An integrated photoelectric coupler

Abstract

The present invention discloses an integrally formed photoelectric coupler, which relates to the technical field of photoelectric couplers, and includes: a package bottom shell and a package top cover, wherein the package bottom shell and the package top cover are connected via a docking assembly, a temperature control assembly is installed on the package top cover, a photoelectric coupler body is installed in the package bottom shell, and a plurality of groups of pins extend into the package bottom shell to be connected with the photoelectric coupler body. By arranging a docking assembly between the package bottom shell and the package top cover, the two can be firmly connected, ensuring the overall stability of the package structure, and avoiding loosening or displacement caused by external factors. A heat dissipation window is arranged on the package bottom shell, which effectively helps to dissipate the heat generated inside, and prevents the normal operation of the photoelectric coupler body from being affected by excessive temperature. At the same time, the use of an integrally formed package bottom shell and package top cover further improves the sealing and durability of the package, simplifies the assembly process, and reduces the manufacturing cost.

Description

Technical Field

[0001] The present invention relates to the technical field of photoelectric couplers, and in particular to an integrally formed photoelectric coupler. Background Art

[0002] With the development and increasing application of optoelectronic technology, optocouplers, as key components for photoelectric signal conversion, play an important role in various optical communications and optoelectronic devices.

[0003] Existing patent: CN202222323594.2-A photoelectric coupler package with heat dissipation function includes a package shell, a heat-conducting frame, a heat-conducting plate and a heat sink, etc. The heat-conducting frames are symmetrically installed on both sides of the symmetrical package shell, and the top of the package shell is connected to a heat-conducting plate adapted to accelerate the conduction of heat generated by the photoelectric coupler inside the package shell, and the heat-conducting plate is connected to the heat sink. The heat of the package shell is conducted to the heat sink through the heat-conducting frame and the heat-conducting plate for heat dissipation, and the cooling fan accelerates the air circulation at the heat sink, improves the heat dissipation efficiency of the heat sink, realizes the efficient heat dissipation function of the package shell, and ensures the stability of the working performance of the photoelectric coupler.

[0004] In the above patent, the heat dissipation of the optocoupler is carried out by a single heat sink plus a cooling fan, which is not only inefficient but also the heat sink and the cooling fan are directly erected on the top of the packaging shell, which increases the installation space required for the optocoupler and cannot be adapted to a small space. In addition, the packaging shell cannot be disassembled, which makes it inconvenient to repair the optocoupler after it is damaged, or it can only be replaced as a whole.

[0005] Therefore, the present invention provides an integrated optocoupler to solve one or more of the above problems. Summary of the invention

[0006] 1. Technical issues to be resolved

[0007] In view of the deficiencies of the prior art, the present invention provides an integrated optocoupler to solve the problems raised in the above background technology.

[0008] (II) Technical solution

[0009] To achieve the above objectives, the present invention is implemented through the following technical solutions, including: a package bottom shell and a package top cover, the package bottom shell and the package top cover are connected by a docking component, a temperature control component is installed on the package top cover, an optocoupler body is installed in the package bottom shell, and several groups of pins extend into the package bottom shell to be connected to the optocoupler body.

[0010] Preferably, a heat dissipation window is provided on the outer wall of the packaging bottom shell.

[0011] Preferably, the package bottom shell and the package top cover are formed by integral molding and pressing.

[0012] Preferably, the number of docking components is several groups, and they are evenly arranged on the top frame of the packaging bottom shell.

[0013] Preferably, the docking assembly includes: a U-shaped bottom buckle and a connector, the U-shaped bottom buckle is fixed on the top frame of the packaging bottom shell, the connector is embedded in the packaging top cover shell, the top of the U-shaped bottom buckle extends upward to form a Yuanbao head, and the elastic connecting part is installed on the Yuanbao head at the top of the U-shaped bottom buckle.

[0014] Preferably, both ends of the elastic connector are I-shaped structures, and the I-shaped end extends upward to form a bending clamping head and extends downward to form a hooking head, and the hooking head matches the ingot head.

[0015] Preferably, the connector extends downward to form a first locking plug and a second locking plug, and a U-shaped slot is left between the first locking plug and the second locking plug, and the bottom of the second locking plug extends upward to form a locking protrusion.

[0016] Preferably, the horizontal section of the L-shaped rod is fixedly connected to the top frame of the packaging bottom shell, and the end of the vertical section of the L-shaped rod extends to form an arc-shaped protrusion, and a ball is movably arranged in the arc-shaped protrusion.

[0017] Preferably, the temperature control component includes: a circulating heat-conducting disk, the circulating heat-conducting disk is inserted into the top of the packaging top cover, a plurality of groups of heat sinks are installed on the top of the circulating heat-conducting disk, and the plurality of groups of heat sinks arranged radially are connected by levers, a coolant column is installed at the top center of the circulating heat-conducting disk through a support rod, a coolant guide pipe is spirally installed in the circulating heat-conducting disk, and the coolant column is connected to the coolant guide pipe in the circulating heat-conducting disk.

[0018] Preferably, a telescopic rod structure for control is installed on the heat sink close to the coolant column, the fixed end of the telescopic rod structure is movably connected to the circulating heat transfer disk, the other end of the telescopic rod structure is movably connected to the heat sink, an air bag for pushing is arranged in the telescopic rod structure, the heat sink has a hollow structure, and two groups of guide joints are provided on the heat sink, the heat sink is connected to the coolant guide pipe through the two groups of guide joints, a rotating head is provided between the two groups of guide joints, and the heat sink is movably connected to the circulating heat transfer disk through the rotating head.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] 1. Connection stability: By designing multiple sets of docking components between the package bottom shell and the package top cover, the connection between the two is more stable, avoiding loosening and sliding, and ensuring the structural stability of the optocoupler during operation. This design can effectively reduce the loose connection caused by external force and improve the reliability and durability of the product.

[0021] 2. Excellent heat dissipation effect: The present invention sets a heat dissipation window on the bottom shell of the package and integrates a temperature control component in the top cover of the package. The temperature control component includes a circulating heat conduction plate and a coolant diversion system, which automatically adjusts the opening and closing angles of the heat sink to achieve automatic adjustment of the heat dissipation efficiency. When the temperature inside the package is too high, the heat sink will automatically expand to increase the contact area with the air, thereby quickly dissipating the heat. This heat dissipation mechanism ensures the efficient operation of the optocoupler while avoiding equipment damage caused by overheating.

[0022] 3. Easy to assemble and maintain: The present invention reserves notches when the bottom shell of the package is formed, which facilitates the installation and fixation of the heat dissipation window, pins and temperature control components, thereby improving assembly efficiency and reducing manufacturing costs. In addition, the elastic connector in the docking assembly can be removed and replaced. During maintenance, it is only necessary to push the old elastic connector away from the ingot head and replace it with a new one, which is convenient and quick, greatly reducing the difficulty and cost of maintenance.

[0023] 4. High elastic locking design: Elastic connectors, snap-fit ​​protrusions, ball bearings and other structures are used in the docking assembly to enable the package top cover to be firmly buckled on the package bottom shell, and prevent slipping through multiple locking structures (including clamping force, friction force, snap-fit ​​force, etc.). Compared with the traditional fixed connection method, this design significantly improves the firmness and safety of the package, and is convenient for disassembly using tools without affecting stability, and has good operational flexibility. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0025] Figure 2 This is a schematic diagram of the installation position of the docking assembly in the present invention;

[0026] Figure 3 It is an exploded schematic diagram of the package bottom shell and the package top cover in the present invention;

[0027] Figure 4 It is a schematic diagram of the structure of the docking assembly in the present invention;

[0028] Figure 5 It is a schematic diagram of the top view structure of the temperature control component in the present invention;

[0029] Figure 6 Schematic diagram of the three-dimensional structure of the temperature control component in the present invention Figure 1 ;

[0030] Figure 7 Schematic diagram of the three-dimensional structure of the temperature control component in the present invention Figure 2 ;

[0031] Figure 8 It is a schematic diagram of the three-dimensional structure of the heat sink in the present invention.

[0032] In the figure: 1. Package bottom shell; 2. Package top cover; 3. Heat dissipation window; 4. Pin; 5. Temperature control component; 6. Docking component; 7. U-shaped bottom buckle; 8. Connector; 9. Yuanbao head; 10. Elastic connector; 11. Bending clamp; 12. Hook head; 13. L-shaped plug; 14. Arc-shaped protrusion; 15. First locking plug; 16. Second locking plug; 17. Ball; 18. Clamping protrusion; 19. Circulating heat conduction plate; 20. Telescopic rod structure; 21. Push rod; 22. Coolant column; 23. Heat sink; 24. Coolant guide tube; 25. Support rod; 26. Rotating head; 27. Guide joint. DETAILED DESCRIPTION

[0033] In the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes, and do not specifically refer to the order or sequence, nor are they used to limit the present invention. They are only used to distinguish the protective components or operations described with the same technical terms, and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions and technical features between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0034] Example 1

[0035] See also Figure 1 A technical means provided by the present invention includes: a package bottom shell 1 and a package top cover 2, the package bottom shell 1 and the package top cover 2 are connected by a docking component 6, a temperature control component 5 is installed on the package top cover 2, a photoelectric coupler body is installed in the package bottom shell 1, and a plurality of groups of pins 4 extend into the package bottom shell 1 to be connected to the photoelectric coupler body.

[0036] Preferably, a heat dissipation window 3 is provided on the outer wall of the packaging bottom shell 1 .

[0037] Preferably, the package bottom shell 1 and the package top cover 2 are formed by integral molding and pressing.

[0038] Preferably, the package bottom shell 1 is provided with notches for installing the heat dissipation window 3 , the pins 4 and the temperature control component 5 during molding.

[0039] Preferably, the docking components 6 are in several groups and are evenly arranged on the top frame of the packaging bottom shell 1 .

[0040] The beneficial effects of the above scheme are as follows: by providing a docking assembly between the package bottom shell and the package top cover, the two can be firmly connected, ensuring the overall stability of the package structure and avoiding loosening or displacement caused by external factors. A heat dissipation window is provided on the package bottom shell to effectively help dissipate the heat generated inside and prevent the normal operation of the optocoupler body from being affected by excessive temperature. At the same time, the use of an integrally formed package bottom shell and package top cover further improves the sealing and durability of the package, simplifies the assembly process, and reduces the manufacturing cost. In addition, by reserving installation notches during molding, components such as heat dissipation windows, pins, and temperature control components can be easily installed and fixed, further improving the ease of assembly of the components and the overall performance of the product.

[0041] Example 2

[0042] Based on Example 1, please refer to Figure 2-Figure 4 The docking assembly 6 includes: a U-shaped bottom buckle 7 and a connector 8. The U-shaped bottom buckle 7 is fixed on the top frame of the packaging bottom shell 1. The connector 8 is embedded in the packaging top cover 2 shell. The top of the U-shaped bottom buckle 7 extends upward to form a Yuanbao head 9. The elastic connecting part 10 is installed on the Yuanbao head 9 at the top of the U-shaped bottom buckle 7.

[0043] Preferably, both ends of the elastic connector 10 are I-shaped structures, and the I-shaped end extends upward to form a bending clamp 11 and extends downward to form a hooking head 12, and the hooking head 12 matches the ingot head 9.

[0044] Preferably, the connector 8 extends downward to form a first locking plug 15 and a second locking plug 16 , and a U-shaped slot is left between the first locking plug 15 and the second locking plug 16 . The bottom of the second locking plug 16 extends upward to form a locking protrusion 18 .

[0045] Preferably, the horizontal section of the L-shaped rod 13 is fixedly connected to the top frame of the packaging bottom shell 1 , and the end of the vertical section of the L-shaped rod 13 extends to form an arc-shaped protrusion 14 , and a ball 17 is movably arranged in the arc-shaped protrusion 14 .

[0046] Preferably, the first locking plug 15 and the second locking plug 16 are made of a material with high elasticity.

[0047] The working principle and beneficial effects of the above scheme are as follows: after the packaging top cover 2 with the plug-in component 8 is buckled on the top of the packaging bottom shell 1 and aligned with the U-shaped bottom buckle 7, the packaging top cover 2 is pressed down so that the vertical sections of the U-shaped bottom buckle 7 and the L-shaped plug rod 13 enter the U-shaped slot formed between the first locking plug 15 and the second locking plug 16. Due to the presence of the ball 17, the smoothness of the plug-in component 8 when moving downward can be improved, and when the plug-in component 8 moves downward, the first locking plug 15 and the second locking plug 16 will be stretched apart, so that when moving to contact with the horizontal sections of the U-shaped bottom buckle 7 and the L-shaped plug rod 13, a clamping force is applied to the vertical sections of the U-shaped bottom buckle 7 and the L-shaped plug rod 13 to prevent them from slipping. At the same time, when the engaging protrusion 18 of the second locking plug 16 just contacts the bending clamp 11 of the elastic connector 10, the shape of the arc surface on the top of the bending clamp 11 will not affect the descending shape of the engaging protrusion 18 The U-shaped bottom buckle 7 and the L-shaped plug 13 are connected to each other, and the first locking plug 15 and the second locking plug 16 are connected to each other, so that the U-shaped bottom buckle 7 and the L-shaped plug 13 are connected to each other, and the first locking plug 15 and the second locking plug 16 are connected to each other, so that the U-shaped bottom buckle 7 and the L-shaped plug 13 are connected to each other, and the U-shaped bottom buckle 7 and the L-shaped plug 13 are connected to each other.

[0048] Among them, the elastic connector 10 plays the role of a locking tongue and can be disassembled and replaced. When disassembling and replacing, the old elastic connector 10 only needs to be pushed out along the front and rear direction of the ingot head 9, and the new elastic connector 10 can be pushed in the opposite direction. In addition, through the cooperation of the ingot head 9 and the hook head 12, the locking protrusion 18 can be prevented from lifting the elastic connector 10 when it is pulled out.

[0049] Example 3

[0050] Based on any one of Examples 1-2, please refer to Figure 5-Figure 8The temperature control component 5 includes: a circulating heat-conducting disk 19, the circulating heat-conducting disk 19 is inserted into the top of the packaging top cover 2, a plurality of groups of heat sinks 23 are installed on the top of the circulating heat-conducting disk 19, and the plurality of groups of heat sinks 23 arranged radially are connected by levers 21, a coolant column 22 is installed at the top center of the circulating heat-conducting disk 19 through a support rod 25, a coolant guide pipe 24 is spirally installed in the circulating heat-conducting disk 19, and the coolant column 22 is connected to the coolant guide pipe 24 in the circulating heat-conducting disk 19.

[0051] Preferably, a telescopic rod structure 20 for control is installed on the heat sink 23 close to the coolant column 22, the fixed end of the telescopic rod structure 20 is movably connected to the circulating heat transfer disk 19, and the other end of the telescopic rod structure 20 is movably connected to the heat sink 23, an air bag for pushing is arranged inside the telescopic rod structure 20, the heat sink 23 has a hollow structure, and two groups of guide joints 27 are provided on the heat sink 23, the heat sink 23 is connected to the coolant guide pipe 24 through the two groups of guide joints 27, a rotating head 26 is provided between the two groups of guide joints 27, and the heat sink 23 is movably connected to the circulating heat transfer disk 19 through the rotating head 26.

[0052] Preferably, the air bag provided in the telescopic rod structure 20 is filled with gas with high thermal conductivity.

[0053] Preferably, the telescopic end of the telescopic rod structure 20 is connected to the airbag.

[0054] The working principle and beneficial effects of the above scheme are as follows: when the heat dissipation window 3 is insufficient to dissipate the heat generated by the photoelectric coupler when it is working in time, the accumulated heat will cause the temperature in the package bottom shell 1 to gradually increase. If the coolant in the coolant column 22 cannot dissipate the heat in time through the coolant guide tube 24, the telescopic rod structure 20 installed on the top of the circulating heat conducting disk 19 will be heated up synchronously, thereby causing the air bag in the telescopic rod structure 20 to expand, thereby pushing the active end of the telescopic rod structure 20 to extend, further pushing the heat sink 23 close to the coolant column 22 to move in a direction away from it, and pushing the radial groups of heat sinks 23 to diffuse outward through the lever 21, thereby increasing the contact area between the groups of heat sinks 23 and the air, and then enabling the groups of heat sinks 23 to quickly take away the heat in the coolant guide tube 24. In the above manner, the temperature control component 5 can control the opening and closing angles of the groups of heat sinks 23 according to different temperatures, thereby enhancing their heat dissipation.

[0055] The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention to be protected. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. An integrated photoelectric coupler, characterized in that: include: A package bottom shell (1) and a package top cover (2), the package bottom shell (1) and the package top cover (2) are connected via a docking assembly (6), a temperature control assembly (5) is installed on the package top cover (2), a photoelectric coupler body is installed in the package bottom shell (1), and a plurality of groups of pins (4) extend into the package bottom shell (1) and are connected to the photoelectric coupler body.

2. The one-piece photoelectric coupler according to claim 1, characterized in that: A heat dissipation window (3) is provided on the outer wall of the packaging bottom shell (1).

3. The one-piece photoelectric coupler according to claim 1, characterized in that: The packaging bottom shell (1) and the packaging top cover (2) are both formed by integral molding and pressing.

4. The one-piece photoelectric coupler according to claim 1, characterized in that: The docking components (6) are in a plurality of groups and are evenly arranged on the top frame of the packaging bottom shell (1).

5. The one-piece photoelectric coupler according to claim 4, characterized in that: The docking assembly (6) comprises: a U-shaped bottom buckle (7) and a plug-in connector (8); the U-shaped bottom buckle (7) is fixedly arranged on the top frame of the packaging bottom shell (1); the plug-in connector (8) is embedded in the housing of the packaging top cover (2); the top of the U-shaped bottom buckle (7) extends upward to form a gold ingot head (9); and the elastic connecting member (10) is installed on the gold ingot head (9) at the top of the U-shaped bottom buckle (7).

6. The one-piece photoelectric coupler according to claim 5, characterized in that: Both ends of the elastic connector (10) are I-shaped structures, and the I-shaped end head extends upward to form a bending clamp head (11) and extends downward to form a hooking head (12), and the hooking head (12) matches the ingot head (9).

7. The one-piece photoelectric coupler according to claim 6, characterized in that: The plug connector (8) extends downward to form a first locking plug (15) and a second locking plug (16), and a U-shaped slot is left between the first locking plug (15) and the second locking plug (16), and the bottom of the second locking plug (16) extends upward to form a locking protrusion (18).

8. The one-piece photoelectric coupler according to claim 7, characterized in that: The horizontal section of the L-shaped plug rod (13) is fixedly connected to the top frame of the packaging bottom shell (1), and the end of the vertical section of the L-shaped plug rod (13) extends to form an arc-shaped protrusion (14), and a ball (17) is movably arranged in the arc-shaped protrusion (14).

9. The one-piece photoelectric coupler according to claim 1, characterized in that: The temperature control component (5) comprises: a circulating heat conducting disc (19), the circulating heat conducting disc (19) is inserted into the top of the packaging top cover (2), a plurality of groups of heat sinks (23) are installed on the top of the circulating heat conducting disc (19), and the plurality of groups of heat sinks (23) arranged radially are connected by levers (21), a coolant column (22) is installed at the top center of the circulating heat conducting disc (19) through a support rod (25), a coolant guide pipe (24) is spirally installed in the circulating heat conducting disc (19), and the coolant column (22) is connected to the coolant guide pipe (24) in the circulating heat conducting disc (19).

10. The one-piece photoelectric coupler according to claim 9, characterized in that: A telescopic rod structure (20) for control is installed on the heat sink (23) near the coolant column (22); the fixed end of the telescopic rod structure (20) is movably connected to the circulating heat conduction disk (19); the other end of the telescopic rod structure (20) is movably connected to the heat sink (23); an air bag for pushing is arranged inside the telescopic rod structure (20); the heat sink (23) is a hollow structure; two groups of flow guide joints (27) are provided on the heat sink (23); the heat sink (23) is connected to the coolant flow guide pipe (24) through the two groups of flow guide joints (27); a rotating head (26) is provided between the two groups of flow guide joints (27); the heat sink (23) is movably connected to the circulating heat conduction disk (19) through the rotating head (26).

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