An LED chip packaging structure device

Abstract

The application discloses a LED chip packaging structure device, and relates to the technical field of semiconductor devices, which comprises a plastic shell, a pin plate fixedly connected to the inner side of the plastic shell, a bolt in threaded fastening connection between the pin plate and the plastic shell, a bottom support shell fixedly connected to the bottom of the plastic shell, a lens fixedly connected to the top of the plastic shell, and a foam plug fixedly connected to the position below the surface of the lens. The LED chip packaging structure device is characterized in that the surface of the lens is provided with a glue injection hole, the glue injection hole is oppositely arranged with the foam plug, a gap is arranged between the shell and the heat sinking mechanism, the bottom support shell blocks the bottom of the gap, silicon glue is injected into the interior of the lens, the silicon glue fills the cavity among the shell, the lens and the heat sinking mechanism, the silicon glue is not easy to pass through the foam plug due to its high viscosity, and gas is discharged through the foam plug, so that the rapid assembly of the LED chip packaging structure is realized.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor devices, in particular to an LED chip packaging structure device. BACKGROUND

[0002] The LED packaging components mainly include substrates (heat dissipation), packaging glue (silicone), packaging lenses (with high refractive index and light transmittance), etc. The cooperation of the packaging glue and the packaging lens not only provides protection for the chip (to prevent the chip from being exposed to air for a long time or being mechanically damaged to fail, so as to improve the stability of the chip), but also achieves good light output efficiency, thereby making the LED have better light emitting efficiency. The LED chip packaging technology usually installs the LED chip on the PCB and uses the packaging glue to seal, so as to protect the LED chip from the external environment. Although this packaging technology works well in many cases, there are still some limitations, one of which is the problem of the divergence angle of the LED chip. The divergence angle of the LED chip determines the light output characteristics. In the related LED chip packaging structure, the divergence angle is small, which limits the application range of the LED. At the present stage, the development increasingly needs wider-angle light scattering to realize more comprehensive lighting, projection or display requirements. Chinese Patent No. CN102255035A discloses a substrate multi-LED chip packaging structure. In this patent, a silicone ball lens is arranged above the upper layer of the plane silicone glue and the LED chip in the existing COB light source. The light rays that are greater than the critical angle and are reflected by the plane silicone glue and air are guided out of the air, thereby improving the light output efficiency of the COB light source.

[0003] The existing LED chip packaging structure device has the problems of low light output efficiency due to the absorption of the light emitted by the adjacent LED chips to each other and the decrease of the refractive index due to the increase of the internal thermal stress of the packaging glue under high temperature for a long time, thereby affecting the light emission. SUMMARY

[0004] The present application provides an LED chip packaging structure device, which solves the problems mentioned in the background.

[0005] To achieve the above purpose, the present application is implemented by the following technical scheme: an LED chip packaging structure device, comprising a plastic shell, the inner side surface of the plastic shell is fixedly connected with a pin plate, the position between the pin plate and the plastic shell is tightly connected with a bolt through threads, the bottom of the plastic shell is fixedly connected with a bottom support shell, the top of the plastic shell is fixedly connected with a lens, the lower position of the surface of the lens is fixedly connected with a foam plug, further comprising:

[0006] The heat sinking mechanism is fixedly installed at the middle position of the inner side of the plastic shell, the top of the heat sinking mechanism is fixedly connected with the chip plate, the heat sinking mechanism is bonded with the heat-conducting glue on the surface of the chip plate, and the heat sinking mechanism is used for taking away the heat on the surface of the chip plate.

[0007] The lead-in mechanism is fixedly installed on the inner side of the heat sinking mechanism, the top of the lead-in mechanism is fixedly connected with the surface of the chip plate, and the lead-in mechanism is used for the joint communication between the plurality of chip plates and the conductive pin plate.

[0008] The heat sinking mechanism includes a lead-in assembly, the lead-in assembly is fixedly installed at the middle position of the inner side of the plastic shell, the top of the lead-in assembly is fixedly connected with the heat exchange block, the top of the heat exchange block is fixedly connected with the support assembly, the surface of the heat exchange block is fixedly connected with the plastic pipe, and the inside of the plastic pipe, the heat exchange block and the support assembly is in communication through gas.

[0009] Preferably, the inside of the heat exchange block is provided with an arc-shaped hole, the lead-in assembly is fixed by pouring silica gel at the middle position of the inner side of the plastic shell, and the top end of the plastic pipe is fixedly connected with the flared cylinder.

[0010] Preferably, the plastic shell includes a shell body, an expansion hole is formed at the upper position of the inner side of the shell body, an annular groove is formed at the top of the shell body, the bottom of the lens is embedded into the annular groove, the shell body is used for the insulation protection of the pin plate and the heat sinking mechanism, the end surface of the pin plate passes through the shell body to the lead-in mechanism, the plurality of chip plates are jointed with the pin plate through the lead-in mechanism and realize the conductive communication, the expansion hole supports the heat sinking mechanism, the pin plate is stably connected with the inner sliding table through the bolt, during installation, the bottom of the lens is embedded into the inside of the annular groove, then, the two half ring plates are abutted with each other and embedded into the lower position of the surface of the lens, then the two half ring plates are fixed so that the lens is quickly positioned.

[0011] Preferably, the plastic shell further includes an inner sliding table, the inner side of the inner sliding table is slidingly connected with the surface of the pin plate, the top of the shell body is fixedly connected with the half ring plate, and the number of the half ring plate is two.

[0012] Preferably, the bottom support shell includes a support body, the top of the support body is fixedly installed at the bottom of the plastic shell, the top of the support body is fixedly connected with the extension plate at the position close to the inner side, the surface of the support body is provided with the air flow hole, the inner side of the shell body and the heat sinking mechanism are provided with a gap, the extension plate supports and positions the shell body and the heat sinking mechanism, the edge of the top of the support body is provided with an upward warping, and the convex ring is arranged at the end of the extension plate away from the support body.

[0013] Preferably, the bottom shell further comprises a convex ring, which is fixedly installed on the surface of the extension plate near the middle part, the top of the extension plate is in close contact with the bottom of the guide assembly, and the bottom of the inner side surface of the bracket body is fixedly connected with the convex shell.

[0014] Preferably, the guide assembly comprises a guide shell, the surface of the guide shell is fixedly connected with the inner side surface of the plastic shell through silica gel, the inner side surface of the guide shell is provided with an air flow channel, a plurality of chip plates are uniformly arranged in the inner part of the support assembly, the bottom of the chip plate is deposited with heat-conducting glue, the chip plate is limited by the heat-conducting glue, and meanwhile, the heat-conducting glue enables the heat of the chip plate to be directly transmitted to the heat exchange block. In the prior art, the heat sink metal enables the heat to be transmitted, but the surface of the heat sink metal block is wrapped with plastic in a large area to ensure insulation, and the poor heat conduction of the plastic can cause heat accumulation.

[0015] Preferably, the guide assembly further comprises an end face pipe, which is fixedly installed on the guide shell near the air flow channel, and a rectangular pipe is fixedly connected to the lower part of the surface of the guide shell.

[0016] Preferably, the support assembly comprises a support table, which is fixedly installed on the top of the heat exchange block, the bottom of the support table is provided with a square hole, the chip plate is located above the square hole, a plurality of chip plates are separated by a partition plate, the surfaces of the support table, the partition plate and the blocking ring are provided with silver-plated mirror surfaces, the inclined surfaces cooperate with the silver-plated mirror surfaces to effectively enable the reflected light to be upward, the silver-plated mirror surface can reflect the light at the edge of the chip plate to the upper part of the lens surface, the light of the chip plate cannot be guided out at the position near the bottom of the lens surface, the end face of the plastic pipe is arranged at the position near the bottom of the lens, the light of the chip plate that cannot be guided out is reflected and guided out by the silver-plated mirror surface, and the utilization efficiency of the lens is increased.

[0017] Preferably, the support assembly further comprises a partition plate, which is fixedly installed on the inner side surface of the support table, the surface of the partition plate is fixedly connected with a blocking ring, and the surfaces of the blocking ring and the partition plate are both provided with inclined surfaces.

[0018] Preferably, the guide mechanism comprises a first guide ring and a second guide ring, the surfaces of the first guide ring and the second guide ring are both provided with inner grooves, the first guide ring and the second guide ring are both fixedly installed on the inner side surface of the guide assembly, the first guide ring is arranged above the second guide ring, the first guide ring and the second guide ring are arranged in an up-down interval, correspondingly, two pin plates are also arranged in an up-down interval, the first guide ring and the second guide ring are both made of copper, the surface of one chip plate is circumscribed with two leads, the two leads are respectively fixedly installed on the surfaces of the first guide ring and the second guide ring downward, the surfaces of the leads are both subjected to plastic dipping treatment, the end face of the pin plate extends into the embedded groove after penetrating through the shell, silica gel fills the gap between the guide shell and the shell, and the pin plate is quickly fixed and limited.

[0019] Preferably, the guide mechanism further comprises a guide wire, the bottom of the guide wire is fixedly installed on the top of the first guide ring, and the surfaces of the first guide ring and the second guide ring are provided with embedded grooves, and the top end of the guide wire is fixedly connected with the surface of the chip plate.

[0020] The application provides an LED chip packaging structure device.

[0021] 1. The LED chip packaging structure device, the surface of the lens is provided with a glue injection hole, the glue injection hole is arranged opposite to the foam plug, a gap is arranged between the shell and the heat sinking mechanism, the bottom support shell blocks the bottom of the gap, silicon glue is injected into the interior of the lens, the silicon glue fills the cavity between the shell, the lens and the heat sinking mechanism, the silicon glue is not easy to pass through the foam plug due to the large viscosity, and the gas is discharged through the foam plug, so that the rapid assembly of the LED chip packaging structure is realized.

[0022] 2. The LED chip packaging structure device, the support body and the warping structure are arranged on the inner and outer sides of the filled gap, when the silicon glue is injected into the interior of the lens, the inner and outer sides form a protection so that the silicon glue is not easy to overflow, meanwhile, a thin silicon glue layer can be formed between the extension plate and the shell and the heat sinking mechanism, the connection between the overall structure of the bottom support shell and the shell and the heat sinking mechanism is more compact, the support body is made of plastic material, the support body arranged at the bottom makes the heat sinking mechanism be lifted by a certain distance, so that the heat in the heat sinking mechanism is convenient to take away with the airflow, and the support body can effectively prevent the heat sinking mechanism made of metal material from being in contact with the metal joint to cause the damage of the LED chip.

[0023] 3. The LED chip packaging structure device, the support body is arranged directly below the lead-through assembly, the LED chip packaging structure is subjected to the action of wind force during use, the airflow successively passes through the plastic pipe, the arc-shaped hole and the lead-through assembly, the airflow takes away the heat of the heat exchange block, the heated gas is guided to the interior of the support body through the bottom of the lead-through assembly, the heated gas is guided out of the support body under the guidance of the convex shell, and the problem that the packaging glue is in high temperature for a long time, the internal thermal stress is increased, the refractive index is reduced, and the light emission is affected is solved.

[0024] 4. The LED chip packaging structure device, the flared cylinder promotes the flow of the gas, the light emitted by the chip plate is guided out of the lens to the greatest extent, the heating caused by the light unable to be guided out can be effectively reduced, the airflow is circulated and cooled in the plastic pipe, the heat exchange block and the end face pipe, the efficiency is higher, and the problem that the light emitted by the adjacent LED chips to each other is absorbed when multiple chips are packaged, and the light emission efficiency is reduced is solved.

[0025] 5、The LED chip packaging structure device, two pin plates are respectively in conductive engagement with the first lead ring and the second lead ring, so that the input end and the output end of the chip plate are respectively in conductive engagement with the first lead ring and the second lead ring, the first lead ring and the second lead ring are sleeved on the lead connection shell close to the air flow channel, the air flow flowing in the air flow channel improves the efficiency of heat being taken away when the air flow reaches the end face pipe, and meanwhile, the multiple chip plates are more stable and reliable when being engaged. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 It is a perspective view of the whole top of the LED chip packaging structure device of the application;

[0027] Figure 2 It is a perspective view of the whole bottom of the LED chip packaging structure device of the application;

[0028] Figure 3 It is a structural schematic view of the inside of the LED chip packaging structure device of the application;

[0029] Figure 4 It is a structural schematic view of the plastic shell of the application;

[0030] Figure 5 It is a structural schematic view of the bottom support shell of the application;

[0031] Figure 6 It is a structural schematic view of the bottom of the heat sinking mechanism of the application;

[0032] Figure 7 It is a structural schematic view of the top of the heat sinking mechanism of the application;

[0033] Figure 8 It is a structural schematic view of the lead connection assembly and the support assembly of the application;

[0034] Figure 9 It is a structural schematic view of the lead connection mechanism of the application.

[0035] In the figure: 1, plastic shell; 11, shell body; 12, flared hole; 13, annular groove; 14, inner sliding table; 15, half ring plate; 2, pin plate; 3, bolt; 4, bottom support shell; 41, support body; 42, air flow hole; 43, extension plate; 44, protruding ring; 45, convex shell; 5, lens; 6, foam plug; 7, heat sinking mechanism; 71, lead connection assembly; 711, lead connection shell; 712, air flow channel; 713, end face pipe; 714, rectangular pipe; 72, heat exchange block; 721, arc-shaped hole; 73, plastic pipe; 74, flared cylinder; 75, support assembly; 751, support table; 752, square hole; 753, partition plate; 754, blocking ring; 8, lead connection mechanism; 81, first lead ring; 82, second lead ring; 83, inner recess; 84, inner embedded groove; 85, lead wire; 9, chip plate. DETAILED DESCRIPTION

[0036] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0037] First embodiment: as follows Figures 1-4 As shown, the present invention provides a technical solution: an LED chip packaging structure device, including a plastic shell 1, a lead plate 2 fixedly connected to the inner side of the plastic shell 1, a bolt 3 fastened between the lead plate 2 and the plastic shell 1 by threads, a base shell 4 fixedly connected to the bottom of the plastic shell 1, a lens 5 fixedly connected to the top of the plastic shell 1, and a foam plug 6 fixedly connected to the lower part of the surface of the lens 5, and further including:

[0038] Heat sink mechanism 7 is fixedly installed in the middle of the inner side of the plastic shell 1. Chip board 9 is fixedly connected to the top of heat sink mechanism 7. Thermally conductive adhesive is bonded between heat sink mechanism 7 and chip board 9. Heat sink mechanism 7 is used to remove heat from the surface of chip board 9.

[0039] The lead-in mechanism 8 is fixedly installed on the inner side of the heat sink mechanism 7. The top of the lead-in mechanism 8 is fixedly connected to the surface of the chip board 9. The lead-in mechanism 8 is used for the connection and communication between multiple chip boards 9 and conductive pin boards 2.

[0040] The plastic shell 1 includes a shell 11, with an flared hole 12 at the upper position of the inner side of the shell 11, and an annular groove 13 at the top of the shell 11. The bottom of the lens 5 is embedded in the annular groove 13. The plastic shell 1 also includes an inner slide 14, with the inner side of the inner slide 14 slidably connected to the surface of the pin plate 2. A semi-annular plate 15 is fixedly connected to the top of the shell 11, and there are two semi-annular plates 15.

[0041] In use, the shell 11 is used for the insulation protection of the pin plate 2 and the heat sinking mechanism 7, the end surface of the pin plate 2 passes through the shell 11 to the lead-through mechanism 8, a plurality of chip plates 9 are connected with the pin plate 2 through the lead-through mechanism 8 and realize the conductive communication, the flared hole 12 supports the heat sinking mechanism 7, the bolt 3 stably connects the pin plate 2 with the inner sliding table 14, in installation, the bottom of the lens 5 is embedded into the inside of the annular groove 13, then the two half ring plates 15 are mutually butted and embedded into the position below the surface of the lens 5, then the two half ring plates 15 are fixed so that the lens 5 is quickly positioned, the surface of the lens 5 is provided with a glue injection hole, the glue injection hole is oppositely arranged with the foam plug 6, the gap is arranged between the shell 11 and the heat sinking mechanism 7, the bottom support shell 4 blocks the bottom of the gap, the inside of the lens 5 is filled with silica gel, the cavity between the shell 11, the lens 5 and the heat sinking mechanism 7 is filled with the silica gel, since the silica gel has large viscosity and is not easy to pass through the foam plug 6, the gas is discharged through the foam plug 6, so that the quick assembly of the LED chip packaging structure is realized.

[0042] The second embodiment is shown in Figs. 4-6. Figure 4 、 Figure 5 The bottom support shell 4 comprises a support body 41, the top of the support body 41 is fixedly installed at the bottom of the plastic shell 1, the top of the support body 41 is fixedly connected with an extension plate 43 at the position close to the inner side, the surface of the support body 41 is provided with an air flow hole 42, the bottom support shell 4 further comprises a raised ring 44, the raised ring 44 is fixedly installed at the position close to the middle of the surface of the extension plate 43, the top of the extension plate 43 is in close contact with the bottom of the lead-through assembly 71, the bottom of the inner side surface of the support body 41 is fixedly connected with a convex shell 45.

[0043] In use, the gap is arranged between the inner side surface of the shell 11 and the heat sinking mechanism 7, the extension plate 43 supports and positions the shell 11 and the heat sinking mechanism 7, the edge of the top of the support body 41 is upwardly warped, the raised ring 44 is arranged at the end of the extension plate 43 away from the support body 41, the support body 41 and the warped structure are arranged at the inner and outer sides of the filled gap, when the inside of the lens 5 is filled with silica gel, the inner and outer sides form protection so that the silica gel is not easy to overflow, at the same time, the extension plate 43 and the shell 11 and the heat sinking mechanism 7 can form a thin silica gel layer, so that the overall structure of the bottom support shell 4 is more closely connected with the shell 11 and the heat sinking mechanism 7, the support body 41 is made of plastic material, the support body 41 arranged at the bottom makes the heat sinking mechanism 7 be lifted by a certain distance, so that the heat inside the heat sinking mechanism 7 is facilitated to be taken away with the air flow, at the same time, the support body 41 can effectively avoid the contact between the heat sinking mechanism 7 made of metal material and the metal joint to cause the damage of the LED chip.

[0044] The third embodiment is shown in Figs. 7-9. Figure 5 、 Figure 6As shown, the heat sink mechanism 7 includes a guide connection assembly 71 fixedly installed at the middle position of the inner side of the plastic shell 1, the top of the guide connection assembly 71 is fixedly connected with a heat exchange block 72, the top of the heat exchange block 72 is fixedly connected with a support assembly 75, the surface of the heat exchange block 72 is fixedly connected with a plastic pipe 73, the inside of the plastic pipe 73, the heat exchange block 72 and the support assembly 75 are communicated by gas, the inside of the heat exchange block 72 is provided with an arc-shaped hole 721, the guide connection assembly 71 and the middle position of the inner side of the plastic shell 1 are filled with silica gel for fixation, and the top end of the plastic pipe 73 is fixedly connected with a flared cylinder 74.

[0045] In use, a plurality of chip plates 9 are evenly arranged in the inside of the support assembly 75, the bottom of the chip plate 9 is deposited with heat-conducting glue, and the chip plate 9 is limited by the heat-conducting glue, and at the same time, the heat-conducting glue enables the heat of the chip plate 9 to be directly transmitted to the heat exchange block 72. In the prior art, the heat is transmitted by using a heat sink metal, but the surface of the heat sink metal block is wrapped with plastic in a large area to ensure insulation, and the poor heat transfer capacity of the plastic will cause heat accumulation. In this device, the support body 41 is arranged directly below the guide connection assembly 71, and the LED chip packaging structure is affected by wind force in use. The airflow successively passes through the plastic pipe 73, the arc-shaped hole 721 and the guide connection assembly 71, and the airflow takes away the heat of the heat exchange block 72. The heated gas is guided out of the support body 41 by the guide of the convex shell 45, solving the problem that the packaging glue is in high temperature for a long time, the internal thermal stress is increased, the refractive index is reduced, and the light emission is affected.

[0046] The fourth embodiment is as shown in Figure 6 , Figure 7 , Figure 8 As shown, the guide connection assembly 71 includes a guide shell 711, the surface of the guide shell 711 is fixedly connected with the inner side of the plastic shell 1 through silica gel, the inner side of the guide shell 711 is provided with an airflow channel 712, the guide connection assembly 71 further includes an end face pipe 713 fixedly installed at the position close to the airflow channel 712 of the guide shell 711, and a rectangular pipe 714 is fixedly connected with the lower position of the surface of the guide shell 711.

[0047] The support assembly 75 includes a support table 751 fixedly installed at the top of the heat exchange block 72, the bottom of the support table 751 is provided with a square hole 752, the chip plate 9 is arranged at the upper position of the square hole 752, the support assembly 75 further includes a partition plate 753 fixedly installed at the inner side of the support table 751, the surface of the partition plate 753 is fixedly connected with a blocking ring 754, and the surface of the blocking ring 754 and the partition plate 753 are both provided with inclined surfaces.

[0048] In use, the plurality of chip plates 9 are blocked by the partition plate 753, the surface of the support table 751, the partition plate 753 and the blocking ring 754 is provided with a silver-plated mirror surface, and the inclined surface cooperates with the silver-plated mirror surface to effectively make the reflected light upward, the silver-plated mirror surface can reflect the light at the edge position of the chip plate 9 to the upper position of the surface of the lens 5, and the position close to the bottom of the surface of the lens 5 cannot make the light of the chip plate 9 be guided out. The end surface of the plastic pipe 73 is arranged at the position close to the bottom of the lens 5, the light of the chip plate 9 which cannot be guided out is reflected and guided out by the silver-plated mirror surface, the utilization efficiency of the lens 5 is increased, the flared barrel 74 promotes the flow of gas, the light emitted by the chip plate 9 is guided out of the lens 5 to the maximum extent, and the heating caused by the light that cannot be guided out can be effectively reduced. When the airflow flows and cools in the inside of the plastic pipe 73, the heat exchange block 72 and the end surface pipe 713, the efficiency is higher, and the problem that the light emitted by the adjacent LED chips is absorbed when the multi-chip is packaged, thereby reducing the light emitting efficiency, is solved.

[0049] Fifth embodiment: as shown in Figure 8 、 Figure 9 The lead-in mechanism 8 includes a first guide ring 81 and a second guide ring 82, the surfaces of the first guide ring 81 and the second guide ring 82 are provided with inner grooves 83, the first guide ring 81 and the second guide ring 82 are fixedly installed on the inner side of the lead-in assembly 71, the first guide ring 81 is arranged at the upper position of the second guide ring 82, the lead-in mechanism 8 further includes a lead wire 85, the bottom of the lead wire 85 is fixedly installed on the top of the first guide ring 81, the surfaces of the first guide ring 81 and the second guide ring 82 are provided with inner embedded grooves 84, and the top end of the lead wire 85 is fixedly connected with the surface of the chip plate 9.

[0050] In use, the first guide ring 81 and the second guide ring 82 are arranged in an upper and lower interval, and correspondingly, the two pin plates 2 are also arranged in an upper and lower interval, the first guide ring 81 and the second guide ring 82 are both made of copper, the surface of one chip plate 9 is connected with two lead wires 85, the two lead wires 85 are respectively fixedly installed on the surfaces of the first guide ring 81 and the second guide ring 82, the surfaces of the lead wires 85 are subjected to plastic dipping treatment, the end surface of the pin plate 2 extends into the inner embedded groove 84 after penetrating through the shell 11, and the gap between the lead-in shell 711 and the shell 11 is filled with silica gel, so that the pin plate 2 is quickly fixed and positioned. The two pin plates 2 are respectively electrically connected with the first guide ring 81 and the second guide ring 82, so as to electrically connect the input end and the output end of the chip plate 9 with the first guide ring 81 and the second guide ring 82 respectively. The first guide ring 81 and the second guide ring 82 are sleeved on the position of the lead-in shell 711 close to the airflow channel 712, the airflow flows in the airflow channel 712 to the end surface pipe 713, thereby improving the efficiency of heat being taken away, and at the same time, the jointing of the plurality of chip plates 9 is more stable and reliable.

[0051] It is to be noted that, as used in this specification and the appended claims, the singular forms "a," "an," and "the" include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to "a component" can include a combination of two or more components. Additionally, the terms "comprise," "comprises," and "comprising," or any variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements is not necessarily limited to those elements, but can include other elements not expressly listed or inherent to such process, method, article, or apparatus. Reference to "about" or "substantially" indicates that the value mentioned is subject to an acceptable degree of deviation, e.g., due to measurement or manufacturing tolerances, up to a reasonable limit.

Claims

1. An LED chip encapsulation structure device comprising a plastic shell (1), characterized in that, The inner side of the plastic shell (1) is fixedly connected with a pin plate (2), the position between the pin plate (2) and the plastic shell (1) is fixedly connected with a bolt (3) through threaded fastening, the bottom of the plastic shell (1) is fixedly connected with a bottom support shell (4), the top of the plastic shell (1) is fixedly connected with a lens (5), the lower position of the surface of the lens (5) is fixedly connected with a foam plug (6), and the plastic shell (1) further comprises: A heat sinking mechanism (7) is fixedly installed at the middle position of the inner side of the plastic shell (1), the top of the heat sinking mechanism (7) is fixedly connected with a chip board (9), the heat sinking mechanism (7) is bonded with the chip board (9) with heat-conducting glue, and the heat sinking mechanism (7) is used for carrying away the heat on the surface of the chip board (9). An interface mechanism (8) is fixedly installed on the inner side of the heat sinking mechanism (7), the top of the interface mechanism (8) is fixedly connected with the surface of the chip board (9), and the interface mechanism (8) is used for the joint communication between the plurality of chip boards (9) and the conductive pin plate (2). The heat sinking mechanism (7) comprises a lead-through assembly (71) fixedly installed at the middle position of the inner side of the plastic shell (1), the top of the lead-through assembly (71) is fixedly connected with a heat exchange block (72), the top of the heat exchange block (72) is fixedly connected with a support assembly (75), the surface of the heat exchange block (72) is fixedly connected with a plastic tube (73), and the inside of the plastic tube (73), the heat exchange block (72) and the support assembly (75) are in communication through gas.

2. The LED chip packaging structure apparatus of claim 1, wherein: The inside of the heat exchange block (72) is provided with an arc-shaped hole (721), the lead-through assembly (71) is fixed by pouring silica gel at the middle position of the inner side of the plastic shell (1), and the top end of the plastic tube (73) is fixedly connected with a flared cylinder (74).

3. The LED chip packaging structure apparatus of claim 2, wherein: The plastic shell (1) comprises a shell body (11), an expanded hole (12) is formed at the upper position of the inner side of the shell body (11), an annular groove (13) is formed at the top of the shell body (11), and the bottom of the lens (5) is embedded into the annular groove (13).

4. The LED chip packaging structure apparatus of claim 3, wherein: The plastic shell (1) further comprises an inner sliding table (14), the inner side of the inner sliding table (14) is slidingly connected with the surface of the pin plate (2), the top of the shell body (11) is fixedly connected with a half-ring plate (15), and the number of the half-ring plate (15) is two.

5. The LED chip packaging structure apparatus of claim 4, wherein: The bottom support shell (4) comprises a support body (41), the top of the support body (41) is fixedly installed at the bottom of the plastic shell (1), the top of the support body (41) is fixedly connected with an extension plate (43) at the position close to the inner side, and the surface of the support body (41) is provided with an air flow hole (42).

6. The LED chip packaging structure apparatus of claim 5, wherein: The bottom support shell (4) further comprises a raised ring (44), the raised ring (44) is fixedly installed at the position close to the middle of the surface of the extension plate (43), the top of the extension plate (43) is in close contact with the bottom of the lead-through assembly (71), and the bottom of the inner side of the support body (41) is fixedly connected with a convex shell (45).

7. The LED chip packaging structure apparatus of claim 1, wherein: The guide connection assembly (71) comprises a guide connection shell (711), the surface of the guide connection shell (711) is fixedly connected with the inner side of the plastic shell (1) through silica gel, and the inner side of the guide connection shell (711) is provided with an air flow channel (712).

8. The LED chip packaging structure apparatus of claim 7, wherein: The guide connection assembly (71) further comprises an end face pipe (713), the end face pipe (713) is fixedly installed on the guide connection shell (711) close to the air flow channel (712), and the lower position of the surface of the guide connection shell (711) is fixedly connected with a rectangular pipe (714).

9. The LED chip packaging structure apparatus of claim 8, wherein: The support assembly (75) comprises a support table (751), the support table (751) is fixedly installed on the top of the heat exchange block (72), the bottom of the support table (751) is provided with a square hole (752), and the chip plate (9) is located above the square hole (752).

10. The LED chip packaging structure apparatus of claim 9, wherein: The support assembly (75) further comprises a partition plate (753), the partition plate (753) is fixedly installed on the inner side of the support table (751), the surface of the partition plate (753) is fixedly connected with a blocking ring (754), and the surface of the blocking ring (754) and the partition plate (753) are all provided with inclined surfaces.

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