduces the cost. The reduction of the brazing parts improves the airtight stability of the product, and the absence of metal parts also reduces the deformation of the product. It is easier to assemble, improves efficiency, and reduces the defective rate. The product can be made very thin, reducing the degree of damage to the patient.

[0033] In addition, the groove 3 is one, two or more, which can meet the requirements of multiple PCBAs. Figure 4 , 5 The figure shows the arrangement of the electrode metal contacts and the data metal contacts when the number of grooves is two. Figure 4 In the embodiment, the electrode metal contact and the data metal contact are separated into two areas at the flat end of the ceramic plate 1; Figure 5 In the embodiment, the electrode metal contacts are distributed in a ring around the data metal contacts. It should be noted that the arrangement of the data metal contacts and the electrode metal contacts can have more possibilities according to the process and clinical needs.

[0034] The above is only a preferred specific implementation of the present invention; however, the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical solution and its improved conception within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A packaging structure of an active implant, characterized in that: The invention comprises a ceramic plate (1) and a ceramic cover plate (2), wherein a groove (3) is provided on one side of the ceramic plate (1), a PCBA board (4) is embedded in the groove (3) of the ceramic plate (1), the PCBA board (4) is located between the ceramic plate (1) and the ceramic cover plate (2), and the ceramic cover plate (2) and the PCBA board (4) are packaged on the ceramic plate (1) by transparent sapphire laser welding; The flat end of the ceramic plate (1) is provided with a plurality of small holes (5), and metal contacts (6) are inserted into the small holes (5). The metal contacts (6) are connected to the PCBA board (4) through a feed-through, and the gaps between the metal contacts (6) and the small holes (5) and the metal contacts (6) are sealed by solder, and the metal point contacts (6) are electrode metal contacts and data metal contacts.

2. The packaging structure of an active implant according to claim 1, characterized in that: The number of the groove (3) is one, two or more.

3. The packaging structure of an active implant according to claim 1, characterized in that: The electrode metal contact and the data metal contact are separated into two areas at the plane end of the ceramic plate (1).

4. The packaging structure of an active implant according to claim 1, characterized in that: The electrode metal contacts are distributed in a ring shape around the data metal contacts.

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