A debugging tool for circuit board heat dissipation

Abstract

The present invention discloses a debugging tool for heat dissipation of a circuit board, comprising a heat dissipation base, the heat dissipation base is provided with supporting feet, a fan is installed below the heat dissipation base, the heat dissipation base is provided with a guide rail, a slider is provided on the guide rail, a slider fixing seat is installed on the slider, the slider fixing seat is provided with an adjustment screw, the adjustment screw is connected with a circuit board fixing assembly, the circuit board fixing assembly comprises an adjustable clamp, a support column and a clamping screw, the adjustable clamp is connected with the adjustment screw, the adjustable clamp is provided with a threaded hole, the clamping screw is threadedly connected with the adjustable clamp, the support column is connected with the circuit board through the circuit board fixing hole, and the clamping screw is used to clamp the support column. The present invention is used to solve the problem of size incompatibility caused by irregular size and shape of the circuit board during debugging.

Description

Technical Field

[0001] The invention belongs to the technical field of circuit board heat dissipation, and in particular relates to a debugging tool for circuit board heat dissipation. Background Art

[0002] In various devices, due to factors such as circuit performance parameters and installation space, it is difficult to achieve completely consistent size specifications of circuit boards designed for different projects. As a result, the heat dissipation debugging tools used in different project circuit boards can only be designed separately and cannot be used on circuit boards of other projects. In the process of actual circuit debugging and experiments, it is often the case that the power supply is ready but the debugging work can only continue after the matching heat dissipation tooling is completed, resulting in a waste of time and money.

[0003] Existing common heat dissipation debugging tools such as Figure 1 As shown, the circuit board that needs to be cooled is fixed to the radiator by screws, and the pre-tightening force of the screws is used to achieve close contact between the circuit board and the radiator. When the heat is transferred to the radiator fins through the radiator substrate by heat conduction, the fan deflects the waste heat on the fins to achieve the purpose of heat dissipation. In this way, since the specifications and sizes of the circuit boards of each project are different, the radiator needs to be designed separately according to the size and shape of the circuit boards, which will result in a waste of resources.

[0004] The current air-cooling heat dissipation method is to fix the circuit board directly to the radiator by screwing it, and transfer the waste heat generated by the heating elements on the circuit board to the radiator through heat conduction, and deflect the waste heat on the radiator by blowing the cooling fins directly through the fan on the side of the radiator. However, due to the different sizes of circuit boards used in different projects, there are differences in the fixing hole positions. The present invention aims to be compatible with circuit boards of different specifications to save time and facilitate debugging. Summary of the invention

[0005] In view of the deficiencies in the prior art, the present invention provides a debugging tool for heat dissipation of a circuit board, which is used to solve the problem of size incompatibility caused by irregular size and shape of the circuit board during the debugging process.

[0006] The present invention is achieved through the following technical solutions:

[0007] A debugging tool for circuit board heat dissipation comprises a heat dissipation base, the heat dissipation base is provided with supporting feet, a cooling device is installed below the heat dissipation base, the heat dissipation base is provided with a guide rail, a slider is provided on the guide rail, a slider fixing seat is installed on the slider, the slider fixing seat is provided with an adjustment screw, and the adjustment screw is connected to a circuit board fixing assembly.

[0008] Further, the adjustment screw includes a sliding rod, a first threaded sleeve rod and a second threaded sleeve rod, the first threaded sleeve rod is connected to the second threaded sleeve rod, the sliding rod passes through the first threaded sleeve rod and one end is connected to the circuit board fixing assembly, the second threaded sleeve rod is provided with a cavity, a spring is provided in the cavity, one end of the spring is abutted against the sliding rod, the end of the sliding rod can slide in the cavity, the other end of the spring is abutted against the screwing base, the screwing base is provided with threads, and is connected to the cavity through the internal threads at the end of the cavity.

[0009] Furthermore, the first threaded sleeve is provided with a sleeve at the connecting end with the second threaded sleeve, the inner diameter of the sleeve is larger than the diameter of the sliding rod, and one end of the second threaded sleeve is embedded in the sleeve.

[0010] Furthermore, a limiting rod is provided on the sleeve, and a circumferential annular groove and an axial limiting groove are provided at the end of the second threaded sleeve rod, the annular groove is communicated with the limiting groove, and when the limiting rod is located in the limiting groove, the first threaded sleeve rod and the second threaded sleeve rod are tightly connected and a continuous thread is formed at the connection, and when the limiting rod is located in the annular groove, an axial gap is generated between the first threaded sleeve rod and the second threaded sleeve rod and a slight thread misalignment is formed at the connection.

[0011] Furthermore, the circuit board fixing assembly includes an adjustable clamp, a support column and a clamping screw, the adjustable clamp is connected to the adjustment screw, the adjustable clamp is provided with a threaded hole, the clamping screw is threadedly connected to the adjustable clamp, the support column is connected to the circuit board through the circuit board fixing hole, and the clamping screw is used to clamp the support column.

[0012] Furthermore, the cooling device is a fan, and the fan is connected to the heat dissipation base through a fan fixing rod.

[0013] Compared with the prior art, the present invention has the following beneficial effects:

[0014] 1. Can improve the compatibility of circuit boards of different projects;

[0015] 2. The segmented adjustment screw can achieve automatic locking to prevent damage to the circuit board;

[0016] 2. Auxiliary clamping circuit board welding can be realized in the plane coordinate system;

[0017] 3. It can assist in achieving the clamping and heat dissipation effect when testing the power of a single component. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the implementation methods of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for the implementation methods or the description of the prior art. Obviously, the drawings in the following description are only exemplary, and for ordinary technicians in this field, other implementation drawings can be derived from the provided drawings without creative work.

[0019] Figure 1 Schematic diagram of the heat dissipation debugging tooling structure for existing circuit boards;

[0020] Figure 2 This is a schematic diagram of a debugging tooling mechanism for heat dissipation of a circuit board of the present invention;

[0021] Figure 3 An exploded view of the debugging tooling components for heat dissipation of a circuit board of the present invention;

[0022] Figure 4 This is a schematic diagram of the structure of the adjusting screw of the present invention;

[0023] Figure 5 It is a schematic diagram of the structure of the second threaded sleeve rod of the present invention.

[0024] Reference numerals in the figure: 1-circuit board, 2-heat dissipation base, 3-support foot, 4-fan, 5-guide rail, 6-slider, 7-slider fixing seat, 8-adjusting screw, 9-adjustable clamp, 10-pressing screw, 11-support column, 12-fan fixing rod, 801-sliding rod, 802-first threaded sleeve rod, 803-second threaded sleeve rod, 804-spring, 805-screwing base, 806-limiting rod, 807-annular groove, 808-limiting groove. DETAILED DESCRIPTION

[0025] The exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present invention and to enable the scope of the present invention to be fully communicated to those skilled in the art. It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in conjunction with the embodiments.

[0026] The present invention discloses a specific embodiment of a debugging tool for circuit board heat dissipation, such as Figure 2 , Figure 3As shown, it includes a heat dissipation base 2, a support foot 3, a guide rail 5, a slider 6, a slider fixing seat 7, an adjustment screw 8, an adjustable clamp 9, a clamping screw 10 and a support column 11. The heat dissipation device adopts a fan 4 and is fixed under the heat dissipation base 2 through a fan fixing rod 12. The circuit board 1 is fixed by the adjustable clamp 9 and the adjustment screw 8 and the circuit board 1 is cooled by the fan 4; the positioning of the circuit boards 1 of different sizes is realized by the guide rail 5 and the slider fixing seat 7, and the circuit board 1 is fixed by the slider fixing seat 7 and the adjustable clamp 9 on the slider 6 to achieve the purpose of preliminary constraint; according to the fixing hole position of the circuit board 1, the support column 11 is placed at the clamping screw 10, and the clamping screw 10 on the adjustable clamp 9 is rotated to give the circuit board 1 a vertical pressure to fix the circuit board 1. In this way, it can be compatible with the changes in the size and fixing hole position of the circuit board for different projects. Compared with the existing method of directly fixing the circuit board on the radiator, it can be compatible with multiple projects.

[0027] The adjusting screw 8 includes a sliding rod 801, a first threaded sleeve rod 802 and a second threaded sleeve rod 803. The sliding rod 801 passes through the first threaded sleeve rod 802 and one end is connected to the adjustable clamp 9. The second threaded sleeve rod 803 is provided with a cavity. The inner diameter of the cavity is larger than the diameter of the sliding rod 801 and a spring 804 is provided inside the cavity. One end of the spring 804 is against the sliding rod 801, and the end of the sliding rod 801 can slide in the cavity. The other end of the spring 804 is against the screwing base 805. The screwing base 805 is provided with threads and is connected to the cavity through the internal threads at the end of the cavity. The stroke elastic force of the spring 804 can be adjusted by adjusting the position of the screwing base 805.

[0028] A sleeve is provided at the connection end of the first threaded sleeve 802 and the second threaded sleeve 803, the inner diameter of the sleeve is larger than the diameter of the sliding rod 801, and one end of the second threaded sleeve 803 is inserted into the sleeve. A limiting rod 806 is provided on the sleeve, and a circumferential annular groove 807 and an axial limiting groove 808 are provided at the end of the second threaded sleeve 803, and the annular groove 807 is connected with the limiting groove 808. When the limiting rod 806 is located in the limiting groove 808, the first threaded sleeve 802 and the second threaded sleeve 803 are tightly connected and a continuous thread is formed at the connection. When the limiting rod 806 is located in the annular groove 807, an axial gap is generated between the first threaded sleeve 802 and the second threaded sleeve 803, and a slight thread misalignment is formed at the connection.

[0029] The use process of the debugging tool for circuit board heat dissipation provided in this embodiment is as follows:

[0030] S1: confirm the ambient temperature, the amount of heat generated by the circuit board 1 that needs to be cooled, the temperature control range, and the height of the circuit board 1.

[0031] S2: Confirm the parameters of the selected fan 4 and the material of the heat sink 2 according to the conditions of step S1; fix the fan fixing rod 12 on the finned mounting surface of the heat sink 2, and point the air outlet of the fan 4 toward the heat sink 2, so that the waste heat on the heat sink 2 is desorbed by the operation of the fan 4. Fix the support foot 3 on the finned mounting surface of the heat sink 2, and adjust the thread height of the support foot 3 to achieve the effect of supporting the fan 4 and the heat sink 2.

[0032] S3: Assemble the support column 11 to the fixing hole of the circuit board 1 to be tested, and place it on the working surface of the heat dissipation base 2 (the mounting surface without fins).

[0033] S4: Fix the guide rail 5 on the working surface of the heat dissipation base 2 and install the slider 6, and assemble the adjustable clamp 9 and the pressing screw 10.

[0034] S5: Select a suitable slide bar 801 to assemble the adjusting screw 8, screw the adjusting screw 8 into the slider fixing seat 7, install the adjustable clamp 9 to one end of the slide bar 801, and fix the slider fixing seat 7 on the guide rail slider 6.

[0035] S6: Slide the limit rod 806 into the limit groove 808, screw the second threaded sleeve 803 to drive the first threaded sleeve 802 to rotate together, and after the adjustable clamp 9 contacts the circuit board 1, continue to screw the second threaded sleeve 803 according to the previous force. When the sliding rod 801 squeezes the spring 804 to a certain extent, the reaction force of the spring 804 will make the limit rod 806 slide into the annular groove 807, so that an axial gap is formed between the first threaded sleeve 802 and the second threaded sleeve 803, and the threads at the connection are slightly misaligned, so that the first threaded sleeve 802 cannot be continued to be driven by the second threaded sleeve 803, thereby achieving the effect of position locking and preventing the circuit board 1 from being damaged by excessive force.

[0036] S7: After locating the fixing hole of the circuit board 1 with the clamping screw 10 on the adjustable clamp head 9, confirm that the circuit board 1 to be tested is in a clamped state, and fix it by screwing the top screw on the side of the slider to achieve the purpose of being compatible with changes in the shape and size of the circuit board.

[0037] When the tooling is disassembled, the first threaded sleeve 802 is reversely screwed to make the limiting rod 806 slide to the limiting groove 808 , so that the first threaded sleeve 802 drives the second threaded sleeve 803 to screw out of the threaded channel of the slider fixing seat 7 .

[0038] Through the above steps, the occurrence of situations in which the debugging progress is affected by the non-interchangeability of heat dissipation tooling during electrical experiments or equipment debugging is reduced.

[0039] The present invention has been described in detail above through embodiments, but the contents described are only exemplary embodiments of the present invention and cannot be considered to limit the scope of implementation of the present invention. The protection scope of the present invention is defined by the claims. Anyone who utilizes the technical solution described in the present invention, or a technician in the field, inspired by the technical solution of the present invention, designs a similar technical solution within the essence and protection scope of the present invention to achieve the above technical effects, or makes equal changes and improvements to the scope of application, shall still belong to the scope of protection covered by the patent of the present invention. It should be noted that in order to make a clear statement, the description of some components and processes that have no direct and obvious connection with the scope of protection of the present invention but are known to those skilled in the art are omitted in the description of the present invention.

[0040] It should be noted that, in the description of the present invention, terms such as "up", "down", "left", "right", "inside" and "outside" indicating directions or positional relationships are based on the directions or positional relationships shown in the drawings. This is merely for the convenience of description and does not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it cannot be understood as a limitation on the present invention.

[0041] In addition, it should be noted that in the description of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

Claims

1. A debugging tool for circuit board heat dissipation, comprising a heat dissipation base, the heat dissipation base is provided with supporting feet, a cooling device is installed below the heat dissipation base, characterized in that: The heat dissipation base is provided with a guide rail, a slider is provided on the guide rail, a slider fixing seat is installed on the slider, an adjusting screw is provided on the slider fixing seat, and a circuit board fixing assembly is connected to the adjusting screw.

2. A circuit board heat dissipation debugging tool according to claim 1, characterized in that: The adjusting screw comprises a sliding rod, a first threaded sleeve rod and a second threaded sleeve rod, the first threaded sleeve rod is connected to the second threaded sleeve rod, the sliding rod passes through the first threaded sleeve rod and one end is connected to the circuit board fixing assembly, the second threaded sleeve rod is provided with a cavity, a spring is provided in the cavity, one end of the spring is abutted against the sliding rod, the end of the sliding rod can slide in the cavity, the other end of the spring is abutted against the screwing base, the screwing base is provided with threads, and is connected to the cavity through the internal threads at the end of the cavity.

3. A circuit board heat dissipation debugging tool according to claim 2, characterized in that: The first threaded sleeve is provided with a sleeve at the end connected to the second threaded sleeve, the inner diameter of the sleeve is larger than the diameter of the sliding rod, and one end of the second threaded sleeve is embedded in the sleeve.

4. A debugging tool for circuit board heat dissipation according to claim 3, characterized in that: The sleeve is provided with a limiting rod, and the end of the second threaded sleeve is provided with a circumferential annular groove and an axial limiting groove, the annular groove is communicated with the limiting groove, when the limiting rod is located in the limiting groove, the first threaded sleeve and the second threaded sleeve are tightly connected and form a continuous thread at the connection, when the limiting rod is located in the annular groove, an axial gap is generated between the first threaded sleeve and the second threaded sleeve and a slight thread misalignment is formed at the connection.

5. The circuit board heat dissipation debugging tool according to claim 1, characterized in that: The circuit board fixing assembly includes an adjustable clamp, a support column and a clamping screw. The adjustable clamp is connected to the adjustment screw. The adjustable clamp is provided with a threaded hole. The clamping screw is threadedly connected to the adjustable clamp. The support column is connected to the circuit board through the circuit board fixing hole. The clamping screw is used to clamp the support column.

6. The circuit board heat dissipation debugging tool according to claim 1, characterized in that: The cooling device is a fan, and the fan is connected to the heat dissipation base through a fan fixing rod.

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