A solar panel velveting equipment

Abstract

The present invention discloses a solar panel texturing device, including a texturing device body, a texturing mechanism disposed in the texturing device body, a transmission mechanism installed inside the texturing device body, the transmission mechanism being located above the texturing mechanism, a feeding mechanism installed on one side of the texturing device body, the feeding mechanism matching the texturing mechanism, a de-impurity mechanism installed inside the texturing mechanism, the de-impurity mechanism including a collecting component and a cleaning component. Compared with the prior art, the solar panel texturing device of the present invention can replenish solutes as the effective components in the solution gradually decrease during the texturing process of the solar panel, and in the process of replenishing the solutes, the thrust of the newly entered solution can be used to stir the mixed solution, thereby improving the solute mixing efficiency, stabilizing the concentration of the effective components in the solution, making the shape, size and distribution of the velvet structure more uniform, and improving the performance and stability of the battery cell.

Description

Technical Field

[0001] The invention belongs to the technical field of texturing equipment, and in particular relates to a texturing equipment for a solar panel. Background Art

[0002] Solar panel texturing equipment is one of the key equipment in the solar cell preparation process. It is mainly used to form a velvet surface on the surface of solar cells to increase the surface area of ​​the cells and improve the photoelectric conversion efficiency.

[0003] The textured solar panels can reduce light reflection and increase light absorption, thereby improving the photoelectric conversion efficiency. Specifically, the texture is formed by forming a special velvet structure on the surface of the solar panel. This structure has many tiny bumps and depressions, which can scatter the incident light at multiple angles, thereby reducing light reflection and allowing more sunlight to be absorbed and converted into electrical energy. In addition, the velvet structure can also increase the number of reflections and refractions of light inside the solar panel, extend the light path, and thus improve the light absorption efficiency, especially in low light conditions. It can maintain efficient operation.

[0004] However, during the texturing process of solar panels, as the chemical components in the solution react with the silicon wafer, the effective components in the solution gradually decrease and the solution concentration gradually decreases. The reduction in solution concentration may affect the shape, size and distribution of the velvet structure. It may even be impossible to form an ideal pyramid structure, resulting in an increase in the reflectivity of the silicon wafer surface, affecting the photoelectric conversion efficiency of the solar cell. And as the texturing process proceeds, the silicon wafer may produce debris due to cutting, corrosion and other processes. These debris impurities may interfere with the chemical reaction in the texturing process, resulting in uneven velvet structure or abnormal shape. Impurities may also form attachments on the surface of the silicon wafer, affecting the formation and quality of the velvet, reducing the absorption of light inside the silicon wafer, and reducing the photoelectric conversion efficiency of the solar cell.

[0005] Therefore, in view of the above technical problems, it is necessary to provide a solar panel texturing device. Summary of the invention

[0006] The object of the present invention is to provide a solar panel texturing device which can solve the problems raised in the above-mentioned background technology.

[0007] In order to achieve the above object, a technical solution provided by a specific embodiment of the present invention is as follows:

[0008] A solar panel texturing device comprises a texturing device body, a texturing mechanism is arranged in the texturing device body, a transmission mechanism is installed inside the texturing device body, the transmission mechanism is located above the texturing mechanism, a feeding mechanism is installed on one side of the texturing device body, the feeding mechanism matches the texturing mechanism, a debris removal mechanism is installed inside the texturing mechanism, and the debris removal mechanism comprises a collecting component and a cleaning component.

[0009] In one or more embodiments of the present invention, the texturing mechanism includes, in sequence, a first pre-cleaning tank, a rough polishing tank, a texturing tank, a pickling tank, and a second cleaning tank.

[0010] In one or more embodiments of the present invention, the transmission mechanism includes an electric control slide rail and a silicon wafer texturing frame, the electric control slide rail is fixedly connected to the texturing equipment body, a support seat is installed on the electric control slide rail, an electric lifting rod is fixedly connected to the bottom of the support seat, and a first connecting structure matching the silicon wafer texturing frame is installed at one end of the electric lifting rod.

[0011] In one or more embodiments of the present invention, the first connection structure comprises a connection plate, a connection card block is mounted on the connection plate, and a connection card slot matching the connection card block is provided on the silicon wafer texturing frame.

[0012] In one or more embodiments of the present invention, the silicon wafer texturing rack is provided with a plurality of silicon wafer placement slots.

[0013] In one or more embodiments of the present invention, the feeding mechanism includes a raw material storage box, which is located on one side of the main body of the texturing equipment. A water pump is installed on the raw material storage box, one end of the water pump is connected to a rotating connector, one end of the rotating connector is fixedly connected to a discharge pipe, and a plurality of inclined discharge ports are provided on the discharge pipe.

[0014] In one or more embodiments of the present invention, an auxiliary block matching the discharge port is installed at the inner bottom of the texturing mechanism.

[0015] In one or more embodiments of the present invention, the collecting component includes a first filtering grid plate and a second collecting grid plate, the first filtering grid plate is fixedly connected to the transmission mechanism, and a second connecting structure is installed between the first filtering grid plate and the second collecting grid plate.

[0016] In one or more embodiments of the present invention, the second connection structure includes a connection hook, which is fixedly connected to the first filtering grid plate, and the second collecting grid plate is provided with a second collecting grid plate matching the connection hook.

[0017] In one or more embodiments of the present invention, the cleaning component includes two groups of auxiliary material removal blocks, which are matched with connecting hooks, and one group of the auxiliary material removal blocks is equipped with a spring and a telescopic rod at the bottom, and the spring and the telescopic rod are fixedly connected in the second cleaning tank.

[0018] Compared with the prior art, the solar panel texturing equipment of the present invention can replenish the solute as the effective ingredients in the solution gradually decrease during the texturing process of the solar panel, and in the process of replenishing the solute, the thrust of the newly entered solution can be used to stir the mixed solution, thereby improving the solute mixing efficiency, stabilizing the concentration of the effective ingredients in the solution, and making the shape, size and distribution of the velvet structure more uniform, thereby improving the performance and stability of the battery cell. At the same time, since silicon wafers may produce debris due to corrosion and other processes, and dust, particulate matter, etc. in the production environment may also enter the texturing tank and become impurities, the present invention can not only filter impurities at any time, and avoid as much as possible that these debris impurities interfere with the chemical reaction in the texturing process as the texturing process proceeds, resulting in uneven velvet structure or abnormal shape, affecting the formation and quality of the velvet, but also can remove the impurities together after a certain amount of impurities have accumulated, and avoid as much as possible that the impurities accumulate at the grid and affect the filtering effect of the impurities. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1 This is a schematic diagram of the external structure of a solar panel texturing device in the first embodiment of the present invention;

[0021] Figure 2 This is a schematic diagram of the internal structure of a solar panel texturing device in the first embodiment of the present invention;

[0022] Figure 3 It is a schematic diagram of the partial structure of the pre-cleaning tank in the first embodiment of the present invention;

[0023] Figure 4 Schematic diagram of the partial structure of the transmission mechanism and the cleaning mechanism in the first embodiment of the present invention Figure 1 ;

[0024] Figure 5 A partial cross-sectional view of the feeding mechanism in the first embodiment of the present invention Figure 1 ;

[0025] Figure 6Schematic diagram of the partial structure of the transmission mechanism and the cleaning mechanism in the first embodiment of the present invention Figure 2 ;

[0026] Figure 7 The first embodiment of the present invention Figure 6 A is an enlarged structural diagram;

[0027] Figure 8 A partial cross-sectional view of the feeding mechanism in the first embodiment of the present invention Figure 2 ;

[0028] Fig. 9 It is a schematic cross-sectional structural diagram of the cleaning tank in the first embodiment of the present invention.

[0029] Description of main reference numerals:

[0030] 1. Texturing equipment body; 101. First pre-cleaning tank; 102. Rough polishing tank; 103. Texturing tank; 104. Pickling tank; 105. Second cleaning tank; 106. Laser ranging sensor; 201. Electric control slide rail; 202. Support seat; 203. Electric lifting rod; 204. Connecting plate; 205. Connecting block; 206. Silicon wafer texturing rack; 207. Connecting slot; 208. Silicon wafer placement slot; 301. Raw material storage box; 302. Water pump; 303. Rotating connector; 304. Discharge pipe; 305. Discharge port; 306. Auxiliary block; 401. First filtering grid plate; 402. Second collecting grid plate; 403. Connecting hook; 404. Connecting port; 405. Auxiliary unloading block; 406. Spring; 407. Telescopic rod. DETAILED DESCRIPTION

[0031] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0032] like Figures 1 to 9 As shown, a solar panel texturing device in one embodiment of the present invention includes a texturing device body 1, a texturing mechanism is arranged in the texturing device body 1, a transmission mechanism is installed inside the texturing device body 1, the transmission mechanism is located above the texturing mechanism, a feeding mechanism is installed on one side of the texturing device body 1, the feeding mechanism is matched with the texturing mechanism, a debris removal mechanism is installed inside the texturing mechanism, and the debris removal mechanism includes a collecting component and a cleaning component.

[0033] like Figures 1 to 9As shown, the transmission mechanism transports the silicon wafer to be textured into the texture making mechanism for texture making. During the texture making process, the silicon wafer reacts with the solute in the texture making mechanism, resulting in a decrease in the solute concentration in the texture making mechanism. When the solute content is low and gradually affects the texture making effect, the adding mechanism adds the solute with reduced content into the texture making mechanism to ensure the stability of the texture making effect.

[0034] like Figures 1 to 9 As shown, during the texturing process, the impurity removal mechanism collects the impurities through the collecting component, and the cleaning component cleans the impurities outside the texturing equipment, thereby avoiding the influence of impurities on the texturing effect as much as possible and ensuring the purity of the texturing liquid, thereby obtaining a more uniform and ideal velvet surface structure, improving the reliability and service life of solar cells, obtaining better light trapping effects and improving the overall performance of solar cells.

[0035] like Figure 2 As shown, the texturing mechanism includes a first pre-cleaning tank 101, a rough polishing tank 102, a texturing tank 103, a pickling tank 104 and a second cleaning tank 105 in sequence, and an auxiliary unloading block 405 for releasing the restriction of the connecting hook 403 on the second collecting grid plate 402 is installed in the texturing mechanism.

[0036] like Figure 2 As shown, the first pre-cleaning tank 101 is used to remove large dust and impurities in transition, reduce scratches caused by impurities on the silicon wafer during subsequent processing, and improve the surface quality of the silicon wafer to a certain extent. The rough polishing tank 102 uses abrasives or polishing agents to remove the uneven parts of the silicon wafer surface through mechanical action to provide a flat surface for texturing. Reduce the damage or defective products caused by surface defects in the subsequent processing of the silicon wafer, and maximize the yield rate.

[0037] like Figure 2 As shown, the texturing tank 103 is used to form a specific velvet structure on the surface of the silicon wafer, increase the silicon wafer's absorption of sunlight, thereby improving the photoelectric conversion efficiency of the solar cell and improving the performance of the solar cell as much as possible. The pickling tank 104 is used to remove oxides, rust or other pollutants on the metal surface, thereby obtaining a cleaner and smoother surface, improving the adhesion of the texturing layer, and making the texturing layer more firm and durable.

[0038] like Figure 2 As shown, the second cleaning tank 105 is used to clean impurities on the surface of the silicon wafer after texturing. It is possible to avoid corrosion or damage to the workpiece by the residue. The surface of the workpiece after the cleaning tank is cleaner and tidier, which can improve the quality and appearance of the product.

[0039] like Figure 2 to Figure 4As shown, the transmission mechanism includes an electric control slide 201 and a silicon wafer texturing frame 206. The electric control slide 201 is fixedly connected to the texturing equipment body 1. A support seat 202 is installed on the electric control slide 201. An electric lifting rod 203 is fixedly connected to the bottom of the support seat 202. A first connection structure matching the silicon wafer texturing frame 206 is installed at one end of the electric lifting rod 203. The electric control slide 201 transmits the silicon wafer texturing frame 206 to a suitable position through the first connection structure. The electric lifting rod 203 lowers the silicon wafer texturing frame 206 to the height specified by the controller, and texturing is performed on the silicon wafer in the silicon wafer texturing frame 206.

[0040] like Figure 4 As shown, the first connection structure includes a connection plate 204 , on which a connection block 205 is mounted, and a connection slot 207 matching the connection block 205 is provided on a silicon wafer texturing frame 206 .

[0041] like Figure 2 As shown, after the electric lifting rod 203 moves the connecting plate 204 and the connecting block 205 downward to the bottom of the connecting slot 207, the electric control slide rail 201 moves the connecting block 205 backward until the connecting block 205 is located at the leftmost end of the connecting slot 207. At this time, when the transmission mechanism moves the silicon wafer texturing rack 206 upward, the first connecting structure connects the silicon wafer texturing rack 206 with the transmission mechanism, thereby transferring the silicon wafer texturing rack 206 to the appropriate position.

[0042] like Figure 4 As shown, a plurality of silicon wafer placement slots 208 are provided on the silicon wafer texturing frame 206. When the silicon wafers are installed in the silicon wafer placement slots 208, the silicon wafers can be fixed while avoiding the distance between adjacent silicon wafers being too close, which will cause interference between the silicon wafers and uneven texturing, thereby affecting the formation of the pyramid structure.

[0043] like Figure 5 , Figure 8 As shown, the feeding mechanism includes a raw material storage box 301, which is located on one side of the texturing equipment body 1, and a water pump 302 is installed on the raw material storage box 301. One end of the water pump 302 is connected to a rotating connector 303, and one end of the rotating connector 303 is fixedly connected to a discharge pipe 304, and a plurality of inclined discharge ports 305 are provided on the discharge pipe 304.

[0044] like Figure 5 , Figure 8 As shown, the water pump 302 discharges the raw materials in the raw material storage box 301 into the discharge pipe 304 to ensure the stability of the solute content in the texturing mechanism and to avoid the texturing effect being affected by the reduction of the solute content of the texturing liquid.

[0045] like Figure 5 , Figure 8As shown, with the cooperation of the rotating connecting head 303 and the inclined discharge port 305, not only can the raw materials be discharged into the texturing mechanism, but the discharge pipe 304 can also rotate under the impetus of the reaction force, so that the raw material mixing efficiency is higher and the texturing effect is avoided as much as possible due to the unevenness of the raw materials.

[0046] like Figure 5 , Figure 8 As shown, an auxiliary block 306 matching the discharge port 305 is installed at the bottom of the texturing mechanism. When the liquid discharged from the discharge port 305 is pushed toward the auxiliary block 306, the reaction force provided by the auxiliary block 306 makes the discharge pipe 304 rotate at a higher speed, which improves the mixing efficiency of the solute to a certain extent. It is ensured as much as possible that a uniform pyramid structure or other shaped texturing is formed on the surface of the silicon wafer, so that sunlight can be captured more effectively, the reflectivity can be reduced, and the light absorption efficiency of the battery can be finally improved.

[0047] like Figure 6 As shown, the collecting component includes a first filtering grid plate 401 and a second collecting grid plate 402 . The first filtering grid plate 401 is fixedly connected to the transmission mechanism, and a second connecting structure is installed between the first filtering grid plate 401 and the second collecting grid plate 402 .

[0048] like Figure 6 As shown, the first filtering grid plate 401 squeezes the impurities below between the first filtering grid plate 401 and the second collecting grid plate 402 as the transmission mechanism moves downward, avoiding the impurities from adhering to the silicon wafer as much as possible, causing the impurities to form a thin film or protrusion on the surface of the silicon wafer, affecting the light transmittance and reflectivity of the silicon wafer, and reducing the efficiency of the silicon wafer in the photoelectric conversion process.

[0049] like Figure 7 As shown, the second connection structure includes a connection hook 403, which is fixedly connected to the first filtering grid plate 401, and the second collecting grid plate 402 is provided with a second collecting grid plate 402 matching the connection hook 403. When the connection hook 403 and the first filtering grid plate 401 are downward, and the connection hook 403 is engaged in the connection port 404, the connection hook 403 hooks the connection port 404, and the first filtering grid plate 401 and the second collecting grid plate 402 are connected, so that impurities are collected between the first filtering grid plate 401 and the second collecting grid plate 402.

[0050] like Figure 8-Figure 9As shown, the cleaning component includes two groups of auxiliary material blocks 405, the auxiliary material blocks 405 match the connecting hooks 403, and a spring 406 and a telescopic rod 407 are installed at the bottom of one group of auxiliary material blocks 405, and the spring 406 and the telescopic rod 407 are fixedly connected in the second cleaning tank 105. When the transmission mechanism moves the first filtering grid plate 401 and the second collecting grid plate 402 to the auxiliary material blocks 405 to generate a squeezing force with the auxiliary material blocks 405, under the cooperation of the auxiliary material blocks 405, the two groups of connecting hooks 403 move inward to push the connecting hooks 403 until the connecting hooks 403 are separated from the connecting port 404, thereby placing the second collecting grid plate 402 on the auxiliary material blocks 405.

[0051] like Figure 8-Figure 9 As shown, the spring 406 and the telescopic rod 407 are then extended and retracted to drive the second collecting grid plate 402 to shake, thereby shaking off the impurities on the second collecting grid plate 402, and the transmission mechanism moves the first filtering grid plate 401 and the connecting hook 403 toward the second collecting grid plate 402 until the connecting hook 403 and the connecting port 404 are engaged, and the second collecting grid plate 402 is moved into the wool making mechanism again, and the second collecting grid plate 402 can be lowered through the auxiliary unloading block 405.

[0052] During use, the transmission mechanism transports the silicon wafer to be textured placed on the spring 406 to the texture making mechanism for texture making. When the laser distance sensor 106 detects that the thickness of the silicon wafer is sufficient, the transmission mechanism lifts the silicon wafer. When the concentration detection device detects that the solute concentration in the texture making mechanism is insufficient, the feeding mechanism adds solute to the texture making mechanism, so that the raw material solute in the texture making mechanism is sufficient and stable, ensuring that each batch of silicon wafers obtains consistent effects during the texture making process, thereby improving the consistency and reliability of the battery. At the same time, the rotating discharge pipe 304 on the feeding mechanism allows the solute to be mixed more evenly faster, avoiding uneven texture layer caused by uneven solute mixing as much as possible, affecting the texture effect.

[0053] When the transmission mechanism places the first filter grid plate 401 into the texturing equipment along with the silicon wafer texturing rack 206, the first filter grid plate 401 filters the impurities in the solution downward to between the first filter grid plate 401 and the second collection grid plate 402, thereby ensuring the purity of the solution as much as possible and ensuring that the chemical reaction is carried out evenly on the surface of the silicon wafer as much as possible, thereby generating a uniformly distributed velvet structure. The uniform velvet structure helps to reduce light reflection, improve light absorption efficiency, and increase the output power of the battery to a certain extent.

[0054] When there are too many impurities in the wool making mechanism and it is difficult to collect them quickly through filtering by the first filtering grid plate 401, the transmission mechanism presses down the first filtering grid plate 401, and lifts the second collecting grid plate 402 into the second cleaning tank 105 through the cooperation of the connecting hook 403 and the connecting port 404, washes the impurities collected by the second collecting grid plate 402, and then puts the second collecting grid plate 402 back into the wool making mechanism to collect the impurities again.

[0055] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and range of equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0056] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A solar panel texturing device, characterized in that: include: A texturing device body, wherein a texturing mechanism is arranged in the texturing device body; A transmission mechanism, wherein the transmission mechanism is installed inside the texturing device body and is located above the texturing device; A feeding mechanism, which is located on one side of the texturing device body and matches the texturing mechanism; The impurity removal mechanism is located inside the wool making mechanism, and the impurity removal mechanism includes a collecting component and a cleaning component.

2. A solar panel texturing device according to claim 1, characterized in that: The texturing mechanism comprises in sequence a first pre-cleaning tank, a rough polishing tank, a texturing tank, a pickling tank and a second cleaning tank.

3. A solar panel texturing device according to claim 1, characterized in that: The transmission mechanism includes an electric control slide rail and a silicon wafer texturing frame. The electric control slide rail is fixedly connected to the texturing equipment body. A support seat is installed on the electric control slide rail. An electric lifting rod is fixedly connected to the bottom of the support seat. One end of the electric lifting rod is installed with a first connecting structure matching the silicon wafer texturing frame.

4. A solar panel texturing device according to claim 3, characterized in that: The first connection structure comprises a connection plate, a connection card block is installed on the connection plate, and a connection card slot matching the connection card block is provided on the silicon wafer texturing frame.

5. A solar panel texturing device according to claim 3, characterized in that: The silicon wafer texturing frame is provided with a plurality of silicon wafer placing grooves.

6. A solar panel texturing device according to claim 1, characterized in that: The feeding mechanism includes a raw material storage box, which is located on one side of the texturing equipment body. A water pump is installed on the raw material storage box. One end of the water pump is connected to a rotating connector, one end of the rotating connector is fixedly connected to a discharge pipe, and the discharge pipe is provided with multiple groups of inclined discharge ports.

7. A solar panel texturing device according to claim 6, characterized in that: An auxiliary block matching the material outlet is installed at the inner bottom of the texturing mechanism.

8. The solar panel texturing equipment according to claim 1, characterized in that: The collecting component comprises a first filtering grid plate and a second collecting grid plate, wherein the first filtering grid plate is fixedly connected to the transmission mechanism, and a second connecting structure is installed between the first filtering grid plate and the second collecting grid plate.

9. A solar panel texturing device according to claim 8, characterized in that: The second connection structure comprises a connection hook, which is fixedly connected to the first filtering grid plate, and the second collecting grid plate is provided with a second collecting grid plate matching the connection hook.

10. The solar panel texturing equipment according to claim 1, characterized in that: The cleaning component comprises two groups of auxiliary material removal blocks, which are matched with the connecting hooks. A spring and a telescopic rod are installed at the bottom of one group of the auxiliary material removal blocks, and the spring and the telescopic rod are fixedly connected in the second cleaning tank.

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