Resin wafer spin coating glue method

Abstract

The present invention discloses a method for spin-coating glue on a resin wafer, comprising the following steps: providing a hard substrate, laminating a strippable glue layer on one surface of the hard substrate; providing a resin wafer, adding a hydrophobic film layer on the first surface of the resin wafer; laminating the first surface of the resin wafer with the hydrophobic film layer on the strippable glue layer to form a spin-coated composite structure; adsorbing the hard substrate and driving the spin-coated composite structure to rotate, and spin-coating glue on the second surface of the resin wafer; peeling the spin-coated resin wafer from the strippable glue layer of the hard substrate. In the method for spin-coating glue on a resin wafer proposed by the present invention, the hard substrate not only provides support for the resin wafer, but also can be vacuum-adsorbed and transmit a rotational force to drive the resin wafer to apply glue, and the resin wafer remains flat and does not deform during the process of applying glue, and the thickness of the glue is uniform. The resin wafer provided with a hydrophobic film layer is easy to peel off; the hard substrate and the strippable glue layer can be reused.

Description

Technical Field

[0001] The invention relates to the technical field of optical waveguides, in particular to a method for spin coating glue on a resin wafer. Background Art

[0002] In the near-eye display device of augmented reality (AR), the optical module usually consists of two parts: an optical machine (also called a light engine) and a light combiner. The optical machine consists of an image source and a projection lens. The image source is used to generate the image to be displayed, and the projection lens projects the image displayed by the image source to infinity or a specified distance. The light combiner can transmit the signal light emitted by the optical machine to the human eye in a direction, forming the image to be displayed on the retina; at the same time, the light combiner has good transmittance to the ambient light in the real world. Through the light combiner, the human eye can see the real-world scenery and the image projected by the optical machine at the same time, realizing the combination of virtual and real.

[0003] Diffractive optical waveguides are the preferred solution for optical combiners due to their thin thickness, light weight and good light transmittance. The overall optical waveguide performance of the diffractive optical waveguide has a great impact on the display effect of the near-eye display device.

[0004] In the related art, when spin coating a thin resin wafer for making a diffractive optical waveguide, the resin wafer is deformed during the process of vacuum adsorbing the resin wafer and driving it to rotate, and the glue thickness is unevenly distributed, resulting in an uneven grating structure, which seriously affects the optical efficiency of the diffractive optical waveguide. Summary of the invention

[0005] In view of this, the present invention proposes a method for spin-coating glue on a resin wafer, aiming to solve at least one of the aforementioned technical problems and achieve uniform glue coating on a thinner resin wafer without deformation of the resin wafer during glue coating.

[0006] The present invention provides a method for spin-coating glue on a resin wafer, comprising the following steps: providing a hard substrate, and laminating a strippable glue layer on one surface of the hard substrate; providing a resin wafer, and adding a hydrophobic film layer on the first surface of the resin wafer; laminating the first surface of the resin wafer with the hydrophobic film layer on the strippable glue layer to form a spin-coated composite structure; adsorbing the hard substrate and driving the spin-coated composite structure to rotate, and spin-coating glue on the second surface of the resin wafer; and peeling the spin-coated resin wafer from the strippable glue layer of the hard substrate.

[0007] It can be seen from the above technical scheme that the resin wafer spin coating glue method proposed by the present invention is to stick a thinner resin wafer on a hard substrate. The hard substrate provides support for the resin wafer. The hard substrate can also be vacuum adsorbed and transmit a rotational force to drive the resin wafer to coat the glue, so that the resin wafer always remains flat and does not deform during the coating process, so that during the spin coating process, the second side of the resin wafer can be spin coated with glue with high quality as needed. A hydrophobic film layer is provided on the side of the resin wafer facing the hard substrate, so that during the peeling process of the resin wafer, due to the lower adhesion between the hydrophobic film layer and the strippable adhesive layer, the resin wafer is easier to overcome the adhesive force between the strippable adhesive layer and achieve peeling, and peeling is convenient. After the resin wafer is peeled, the hard substrate and the strippable adhesive layer can be retained and reused to reduce costs.

[0008] In some embodiments of the present invention, the strippable adhesive layer is a temperature-sensitive adhesive; when the resin wafer is spin-coated with glue, the strippable adhesive layer is at a first temperature, and when the resin wafer is peeled off from the hard substrate, the strippable adhesive layer is at a second temperature, which is different from the first temperature. At the first temperature, the viscosity of the strippable adhesive layer is reduced.

[0009] In some further embodiments of the present invention, the second temperature is lower than the first temperature; and / or the second temperature is 60°C to 80°C, and the first temperature is 20°C to 30°C.

[0010] In some embodiments of the present invention, before peeling the spin-coated resin wafer from the strippable adhesive layer of the hard substrate, the following steps are also included: heating the spin-coated composite structure to reduce the viscosity of the strippable adhesive layer, and the strippable adhesive layer and the hydrophobic film layer are separated from each other.

[0011] In some embodiments of the present invention, the peelable adhesive layer includes at least one of epoxy resin adhesive, acrylate adhesive or polyurethane adhesive.

[0012] In some embodiments of the present invention, the step of providing a hard substrate and laminating a peelable adhesive layer on one side of the hard substrate includes: providing a hard substrate, processing one side of the hard substrate to form a hydrophilic film layer, and laminating a peelable adhesive layer on the side having the hydrophilic film layer.

[0013] In some specific embodiments of the present invention, the hydrophilic angle of the hydrophilic film layer is less than or equal to 30 degrees; and / or the hydrophobic angle of the hydrophobic film layer is greater than 110 degrees.

[0014] In some embodiments of the present invention, the hard substrate includes at least one of a resin substrate, a glass substrate or a silicon substrate.

[0015] In some embodiments of the present invention, the orthographic projection of the outer contour of the resin wafer on the hard substrate coincides with the outer contour of the hard substrate; or, the orthographic projection of the outer contour of the resin wafer on the hard substrate is located within the outer contour of the hard substrate.

[0016] In some embodiments of the present invention, laminating the removable adhesive layer on one side of the hard substrate includes: laminating the removable adhesive layer on one side of the hard substrate by a rolling method; laminating the first side of the resin wafer with the hydrophobic film layer on the removable adhesive layer includes: laminating the first side of the resin wafer with the hydrophobic film layer on the removable adhesive layer by a rolling method.

[0017] In some embodiments of the present invention, the first protective film and the second protective film are respectively provided on two opposite sides of the unbonded removable adhesive layer; before bonding the removable adhesive layer on one side of the hard substrate, the following steps are also included: tearing off the first protective film of the removable adhesive layer; before bonding the first side of the resin wafer with the hydrophobic film layer on the removable adhesive layer, the following steps are also included: tearing off the second protective film of the removable adhesive layer.

[0018] It should be understood that the above general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure of the embodiments of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained like these accompanying drawings without paying any creative work.

[0020] Figure 1 It is a schematic flow chart of a method for spin coating glue on a resin wafer proposed in some embodiments of the present invention;

[0021] Figure 2 It is a schematic flow chart of a method for spin coating glue on a resin wafer according to some embodiments of the present invention;

[0022] Figure 3 It is a schematic flow chart of a method for spin coating glue on a resin wafer according to some other embodiments of the present invention;

[0023] Figure 4 It is a schematic flow chart of a method for spin coating glue on a resin wafer proposed in some other embodiments of the present invention;

[0024] Figure 5 It is a schematic flow chart of a method for spin coating glue on a resin wafer proposed in some other embodiments of the present invention. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, other embodiments obtained by ordinary technicians in this field without creative work are all within the scope of protection of the present invention.

[0026] In the absence of conflict, the following embodiments and features of the embodiments may be combined with each other.

[0027] In order to further improve the wearing comfort and reduce the weight of AR near-eye display devices, thinner diffractive optical waveguides will tend to be used. When the resin wafer used to make diffractive optical waveguides has a higher refractive index and a thinner thickness, vacuum adsorption of thin resin wafers and spin coating glue will cause the resin wafer to deform, which will lead to uneven thickness of the glue on the resin wafer, resulting in poor appearance quality and poor optical performance of the manufactured diffractive optical waveguide.

[0028] The present invention is aimed at performing spin coating on thin resin wafers.

[0029] According to an embodiment of the present invention, a method for spin coating glue on a resin wafer is provided. Figure 1 As shown, the following steps are included:

[0030] Step S100: providing a hard substrate, and attaching a peelable adhesive layer to one side of the hard substrate.

[0031] Step S200: providing a resin wafer, and adding a hydrophobic film layer on a first surface of the resin wafer.

[0032] Step S300 , laminating the first surface of the resin wafer with the hydrophobic film layer on the strippable adhesive layer to form a spin-coated composite structure.

[0033] Step S400, adsorbing the hard substrate and driving the spin-coating composite structure to rotate, and spin-coating glue on the second surface of the resin wafer.

[0034] Step S500: peeling the spin-coated resin wafer from the peelable adhesive layer of the hard substrate.

[0035] As can be seen from the above technical solution, the resin wafer spin coating glue method proposed in the present invention is to stick a thinner resin wafer on a hard substrate, and the hard substrate provides support for the resin wafer. At the same time, the resin wafer is also connected to the hard substrate through a peelable adhesive layer. When the hard substrate is vacuum adsorbed, it is not easy to be deformed by the vacuum adsorption force due to its own hard material. Therefore, it can provide reliable support for the resin wafer; the rotational force acting on the hard substrate can be transmitted upward to the resin wafer through the peelable adhesive layer, so that the entire spin coating composite structure can rotate synchronously, and then the second side of the resin wafer can be evenly coated with glue. Then, the thinner resin wafer always remains flat and does not deform during the glue coating process. During the spin coating process, the second side of the resin wafer can be spin coated with glue with high quality as needed, thereby improving the optical performance of the resin wafer as an optical waveguide material.

[0036] In addition, the hard substrate of the present invention has a certain hardness and can withstand a large vacuum adsorption force without deformation, so that the spin-coated composite structure can be rotated at a faster rate, thereby effectively improving the efficiency and quality of the spin-coated glue. The hard substrate of the present invention has a small thickness deviation, which is conducive to the bonding of the strippable adhesive layer and the hard substrate, and is also conducive to the uniform coating of the resin wafer.

[0037] Since the resin wafer of the present invention is provided with a hydrophobic film layer on the side facing the hard substrate, the resin wafer can be peeled off more easily because the adhesion between the hydrophobic film layer and the peelable adhesive layer is lower during the peeling process. Therefore, the resin wafer can be peeled off more easily because the adhesion between the hydrophobic film layer and the peelable adhesive layer is lower. The peeling is convenient and residue is not likely to occur, which facilitates the subsequent processing of the resin wafer after the glue coating. During the peeling process, since the surface of the resin wafer has a hydrophobic film layer, it is not likely to leave glue marks on the surface.

[0038] After the resin wafer of the present invention is peeled off, the hard substrate and the peelable adhesive layer can be retained and reused, thereby reducing the cost of the entire spin coating process.

[0039] The method for spin-coating glue on a resin wafer of the present invention is particularly suitable for spin-coating glue on a resin wafer with a thickness of 0.01 mm to 1 mm. For example, the thickness of the resin wafer is 0.01 mm, 0.02 mm, 0.03 mm, 0.05 mm, 0.1 mm, 0.3 mm, 0.5 mm, 0.8 mm, 1 mm, etc. The resin wafer within the above thickness range is relatively thin. If the resin wafer is directly adsorbed by a vacuum suction cup, it is easy to deform and the thickness of the spin-coated glue is uneven. However, the hard substrate of the present invention is used to support the resin wafer of the above thickness, and the vacuum suction cup is adsorbed on the hard substrate, which can effectively prevent the resin wafer from being deformed, and the thickness of the glue after the resin wafer is spin-coated with glue can be uniform.

[0040] It can be understood that compared with the defects of uneven glue thickness, deformation of resin wafer and poor appearance quality caused by directly adsorbing thinner resin wafers for glue coating in the prior art, the resin wafer spin coating glue method of the present invention can achieve high-quality spin coating glue on thinner resin wafers, and ensure that the resin wafer after spin coating has good appearance quality and is convenient for subsequent processing.

[0041] In some embodiments, the thickness of the hard substrate is controlled at 0.01 mm to 1 mm, so as to ensure that the hard substrate has sufficient hardness and rigidity while reasonably controlling the processing cost, making the operation of the spin coating device more controllable and extending the service life of the spin coating device. For example, the thickness of the hard substrate is 0.01 mm, 0.02 mm, 0.03 mm, 0.05 mm, 0.1 mm, 0.3 mm, 0.5 mm, 0.8 mm, 1 mm, etc. When the hard substrate is too thinner than 0.01 mm, the structural strength is insufficient and deformation is prone to occur; if the hard substrate is too thick, the required load-bearing components are more demanding, the service life of the components applying the rotational force may be shortened, and the cost of processing the hard substrate is high.

[0042] In some embodiments, the thickness of the strippable adhesive layer is controlled to be between 10nm and 10000nm, so that the strippable adhesive layer has two relatively bondable sides, the two sides of the strippable adhesive layer do not interfere with each other during bonding or stripping, the cost is controllable, the amount of adhesive is appropriate, the operation is convenient, and the overall thickness of the spin-coated composite structure is controlled within a reasonable range during spin coating, so that the rotation center is relatively stable during spin coating. For example, the thickness of the strippable adhesive layer is 10nm, 20nm, 50nm, 75nm, 100nm, 150nm, 230nm, 300nm, 500nm, 1000nm, 3000nm, 7000nm, 8888nm, 10000nm and the like. When the thickness of the strippable adhesive layer is too thin, thinner than 10nm, the peeling force generated during the peeling process of the strippable adhesive layer and the resin wafer will be transmitted to the other side of the strippable adhesive layer, which may affect the connection between the strippable adhesive layer and the hard substrate; when the thickness of the strippable adhesive layer is too thick, the liquid adhesive curing process will be slow, affecting the operation progress, requiring a large amount of adhesive, high cost, and the rotation center may not be stable enough during the spin coating process.

[0043] In some embodiments of the present invention, the strippable adhesive layer used in the method of spin-coating glue on a resin wafer is a temperature-sensitive adhesive; when the resin wafer is spin-coated with glue, the strippable adhesive layer is placed in a first temperature environment, and when the resin wafer is peeled off from a hard substrate, the strippable adhesive layer is placed in a second temperature environment, the second temperature is different from the first temperature, and at the first temperature, the viscosity of the strippable adhesive layer is lower. That is to say, during the spin-coating process of the resin wafer, the bonding strength between the strippable adhesive layer and the resin wafer at the first temperature is large, so that the spin-coated composite structure is formed into a stable whole, and under the action of the rotating force, the spin-coated composite structure will rotate at a preset spin-coating speed for glue coating. After the spin-coating is completed, the bonding strength between the strippable adhesive layer and the resin wafer at the second temperature is small, and under the drive of the peeling force, the resin wafer and the strippable adhesive layer can be quickly separated. Then, the first temperature can be greater than the second temperature, and the first temperature can also be less than the second temperature, which needs to be adjusted according to the actual temperature control conditions and the type of the selected strippable adhesive layer.

[0044] In some specific embodiments, the second temperature is lower than the first temperature, for example, the second temperature is 60°C to 80°C, specifically 60°C, 65°C, 70°C, 75°C, 80°C, etc.; the first temperature is 20°C to 30°C, specifically 20°C, 22°C, 24°C, 26°C, 28°C, 30°C, etc. In these examples, the adhesive force between the strippable adhesive layer and the hydrophobic film layer at 60°C to 80°C is reduced, so that the resin wafer can be easily separated from the strippable adhesive layer with a smaller force, and the smaller adhesive force can also effectively prevent the resin wafer from deforming during the stripping process; while the strippable adhesive layer at 20°C to 30°C will restore the adhesive force, and the strippable adhesive layer at this temperature can also be attached to another resin wafer to be spin-coated with glue, so that the hard substrate and the strippable adhesive layer of the present invention can achieve the effect of repeated use. Of course, in other examples, the first temperature and the second temperature may be in other temperature ranges, as long as the operation is convenient, the conditions are convenient for implementation, and the peelable adhesive layer can have different viscosities at the first temperature and the second temperature.

[0045] In some embodiments of the present invention, Figure 2 As shown, before step S500 of peeling the spin-coated resin wafer from the peelable adhesive layer of the hard substrate, the following steps are also included:

[0046] Step S501, heating the spin-coated composite structure to reduce the viscosity of the strippable adhesive layer, and the strippable adhesive layer and the hydrophobic film layer are separated from each other. That is, in these examples, the strippable adhesive layer is a temperature-sensitive adhesive, and the adhesive selected for the strippable adhesive has a higher viscosity with the hydrophobic film layer at a lower temperature, and a lower viscosity with the hydrophobic film layer at a higher temperature. Then, before peeling off the resin wafer, by performing a heating operation, it is convenient to quickly separate the strippable adhesive layer and the hydrophobic film layer, and realize the peeling of the spin-coated resin wafer.

[0047] The following describes a specific example. Figure 2 As shown, the steps of the resin wafer spin coating glue method of the present invention are as follows:

[0048] Step S100: providing a hard substrate, and attaching a peelable adhesive layer to one side of the hard substrate.

[0049] Step S200: providing a resin wafer, and adding a hydrophobic film layer on a first surface of the resin wafer.

[0050] Step S300 , laminating the first surface of the resin wafer with the hydrophobic film layer on the strippable adhesive layer to form a spin-coated composite structure.

[0051] Step S400, adsorbing the hard substrate and driving the spin-coating composite structure to rotate, and spin-coating glue on the second surface of the resin wafer.

[0052] Step S501 : heating the spin-coated composite structure to reduce the viscosity of the strippable adhesive layer, so that the strippable adhesive layer and the hydrophobic film layer are separated from each other.

[0053] Step S500: peeling the spin-coated resin wafer from the peelable adhesive layer of the hard substrate.

[0054] In some embodiments of the present invention, the peelable adhesive layer includes at least one of epoxy resin adhesive, acrylate adhesive or polyurethane adhesive. By selecting different peelable adhesive layers, the peelable adhesive layer can change its own viscosity under different temperatures, and these adhesives can achieve better bonding with substrates with higher polarity, while the bonding effect with hydrophobic substrates is weaker than that with hydrophilic substrates; then when the temperature changes, the adhesive force of the peelable adhesive layer becomes weaker, which is convenient for separation from the resin wafer with a hydrophobic film layer.

[0055] In the above example, when the peelable adhesive layer is epoxy resin adhesive, the epoxy resin adhesive has a small volume shrinkage rate and internal stress, contains a variety of polar groups, and has strong adhesion to polar materials such as glass and plastic, especially materials with high surface activity; the cohesive strength of epoxy cured products is also very large, so its bonding strength is very high, so that the hard substrate and resin wafer bonded with epoxy resin adhesive can form a stable structure, which is convenient for high-speed spin coating of glue on the resin wafer. Epoxy resin adhesive also has the characteristics of high flexibility, strong versatility, and easy curing at room temperature.

[0056] In the above example, when the peelable adhesive layer is acrylic adhesive, acrylic adhesive has high tensile strength and can withstand large tensile loads. The adhesive has good adhesion to glass, aluminum plates, metals, plastics, etc., and does not pollute the substrate during the curing process. It has good weather resistance and UV resistance, and can still maintain good softness at low temperatures. It can be cured between 10℃ and 40℃.

[0057] In the above example, when the peelable adhesive layer is polyurethane adhesive, the polyurethane adhesive has high transparency at room temperature, is easy to process, is resistant to ultraviolet rays, is not prone to aging, and is not prone to yellowing. It can be quickly cured within a certain period of time. The use of this type of peelable adhesive layer can improve the operating process of step S100 and step S300, and achieve rapid bonding between the peelable adhesive layer and the hard substrate, as well as rapid bonding between the peelable adhesive layer and the resin wafer.

[0058] In some embodiments of the present invention, Figure 3 As shown, step S100 provides a hard substrate, and the step of laminating a peelable adhesive layer on one side of the hard substrate includes:

[0059] Step S110, providing a hard substrate, treating one side of the hard substrate to form a hydrophilic film layer, and attaching a strippable adhesive layer to the side with the hydrophilic film layer. That is to say, when attaching the strippable adhesive layer, the surface of the hard substrate is treated so that the hard substrate is more easily bonded to the strippable adhesive layer, and the bonding strength between the hard substrate and the strippable adhesive layer is greater than the bonding strength between the resin wafer with the hydrophobic film layer and the strippable adhesive layer. Then, when the stripping force is applied to the spin-coated composite structure in step S500, the strippable adhesive layer will be firstly stripped from the resin wafer, and the strippable adhesive layer can continue to remain on the hard substrate.

[0060] The following describes a specific example. Figure 3 As shown, the steps of the resin wafer spin coating glue method of the present invention are as follows:

[0061] Step S110, providing a hard substrate, treating one side of the hard substrate to form a hydrophilic film layer, and laminating a peelable adhesive layer on the side of the hard substrate having the hydrophilic film layer.

[0062] Step S200: providing a resin wafer, and adding a hydrophobic film layer on a first surface of the resin wafer.

[0063] Step S300 , laminating the first surface of the resin wafer with the hydrophobic film layer on the strippable adhesive layer to form a spin-coated composite structure.

[0064] Step S400, adsorbing the hard substrate and driving the spin-coating composite structure to rotate, and spin-coating glue on the second surface of the resin wafer.

[0065] Step S501 : heating the spin-coated composite structure to reduce the viscosity of the strippable adhesive layer, so that the strippable adhesive layer and the hydrophobic film layer are separated from each other.

[0066] Step S500: peeling the spin-coated resin wafer from the peelable adhesive layer of the hard substrate.

[0067] In some specific embodiments, the hydrophilic angle of the hydrophilic film layer used is less than or equal to 30 degrees, that is, the hydrophilic film layer has good hydrophilicity and is easy to achieve strong bonding with the polar peelable adhesive layer.

[0068] In some specific embodiments, the hydrophobic angle of the hydrophobic film layer is greater than 110 degrees, that is, the contact angle is greater than 110 degrees. That is, the hydrophobic film layer has good hydrophobicity, and the adhesion between the hydrophobic film layer and the peelable adhesive layer is less than the adhesion between the hydrophilic film layer and the peelable adhesive layer. Then, when the peelable adhesive layer becomes less viscous at a predetermined temperature, it can be easily separated from the resin wafer with the hydrophilic film layer.

[0069] In some embodiments of the present invention, the hard substrate includes at least one of a resin substrate, a glass substrate or a silicon substrate. These substrates all have a certain hardness and can withstand a certain external force without deformation; these substrates are also convenient for machining, so that the size and shape of the hard substrate are easy to control, so that they can better match the size of the resin wafer and provide reliable support for the resin wafer; these types of hard substrates also have a certain thermal conductivity, which can quickly heat up or cool down the removable adhesive on the hard substrate, so that the removable adhesive changes its own viscosity, which is convenient for implementing step S500 and / or step S501.

[0070] Resin substrates and glass substrates can be made into transparent substrates, which are convenient for observing the vacuum adsorption sites and performing vacuum adsorption. The processing technology of silicon substrates is very mature and can achieve high-precision and high-efficiency production; the price is cheap and the cost is low.

[0071] In some examples, the orthographic projection of the outer contour of the resin wafer on the hard substrate coincides with the outer contour of the hard substrate. Thus, the entire resin wafer can be stably supported by the hard substrate, and the size of the hard substrate is reasonably controlled, the processing cost is low, and it is easy to center the rotation center, and it can effectively support the resin wafers of the same size and the same batch, and it is easy to quickly spin-coat the same resin wafers in batches.

[0072] In other examples, the orthographic projection of the outer contour of the resin wafer on the hard substrate is located within the outer contour of the hard substrate. Thus, the entire resin wafer can be stably supported by the hard substrate, and the edge of the resin wafer can also be protected by the hard substrate. The hard substrate can be applied to resin wafers of various sizes, which expands the application range of the hard substrate and helps to reuse the hard substrate. The same hard substrate also helps to improve processing efficiency.

[0073] In some embodiments of the present invention, Figure 4 As shown, in step S100, laminating a peelable adhesive layer on one side of the hard substrate includes:

[0074] Step S120, affixing the removable adhesive layer on one side of the hard substrate by roller rolling. By rolling, force can be applied evenly, so that the removable adhesive layer is evenly spread on the hard substrate, ensuring that the removable adhesive layer is attached to the entire hard substrate, so that all parts of the hard substrate can achieve strong adhesion with the removable adhesive layer, and the adhesion is even, without bulging or wrinkles, which is conducive to bonding the resin wafer on the other side of the removable adhesive layer. The hard substrate of the present invention will not be deformed during the process of rolling and affixing the removable adhesive tape.

[0075] The step S300 of laminating the first surface of the resin wafer with the hydrophobic film layer on the strippable adhesive layer includes:

[0076] Step S310, the first surface of the resin wafer with the hydrophobic film layer is bonded to the strippable adhesive layer by a roller rolling method. By the roller rolling method, the force can be evenly applied to smoothly bond the resin wafer to the strippable adhesive layer, and the hydrophobic film layer of the resin wafer can be bonded to the strippable adhesive layer at all places, and the bonding is uniform and not easy to bulge, so that the surface of the resin wafer after bonding is flat, and the spin-coated surface of the resin wafer is on the same rotating plane, and the force is uniform when the glue is spin-coated. The hard substrate of the present invention will not be deformed during the process of roller rolling and bonding the resin wafer.

[0077] The following describes a specific example. Figure 4 As shown, the steps of the resin wafer spin coating glue method of the present invention are as follows:

[0078] Step S120: providing a hard substrate, and applying a peelable adhesive layer to one side of the hard substrate by rolling.

[0079] Step S200: providing a resin wafer, and adding a hydrophobic film layer on a first surface of the resin wafer.

[0080] Step S310: Lay the first surface with the hydrophobic film layer on the peelable adhesive layer by roller rolling to form a spin-coated composite structure.

[0081] Step S400, adsorbing the hard substrate and driving the spin-coating composite structure to rotate, and spin-coating glue on the second surface of the resin wafer.

[0082] Step S500: peeling the spin-coated resin wafer from the peelable adhesive layer of the hard substrate.

[0083] In some embodiments of the present invention, the two opposite sides of the unbonded peelable adhesive layer are respectively provided with a first protective film and a second protective film, which can effectively protect the adhesive surface of the peelable adhesive layer from contamination and ensure its adhesive performance.

[0084] like Figure 5 As shown, before the peelable adhesive layer is attached to one side of the hard substrate in step S100, the following steps are also included:

[0085] Step S101, peeling off the first protective film of the peelable adhesive layer, so that the peelable adhesive layer under the first protective film is exposed to expose the adhesive surface, so as to facilitate bonding with the hard substrate.

[0086] Before laminating the first surface of the resin wafer with the hydrophobic film layer on the removable adhesive layer in step S300, the following steps are also included:

[0087] Step S301, tearing off the second protective film of the peelable adhesive layer, so that the peelable adhesive layer under the second protective film is exposed to expose the adhesive surface, so as to facilitate the bonding with the hydrophobic film layer.

[0088] The following describes a specific example. Figure 5 As shown, the steps of the resin wafer spin coating glue method of the present invention are as follows:

[0089] Step S101, peeling off the first protective film of the peelable adhesive layer.

[0090] Step S100: providing a hard substrate, and attaching a peelable adhesive layer to one side of the hard substrate.

[0091] Step S200: providing a resin wafer, and adding a hydrophobic film layer on a first surface of the resin wafer.

[0092] Step S301, peeling off the second protective film of the peelable adhesive layer.

[0093] Step S300 , laminating the first surface of the resin wafer with the hydrophobic film layer on the strippable adhesive layer to form a spin-coated composite structure.

[0094] Step S400, adsorbing the hard substrate and driving the spin-coating composite structure to rotate, and spin-coating glue on the second surface of the resin wafer.

[0095] Step S500: peeling the spin-coated resin wafer from the peelable adhesive layer of the hard substrate.

[0096] In other examples, the peelable adhesive layer of the present invention may also be in liquid form, and the hard substrate may have a peelable adhesive layer with a certain thickness by evenly applying liquid colloid on the hard substrate.

[0097] The terms "first" and "second" in the present invention are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features.

[0098] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed by the present invention, and these modifications or replacements should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be based on the protection scope of the claims.

Claims

1. A method for spin coating glue on a resin wafer, characterized in that: The following steps are involved: Providing a hard substrate, and attaching a peelable adhesive layer to one side of the hard substrate; Providing a resin wafer, and adding a hydrophobic film layer on a first surface of the resin wafer; Laminating the first surface of the resin wafer with the hydrophobic film layer on the strippable adhesive layer to form a spin-coated composite structure; Adsorbing the hard substrate and driving the spin-coating composite structure to rotate, and spin-coating glue on the second surface of the resin wafer; The spin-coated resin wafer is peeled off from the peelable adhesive layer of the hard substrate.

2. The method for spin coating glue on a resin wafer as claimed in claim 1, characterized in that: The strippable adhesive layer is a temperature-sensitive adhesive; when the resin wafer is spin-coated with glue, the strippable adhesive layer is at a first temperature, and when the resin wafer is peeled off from the hard substrate, the strippable adhesive layer is at a second temperature, which is different from the first temperature. At the first temperature, the viscosity of the strippable adhesive layer is reduced.

3. The method for spin coating glue on a resin wafer as claimed in claim 2, characterized in that: The second temperature is lower than the first temperature; and / or, The second temperature is 60°C to 80°C, and the first temperature is 20°C to 30°C.

4. The method for spin coating glue on a resin wafer as claimed in claim 1, characterized in that: Before peeling the spin-coated resin wafer from the peelable adhesive layer of the hard substrate, the method further includes the following steps: The spin-coated composite structure is heated to reduce the viscosity of the strippable adhesive layer, and the strippable adhesive layer and the hydrophobic film layer are separated from each other.

5. The method for spin coating glue on a resin wafer according to any one of claims 1 to 4, characterized in that: The peelable adhesive layer includes at least one of epoxy resin adhesive, acrylate adhesive or polyurethane adhesive.

6. The method for spin coating glue on a resin wafer according to any one of claims 1 to 4, characterized in that: The step of providing a hard substrate and attaching a peelable adhesive layer to one side of the hard substrate comprises: A hard substrate is provided, one side of the hard substrate is processed to form a hydrophilic film layer, and a peelable adhesive layer is attached to the side having the hydrophilic film layer.

7. The method for spin coating glue on a resin wafer as claimed in claim 6, characterized in that: The hydrophilic angle of the hydrophilic film layer is less than or equal to 30 degrees; and / or the hydrophobic angle of the hydrophobic film layer is greater than 110 degrees.

8. The method for spin coating glue on a resin wafer according to any one of claims 1 to 4, characterized in that: The hard substrate includes at least one of a resin substrate, a glass substrate or a silicon substrate.

9. The method for spin coating glue on a resin wafer according to any one of claims 1 to 4, characterized in that: The orthographic projection of the outer contour of the resin wafer on the hard substrate coincides with the outer contour of the hard substrate; or, The orthographic projection of the outer contour of the resin wafer on the hard substrate is located within the outer contour of the hard substrate.

10. The method for spin coating glue on a resin wafer according to any one of claims 1 to 4, characterized in that: The step of laminating the peelable adhesive layer on one side of the hard substrate comprises: laminating the peelable adhesive layer on one side of the hard substrate by rolling with a roller; Laying the first surface of the resin wafer with the hydrophobic film layer on the strippable adhesive layer comprises: laminating the first surface of the resin wafer with the hydrophobic film layer on the strippable adhesive layer by rolling.

11. The method for spin coating glue on a resin wafer according to any one of claims 1 to 4, characterized in that: The opposite sides of the unbonded peelable adhesive layer are respectively provided with a first protective film and a second protective film; Before attaching the peelable adhesive layer to one side of the hard substrate, the method further includes the following steps: peeling off the first protective film of the peelable adhesive layer; Before laminating the first surface of the resin wafer with the hydrophobic film layer on the strippable adhesive layer, the method further includes the following steps: peeling off the second protective film of the strippable adhesive layer.

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