A printed circuit board component heat dissipation structure and module

Abstract

The present invention relates to a heat dissipation structure and module for components of a printed circuit board, the heat dissipation structure comprises a printed circuit board, components, a heat dissipation bottom layer, fasteners and an insulating sleeve, wherein: the printed circuit board has a first through hole; the components have a second through hole, and the components are welded on the printed circuit board; the heat dissipation bottom layer has a blind hole; the insulating sleeve is inserted into the first through hole, and the fastener passes through the insulating sleeve and the second through hole in sequence from one side, and is fixed with the blind hole sleeve, thereby connecting and fixing the components with the heat dissipation bottom layer. This structure enables the components welded on the surface of the printed circuit board to directly contact the heat dissipation bottom layer without being squeezed by the weight of the heat dissipation bottom layer. The fastener fixation not only reduces the air gap between the heat dissipation bottom layer and the components, but the fastener can also act as a heat conducting medium to directly conduct the heat generated by the components to the heat dissipation bottom layer. The insulating sleeve can produce an insulating effect between the printed circuit board and the fastener, preventing the printed circuit board from having poor withstand voltage.

Description

Technical Field

[0001] The invention relates to the technical field of electronic hardware design, and in particular to a printed circuit board component heat dissipation structure and module. Background Art

[0002] In modern electronic devices, with the improvement of circuit component functions and the increase in power consumption, the heat generated by components during operation has become an important factor affecting the performance and reliability of the equipment. To this end, the prior art usually adopts heat-conducting structures such as heat sinks to dissipate heat for components by heat conduction. However, this heat dissipation method still has many problems in practical applications. On the one hand, even if the heat sink is attached to the components, there is a certain air gap between the heat sink and the components, which reduces the heat conduction efficiency; on the other hand, for components soldered on the surface of the printed circuit board, the heat of the components needs to be transferred to the heat sink through the printed circuit board. The heat conduction path is long and the heat is difficult to dissipate quickly; and directly attaching a large metal heat sink to the top of the components of the printed circuit board is easy to put pressure on the components and damage the components; using a thinner heat sink to protect the components cannot meet the heat dissipation requirements of some components. Summary of the invention

[0003] The object of the present invention is to provide a heat dissipation structure for components of a printed circuit board, which can improve the heat dissipation efficiency of components of the printed circuit board without causing possible damage to the components.

[0004] In order to achieve the above-mentioned purpose, the first aspect of the present invention provides a printed circuit board component heat dissipation structure, including a printed circuit board, a component, a heat dissipation bottom layer and a fastener, wherein: the printed circuit board has a first through hole; the component is soldered on the printed circuit board; the heat dissipation bottom layer has a blind hole; the fastener passes through the first through hole from one side and is fixedly sleeved with the blind hole, thereby making the component contact with the heat dissipation bottom layer.

[0005] The above-mentioned printed circuit board component heat dissipation structure sets the heat dissipation layer at the bottom and inverts the printed circuit board, so that the components soldered on the surface of the printed circuit board can directly contact the heat dissipation bottom layer without being squeezed by the weight of the heat dissipation bottom layer, avoiding damage to the components, and making it unnecessary for the heat of the components to be transferred to the heat dissipation bottom layer through the printed circuit board, thereby improving the heat dissipation efficiency of the components. In addition, the fasteners support the printed circuit board as a supporting structure to prevent the printed circuit board from causing mechanical squeezing of the components.

[0006] In a possible implementation, the component has a second through hole, wherein: the fastener passes through the first through hole and the second through hole in sequence from one side, and is then sleeved and fixed with the blind hole, thereby connecting and fixing the component to the heat dissipation bottom layer.

[0007] In this implementation, components with mounting through holes are used, and the components are connected and fixed to the heat dissipation bottom layer by fasteners, which not only makes the contact between the components and the heat dissipation bottom layer closer, reduces the air gap between the heat dissipation bottom layer and the components, and improves the heat conduction efficiency, but the fasteners can also directly conduct the heat generated by the components to the heat dissipation bottom layer as a heat conducting medium, further improving the heat dissipation efficiency of the components. In addition, the fasteners pass through the through holes of the printed circuit board and the through holes of the components from one side in sequence, and then are fixed with the blind holes of the heat dissipation bottom layer, so that a stable fixed connection structure is formed between the printed circuit board, the components and the heat dissipation bottom layer, avoiding relative sliding between the printed circuit board and the heat dissipation bottom layer due to unstable fixation, which may damage the components.

[0008] In a possible implementation, the heat dissipation bottom layer has a boss, wherein: the blind hole is located in the boss, and the heat dissipation bottom layer is in contact with the component through the boss.

[0009] In this implementation, the heat dissipation bottom layer contacts the components through the boss structure, and bosses of corresponding heights can be made according to the thickness of different components, so that the heat dissipation bottom layer is adapted to the height of the components, thereby closely contacting the components and improving the heat conduction efficiency. In addition, when components of different thicknesses are soldered on the printed circuit board and need to be dissipated in the above manner, multiple bosses of different heights can be made on the heat dissipation bottom layer, so that the heat dissipation bottom layer can be in close contact with multiple components of different thicknesses, thereby improving the heat conduction efficiency.

[0010] In a possible implementation, the fastener is a screw, and the blind hole is a threaded hole; the screw passes through the first through hole and the second through hole in sequence from one side and is connected to the threaded hole, thereby connecting and fixing the component to the heat dissipation bottom layer.

[0011] In this implementation, screws and threaded holes are used as a connection method for connecting the printed circuit board, components and the heat dissipation bottom layer. When installing, the screw only needs to be passed through the first through hole and the second through hole from one side in sequence and then screwed into the threaded hole. When disassembling, the screw only needs to be screwed out of the threaded hole and then withdrawn from the second through hole and the first through hole in sequence, making the installation and disassembly of the components more convenient. In addition, the screw, as a metal connector, can take into account the connection and fixation of the components and the heat dissipation bottom layer and directly conduct the heat generated by the components to the heat dissipation bottom layer as a heat conducting medium, thereby improving the heat dissipation efficiency of the circuit board components.

[0012] In a possible implementation, the printed circuit board component heat dissipation structure further includes an insulating sleeve, wherein: the insulating sleeve is inserted into the first through hole, and the screw passes through the insulating sleeve and the second through hole in sequence from one side and is connected to the threaded hole.

[0013] In this implementation, considering that the distance between the screw head and the first through hole on the printed circuit board in the above-mentioned heat dissipation structure is relatively close, resulting in the screw as a metal device being too close to the upper surface and the lower surface of the printed circuit board, which may cause the problem of poor voltage resistance of the printed circuit board, an insulating sleeve is designed to be inserted into the first through hole, so that the screw passes through the insulating sleeve and the second through hole in sequence from one side, and after being connected to the threaded hole, the screw and the printed circuit board are isolated by the insulating sleeve, so that the insulating sleeve has an insulating effect on the printed circuit board and the screw, thereby preventing the printed circuit board from having poor voltage resistance.

[0014] In a possible implementation, after the screw passes through the insulating sleeve and the second through hole in sequence from one side and is connected to the threaded hole, a semi-wrapped structure is formed between the insulating sleeve and the head of the screw.

[0015] In this implementation, the size of the insulating sleeve is designed so that a semi-wrapped structure is formed between the insulating sleeve and the head of the screw, thereby further enhancing the insulating effect of the insulating sleeve on the printed circuit board and the screw.

[0016] The second aspect of the present invention provides a component heat dissipation module, comprising a printed circuit board, components, a heat dissipation bottom layer, a heat dissipation shell, screws and a cover plate, wherein: the printed circuit board is installed in the heat dissipation shell, and the printed circuit board has a first through hole; the component is welded on the printed circuit board, and the component has a second through hole; the heat dissipation bottom layer has a threaded hole; the screw passes through the first through hole and the second through hole in sequence from one side, and is connected to the threaded hole, thereby connecting and fixing the component to the heat dissipation bottom layer; the heat dissipation bottom layer is fixed to the bottom of the heat dissipation shell; the cover plate is connected and fixed to the heat dissipation shell, thereby sealing the printed circuit board in the heat dissipation shell.

[0017] The above-mentioned component heat dissipation module sets the heat dissipation layer at the bottom of the heat dissipation shell, and reverses the printed circuit board, so that the components welded on the surface of the printed circuit board can directly contact the heat dissipation bottom layer without being squeezed by the weight of the heat dissipation bottom layer, avoiding the components from being damaged by force, and making the heat of the components not need to be transferred to the heat dissipation bottom layer through the printed circuit board, thereby improving the heat dissipation efficiency of the components. Using components with mounting through holes, the components are connected and fixed to the heat dissipation bottom layer by screws, which not only makes the contact between the components and the heat dissipation bottom layer closer, reduces the air gap between the heat dissipation bottom layer and the components, and improves the heat conduction efficiency, but the screws can also directly conduct the heat generated by the components to the heat dissipation bottom layer as a heat conducting medium, further improving the heat dissipation efficiency of the components. In addition, the screws are connected to the threaded holes of the heat dissipation bottom layer by passing through the through holes of the printed circuit board and the through holes of the components from one side in turn, so that a stable fixed connection structure is formed between the printed circuit board, the components and the heat dissipation bottom layer, avoiding relative sliding between the printed circuit board and the heat dissipation bottom layer due to unstable fixation, thereby damaging the components. The cover plate is connected and fixed to the heat dissipation shell, so that the printed circuit board is sealed in the heat dissipation shell, which can not only protect the printed circuit board and components, but the heat dissipation shell can also serve as a heat-conducting structure to conduct the heat received by the heat dissipation bottom layer into the air, thereby increasing the contact area between the heat-conducting structure and the air and improving the heat conduction efficiency.

[0018] In a possible implementation, the heat dissipation bottom layer has a boss, wherein: the threaded hole is located in the boss, and the heat dissipation bottom layer is in contact with the component through the boss.

[0019] In this implementation, the heat dissipation bottom layer contacts the components through the boss structure. Bosses of corresponding heights can be made according to the thickness of different components, so that the heat dissipation bottom layer is adapted to the height of the components, thereby closely contacting the components and improving the heat conduction efficiency. Since the heat dissipation shell is a relatively regular rectangular structure, the above implementation avoids the situation where the heat dissipation bottom layer is fixed to the shell bottom of the heat dissipation shell and is restricted by the thickness and shape of the shell bottom and cannot be in close contact with the components, thereby reducing the air gap between the heat dissipation bottom layer and the components. In addition, when components of different thicknesses are welded on the printed circuit board and need to be cooled in the above manner, multiple bosses of different heights can be made on the heat dissipation bottom layer so that the heat dissipation bottom layer can be in close contact with multiple components of different thicknesses, thereby improving the heat conduction efficiency.

[0020] In a possible implementation, the component heat dissipation module further includes an insulating sleeve, wherein: the insulating sleeve is inserted into the first through hole, and the screw passes through the insulating sleeve and the second through hole in sequence from one side and is connected to the threaded hole.

[0021] In this implementation, considering that the distance between the screw head and the first through hole on the printed circuit board in the above-mentioned heat dissipation structure is relatively close, resulting in the screw as a metal device being too close to the upper surface and the lower surface of the printed circuit board, which may cause the problem of poor voltage resistance of the printed circuit board, an insulating sleeve is designed to be inserted into the first through hole, so that the screw passes through the insulating sleeve and the second through hole in sequence from one side, and after being connected to the threaded hole, the screw and the printed circuit board are isolated by the insulating sleeve, so that the insulating sleeve has an insulating effect on the printed circuit board and the screw, thereby preventing the printed circuit board from having poor voltage resistance.

[0022] In a possible implementation, after the screw passes through the insulating sleeve and the second through hole in sequence from one side and is connected to the threaded hole, a semi-wrapped structure is formed between the insulating sleeve and the head of the screw.

[0023] In this implementation, the size of the insulating sleeve is designed so that a semi-wrapped structure is formed between the insulating sleeve and the head of the screw, thereby further enhancing the insulating effect of the insulating sleeve on the printed circuit board and the screw.

[0024] A printed circuit board component heat dissipation structure and module provided by the present invention has at least the following advantages compared with the prior art:

[0025] The above-mentioned printed circuit board component heat dissipation structure and module sets the heat dissipation layer at the bottom of the heat dissipation shell, and reverses the printed circuit board, so that the components welded on the surface of the printed circuit board can directly contact the heat dissipation bottom layer without being squeezed by the weight of the heat dissipation bottom layer, avoiding the components from being damaged by force, and making the heat of the components not need to be transferred to the heat dissipation bottom layer through the printed circuit board, thereby improving the heat dissipation efficiency of the components. Using components with mounting through holes, the components are connected and fixed to the heat dissipation bottom layer by screws, which not only makes the contact between the components and the heat dissipation bottom layer closer, reduces the air gap between the heat dissipation bottom layer and the components, and improves the heat conduction efficiency, but the screws can also be used as a heat-conducting medium to directly conduct the heat generated by the components to the heat dissipation bottom layer, further improving the heat dissipation efficiency of the components. In addition, the screws are connected to the threaded holes of the heat dissipation bottom layer by passing through the printed circuit board through holes and component through holes from one side in sequence, so that a stable fixed connection structure is formed between the printed circuit board, the components and the heat dissipation bottom layer, avoiding relative sliding between the printed circuit board and the heat dissipation bottom layer due to unstable fixation, thereby damaging the components. The cover plate is connected and fixed to the heat dissipation shell, so that the printed circuit board is sealed in the heat dissipation shell, which can not only protect the printed circuit board and components, but the heat dissipation shell can also serve as a heat-conducting structure to conduct the heat received by the heat dissipation bottom layer into the air, thereby increasing the contact area between the heat-conducting structure and the air and improving the heat conduction efficiency.

[0026] Taking into account that the distance between the screw head and the first through hole on the printed circuit board in the above-mentioned heat dissipation structure is relatively close, resulting in the screw as a metal device being too close to the upper surface and the lower surface of the printed circuit board, which may cause the problem of poor voltage resistance of the printed circuit board, an insulating sleeve is designed to be inserted into the first through hole, so that the screw passes through the insulating sleeve and the second through hole in sequence from one side. After being connected to the threaded hole, the screw and the printed circuit board are isolated by the insulating sleeve, and a semi-wrapped structure is formed between the insulating sleeve and the head of the screw, so that the insulating sleeve has an insulating effect on the printed circuit board and the screw, thereby preventing the printed circuit board from having poor voltage resistance. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a structural diagram of a heat dissipation structure of a printed circuit board component provided by an embodiment of the present invention;

[0028] Figure 2 It is a schematic diagram of a component structure provided by an embodiment of the present invention;

[0029] Figure 3 is a three-dimensional diagram of an insulating sleeve design provided by an embodiment of the present invention;

[0030] Figure 4 is a top view of an insulating sleeve design provided by an embodiment of the present invention;

[0031] Figure 5 is a side cross-sectional view of an insulating sleeve design provided by an embodiment of the present invention;

[0032] Figure 6 is a structural diagram of a component heat dissipation module provided by an embodiment of the present invention;

[0033] Figure 7 is a structural diagram of another component heat dissipation module provided by an embodiment of the present invention;

[0034] Among them: 1. Printed circuit board; 2. Components; 3. Heat dissipation base; 31. Boss; 32. Thermal insulation pad; 4. Screws; 5. Insulation sleeve; 6. Heat dissipation shell; 7. Cover plate; 8. Inductor. DETAILED DESCRIPTION

[0035] The present invention will be described in detail below with reference to the accompanying drawings and in combination with embodiments. It should be noted that the embodiments and features in the embodiments of the present invention can be combined with each other without conflict.

[0036] The following detailed descriptions are all exemplary descriptions, and are intended to provide further detailed descriptions of the present invention. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by technicians in the technical field of the present application; the terms used in the specification of the application herein are only for the purpose of describing specific embodiments, and are not intended to limit the present application; the terms "including" and "having" in the specification and claims of the present application and the above-mentioned drawings and any variations thereof are intended to cover non-exclusive inclusions. The terms "first", "second", etc. in the specification and claims of the present application or the above-mentioned drawings are used to distinguish different objects, not to describe a specific order.

[0037] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0038] Before describing the present application in detail with reference to the accompanying drawings and in combination with the embodiments, the terms and application scenarios involved in the present application are first described.

[0039] An embodiment of the present invention provides a printed circuit board component heat dissipation structure, comprising a printed circuit board 1, a component 2, a heat dissipation bottom layer 3 and a screw 4, wherein: the printed circuit board 1 has a first through hole; the component 2 is welded on the printed circuit board 1; the heat dissipation bottom layer 3 has a threaded hole; the screw 4 passes through the first through hole from one side and is sleeved and fixed with the threaded hole, thereby making the component 2 contact with the heat dissipation bottom layer 3.

[0040] In the above-mentioned printed circuit board component heat dissipation structure, the heat dissipation layer is arranged at the bottom, and the printed circuit board 1 is inverted, so that the components 2 soldered on the surface of the printed circuit board 1 can directly contact the heat dissipation bottom layer 3 without being squeezed by the weight of the heat dissipation bottom layer 3, thereby avoiding the components 2 from being damaged by force, and making it unnecessary for the heat of the components 2 to be transferred to the heat dissipation bottom layer 3 through the printed circuit board 1, thereby improving the heat dissipation efficiency of the components 2. In addition, the screws 4 support the printed circuit board 1 as a supporting structure to prevent the printed circuit board 1 from causing mechanical squeezing of the components 2.

[0041] See also Figure 1 and Figure 2 In a possible embodiment, the component 2 has a second through hole, wherein: the screw 4 passes through the first through hole and the second through hole in sequence from one side, and is connected and fixed to the threaded hole, thereby connecting and fixing the component 2 to the heat dissipation bottom layer 3.

[0042] In this embodiment, a component 2 with a mounting through hole is used, and the component 2 is connected and fixed to the heat dissipation bottom layer 3 by means of screws 4, which not only makes the contact between the component 2 and the heat dissipation bottom layer 3 closer, reduces the air gap between the heat dissipation bottom layer 3 and the component 2, and improves the heat conduction efficiency, but the screw 4 can also directly conduct the heat generated by the component 2 to the heat dissipation bottom layer 3 as a heat conducting medium, further improving the heat dissipation efficiency of the component 2. In addition, the screw 4 is connected and fixed to the threaded hole of the heat dissipation bottom layer 3 after passing through the through hole of the printed circuit board 1 and the through hole of the component 2 from one side in sequence, so that a stable fixed connection structure is formed between the printed circuit board 1, the component 2 and the heat dissipation bottom layer 3, and avoids relative sliding between the printed circuit board 1 and the heat dissipation bottom layer 3 due to unstable fixation, which may damage the component 2.

[0043] Furthermore, screws 4 are connected and fixed with threaded holes as a connection method for connecting the printed circuit board 1, the components 2 and the heat dissipation bottom layer 3. When installing, it is only necessary to pass the screws 4 through the first through hole and the second through hole from one side in sequence and then screw them into the threaded holes. When removing, it is only necessary to screw the screws 4 out of the threaded holes and then withdraw them from the second through hole and the first through hole in sequence, making the installation and removal of the components 2 more convenient. In addition, as a metal connector, the screws can take into account the connection and fixation of the components 2 and the heat dissipation bottom layer 3 and directly conduct the heat generated by the components 2 to the heat dissipation bottom layer 3 as a heat conducting medium, thereby improving the heat dissipation efficiency of the circuit board components.

[0044] In a possible embodiment, the component 2 is a MOS tube or a diode.

[0045] In a possible embodiment, the heat dissipation bottom layer 3 has a boss, wherein: the threaded hole is located in the boss, and the heat dissipation bottom layer 3 is in contact with the component 2 through the boss.

[0046] In this embodiment, the heat dissipation bottom layer 3 contacts the components 2 through the boss structure, and bosses of corresponding heights can be made according to the thickness of different components 2, so that the heat dissipation bottom layer 3 is adapted to the height of the components 2, thereby closely contacting the components 2 and improving the heat conduction efficiency. In addition, when components 2 of different thicknesses are soldered on the printed circuit board 1 and need to be dissipated in the above manner, multiple bosses of different heights can be made on the heat dissipation bottom layer 3, so that the heat dissipation bottom layer 3 can be in close contact with multiple components 2 of different thicknesses, thereby improving the heat conduction efficiency.

[0047] See also Figure 1 In a possible embodiment, the printed circuit board component heat dissipation structure also includes an insulating sleeve 5, wherein: the insulating sleeve 5 is inserted into the first through hole, and the screw 4 passes through the insulating sleeve and the second through hole in sequence from one side and is connected to the threaded hole.

[0048] In this embodiment, considering that the head of the screw 4 in the above-mentioned heat dissipation structure is close to the first through hole on the printed circuit board 1, the screw 4 as a metal device is too close to the upper surface and the lower surface of the printed circuit board 1, which may cause the problem of poor withstand voltage of the printed circuit board 1. Therefore, the insulating sleeve 5 is designed to be inserted into the first through hole, so that the screw 4 passes through the insulating sleeve and the second through hole in sequence from one side. After being connected with the threaded hole, the screw 4 and the printed circuit board 1 are isolated by the insulating sleeve 5, so that the insulating sleeve 5 has an insulating effect on the printed circuit board 1 and the screw 4, thereby preventing the printed circuit board 1 from having poor withstand voltage.

[0049] In a possible embodiment, after the screw 4 passes through the insulating sleeve and the second through hole in sequence from one side and is connected to the threaded hole, a semi-wrapped structure is formed between the insulating sleeve 5 and the head of the screw 4 .

[0050] In this embodiment, the size of the insulating sleeve 5 is designed so that a semi-wrapped structure is formed between the insulating sleeve 5 and the head of the screw 4 , thereby further enhancing the insulating effect of the insulating sleeve 5 on the printed circuit board 1 and the screw 4 .

[0051] See also Figure 3 , Figure 3 It is a three-dimensional diagram of the design of an insulating sleeve 5.

[0052] For further information, see Figure 4 , Figure 4 It is a top view of the design of the insulating sleeve 5. In this embodiment, the outer diameter of the first through hole of the printed circuit board 1 is 8 mm. Since the insulating sleeve 5 needs to be inserted into the first through hole, the outer diameter design value of the insulating sleeve 5 is calculated to be Φ7.5 mm according to the outer diameter of the first through hole of the printed circuit board 1. The outer diameter of the screw 4 is 3 mm. Since the screw 4 needs to pass through the insulating sleeve 5, the inner diameter design value of the through hole of the insulating sleeve can be calculated to be Φ3.1 mm according to the outer diameter of the screw 4.

[0053] For further information, see Figure 5 , Figure 5It is a side view of the design of the insulating sleeve 5. In this embodiment, the combination screw 4 also needs a corresponding screw gasket, and the outer diameter of the screw gasket is 6mm. Since the screw gasket should also be wrapped by the insulating sleeve 5, the inner diameter design value of the insulating sleeve 5 is calculated to be Φ6.5mm according to the outer diameter of the screw gasket. The height of the screw head plus the height of the screw gasket is 4.0mm; since the insulating sleeve 5 needs to form a semi-wrapped structure with the head of the screw 4, the inner height design value of the insulating sleeve 5 is calculated to be 5.5mm according to the height of the screw head plus the height of the screw gasket. Since the insulating sleeve 5 needs to have a certain thickness to produce an insulating effect between the printed circuit board 1 and the screw 4 to prevent the printed circuit board 1 from having poor withstand voltage, the outer height design value of the insulating sleeve 5 is calculated to be 6mm.

[0054] In a possible embodiment, the insulating sleeve 5 is made of LCP material. The dielectric strength of LCP material is higher than that of conventional plastics, and its arc resistance is good. When the continuous use temperature of LCP material reaches 200°C to 300°C, its insulation performance is still not affected; when the intermittent use temperature of LCP material reaches 316°C, its insulation performance is also not affected. In addition, the flame retardant grade of LCP material is UL94V-0, which can effectively prevent the printed circuit board 1 or components 2 from heating and burning due to excessive working temperature.

[0055] See also Figure 6 An embodiment of the present invention provides a component heat dissipation module, comprising a printed circuit board 1, a component 2, a heat dissipation bottom layer 3, a heat dissipation shell 6 and a screw 4, wherein: the printed circuit board 1 is installed in the heat dissipation shell 6, and the printed circuit board 1 has a first through hole; the component 2 is welded on the printed circuit board 1, and the component 2 has a second through hole; the heat dissipation bottom layer 3 has a threaded hole; the screw 4 passes through the first through hole and the second through hole in sequence from one side, and is connected to the threaded hole, thereby connecting and fixing the component 2 to the heat dissipation bottom layer 3; the heat dissipation bottom layer 3 is fixed to the shell bottom of the heat dissipation shell 6.

[0056] The above-mentioned component heat dissipation module sets the heat dissipation layer at the bottom of the heat dissipation shell 6, and inverts the printed circuit board 1, so that the components 2 soldered on the surface of the printed circuit board can directly contact the heat dissipation bottom layer 3 without being squeezed by the weight of the heat dissipation bottom layer 3, avoiding damage to the components 2, and making it unnecessary for the heat of the components 2 to be transferred to the heat dissipation bottom layer through the printed circuit board 1, thereby improving the heat dissipation efficiency of the components 2. Using components 2 with mounting through holes, the components 2 are connected and fixed to the heat dissipation bottom layer 3 by screws 4, which not only makes the contact between the components 2 and the heat dissipation bottom layer 3 closer, reduces the air gap between the heat dissipation bottom layer 3 and the components 2, and improves the heat conduction efficiency, but the screws 4 can also act as a heat conducting medium to directly conduct the heat generated by the components 2 to the heat dissipation bottom layer 3, further improving the heat dissipation efficiency of the components 2. In addition, the screw 4 passes through the through hole of the printed circuit board 1 and the through hole of the component from one side in sequence and is connected to the threaded hole of the heat dissipation bottom layer 3, so that a stable fixed connection structure is formed between the printed circuit board 1, the component 2 and the heat dissipation bottom layer 3, thereby avoiding relative sliding between the printed circuit board 1 and the heat dissipation bottom layer 3 due to unstable fixation, which may cause damage to the component 2.

[0057] In a possible embodiment, the printed circuit board 1 has a plurality of third through holes in addition to the first through holes, which are used to be fixed to the heat dissipation housing 6 by screws, so that the printed circuit board 1 is installed in the heat dissipation housing 6 .

[0058] See also Figure 6 In a possible embodiment, the heat dissipation bottom layer 3 has a boss 31 , wherein: the threaded hole is located in the boss 31 , and the heat dissipation bottom layer 3 contacts the component 2 through the boss 31 .

[0059] In this embodiment, the heat dissipation bottom layer 3 contacts the components 2 through the bosses 31. The bosses 31 of corresponding heights can be made according to the thicknesses of different components 2, so that the heat dissipation bottom layer 3 is adapted to the height of the components 2, thereby closely contacting the components 2 and improving the heat conduction efficiency. Since the heat dissipation housing 6 is a relatively regular rectangular structure, the above implementation method avoids the heat dissipation bottom layer 3 being restricted by the thickness and shape of the shell bottom when it is fixed to the shell bottom of the heat dissipation housing 6 and cannot be in close contact with the components 2, thereby reducing the air gap between the heat dissipation bottom layer 3 and the components 2. In addition, when components 2 of different thicknesses are welded on the printed circuit board 1 and need to be cooled in the above manner, multiple bosses 31 of different heights can be made on the heat dissipation bottom layer 3, so that the heat dissipation bottom layer 3 can be in close contact with multiple components 2 of different thicknesses, thereby improving the heat conduction efficiency.

[0060] See also Figure 6In a possible embodiment, the surface of the boss 31 also has a thermally conductive insulating pad 32. The component 2 conducts heat to the metal boss 31 and the heat dissipation bottom layer 3 through the thermally conductive insulating pad 32. On the basis of ensuring the heat dissipation efficiency of the original structure, it prevents the component 2 from causing safety problems such as short circuit or leakage due to too close contact with the metal boss 31, thereby enhancing the protection of the component 2 by this embodiment; and the thermally conductive insulating pad 32 also has a certain shock-absorbing and buffering effect on the component 2, preventing the component 2 from being damaged due to physical collision during use.

[0061] See also Figure 6 In a possible embodiment, the component heat dissipation module also includes an insulating sleeve 5, wherein: the insulating sleeve 5 is inserted into the first through hole, and the screw 4 passes through the insulating sleeve 5 and the second through hole in sequence from one side and is connected to the threaded hole.

[0062] In this embodiment, the printed circuit board 1 is required to meet the requirement of withstand voltage of AC3000V. After testing, it is found that the head of the screw 4 in the above-mentioned heat dissipation structure is close to the first through hole on the printed circuit board 1, resulting in the screw 4 as a metal device being too close to the upper surface and the lower surface of the printed circuit board 1, so that the printed circuit board 1 cannot meet the requirement of withstand voltage of AC3000V. Therefore, the insulating sleeve 5 is designed to be inserted into the first through hole, so that the screw 4 passes through the insulating sleeve 5 and the second through hole in sequence from one side. After being connected with the threaded hole, the screw 4 and the printed circuit board 1 are isolated by the insulating sleeve 5, and then the insulating sleeve 5 has an insulating effect on the printed circuit board 1 and the screw 4, so that the printed circuit board 1 meets the requirement of withstand voltage of AC3000V.

[0063] In a possible embodiment, the insulating sleeve 5 is a bowl-shaped insulating sleeve.

[0064] In a possible embodiment, after the screw 4 passes through the insulating sleeve 5 and the second through hole in sequence from one side and is connected to the threaded hole, a semi-wrapped structure is formed between the insulating sleeve 5 and the head of the screw 4 .

[0065] In this embodiment, the size of the insulating sleeve 5 is designed so that a semi-wrapped structure is formed between the insulating sleeve 5 and the head of the screw 4 , thereby further enhancing the insulating effect of the insulating sleeve 5 on the printed circuit board 1 and the screw 4 .

[0066] See also Figure 7 In a possible embodiment, the component heat dissipation module further includes a cover plate 7 , and the cover plate 7 is connected and fixed to the heat dissipation housing 6 , so as to seal the printed circuit board 1 in the heat dissipation housing 6 .

[0067] In this embodiment, the cover plate 7 is connected and fixed to the heat dissipation shell 6, so that the printed circuit board 1 is sealed in the heat dissipation shell 6, which can not only protect the printed circuit board 1 and the components 2, but the heat dissipation shell 6 can also serve as a heat-conducting structure to conduct the heat received by the heat dissipation bottom layer 3 to the air, increase the contact area between the heat-conducting structure and the air, and improve the heat conduction efficiency.

[0068] In a possible embodiment, the heat dissipation bottom layer is made of aluminum, and the heat dissipation housing is an aluminum shell. The cover plate 7 has a plurality of through holes, and the heat dissipation housing 6 has threaded holes corresponding to the positions of the through holes on the cover plate 7. The cover plate 7 and the heat dissipation housing 6 are fixed with screws, specifically: the screws pass through the through holes of the cover plate 7 from one side and are connected to the threaded holes corresponding to the positions on the heat dissipation housing, so that the cover plate 7 and the heat dissipation housing 6 are connected and fixed.

[0069] See also Figure 7 In a possible embodiment, the component heat dissipation module further includes an inductor 8, which is fixed in the heat dissipation housing 6 by filling with thermal conductive glue. In this embodiment, the inductor 8 is a part of the circuit structure on the printed circuit board 1, but the inductor 8 is too large to be installed on the printed circuit board 1, so the inductor 8 needs to be fixed in the heat dissipation housing 6. At this time, the heat dissipation housing 6 in this embodiment also has the function of providing additional installation space for placing circuit components that are too large.

[0070] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope recorded in this specification.

[0071] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the present application. It should be noted that, for a person of ordinary skill in the art, several improvements and substitutions may be made without departing from the concept of the present application, and these improvements and substitutions shall also be regarded as the protection scope of the present invention. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. A printed circuit board component heat dissipation structure, characterized in that: Including printed circuit boards, components, heat sinks and fasteners, including: The printed circuit board has a first through hole; The components are welded on the printed circuit board; The heat dissipation bottom layer has blind holes; The fastener passes through the first through hole from one side and is sleeved and fixed with the blind hole, thereby making the component contact with the heat dissipation bottom layer.

2. A printed circuit board component heat dissipation structure according to claim 1, characterized in that: The component has a second through hole, wherein: The fastener passes through the first through hole and the second through hole in sequence from one side, and is then sleeved and fixed with the blind hole, thereby connecting and fixing the component to the heat dissipation bottom layer.

3. A printed circuit board component heat dissipation structure according to claim 2, characterized in that: The heat dissipation bottom layer has a boss, wherein: The blind hole is located in the boss, and the heat dissipation bottom layer is in contact with the component through the boss.

4. A printed circuit board component heat dissipation structure according to claim 2, characterized in that: The fastener is a screw, and the blind hole is a threaded hole; the screw passes through the first through hole and the second through hole in sequence from one side and is connected to the threaded hole, thereby connecting and fixing the component to the heat dissipation bottom layer.

5. A printed circuit board component heat dissipation structure according to claim 4, characterized in that: Also included is an insulating sleeve, wherein: The insulating sleeve is inserted into the first through hole, and the screw passes through the insulating sleeve and the second through hole in sequence from one side and is connected with the threaded hole.

6. A printed circuit board component heat dissipation structure according to claim 5, characterized in that: After the screw passes through the insulating sleeve and the second through hole in sequence from one side and is connected to the threaded hole, a semi-wrapped structure is formed between the insulating sleeve and the head of the screw.

7. A component heat dissipation module, characterized in that: It includes printed circuit boards, components, heat dissipation bottom layer, heat dissipation housing, screws and cover plates, including: The printed circuit board is installed in the heat dissipation housing, and the printed circuit board has a first through hole; The component is soldered on the printed circuit board, and the component has a second through hole; The heat dissipation bottom layer has threaded holes; The screw passes through the first through hole and the second through hole in sequence from one side and is connected to the threaded hole, thereby connecting and fixing the component to the heat dissipation bottom layer; The heat dissipation bottom layer is fixed to the shell bottom of the heat dissipation shell; The cover plate is connected and fixed to the heat dissipation housing, so that the printed circuit board is sealed in the heat dissipation housing.

8. The component heat dissipation module according to claim 7, characterized in that: The heat dissipation bottom layer has a boss, wherein: The threaded hole is located in the boss, and the heat dissipation bottom layer is in contact with the component through the boss.

9. The component heat dissipation module according to claim 7, characterized in that: Also included is an insulating sleeve, wherein: The insulating sleeve is inserted into the first through hole, and the screw passes through the insulating sleeve and the second through hole in sequence from one side and is connected with the threaded hole.

10. The component heat dissipation module according to claim 9, characterized in that: After the screw passes through the insulating sleeve and the second through hole in sequence from one side and is connected to the threaded hole, a semi-wrapped structure is formed between the insulating sleeve and the head of the screw.

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